Preparation method of an airtight adapter for a quantum computer

Abstract

The present invention provides a preparation method of an airtight adapter for a quantum computer, which relates to the technical field of quantum computers and includes: obtaining an oxygen-free copper material and demagnetizing the oxygen-free copper material to obtain demagnetized oxygen-free copper; using the demagnetized oxygen-free copper as the metal material part of the adapter to be prepared to prepare the inner core and the outer shell of the adapter; bonding the inner core and the outer shell with a prepared adhesive to obtain a prepared airtight adapter; the thermal expansion coefficient of the prepared adhesive is consistent with that of the demagnetized oxygen-free copper. The present invention can obtain a completely non-magnetic airtight adapter, which can meet the working environment requirements of being non-magnetic.

Description

Technical Field

[0001] The present invention relates to the technical field of quantum computers, and particularly to a preparation method of an airtight adapter seat for a quantum computer. Background Art

[0002] The working principle of a superconducting quantum computer is to perform quantum computing in an adiabatic vacuum tank at an environment cooled to near absolute zero (-273.15 °C). In such a state of ultra-low temperature and ultra-high vacuum, quantum computing is carried out.

[0003] Due to the limited refrigeration power of the refrigerator, inside the vacuum tank, the internal space is divided into several regions. By the method of gradually decreasing the temperature, from the normal temperature of 300 K (about 26.85 °C) outside the vacuum to the 50 K (-223.15 °C) temperature zone, to the 4 K (-269.15 °C) temperature zone, to the 1 K (-274.15 °C) temperature zone, it is only at the very bottom of the tank that the temperature can be cooled to the required 10 mK (-273.149 °C). (Note: The temperature zone division of different superconducting quantum computers may vary slightly, but the principle is similar, gradually dividing the zones to cool down and finally approaching absolute zero).

[0004] In order to ensure the ultra-low temperature working environment of the quantum chip, the primary function of the ultra-low temperature vacuum tank of the superconducting quantum computer is to try to ensure the low temperature environment and avoid heat exchange.

[0005] There are three forms of heat exchange: heat conduction, heat radiation, and heat convection. Inside the vacuum tank, it is not a completely vacuum environment, and trace amounts of gas will cause heat convection. Therefore, if an airtight adapter seat can also be applied inside the vacuum tank to seal each temperature zone separately, heat exchange can be further reduced.

[0006] However, as Figure 1 shown, the traditional airtight adapter seat is currently only applied at the top layer of the vacuum tank (at the 300 K position). The manufacturing process of this airtight adapter seat is to achieve the airtight function through sintering of glass material and Kovar alloy. The "Kovar alloy airtight adapter seat" at the topmost part is the adapter seat product that requires an airtight function. The ordinary adapter seat and the quantum chip in the picture illustrate the overall structural layout of the quantum computer.

[0007] Because Kovar alloy has an expansion coefficient similar to that of glass and ceramic, it can be effectively sealed and joined with them. The expansion coefficient difference between ordinary metal materials and glass materials is too large, and after high or low temperature changes, problems such as seal shedding and cracking will occur.

[0008] However, the true nature of Kovar alloy is an iron-nickel-cobalt alloy. A typical Kovar alloy contains 53% iron, 29% nickel, 17% cobalt, less than 0.5% manganese, 0.2% silicon, and less than 0.25% aluminum, magnesium, zirconium, and titanium. Among them, the three elements of iron, cobalt, and nickel with the highest proportion are natural magnetic materials. If applied to a vacuum tank, their own magnetism will produce great magnetic interference under the blessing of electrical signals. This magnetic interference has been proven to have a great interference effect on the stable operation of quantum chips.

[0009] Due to the presence of iron, cobalt and nickel materials in traditional adapters, this adapter is destined to not achieve non-magnetic performance, but can only achieve a slightly magnetic or low magnetic state.

[0010] As the capacity of quantum computer systems increases, the number of signal transmission channels will increase significantly, and the number of airtight adapters will also increase significantly. When the number of alloys in the adapter reaches a certain amount, the magnetic interference generated will also increase proportionally, so there is an urgent need to develop a truly non-magnetic airtight adapter. Summary of the invention

[0011] In order to overcome the deficiencies of the prior art, an object of the present invention is to provide a method for preparing an airtight adapter for a quantum computer.

[0012] To achieve the above object, the present invention provides the following solutions:

[0013] A method for preparing an airtight adapter for a quantum computer, comprising:

[0014] Obtaining an oxygen-free copper material, and performing a demagnetization treatment on the oxygen-free copper material to obtain demagnetized oxygen-free copper;

[0015] The demagnetized oxygen-free copper is used as the metal material part of the adapter to be prepared, so as to prepare the adapter to be prepared, and obtain the inner core and outer shell of the adapter;

[0016] The inner core and the outer shell are bonded together using a prepared adhesive to obtain a prepared airtight adapter; the thermal expansion coefficient of the prepared adhesive is consistent with the thermal expansion coefficient of the demagnetized oxygen-free copper.

[0017] Preferably, the method for preparing the adhesive comprises:

[0018] The silicate powder and the borosilicate powder in a preset proportion are added to the original adhesive to obtain the prepared adhesive.

[0019] Preferably, the thermal expansion coefficient of the demagnetized oxygen-free copper is 17.2×10 -6 k.

[0020] Preferably, the thermal expansion coefficient of the silicate powder is 9×10-6 k.

[0021] Preferably, the thermal expansion coefficient of the borosilicate powder is 3.3×10 -6 k.

[0022] Preferably, the preset ratio is modulated according to the structural gap.

[0023] According to the specific embodiments provided by the present invention, the following technical effects are disclosed:

[0024] The present invention provides a method for preparing an airtight adapter seat for a quantum computer, including: obtaining an oxygen-free copper material and demagnetizing the oxygen-free copper material to obtain demagnetized oxygen-free copper; using the demagnetized oxygen-free copper as the metal material part of the adapter seat to be prepared to prepare the inner core and the outer shell of the adapter; bonding the inner core and the outer shell with a modulated adhesive to obtain a prepared airtight adapter seat; the thermal expansion coefficient of the modulated adhesive is the same as that of the demagnetized oxygen-free copper. The present invention can obtain a completely non-magnetic airtight adapter seat, which can meet the working environment requirements without magnetism. Description of the Drawings

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0026] Figure 1 It is a schematic diagram of the internal temperature range division of a traditional ultra-low temperature vacuum tank in the prior art;

[0027] Figure 2 It is a flowchart of the preparation method provided by the embodiment of the present invention. Detailed Embodiments

[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.

[0029] The purpose of the present invention is to provide a method for preparing an airtight adapter seat for a quantum computer, which can obtain a completely non-magnetic airtight adapter seat and can meet the working environment requirements without magnetism.

[0030] To make the above objects, features, and advantages of the present invention more apparent and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0031] Figure 2 The flowchart of the preparation method provided by the embodiment of the present invention is as Figure 2 shown. The present invention provides a preparation method for an airtight adapter seat for a quantum computer, including:

[0032] Step 100: Obtain oxygen-free copper material and demagnetize the oxygen-free copper material to obtain demagnetized oxygen-free copper;

[0033] Step 200: Use the demagnetized oxygen-free copper as the metal material part of the adapter seat to be prepared, and prepare the adapter seat to be prepared to obtain the inner core and the outer shell of the adapter;

[0034] Step 300: Bond the inner core and the outer shell with the prepared adhesive to obtain the prepared airtight adapter seat; the thermal expansion coefficient of the prepared adhesive is the same as that of the demagnetized oxygen-free copper.

[0035] Specifically, when designing the non-magnetic airtight adapter in this embodiment, the glass sintering sealing process is abandoned. Therefore, the metal material part uses demagnetized oxygen-free copper (pure copper itself has no magnetism, and the impurities in the copper material are further demagnetized through high-temperature treatment). After the oxygen-free copper is demagnetized, it can completely reach a non-magnetic state.

[0036] Further, the inner core and the outer shell of the adapter are not sintered at high temperature. A kind of adhesive is used to bond the metal shell. Since the thermal expansion coefficient of oxygen-free copper is 17.2×10 -6 k, and we have obtained through testing that the thermal expansion coefficient of the adhesive itself is 54×10 -6 k. In order to achieve the same thermal expansion coefficient as that of oxygen-free copper, we add a certain proportion (the proportion is adjusted according to the structural gap) of silicate powder (thermal expansion coefficient 9×10-6k) and borosilicate powder (thermal expansion coefficient 3.3×10 -6 k) to the adhesive to adjust its thermal expansion coefficient to be the same as that of oxygen-free copper.

[0037] The structural gap in the present invention is the gap between the metal shell and the internal insulating material. This gap needs to be bonded and fixed with an adhesive with an appropriate thermal expansion coefficient. Otherwise, thermal expansion and contraction will cause the adhesive to fail and the connector to be damaged.

[0038] When bonding two different materials, a certain tolerance gap is designed between the materials. Generally speaking, when the viscosity of the adhesive bonding is high, the designed reserved gap can be slightly larger, for example, 0.08 - 0.12 mm. This is beneficial to the flow and wetting of the contact surface by the adhesive.

[0039] When the viscosity of the adhesive bonding is low, the designed reserved gap can be slightly smaller, for example, 0.04 - 0.08 mm. This can prevent the adhesive from overflowing.

[0040] When formulating an adhesive with a wide and stable coefficient of thermal expansion, mixing powders in different proportions will cause changes in the viscosity of the adhesive. The more powder, the more viscous the adhesive. This needs to be considered when designing the structure.

[0041] After the coefficient of thermal expansion of the adhesive is adjusted, it can be close to that of metal. In this way, during the temperature conversion process between ultra-low temperature and normal temperature, the airtight function can still be ensured.

[0042] Thus, through this method, a completely non-magnetic airtight adapter is obtained in this embodiment, which can meet the working environment requirements without magnetism.

[0043] The main body of the adhesive and the silicate powder in this embodiment are non-metallic, do not have magnetism themselves, and will not be magnetized, which is very beneficial to the non-magnetic environment of the quantum computer.

[0044] The various embodiments in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. For the same and similar parts between the various embodiments, reference can be made to each other.

[0045] Specific examples are used in this article to elaborate on the principles and implementation methods of the present invention. The descriptions of the above embodiments are only used to help understand the method and its core idea of the present invention; at the same time, for those of ordinary skill in the art, based on the idea of the present invention, there will be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be construed as a limitation to the present invention.

Claims

1. A preparation method of an airtight adapter for a quantum computer, characterized in that, Including: Obtain oxygen-free copper material, and demagnetize the oxygen-free copper material to obtain demagnetized oxygen-free copper; Use the demagnetized oxygen-free copper as the metal material part of the adapter to be prepared, and prepare the adapter to be prepared to obtain the inner core and the outer shell of the adapter; Bond the inner core and the outer shell with the prepared adhesive to obtain a prepared airtight adapter; The thermal expansion coefficient of the prepared adhesive is consistent with that of the demagnetized oxygen-free copper; The method for preparing the adhesive includes: Add a preset proportion of silicate powder and borosilicate powder to the original adhesive to obtain the prepared adhesive; The preset proportion is adjusted according to the structural gap; The coefficient of thermal expansion of the demagnetized oxygen-free copper is 17.2×10 -6 k; The coefficient of thermal expansion of the silicate powder is 9×10 -6 k; The coefficient of thermal expansion of the borosilicate powder is 3.3×10 -6 k.

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