A silicon wafer flat washing device for semiconductor production

Abstract

The present invention discloses a silicon wafer flat washing device for semiconductor production, which relates to the technical field of semiconductor production. The silicon wafer flat washing device for semiconductor production includes an ultrasonic cleaning tank, and a drying mechanism is fixedly connected to the top of the ultrasonic cleaning tank. In this silicon wafer flat washing device for semiconductor production, through the setting of the drying mechanism, when the carrier box is tilted and the silicon wafers slide from the carrier box to the trough-shaped soft plate through the inclined blocks, the second motor is started. The second motor drives the fourth rotating shaft to rotate, the fourth rotating shaft drives the second gear to rotate, and the second gear drives the trough-shaped soft plate to slide in the trough-shaped slide rail. During the sliding process, whenever passing through the separation plate, the separation plate will flatten the stacked silicon wafers. In this way, the drying area can be increased, the drying speed can be faster, the working efficiency of the device is improved, and at the same time, after flattening, the silicon wafers can be dried more evenly, improving the working quality of the device.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor production, and specifically relates to a silicon wafer flat washing device for semiconductor production. Background Art

[0002] Semiconductors refer to materials whose electrical conductivity at room temperature is between that of conductors and insulators. We usually call materials with poor electrical conductivity, such as coal, artificial crystals, amber, ceramics, etc., insulators, and call metals with relatively good electrical conductivity, such as gold, silver, copper, iron, tin, aluminum, etc., conductors. Materials between conductors and insulators can be simply called semiconductors. Silicon wafers, also known as wafer sheets, are processed from silicon ingots. Millions of transistors can be etched on silicon wafers through special processes and are widely used in the manufacture of integrated circuits;

[0003] The patent number CN216606403U is cited. This patent discloses a silicon wafer flat washing device for semiconductor production;

[0004] The existing semiconductor silicon wafers are not washed thoroughly, and after the washing is completed, workers need to take them out of the washing device by themselves for drying, which is troublesome and time-consuming. Therefore, it is necessary to invent a silicon wafer flat washing device for semiconductor production that can wash thoroughly and automatically dry after the washing is completed. Summary of the Invention

[0005] Aiming at the deficiencies of the prior art, the present invention provides a silicon wafer flat washing device for semiconductor production to solve the problems raised in the above background art.

[0006] To achieve the above objectives, the present invention is realized through the following technical solutions: A silicon wafer flat washing device for semiconductor production includes an ultrasonic cleaning tank. A drying mechanism is fixedly connected to the top of the ultrasonic cleaning tank. A rotating block one is fixedly connected to the top of the drying mechanism. A box door is rotatably connected to the inside of the rotating block one. A handle is fixedly connected to the top of the box door. A lifting mechanism is provided inside the ultrasonic cleaning tank. A stirring mechanism is fixedly connected to the inside of the lifting mechanism. When the lifting mechanism transports the carrier box to the top of the through pipe, the baffle will press the stop rod inside the lifting mechanism downward, so that the carrier box tilts. After the carrier box tilts, the silicon wafers inside it will slide into the drying mechanism through the inclined block;

[0007] Preferably, the drying mechanism includes a through pipe. A third rotating block is fixedly connected to the top of the through pipe. A baffle is fixedly connected to the side of the third rotating block. An inclined block is fixedly connected to the outside of the through pipe. A second stopper is fixedly connected to the side of the inclined block. A trough-shaped flexible plate is provided at the bottom of the inclined block. A trough-shaped slide rail is slidably connected to the bottom of the trough-shaped flexible plate. A drying box is fixedly connected to the bottom of the trough-shaped slide rail. A first stopper is fixedly connected to the inside of the drying box. A drying device is provided on the top of the first stopper. A separation plate is fixedly connected to the inside of the first stopper. There are two first stoppers and four drying devices. A second motor is fixedly connected to the top of the second stopper. A fourth rotating shaft is fixedly connected to the output end of the second motor. A second gear is fixedly connected to the end of the fourth rotating shaft away from the second motor. The side of the second gear meshes with the side of the trough-shaped slide rail. When the silicon wafer slides onto the trough-shaped flexible plate through the inclined block, the second motor drives the trough-shaped flexible plate to slide in the trough-shaped slide rail. During the sliding process, whenever passing through the separation plate, the separation plate will flatten the stacked silicon wafers, which can increase the drying area, make the drying speed faster, improve the working efficiency of the device. At the same time, after flattening, the silicon wafers can be dried more evenly, improving the working quality of the device.

[0008] Preferably, the stirring mechanism includes a first motor. A third rotating shaft is fixedly connected to the output end of the first motor. A stirring rod is fixedly connected to the end of the third rotating shaft away from the first motor. A cleaning box is provided at the bottom of the first motor. A top cover is fixedly connected to the top of the cleaning box. A straight slide rail is fixedly connected to the side of the cleaning box. An arc-shaped door is slidably connected to the inside of the straight slide rail. A pull ring is fixedly connected to the top of the arc-shaped door. The silicon wafer is placed in the cleaning box. The first motor drives the stirring rod to rotate. The stirring rod is circular, which can greatly reduce the extrusion damage to the silicon wafer during the stirring process. Through stirring, any position of the silicon wafer can be ultrasonically cleaned, and when transferring the silicon wafer, the silicon wafers in the cleaning box can be completely cleaned out by the rotation of the stirring rod, greatly improving the quality of ultrasonic cleaning, and enhancing the working efficiency and quality of the device. After cleaning, the arc-shaped door can be opened through the pull ring, facilitating the subsequent transportation and processing of the silicon wafer.

[0009] Preferably, the lifting mechanism includes a grip, a first rotating rod is fixedly connected to the side surface of the grip, a first rotating shaft is fixedly connected to the end of the first rotating rod away from the grip, a first gear is fixedly connected to the outer side of the first rotating shaft, a ring gear plate is engaged with the bottom of the first gear, a second rotating rod is fixedly connected to the end of the first rotating shaft away from the first rotating rod, a fixed block is rotatably connected to the end of the first rotating shaft close to the second rotating rod, a third rotating rod is rotatably connected to the end of the second rotating rod away from the first rotating shaft, a lifting platform is fixedly connected to the end of the third rotating rod away from the second rotating rod, a spring is fixedly connected to the top of the lifting platform, a carrier box is fixedly connected to the top of the spring, a baffle rod is fixedly connected to the outer side of the carrier box, a second rotating shaft is fixedly connected to the inside of the carrier box, a second rotating block is rotatably connected to the outer side of the second rotating shaft, there are four fixed blocks and four springs. After the silicon wafer is ultrasonically cleaned, hold the grip and rotate the first rotating rod. The first rotating rod drives the first gear and the third rotating rod to rotate. The rotation of the first gear will drive the ring gear plate to rotate, so that the three third rotating rods will rotate accordingly, realizing the lifting function of the lifting platform. At the same time, since the bottom of the carrier box is set as a filter plate structure, the water in the carrier box will flow out during the rising process, preventing it from entering the subsequent mechanism. At the same time, one side of the carrier box is set as an upward inclined surface. When the carrier box is placed flat, it can prevent the silicon wafer from falling out. When the carrier box is tilted, it is convenient for the silicon wafer to slide out of the carrier box. There are four springs at the bottom of the carrier box, which is convenient for the subsequent transmission of the silicon wafer. In this way, the direct transfer of the silicon wafer can be realized, facilitating the subsequent work, eliminating the need for workers to manually take out the ultrasonically cleaned silicon wafer, improving the work efficiency and reducing the workload of workers.

[0010] The present invention provides a silicon wafer flat washing device for semiconductor production. It has the following beneficial effects:

[0011] 1. For this silicon wafer flat washing device for semiconductor production, through the setting of the stirring mechanism, the silicon wafer is placed in the cleaning box, and the first motor drives the stirring rod to rotate. The stirring rod is circular, which can greatly reduce the extrusion damage to the silicon wafer during the stirring process. Through stirring, any position of the silicon wafer can be ultrasonically cleaned. And when transferring the silicon wafer, all the silicon wafers in the cleaning box can be cleared out by the rotation of the stirring rod, greatly improving the quality of ultrasonic cleaning, enhancing the working efficiency and quality of the device. After the cleaning is completed, the arc-shaped door can be opened through the pull ring, facilitating the subsequent transportation and processing of the silicon wafer.

[0012] 2. The silicon wafer flat washing device for semiconductor production, through the setting of the lifting mechanism, after the silicon wafer is ultrasonically cleaned, hold the handle and rotate the first rotating rod. The first rotating rod drives the first gear and the third rotating rod to rotate. The rotation of the first gear will drive the annular gear plate to rotate, so that the three third rotating rods rotate accordingly, realizing the lifting function of the lifting table. At the same time, since the bottom of the carrier box is set as a filter plate structure, the water in the carrier box will flow out during the rising process, preventing it from entering the subsequent mechanism. At the same time, one side of the carrier box is set as an upward inclined surface. When the carrier box is placed flat, it can prevent the silicon wafer from falling out. When the carrier box is tilted, it is convenient for the silicon wafer to slide out of the carrier box. Four springs are arranged at the bottom of the carrier box, which is convenient for the subsequent transmission of the silicon wafer. In this way, the direct transfer of the silicon wafer can be realized, facilitating the subsequent work. There is no need for workers to manually take out the cleaned silicon wafer, improving the work efficiency and reducing the work content of workers.

[0013] 3. The silicon wafer flat washing device for semiconductor production, through the setting of the baffle and the inclined block, when the lifting mechanism transports the carrier box to the top of the through pipe, the baffle will press the stop rod in the lifting mechanism downward, so that the carrier box tilts. After the carrier box tilts, the silicon wafer inside it will slide down into the drying mechanism through the inclined block.

[0014] 4. The silicon wafer flat washing device for semiconductor production, through the setting of the drying mechanism, when the silicon wafer slides down onto the trough-shaped soft board through the inclined block, the second motor drives the trough-shaped soft board to slide in the trough-shaped slide rail. During the sliding process, whenever passing through the separation board, the separation board will flatten the stacked silicon wafers. In this way, the drying area can be increased, making the drying speed faster, improving the working efficiency of the device. At the same time, after flattening, the silicon wafers can be dried more evenly, improving the working quality of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a schematic diagram of the overall structure of the present invention;

[0016] Figure 2 is a schematic diagram of the overall internal structure of the present invention;

[0017] Figure 3 is a schematic diagram of the overall structure of the lifting mechanism of the present invention;

[0018] Figure 4 is of the present invention Figure 3 magnified view of A;

[0019] Figure 5 is a front view structure diagram of the lifting mechanism of the present invention;

[0020] Figure 6 is a schematic diagram of the stirring mechanism structure of the present invention;

[0021] Figure 7Schematic diagram of the drying mechanism of the present invention;

[0022] Figure 8 Schematic diagram of the internal structure of the drying mechanism of the present invention.

[0023] In the figure: 1. Ultrasonic cleaning tank; 2. First rotating block; 3. Chamber door; 4. Handle; 5. Drying mechanism; 501. Through pipe; 502. Inclined block; 503. Grooved flexible plate; 504. Drying box; 505. First stop block; 506. Drying device; 507. Third rotating block; 508. Baffle; 509. Second motor; 510. Fourth rotating shaft; 511. Second gear; 512. Second stop block; 513. Grooved slide rail; 514. Separation plate; 6. Stirring mechanism; 601. First motor; 602. Third rotating shaft; 603. Top cover; 604. Stirring rod; 605. Cleaning box; 606. Arc-shaped door; 607. Straight slide rail; 608. Pull ring; 7. Lifting mechanism; 701. Grip; 702. First rotating rod; 703. First rotating shaft; 704. First gear; 705. Fixed block; 706. Carrying box; 707. Second rotating rod; 708. Third rotating rod; 709. Ring-shaped gear plate; 710. Lifting platform; 711. Second rotating block; 712. Second rotating shaft; 713. Spring; 714. Stop rod. Detailed implementation manners

[0024] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments.

[0025] Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the accompanying drawings are exemplary and are intended to explain the present invention, and should not be construed as a limitation to the present invention.

[0026] Please refer to Figure 1-8 , the present invention provides a technical solution: a silicon wafer flat washing device for semiconductor production, including an ultrasonic cleaning tank 1, a drying mechanism 5 is fixedly connected to the top of the ultrasonic cleaning tank 1, a first rotating block 2 is fixedly connected to the top of the drying mechanism 5, a chamber door 3 is rotatably connected to the inside of the first rotating block 2, a handle 4 is fixedly connected to the top of the chamber door 3, a lifting mechanism 7 is arranged inside the ultrasonic cleaning tank 1, and a stirring mechanism 6 is fixedly connected to the inside of the lifting mechanism 7. When the lifting mechanism 7 transports the carrying box 706 to the top of the through pipe 501, the baffle 508 will press the stop rod 714 inside the lifting mechanism 7 downward, so that the carrying box 706 tilts, and the silicon wafers inside the carrying box 706 will slide into the drying mechanism 5 through the inclined block 502;

[0027] The drying mechanism 5 includes a through pipe 501. A third rotating block 507 is fixedly connected to the top of the through pipe 501. A baffle 508 is fixedly connected to the side of the third rotating block 507. An inclined block 502 is fixedly connected to the outside of the through pipe 501. A second stop block 512 is fixedly connected to the side of the inclined block 502. A grooved flexible plate 503 is provided at the bottom of the inclined block 502. A grooved slide rail 513 is slidably connected to the bottom of the grooved flexible plate 503. A drying box 504 is fixedly connected to the bottom of the grooved slide rail 513. A first stop block 505 is fixedly connected to the inside of the drying box 504. A drying device 506 is provided at the top of the first stop block 505. A separation plate 514 is fixedly connected to the inside of the first stop block 505. There are two first stop blocks 505 and four drying devices 506. A second motor 509 is fixedly connected to the top of the second stop block 512. A fourth rotating shaft 510 is fixedly connected to the output end of the second motor 509. A second gear 511 is fixedly connected to the end of the fourth rotating shaft 510 away from the second motor 509. The side of the second gear 511 meshes with the side of the grooved slide rail 513. When the silicon wafer slides down onto the grooved flexible plate 503 through the inclined block 502, the material of the grooved flexible plate 503 is a PVC board. The second motor 509 drives the fourth rotating shaft 510 to rotate, the fourth rotating shaft 510 drives the second gear 511 to rotate, and the second gear 511 drives the grooved flexible plate 503 to slide within the grooved slide rail 513. During the sliding process, whenever passing through the separation plate 514, the separation plate 514 will flatten the stacked silicon wafers, which can increase the drying area, make the drying speed faster, improve the working efficiency of the device. At the same time, after flattening, the silicon wafers can be dried more evenly, improving the working quality of the device.

[0028] The stirring mechanism 6 includes a first motor 601. A third rotating shaft 602 is fixedly connected to the output end of the first motor 601. A stirring rod 604 is fixedly connected to the end of the third rotating shaft 602 away from the first motor 601. A cleaning box 605 is provided at the bottom of the first motor 601. A top cover 603 is fixedly connected to the top of the cleaning box 605. A straight slide rail 607 is fixedly connected to the side of the cleaning box 605. An arc-shaped door 606 is slidably connected to the inside of the straight slide rail 607. A pull ring 608 is fixedly connected to the top of the arc-shaped door 606. Place the silicon wafer in the cleaning box 605. The first motor 601 drives the third rotating shaft 602 to rotate, and the third rotating shaft 602 drives the stirring rod 604 to rotate. The stirring rod 604 is circular, which can greatly reduce the extrusion damage to the silicon wafer during the stirring process. Through stirring, ultrasonic cleaning can be performed at any position of the silicon wafer, and when transferring the silicon wafer, all the silicon wafers in the cleaning box 605 can be cleaned out by the rotation of the stirring rod 604, greatly improving the quality of ultrasonic cleaning and enhancing the working efficiency and quality of the device. After cleaning, the arc-shaped door 606 can be pulled in the straight slide rail 607 through the pull ring 608 to open the cleaning box 605, facilitating the subsequent transportation and processing of the silicon wafer.

[0029] The lifting mechanism 7 includes a grip 701. A first rotating rod 702 is fixedly connected to the side surface of the grip 701. One end of the first rotating rod 702 away from the grip 701 is fixedly connected to a first rotating shaft 703. A first gear 704 is fixedly connected to the outer side of the first rotating shaft 703. A ring gear plate 709 is engaged with the bottom of the first gear 704. A second rotating rod 707 is fixedly connected to the end of the first rotating shaft 703 away from the first rotating rod 702. A fixed block 705 is rotatably connected to one end of the first rotating shaft 703 close to the second rotating rod 707. One end of the second rotating rod 707 away from the first rotating shaft 703 is rotatably connected to a third rotating rod 708. One end of the third rotating rod 708 away from the second rotating rod 707 is fixedly connected to a lifting platform 710. A spring 713 is fixedly connected to the top of the lifting platform 710. A load box 706 is fixedly connected to the top of the spring 713. A retaining rod 714 is fixedly connected to the outer side of the load box 706. A second rotating shaft 712 is fixedly connected to the inside of the load box 706. A second rotating block 711 is rotatably connected to the outer side of the second rotating shaft 712. There are four fixed blocks 705 and four springs 713. After the silicon wafer is ultrasonically cleaned, hold the grip 701 and rotate the first rotating rod 702. The first rotating rod 702 drives the first gear 704 and the first rotating shaft 703 to rotate. The first rotating shaft 703 drives the second rotating rod 707 to rotate. The second rotating rod 707 drives the third rotating rod 708 to rotate. The rotation of the first gear 704 drives the ring gear plate 709 to rotate, so that the three first gears 704 rotate accordingly, thereby driving the third rotating rod 708 to rotate accordingly, realizing the lifting function of the lifting platform 710. At the same time, since the bottom of the load box 706 is set as a filter plate structure, the water in the load box 706 will flow out during the rising process, preventing it from entering the subsequent mechanism. At the same time, one side of the load box 706 is set as an upward inclined surface. When the load box 706 is placed flat, it can prevent the silicon wafer from falling out. When the load box 706 is inclined, it is convenient for the silicon wafer to slide out of the load box 706. Four springs 713 are arranged at the bottom of the load box 706, which is convenient for the subsequent transmission of the silicon wafer. In this way, the direct transfer of the silicon wafer can be realized, facilitating the subsequent work. There is no need for workers to manually take out the ultrasonically cleaned silicon wafer, improving the work efficiency and reducing the work content of the workers.

[0030] During use, place the silicon wafer in the cleaning box 605, start the first motor 601 to drive the third rotating shaft 602 to rotate, the third rotating shaft 602 drives the stirring rod 604 to rotate. The stirring rod 604 is circular, which can greatly reduce the extrusion damage to the silicon wafer during the stirring process. Through stirring, ultrasonic cleaning can be carried out at any position of the silicon wafer, and when transferring the silicon wafer, all the silicon wafers in the cleaning box 605 can be cleaned out by the rotation of the stirring rod 604, greatly improving the quality of ultrasonic cleaning and enhancing the working efficiency and quality of the device. After cleaning, the arc-shaped door 606 can be pulled in the straight slide rail 607 through the pull ring 608 to open the cleaning box 605, facilitating the subsequent transportation and processing of the silicon wafer. After the silicon wafer is ultrasonically cleaned, hold the grip 701 and rotate the first rotating rod 702. The first rotating rod 702 drives the first gear 704 and the first rotating shaft 703 to rotate. The first rotating shaft 703 drives the second rotating rod 707 to rotate. The second rotating rod 707 drives the third rotating rod 708 to rotate. The rotation of the first gear 704 drives the annular gear plate 709 to rotate, so that the three first gears 704 rotate accordingly, driving the third rotating rod 708 to rotate accordingly, realizing the lifting function of the lifting platform 710. At the same time, since the bottom of the loading box 706 is set as a filter plate structure, the water in the loading box 706 will flow out during the rising process, preventing it from entering the subsequent mechanism. At the same time, one side of the loading box 706 is set as an upward inclined surface, which can prevent the silicon wafer from falling out when the loading box 706 is placed flat, and can facilitate the silicon wafer to slide out of the loading box 706 when the loading box 706 is inclined. Four springs 713 are provided at the bottom of the loading box 706, facilitating the subsequent transmission of the silicon wafer, realizing the direct transfer of the silicon wafer, facilitating the subsequent work, eliminating the need for workers to manually take out the cleaned silicon wafer, improving the working efficiency and reducing the workload of workers. When the lifting mechanism 7 transports the loading box 706 to the top of the through pipe 501, the baffle 508 will press the stop rod 714 in the lifting mechanism 7 downward, causing the loading box 706 to tilt. After the loading box 706 tilts, the silicon wafers inside it will slide down through the inclined block 502 into the drying mechanism 5. When the silicon wafer slides onto the trough-shaped soft board 503 through the inclined block 502, the material of the trough-shaped soft board 503 is a PVC board. The second motor 509 rotates the fourth rotating shaft 510, the fourth rotating shaft 510 drives the second gear 511 to rotate, and the second gear 511 drives the trough-shaped soft board 503 to slide in the trough-shaped slide rail 513. During the sliding process, whenever passing through the separation board 514, the separation board 514 will spread out the stacked silicon wafers, increasing the drying area, making the drying speed faster, enhancing the working efficiency of the device, and at the same time, after spreading out, the silicon wafers can be dried more evenly, improving the working quality of the device.

[0031] The above are only the preferred specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution and inventive concept of the present invention, making equivalent substitutions or changes should be covered within the protection scope of the present invention.

Claims

1. A silicon wafer flat washing device for semiconductor production, including an ultrasonic cleaning tank (1), characterized in that: A drying mechanism (5) is fixedly connected to the top of the ultrasonic cleaning tank (1). A first rotating block (2) is fixedly connected to the top of the drying mechanism (5). A box door (3) is rotatably connected to the inside of the first rotating block (2). A handle (4) is fixedly connected to the top of the box door (3). A lifting mechanism (7) is provided inside the ultrasonic cleaning tank (1). A stirring mechanism (6) is fixedly connected to the inside of the lifting mechanism (7). The drying mechanism (5) includes a through pipe (501). A third rotating block (507) is fixedly connected to the top of the through pipe (501). A baffle (508) is fixedly connected to the side of the third rotating block (507). An inclined block (502) is fixedly connected to the outside of the through pipe (501). A second stop block (512) is fixedly connected to the side of the inclined block (502). A grooved flexible plate (503) is provided at the bottom of the inclined block (502). A grooved slide rail (513) is slidably connected to the bottom of the grooved flexible plate (503). A drying box (504) is fixedly connected to the bottom of the grooved slide rail (513). A first stop block (505) is fixedly connected to the inside of the drying box (504). A drying device (506) is provided at the top of the first stop block (505). A separation plate (514) is fixedly connected to the inside of the first stop block (505). The lifting mechanism (7) includes a grip (701). A first rotating rod (702) is fixedly connected to the side of the grip (701). A first rotating shaft (703) is fixedly connected to the end of the first rotating rod (702) away from the grip (701). A first gear (704) is fixedly connected to the outside of the first rotating shaft (703). A ring gear plate (709) is engaged with the bottom of the first gear (704). A second rotating rod (707) is fixedly connected to the end of the first rotating shaft (703) away from the first rotating rod (702). A fixed block (705) is rotatably connected to the end of the first rotating shaft (703) close to the second rotating rod (707). A third rotating rod (708) is rotatably connected to the end of the second rotating rod (707) away from the first rotating shaft (703). A lifting platform (710) is fixedly connected to the end of the third rotating rod (708) away from the second rotating rod (707). A spring (713) is fixedly connected to the top of the lifting platform (710). A load box (706) is fixedly connected to the top of the spring (713). A stop rod (714) is fixedly connected to the outside of the load box (706). A second rotating shaft (712) is fixedly connected to the inside of the load box (706). A second rotating block (711) is rotatably connected to the outside of the second rotating shaft (712). There are four fixed blocks (705). There are four springs (713).

2. The silicon wafer flat washing device for semiconductor production according to claim 1, wherein: There are two first stop blocks (505). There are four drying devices (506).

3. A silicon wafer flat washing device for semiconductor production according to claim 1, characterized in that: A second stopper (512) has a second motor (509) fixedly connected to its top. An output end of the second motor (509) is fixedly connected to a fourth rotating shaft (510). One end of the fourth rotating shaft (510) away from the second motor (509) is fixedly connected to a second gear (511). A side surface of the second gear (511) meshes with a side surface of a groove-shaped slide rail (513).

4. A silicon wafer flat washing device for semiconductor production according to claim 1, characterized in that: The stirring mechanism (6) includes a first motor (601). An output end of the first motor (601) is fixedly connected to a third rotating shaft (602). One end of the third rotating shaft (602) away from the first motor (601) is fixedly connected to a stirring rod (604). A cleaning box (605) is provided at the bottom of the first motor (601). A top cover (603) is fixedly connected to the top of the cleaning box (605).

5. The silicon wafer flat washing device for semiconductor production according to claim 4, wherein: A straight slide rail (607) is fixedly connected to a side surface of the cleaning box (605). An arc-shaped door (606) is slidably connected to the inside of the straight slide rail (607). A pull ring (608) is fixedly connected to the top of the arc-shaped door (606).

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