A modified divinylbenzene resin and its preparation method and application, a thermosetting polymer material and its preparation method and application

Abstract

The present invention provides a modified divinylbenzene resin and a preparation method and application thereof, a thermosetting polymer material and a preparation method and application thereof, and relates to the technical field of polymer materials. In the molecular structure of the modified divinylbenzene resin provided by the present invention, diisopropyl and tetramethyl structures with large free volume and non-polarity are synergistically introduced, giving the resin a low dielectric constant, low dielectric loss and low moisture absorption rate. Moreover, the modified divinylbenzene resin provided by the present invention has good curing activity, and can be used as a main component or a modified component to prepare a polymer material with low dielectric constant, low dielectric loss and low moisture absorption after curing polymerization, which has important potential application value in the field of high-frequency and high-speed copper-clad laminates. Moreover, the preparation process of the resin is convenient, simple to operate, has few side reactions, and has a high product yield.

Description

Technical Field

[0001] The invention relates to the technical field of polymer materials, and in particular to a modified divinylbenzene resin and a preparation method and application thereof, and a thermosetting polymer material and a preparation method and application thereof. Background Art

[0002] Copper clad laminate is the core material of modern electronic equipment. It determines the design and manufacturing capabilities of the motherboard, which in turn affects the innovation and development of electronic products. The types and technical levels of copper clad laminates are also constantly improving with the changes of the times to meet the needs of electronic devices in different fields. With the rapid development of new generation information technology represented by 5G, artificial intelligence, big data, and the Internet of Things, high-frequency and high-speed copper clad laminates have become the mainstream direction of copper clad laminate development due to their higher signal transmission speed and lower signal loss. Polymer resin is the core material of copper clad laminates, and its performance directly affects the performance of the final printed circuit board. Due to the need for high-speed and high-frequency transmission of signals, traditional copper clad laminate resin materials (such as epoxy resin, bismaleimide resin, triazine resin, etc.) usually have high dielectric constants, dielectric losses, and moisture absorption rates due to the presence of polar groups, and can no longer meet the use requirements of high-speed and high-frequency copper clad laminates.

[0003] Low molecular weight polyphenylene ether with active divinylbenzene structure at the end group is an important high-frequency and high-speed copper-clad laminate substrate resin developed in recent years. However, the synthesis and preparation process of this type of resin is complicated. It is necessary to first prepare polyphenylene ether with low molecular weight and narrow distribution coefficient through oxidative coupling polymerization, and then introduce cross-linkable active double bonds through functionalization reaction of terminal hydroxyl groups. The synthesis and preparation process of this type of resin is complicated and difficult to purify. Currently, only a few foreign companies produce it in large quantities (SABIC, Mitsubishi Gas, Asahi Kasei). Therefore, it is of great application value and academic value to carry out the research and development of new modified divinylbenzene resin with low dielectric constant, low dielectric loss and low water absorption characteristics, and further improve the performance of the material. Summary of the invention

[0004] In view of this, the object of the present invention is to provide a modified divinylbenzene resin and a preparation method and application thereof, a thermosetting polymer material and a preparation method and application thereof. The modified divinylbenzene resin provided by the present invention can be used as a main component or a modified component to obtain a thermosetting polymer material with low dielectric constant, low dielectric loss and low moisture absorption rate after curing, which has important potential application value in the field of high-frequency and high-speed copper clad laminates.

[0005] In order to achieve the above-mentioned object of the invention, the present invention provides the following technical solutions:

[0006] The present invention provides a modified divinyl benzene resin having a structure shown in Formula I:

[0007]

[0008] The present invention provides a method for preparing a tetramethyl-substituted triphenyl diisopropane structure-modified divinyl benzene resin according to the technical scheme, comprising the following steps:

[0009] Dissolving α,α'-bis(4-hydroxy-3,5-xylyl)-1,4-diisopropylbenzene in an organic solvent, adding an alkaline catalyst to carry out a salt-forming reaction, and obtaining an active bisphenolate solution containing a tetramethyl-substituted triphenyl diisopropyl structure;

[0010] The active bisphenolate solution containing tetramethyl-substituted triphenyl diisopropane structure is mixed with p-chlorostyrene to carry out substitution reaction to obtain modified divinylbenzene resin.

[0011] Preferably, the molar ratio of the α,α'-bis(4-hydroxy-3,5-xylyl)-1,4-diisopropylbenzene to the alkaline catalyst is 1:2 to 2.3;

[0012] The alkaline catalyst is added in batches, and the duration of adding the alkaline catalyst is 20 to 40 minutes;

[0013] The organic solvent comprises one or more of N-methylpyrrolidone, N,N-dimethylacetamide and N,N-dimethylformamide; the mass ratio of the α,α'-bis(4-hydroxy-3,5-xylyl)-1,4-diisopropylbenzene to the organic solvent is 1:4-6.

[0014] Preferably, the molar ratio of the α,α'-bis(4-hydroxy-3,5-xylyl)-1,4-diisopropylbenzene to chlorostyrene is 1:2 to 2.4.

[0015] Preferably, the temperature of the substitution reaction is 60-80° C. and the time is 4-12 hours.

[0016] The present invention provides the use of the modified divinylbenzene resin described in the above technical solution or the modified divinylbenzene resin prepared by the preparation method described in the above technical solution in thermosetting polymer materials.

[0017] The present invention provides a thermosetting polymer material, the raw materials for preparing the material include resin, initiator and solvent; the resin includes modified divinyl benzene resin;

[0018] The modified divinylbenzene resin is the modified divinylbenzene resin described in the above technical solution or the modified divinylbenzene resin prepared by the preparation method described in the above technical solution.

[0019] Preferably, the resin further comprises other resins, and the other resins comprise diphenylmethane bismaleimide resin and / or vinyl terminated polyphenylene ether.

[0020] The present invention provides a method for preparing the thermosetting polymer material described in the above technical solution, comprising the following steps:

[0021] Mixing a resin, a solvent and an initiator, and thermally curing the obtained resin solution to obtain a thermosetting polymer material;

[0022] The resin includes a modified divinyl benzene resin.

[0023] The present invention provides the use of the thermosetting polymer material described in the above technical solution or the thermosetting polymer material prepared by the preparation method described in the above technical solution in high-frequency and high-speed copper-clad laminates.

[0024] The molecular structure of the modified divinylbenzene resin having the structure shown in Formula I provided by the present invention synergistically introduces diisopropylamine and tetramethyl structure having a large free volume and non-polarity, thereby giving the resin a low dielectric constant, low dielectric loss and low moisture absorption rate. Moreover, the modified divinylbenzene resin provided by the present invention has good curing activity, can be used as a main component or a modified component to prepare a polymer material having a low dielectric constant, low dielectric loss and low moisture absorption after curing polymerization, and has important potential application value in the field of high-frequency and high-speed copper-clad laminates.

[0025] The method for preparing the modified divinylbenzene resin according to the technical scheme provided by the present invention has the advantages of convenient preparation process, simple operation, few side reactions, easy separation and purification, high product yield, high purity, low production cost, green environmental protection, and suitability for industrialized large-scale production. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 1,4-bis(2-(4-(4-vinylphenoxy)-3,5-dimethylphenyl)propane-2-yl)benzene 1 HNMR spectrum;

[0027] Figure 2 This is the infrared spectrum of 1,4-bis(2-(4-(4-vinylphenoxy)-3,5-dimethylphenyl)propan-2-yl)benzene. DETAILED DESCRIPTION

[0028] The present invention provides a modified divinyl benzene resin having a structure shown in Formula I:

[0029]

[0030] In the present invention, the melting point of the modified divinyl benzene resin is preferably 181-182° C.; the chemical name of the modified divinyl benzene resin is 1,4-bis(2-(4-(4-vinylphenoxy)-3,5-dimethylphenyl)propane-2-yl)benzene.

[0031] The present invention provides a method for preparing a tetramethyl-substituted triphenyl diisopropane structure-modified divinyl benzene resin according to the technical scheme, comprising the following steps:

[0032] Dissolving α,α'-bis(4-hydroxy-3,5-xylyl)-1,4-diisopropylbenzene in an organic solvent, adding an alkaline catalyst to carry out a salt-forming reaction, and obtaining an active bisphenolate solution containing a tetramethyl-substituted triphenyl diisopropyl structure;

[0033] The active bisphenolate solution containing tetramethyl-substituted triphenyl diisopropane structure is mixed with p-chlorostyrene to carry out substitution reaction to obtain modified divinylbenzene resin.

[0034] In the present invention, the preparation route of the modified divinyl benzene resin is as follows:

[0035]

[0036] Unless otherwise specified, the materials and equipment used in the present invention are all commercially available products in the art.

[0037] The invention dissolves α,α'-bis(4-hydroxy-3,5-xylyl)-1,4-diisopropylbenzene in an organic solvent, adds an alkaline catalyst to carry out a salt-forming reaction, and obtains an active bisphenolate solution containing a tetramethyl-substituted triphenyl diisopropyl structure.

[0038] In the present invention, the alkaline catalyst preferably includes sodium hydride; the alkaline catalyst is preferably added in batches, more preferably 3 to 4 batches; the duration of adding the alkaline catalyst is preferably 20 to 40 minutes, more preferably 30 minutes; the alkaline catalyst is preferably added under ice bath conditions. In the present invention, the molar ratio of α,α'-bis(4-hydroxy-3,5-xylyl)-1,4-diisopropylbenzene to the alkaline catalyst is preferably 1:2 to 2.3, more preferably 1:2 to 2.2, and further preferably 1:2 to 2.1.

[0039] In the present invention, the organic solvent preferably includes one or more of N-methylpyrrolidone, N,N-dimethylacetamide and N,N-dimethylformamide. In the present invention, the mass ratio of α,α'-bis(4-hydroxy-3,5-xylyl)-1,4-diisopropylbenzene to the organic solvent is preferably 1:4-6, more preferably 1:5.

[0040] After obtaining the active bisphenolate solution containing tetramethyl-substituted triphenyl diisopropane structure, the present invention mixes the active bisphenolate solution containing tetramethyl-substituted triphenyl diisopropane structure with p-chlorostyrene to carry out substitution reaction to obtain modified divinylbenzene resin.

[0041] In the present invention, the molar ratio of α,α′-bis(4-hydroxy-3,5-xylyl)-1,4-diisopropylbenzene to chlorostyrene is preferably 1:2-2.4, more preferably 1:2.1-2.3, and even more preferably 1:2.2.

[0042] In the present invention, the temperature of the substitution reaction is preferably 60-80°C, more preferably 65-75°C, and further preferably 70°C; the time of the substitution reaction is preferably 4-12h, more preferably 5-10h, and further preferably 6-8h.

[0043] After completing the substitution reaction, the present invention preferably further comprises: placing the obtained substitution reaction system in water for sedimentation and then solid-liquid separation, washing the obtained solid component and then drying it to obtain a modified divinylbenzene resin. In the present invention, the solid-liquid separation method preferably includes suction filtration, filtration or centrifugal separation. In the present invention, the washing is preferably alcohol washing, and the alcohol for the alcohol washing preferably includes methanol and / or ethanol. In the present invention, the drying temperature is preferably 80 to 120°C, more preferably 80 to 100°C; the drying time is preferably 6 to 12h, more preferably 10 to 12h.

[0044] The present invention provides the use of the modified divinylbenzene resin described in the above technical solution or the modified divinylbenzene resin prepared by the preparation method described in the above technical solution in thermosetting polymer materials. In the present invention, the modified divinylbenzene resin is preferably used as a main component or a modified component for preparing a thermosetting polymer material.

[0045] The invention provides a thermosetting polymer material, the preparation raw materials of which include resin, initiator and solvent; the resin includes the modified divinylbenzene resin described in the above technical solution or the modified divinylbenzene resin prepared by the preparation method described in the above technical solution.

[0046] In the present invention, the resin preferably also includes other resins, and the other resins preferably include diphenylmethane bismaleimide resin and / or vinyl terminated polyphenylene ether (SA9000). In the present invention, the mass ratio of the modified divinylbenzene resin to other resins is preferably 1:0.1-9, more preferably 1:0.5-2, and specifically preferably 1:0.5, 1:1, 1:1.5, 1:2, 1:2.5, 1:3, 1:3.5, 1:4, 1:4.5, 1:5, 1:5.5, 1:6, 1:6.5, 1:7, 1:7.5, 1:8, 1:8.5 or 1:9.

[0047] In the present invention, the initiator preferably includes dibenzoyl peroxide and / or azobisisobutyronitrile. In the present invention, the mass ratio of the modified divinylbenzene resin to the initiator is preferably 1:0.0001-0.01, more preferably 1:0.0005-0.01, and specifically preferably 1:0.00083, 1:0.00125, 1:0.0017 or 1:0.0025.

[0048] In the present invention, the organic solvent preferably includes a ketone solvent, more preferably cyclohexanone and / or butanone. In the present invention, the mass ratio of the modified divinylbenzene resin to the volume of the organic solvent is preferably 1g:1.5-9mL, more preferably 1g:2-5mL.

[0049] The present invention provides a method for preparing the thermosetting polymer material described in the above technical solution, comprising the following steps: mixing a resin, a solvent and an initiator, and thermally curing the obtained resin solution to obtain the thermosetting polymer material; the resin comprises a modified divinylbenzene resin.

[0050] Before the heat curing, the present invention preferably further comprises drying the resin solvent. In the present invention, the drying temperature is preferably 80-120°C, more preferably 80-100°C; the drying time is preferably 0.5-1.5h, more preferably 1h.

[0051] In the present invention, the thermal curing is preferably programmed curing, and the programmed curing preferably includes: heating from room temperature to 160-180°C at a rate of 1-3°C / min, keeping warm for 1-2 hours, and then heating to 230-250°C at a rate of 1-3°C / min, and keeping warm for 1-2 hours. It more preferably includes heating from room temperature to 160-170°C at a rate of 1-2°C / min, and keeping warm for 1-1.5 hours, and then heating to 235-245°C at a rate of 1-2°C / min, and keeping warm for 1-1.5 hours. It is further preferably heating from room temperature to 160°C at a rate of 1°C / min, and keeping warm for 1 hour, and then heating to 240°C at a rate of 1°C / min, and keeping warm for 1 hour.

[0052] The present invention also provides the use of the thermosetting polymer material described in the above technical solution or the thermosetting polymer material prepared by the preparation method described in the above technical solution in high-frequency and high-speed copper-clad laminates. The thermosetting polymer material provided by the present invention has low dielectric constant, low dielectric loss and low moisture absorption rate, and has important potential application value in the field of high-frequency and high-speed copper-clad laminates.

[0053] In order to further illustrate the present invention, the modified divinylbenzene resin and its preparation method and application, the thermosetting polymer material and its preparation method and application are described in detail below in conjunction with the embodiments, but they should not be construed as limiting the scope of protection of the present invention.

[0054] The following are the raw materials and drugs used in the examples: p-chloromethylstyrene: purity 99%, Shandong Xingshun New Materials Co., Ltd.; α,α'-bis(4-hydroxy-3,5-xylyl)-1,4-diisopropylbenzene: purity 99%, Shanghai Darui Fine Chemicals Co., Ltd.; diphenylmethane bismaleimide: purity 98%, Shanghai Aladdin Reagent Co., Ltd.; vinyl-terminated polyphenylene ether resin SA9000: Saudi Basic Industries Corporation (SABIC); sodium hydride, N-methylpyrrolidone, N,N-dimethylacetamide, N,N-dimethylformamide and ethanol: Shanghai Sinopharm Chemical Reagent Co., Ltd., chemically pure.

[0055] The test instruments and standards used in the following examples: Dielectric constant (D k ) and dielectric loss (D f ) The test results are obtained by using an Agilent 4291B impedance analyzer with reference to the national standard GB / T 1409-2006; the moisture absorption rate is obtained by using a weighing method with reference to the national standard GB1034-70.

[0056] Example 1

[0057] In a dry three-necked flask equipped with a mechanical stirrer and a condenser, α,α'-bis(4-hydroxy-3,5-xylyl)-1,4-diisopropylbenzene and N-methylpyrrolidone were added, stirred under an ice bath, and sodium hydride was added in three batches within 30 minutes. Then, p-chloromethylstyrene was added, and the temperature was raised to 60°C and stirred for 12 hours. After the reaction, the reaction solution was poured into water for sedimentation, filtered, and the solid component was washed with ethanol and dried at 80°C for 12 hours to obtain 1,4-bis(2-(4-(4-vinylphenoxy)-3,5-dimethylphenyl)propane-2-yl)benzene (modified divinylbenzene resin) with a yield of 91%. Among them, the usage ratio of α,α'-bis(4-hydroxy-3,5-xylyl)-1,4-diisopropylbenzene and N-methylpyrrolidone is 1 mol:1.65L; the molar ratio of α,α'-bis(4-hydroxy-3,5-xylyl)-1,4-diisopropylbenzene, sodium hydride and p-chloromethylstyrene is 1:2:2.

[0058] Figure 1 1,4-bis(2-(4-(4-vinylphenoxy)-3,5-dimethylphenyl)propane-2-yl)benzene 1 HNMR spectrum. 1H NMR(CDCl3,400MHz):7.36(m,8H),7.05(m,4H),6.81(s,4H),6.62-6.70(d ,2H),5.69(d,2H),5.19(d,2H),4.71(s,4H),2.18(s,12H),1.57(s,12H). FT-IR(KBr) / cm- 1 :2967,2913,2859,1635,1227,1192.

[0059] Figure 2 This is the infrared spectrum of 1,4-bis(2-(4-(4-vinylphenoxy)-3,5-dimethylphenyl)propane-2-yl)benzene. The typical methyl and isopropyl absorption peaks in the molecular structure appear at 2859-2967 cm -1 The carbon-carbon double bond absorption peak appears at 1635 cm -1 , the ether bond absorption peak appears at 1192~1227cm -1 .

[0060] Example 2

[0061] In a dry three-necked flask equipped with a mechanical stirrer and a condenser, α,α'-bis(4-hydroxy-3,5-xylyl)-1,4-diisopropylbenzene and N-methylpyrrolidone were added, stirred under an ice bath, and sodium hydride was added in three batches within 20 minutes. Then, p-chloromethylstyrene was added, and the temperature was raised to 80°C and stirred for 4 hours. After the reaction, the reaction solution was poured into water for sedimentation, filtered, and the obtained solid component was washed with methanol and dried at 80°C for 6 hours to obtain 1,4-bis(2-(4-(4-vinylphenoxy)-3,5-dimethylphenyl)propane-2-yl)benzene with a yield of 90%. Among them, the usage ratio of α,α'-bis(4-hydroxy-3,5-xylyl)-1,4-diisopropylbenzene and N-methylpyrrolidone is 1 mol:2.3L; the molar ratio of α,α'-bis(4-hydroxy-3,5-xylyl)-1,4-diisopropylbenzene, sodium hydride and p-chloromethylstyrene is 1:2:2.4.

[0062] Example 3

[0063] In a dry three-necked flask equipped with a mechanical stirrer and a condenser, α,α'-bis(4-hydroxy-3,5-xylyl)-1,4-diisopropylbenzene and N-methylpyrrolidone were added, stirred under an ice bath, and sodium hydride was added in 4 batches within 40 minutes. Then, p-chloromethylstyrene was added, and the temperature was raised to 60°C and stirred for 8 hours. After the reaction, the reaction solution was poured into water for sedimentation, filtered, and the obtained solid component was washed with methanol and dried at 100°C for 9 hours to obtain 1,4-bis(2-(4-(4-vinylphenoxy)-3,5-dimethylphenyl)propane-2-yl)benzene with a yield of 91%. Among them, the dosage ratio of α,α'-bis(4-hydroxy-3,5-xylyl)-1,4-diisopropylbenzene and N-methylpyrrolidone is 1 mol:2L; the molar ratio of α,α'-bis(4-hydroxy-3,5-xylyl)-1,4-diisopropylbenzene, sodium hydride and p-chloromethylstyrene is 1:2:2.2.

[0064] Example 4

[0065] 6.0 g of 1,4-bis(2-(4-(4-vinylphenoxy)-3,5-dimethylphenyl)propane-2-yl)benzene was dissolved in 10 mL of cyclohexanone, dibenzoyl peroxide initiator was added, the resin solution was poured into a glass mold, dried in an oven at 80°C for 1 hour, heated from room temperature to 160°C at a heating rate of 1°C / min and kept warm for 1 hour, then heated to 240°C at a heating rate of 1°C / min and kept warm for 1 hour to obtain a thermosetting polymer material. Dielectric properties of thermosetting polymer materials: D k is 2.61, D f The mass ratio of 1,4-bis(2-(4-(4-vinylphenoxy)-3,5-dimethylphenyl)propane-2-yl)benzene to cyclohexanone is 6 g:10 mL; the mass ratio of 1,4-bis(2-(4-(4-vinylphenoxy)-3,5-dimethylphenyl)propane-2-yl)benzene to dibenzoyl peroxide is 6:0.005.

[0066] Example 5

[0067] Dissolve 1,4-bis(2-(4-(4-vinylphenoxy)-3,5-dimethylphenyl)propane-2-yl)benzene and diphenylmethane bismaleimide resin in cyclohexanone, add dibenzoyl peroxide initiator, pour the mixed resin solution into a glass mold, dry in an oven at 80°C for 1 hour, heat from room temperature to 160°C at a heating rate of 1°C / min and keep warm for 1 hour, then heat to 240°C at a heating rate of 1°C / min and keep warm for 1 hour to obtain a thermosetting polymer material. Dielectric properties of thermosetting polymer materials: D k is 2.72, D fThe mass ratio of 1,4-bis(2-(4-(4-vinylphenoxy)-3,5-dimethylphenyl)propane-2-yl)benzene to diphenylmethane bismaleimide resin is 1:2; the dosage ratio of 1,4-bis(2-(4-(4-vinylphenoxy)-3,5-dimethylphenyl)propane-2-yl)benzene to cyclohexanone is 1g:5mL; the mass ratio of 1,4-bis(2-(4-(4-vinylphenoxy)-3,5-dimethylphenyl)propane-2-yl)benzene to dibenzoyl peroxide is 1:0.0025.

[0068] Example 6

[0069] Dissolve 1,4-bis(2-(4-(4-vinylphenoxy)-3,5-dimethylphenyl)propane-2-yl)benzene and diphenylmethane bismaleimide resin in cyclohexanone, add dibenzoyl peroxide initiator, pour the mixed resin solution into a glass mold, dry in an oven at 80°C for 1 hour, heat from room temperature to 160°C at a heating rate of 1°C / min and keep warm for 1 hour, then heat to 240°C at a heating rate of 1°C / min and keep warm for 1 hour to obtain a thermosetting polymer material. Dielectric properties of thermosetting polymer materials: D k is 2.69, D f The mass ratio of 1,4-bis(2-(4-(4-vinylphenoxy)-3,5-dimethylphenyl)propane-2-yl)benzene to diphenylmethane bismaleimide resin is 1:1; the dosage ratio of 1,4-bis(2-(4-(4-vinylphenoxy)-3,5-dimethylphenyl)propane-2-yl)benzene to cyclohexanone is 3g:10mL; the mass ratio of 1,4-bis(2-(4-(4-vinylphenoxy)-3,5-dimethylphenyl)propane-2-yl)benzene to dibenzoyl peroxide is 3:0.005.

[0070] Example 7

[0071] Dissolve 1,4-bis(2-(4-(4-vinylphenoxy)-3,5-dimethylphenyl)propane-2-yl)benzene and diphenylmethane bismaleimide resin in cyclohexanone, add dibenzoyl peroxide initiator, pour the mixed resin solution into a glass mold, dry in an oven at 80°C for 1 hour, heat from room temperature to 160°C at a heating rate of 1°C / min and keep warm for 1 hour, then heat to 240°C at a heating rate of 1°C / min and keep warm for 1 hour to obtain a thermosetting polymer material. Dielectric properties of thermosetting polymer materials: D k is 2.64, D fThe mass ratio of 1,4-bis(2-(4-(4-vinylphenoxy)-3,5-dimethylphenyl)propane-2-yl)benzene to diphenylmethane bismaleimide resin is 1:0.5; the dosage ratio of 1,4-bis(2-(4-(4-vinylphenoxy)-3,5-dimethylphenyl)propane-2-yl)benzene to cyclohexanone is 1g:2.5mL; the mass ratio of 1,4-bis(2-(4-(4-vinylphenoxy)-3,5-dimethylphenyl)propane-2-yl)benzene to dibenzoyl peroxide is 4:0.005.

[0072] Although the above-mentioned embodiments have made a detailed description of the present invention, they are only some embodiments of the present invention, rather than all embodiments. People can also obtain other embodiments based on the embodiments of the present invention without creative work, and these embodiments all fall within the scope of protection of the present invention.

Claims

1. A modified divinyl benzene resin having a structure shown in Formula I: Formula I.

2. The method for preparing the modified divinyl benzene resin according to claim 1, comprising the following steps: Dissolving α,α'-bis(4-hydroxy-3,5-xylyl)-1,4-diisopropylbenzene in an organic solvent, adding an alkaline catalyst to carry out a salt-forming reaction, and obtaining an active bisphenolate solution containing a tetramethyl-substituted triphenyl diisopropyl structure; The active bisphenolate solution containing tetramethyl-substituted triphenyl diisopropane structure is mixed with p-chloromethylstyrene to carry out substitution reaction to obtain modified divinylbenzene resin.

3. The preparation method according to claim 2, characterized in that: The molar ratio of α,α'-bis(4-hydroxy-3,5-xylyl)-1,4-diisopropylbenzene to the alkaline catalyst is 1:2-2.3; The alkaline catalyst is added in batches, and the duration of adding the alkaline catalyst is 20 to 40 minutes; The organic solvent is one or more of N-methylpyrrolidone, N,N-dimethylacetamide and N,N-dimethylformamide; the mass ratio of the α,α'-bis(4-hydroxy-3,5-xylyl)-1,4-diisopropylbenzene to the organic solvent is 1:4-6.

4. The preparation method according to claim 2, characterized in that: The molar ratio of the α,α'-bis(4-hydroxy-3,5-xylyl)-1,4-diisopropylbenzene to p-chloromethylstyrene is 1:2-2.

4.

5. The preparation method according to claim 2, characterized in that: The temperature of the substitution reaction is 60-80° C. and the time is 4-12 hours.

6. Use of the modified divinylbenzene resin according to claim 1 or the modified divinylbenzene resin prepared by the preparation method according to any one of claims 2 to 5 in thermosetting polymer materials.

7. A thermosetting polymer material, wherein the raw materials for preparation include resin, initiator and solvent; the resin includes modified divinyl benzene resin; The modified divinylbenzene resin is the modified divinylbenzene resin according to claim 1 or the modified divinylbenzene resin prepared by the preparation method according to any one of claims 2 to 5.

8. The thermosetting polymer material according to claim 7, characterized in that: The resin further comprises other resins, and the other resins comprise diphenylmethane bismaleimide resin and / or vinyl terminated polyphenylene ether.

9. The method for preparing the thermosetting polymer material according to claim 7 or 8, comprising the following steps: Mixing a resin, a solvent and an initiator, and thermally curing the obtained resin solution to obtain a thermosetting polymer material; The resin includes a modified divinyl benzene resin.

10. Use of the thermosetting polymer material according to claim 7 or 8 or the thermosetting polymer material prepared by the preparation method according to claim 9 in high-frequency and high-speed copper-clad laminates.

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