An AC-DC LED filament package

Abstract

The present invention discloses an AC-DC LED filament package, which includes a bracket. On both sides of the upper end of the bracket, two groups of rectifying chips are installed, and a resistor is also installed on one side. A plurality of light-emitting chips are further installed on the bracket. The light-emitting chips and the rectifying chips form an internal rectifying circuit through metal wires, and are connected to the light-emitting chips in a parallel or series connection manner. And the pads of the respective chips are connected in parallel or series within the bracket to form a complete internal circuit. The LED filament of the present invention can achieve LED light emission when directly driven by alternating current, thus having better use in the fields of product assembly, product application, product cost, etc., and saving resources at the same time.

Description

Technical Field

[0001] The present invention relates to the technical field of AC LED light source bodies, and particularly to an AC-DC LED filament package. Background Art

[0002] Currently, LED filament packages are still based on traditional ceramic, sapphire, glass and other brackets, plus materials such as chips, phosphors, and encapsulation adhesives, and are formed into strip-shaped or special-shaped LED filaments through process encapsulation. However, they are only limited to use in products with power control. In the field of lighting technology, the existing LED light sources with filament packages have the advantages of low energy consumption, strong applicability, high stability, and multi-color light emission due to their use of DC power supply to drive, and have gradually replaced the original corn bulbs or energy-saving lamps as the new generation of mainstream lighting sources. However, due to their nature, they can only drive the filament LED to emit light after converting alternating current into direct current using an external power supply. Now, the present invention specifically aims to remove the traditional external power supply and use a metal bracket for better heat dissipation, with higher luminous efficiency and the ability to directly use wide-voltage AC and DC power, and can also normally and stably drive strip-shaped metal LED light-emitting devices. Summary of the Invention

[0003] In order to solve the above-mentioned deficiencies of the prior art, the present invention proposes an AC-DC LED filament package.

[0004] In order to solve the above technical problems, the present invention adopts the following technical solutions: An AC-DC LED filament package includes a bracket, two groups of rectifying chips are installed on both sides of the upper end of the bracket, an internal circuit is installed on the bracket, and a resistor is also installed on one side.

[0005] A plurality of light-emitting chips are also installed on the bracket. The light-emitting chips and the rectifying chips form an internal rectifying circuit through metal wires, and are connected to the light-emitting chips in a parallel or series connection manner, and the pads of each chip are connected in parallel or series within the bracket to form a complete internal circuit.

[0006] Preferably, the resistor, rectifying chips and light-emitting chips are fixedly connected to the bracket through an adhesive.

[0007] Preferably, after installation, it is encapsulated through a mixed encapsulation colloid to form a complete AC and DC LED metal filament light-emitting body.

[0008] Preferably, the adhesive is die bonding glue or silver glue.

[0009] Preferably, the mixed encapsulation colloid is a mixture of phosphor and diamond.

[0010] Preferably, the bracket is a metal bracket or a bracket made of thermally conductive plastic material. The metal bracket can be a copper alloy bracket, an iron alloy bracket or a bracket made of other alloy components. The bracket made of thermally conductive plastic material can be a thermosetting EMC, a thermoplastic PCT or other plastic materials with thermal conductivity function.

[0011] Preferably, the internal circuit is installed by spraying an insulating oil on the bracket first, and then brushing a silver layer on it and installing the internal circuit.

[0012] Preferably, the internal circuit is installed by directly bonding a flexible circuit board such as FPC or other high-temperature resistant flexible insulating circuit board to the special-shaped metal or alloy bracket, which is a packaging technology process.

[0013] The preparation method of the bracket includes the following steps:

[0014] S1. Uniformly mix the thermally conductive silicone grease composite material, diamond and ceramic powder, and then prepare a thermally conductive layer. The mass ratio of the thermally conductive silicone grease composite material, diamond powder and ceramic powder is 1:0.2 - 0.4:0.1 - 0.3;

[0015] S2. High-temperature fuse nickel, aluminum and copper and then stir to prepare a metal plate. The mass ratio of nickel, aluminum and copper is 0.1 - 0.3:1:1;

[0016] S3. After preparing the metal plate into the required bracket, coat the thermally conductive layer on the bracket.

[0017] Preferably, the preparation method of the thermally conductive layer includes: at a temperature of 25°C - 30°C, add diamond powder with a total content of 30% and ceramic powder with a total content of 65% to the thermally conductive silicone grease composite material and stir and fuse. After fusion, raise the temperature to 75°C at a heating rate of 2 - 4°C / min and keep it warm for 30 - 65 min. After the heat preservation ends, lower the temperature to 45 - 50°C at a cooling rate of 1 - 2°C / min, and then continue to add the remaining diamond powder and ceramic powder and stir and fuse. And the second fusion is carried out in an environment of ultrasonic dispersion at a frequency of 250 Hz - 600 Hz and a power of 200 - 250 W for 20 - 45 min. After fusion, the thermally conductive layer is obtained.

[0018] Preferably, the preparation method of the thermally conductive silicone grease composite material includes: at room temperature, add bentonite and sodium dodecyl sulfate to the silicone grease and stir for modification treatment. The frequency is 200 Hz - 500 Hz, and the power is 100 - 200 W for ultrasonic dispersion for 30 - 60 min to obtain the thermally conductive silicone grease composite material. The mass ratio of the silicone grease, bentonite and sodium dodecyl sulfate is 1:0.4:0.2.

[0019] Compared with the prior art, the beneficial effects of the present invention:

[0020] In use, as described in this invention patent, traditional electronic components are assembled into a large-sized product with complex processes and high assembly costs during the finished product assembly process. Additionally, the external power supply is easily affected by factors such as production and usage environments, resulting in power supply damage. In this invention, by integrating traditional SMD packaging technology and power supply technology through the integrated LED filament packaging technology of this invention, the influence of external power supply factors is reduced, enabling the LED filament of this invention to emit light when directly driven by alternating current, thereby achieving better performance in product assembly, product application, product cost, etc., and saving resources at the same time;

[0021] Diamond has a high hardness and thermal conductivity coefficient. When combined with thermal conductive silicone grease and ceramic powder, the frequency between atoms and the lattice is reduced. Under the influence of mutual interaction, the vibration of atoms and the lattice is changed, thereby enhancing the thermal conductivity coefficient;

[0022] Using materials such as metals or alloys, various forms (such as bars, circles, semi-circles, and other special-shaped brackets) are made through molds or other processes. According to product requirements, various PCB-like electronic circuits are attached to the brackets. Then, a single or multiple rectifier chips, capacitors, resistors, and other electronic components are used to form an internal rectification circuit. Subsequently, a single or multiple light-emitting LED chips are welded onto the brackets using metal wires such as gold wires or alloy wires through a professional welding machine. In this way, a complete internal circuit is formed, and then through our special LED encapsulation glue and other LED encapsulation processes, a complete LED filament that can be directly used under alternating current conditions is manufactured. Such a packaging technology can enable the LED filament to have the advantages of faster heat dissipation and better thermal conductivity. At the same time, an external step-down resistor or a step-down resistor or current-limiting resistor structure can be added outside the metal bracket. Combining with the diode characteristics of the AC LED filament of this invention, single-crystal LED chips or polycrystalline LED chips are connected in series or parallel to form an independent light-emitting LED metal filament or alloy filament of a complete LED metal filament. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic structural diagram of the present invention.

[0024] Figure 2 It is a schematic diagram of the circuit placement of the structure of the present invention.

[0025] Figure 3 It is a schematic diagram of the internal circuit of the present invention.

[0026] Figure 4 It is a packaging diagram of the present invention.

[0027] Reference numerals in the figure: 1 rectifier chip, 2 resistor, 3 light-emitting chip, 4 bracket, 5 encapsulation glue. DETAILED DESCRIPTION OF THE INVENTION

[0028] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present invention. In the description of the present invention, unless otherwise specified, the meaning of "a plurality" is two or more.

[0029] The present invention will be described in detail below with reference to the drawings and embodiments.

[0030] Embodiment 1

[0031] As Figures 1 - 4 shown, an AC-DC LED filament package includes a bracket 4. On both sides directly above the bracket 4, two groups of rectifying chips 1 are installed. On one side, a resistor 2 is also installed. The position of the resistor 2 can be installed according to the requirements of the customer according to the actual situation. An internal circuit is installed on the bracket. The installation method of this internal circuit is to spray a layer of insulating oil on the bracket first, and then brush a layer of silver layer on it and then install the internal circuit, or the installation method of this internal circuit is to directly attach an FPC or other high-temperature-resistant flexible insulating circuit board to the special-shaped metal or alloy bracket.

[0032] In the middle section of the bracket 4, a plurality of light-emitting chips 3 are also installed. The light-emitting chips 3 are arranged in sequence and form an internal rectifying circuit with the rectifying chips 1 through metal wires. The specific internal rectifying circuit is as Figure 3 shown, and is connected to the light-emitting chips 3 in a parallel or series connection manner, and the pads of each chip are connected in parallel or in series within the bracket 4 to form a complete internal circuit. The two groups of rectifying chips 1 on both sides of the bracket 4 are one group with the positive pole facing up and the other group with the negative pole facing up. The light-emitting chips 3 close to the rectifying chips 1 have the positive pole facing up, and the light-emitting chips 3 are placed with the positive and negative poles connected in sequence from left to right. See Figure 2 ;

[0033] In this embodiment, electronic devices such as the resistor 2, the rectifying chips 1, and the light-emitting chips 3 are fixedly connected to the inside of the bracket 4 through an adhesive. After all the electronic devices are installed, they are encapsulated with a mixed encapsulation glue 5 to form a complete AC and DC LED metal filament light-emitting body. The adhesive is die bonding glue or silver glue, and the mixed encapsulation glue 5 is a mixture of phosphor and diamond.

[0034] In this embodiment, the bracket 4 is a metal bracket or a heat-conducting plastic material bracket. In this embodiment, the bracket material can be any material with heat conduction and high strength.

[0035] Example 2

[0036] Compared with Example 1, the difference in this example is that the internal circuit installation method is a packaging technology process in which a flexible circuit board such as an FPC or other high-temperature-resistant flexible insulating circuit board is directly bonded to a shaped metal or alloy bracket.

[0037] Example 3

[0038] Compared with Example 1, the difference in this example is that the preparation method of the bracket includes the following steps:

[0039] S1. At a temperature of 25°C, add diamond with a total content of 30% and ceramic powder with a total content of 65% to the thermal grease composite material and stir to fuse. After fusion, then raise the temperature to 75°C at a heating rate of 2°C / min and keep it warm for 30 min. After the heat preservation ends, then lower the temperature to 45°C at a cooling rate of 1°C / min and continue to add the remaining amount of diamond and ceramic powder and stir to fuse. And the second fusion is carried out in an environment of ultrasonic dispersion at a frequency of 250 Hz and a power of 200 W for 205 min. After fusion, a thermal conductive layer is obtained. The mass ratio of the thermal grease composite material, diamond and ceramic powder is 1:0.2:0.1;

[0040] S2. High-temperature fuse nickel, aluminum and copper and then stir to prepare a metal plate. The mass ratio of nickel, aluminum and copper is 0.1 - 0.3:1;

[0041] S3. After preparing the required bracket from the metal plate, then coat the thermal conductive layer on the bracket.

[0042] The preparation method of the thermal grease composite material includes: at room temperature, add bentonite and sodium dodecyl sulfate to the thermal grease and stir for modification treatment. The frequency is 200 Hz and the power is 100 W for ultrasonic dispersion for 30 min to obtain the thermal grease composite material. The mass ratio of the thermal grease, bentonite and sodium dodecyl sulfate is 1:0.4:0.2.

[0043] Example 4

[0044] Compared with Example 1, the difference in this example is that the preparation method of the bracket includes the following steps:

[0045] S1. At a temperature of 27 °C, add diamond with a total content of 30% and ceramic powder with a total content of 65% to the thermal conductive silicone grease composite material and stir to fuse them. After fusion, raise the temperature to 75 °C at a heating rate of 3 °C / min and keep it warm for 57 min. After the heat preservation ends, lower the temperature to 50 °C at a cooling rate of 1 °C / min, and then continue to add the remaining diamond and ceramic powder and stir to fuse them. Moreover, the second fusion is carried out in an environment with an ultrasonic dispersion frequency of 420 Hz and a power of 230 W for 40 min. After fusion, a thermal conductive layer is obtained. The mass ratio of the thermal conductive silicone grease composite material, diamond, and ceramic powder is 1:0.3:0.2;

[0046] S2. High-temperature fuse nickel, aluminum, and copper and then stir to prepare a metal plate. The mass ratio of nickel, aluminum, and copper is 0.1 - 0.3:1;

[0047] S3. After preparing the metal plate into the required bracket, coat the thermal conductive layer on the bracket.

[0048] The preparation method of the thermal conductive silicone grease composite material includes: at room temperature, add bentonite and sodium dodecyl sulfate to the thermal conductive silicone grease and stir for modification treatment. The ultrasonic dispersion is carried out at a frequency of 450 Hz and a power of 140 W for 55 min to obtain the thermal conductive silicone grease composite material. The mass ratio of the thermal conductive silicone grease, bentonite, and sodium dodecyl sulfate is 1:0.4:0.2.

[0049] Example 5

[0050] Compared with Example 1, the difference in this example is that the preparation method of the bracket includes the following steps:

[0051] S1. At a temperature of 30 °C, add diamond with a total content of 30% and ceramic powder with a total content of 65% to the thermal conductive silicone grease composite material and stir to fuse them. After fusion, raise the temperature to 75 °C at a heating rate of 4 °C / min and keep it warm for 65 min. After the heat preservation ends, lower the temperature to 50 °C at a cooling rate of 2 °C / min, and then continue to add the remaining diamond and ceramic powder and stir to fuse them. Moreover, the second fusion is carried out in an environment with an ultrasonic dispersion frequency of 600 Hz and a power of 250 W for 45 min. After fusion, a thermal conductive layer is obtained. The mass ratio of the thermal conductive silicone grease composite material, diamond, and ceramic powder is 1:0.4:0.3;

[0052] High-temperature fuse nickel, aluminum, and copper and then stir to prepare a metal plate. The mass ratio of nickel, aluminum, and copper is 0.1:1:1;

[0053] S3. After preparing the metal plate into the required bracket, coat the thermal conductive layer on the bracket.

[0054] The preparation method of the thermal conductive silicone grease composite material includes: at room temperature, adding bentonite and sodium dodecyl sulfate to the thermal conductive silicone grease and stirring for modification treatment at a frequency of 500 Hz and a power of 200 W for ultrasonic dispersion for 60 min to obtain the thermal conductive silicone grease composite material. The mass ratio of the thermal conductive silicone grease, bentonite and sodium dodecyl sulfate is 1:0.4:0.2.

[0055] Comparative Example 1

[0056] Compared with Example 3, the bracket of Comparative Example 1 is a copper alloy bracket. The content of copper in the copper alloy is 80%, the content of zinc is 20%, and the rest is the same as that of Example 3.

[0057] Comparative Example 2

[0058] Compared with Example 3, the bracket of Comparative Example 2 is an EMC bracket, and the rest is the same as that of Example 3.

[0059] The brackets prepared in Examples 3-5 were experimentally compared with the brackets of Comparative Examples 1-2. The specific data are shown in Table 1;

[0060] Table 1

[0061]

[0062]

[0063] As can be seen from Table 1, Example 4 is the optimal solution.

[0064] The above embodiments only represent several implementation manners of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the present invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the scope of the present invention patent and protection should be subject to the appended claims.

Claims

1. An AC-DC LED filament package, comprising a bracket (4), characterized in that, On both sides of the upper end of the bracket (4), two groups of rectifying chips (1) are installed. An internal circuit is installed on the bracket, and a resistor (2) is also installed on one side; A plurality of light-emitting chips (3) are also installed on the bracket (4). The light-emitting chip (3) and the rectifying chip (1) form an internal rectifying circuit through a metal wire, and are connected to the light-emitting chip (3) in a parallel or series connection manner. Inside the bracket (4), the pads of each chip are connected in parallel or in series to form a complete internal circuit. The resistor (2), the rectifying chip (1), and the light-emitting chip (3) are fixedly connected to the inside of the bracket (4) through an adhesive. After installation, a complete AC and DC LED metal filament light-emitting body is formed through encapsulation with a mixed encapsulation glue (5).

2. The AC / DC LED filament package according to claim 1, wherein The mixed encapsulation glue (5) is a mixture of phosphor and diamond, and the adhesive is die bonding glue or silver glue.

3. A kind of AC-DC LED filament package according to any one of claims 1-2, characterized in that, The bracket (4) is a metal bracket or a bracket made of heat-conducting plastic material.

4. A kind of AC-DC LED filament package according to any one of claims 1-2, characterized in that, The preparation method of the bracket includes the following steps: S1. A heat-conducting layer is prepared by uniformly mixing a heat-conducting silicone composite material, diamond, and ceramic powder. The mass ratio of the heat-conducting silicone composite material, diamond powder, and ceramic powder is 1:0.2 - 0.4:0.1 - 0.3; S2. Nickel, aluminum, and copper are melted at high temperature and then stirred to prepare a metal plate. The mass ratio of nickel, aluminum, and copper is 0.1 - 0.3:1:1; S3. After the metal plate is made into the required bracket, the heat-conducting layer is coated on the bracket.

5. The AC-DC LED filament package according to claim 4, wherein The preparation method of the heat-conducting layer includes: at a temperature of 25°C - 30°C, 30% of the total content of diamond powder and 65% of the total content of ceramic powder are added to the heat-conducting silicone composite material and stirred and fused. After fusion, the temperature is raised to 75°C at a heating rate of 2 - 4°C / min and kept warm for 30 - 65 min. After the heat preservation ends, the temperature is lowered to 45 - 50°C at a cooling rate of 1 - 2°C / min, and then the remaining amount of diamond powder and ceramic powder is added and stirred and fused. The second fusion is carried out in an environment with a frequency of 250 Hz - 600 Hz and a power of 200 - 250 W for ultrasonic dispersion for 20 - 45 min. After fusion, the heat-conducting layer is obtained.

6. The AC-DC LED filament package according to claim 5, characterized in that, The preparation method of the heat-conducting silicone composite material includes: at room temperature, bentonite and sodium dodecyl sulfate are added to the silicone grease and stirred for modification treatment. The frequency is 200 Hz - 500 Hz, and the power is 100 - 200 W for ultrasonic dispersion for 30 - 60 min to obtain the heat-conducting silicone composite material. The mass ratio of the heat-conducting silicone grease, bentonite, and sodium dodecyl sulfate is 1:0.4:0.

2.

7. The AC-DC LED filament package according to claim 1, wherein The installation method of the internal circuit is to first spray an insulating oil on the bracket, and then brush a silver layer on it and install the internal circuit.

8. The AC-DC LED filament package according to claim 1, characterized in that The installation method of the internal circuit is an encapsulation technology process in which a flexible circuit board such as an FPC or other high-temperature-resistant flexible insulating circuit board is directly attached to the special-shaped metal or alloy bracket.

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