Support structure, flexible display module and display device

Abstract

The present application relates to a support structure for the backlight side of a flexible display panel, the display panel comprising a binding area and a non-binding area along a first direction, the support structure comprising a first side surface arranged close to the binding area and a second side surface arranged close to the non-binding area, a plurality of openings being arranged on the second side surface and a plurality of heat dissipation channels extending from the second side surface and penetrating through the second side surface, each of the heat dissipation channels comprising a first end arranged close to the first side surface and a second end arranged close to the second side surface, the inner diameter of the heat dissipation channel gradually decreasing from the first end to the second end. The present application also relates to a flexible display module and a display device.

Description

Technical Field

[0001] This invention relates to the field of display product manufacturing technology, and in particular to a support structure, a flexible display module, and a display device. Background Technology

[0002] Flexible OLED technology is revolutionizing automotive interior design and enhancing the driving experience. However, the heat generated by OLEDs and their electronic components during operation can affect their performance and lifespan, thus impacting the user experience. Summary of the Invention

[0003] To address the aforementioned technical problems, this invention provides a support structure, a flexible display module, and a display device to solve the heat dissipation problem of the display panel.

[0004] To achieve the above objectives, the technical solution adopted in this embodiment of the invention is: a support structure for the backlight side of a flexible display panel. Along a first direction, the display panel includes a bonding area and a non-bonding area. In the first direction, the support structure includes a first side surface near the bonding area and a second side surface near the non-bonding area. Multiple openings are provided on the second side surface, and multiple heat dissipation channels extend to the second side surface to form a plurality of heat dissipation channels penetrating the second side surface. Each heat dissipation channel includes a first end near the first side surface and a second end near the second side surface. The inner diameter of the heat dissipation channel gradually decreases from the first end to the second end.

[0005] Optionally, the support structure includes a first surface for bonding with the display panel, and the heat dissipation channel has a gap with the first surface.

[0006] Optionally, the support structure includes at least a first support layer and a second support layer stacked on top of each other, the first support layer and the second support layer being connected by an adhesive layer, and the heat dissipation channel including a plurality of first sub-heat dissipation channels disposed on the first support layer and a plurality of second sub-heat dissipation channels disposed on the second support layer.

[0007] Optionally, the first sub-heat dissipation channel extends toward the second support layer and penetrates the adhesive layer to communicate with the second sub-heat dissipation channel.

[0008] Optionally, the first sub-heat dissipation channel is formed on the side of the first support layer near the adhesive layer, and the second support layer is formed on the side of the second support layer near the adhesive layer;

[0009] The adhesive layer includes a substrate layer and adhesive layers disposed on opposite sides of the substrate layer.

[0010] Optionally, the orthographic projection of the first sub-heat dissipation channel on the second support layer at least partially overlaps with the corresponding second sub-heat dissipation channel.

[0011] Optionally, the orthographic projection of the first sub-heat dissipation channel on the second support layer is located between two adjacent second sub-heat dissipation channels.

[0012] Optionally, in the thickness direction of the support structure, the cross-sectional shapes of the first sub-heat dissipation channel and the second sub-heat dissipation channel are symmetrically arranged.

[0013] Optionally, in the thickness direction of the support structure, the cross-sectional shape of the first sub-heat dissipation channel and the cross-sectional shape of the second sub-heat dissipation channel may be the same or different.

[0014] In a second direction perpendicular to the first direction, the plurality of heat dissipation channels are spaced apart and uniformly arranged.

[0015] This invention also provides a flexible display module, including a display panel and the aforementioned support structure located on the backlight side of the display panel.

[0016] This invention also provides a display device, including the flexible display module described above.

[0017] The beneficial effects of this invention are: by setting heat dissipation channels on the support structure, the heat of the display panel can be quickly dissipated, which can improve the heat dissipation efficiency of the display panel. When the display module is working, the temperature of the corresponding position (i.e., the bonding area) will be higher than that of other areas due to the influence of PCB components. In this application, the inner diameter of the heat dissipation channel gradually decreases from the first end to the second end. That is, the inner diameter of the part of the heat dissipation channel corresponding to the higher temperature area is larger than the inner diameter of the part corresponding to the lower temperature area, which improves the overall temperature uniformity of the display panel and extends the service life of the product. Attached Figure Description

[0018] Figure 1 This is a schematic diagram showing the temperature of the display module;

[0019] Figure 2 A schematic diagram showing the support structure in an embodiment of the present invention;

[0020] Figure 3 express Figure 2 A schematic diagram of the cross-section of the supporting structure;

[0021] Figure 4 A schematic diagram showing the support structure in an embodiment of the present invention;

[0022] Figure 5 express Figure 4A cross-sectional schematic diagram of the supporting structure in the diagram;

[0023] Figure 6 A schematic diagram showing the support structure in an embodiment of the present invention;

[0024] Figure 7 A schematic diagram showing the support structure in an embodiment of the present invention;

[0025] Figure 8 This is a schematic diagram showing the support structure in an embodiment of the present invention.

[0026] Figure 9 A schematic diagram showing the display module in an embodiment of the present invention;

[0027] Figure 10 This is a schematic diagram illustrating the display module in an embodiment of the present invention. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0029] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an,” “a,” or “the,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “including,” “comprising,” or “containing,” and similar terms mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. The terms “connected,” “linked,” or similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” and “right,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0030] Figure 1 This is a temperature diagram of the OLED display module, showing that the temperature difference ΔT reaches 19.7℃.

[0031] This embodiment provides a support structure for the backlight side of a flexible display panel. Along a first direction, the display panel includes a bonding area and a non-bonding area. In the first direction, the support structure includes a first side surface near the bonding area and a second side surface near the non-bonding area. Multiple openings are provided on the second side surface, and multiple heat dissipation channels 10 extend through the second side surface. Each heat dissipation channel 10 includes a first end 101 near the first side surface and a second end 102 near the second side surface. The inner diameter of the heat dissipation channel 10 gradually decreases from the first end 101 to the second end 102.

[0032] By providing heat dissipation channels 10 on the support structure, the heat of the display panel can be quickly dissipated, thereby improving the heat dissipation efficiency of the display panel. When the display module is working, the temperature of the corresponding position (i.e., the bonding area) will be higher than that of other areas due to the influence of electronic components on the PCB (circuit board, located on the back of the support structure). In this application, the inner diameter of the heat dissipation channel 10 gradually decreases from the first end 101 to the second end 102. That is, the inner diameter of the portion of the heat dissipation channel 10 corresponding to the higher temperature area is larger than the inner diameter of the portion corresponding to the lower temperature area, thereby improving the overall temperature uniformity of the display panel and extending the product's service life.

[0033] In this embodiment, by setting differentiated heat dissipation channels 10 on the support structure, precise heat dissipation of hot spots in medium and large-sized OLED modules is achieved, optimizing the temperature distribution of the modules and thus improving the overall display performance and reliability. Furthermore, due to the natural convection principle of rising hot air, a low-pressure area is formed at the large-diameter end (i.e., the first end 101), attracting external cold air to flow in through the through holes, promoting airflow circulation and effectively improving heat dissipation efficiency.

[0034] The support structure provided in this embodiment utilizes the principle of natural convection to improve heat dissipation efficiency, reducing reliance on additional heat dissipation equipment, thereby potentially reducing overall manufacturing and maintenance costs while maintaining the module's slim and lightweight design.

[0035] In this embodiment, the heat dissipation channel 10 is easy to integrate into the existing OLED module manufacturing process because it is mainly achieved by adjusting the diameter of the heat dissipation channel 10, without the need for complex process changes, which helps to accelerate the product launch process and maintain production efficiency.

[0036] In an exemplary embodiment, the support structure includes a first surface for contacting the display panel, and a gap exists between the heat dissipation channel 10 and the first surface. That is, the heat dissipation channel 10 does not penetrate the first surface to ensure the flatness of the first surface and facilitate the connection stability between the support structure and the display panel.

[0037] In an exemplary embodiment, the support structure includes at least a first support layer 1 and a second support layer 2 stacked on top of each other, the first support layer 1 and the second support layer 2 are connected by an adhesive layer 3, and the heat dissipation channel 10 includes a plurality of first sub-heat dissipation channels 1001 disposed on the first support layer 1 and a plurality of second sub-heat dissipation channels 1002 disposed on the second support layer 2.

[0038] In an exemplary embodiment, the first sub-heat dissipation channel 1001 extends toward the second support layer 2 and penetrates the adhesive layer 3 to communicate with the second sub-heat dissipation channel 1002, as shown in the reference. Figure 2 .

[0039] In an exemplary embodiment, the first sub-heat dissipation channel 1001 is formed on the side of the first support layer 1 near the adhesive layer 3, and the second support layer 2 is formed on the side of the second support layer 2 near the adhesive layer 3.

[0040] The adhesive layer 3 includes a substrate layer and adhesive layers disposed on opposite sides of the substrate layer. That is, the plurality of first sub-heat dissipation channels 1001 and the plurality of second sub-heat dissipation channels 1002 are separated by the adhesive layer 3 so as not to interfere with each other, and the support performance of the support structure is enhanced.

[0041] In an exemplary embodiment, the first sub-heat dissipation channel 1001 is disposed through the side of the first support layer 1 near the adhesive layer 3, as shown in the reference. Figure 4 .

[0042] In an exemplary embodiment, the first sub-heat dissipation channel 1001 is located inside the first support layer 1, that is, the first sub-heat dissipation channel 1001 does not penetrate the side of the first support layer 1 away from the adhesive layer 3, nor does the first sub-heat dissipation channel 1001 penetrate the side of the first support layer 1 close to the adhesive layer 3.

[0043] In an exemplary embodiment, the second sub-heat dissipation channel 1002 is disposed through the side of the second support layer 2 near the adhesive layer 3, as shown in the reference. Figure 4 .

[0044] In an exemplary embodiment, the second sub-heat dissipation channel 1002 is located inside the second support layer 2, that is, the second sub-heat dissipation channel 1002 does not penetrate the side of the second support layer 2 away from the adhesive layer 3, nor does the second sub-heat dissipation channel 1002 penetrate the side of the second support layer 2 close to the adhesive layer 3.

[0045] In an exemplary embodiment, the orthographic projection of the first sub-heat dissipation channel 1001 onto the second support layer 2 at least partially overlaps with the corresponding second sub-heat dissipation channel 1002. Figure 2 , Figure 4 , Figure 6 and Figure 7 In this context, it means that the orthographic projection of the first sub-heat dissipation channel 1001 on the second support layer 2 completely overlaps with the corresponding second sub-heat dissipation channel 1002, but this is not a limitation.

[0046] In an exemplary embodiment, the orthographic projection of the first sub-heat dissipation channel 1001 onto the second support layer 2 is located between two adjacent second sub-heat dissipation channels 1002.

[0047] The first sub-heat dissipation channel 1001 and the second sub-heat dissipation channel 1002 are arranged alternately, which can improve the heat dissipation effect while ensuring the overall support performance of the support structure.

[0048] In an exemplary embodiment, in the thickness direction of the support structure, the cross-sectional shapes of the first sub-heat dissipation channel 1001 and the second sub-heat dissipation channel 1002 are symmetrically arranged with respect to the adhesive layer 3.

[0049] In an exemplary embodiment, the cross-sectional shape of the first sub-heat dissipation channel 1001 and the cross-sectional shape of the second sub-heat dissipation channel 1002 in the thickness direction of the support structure may also be an asymmetrical structure.

[0050] In an exemplary embodiment, the cross-sectional shape of the first sub-heat dissipation channel 1001 and the cross-sectional shape of the second sub-heat dissipation channel 1002 are the same or different in the thickness direction of the support structure.

[0051] Figure 4 The cross-sectional shape of the first sub-heat dissipation channel 1001 and the cross-sectional shape of the second sub-heat dissipation channel 1002 are the same, both being rectangular. Figure 6 The cross-sectional shapes of the first sub-heat dissipation channel 1001 and the second sub-heat dissipation channel 1002 are different. The cross-sectional shape of the first sub-heat dissipation channel 1001 is rectangular, and the cross-sectional shape of the second sub-heat dissipation channel 1002 is triangular.

[0052] Figure 7 In this process, the cross-sectional shape of the first sub-heat dissipation channel 1001 and the cross-sectional shape of the second sub-heat dissipation channel 1002 are both rectangular, but the area of ​​the cross-sectional shape of the first sub-heat dissipation channel 1001 and the area of ​​the cross-sectional shape of the second sub-heat dissipation channel 1002 are different.

[0053] In an exemplary embodiment, the extending direction of the heat dissipation channel 10 is parallel to the first direction (reference direction). Figure 3 and Figure 5 Parallel to the Y-direction in the reference. Figure 3 and Figure 5 .

[0054] In an exemplary embodiment, the angle between the extending direction of the heat dissipation channel 10 and the first direction is greater than zero, referring to... Figure 8 The heat dissipation channel 10 is inclined in the first direction.

[0055] In an exemplary embodiment, in a second direction perpendicular to the first direction (referencing...) Figure 1 In the X direction, multiple heat dissipation channels 10 are spaced apart and evenly arranged.

[0056] It should be noted that, in order to reduce the overall temperature difference of the display module and improve the temperature uniformity of the display module, multiple heat dissipation channels can be distributed according to actual needs. For example, in Figure 1 In the X direction, the distribution density of heat dissipation channels in areas with high display module temperature is greater than that in areas with low display module temperature.

[0057] This invention also provides a flexible display module, including a display panel and the aforementioned support structure located on the backlight side of the display panel.

[0058] Figure 9 This is a schematic diagram of a COF-type display module. Figure 10 A schematic diagram showing a display module in COP format.

[0059] The flexible display module includes a display panel 200, a support structure 100 located on the backlight side of the display panel 200, a PCB board 20 disposed on the back of the support structure 100, a polarizer 300 disposed on the light-emitting side of the display panel 200, a touch substrate 400 disposed on the side of the polarizer 300 away from the display panel 200, and a cover plate 500 disposed on the side of the touch substrate 400 away from the display panel 200.

[0060] exist Figure 9In the structure, the bonding area of ​​the display panel 200 is bonded to the flip-chip film 600, the flip-chip film 600 is provided with a driver IC, and the flip-chip film 600 is connected to the PCB board 20 through the flexible circuit board 700.

[0061] exist Figure 10 In the structure, the driver IC is directly disposed on the bonding area of ​​the display panel 200, the bonding area is bent to the backlight side of the display panel 200, and the display panel 200 is connected to the PCB board 20 through the flexible circuit board 700.

[0062] This invention also provides a display device, including the flexible display module described above.

[0063] The following points need to be explained:

[0064] (1) The accompanying drawings of the embodiments of this disclosure only involve the structures involved in the embodiments of this disclosure. Other structures can be referred to the general design.

[0065] (2) For clarity, the thickness of layers or regions is enlarged or reduced in the drawings used to describe embodiments of the present disclosure, i.e., these drawings are not drawn to actual scale. It will be understood that when an element such as a layer, film, region or substrate is referred to as being “above” or “below” another element, the element may be “directly” located “above” or “below” the other element or there may be intermediate elements.

[0066] (3) Where there is no conflict, the embodiments of this disclosure and the features in the embodiments can be combined with each other to obtain new embodiments.

[0067] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of the present invention, and the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A support structure for the backlight side of a flexible display panel, along a first direction, the display panel including a bonding area and an unbonded area, characterized in that, In the first direction, the support structure includes a first side near the binding area and a second side near the non-binding area. Multiple openings are provided on the second side, and multiple heat dissipation channels extend to the second side to form through the second side. Each heat dissipation channel includes a first end near the first side and a second end near the second side. The inner diameter of the heat dissipation channel gradually decreases from the first end to the second end. The support structure includes at least a first support layer and a second support layer stacked on top of each other, and the first support layer and the second support layer are connected by an adhesive layer. The heat dissipation channel includes a plurality of first sub-heat dissipation channels penetrating the first support layer and a plurality of second sub-heat dissipation channels penetrating the second support layer. The first sub-heat dissipation channels do not penetrate the side of the first support layer away from the adhesive layer, nor do they penetrate the side of the first support layer close to the adhesive layer.

2. The support structure according to claim 1, characterized in that, The support structure includes a first surface for bonding with the display panel, and the heat dissipation channel has a gap with the first surface.

3. The support structure according to claim 1, characterized in that, The first sub-heat dissipation channel extends toward the second support layer and penetrates the adhesive layer to communicate with the second sub-heat dissipation channel.

4. The support structure according to claim 3, characterized in that, The first sub-heat dissipation channel is formed on the side of the first support layer near the adhesive layer, and the second support layer is formed on the side of the second support layer near the adhesive layer; The adhesive layer includes a substrate layer and adhesive layers disposed on opposite sides of the substrate layer.

5. The support structure according to claim 4, characterized in that, The orthographic projection of the first sub-heat dissipation channel onto the second support layer at least partially overlaps with the corresponding second sub-heat dissipation channel.

6. The support structure according to claim 5, characterized in that, The orthographic projection of the first sub-heat dissipation channel onto the second support layer is located between two adjacent second sub-heat dissipation channels.

7. The support structure according to claim 6, characterized in that, In the thickness direction of the support structure, the cross-sectional shapes of the first sub-heat dissipation channel and the second sub-heat dissipation channel are symmetrically arranged.

8. The support structure according to claim 7, characterized in that, In the thickness direction of the support structure, the cross-sectional shape of the first sub-heat dissipation channel and the cross-sectional shape of the second sub-heat dissipation channel may be the same or different. In a second direction perpendicular to the first direction, the plurality of heat dissipation channels are spaced apart and uniformly arranged.

9. A flexible display module, characterized in that, It includes a display panel and a support structure as described in any one of claims 1-8 located on the backlight side of the display panel.

10. A display device, characterized in that, Includes the flexible display module as described in claim 9.

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