Module assembly equipment

Abstract

The present application relates to a modular assembly device. Based on the present application, the mounting backplane can be used as a leveling reference for at least two device modules to help avoid misalignment between the assembled device modules, thereby helping to avoid local deformation of the overall physical form of the modular assembly device; the mounting backplane has at least one interface interconnection area, the interface interconnection area includes a pair of interconnected onboard signal interfaces, and at least two device modules can be connected in series in the assembly arrangement order through the conductive contact between the module signal interface of each device module and the onboard signal interface of the mounting backplane. Therefore, there is no need to reserve lateral assembly structures and lateral physical interfaces on the module side walls of the device modules, thereby avoiding the exposed lateral assembly structures and lateral physical interfaces on the outer side walls of the modular assembly device. Furthermore, it helps to improve the device appearance of the modular assembly device.

Description

Technical Field

[0001] The present application relates to electronic equipment, and in particular to a module assembly device. Background Art

[0002] The module assembly device includes at least two assembled device modules, and the at least two assembled device modules are also connected in series through a module signal interface, so that the device function of the module assembly device can be configured as a combination of module functions of the at least two device modules.

[0003] The module side wall of the device module has a lateral assembly structure, and the module signal interface is presented as a lateral physical interface located on the module side wall of the device module. Thus, every two adjacent device modules can be electrically connected by physically connecting the lateral assembly structures of the module side walls and by docking the lateral physical interfaces, and then, based on the physical and electrical connections between the at least two device modules, the assembly and series connection of at least two device modules can be achieved.

[0004] However, if the local stress generated by the physical connection between any two adjacent equipment modules causes misalignment between the two equipment modules, the overall physical form of the module assembly equipment will be locally deformed.

[0005] Moreover, since the number of equipment modules included in the module assembly equipment and the arrangement position of each equipment module in the module assembly equipment can be adjusted arbitrarily according to needs, most equipment modules will reserve lateral assembly structures and lateral physical interfaces on the module side walls on the upstream side and the downstream side of the series connection. Therefore, for the equipment module at the end of the series connection, one side of the module side wall serves as the outer side wall of the module assembly equipment, and the lateral assembly structure and lateral physical interface reserved on the side module side wall are in an exposed state.

[0006] Whether it is the local deformation of the overall physical form of the modular assembly equipment or the lateral assembly structure and lateral physical interface exposed on the outer side wall of the modular assembly equipment, the overall appearance of the modular assembly equipment will be damaged. Therefore, how to improve the appearance of the modular assembly equipment has become a technical problem to be solved in the prior art. Summary of the invention

[0007] The embodiments of the present application provide a modular assembly device, which helps to improve the appearance of the device.

[0008] In one embodiment of the present application, a module assembly device includes a mounting backplane and at least two device modules, wherein:

[0009] At least two of the equipment modules are independently and respectively physically matched with the mounting backplane;

[0010] Each of the device modules has a module signal interface, the module signal interface of each of the device modules faces the mounting backplane, the mounting backplane has at least one interface interconnection area, one of the interface interconnection areas is used to electrically connect two adjacent device modules, the interface interconnection area includes a pair of interconnected onboard signal interfaces, and at least two of the device modules are connected in series in an assembly arrangement order based on the conductive contact between the module signal interface and the onboard signal interface;

[0011] Among them, at least two device modules include a host module and at least one expansion module, and the host module realizes signal transmission with each of the expansion modules based on series connection according to the assembly arrangement sequence.

[0012] In some examples, optionally, the host module further penetrates the mounting backplane, and the physical cooperation between the host module and the mounting backplane includes: the host module is physically engaged with the mounting backplane by penetrating the mounting backplane.

[0013] In some examples, optionally, the host module is further in physical contact with the mounting backplane, and the physical coordination between the host module and the mounting backplane includes: the host module forms a physical limit on the mounting backplane based on the physical contact with the mounting backplane.

[0014] In some examples, optionally, the mounting backplate is used for wall-mounting on a target wall, and: the host module penetrates the mounting backplate to be electrically connected to the wall wiring within the target wall; and / or the host module forms a physical limit on the mounting backplate based on physical contact with the mounting backplate, thereby pressing the mounting backplate against the target wall.

[0015] In some examples, optionally, the host module has a protrusion facing the mounting backplate, the protrusion penetrates the mounting backplate, and the physical engagement is formed between the protrusion and the mounting backplate.

[0016] In some examples, optionally, the host module has a rear end wall facing the mounting backplane, the rear end wall is in physical contact with the mounting backplane, and the rear end wall forms the physical limit for the mounting backplane based on the physical contact with the mounting backplane.

[0017] In some examples, optionally, the raised portion is raised relative to the rear end wall, and the rear end wall surrounds the periphery of the raised portion.

[0018] In some examples, optionally, the mounting backplate is configured to be wall-mounted on a target wall, and the raised portion is electrically connected to an in-wall wiring in the target wall.

[0019] In some examples, optionally, the mounting back plate has a hollow window, the raised portion penetrates the mounting back plate through the hollow window, and the raised portion is embedded in the hollow window.

[0020] In some examples, optionally, the mounting backplate is used for wall-mounting on a target wall, and a wall mounting box is embedded in the target wall, wherein: when the host module is fixedly connected to the wall mounting box by a connector, the rear end wall forms the physical limit on the mounting backplate by a locking force generated by the connector, and the physical limit is used to press the mounting backplate against the target wall; and / or, the wall mounting box is electrically connected to the wall wiring in the target wall, the host module also has a wiring socket located on the raised portion, and when the host module is fixedly connected to the wall mounting box by a connector, the wiring socket is electrically connected to the wall mounting box, so that the host module is electrically connected to the wall wiring through the wall mounting box.

[0021] In some examples, optionally, the host module includes a module body and a module back seat, wherein: the connecting piece is passed through the module back seat, and the connecting piece fixedly connects the module back seat to the mounting box in the wall; the module body is snap-fitted and assembled to the module back seat, and the module body covers the connecting piece; the raised portion and the rear end wall are located on the module back seat.

[0022] In some examples, optionally, the surface edge of the module body facing the mounting backplane has an edge ridge, and the edge ridge is snap-fitted with the rear end wall at the periphery of the rear end wall.

[0023] In some examples, optionally, the module back seat also has a transfer interface facing the module body, the transfer interface is electrically connected to the wiring socket, the module body also has an external interface facing the module back seat, and when the module body is snap-fitted and assembled on the module back seat, the external interface is plugged into and matched with the transfer interface to be electrically connected to the wiring socket through the transfer interface.

[0024] In some examples, optionally, a contour edge of an assembly formed by arranging and assembling at least two of the device modules is flush with an outer edge of the mounting backplane.

[0025] In some examples, optionally, at least two of the device modules are assembled based on physical cooperation with the mounting backplane.

[0026] In some examples, optionally, a pair of the module signal interfaces at the contact-jointed side of every two adjacent device modules are respectively in conductive contact with a pair of the onboard signal interfaces in the same interface interconnection region.

[0027] In some examples, optionally, at least one of at least two of the device modules has the module signal interface on both sides in the direction of the assembly arrangement.

[0028] In some examples, optionally, the host module is used to provide a host function of the module assembly device, and the expansion module is used to provide the module assembly device with an expansion function that cooperates with the host function.

[0029] In some examples, optionally, the module signal interface and the onboard signal interface each include a plurality of signal terminals.

[0030] In some examples, optionally, the signal terminals of the onboard signal interface include flat surface mount contacts attached to the backplane surface of the mounting backplane, and the multiple signal terminals of the module signal interface include metal springs or metal spring pins installed on the module surface of the device module facing the mounting backplane.

[0031] In some examples, optionally, the signal terminals of the onboard signal interface include metal springs or metal spring pins mounted on the backplane surface of the mounting backplane, and the multiple signal terminals of the module signal interface include copper-plated sockets deployed on the module surface of the device module facing the mounting backplane.

[0032] In some examples, optionally, the installation backplane includes at least two module assembly areas arranged in sequence, an interface interconnection area is deployed at the assembly area junction of every two adjacent module assembly areas, the interface interconnection area includes a pair of interconnected onboard signal interfaces, and a pair of onboard signal interfaces in the interface interconnection area at the assembly area junction of any two adjacent module assembly areas are respectively located on both sides of the junction of the assembly areas; each of the device modules is physically matched with the installation backplane in the corresponding module assembly area, each of the device modules covers and shields the corresponding module assembly area, and the module side walls of every two adjacent device modules are in contact and spliced ​​at the assembly area junction of the corresponding two adjacent module assembly areas. Furthermore, the module signal interfaces on the contact and splicing sides of every two adjacent device modules are respectively in conductive contact with the corresponding onboard signal interfaces in the same interface interconnection area at the junction of the assembly areas on both sides of the junction of the assembly areas of the corresponding two adjacent module assembly areas; wherein at least two of the module assembly areas include a host module assembly area and at least one expansion module assembly area; the host module is physically matched with the installation backplane in the host module assembly area, and the host module covers and shields the host module assembly area; at least one expansion module is physically matched with the installation backplane in the corresponding expansion module assembly area, and at least one expansion module covers and shields the corresponding expansion module assembly area.

[0033] In some examples, optionally, the host module further penetrates the mounting backplane, and the physical cooperation between the host module in the host module assembly area and the mounting backplane includes: the host module forms a physical fit with the mounting backplane by penetrating the mounting backplane.

[0034] In some examples, optionally, the host module is further in physical contact with the mounting backplane, and the physical coordination between the host module and the mounting backplane includes: the host module forms a physical limit on the mounting backplane based on the physical contact with the mounting backplane.

[0035] In some examples, optionally, the mounting backplate is used for wall-mounting on a target wall, the host module presses the host module assembly area of ​​the mounting backplate against the target wall, the expansion module assembly area is provided with a wall-mounting hole, and the wall-mounting screws passed through the wall-mounting hole press the expansion module assembly area of ​​the mounting backplate against the target wall.

[0036] In some examples, optionally, the physical cooperation between the expansion module and the mounting backplane includes: a snap-fit ​​cooperation between the expansion module and the mounting backplane in the expansion module assembly area.

[0037] Based on the embodiments of the present application, the mounting backplane can be used as a leveling reference for at least two device modules to help avoid misalignment between sequentially assembled device modules, thereby helping to avoid local deformation of the overall physical form of the module assembly device; the mounting backplane has at least one interface interconnection area, the interface interconnection area includes a pair of interconnected onboard signal interfaces, and at least two device modules can be connected in series in the assembly arrangement order through the conductive contact between the module signal interface of each device module and the onboard signal interface of the mounting backplane. Therefore, it is not necessary to reserve lateral assembly structures and lateral physical interfaces on the module side walls of the device modules, thereby avoiding the exposed lateral assembly structures and lateral physical interfaces on the outer side walls of the module assembly device. Furthermore, by avoiding local deformation of the overall physical form of the module assembly device and avoiding the exposed lateral assembly structures and lateral physical interfaces on the outer side walls of the module assembly device, it helps to improve the device appearance of the module assembly device. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] The following drawings are only used to illustrate and explain the present application, and do not limit the scope of the present application:

[0039] Figure 1 It is a schematic diagram of the exploded state of the first example structure of the module assembly equipment in the embodiment of the present application;

[0040] Figure 2 It is a schematic diagram of the assembly state of the first example structure of the module assembly equipment in the embodiment of the present application;

[0041] Figure 3 A schematic diagram of a second example structure of a module assembly device in an embodiment of the present application;

[0042] Figure 4 It is a schematic diagram of the installation backplane in the first example structure of the module assembly equipment in the embodiment of the present application;

[0043] Figure 5 It is a schematic diagram of the installation backplane in the second example structure of the module assembly equipment in the embodiment of the present application;

[0044] Figure 6 A schematic diagram of a series relationship provided for a first example structure of a module assembly device in an embodiment of the present application;

[0045] Figure 7 A schematic diagram of a series relationship provided for a second example structure of a module assembly device in an embodiment of the present application;

[0046] Figure 8 A schematic diagram of a first terminal combination example in a first example structure of a module assembly device in an embodiment of the present application;

[0047] Fig. 9 It is a schematic diagram of an example of a second terminal combination in a first example structure of a module assembly device in an embodiment of the present application;

[0048] Fig.10 It is a schematic diagram of an example of a third terminal combination in the first example structure of the module assembly device in the embodiment of the present application;

[0049] Fig.11 It is a schematic diagram of an example of a fourth terminal combination in the first example structure of the module assembly device in the embodiment of the present application;

[0050] Fig.12 It is a schematic diagram of the wall-mounting principle of the host module in the first example structure of the module assembly equipment in the embodiment of the present application;

[0051] Fig.13 It is a schematic diagram of the assembly relationship between the host module and the wall installation box in the first example structure of the module assembly device in the embodiment of the present application;

[0052] Fig.14 It is a schematic diagram of the assembly principle of the expansion module in the first example structure of the module assembly equipment in the embodiment of the present application.

[0053] Reference numerals

[0054] 10 Install the back panel

[0055] 11 Back panel buckle

[0056] 15 Wall mounting holes

[0057] 16 Hollow Window

[0058] 20 Equipment Modules

[0059] 21 First expansion module

[0060] 215 Module card hole

[0061] 22 Second expansion module

[0062] 26 Host Module

[0063] 261 Module body

[0064] 261a Main body buckle

[0065] 261b Edge ridge

[0066] 262 module rear seat

[0067] 262a Rear seat slot

[0068] 262b Rear end wall

[0069] 262c ridge

[0070] 262d Avoid the gap

[0071] 263 External Interface

[0072] 264 adapter

[0073] 265 Wiring Socket

[0074] 266 Connectors

[0075] 30 Wall Mounting Box

[0076] 50 Onboard signal interface

[0077] 60 Module signal interface DETAILED DESCRIPTION

[0078] In order to make the objectives, technical solutions and advantages of the present application more clearly understood, the present application is further described in detail below with reference to the accompanying drawings and examples.

[0079] Figure 1 This is a schematic diagram of the exploded state of the first example structure of the module assembly equipment in the embodiment of the present application. Figure 2 This is a schematic diagram of the assembly status of the first example structure of the module assembly equipment in the embodiment of the present application. Figure 3 Schematic diagram of the second example structure of the module assembly device in the embodiment of the present application. Figures 1 to 3 In an embodiment of the present application, the module assembly device may include a mounting backplane 10 and at least two device modules 20 .

[0080] In such Figure 1 and Figure 2 In the first example structure shown, only at least two device modules 20 including a host module 26 and an expansion module (i.e., the first expansion module 21) are used as an example for illustration, so as to reflect the differentiation of the device modules 20 on the basis of showing the minimum module combination of the module assembly equipment, without intending to impose unnecessary restrictions on the module quantity and module type of the at least two device modules 20.

[0081] exist Figure 3 In the second example structure shown, a capacity expansion combination of three modules of the equipment module 20 is shown, and as shown in FIG. Figure 3 The second example structure shown is intended to indicate that the number of modules of at least two equipment modules 20 can be Figure 1 and Figure 2 The capacity of the first example structure is increased to more than two, and the number of modules can be increased without setting an upper limit according to actual needs.

[0082] For example, in an embodiment of the present application, at least two device modules 20 may include a host module 26 and at least one expansion module (e.g., Figure 1 and Figure 2 The first expansion module 21 in the first example structure shown, or Figure 3 The first expansion module 21 and the second expansion module 22 in the second example structure are shown, wherein the host module 26 is used to provide the host function of the module assembly device, and the expansion module is used to provide the module assembly device with an expansion function of assisting the host function.

[0083] For example, the host module 26 may have a touch screen, and the touch screen of the host module 26 may be used to realize touch, display, light on / off control (such as fully open, fully closed, etc.), curtain retraction control, air conditioning switch control, voice intercom, voice recognition, temperature measurement and other host functions; at least one expansion module provides an auxiliary host function for the module assembly device, and the expansion function may be a switch auxiliary function. At least one expansion module may have a physical switch structure such as a push button switch (such as the first expansion module 21) and a knob switch (such as the second expansion module 22). The physical switch structure is used to realize light on / off control (such as fully open, fully closed, or the opening and closing of a specific light, etc.), curtain retraction control, air conditioning switch control and other switch auxiliary functions. In addition, the switch auxiliary functions that can be provided by the physical switch structures of different expansion modules can be respectively targeted at different control objects.

[0084] For another example, at least one expansion module provides an expansion function for the modular assembly device to assist the host function, and the expansion function can also be an additional function in addition to the host function of the host module 26, and the additional function is used to cooperate with the host function to enrich the overall function of the modular assembly device. For example, the user can only control the lights of the whole house using the host, but can control the curtains using the expansion module.

[0085] In addition, it should be noted that the above-mentioned extended functions can be functions that are different from the functions of the host, or functions that are the same as the functions of the host, for example, the on / off control function of lamp A - the user can control the on / off of lamp A through the touch screen on the host, or use an extended module (such as a key switch) to achieve on / off control of lamp A. Alternatively, it can also be set that the extended functions that can be achieved by the extended module are not repeated with the host functions that can be achieved by the host, for example, it can be set that the individual on / off control of lamp A can only be achieved through the extended module (such as a key switch), and the individual on / off control of lamp A cannot be achieved through the touch screen on the host (only for lamp A), but the full on / off function of all lights in the house can be achieved through the touch screen on the host.

[0086] For example, in an embodiment of the present application, in the case where at least two device modules 20 include a host module 26 and at least one expansion module, the at least one expansion module may be connected in series on the downstream side of the host module 26 .

[0087] In the embodiment of the present application, at least two device modules 20 (eg Figure 1 and Figure 2 The host module 26 and the first expansion module 21 in the first example structure shown, or Figure 3 The host module 26, the first expansion module 21, and the second expansion module 22 in the second example structure shown are physically matched with the installation backplane 10 independently, that is, each device module 20 (such as the host module 26 or the first expansion module 21 or the second expansion module 22) is physically matched with the installation backplane 10, and the physical matching of any two device modules 20 (such as the host module 26 and the first expansion module 21 adjacent to each other, and the first expansion module 21 and the second expansion module 22 adjacent to each other) with the installation backplane 10 is independent of each other. Thus, at least two device modules 20 (such as the host module 26 and the first expansion module 21) can be assembled based on the physical matching with the installation backplane 10.

[0088] For example, in Figure 1 and Figure 2 In the first example structure shown, the host module 26 and the first expansion module 21 can be assembled adjacent to each other based on physical cooperation with the mounting backplane 10 .

[0089] For example, in Figure 3 In the second example structure shown, according to the order in which the host module 26, the first expansion module 21 and the second expansion module 22 are arranged in sequence, the host module 26, the first expansion module 21 and the second expansion module 22 can be assembled adjacent to each other based on the physical cooperation with the mounting backplane 10. That is, the first expansion module 21 can be assembled between the host module 26 and the second expansion module 22.

[0090] Exemplarily, in an embodiment of the present application, each device module 20 (such as a host module 26 or a first expansion module 21 or a second expansion module 22) can be physically matched with the installation backplane 10 in a posture of facing the installation backplane 10, that is, the module rear end of each device module 20 (such as a host module 26 or a first expansion module 21) is used to physically match with the installation backplane 10. Among them, the front face of each device module 20 (such as a host module 26 or a first expansion module 21) refers to the module end face used for human-computer interaction. For example, the host module 26 may include a touch screen, and the front face of the host module 26 may refer to the module end face where the light emitting surface of the display panel is located. For another example, the first expansion module 21 may include a switch panel with a key switch, and the front face of the first expansion module 21 may refer to the module end face where the switch panel is located. For another example, the second expansion module 22 may include a switch panel with a knob switch, and the front face of the second expansion module 22 may refer to the module end face where the switch panel is located.

[0091] Exemplarily, in an embodiment of the present application, the mounting backplane 10 may include at least two module assembly areas As_1 to As_M, wherein M represents the maximum number of device modules 20 that can be installed, that is, the area number M of the module assembly areas As_1 to As_M represents the maximum number of device modules 20 that can be installed in the module assembly device. In this case, each device module 20 (e.g., the host module 26 or the first expansion module 21) is physically matched with the mounting backplane 10 in the corresponding module assembly area As_i or As_j, and each device module 20 (e.g., the host module 26 or the first expansion module 21) covers and blocks the corresponding module assembly area As_i or As_j, and the module side walls of each two adjacent device modules 20 (e.g., the host module 26 and the first expansion module 21) can be contacted and spliced ​​at the junction of the assembly areas of the corresponding two adjacent module assembly areas As_i and As_j, wherein i and j are different from each other, and i and j are both positive integers greater than or equal to 1 and less than or equal to K.

[0092] Exemplarily, in an embodiment of the present application, if at least two device modules 20 include a host module 26 and at least one expansion module, and at least one expansion module is connected in series on the downstream side of the host module 26, then at least two module assembly areas As_1~As_M may include a host module assembly area As_1 and at least one expansion module assembly area As_k, wherein k is a positive integer greater than 1 and less than or equal to M, and the host module assembly area As_1 is located at one end of the mounting backplane 10, and at least one expansion module assembly area As_k is arranged from the host module assembly area As_1 to the other end of the mounting backplane 10.

[0093] For example, in Figure 1 and Figure 2 In the first example structure shown, at least two device modules 20 include a host module 26 and an expansion module (i.e., a first expansion module 21), M can be 2, and the host module assembly area As_1 and an expansion module assembly area As_2 are respectively located at opposite ends of the installation backplane 10. In this case, the host module 26 can physically cooperate with the installation backplane 10 in the host module assembly area As_1, the host module 26 can cover and shield the host module assembly area As_1, the expansion module (i.e., the first expansion module 21) can cooperate with the installation backplane 10 in the corresponding expansion module assembly area physical As_2, and the expansion module (i.e., the first expansion module 21) can cover and shield the corresponding expansion module assembly area physical As_2.

[0094] For another example, in the embodiment of the present application, Figure 3 In the second example structure shown, the number M of the at least two module assembly areas As_1 to As_M can be 3, and the host module assembly area As_1 and the expansion module assembly area As_3 are respectively located at opposite ends of the installation backplane 10, and another expansion module assembly area As_2 is located between the host module assembly area As_1 and the expansion module assembly area As_3. In this case, the host module 26 can physically cooperate with the installation backplane 10 in the host module assembly area As_1, the host module 26 can cover and block the host module assembly area As_1, and the two expansion modules (i.e., the first expansion module 21 and the second expansion module 22) can cooperate with the installation backplane 10 in the corresponding expansion module assembly areas As_2 and As_3, and the two expansion modules (i.e., the first expansion module 21 and the second expansion module 22) can respectively cover and block the corresponding expansion module assembly areas As_2 and As_3.

[0095] For example, in the embodiment of the present application, at least two device modules 20 (eg Figure 1 and Figure 2 The host module 26 and the first expansion module 21 in the first example structure shown, or Figure 3 The host module 26, the first expansion module 21 and the second expansion module 22 in the second example structure are flush or substantially flush with the front face of the mounting backplane 10, so that at least two device modules 20 (for example Figure 1 and Figure 2 The host module 26 and the first expansion module 21 in the first example structure shown, or Figure 3 The front face of the host module 26, the first expansion module 21 and the second expansion module 22 in the second example structure shown can have an overall integrated appearance; and / or, at least two device modules 20 (for example Figure 1 and Figure 2 The host module 26 and the first expansion module 21 in the first example structure shown, or Figure 3 The outline edge of the assembled whole formed by assembling and arranging the host module 26, the first expansion module 21 and the second expansion module 22 in the second example structure shown in the figure can be flush with the outer edge of the mounting backplane 10, so that the mounting backplane 10 is configured as a hidden structure, that is, Figure 2 As shown, when viewing the module assembly device from the front facing side, the mounting back plate 10 may not be visible.

[0096] In the embodiment of the present application, the module signal interface 60 of each device module 20 (such as the host module 26 or the first expansion module 21 or the second expansion module 22) faces the mounting backplane 10, that is, the module signal interface 60 of each device module 20 (such as the host module 26 or the first expansion module 21 or the second expansion module 22) is arranged at the rear end of the module, and the mounting backplane 10 has an interconnected onboard signal interface 50. Thus, at least two device modules 20 (such as Figure 1 and Figure 2 The host module 26 and the first expansion module 21 in the first example structure shown, or Figure 3 The host module 26, the first expansion module 21, and the second expansion module 22 in the second example structure are connected in series according to the assembly arrangement sequence of at least two device modules 20 based on the conductive contact between the respective module signal interfaces 60 and the onboard signal interface 50. The assembly arrangement sequence of at least two device modules 20 can also be regarded as the at least two device modules 20 being electrically cascaded according to the assembly arrangement sequence.

[0097] Figure 4 This is a schematic diagram of the installation backplane in the first example structure of the module assembly equipment in the embodiment of the present application. Figure 5 Schematic diagram of the installation backplane in the second example structure of the module assembly device in the embodiment of the present application. Figure 4 and Figure 5 For example, in an embodiment of the present application, the mounting backplane 10 may have at least one interface interconnection area Ac, one interface interconnection area Ac is used to electrically connect two adjacent device modules 20, and the interface interconnection area Ac may include a pair of interconnected on-board signal interfaces 50.

[0098] In an embodiment of the present application, the module signal interface 60 of every two adjacent device modules 20 (for example, the host module 26 and the first expansion module 21) is respectively in conductive contact with a pair of onboard signal interfaces 50 in the same interface interconnection area Ac, that is, the pair of module signal interfaces 60 of every two adjacent device modules 20 (for example, the host module 26 and the first expansion module 21) on the contact splicing side are respectively in conductive contact with a pair of onboard signal interfaces 50 in the same interface interconnection area Ac.

[0099] In an embodiment of the present application, for the case where the installation backplane 10 includes at least two module assembly areas As_1~As_M, an interface interconnection area Ac can be deployed at the junction of the assembly areas of every two adjacent module assembly areas As_i and As_j, and a pair of on-board signal interfaces 50 in the interface interconnection area Ac at the junction of the assembly areas of any two adjacent module assembly areas As_i and As_j are respectively located on both sides of the junction of the assembly areas.

[0100] For example, in Figure 1 and Figure 2 In the first example structure shown, the mounting backplane 10 may have an interface interconnection area Ac for serially connecting the host module 26 and the first expansion module 21. The interface interconnection area Ac is located at the junction of the host module assembly area As_1 and the expansion module assembly area As_2.

[0101] For example, in Figure 3 In the second example structure shown, the mounting backplane 10 may have two interface interconnection areas Ac, one of which is located at the junction of the host module assembly area As_1 and the expansion module assembly area As_2, and is used to connect the host module 26 and the first expansion module 21 in series, and the other interface interconnection area Ac is located at the junction of the expansion module assembly areas As_2 and As_3, and is used to connect the first expansion module 21 and the second expansion module 22 in series. That is, for the module assembly area (i.e., the expansion module assembly area) As_2, the interface interconnection areas Ac are arranged at the junctions of both sides with the adjacent areas. In this case, the first expansion module 21 can be assembled between the host module 26 and the second expansion module 22, and the first expansion module 21 has module signal interfaces 60 on both sides in the direction of assembly and arrangement of at least two device modules 20.

[0102] It is understandable that, in order to support the arrangement position adjustment between the expansion modules, the second expansion module 22 may also have module signal interfaces 60 on both sides in the direction of the assembly and arrangement of at least two device modules 20; and / or, in order to support the bidirectional series connection in two opposite assembly and arrangement directions with the host module 26 as the upstream node, the host module 26 may also have module signal interfaces 60 on both sides in the direction of the assembly and arrangement of at least two device modules 20. That is, any one or at least one of the at least two device modules 20 may have module signal interfaces 60 on both sides in the direction of the assembly and arrangement of at least two device modules 20.

[0103] Thus, the module signal interface 60 of each device module 20 (for example, the host module 26 or the first expansion module 21 or the second expansion module 22) is in conductive contact with the corresponding on-board signal interface 50 on the inner side of the module side wall with a posture facing the mounting backplane 10, that is, the module signal interface 60 of each two adjacent device modules 20 on the contact splicing side can be in conductive contact with the corresponding on-board signal interface 50 in the same interface interconnection area Ac at the junction of the assembly areas on both sides of the junction of the assembly areas of the corresponding two adjacent module assembly areas.

[0104] In the embodiment of the present application, at least two device modules 20 can be connected in series in an assembly arrangement order based on the conductive contact between the respective module signal interfaces 60 and the onboard signal interface 50, and at least two device modules 20 include a host module 26 and at least one expansion module (e.g. Figure 1 and Figure 2 The first expansion module 21 in the first example structure shown, or Figure 3 In the case of the first expansion module 21 and the second expansion module 22 in the second example structure shown, the host module 26 realizes signal transmission with each expansion module (for example, the first expansion module 21 or the second expansion module 22) based on the series connection according to the assembly arrangement order.

[0105] Figure 6 This is a schematic diagram of the series relationship provided for the first example structure of the module assembly device in the embodiment of the present application. Figure 6In the first example structure of the embodiment of the present application, the module signal interface 60 of the host module 26 and the first expansion module 21 can be located in the interface interconnection area Ac at the junction of the host module assembly area As_1 and the expansion module assembly area As_2, and the module signal interface 60 of the host module 26 and the first expansion module 21 can be respectively in conductive contact with a pair of onboard signal interfaces 50 in the interface interconnection area Ac. Thus, based on the conductive contact between the module signal interface 60 of the host module 26 and the first expansion module 21 and the pair of onboard signal interfaces 50, and the interconnection between the pair of onboard signal interfaces 50, the host module 26 and the first expansion module 21 can be connected in series according to the assembly arrangement order, for signal transmission between the host module 26 and the first expansion module 21 connected in series.

[0106] from Figure 6 It can be seen that the series connection node between the host module 26 and the first expansion module 21 represented by the virtual rectangular box is a pair of on-board signal interfaces 50 in the interface interconnection area Ac, and the signal transmission between the host module 26 and the first expansion module 21 can be independent of the on-board wiring of the installation backplane 10 outside the interface interconnection area Ac.

[0107] Figure 7 A schematic diagram of the series relationship provided for the second example structure of the module assembly device in the embodiment of the present application. Figure 7 , in the second example structure of the embodiment of the present application:

[0108] The module signal interface 60 of the host module 26 and the first expansion module 21 may be located in an interface interconnection area Ac at the junction of the host module assembly area As_1 and the expansion module assembly area As_2, and the module signal interface 60 of the host module 26 and the first expansion module 21 may be in conductive contact with a pair of onboard signal interfaces 50 in the interface interconnection area Ac, respectively;

[0109] The module signal interface 60 of the first expansion module 21 and the second expansion module 22 can be located in the interface interconnection area Ac at the junction of the expansion module assembly areas As_2 and As_3, and the module signal interface 60 of the first expansion module 21 and the second expansion module 22 can respectively be in conductive contact with a pair of on-board signal interfaces 50 in the interface interconnection area Ac.

[0110] Thus, based on the conductive contact between the module signal interface 60 of the host module 26 and the first expansion module 21 and a pair of onboard signal interfaces 50 in one interface interconnection area Ac, the conductive contact between the module signal interface 60 of the first expansion module 21 and the second expansion module 22 and a pair of onboard signal interfaces 50 in another interface interconnection area Ac, and the interconnection between the pair of onboard signal interfaces 50 in each interface interconnection area Ac, the host module 26, the first expansion module 21 and the second expansion module 22 can be connected in series according to the assembly arrangement order of the three, for signal transmission between the host module 26 and each of the first expansion module 21 and the second expansion module 22 connected in series. That is, the signal transmission between the host module 26 and the first expansion module 21 connected in series can be a direct signal transmission between the host module 26 and the first expansion module 21, and the signal transmission between the host module 26 and the second expansion module 22 connected in series can be a relay transmission with the first expansion module 21 as a relay node.

[0111] from Figure 7 It can be seen that the host module 26, the first expansion module 21 and the third expansion module 22 represented by the virtual rectangular frame can be connected in series with a pair of onboard signal interfaces 50 in the two interface interconnection areas Ac as connection nodes, and the signal transmission between the host module 26 and each of the first expansion module 21 and the second expansion module 22 can be independent of the on-board wiring of the installation backplane 10 outside the interface interconnection area Ac.

[0112] Exemplarily, in an embodiment of the present application, the multiple signal terminals of the module signal interface 60 and the onboard signal interface 50 may include: a power signal terminal, an uplink transmission signal terminal, a downlink transmission signal terminal, a ground signal terminal, and a module identification signal terminal. Among them, the uplink transmission signal terminal is used to transmit signals in the uplink direction (for example, transmission with the host module 26 as the destination), the downlink transmission signal terminal is used to transmit signals in the downlink direction (for example, transmission with the host module 26 as the signal source), and the module identification signal terminal is used for identity recognition between at least two modules 20 (for example, the host module 26 identifies each expansion module connected in series).

[0113] Exemplarily, in an embodiment of the present application, the module signal interface 60 and the onboard signal interface 50 may each include multiple signal terminals, and the interconnection between a pair of onboard signal interfaces 50 in each interface interconnection area Ac adopts a method of interconnecting signal terminals with the same signal definition in pairs.

[0114] For example, in an embodiment of the present application, the multiple signal terminals of the onboard signal interface 50 or the module signal interface 60 may include circuit board contacts of an FPC (Flexible Printed Circuit) attached to the mounting backplane 10 or the device module 20 (e.g., the host module 26 and the first expansion module 21); or, the multiple signal terminals of the onboard signal interface 50 or the module signal interface 60 may include rigid metal contacts or elastic metal contacts integrated in the mounting backplane 10 or the device module 20 (e.g., the host module 26 and the first expansion module 21). For example, the rigid metal contact may include exposed copper formed by a chemical plating process, and the exposed copper may be attached to a flat surface or a slot wall. For another example, the elastic metal contact may include any one of a metal spring pin (POGO PIN) and a metal spring sheet.

[0115] Figure 8 Schematic diagram of a first terminal combination example in a first example structure of a module assembly device in an embodiment of the present application. For example, in an embodiment of the present application, the physical form of multiple signal terminals of the onboard signal interface 50 and the module signal interface 60 can be Figure 8 The first terminal combination shown, i.e., the multiple signal terminals of the onboard signal interface 50 may include flat surface mount contacts 71 (e.g., surface mount exposed copper) attached to the backplane surface of the mounting backplane 10, and the multiple signal terminals of the module signal interface 60 may include metal springs 72 installed on the module surface of the device module 20 facing the mounting backplane 10.

[0116] Fig. 9 Schematic diagram of a second terminal combination example in the first example structure of the module assembly device in the embodiment of the present application. For example, in the embodiment of the present application, the physical form of the multiple signal terminals of the onboard signal interface 50 and the module signal interface 60 can be Fig. 9 The second terminal combination shown, i.e., the multiple signal terminals of the on-board signal interface 50 may include flat surface mount contacts 71 (e.g., surface mount exposed copper) attached to the backplane surface of the mounting backplane 10, and the multiple signal terminals of the module signal interface 60 may include metal spring pins 73 installed on the module surface of the device module 20 facing the mounting backplane 10.

[0117] Fig.10 Schematic diagram of the third terminal combination example in the first example structure of the module assembly device in the embodiment of the present application. For example, in the embodiment of the present application, the physical form of the multiple signal terminals of the onboard signal interface 50 and the module signal interface 60 can be Fig.10The third terminal combination shown, i.e., the multiple signal terminals of the onboard signal interface 50 may include a metal spring 72 installed on the backplane surface of the mounting backplane 10, and the multiple signal terminals of the module signal interface 60 may include a copper-plated socket 75 deployed on the module surface of the device module 20 facing the mounting backplane 10.

[0118] Fig.11 Schematic diagram of the fourth terminal combination example in the first example structure of the module assembly device in the embodiment of the present application. For example, in the embodiment of the present application, the physical form of the multiple signal terminals of the onboard signal interface 50 and the module signal interface 60 can be Fig.11 The fourth terminal combination shown, i.e., the multiple signal terminals of the onboard signal interface 50 can adopt metal spring pins 73, and the multiple signal terminals of the module signal interface 60 can include copper-plated sockets 75 deployed on the module surface of the device module 20 facing the mounting backplane 10.

[0119] The above examples are only used to facilitate understanding of the characteristics of the onboard signal interface 50 , and are not used to limit the specific physical form of the onboard signal interface 50 .

[0120] Based on the embodiments of the present application, the mounting backplane 10 can be used as a leveling reference for at least two device modules 20 (e.g., a host module 26 and a first expansion module 21) to facilitate misalignment between the assembled and arranged device modules 20 (e.g., a host module 26 and a first expansion module 21), thereby helping to avoid local deformation of the overall physical form of the module assembly device; and the assembly of at least two device modules 20 (e.g., a host module 26 and a first expansion module 21) depends on the alignment of each device module 20 (e.g., a host module 26 or a first expansion module 21) with the mounting backplane 10. The physical coordination of the mounting backplane 10, the module signal interface of each device module 200 (such as the host module 26 or the first expansion module 21) of at least two device modules 20 (such as the host module 26 and the first expansion module 21) can be in conductive contact with the onboard signal interface 50 of the mounting backplane 10, so it is not necessary to reserve a lateral assembly structure and a lateral physical interface on the module side wall of the device module 20 (such as the host module 26 and the first expansion module 21), thereby avoiding the exposed lateral assembly structure and lateral physical interface on the outer side wall of the module assembly device. Furthermore, by avoiding local deformation of the overall physical form of the module assembly device, and avoiding the exposed lateral assembly structure and lateral physical interface on the outer side wall of the module assembly device, it helps to improve the device appearance of the module assembly device.

[0121] In the embodiment of the present application, the physical matching modes of at least two device modules 20 and the mounting backplane 10 may not be completely the same, so as to support the diversification of the module structure of the device module 20. For example:

[0122] Any one of the at least two device modules 20 (e.g., the host module 26) can penetrate the mounting backplane 10, and the physical cooperation between the device module 20 and the mounting backplane 10 may include: the device module 20 is physically engaged with the mounting backplane 10 by penetrating the mounting backplane 10. For example, if the mounting backplane 10 is used for wall-mounting on a target wall, the device module 20 can penetrate the mounting backplane 10 to be electrically connected to the wall wiring in the target wall, so that the module assembly device can be electrically connected to the wall wiring in the target wall through the device module 20 (e.g., the host module 26);

[0123] and / or

[0124] Any one of the at least two device modules 20 (e.g., the host module 26) can be in physical contact (e.g., surface contact) with the mounting backplane 10, and the physical cooperation between the device module 20 and the mounting backplane 10 may include: the device module 20 forms a physical limit on the mounting backplane 10 based on the physical contact with the mounting backplane 10. For example, if the mounting backplane 10 is used for wall-mounting on a target wall, the physical limit can be used to press the mounting backplane 10 against the target wall;

[0125] and / or,

[0126] The physical fit between any one of the at least two device modules 20 or other modules (eg, the first expansion module 21 or an expansion module such as the second expansion module 22 ) and the mounting backplane 10 may include a snap fit.

[0127] In an embodiment of the present application, if the mounting back panel 10 is used for wall-mounting on a target wall, the modular assembly device can be supported to be wall-mounted. For example, the modular assembly device can be configured as a control device for smart home appliances, and the modular assembly device needs to be electrically connected to home appliances such as lighting, electric curtains, smart doorbells, etc. through intra-wall wiring in the wall.

[0128] Fig.12 It is a schematic diagram of the wall-mounting installation principle of the host module in the first example structure of the module assembly equipment in the embodiment of the present application. Fig.13 This is a schematic diagram of the assembly relationship between the host module and the wall mounting box in the first example structure of the module assembly device in the embodiment of the present application. Fig.12 and Fig.13 In the example, the host module 26 is described by taking the first example structure as an example, and the host module 26 in the second example structure is the same. Fig.12 and Fig.13The module assembly device can be electrically connected to the wall wiring in the wall through the host module 26, and the host module 26 can include a module body 261 and a module back seat 262.

[0129] In an embodiment of the present application, the module rear seat 262 of the host module 26 may include a rear end wall 262b and a raised portion 262c, wherein the rear end wall 262b surrounds the periphery of the raised portion 262c, and the raised portion 262c protrudes relative to the rear end wall 262b. In this case:

[0130] The raised portion 262c may penetrate the mounting backplane 10. For example, the raised portion 262c may penetrate the mounting backplane 10 to be electrically connected to the wall wiring in the target wall, and the raised portion 262c and the mounting backplane 10 may form a physical fit between the host module 26 and the mounting backplane 10 (for example, in the host module assembly area As_1);

[0131] and / or,

[0132] The rear end wall 262b can be in physical contact (e.g., surface contact) with the mounting backplate 10, and the rear end wall 262b can form a physical limit on the mounting backplate 10 based on the physical contact with the mounting backplate 10, so as to press the mounting backplate 10 (e.g., in the host module assembly area As_1) to the physical limit of the target wall.

[0133] In an embodiment of the present application, the mounting back plate 10 for wall-mounting on the target wall may have a hollow window 16. For example, the mounting back plate 10 may have a hollow window 16 in the host module assembly area As_1, and an in-wall mounting box 30 is embedded in the target wall, and the in-wall wiring in the target wall may converge to the in-wall mounting box 30. In this case, the raised portion 262c of the host module 26 may be embedded in the hollow window 16 of the mounting back plate 10, that is, the raised portion 262c may penetrate the mounting back plate 10 through the hollow window 16, and the raised portion 262c may be embedded in the hollow window 16, so as to achieve physical embedding of the host module 26 penetrating the mounting back plate based on the cooperation of the raised portion 262c and the hollow window 16.

[0134] In the embodiment of the present application, the connector 266 is provided through the module rear seat 262, and the connector 266 can fix the module rear seat 262 with the wall mounting box 30 in the target wall. Thus, when the host module 26 (i.e., the module rear seat 262) is fixedly connected with the wall mounting box 30 by the connector 266, the rear end wall 262b can press the mounting back plate 10 by the locking force generated by the connector 266, so as to realize the physical limit of the host module 26 pressing the mounting back plate 10 on the target wall, thereby, based on the rear end wall 262b of the host module 26 pressing the mounting back plate 10 by the locking force generated by the connector 266, the mounting back plate 10 can be closely attached to the target wall.

[0135] In the embodiment of the present application, the host module 26 may also have a wiring socket 265, and the wiring socket 265 is located at the raised portion 262c. That is, in the embodiment of the present application, the host module 26 may have a rear end wall 262b facing the mounting back plate 10, and a raised portion 262c protruding relative to the rear end wall 262b and surrounded by the rear end wall 262b, and the raised portion 262c has the wiring socket 265.

[0136] In an embodiment of the present application, when the host module 26 (i.e., the module back seat 262) is fixedly connected to the wall-mounted installation box 30 using the connecting piece 266, the raised portion 262c of the host module 26 can be located in the wall-mounted installation box 30, and, by electrically connecting the wiring socket 265 located on the raised portion 262c to the wall-mounted installation box 30, the wiring socket 265 can be electrically connected to the wall wiring through the wall-mounted installation box 30. In this case, since the wall-mounted installation box 30 is electrically connected to the wall wiring in the target wall, the wiring socket 265 is electrically connected to the wall wiring through the wall-mounted installation box 30, and the host module 26 can be electrically connected to the wall wiring through the wall-mounted installation box.

[0137] In an embodiment of the present application, after the module rear seat 262 of the host module 26 is fixedly connected to the wall mounting box 30 using the connecting piece 266, the module body 261 of the host module 26 can be snap-fitted and assembled on the module rear seat 262, and the module body 10 covers the connecting piece 266.

[0138] Exemplarily, in an embodiment of the present application, the surface edge of the module body 261 of the host module 26 facing the mounting backplate 10 (i.e., facing the module back seat 262) may have an edge ridge 261b, and the edge ridge 261b of the module body 261 may surround the outer peripheral edge of the rear end wall 262b of the module back seat 262, so that the rear end wall 262b of the module back seat 262 can be completely blocked and covered by the module body 261.

[0139] Exemplarily, in the embodiment of the present application, the edge ridge 261b of the module body 261 can be snap-fitted with the rear end wall 262b of the module back seat 262 at the periphery of the rear end wall 262b of the module back seat 262. For example, the inner side of the edge ridge 261b of the module body 261 can have a body buckle 261a, and the outer peripheral edge of the rear end wall 262b of the module back seat 262 can have a back seat slot 262a, so that the edge ridge 261b of the module body 261 can be snap-fitted with the rear end wall 262b of the module back seat 262 at the periphery of the rear end wall 262b of the module back seat 262 through the snap-fitting between the body opening 261a and the back seat slot 262a.

[0140] In an embodiment of the present application, the module signal interface 60 of the host module 26 is located on the rear side of the module body 261 of the host module 26 toward the module rear seat 262, and when the module body 261 of the host module 26 is snap-fitted and assembled to the module rear seat 262, the module signal interface 60 of the host module 26 can be conductively contacted with the corresponding on-board signal interface 50 in the interface interconnection area Ac.

[0141] Exemplarily, in an embodiment of the present application, the rear end wall 262b for implementing physical limitation on the mounting back plate 10 needs to avoid the interface interconnection area Ac. For example, the rear end wall 262b may have an avoidance notch 262d in the edge area overlapping with the interface interconnection area Ac.

[0142] In the embodiment of the present application, the module back seat 262 of the host module 26 may have a transfer interface 264 facing the module body 261 in addition to the wiring socket 265 located at the protrusion 262c. The transfer interface 264 is electrically connected to the wiring socket 265, and the module body 261 of the host module 26 may also have an external interface 263 facing the module back seat 262. In this case, when the module body 261 of the host module 26 is snap-fitted and assembled to the module back seat 262, the external interface 263 of the module body 261 may be plugged and matched with the transfer interface 264 of the module back seat 262, and the external interface 263 of the module body 261 may be electrically connected to the wiring socket 265 through the transfer interface 264, so that the electrical connection between the host module 26 and the wiring in the wall is realized through the multi-level electrical connection of the external interface 263, the transfer interface 264 and the wiring socket 265, so that the module assembly device is electrically connected to the wiring in the wall through the host module 26.

[0143] In the embodiment of the present application, the mounting back plate 10 for wall-mounting on the target wall may also have a wall-mounting hole 16, for example, the expansion module assembly area As_k of the mounting back plate 10 may be provided with a wall-mounting hole 16. Thus, after the host module 26 (i.e., the module rear seat 262) is fixedly connected to the wall-mounting box 30 by using the connecting piece 266, in addition to pressing the host module assembly area As_1 of the mounting back plate 10 and the host module 26 (i.e., the rear end wall 262b of the module rear seat 262) on the target wall, the expansion module assembly area As_k of the mounting back plate 10 may also be pressed on the target wall by using the wall-mounting screws penetrating the wall-mounting hole 16, so as to use the target wall to maintain the flatness of the mounting back plate 10.

[0144] As described above, in an embodiment of the present application, the mounting backplate 10 can serve as a leveling reference for at least two device modules 20 (e.g., a host module 26 and a first expansion module 21) to help avoid local deformation of the overall physical form of the module assembly device. Therefore, if the target wall is used to maintain the flatness of the mounting backplate 10, it can be more conducive to avoiding local deformation of the overall physical form of the module assembly device.

[0145] Fig.14 This is a schematic diagram of the assembly principle of the expansion module in the first example structure of the module assembly device in the embodiment of the present application. Fig.14 In an embodiment of the present application, the physical cooperation between the expansion module (for example, the first expansion module 21) and the installation backplane may include: the expansion module (for example, the first expansion module 21) is snap-fitted with the installation backplane 10 in the expansion module assembly area As_k (for example, As_2).

[0146] Exemplarily, in an embodiment of the present application, the mounting backplane 10 may have a backplane buckle 11. For example, the backplane buckle 11 of the mounting backplane 10 may be located in the expansion module assembly area As_k, and the expansion module (for example, the first expansion module 21) may have a module clip hole 215 toward the module rear end of the mounting backplane 10. Thus, through the snap-fitting between the backplane buckle 11 and the module clip hole 215, the snap-fitting between the expansion module (for example, the first expansion module 21) and the mounting backplane 10 in the expansion module assembly area As_k (for example, As_2) can be achieved.

[0147] For example, in the embodiments of the present application, Figure 3 In the second example structure shown, the second expansion module 22 can be physically matched with the mounting backplane 10 in the corresponding expansion module assembly area As_3 by using a snap-on method that is substantially the same as that of the first expansion module 22 .

[0148] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A module assembly device, characterized in that: It includes a mounting backplane and at least two equipment modules, wherein: At least two of the device modules are independently physically matched with the mounting backplane, and at least two of the device modules are assembled based on the physical match with the mounting backplane; The installation backplane comprises at least two module assembly areas arranged in sequence, each of the equipment modules physically cooperates with the installation backplane in the corresponding module assembly area, each of the equipment modules covers and shields the corresponding module assembly area, the module side walls of each two adjacent equipment modules contact and splice at the junction of the assembly areas of the corresponding two adjacent module assembly areas, and the contour edge of the assembled whole formed by the assembly of at least two equipment modules is flush with the outer edge of the installation backplane; Each of the equipment modules has a module signal interface, and the module signal interface of each of the equipment modules faces the mounting backplane; The mounting backplane is provided with an interface interconnection area at the junction of the assembly areas of every two adjacent module assembly areas, the interface interconnection area is used to electrically connect the two adjacent device modules, the interface interconnection area includes a pair of interconnected onboard signal interfaces, and the pair of onboard signal interfaces in the interface interconnection area at the junction of the assembly areas of any two adjacent module assembly areas are respectively located on both sides of the junction of the assembly areas; The module signal interfaces of each two adjacent device modules in at least two of the device modules are located at the contact and splicing sides of the two device modules, and a pair of the module signal interfaces located at the contact and splicing sides of the two device modules are respectively in conductive contact with a pair of the onboard signal interfaces in the same interface interconnection area at the junction of the assembly areas on both sides of the junction of the assembly areas of the corresponding two adjacent module assembly areas, so that at least two of the device modules are connected in series according to the assembly arrangement order; Among them, at least two device modules include a host module and at least one expansion module, and the host module realizes signal transmission with each of the expansion modules based on series connection according to the assembly arrangement sequence.

2. The modular assembly equipment according to claim 1, characterized in that: The host module penetrates the mounting backplane, and the physical cooperation between the host module and the mounting backplane in the corresponding module assembly area includes: the host module and the mounting backplane are physically engaged by penetrating the mounting backplane in the corresponding module assembly area; and / or, The host module is in physical contact with the mounting backplane, and the physical coordination between the host module in the corresponding module assembly area and the mounting backplane includes: the host module forms a physical limit on the mounting backplane based on the physical contact between the host module and the mounting backplane in the corresponding module assembly area.

3. The modular assembly equipment according to claim 2, characterized in that: The mounting backplate is for wall mounting on a target wall and: The host module penetrates the mounting back plate at the corresponding module assembly area and is electrically connected to the wall wiring in the target wall; and / or, The host module forms the physical limit on the installation backplane based on the physical contact with the installation backplane in the corresponding module assembly area, so as to press the installation backplane against the target wall.

4. The modular assembly equipment according to claim 2, characterized in that: The host module has a raised portion facing the mounting backplane, the raised portion penetrates the mounting backplane, and the physical engagement is formed between the raised portion and the mounting backplane; and / or, The host module has a rear end wall facing the mounting back plate, the rear end wall is in physical contact with the mounting back plate, and the rear end wall forms the physical limit for the mounting back plate based on the physical contact with the mounting back plate.

5. The modular assembly equipment according to claim 4, characterized in that: The raised portion protrudes relative to the rear end wall, and the rear end wall surrounds the outer periphery of the raised portion; and / or, The mounting back plate is used for wall-mounting on a target wall, and the raised portion is electrically connected to the wall wiring in the target wall; and / or, The mounting back plate has a hollow window in the module assembly area corresponding to the host module, the raised portion penetrates the mounting back plate through the hollow window, and the raised portion is embedded in the hollow window.

6. The modular assembly equipment according to claim 4, characterized in that: The mounting back plate is used for wall-mounting on a target wall, and an in-wall mounting box is embedded in the target wall, wherein: When the host module is fixedly connected to the wall mounting box by means of a connector, the rear end wall forms the physical limit on the mounting back plate by means of a locking force generated by the connector, and the physical limit is used to press the mounting back plate onto the target wall; and / or, The in-wall mounting box is electrically connected to the in-wall wiring in the target wall, and the host module also has a wiring socket located on the raised portion, and when the host module is fixedly connected to the in-wall mounting box using a connector, the wiring socket is electrically connected to the in-wall mounting box, so that the host module is electrically connected to the in-wall wiring through the in-wall mounting box.

7. The modular assembly equipment according to claim 6, characterized in that: The host module comprises a module body and a module back seat, wherein: The connecting piece is passed through the module rear seat, and the connecting piece fixedly connects the module rear seat with the wall mounting box; The module body is snap-fitted and assembled on the module rear seat, and the module body covers the connecting piece; The raised portion and the rear end wall are located at the module rear seat.

8. The modular assembly equipment according to claim 7, characterized in that: The surface edge of the module body facing the mounting back plate has an edge ridge, and the edge ridge is snap-fitted with the rear end wall at the periphery of the rear end wall; and / or, The module back seat also has a transfer interface facing the module body, and the transfer interface is electrically connected to the wiring socket. The module body also has an external interface facing the module back seat, and when the module body is snap-fitted and assembled on the module back seat, the external interface is plugged into and matched with the transfer interface to be electrically connected to the wiring socket through the transfer interface.

9. The modular assembly equipment according to claim 1, characterized in that: At least one of at least two of the equipment modules has the module signal interface on both sides in the direction of the assembly arrangement; and / or, The host module is used to provide the host function of the module assembly device, and the expansion module is used to provide the module assembly device with an expansion function that cooperates with the host function; and / or, The module signal interface and the onboard signal interface each include a plurality of signal terminals.

10. The modular assembly equipment according to claim 1, characterized in that: The signal terminals of the onboard signal interface include flat surface mount contacts attached to the backplane surface of the mounting backplane, and the plurality of signal terminals of the module signal interface include metal springs or metal spring pins mounted on the module surface of the device module facing the mounting backplane; or, The signal terminals of the onboard signal interface include metal springs or metal spring pins installed on the backplane surface of the mounting backplane, and the multiple signal terminals of the module signal interface include copper-plated sockets deployed on the module surface of the device module facing the mounting backplane.

11. The modular assembly equipment according to claim 1, characterized in that: At least two of the module assembly areas include a host module assembly area and at least one expansion module assembly area; The host module is physically matched with the mounting backplane in the host module assembly area, and the host module covers and shields the host module assembly area; At least one of the expansion modules is physically matched with the mounting backplane in the corresponding expansion module assembly area, and at least one of the expansion modules covers and shields the corresponding expansion module assembly area.

12. The modular assembly equipment according to claim 11, characterized in that: The host module penetrates the mounting backplane, and the physical cooperation of the host module between the host module assembly area and the mounting backplane includes: the host module is physically engaged with the mounting backplane by penetrating the mounting backplane in the host module assembly area; and / or, The host module is further in physical contact with the mounting backplane, and the physical cooperation between the host module and the mounting backplane in the host module assembly area includes: the host module forms a physical limit on the mounting backplane based on the physical contact between the host module assembly area and the mounting backplane; and / or, The mounting back plate is used for wall-mounting on a target wall, the host module presses the host module assembly area of ​​the mounting back plate on the target wall, the expansion module assembly area is provided with a wall-mounting hole, and the wall-mounting screws penetrated through the wall-mounting hole press the expansion module assembly area of ​​the mounting back plate on the target wall; and / or, The physical cooperation between the expansion module and the mounting backplane includes: the expansion module is snap-fitted with the mounting backplane in the expansion module assembly area.

Images