Display substrate, preparation method, backlight module and display device

Abstract

The present application relates to a display substrate, a preparation method, a backlight module and a display device, wherein the display substrate includes a glass substrate, a plurality of light-emitting elements arranged on the glass substrate, a chip-on-chip film connected to the glass substrate and a circuit board electrically connected to the chip-on-chip film, wherein the light-emitting elements and the chip-on-chip film are respectively located on both sides of the glass substrate, the glass substrate includes a through hole penetrating the glass substrate, a conductive paste is arranged in the through hole, one end of the through hole is connected to the light-emitting element, and the other end of at least part of the through hole is connected to the chip-on-chip film, the circuit board is located on the side of the glass substrate where the chip-on-chip film is arranged, and is connected to the glass substrate. A reinforcement is arranged on the side of the glass substrate where the chip-on-chip film is connected, and the reinforcement does not overlap with the chip-on-chip film and the circuit board. This is to improve the rigidity strength of the thin and light display device.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display substrate, a preparation method, a backlight module and a display device. Background Art

[0002] With the continuous advancement of display technology, display panels are widely used in fields such as televisions, computer monitors and mobile devices, among which thin and light display devices are more popular among users.

[0003] In the related art, in order to realize the thinness and lightness of display devices, various manufacturers narrow the frame of the display on the one hand, and continuously reduce the thickness of the base substrate in the display panel on the other hand.

[0004] However, in the related art, whether the display device has a narrowed frame or a display device with a reduced thickness of the base substrate, the rigidity of the display device will be reduced, making it easy to be damaged during transportation or use. Summary of the invention

[0005] The present application aims to provide a display substrate, a preparation method, a backlight module and a display device to solve the technical problem of poor rigidity strength of lightweight and thin display devices in the related art.

[0006] In the first aspect, an embodiment of the present application proposes a display substrate, including a glass substrate, a plurality of light-emitting elements arranged on the glass substrate, a chip-on-chip film connected to the glass substrate, and a circuit board electrically connected to the chip-on-chip film, the light-emitting elements and the chip-on-chip film are respectively located on both sides of the glass substrate, the glass substrate includes a through hole penetrating the glass substrate, a conductive paste is arranged in the through hole, one end of the through hole is connected to the light-emitting element, and the other end of at least part of the through hole is connected to the chip-on-chip film, the circuit board is located on a side of the glass substrate where the chip-on-chip film is arranged, and is connected to the glass substrate; a reinforcement is arranged on the side of the glass substrate where the chip-on-chip film is connected, and the reinforcement does not overlap with the chip-on-chip film and the circuit board.

[0007] In a possible implementation, a driving circuit is disposed on the side wall of the reinforcement, and the driving circuit is electrically connected to the conductive paste in some through holes.

[0008] In a possible implementation manner, a groove is provided on the glass substrate, and the reinforcing member is located in the groove.

[0009] In a possible implementation, the material of the reinforcing member and / or the material of the circuit board is the same as that of the glass substrate, and the reinforcing member and the glass substrate are fixed by welding.

[0010] In a possible implementation, a plurality of pads are disposed on the glass substrate, and the light-emitting element is electrically connected to the pads via an anisotropic conductive adhesive film; and the area of ​​the through hole is smaller than the area of ​​the pad.

[0011] In a second aspect, an embodiment of the present application provides a method for preparing a display substrate as mentioned in the first aspect, comprising:

[0012] A glass substrate is provided.

[0013] A through hole is arranged on the glass substrate, and a conductive paste is arranged in the through hole, wherein the through hole penetrates the glass substrate.

[0014] A plurality of light emitting elements and chip-on-chip films are respectively arranged on both sides of the glass substrate, so that one end of the through hole is connected to the light emitting element, and the other end of at least part of the through hole is connected to the chip-on-chip film.

[0015] A circuit board is arranged on one side of the glass substrate where the chip-on-chip film is arranged. The circuit board is electrically connected to the chip-on-chip film and is also connected to the glass substrate.

[0016] A reinforcing member is arranged on one side of the glass substrate connected to the chip-on-cover film, and the reinforcing member does not overlap with the chip-on-cover film and the circuit board.

[0017] In a possible implementation, the material of the reinforcement and / or the material of the circuit board is the same as that of the glass substrate, a circuit board is arranged on one side of the glass substrate where the chip-on-film is arranged, the circuit board is electrically connected to the chip-on-film and connected to the glass substrate, including:

[0018] The circuit board is connected to the glass substrate by laser welding.

[0019] In a possible implementation, the material of the reinforcing member and / or the material of the circuit board is the same as that of the glass substrate, and a reinforcing member is provided on a side of the glass substrate connected to the chip-on-film, including:

[0020] The reinforcing member is connected to the glass substrate by laser welding.

[0021] In a third aspect, an embodiment of the present application provides a backlight module, comprising:

[0022] The display substrate as mentioned in the first aspect.

[0023] In a fourth aspect, an embodiment of the present application provides a display device, including:

[0024] Such as the display substrate mentioned in the first aspect or the backlight module mentioned in the third aspect.

[0025] The embodiment of the present application provides a display substrate, a preparation method, a backlight module and a display device, the display substrate includes a glass substrate, a plurality of light-emitting elements arranged on the glass substrate, a chip-on-chip film connected to the glass substrate and a circuit board electrically connected to the chip-on-chip film, the light-emitting element and the chip-on-chip film are respectively located on both sides of the glass substrate, the glass substrate includes a through hole penetrating the glass substrate, a conductive paste is arranged in the through hole, one end of the through hole is connected to the light-emitting element, and the other end of at least part of the through hole is connected to the chip-on-chip film, the circuit board is located on the side of the glass substrate where the chip-on-chip film is arranged, and is connected to the glass substrate. By arranging a through hole in the glass substrate and arranging a conductive paste in the through hole, the light-emitting element is electrically connected to the chip-on-chip film through the conductive paste in the through hole, and then the chip-on-chip film and the light-emitting element are respectively located on both sides of the glass substrate, even if the chip-on-chip film is located on the backlight side of the glass substrate, and the positive projection of the chip-on-chip film and the circuit board on the glass substrate is located on the glass substrate. Compared with the related art, the present application effectively improves the rigidity strength of the display device with a light and thin design to reduce the breakage rate during transportation or use. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The features, advantages and technical effects of the exemplary embodiments of the present application will be described below with reference to the accompanying drawings. In the accompanying drawings, the same reference numerals are used for the same components. The accompanying drawings are not drawn according to the actual scale, but are only used to illustrate the relative position relationship. The layer thickness of some parts is exaggerated for easy understanding, and the layer thickness in the accompanying drawings does not represent the proportional relationship of the actual layer thickness.

[0027] Figure 1 A side view of a display substrate provided in Embodiment 1 of the present application is shown;

[0028] Figure 2 A rear view of a display substrate provided in the first embodiment of the present application is shown;

[0029] Figure 3 A side view of another display substrate provided in the first embodiment of the present application is shown;

[0030] Figure 4 A rear view of another display substrate provided in the first embodiment of the present application is shown;

[0031] Figure 5 A schematic flow chart showing a method for preparing a display substrate provided in Embodiment 2 of the present application;

[0032] Figure 6 A schematic diagram showing the structure of a backlight module provided in the third embodiment of the present application is shown;

[0033] Figure 7 A schematic structural diagram of a display device provided in Embodiment 4 of the present application is shown.

[0034] Reference numerals:

[0035] 10. Display substrate;

[0036] 11. glass substrate; 111. through hole; 112. conductive paste; 113. groove;

[0037] 12. Light-emitting element;

[0038] 13. Chip-on-chip film;

[0039] 14. Circuit board;

[0040] 15. Reinforcement;

[0041] 16. Solder pad;

[0042] 17. Driving circuit;

[0043] 20. Backlight module; 30. Display device. DETAILED DESCRIPTION

[0044] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In the detailed description below, many specific details are proposed to provide a comprehensive understanding of the present application. However, it is obvious to those skilled in the art that the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating examples of the present application. In the accompanying drawings and the following description, at least part of the known structures and technologies are not shown to avoid unnecessary ambiguity in the present application; and, for clarity, the size of the regional structure may be exaggerated. In addition, the features, structures or characteristics described below may be combined in one or more embodiments in any suitable manner.

[0045] In the related art, the display device is made thinner and lighter by narrowing the frame of the display or reducing the thickness of the substrate in the display panel. However, in the related art, while making the display device thinner and lighter, the rigidity of the display device is reduced, making it easy to be damaged during transportation or use.

[0046] In view of this, the embodiments of the present application provide a display substrate, a preparation method, a backlight module and a display device, by setting a through hole in the glass substrate and setting a conductive paste in the through hole, so that the light-emitting element is electrically connected to the chip-on-chip film through the conductive paste in the through hole, and then the chip-on-chip film and the light-emitting element are respectively located on both sides of the glass substrate, so that the orthographic projection of the chip-on-chip film and the circuit board on the glass substrate is located on the backlight surface of the glass substrate, effectively reducing the frame width of the display device to achieve a narrow frame design of the display device. A reinforcing member is set on the glass substrate to improve the overall rigidity while achieving a thin and light display device.

[0047] The specific structures and processes of the display substrate, preparation method, backlight module and display device provided in each embodiment of the present application are described below in conjunction with the accompanying drawings.

[0048] First embodiment

[0049] Figure 1 A side view of a display substrate 10 provided in the first embodiment of the present application is shown; Figure 2 A rear view of a display substrate 10 provided in the first embodiment of the present application is shown.

[0050] like Figure 1 and Figure 2 As shown, the first embodiment of the present application provides a display substrate 10, including a glass substrate 11, a plurality of light-emitting elements 12 arranged on the glass substrate 11, a chip-on-film 13 connected to the glass substrate 11, and a circuit board 14 electrically connected to the chip-on-film 13.

[0051] The light-emitting element 12 may be a conventional-sized light-emitting diode (LED), or may be a micro-LED or a submillimeter light-emitting diode (Mini-LED). Micro-LED refers to an LED chip with a grain size of less than 100 microns, and Mini-LED refers to an LED chip with a grain size of about 100 to 300 microns. LED, Mini-LED or Micro-LED can be used as a self-luminous light-emitting element 12 display, and has the advantages of low power consumption, high brightness, high resolution, high color saturation, fast response speed, long life, and high efficiency.

[0052] The material used for LED lamp beads is acrylic material, which has the advantages of higher transparency, chemical stability, mechanical properties, weather resistance, easy color transmission, easy processing, and beautiful appearance. It makes the LED backlight display module have high brightness. When the display module displays images, it improves the clarity of the image and the color rendering of the image.

[0053] The light-emitting element 12 and the chip-on-film 13 are respectively located on both sides of the glass substrate 11. The glass substrate 11 includes a through hole 111 that penetrates the glass substrate 11. A conductive paste 112 is arranged in the through hole 111. One end of the through hole 111 is connected to the light-emitting element 12, and the other end of at least part of the through hole 111 is connected to the chip-on-film 13. The circuit board 14 is located on the side of the glass substrate 11 where the chip-on-film 13 is arranged, and is connected to the glass substrate 11.

[0054] In this embodiment, a through hole 111 is provided inside the glass substrate 11, and a conductive paste 112 is filled in the through hole 111. Only the light-emitting circuit required by the light-emitting element 12 is etched on one side of the glass substrate 11 where the light-emitting element 12 is provided, and the electrode of the light-emitting element 12 is introduced to the other side of the glass substrate 11, that is, introduced to the backlight surface of the glass substrate 11, through the conductive hole, and the display circuit is etched on the backlight surface to avoid the risk of directly exposing the upper surface of the circuit and to avoid the situation where the light-emitting circuit and the display circuit are connected to each other. On the other hand, because the light-emitting circuit and the display circuit are located on both sides of the glass substrate 11, the light-emitting element 12 can be bound using the binding technology of the light-emitting element 12 in the prior art.

[0055] A reinforcing member 15 is disposed on one side of the glass substrate 11 connected to the COF 13 . The reinforcing member 15 does not overlap with the COF 13 or the circuit board 14 .

[0056] In this embodiment, a reinforcing member 15 is provided on the backlight side of the glass substrate 11, and the mechanical strength of the display substrate 10 is improved without affecting the light-emitting performance of the display substrate 10. The present application does not limit the shape of a single reinforcing member 15 and the shape formed by the combination of multiple reinforcing ribs. In addition, in this embodiment, the thickness of the glass substrate 11 can be reduced to further reduce the overall thickness of the display device 30.

[0057] In this embodiment, by setting a through hole 111 in the glass substrate 11 and setting a conductive paste 112 in the through hole 111, the light-emitting element 12 is electrically connected to the COF 13 through the conductive paste 112 in the through hole 111, so that the COF 13 and the light-emitting element 12 are respectively located on both sides of the glass substrate 11, even if the COF 13 is located on the backlight side of the glass substrate 11, and the orthographic projections of the COF 13 and the circuit board 14 on the glass substrate 11 are located on the glass substrate 11. The present application effectively reduces the frame width of the display device 30, so as to realize the narrow frame design of the display device 30, and then realize the thinness of the display device 30. At the same time, a reinforcing member 15 is set on the backlight side of the glass substrate 11 to improve the rigidity of the thin display device 30 and reduce the probability of damage.

[0058] In some embodiments, a driving circuit 17 is disposed on the side wall of the reinforcement 15 , and the driving circuit 17 is electrically connected to the conductive paste 112 in a portion of the through holes 111 .

[0059] Specifically, Figure 3 FIG. 2 shows a side view of another display substrate provided in Embodiment 1 of the present application. Figure 4 FIG. 2 shows a rear view of another display substrate provided in the first embodiment of the present application; Figure 3 and Figure 4 As shown, a portion of the through holes 111 is connected to the COF film 13, and another portion of the through holes 111 is connected to the driving circuit 17. Figure 1 and Figure 2 All the light emitting elements 12 in the display substrate 10 shown are controlled by the COF 13. The light emitting elements 12 in the display substrate 10 in this embodiment can be controlled by the driving circuit 17 and the COF 13 respectively, so as to avoid the situation where the light emitting elements 12 are controlled by only the COF 13 and cause excessive heat. In addition, the driving circuit 17 is arranged on the side wall of the reinforcing member 15, rather than on the side where the reinforcing member 15 is connected to the glass substrate 11 or on the side where the reinforcing member 15 is away from the glass substrate 11, so as to avoid damage to the driving circuit 17 when the reinforcing member 15 is connected to the glass substrate 11, and also to avoid the display substrate 10 from rubbing against the driving circuit 17 when it is placed.

[0060] In some embodiments, a groove 113 is provided on the glass substrate 11, and the reinforcing member 15 is located in the groove 113. Specifically, the depth of the groove is less than the thickness of the reinforcing member 15, which further reduces the overall thickness of the display substrate 10 and increases the rigidity of the display substrate 10. In addition, the groove 113 limits the reinforcing member 15, and the reinforcing member 15 provided with the driving circuit 17 can be quickly connected to the glass substrate 11.

[0061] In this embodiment, by setting a groove 113 on the glass substrate 11 and setting a driving circuit 17 on the side wall of the reinforcing member 15, the process of connecting the driving circuit 17 to the glass substrate 11 and locating the installation position of the reinforcing member 15 on the glass substrate 11 can be saved to achieve efficient automated assembly.

[0062] In some embodiments, the material of the reinforcing member 15 and / or the material of the circuit board 14 is the same as the material of the glass substrate 11 , and the reinforcing member 15 and the glass substrate 11 are fixed by welding.

[0063] Specifically, the glass substrate 11 is cut from a glass panel with a larger area, and the remaining part of the glass panel can be cut into reinforcement 15 and / or circuit board 14 to avoid wasting the glass panel. The reinforcement 15 and the glass substrate 11, the circuit board 14 and the glass substrate 11 are welded by laser welding. The principle of material homogeneity ensures the welding strength and improves the crack resistance and pressure resistance of the glass base. Dielectric-free laser welding uses femtosecond laser welding to focus on the interface of the glass between the reinforcement 15 and the glass substrate 11 and the interface of the glass between the circuit board 14 and the glass substrate 11, and uses laser energy to instantly melt the two layers of glass at the interface to achieve a welding effect.

[0064] On the other hand, compared with the related art, in which the material of the circuit board 14 is epoxy glass cloth laminate, the material of the circuit board 14 in the present application is the same glass as the glass substrate 11, which not only improves the stability of welding, further increases the mechanical strength of the display substrate 10, but also makes full use of the raw materials and avoids waste of raw materials.

[0065] In addition, the reinforcing member 15 and the glass substrate 11 are fixed by welding, and the welding gap between the reinforcing member 15 and the glass substrate 11 is in the range of 50 μm-100 μm.

[0066] In this embodiment, the process parameters are adjusted by focusing mirror, automatic focal length compensation and precision motion control system, and the glass welding weld is only 50μm to 100μm; the welding environment is carried out in a dust-free environment to ensure the quality of the weld. The welding position does not affect the display circuit of the light-emitting element 12 to ensure the normal display of the light bar, and the number of welding welds can be increased according to the length of the glass substrate 11 to ensure the mechanical strength of the glass substrate 11. In order to ensure the display quality of the glass substrate 11, the weld cannot penetrate the glass substrate 11 and damage the circuit of the substrate; in addition, the rigidly welded glass substrate 11 must not have cracks or burrs.

[0067] In some embodiments, a plurality of pads 16 are disposed on the glass substrate 11, and the light emitting element 12 is electrically connected to the pads 16 through an anisotropic conductive adhesive film; the area of ​​the through hole 111 is smaller than the area of ​​the pad 16. The area of ​​the through hole 111 is smaller than the area of ​​the pad 16, so that the pad 16 is stably fixed on the glass substrate 11, and the light emitting element 12 is stably installed.

[0068] In this embodiment, by setting a through hole 111 in the glass substrate 11 and setting a conductive paste 112 in the through hole 111, the light-emitting element 12 is electrically connected to the COF film 13 through the conductive paste 112 in the through hole 111, so that the COF film 13 and the light-emitting element 12 are respectively located on both sides of the glass substrate 11, even if the COF film 13 is located on the backlight side of the glass substrate 11, and the orthographic projections of the COF film 13 and the circuit board 14 on the glass substrate 11 are located on the glass substrate 11. The present application effectively reduces the frame width of the display device 30 so as to realize the thin and light design of the display device 30. And the present application improves the rigidity strength of the thin and light display device 30 by setting a reinforcing member 15. In addition, the reinforcing member 15 in the present application is made of the same material as the glass substrate 11 and / or the circuit board 14, and the stability of the connection between the reinforcing member 15 and the glass substrate 11 is increased by laser welding. A groove 113 is provided on the glass substrate 11, and a driving circuit 17 is provided on the side wall of the reinforcing member 15. On the one hand, the driving circuit 17 and the chip-on-chip film 13 jointly control the operation of the light-emitting element 12, thereby avoiding the light-emitting element 12 generating a large amount of heat only controlled by the chip-on-chip film 13; on the other hand, the groove limits the reinforcing member 15, and also facilitates the installation of the reinforcing member 15.

[0069] Second embodiment

[0070] Figure 5 A schematic flow chart of a method for preparing a display substrate provided in Embodiment 2 of the present application is shown.

[0071] like Figure 5 As shown, Embodiment 2 of the present application provides a method for preparing a display substrate, the method comprising:

[0072] Step S101: providing a glass substrate.

[0073] Step S102: a through hole is provided on the glass substrate, and a conductive paste is provided in the through hole, wherein the through hole passes through the glass substrate.

[0074] Step S103: a plurality of light emitting elements and chip-on-chip films are respectively arranged on both sides of the glass substrate, so that one end of the through hole is connected to the light emitting element, and the other end of at least part of the through hole is connected to the chip-on-chip film.

[0075] Step S104: a circuit board is disposed on the side of the glass substrate where the chip-on-film is disposed, and the circuit board is electrically connected to the chip-on-film and to the glass substrate.

[0076] Step S105: a reinforcing member is disposed on one side of the glass substrate connected to the COF, and the reinforcing member does not overlap with the COF and the circuit board.

[0077] In this embodiment, a glass substrate is provided; a through hole is provided on the glass substrate, and a conductive paste is provided in the through hole, wherein the through hole passes through the glass substrate; a plurality of light-emitting elements and a chip-on-chip film are provided on both sides of the glass substrate, respectively, so that one end of the through hole is connected to the light-emitting element, and the other end of the through hole is connected to the chip-on-chip film; a circuit board is provided on the side of the glass substrate provided with the chip-on-chip film, and the circuit board is electrically connected to the chip-on-chip film and connected to the glass substrate; a reinforcement is provided on the side of the glass substrate connected to the chip-on-chip film, and the reinforcement does not overlap with the chip-on-chip film and the circuit board. The present application effectively reduces the border width of the display device so as to realize a narrow border design of the display device. A reinforcement is provided to enhance the rigidity of the thin and light display device to avoid damage during transportation or use.

[0078] In some embodiments, a driving circuit is disposed on the sidewall of the reinforcement, and the driving circuit is electrically connected to the conductive paste in part of the through holes.

[0079] In some embodiments, a groove is provided on the glass substrate, and the reinforcing member is located in the groove. Specifically, the depth of the groove is less than the thickness of the reinforcing member, which further reduces the overall thickness of the display substrate while increasing the rigidity of the display substrate. In addition, the groove limits the reinforcing member, and the reinforcing member provided with the driving circuit can be quickly connected to the glass substrate.

[0080] Specifically, by providing a groove on the glass substrate and providing a driving circuit on the side wall of the reinforcing member, the process of connecting the driving circuit to the glass substrate and locating the installation position of the reinforcing member on the glass substrate can be saved, thereby achieving efficient automated assembly.

[0081] In some embodiments, a reinforcing member is disposed on one side of the glass substrate connected to the COF, and the material of the reinforcing member and / or the material of the circuit board is the same as that of the glass substrate. In the method for preparing the display substrate, step S104 specifically includes:

[0082] Step S1041: Connecting the circuit board to the glass substrate by laser welding.

[0083] In this embodiment, the glass substrate and the circuit board are welded by laser welding. The material isotropic principle ensures the welding strength and improves the crack resistance and pressure resistance of the glass substrate. The dielectric-free laser welding uses femtosecond laser welding to focus on the interface of the glass between the circuit board and the glass substrate, and uses laser energy to instantly fuse the two layers of glass at the interface to achieve the welding effect.

[0084] It is worth noting that the glass substrate is cut from a glass panel with a larger area, and the remaining part of the glass panel can be cut into a circuit board to avoid wasting the glass panel.

[0085] In some embodiments, the material of the reinforcing member and / or the material of the circuit board is the same as the material of the glass substrate. In the method for preparing the display substrate, step S105 specifically includes:

[0086] Step S1051: connecting the reinforcing member to the glass substrate by laser welding.

[0087] In this embodiment, the reinforcement and the glass substrate are welded by laser welding. The material isotropic principle ensures the welding strength and improves the crack resistance and pressure resistance of the glass substrate. The dielectric-free laser welding focuses on the interface of the glass between the reinforcement and the glass substrate through femtosecond laser welding, and uses laser energy to instantly fuse the two layers of glass at the interface to achieve the welding effect.

[0088] It is worth noting that the glass substrate is cut from a glass panel with a larger area, and the remaining part of the glass panel can be cut into reinforcement parts to avoid wasting the glass panel.

[0089] In this embodiment, by setting a through hole in the glass substrate and setting a conductive paste in the through hole, the light-emitting element is electrically connected to the chip-on-chip film through the conductive paste in the through hole, so that the chip-on-chip film and the light-emitting element are respectively located on both sides of the glass substrate, even if the chip-on-chip film is located on the backlight side of the glass substrate, and the positive projection of the chip-on-chip film and the circuit board on the glass substrate is located on the glass substrate. Compared with the related art, the chip-on-chip film and the light-emitting element are on the same side, and part of the chip-on-chip film and the circuit board are located outside the glass substrate, which makes the frame of the display device too wide. The present application effectively reduces the frame width of the display device so as to realize the thin and light design of the display device. In addition, the present application improves the rigidity of the thin and light display device by setting a reinforcement member to avoid damage during transportation or use. The reinforcement member, the circuit board and the glass substrate are made of the same material. The laser welding method is used to increase the stability of the connection between the reinforcement member and the glass substrate, further improving the rigidity of the display substrate.

[0090] Third embodiment

[0091] Figure 6 A structural schematic diagram of a backlight module 20 provided in the third embodiment of the present application is shown.

[0092] like Figure 6 As shown, the third embodiment of the present application provides a backlight module 20, including: the display substrate 10 as mentioned above.

[0093] Fourth embodiment

[0094] Figure 7 A schematic structural diagram of a display device 30 provided in Embodiment 4 of the present application is shown.

[0095] like Figure 7 As shown, the fourth embodiment of the present application provides a display device 30, including: the display substrate 10 as mentioned above or the backlight module 20 as mentioned above.

[0096] It should be easily understood that “on,” “above,” and “over” in this application should be interpreted in the broadest manner, so that “on” not only means “directly on something,” but also includes the meaning of “on something” with intervening features or layers therebetween, and “above” or “over” not only includes the meaning of “above something” or “over,” but also may include the meaning of “above something” or “over” with no intervening features or layers therebetween (i.e., directly on something).

[0097] The term "substrate substrate" as used herein refers to the material on which subsequent material layers are added. The substrate substrate itself can be patterned. The material added on top of the substrate substrate can be patterned, or can remain unpatterned. In addition, the substrate substrate can include a wide range of materials, such as silicon, germanium, gallium arsenide, indium phosphide, etc. Alternatively, the substrate substrate can be made of a non-conductive material (e.g., glass, plastic, or sapphire wafer, etc.).

[0098] The term "layer" used in the text may refer to a material portion including an area with a certain thickness. A layer may extend over the entire underlying structure or overlying structure, or may have a range smaller than the range of the underlying or overlying structure. In addition, a layer may be an area of ​​a homogeneous or inhomogeneous continuous structure, the thickness of which is less than the thickness of the continuous structure. For example, a layer may be located between the top surface and the bottom surface of the continuous structure or between any paired lateral planes at the top surface and the bottom surface. A layer may extend laterally, vertically and / or along a tapered surface. A substrate substrate may be a layer, may include one or more layers therein, and / or may have one or more layers located thereon, above it and / or below it. A layer may include multiple layers. For example, an interconnect layer may include one or more conductors and a contact layer (forming contacts, interconnects and / or vias therein) and one or more dielectric layers.

[0099] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A display substrate, comprising a glass substrate, a plurality of light-emitting elements disposed on the glass substrate, a chip-on-film connected to the glass substrate, and a circuit board electrically connected to the chip-on-film, characterized in that: The light-emitting element and the chip-on-film are respectively located on both sides of the glass substrate, the glass substrate includes a through hole penetrating the glass substrate, a conductive paste is arranged in the through hole, one end of the through hole is connected to the light-emitting element, and the other end of at least part of the through hole is connected to the chip-on-film, the circuit board is located on the side of the glass substrate where the chip-on-film is arranged, and is connected to the glass substrate; A reinforcing member is disposed on one side of the glass substrate connected to the COF, and the reinforcing member does not overlap with the COF and the circuit board.

2. The display substrate according to claim 1, characterized in that: A driving circuit is disposed on the side wall of the reinforcement, and the driving circuit is electrically connected to the conductive paste in part of the through hole.

3. The display substrate according to claim 1, characterized in that: A groove is arranged on the glass substrate, and the reinforcing member is located in the groove.

4. The display substrate according to claim 1, characterized in that: The material of the reinforcing member and / or the material of the circuit board is the same as that of the glass substrate, and the reinforcing member is fixed to the glass substrate by welding.

5. The display substrate according to claim 1, characterized in that: A plurality of pads are arranged on the glass substrate, and the light-emitting element is electrically connected to the pads via an anisotropic conductive adhesive film; The area of ​​the through hole is smaller than the area of ​​the pad.

6. A method for preparing a display substrate according to any one of claims 1 to 5, characterized in that: include: providing a glass substrate; Arranging a through hole on the glass substrate, and placing a conductive paste in the through hole, wherein the through hole penetrates the glass substrate; A plurality of light-emitting elements and a chip-on-chip film are respectively arranged on both sides of the glass substrate, so that one end of the through hole is connected to the light-emitting element, and the other end of at least part of the through hole is connected to the chip-on-chip film; A circuit board is arranged on one side of the glass substrate where the chip-on-film is arranged, and the circuit board is electrically connected to the chip-on-film and connected to the glass substrate; A reinforcing member is disposed on one side of the glass substrate connected to the COF, and the reinforcing member does not overlap with the COF and the circuit board.

7. The method for preparing a display substrate according to claim 6, characterized in that: The material of the reinforcing member and / or the material of the circuit board is the same as the material of the glass substrate, a circuit board is arranged on one side of the glass substrate where the chip-on-film is arranged, the circuit board is electrically connected to the chip-on-film and connected to the glass substrate, including: The circuit board is connected to the glass substrate by laser welding.

8. The method for preparing a display substrate according to claim 6, characterized in that: The material of the reinforcing member and / or the material of the circuit board is the same as the material of the glass substrate, and a reinforcing member is provided on a side of the glass substrate connected to the chip-on-film, including: The reinforcing member is connected to the glass substrate by laser welding.

9. A backlight module, characterized in that: include: A display substrate as claimed in any one of claims 1 to 5.

10. A display device, characterized in that: include: The display substrate according to any one of claims 1 to 5 or the backlight module according to claim 9.

Images