Method for manufacturing optical device and electronic device

Abstract

The present application discloses a method for manufacturing an optical device and an electronic device, belonging to the technical field of electronic products. The electronic device comprises: a screen cover, a circuit board and an optical device, wherein the circuit board is located on the inner side of the screen cover; the optical device comprises a metal frame and a photosensitive chip, the metal frame comprises a frame body and a plurality of pin structures, the frame body comprises a first surface and a second surface arranged opposite to each other, and the photosensitive chip is arranged on the first surface; the plurality of pin structures comprise a first pin structure and a second pin structure, each of the first pin structure and the second pin structure comprises a supporting connection portion extending from the frame body and a connection portion arranged at the end of each supporting connection portion, the connection portion of the first pin structure is arranged on the side where the first surface is located, and the connection portion of the second pin structure is arranged on the side where the second surface is located; the optical device is arranged between the screen cover and the circuit board through the supporting connection portion of the first pin structure and / or the supporting connection portion of the second pin structure.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic products, and specifically relates to a method for manufacturing an optical device and an electronic device. Background Art

[0002] With the development of terminal technology, more and more optical devices are placed under the screen. Furthermore, to improve the optical performance of optical devices, a spacer plate is often designed to shorten the gap between the optical device and the screen and reduce optical crosstalk. However, the use of the spacer plate requires the optical device to be mounted on the spacer plate using surface mount technology (SMT) to form an optical spacer plate module during the assembly process. This is then followed by another SMT process to mount the optical spacer plate module to a circuit board such as the motherboard. This means that two SMT processes are required to complete the assembly of the optical device.

[0003] It can be seen that the assembly of optical devices in the related art has the problem of complicated assembly process. Summary of the Invention

[0004] The purpose of the embodiments of the present application is to provide a method for manufacturing an optical device and an electronic device, which can solve the problem of complicated assembly process in the assembly of optical devices in the related art.

[0005] In order to solve the above technical problems, this application is implemented as follows:

[0006] In a first aspect, an embodiment of the present application provides an electronic device, comprising a screen cover, a circuit board, and an optical device, wherein the circuit board is located inside the screen cover;

[0007] The optical device includes a metal frame and a photosensitive chip. The metal frame includes a frame body and a plurality of pin structures extending from the frame body. The frame body includes a first surface and a second surface disposed opposite to each other. The photosensitive chip is disposed on the first surface.

[0008] The plurality of pin structures include a first pin structure and a second pin structure, each of the first pin structure and the second pin structure includes a support connection portion extending from the frame body and a connection portion provided at an end of each support connection portion, the connection portion of the first pin structure being provided on a side where the first surface is located, and the connection portion of the second pin structure being provided on a side where the second surface is located;

[0009] Wherein, the optical device is arranged between the screen cover and the circuit board through the supporting connection part of the first pin structure and / or the supporting connection part of the second pin structure.

[0010] In a second aspect, an embodiment of the present application provides a method for manufacturing an optical device, comprising:

[0011] providing a metal substrate;

[0012] Etching the metal substrate to obtain a metal frame including a frame body and a plurality of pins, wherein the frame body includes a first surface and a second surface disposed opposite to each other, and the plurality of pins are disposed around the frame body;

[0013] Mounting a photosensitive chip on the first surface, and electrically connecting the photosensitive chip to at least some of the plurality of pins;

[0014] Bending the plurality of pins to obtain an optical device comprising a plurality of pin structures, the plurality of pin structures comprising a first pin structure and a second pin structure, the first pin structure and the second pin structure each comprising a supporting connection portion extending from the frame body and a connecting portion disposed at an end of each supporting connection portion, the connecting portion of the first pin structure being disposed on a side where the first surface is located, and the connecting portion of the second pin structure being disposed on a side where the second surface is located;

[0015] Wherein, the optical device is arranged between the screen cover and the circuit board through the supporting connection part of the first pin structure and / or the supporting connection part of the second pin structure.

[0016] In the embodiments of the present application, since the supporting connection portion of the first pin structure and the supporting connection portion of the second pin structure can both provide a certain supporting force, and this supporting force can provide support for the optical device, when the optical device is set on the screen cover via the supporting connection portion of the first pin structure, or is set on the circuit board via the supporting connection portion of the second pin structure, there is no need to use an additional raised structure or raised layer to provide support. Compared with the solution that requires a raised structure or raised layer, which requires at least two SMTs to achieve the assembly of the optical device, in the present application, only one SMT is required to achieve the assembly and connection of the optical device between the screen cover and the circuit board, effectively simplifying the assembly process of the optical device and improving the assembly efficiency of the optical device.

[0017] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become obvious from the description below, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0019] Figure 1This is one of the structural diagrams of the electronic device provided in the embodiment of the present application;

[0020] Figure 2 This is the second structural diagram of the electronic device provided in the embodiment of the present application;

[0021] Figure 3 is a schematic structural diagram of an optical device provided in an embodiment of the present application;

[0022] Figure 4 yes Figure 3 One of the structural diagrams of the pin structure shown in;

[0023] Figure 5 yes Figure 3 The second structural diagram of the pin structure shown in FIG;

[0024] Figure 6 yes Figure 3 The third structural diagram of the pin structure shown in FIG;

[0025] Figure 7 yes Figure 3 One of the bending schematic diagrams of the pin structure shown in;

[0026] Figure 8 yes Figure 3 The second bending diagram of the pin structure shown in FIG;

[0027] Figure 9 yes Figure 3 The third bending diagram of the pin structure shown in FIG;

[0028] Figure 10 is a flow chart of a method for manufacturing an optical device provided in an embodiment of the present application;

[0029] Figure 11 This is one of the operational schematic diagrams of the method for manufacturing an optical device provided in an embodiment of the present application;

[0030] Figure 12 This is the second operational diagram of the method for manufacturing an optical device provided in an embodiment of the present application;

[0031] Figure 13 This is a schematic diagram of pins of different lengths provided in an embodiment of the present application. DETAILED DESCRIPTION

[0032] The embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0033] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly refer to one or more of the features. Throughout the description of this application, unless otherwise specified, "plurality" means two or more. Furthermore, "and / or" in the specification and claims refers to at least one of the connected entities, and the character " / " generally indicates an "or" relationship between the connected entities.

[0034] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0035] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0036] like Figures 1 to 9 As shown, an embodiment of the present application provides an electronic device, including a screen cover 10, a circuit board 20 and an optical device 30, wherein the circuit board 20 is located on the inner side of the screen cover 10;

[0037] The optical device 30 includes a metal frame 31 and a photosensitive chip 32. The metal frame 31 includes a frame body 311 and a plurality of pin structures 312 extending from the frame body 311. The frame body 311 includes a first surface and a second surface disposed opposite to each other. The photosensitive chip 32 is disposed on the first surface.

[0038] The plurality of pin structures 312 include a first pin structure and a second pin structure. Each of the first pin structure and the second pin structure includes a support connection portion 3121 extending from the frame body 311 and a connection portion 3122 disposed at an end of each support connection portion 3121. The connection portion 3122 of the first pin structure is disposed on the side where the first surface is located, and the connection portion 3122 of the second pin structure is disposed on the side where the second surface is located.

[0039] The optical device is arranged between the screen cover 10 and the circuit board 20 through the supporting connection portion 3121 of the first pin structure and / or the supporting connection portion 3121 of the second pin structure.

[0040] The above-mentioned first pin structure can be understood as a pin structure in which the connection part 3122 among multiple pin structures is arranged on the side where the first surface is located, that is, it can be understood as a pin structure in which the support connection part 3121 among multiple pin structures extends in a direction away from the second surface, that is, the support connection part 3121 of the first pin structure extends in a direction away from the second surface.

[0041] The above-mentioned second pin structure can be understood as a pin structure in which the connection part 3122 among multiple pin structures is arranged on the side where the second surface is located, that is, it can be understood as a pin structure in which the support connection part 3121 among multiple pin structures extends in a direction away from the first surface, that is, the support connection part 3121 of the second pin structure extends in a direction away from the first surface.

[0042] Since the first surface is the end surface of the frame body 311 on which the photosensitive chip 32 is provided, and the optical device 30 is an under-screen optical device, that is, the end surface of the frame body 311 on which the photosensitive chip 32 is provided needs to be arranged facing the screen cover 10; therefore, the optical device 30 can be arranged on the screen cover 10 through the support connection part 3122 of the first pin structure to realize the assembly connection of the optical device 30; or, the optical device 30 can be arranged on the circuit board 20 through the support connection part 3122 of the second pin structure to realize the assembly connection of the optical device 30.

[0043] Because the pin structure 312 in the present application extends from the frame body 311 of the metal frame 31, it has greater structural strength than a pin structure etched on a circuit board and can provide a certain amount of support. Specifically, the supporting connection portion 3121 of the first pin structure and the supporting connection portion 3121 of the second pin structure in the present application both provide a certain amount of support force, which can provide support for the optical device 30. Thus, when the optical device 30 is mounted on the screen cover 10 via the supporting connection portion 3122 of the first pin structure, or mounted on the circuit board 20 via the supporting connection portion 3122 of the second pin structure, no additional support structure or layer is required. Compared to solutions that require at least two SMT processes to assemble the optical device, the present application only requires a single SMT process to assemble the optical device 30 between the screen cover 10 and the circuit board 20, effectively simplifying the assembly process and improving assembly efficiency of the optical device 30.

[0044] In some embodiments, at least some of the multiple pin structures 312 are electrically connected to the photosensitive chip 32, that is, the photosensitive chip 32 can be electrically connected to other devices such as circuit boards through at least some of the multiple pin structures 312 to process the signals received by the photosensitive chip 32, such as realizing functions such as fingerprint recognition.

[0045] Moreover, compared with the conventional solution in which the substrate and circuit board of the optical device are connected through a raised layer, the setting of the supporting connection part 3121 in the present application forms a certain heat dissipation space between the frame body 311 and the circuit board 20 or the screen cover 10, that is, by using the metal frame 31 as the base of the optical device 30, the heat dissipation capacity of the optical device 30 during operation is effectively improved.

[0046] In the present application, by providing a pin structure 312 and utilizing the supporting connection portion 3121 of the pin structure 312 to support the frame body 311, a certain spacing is formed between the frame body 311 and the circuit board 20 or the screen cover 10. Compared to directly attaching the optical device 30 to the circuit board, this can improve the optical viewing angle under the same optical window size, while also reducing optical crosstalk and improving the optical effect of the optical device 30. Moreover, by implementing the spaced support between the optical device 30 and the screen cover 10 through the supporting connection portion 3121, screen burn-in caused by the optical device 30 being too close to the screen cover 10 can be avoided.

[0047] In some embodiments, due to the setting of the support connection portion 3121, a certain spacing space is provided between the frame body 311 and the circuit board 20 or the screen cover 10, which makes it convenient to fill the sealant at the solder joint position, avoiding the void phenomenon caused by the difficulty of filling the solder joint sealant in the conventional solution, improving the strength of the solder joint connection, and also reducing the problem of welding failure caused by falling and collision.

[0048] In some embodiments, the frame body 311 can be connected to the structure with solder pads on the screen cover 10 through the connection portion 3122 to achieve assembly connection of the optical device 30 and the screen cover 10.

[0049] In some embodiments, the frame body 311 can be connected to the circuit board 20 by welding through the connection portion 3122 to achieve an assembly connection between the optical device 30 and the circuit board 20 .

[0050] In some embodiments, as Figure 4 As shown, the support connecting portion 3121 includes a support portion body 31211 and a first connecting segment 31212. The first connecting segment 31212 is a bent connecting segment provided relative to the first end portion of the support portion body 31211. The support portion body 31211 is connected to the frame body 311 via the first connecting segment 31212.

[0051] The connecting portion 3122 is a bent connecting segment disposed relative to the second end portion of the supporting portion body 31211 .

[0052] In this embodiment, by setting the pin structure 312 composed of the supporting connection part 3121 and the connection part 3122 as a two-section bending structure, the structural strength of the pin structure 312 can be effectively improved, that is, the supporting effect of the supporting connection part 3121 on the frame body 311 can be improved.

[0053] In some embodiments, as Figure 6 As shown, the welding surface 31221 of the connecting portion 3122 can be the end surface of the connecting portion 3122 facing away from the frame body 311, so as to increase the contact area between the connecting portion 3122 and the welding point on the circuit board 20 and other devices, thereby improving the connection strength between the optical device 30 and the circuit board 20 and other devices.

[0054] In some embodiments, the length dimension of the connecting portion 3122 is greater than the length dimension of the first connecting section 31212, which can increase the area of ​​the welding surface 31221 of the connecting portion 3122 to further increase the contact area between the connecting portion 3122 and the welding points on devices such as the circuit board 20.

[0055] In some embodiments, the welding surface 31221 of the connecting portion 3122 can be understood as the end surface of the connecting portion 3122 parallel to the sensing surface of the photosensitive chip 32 .

[0056] In some embodiments, as Figure 5 As shown, the support portion body 31211 includes a second connecting segment 312111, a third connecting segment 312112, and a fourth connecting segment 312113 that are bent and connected in sequence. The end of the second connecting segment 312111 away from the third connecting segment 312112 is connected to the first connecting segment 31212, and the end of the fourth connecting segment 312113 away from the third connecting segment 312112 is connected to the connecting portion 3122.

[0057] The third connecting section 312112 is arranged parallel to the first connecting section 31212 and / or the connecting portion 3122 .

[0058] In this embodiment, by setting the support part body 31211 to include a second connecting segment 312111, a third connecting segment 312112 and a fourth connecting segment 312113 which are bent and connected in sequence, that is, by designing the support connection part 3121 as a multi-section bending structure, not only the structural strength of the pin structure 312 can be improved, but also the support height of the pin structure 312 can be adjusted, thereby improving the support effect of the pin structure 312 and realizing flexible adjustment of the support height of the pin structure 312.

[0059] In some embodiments, as Figures 7 to 9 As shown, the support height can be flexibly adjusted by adjusting the bending position of the pin structure 312, thereby meeting the height requirement of the optical device 30 in different scenarios.

[0060] In some embodiments, by setting a first pin structure and a second pin structure, the optical device 30 can be assembled and connected to the screen cover 10 or to the circuit board 20, effectively improving the compatibility of the optical device 30 in different assembly scenarios.

[0061] In some embodiments, the first pin structures and the second pin structures are alternately arranged, and the first pin structures and the second pin structures arranged around the frame body 311 form a Faraday cage structure.

[0062] In this embodiment, a Faraday cage structure is formed by forming the first pin structure and the second pin structure arranged around the frame body 311. The Faraday cage structure can form a certain shielding effect on the working signal of the optical device 30, thereby reducing the interference effect of the working signal of the optical device 30 on other components of the electronic device, especially reducing the interference effect of the working signal of the optical device 30 on the antenna structure of the electronic device.

[0063] In some embodiments, the first pin structure and the second pin structure may be alternately arranged in sequence.

[0064] It can be understood that the first pin structure and the second pin structure alternately arranged in sequence may be pin structures extended from the same side edge of the frame body 311 .

[0065] In some embodiments, for the first pin structure and the second pin structure extending from the same side edge of the frame body 311 , two second pin structures are arranged between any two first pin structures, or two first pin structures are arranged between any two second pin structures.

[0066] In some embodiments, for the first pin structure and the second pin structure extending from the same side edge of the frame body 311, three second pin structures are arranged between any two first pin structures, or three first pin structures are arranged between any two second pin structures.

[0067] like Figures 10 to 12 As shown, the embodiment of the present application further provides a method for manufacturing an optical device, by which the optical device in the above embodiment can be manufactured. The method for manufacturing the optical device specifically includes the following steps:

[0068] Step 1001: Provide a metal substrate.

[0069] Step 1002: Etching the metal substrate to obtain a metal frame including a frame body and a plurality of pins, wherein the frame body includes a first surface and a second surface disposed opposite to each other, and the plurality of pins are disposed around the frame body.

[0070] Step 1003: Mount a photosensitive chip on the first surface, and electrically connect the photosensitive chip to at least some of the plurality of pins.

[0071] Step 1004 : bend the plurality of pins to obtain an optical device including a plurality of pin structures, wherein the plurality of pin structures include a first pin structure and a second pin structure.

[0072] Among them, the first pin structure and the second pin structure both include a supporting connection portion extending from the frame body and a connection portion arranged at the end of each supporting connection portion, the connection portion of the first pin structure is arranged on the side where the first surface is located, and the connection portion of the second pin structure is arranged on the side where the second surface is located; the optical device is arranged between the screen cover and the circuit board through the supporting connection portion of the first pin structure and / or the supporting connection portion of the second pin structure.

[0073] In this embodiment, a metal substrate is provided; the metal substrate is etched to obtain a metal frame including a frame body and a plurality of pins, the frame body including a first surface and a second surface disposed opposite to each other, the plurality of pins being disposed around the frame body; a photosensitive chip is mounted on the first surface, and the photosensitive chip is electrically connected to at least some of the plurality of pins; the plurality of pins are bent to obtain an optical device including a plurality of pin structures, the plurality of pin structures including a first pin structure and a second pin structure, each of the first pin structure and the second pin structure including a supporting connection portion extending from the frame body and a connecting portion disposed at the end of each supporting connection portion, the connecting portion of the first pin structure being disposed on a side of the first surface, and the connecting portion of the second pin structure being disposed on a side of the second surface; wherein the optical device is disposed between a screen cover and a circuit board via the supporting connection portion of the first pin structure and / or the supporting connection portion of the second pin structure. This allows for fabrication of an optical device, and enables the resulting optical device to achieve the same technical effects as the optical device in the above-described embodiment.

[0074] In some embodiments, the bending process of the plurality of pins to obtain an optical device including a plurality of pin structures includes:

[0075] bending a first pin among the plurality of pins toward the side where the first surface is located to obtain an optical device including the first pin structure;

[0076] A second pin among the plurality of pins is bent in a direction toward the side where the second surface is located to obtain an optical device including a second pin structure.

[0077] In this embodiment, the pins of the plurality of pins can be bent in different directions to obtain a first pin structure and a second pin structure with different directions, so that the obtained optical device can be assembled and connected to the screen cover 10 through the support connection part 3122 of the first pin structure, and can also be assembled and connected to the circuit board 20 through the support connection part 3122 of the second pin structure, thereby effectively improving the compatibility of the optical device 30 in different assembly scenarios.

[0078] In some embodiments, the support height provided by the support connection portion may be determined based on the length and / or the bending position of the pin.

[0079] In some embodiments, during the etching process of the metal substrate, basic pins of different lengths can be etched out, and then the basic pins of different lengths can be processed into support pins of different support heights, such as Figure 13 shown.

[0080] In some embodiments, during the etching process of the metal substrate, basic pins of the same length can be etched out, and then based on the basic pins of the same length, different bending positions can be set to process support pins of different support heights, such as Figure 7 and Figure 8 shown.

[0081] In some embodiments, multiple bending processes can be performed to form Figure 9 The "multi-Z-shaped" pins shown can not only realize the flexible setting of the support height, but also improve the structural strength of the pin structure, thereby improving the supporting effect of the pin structure on the frame body.

[0082] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0083] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and intent of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that: It includes a screen cover, a circuit board and an optical device, wherein the circuit board is located on the inner side of the screen cover; The optical device includes a metal frame and a photosensitive chip. The metal frame includes a frame body and a plurality of pin structures extending from the frame body. The frame body includes a first surface and a second surface disposed opposite to each other. The photosensitive chip is disposed on the first surface. The plurality of pin structures include a first pin structure and a second pin structure, each of the first pin structure and the second pin structure includes a support connection portion extending from the frame body and a connection portion provided at an end of each support connection portion, the connection portion of the first pin structure being provided on a side where the first surface is located, and the connection portion of the second pin structure being provided on a side where the second surface is located; Wherein, the optical device is arranged between the screen cover and the circuit board through the supporting connection part of the first pin structure and / or the supporting connection part of the second pin structure.

2. The electronic device according to claim 1, wherein The support connecting portion includes a support portion body and a first connecting segment, wherein the first connecting segment is a bent connecting segment provided relative to the first end portion of the support portion body, and the first end portion of the support portion body is connected to the frame body via the first connecting segment; The connecting portion is a bent connecting segment arranged relative to the second end portion of the supporting portion body.

3. The electronic device according to claim 2, wherein: The welding surface of the connecting portion is the end surface of the connecting portion facing away from the frame body.

4. The electronic device according to claim 3, wherein: The length of the connecting portion is greater than the length of the first connecting section.

5. The electronic device according to claim 2, wherein: The support body includes a second connecting segment, a third connecting segment, and a fourth connecting segment that are bent and connected in sequence, wherein an end of the second connecting segment away from the third connecting segment is connected to the first connecting segment, and an end of the fourth connecting segment away from the third connecting segment is connected to the connecting portion; Wherein, the third connecting section is parallel to the first connecting section and / or the connecting portion.

6. The electronic device according to any one of claims 1 to 5, characterized in that: The first pin structures and the second pin structures are alternately arranged, and the first pin structures and the second pin structures arranged around the frame body form a Faraday cage structure.

7. The electronic device according to claim 6, wherein: The first pin structure and the second pin structure are extended from each side edge of the frame body, and two second pin structures are arranged between any two first pin structures, or two first pin structures are arranged between any two second pin structures.

8. A method for manufacturing an optical device, characterized in that: include: providing a metal substrate; Etching the metal substrate to obtain a metal frame including a frame body and a plurality of pins, wherein the frame body includes a first surface and a second surface disposed opposite to each other, and the plurality of pins are disposed around the frame body; Mounting a photosensitive chip on the first surface, and electrically connecting the photosensitive chip to at least some of the plurality of pins; Bending the plurality of pins to obtain an optical device comprising a plurality of pin structures, the plurality of pin structures comprising a first pin structure and a second pin structure, the first pin structure and the second pin structure each comprising a supporting connection portion extending from the frame body and a connecting portion disposed at an end of each supporting connection portion, the connecting portion of the first pin structure being disposed on a side where the first surface is located, and the connecting portion of the second pin structure being disposed on a side where the second surface is located; Wherein, the optical device is arranged between the screen cover and the circuit board through the supporting connection part of the first pin structure and / or the supporting connection part of the second pin structure.

9. The method according to claim 8, characterized in that The bending process is performed on the plurality of pins to obtain an optical device including a plurality of pin structures, comprising: bending a first pin among the plurality of pins toward the side where the first surface is located to obtain an optical device including the first pin structure; A second pin among the plurality of pins is bent in a direction toward the side where the second surface is located to obtain an optical device including a second pin structure.

10. The method according to claim 8, characterized in that The support height provided by the support connection portion is determined based on the length and / or bending position of the pin.

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