A production process for thin film integrated circuits

Abstract

The invention discloses a manufacturing process for thin film integrated circuits, and relates to the technical field of electronic circuit manufacturing. The invention comprises the steps of S1, multiple coating; S2, exposure and development, forming a circuit pattern on the photoresist layer; S3, electroplating thickening, preparing a gold layer on the surface of the thin film circuit; S4, degumming: firstly performing high-frequency ultrasonic degumming cleaning on the substrate, and then performing low-frequency ultrasonic degumming cleaning on the substrate; S5, etching: corroding the unprotected pattern area by chemical corrosion. In the invention, after the photoresist on the surface of the substrate is solidified, air is introduced into the cold collection room for cooling by a blower, and the low-temperature air is blown to the surface of the substrate through a guide pipe, which is conducive to the rapid cooling of the solidified photoresist. After the photoresist is cooled, it can quickly enter the next stage of coating, which is convenient for improving the coating efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic circuit manufacturing, and in particular to a generation and manufacturing process for thin film integrated circuits. Background Art

[0002] Thin film substrate is a high-precision and high-integration circuit substrate. The preparation process usually uses physical vapor deposition seed layer, uses graphic means of lithography and etching to achieve wiring, and uses electroplating process to thicken the line, thereby preparing a microstrip circuit pattern on the substrate.

[0003] In the thin film substrate production process, the photolithography stage requires coating photoresist on the substrate surface. During the multiple coating stages on the substrate surface, the photoresist on the substrate surface needs to be dried after each coating before proceeding to the next stage of coating.

[0004] The existing drying method is to put the substrate coated with photoresist into a drying box for drying. The method of using the drying box to dry the photoresist on the substrate requires first removing the substrate and putting it into the drying box. After drying the photoresist, the substrate needs to be cooled, and then the cooled substrate with the cured photoresist is placed on the glue coating assembly for glue coating, which results in a long glue coating time and low glue coating efficiency. To this end, we propose a production process for thin film integrated circuits. Summary of the invention

[0005] The object of the present invention is to provide a manufacturing process for thin film integrated circuits, which can effectively solve the problems raised in the background technology.

[0006] In order to solve the above technical problems, the present invention is achieved through the following technical solutions:

[0007] The present invention is a process for producing a thin film integrated circuit, comprising the following steps:

[0008] S1. Multiple coating: using a coating component to coat photoresist on the cleaned substrate surface, and then using a drying component to dry the photoresist on the substrate surface, repeating the process of coating and drying the photoresist;

[0009] The drying assembly includes a cold collecting chamber, a refrigeration sheet, a guide pipe and a blower. In the drying stage, the substrate just coated with glue is transferred to the bottom of the heating surface of the refrigeration sheet. The heating surface of the refrigeration sheet generates heat to dry the photoresist on the surface of the substrate. The refrigeration sheet cools the inner cavity of the cold collecting chamber. Then the blower is turned on. The outside air enters the cold collecting chamber through the blower to cool down. The cold air enters between the refrigeration sheet and the substrate through the guide pipe to cool down the dried photoresist on the surface of the substrate.

[0010] S2, exposure and development, forming a circuit pattern on the photoresist layer;

[0011] S3, electroplating thickening, preparing a gold layer on the surface of the thin film circuit;

[0012] S4, degumming: firstly perform high-frequency ultrasonic degumming cleaning on the substrate, and then perform low-frequency ultrasonic degumming cleaning on the substrate;

[0013] S5. Etching: Etching the unprotected graphic area by chemical etching.

[0014] Preferably, in S1, the glue coating assembly includes a rotating roller, a baffle plate arranged above one side of the rotating roller, and a scraper block arranged below the other side; photoresist is injected between the rotating roller and the baffle plate, the substrate is moved to the bottom of the scraper block, the rotating roller is driven, the photoresist is brought to the surface of the substrate by the rotating roller, and the scraper block is used to scrape off the photoresist attached to the rotating roller and apply it to the surface of the substrate.

[0015] Preferably, in S1, a drying component is provided on each side of the rotating roller, baffles are provided on both sides of the upper side of the rotating roller, scrapers are provided on both sides of the lower side of the rotating roller, a first electric cylinder is provided on the side of each baffle, and a second electric cylinder is provided on the side of each scraper; before injecting photoresist between the rotating roller and the baffle, the first electric cylinder is used to adjust the position of the baffle, adjust the distance between the bottom wall of the baffle and the rotating roller, and control the thickness of the photoresist attached to the surface of the rotating roller, and the second electric cylinder is used to adjust the position of the scraper so that the scraper fits the rotating roller. After the photoresist is coated on the surface of the substrate for the first time, the substrate is first moved to the bottom of one of the drying components to dry the photoresist, and then the surface of the substrate is coated with glue for the second time, and then the substrate is moved to the bottom of another drying component to dry the photoresist.

[0016] Preferably, in S1, when one of the scrapers scrapes off the photoresist on the surface of the rotating roller and coats the photoresist on the surface of the substrate, the second electric cylinder is used to move the other scraper away from the rotating roller.

[0017] Preferably, in S1, a slide module is provided above the rotating roller, a glue outlet nozzle is installed on a slider of the slide module, a glue outlet of the glue outlet nozzle is located just above the rotating roller, and the glue outlet nozzle injects photoresist into the space between the rotating roller and the baffle.

[0018] Preferably, the rotating rod is movably installed between two positioning seats, and a driving motor is fixedly installed on the side of one of the positioning seats, and the driving motor drives the rotating rod to rotate forward and reverse.

[0019] Preferably, in S1, a transmission assembly is used to transport the substrate; the transmission assembly includes a stand, a screw, a movable table and a mounting table, the screw is installed in two stands, the substrate is placed above the mounting table, a servo motor driving the screw is installed in the stand, and the movable table is driven to move during the rotation of the screw.

[0020] Preferably, multiple mounting platforms are arranged above the movable platform, multiple scraping blocks are arranged on each side below the rotating rod, and a partition assembly is arranged on the side of the base plate. The partition assembly includes a partition block and a positioning plate. The partition block is located below the baffle and contacts the baffle. The spacing between two adjacent scraping blocks on each side below the rotating rod is the same as the length of the partition assembly.

[0021] Preferably, in S4, the substrate is first ultrasonically cleaned in a high-frequency ultrasonic cleaning tank for 5 minutes, then rinsed with water for 5 minutes, then ultrasonically cleaned in a low-frequency ultrasonic cleaning tank for 5 minutes, rinsed with water again for 1 minute, and then ultrasonically dehydrated with anhydrous ethanol in a low-frequency ultrasonic cleaning tank for 3 minutes, and then placed in an oven for standby use.

[0022] The present invention has the following beneficial effects:

[0023] 1. The present invention combines the photoresist sacrificial layer technology with the thin film circuit substrate preparation process, and improves and optimizes the traditional thin film circuit substrate preparation process. By using photoresist as a sputtering mask, the circuit pattern is prepared before electroplating, and wet etching is no longer performed, thus avoiding the influence of side corrosion on line accuracy and film-base bonding strength.

[0024] 2. The present invention uses a refrigeration sheet to generate heat to dry the substrate just coated with glue during multiple glue coating stages. The refrigeration sheet and the substrate have the same area and a short distance between them. Most of the heat generated by the refrigeration sheet acts on the photoresist on the surface of the substrate, so that the heat generated by the refrigeration sheet can be fully utilized, saving energy while avoiding heat waste. The refrigeration sheet and the substrate are arranged in parallel, so that the photoresist on the surface of the substrate is heated more evenly, and the surface is smoother after the photoresist is cured.

[0025] 3. In the present invention, after the photoresist on the substrate surface is cured, air is introduced into the cold collection chamber for cooling by a blower, and the low-temperature air is blown to the substrate surface through the guide pipe, which is conducive to quickly cooling the cured photoresist. After the photoresist is cooled, it can quickly enter the next stage of glue coating, which is convenient for improving the glue coating efficiency. Using cold air to cool the cured photoresist also has a cooling effect on the substrate, avoiding the increase of the photoresist temperature caused by the excessively high substrate temperature, and making the cooling of the photoresist more uniform. By cooling the photoresist on the substrate surface, it is avoided that the uneven coating of the photoresist on the substrate surface during the next stage of glue coating due to the high temperature of the photoresist on the substrate surface is avoided.

[0026] 4. The present invention uses a cooling sheet to dry the photoresist, which can form a good low-temperature environment in the cold collection chamber. During the cooling stage of the photoresist on the substrate surface, the cooling sheet stops working, and the outside air enters the cold collection chamber to increase the temperature in the cold collection chamber, which can reduce the temperature difference between the two sides of the cooling sheet, ensure that the cooling sheet is in a good working state when it works next time, and quickly heats up, thereby improving the drying efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for describing the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0028] Figure 1 A flow chart of a manufacturing process for a thin film integrated circuit according to the present invention;

[0029] Figure 2 A three-dimensional diagram of the overall structure of a device used in a process for producing a thin film integrated circuit according to the present invention, viewed from above;

[0030] Figure 3 A bottom-view stereogram of the overall structure of a device used in a process for producing a thin film integrated circuit according to the present invention;

[0031] Figure 4 A front cross-sectional view of the overall structure of a device used in a process for producing a thin film integrated circuit according to the present invention;

[0032] Figure 5 A three-dimensional diagram of a manufacturing process for thin film integrated circuits of the present invention Figure 4 Enlarged view of part A;

[0033] Figure 6 A three-dimensional diagram of a glue coating assembly used in a thin film integrated circuit manufacturing process of the present invention;

[0034] Figure 7 A three-dimensional diagram of a scraper block used in a thin film integrated circuit manufacturing process of the present invention;

[0035] Figure 8 A three-dimensional diagram of a baffle used in a thin film integrated circuit manufacturing process of the present invention;

[0036] Fig. 9 The present invention is a three-dimensional diagram of a separation component used in a thin film integrated circuit manufacturing process.

[0037] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0038] 1. Base plate; 2. First electric cylinder; 3. Glue coating assembly; 31. Rotating roller; 32. Baffle; 33. Scraper; 4. Drying assembly; 41. Cold collecting chamber; 42. Refrigeration plate; 43. Guide pipe; 44. Blower; 5. Second electric cylinder; 6. Slide module; 7. Glue nozzle; 8. Transmission assembly; 81. Stand; 82. Screw; 83. Moving table; 84. Mounting table; 9. Partition assembly; 91. Partition block; 92. Positioning plate; 10. Positioning seat; 11. Driving motor. DETAILED DESCRIPTION

[0039] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. Example

[0040] See also Figure 1 - Fig. 9 As shown, a manufacturing process for thin film integrated circuits includes the following steps:

[0041] S1, multiple coating: using the coating component 3 to coat the photoresist on the cleaned surface of the substrate 1, and then using the drying component 4 to dry the photoresist on the surface of the substrate 1, repeating the process of coating and drying the photoresist;

[0042] The drying assembly 4 includes a cold collecting chamber 41, a cooling sheet 42, a guide tube 43 and a blower 44. During the drying stage, the substrate 1 just coated with glue is transferred to the bottom of the heating surface of the cooling sheet 42. The heating surface of the cooling sheet 42 generates heat to dry the photoresist on the surface of the substrate 1. The cooling sheet 42 cools the inner cavity of the cold collecting chamber 41. Then, the blower 44 is turned on. The outside air enters the cold collecting chamber 41 through the blower 44 to cool down. The cold air enters between the cooling sheet 42 and the substrate 1 through the guide tube 43 to cool down the dried photoresist on the surface of the substrate 1.

[0043] S2, exposure and development, forming a circuit pattern on the photoresist layer;

[0044] S3, electroplating thickening, preparing a gold layer on the surface of the thin film circuit;

[0045] S4, degumming: firstly perform high-frequency ultrasonic degumming cleaning on the substrate 1, and then perform low-frequency ultrasonic degumming cleaning on the substrate 1;

[0046] S5. Etching: Etching the unprotected graphic area by chemical etching.

[0047] In this process, the photoresist sacrificial layer technology is combined with the thin film circuit substrate preparation process to improve and optimize the traditional thin film circuit preparation process. By using photoresist as a sputtering mask, the circuit pattern is prepared before electroplating, and wet etching is no longer performed, avoiding the influence of side corrosion on line accuracy and film-base bonding. At the same time, in this process, the substrate is only immersed in acetone once to remove the photoresist, avoiding the use of a large amount of solution, reducing the oxidation effect of the solution on the circuit pattern surface, and improving the hydrophilicity of the pattern surface and the reliability of the electroplating process.

[0048] In the multiple glue coating stages, the refrigeration sheet 42 is used to generate heat to dry the substrate 1 that has just been glue coated. The refrigeration sheet 42 and the substrate 1 have the same area and are short in distance. Most of the heat generated by the refrigeration sheet 42 acts on the photoresist on the surface of the substrate 1, so that the heat generated by the refrigeration sheet 42 can be fully utilized, saving energy while avoiding heat waste. The refrigeration sheet 42 and the substrate 1 are arranged in parallel, so that the photoresist on the surface of the substrate 1 is heated more evenly, and the surface is smoother after the photoresist is cured.

[0049] In this step, after the photoresist on the surface of the substrate 1 is cured, air is introduced into the cold collecting chamber 41 through the blower 44 to cool down, and the low-temperature air is blown to the surface of the substrate 1 through the guide tube 43, which is conducive to quickly cooling the cured photoresist. After the photoresist is cooled down, it can quickly enter the next stage of glue coating, which is convenient for improving the glue coating efficiency. Using cold air to cool the cured photoresist also has a cooling effect on the substrate 1, avoiding the temperature of the photoresist caused by the excessively high temperature of the substrate 1, and making the cooling of the photoresist more uniform. By cooling the photoresist on the surface of the substrate 1, it is avoided that the uneven coating of the photoresist on the surface of the substrate 1 is caused by the high temperature of the photoresist on the surface of the substrate 1 when the glue is coated in the next stage.

[0050] Based on this step, the refrigeration sheet 42 is used to dry the photoresist, and a good low-temperature environment can be formed in the cold collection chamber 41. During the cooling stage of the photoresist on the surface of the substrate 1, the refrigeration sheet 42 stops working, and the outside air enters the cold collection chamber 41 to increase the temperature in the cold collection chamber 41, which can reduce the temperature difference between the two sides of the refrigeration sheet 42, ensuring that the refrigeration sheet 42 is in a good working state when it works next time, and heats up quickly, thereby improving the drying efficiency.

[0051] Based on this step, when using cold air to cool the photoresist on the surface of the substrate 1, the steam particles generated when the cooling plate 42 dries the photoresist can be blown away, preventing the steam particles from gathering on the surface of the cooling plate 42 and affecting the normal operation of the cooling plate 42. During the process of coating the substrate 1 and drying the photoresist, the substrate 1 does not need to be removed, which can save time and improve the efficiency of multiple coatings.

[0052] Among them, in S1, the glue coating component 3 includes a rotating roller 31, a baffle 32 arranged above one side of the rotating roller 31 and a scraper block 33 below the other side; photoresist is injected between the rotating roller 31 and the baffle 32, the substrate 1 is moved to the bottom of the scraper block 33, the rotating roller 31 is driven, and the photoresist is brought to the surface of the substrate 1 through the rotating roller 31, and the scraper block 33 is used to scrape off the photoresist attached to the rotating roller 31 and apply it to the surface of the substrate 1.

[0053] Based on this step, a gap is left between the bottom of the scraper block 33 and the rotating roller 31, and the size of the gap is the thickness of the photoresist attached to the surface of the rotating roller 31. The photoresist is filled between the rotating roller 31 and the baffle 32, and the photoresist is attached to the surface of the rotating roller 31. The photoresist is brought to the gap by the rotation of the rotating roller 31, which can enhance the gap to ensure the internal pressure of the photoresist in the gap, squeeze out the air, and make the photoresist attached to the surface of the rotating roller 31 more uniform after passing through the gap, so that the photoresist scraped off by the scraper block 33 and coated on the surface of the substrate 1 is more uniform, preventing the problem of too much or insufficient glue on the surface of the substrate 1.

[0054] Among them, in S1, a drying component 4 is provided on each side of the rotating roller 31, baffles 32 are provided on both sides of the upper side of the rotating roller 31, scrapers 33 are provided on both sides of the lower side of the rotating roller 31, a first electric cylinder 2 is provided on the side of each baffle 32, and a second electric cylinder 5 is provided on the side of each scraper 33; before injecting photoresist between the rotating roller 31 and the baffle 32, the first electric cylinder 2 is used to adjust the position of the baffle 32, adjust the distance between the bottom wall of the baffle 32 and the rotating roller 31, and control the thickness of the photoresist attached to the surface of the rotating roller 31, and the second electric cylinder 5 is used to adjust the position of the scraper 33 so that the scraper 33 fits the rotating roller 31. After the first coating of photoresist on the surface of the substrate 1, the substrate 1 is first moved to the bottom of one of the drying components 4 to dry the photoresist, and then the surface of the substrate 1 is coated with glue for the second time, and then the substrate 1 is moved to the bottom of another drying component 4 to dry the photoresist. The first electric cylinder 2 is convenient for adjusting the width of the gap formed between the baffle 32 and the substrate 1, so that the thickness of the photoresist on the rotating roller 31 can be adjusted.

[0055] Based on this operation, when one of the drying components 4 is working, the temperature difference between the two end surfaces of the cooling plate 42 in the other drying component 4 will be close to each other under the action of the blower 44. After the substrate 1 coated with photoresist moves to one of the drying components 4 to dry the photoresist, it returns to the bottom of the rotating roller 31 to coat the photoresist again and moves to another drying component 4 to dry the photoresist. The operation is repeated several times to achieve multiple coating operations.

[0056] In S1 , when one of the scrapers 33 scrapes off the photoresist on the surface of the rotating roller 31 and coats the photoresist on the surface of the substrate 1 , the second electric cylinder 5 is used to move the other scraper 33 away from the rotating roller 31 .

[0057] Based on this operation, the scraper block 33 that does not need to perform photoresist scraping is prevented from interfering with the operation.

[0058] Among them, in S1, a slide module 6 is arranged above the rotating roller 31, and a glue nozzle 7 is installed on the slider of the slide module 6. The glue outlet of the glue nozzle 7 is located directly above the rotating roller 31, and the glue nozzle 7 injects photoresist into the space between the rotating roller 31 and the baffle 32.

[0059] Based on this operation, the slider of the slide module 6 drives the glue nozzle 7 to move back and forth on the rotating roller 31 to evenly inject the photoresist onto the rotating roller 31 .

[0060] The rotating rod 31 is movably installed between two positioning seats 10 , and a driving motor 11 is fixedly installed on the side of one of the positioning seats 10 , and the driving motor 11 drives the rotating rod 31 to rotate forward and reverse.

[0061] In S1, a transmission assembly 8 is used to transport the substrate 1; the transmission assembly 8 includes a stand 81, a screw 82, a moving platform 83 and a mounting platform 84. The screw 82 is installed in two stands 81, and the substrate 1 is placed above the mounting platform 84. A servo motor driving the screw 82 is installed in the stand 81, and the moving platform 83 is driven to move during the rotation of the screw 82. The mounting platform 84 is a lifting platform that can adjust the height of the substrate 1 so as to perform adaptive adjustment of the height of the substrate 1 when the thickness of the photoresist on the surface of the substrate 1 changes.

[0062] Among them, multiple mounting platforms 84 are arranged above the moving platform 83, multiple scraping blocks 33 are arranged on each side below the rotating rod 31, and a partition component 9 is arranged on the side of the substrate 1. The partition component 9 includes a partition block 91 and a positioning plate 92. The partition block 91 is located below the baffle 32 and contacts the baffle 32. The distance between two adjacent scraping blocks 33 on each side below the rotating rod 31 is the same as the length of the partition component 9.

[0063] Based on this operation, multiple substrates 1 can be coated and dried simultaneously. The partition block 91 scrapes off the photoresist at the corresponding position on the surface of the rotating roller 31 to avoid the discharge of excess photoresist from the gap.

[0064] Among them, in S4, first, after ultrasonication in a high-frequency ultrasonic cleaning tank for 5 minutes, the substrate is rinsed with water for 5 minutes, and then ultrasonicated in a low-frequency ultrasonic cleaning tank for 5 minutes and rinsed with water again for 1 minute, and then ultrasonically dehydrated with anhydrous ethanol in a low-frequency ultrasonic cleaning tank for 3 minutes, and then placed in an oven for standby use.

[0065] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A process for producing a thin film integrated circuit, characterized in that: The following steps are included: S1, multiple coating: using a coating component (3) to coat photoresist on the surface of a cleaned substrate (1), and then using a drying component (4) to dry the photoresist on the surface of the substrate (1), and repeating the process of coating and drying the photoresist; The coating assembly (3) comprises a rotating roller (31), a baffle (32) arranged above one side of the rotating roller (31), and a scraper (33) arranged below the other side; photoresist is injected between the rotating roller (31) and the baffle (32), the substrate (1) is moved to the bottom of the scraper (33), the rotating roller (31) is driven, the photoresist is brought to the surface of the substrate (1) by the rotating roller (31), and the scraper (33) is used to scrape off the photoresist attached to the rotating roller (31) and apply it to the surface of the substrate (1); A drying assembly (4) is disposed on each side of the rotating roller (31); baffles (32) are disposed on both sides above the rotating roller (31); scrapers (33) are disposed on both sides below the rotating roller (31); a first electric cylinder (2) is disposed on the side of each baffle (32); and a second electric cylinder (5) is disposed on the side of each scraper (33); before injecting photoresist between the rotating roller (31) and the baffle (32), the first electric cylinder (2) is used to adjust the position of the baffle (32); and the baffle (32) is adjusted. The distance between the bottom wall of the plate (32) and the rotating roller (31) is controlled to control the thickness of the photoresist attached to the surface of the rotating roller (31), and the position of the scraper (33) is adjusted by using the second electric cylinder (5) so that the scraper (33) fits the rotating roller (31). After the photoresist is first coated on the surface of the substrate (1), the substrate (1) is first moved to the bottom of one of the drying components (4) to dry the photoresist, and then the surface of the substrate (1) is coated with the photoresist for the second time, and then the substrate (1) is moved to the bottom of another drying component (4) to dry the photoresist; The drying assembly (4) comprises a cold collecting chamber (41), a cooling plate (42), a guide tube (43) and a blower (44). During the drying stage, the substrate (1) just coated with glue is transferred to the bottom of the heating surface of the cooling plate (42). The heating surface of the cooling plate (42) generates heat to dry the photoresist on the surface of the substrate (1). The cooling plate (42) cools the inner cavity of the cold collecting chamber (41). Then, the blower (44) is turned on. External air enters the cold collecting chamber (41) through the blower (44) to cool down. The cold air enters between the cooling plate (42) and the substrate (1) through the guide tube (43) to cool down the dried photoresist on the surface of the substrate (1). S2, exposure and development, forming a circuit pattern on the photoresist layer; S3, electroplating thickening, preparing a gold layer on the surface of the thin film circuit; S4, degumming: firstly, the substrate (1) is subjected to high-frequency ultrasonic degumming cleaning, and then the substrate (1) is subjected to low-frequency ultrasonic degumming cleaning; S5. Etching: Etching the unprotected graphic area by chemical etching.

2. A process for producing a thin film integrated circuit according to claim 1, characterized in that: In S1, when one of the scraping blocks (33) scrapes off the photoresist on the surface of the rotating roller (31) and coats the photoresist on the surface of the substrate (1), the second electric cylinder (5) is used to move the other scraping block (33) away from the rotating roller (31).

3. A process for producing a thin film integrated circuit according to claim 2, characterized in that: In S1, a slide module (6) is arranged above the rotating roller (31), a glue outlet nozzle (7) is installed on a slider of the slide module (6), a glue outlet of the glue outlet nozzle (7) is located directly above the rotating roller (31), and the glue outlet nozzle (7) injects photoresist into the space between the rotating roller (31) and the baffle (32).

4. A process for producing a thin film integrated circuit according to claim 3, characterized in that: The rotating rod (31) is movably mounted between two positioning seats (10), wherein a driving motor (11) is fixedly mounted on the side of one of the positioning seats (10), and the driving motor (11) drives the rotating rod (31) to rotate forward and reverse.

5. A process for producing a thin film integrated circuit according to claim 4, characterized in that: In S1, a transmission assembly (8) is used to transport the substrate (1); the transmission assembly (8) comprises a stand (81), a screw rod (82), a moving platform (83) and a mounting platform (84); the screw rod (82) is mounted in two stands (81); the substrate (1) is placed above the mounting platform (84); a servo motor for driving the screw rod (82) is installed in the stand (81); the moving platform (83) is driven to move during the rotation of the screw rod (82).

6. A process for producing a thin film integrated circuit according to claim 5, characterized in that: A plurality of mounting platforms (84) are arranged above the moving platform (83); a plurality of scraping blocks (33) are arranged on each side below the rotating roller (31); a partition assembly (9) is arranged on the side of the base plate (1); the partition assembly (9) comprises a partition block (91) and a positioning plate (92); the partition block (91) is located below the baffle plate (32) and contacts the baffle plate (32); and the spacing between two adjacent scraping blocks (33) on each side below the rotating roller (31) is the same as the length of the partition assembly (9).

7. A process for producing a thin film integrated circuit according to claim 6, characterized in that: In S4, the substrate is first ultrasonically cleaned in a high-frequency ultrasonic cleaning tank for 5 minutes, then rinsed with water for 5 minutes, then ultrasonically cleaned in a low-frequency ultrasonic cleaning tank for 5 minutes, rinsed with water again for 1 minute, and then ultrasonically dehydrated with anhydrous ethanol in a low-frequency ultrasonic cleaning tank for 3 minutes, and then placed in an oven for standby use.

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