Display module and display device

Abstract

The present application discloses a display module and a display device, wherein the display module includes a display panel, a backlight module, a circuit board and a chip, wherein the backlight module includes a back plate and a light-emitting unit, wherein the back plate includes a bottom plate and a side plate, wherein the side plate extends in a direction away from the bottom plate, the circuit board and the bottom plate are arranged opposite to each other, and an end of the circuit board close to the display panel is connected to the display panel, and the chip is arranged on a side of the circuit board away from the side plate, and the chip is connected to the circuit board; wherein the light-emitting unit is arranged in the accommodating space, and the light-emitting unit is connected to a side of the circuit board away from the chip; a first overlapping portion is provided between the orthographic projection of the chip on the back plate and the back plate, and a second overlapping portion is provided between the orthographic projection of the chip on the light-emitting unit and the light-emitting unit, and the area of ​​the first overlapping portion is greater than the area of ​​the second overlapping portion, thereby realizing an integrated structural design of the circuit board, the chip and the light-emitting unit, which is beneficial to saving material cost and assembly cost, realizing a narrow frame design of the display module and improving the heat dissipation effect of the chip.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display module and a display device. Background Art

[0002] As market competition for display devices such as TVs, notebooks, and monitors becomes increasingly fierce, brand owners are placing increasing emphasis on the stability and quality specifications of display device designs, leading to stricter requirements for product reliability and mechanical verification.

[0003] The backlight modules of notebook computers that are currently widely used and have experience in mass production usually adopt a bracket structure that is formed by bending outward on one side of the back panel to support the printed circuit board (PCB). The flexible printed circuit (FPC) is bound to the display panel, and then the printed circuit board and the flexible circuit board are bound and connected. Due to the external space occupied by the printed circuit board, the border design of the backlight module cannot be further reduced. Summary of the Invention

[0004] The embodiments of the present application provide a display module and a display device to alleviate the deficiencies in the related art.

[0005] To achieve the above functions, the technical solutions provided in the embodiments of the present application are as follows:

[0006] An embodiment of the present application provides a display module, comprising:

[0007] Display panel;

[0008] A backlight module is located on one side of the display panel backlight, the backlight module includes a back plate and a light-emitting unit, the back plate includes a bottom plate and a side plate, and the side plate extends in a direction away from the bottom plate;

[0009] a circuit board, disposed between the display panel and the backlight module, the circuit board being disposed opposite to the bottom plate, the end of the circuit board close to the display panel being connected to the display panel, and the end of the circuit board close to the backlight module being connected to the side plate, the circuit board, the side plate, and the bottom plate forming a receiving space;

[0010] A chip is provided on a side of the circuit board away from the side plate, and the chip is connected to the circuit board;

[0011] In which, the light-emitting unit is arranged in the accommodating space, and the light-emitting unit is connected to the side of the circuit board away from the chip; the chip has a first overlapping portion between the orthographic projection of the chip on the backplane and the backplane, and the chip has a second overlapping portion between the orthographic projection of the light-emitting unit and the light-emitting unit, and the area of ​​the first overlapping portion is greater than the area of ​​the second overlapping portion.

[0012] Optionally, in one embodiment, the circuit board includes a first surface, the first surface is located on a side of the circuit board close to the display panel, and a binding portion is provided at one end of the first surface close to the display panel;

[0013] Wherein, a binding terminal is provided at one end of the display panel close to the circuit board, and the binding terminal is connected to the binding portion.

[0014] Optionally, in one embodiment, a first connection end is provided at an end of the first surface away from the display panel;

[0015] The chip is located on the first surface of the circuit board, and the chip is connected to the first connection end.

[0016] Optionally, in one embodiment, the backlight module includes:

[0017] a light guide plate, located in the accommodation space, and arranged between the bottom plate and the circuit board;

[0018] Wherein, one end of the circuit board close to the side plate is connected to the side plate, and one end of the circuit board close to the light guide plate is connected to the light guide plate.

[0019] Optionally, in one embodiment, the circuit board includes a second surface, the second surface is located on a side of the circuit board close to the backlight module, and an end of the second surface close to the side plate is provided with an electrostatic discharge portion;

[0020] The back plate further includes an extension portion, the extension portion is located on a side of the side plate away from the bottom plate, and the extension portion extends from the side plate in a direction away from the light guide plate;

[0021] Wherein, the display module further includes a first adhesive portion, and the static electricity release portion is connected to the extension portion through the first adhesive portion.

[0022] Optionally, in one embodiment, a second connection end is provided on a side of the second surface close to the light guide plate, and the display module further includes a second adhesive portion; wherein the second connection end is connected to the light guide plate via the second adhesive portion.

[0023] Optionally, in one embodiment, a light source setting area, a first connection area, and a second connection area are provided on the second surface, the light source setting area is located between the first connection area and the second connection area, the electrostatic discharge portion is located in the first connection area, and the second connection end is located in the second connection area;

[0024] The light emitting unit is located in the light source setting area, the light emitting unit is arranged between the side plate and the light guide plate, and the light emitting unit is spaced apart from the side plate.

[0025] Optionally, in one embodiment, one end of the second adhesive portion close to the light emitting unit is in contact with the light emitting unit, and a material of the second adhesive portion is a light shielding material.

[0026] Optionally, in one embodiment, the circuit board is a printed circuit board.

[0027] An embodiment of the present application further provides a display device comprising any of the display modules described above.

[0028] Beneficial effects of the embodiments of the present application: The embodiments of the present application provide a display module and a display device, wherein the display module includes a display panel, a backlight module, a circuit board and a chip, the backlight module includes a back plate and a light-emitting unit, the back plate includes a bottom plate and a side plate, the side plate extends in a direction away from the bottom plate, the circuit board is arranged opposite to the bottom plate, the end of the circuit board close to the display panel is connected to the display panel, the chip is arranged on a side of the circuit board away from the side plate, and the chip is connected to the circuit board; wherein the light-emitting unit is connected to a side of the circuit board away from the chip; the chip has a first overlapping portion between its orthographic projection on the side plate and the side plate, and the chip has a second overlapping portion between its orthographic projection on the light-emitting unit and the light-emitting unit, the area of ​​the first overlapping portion is larger than the area of ​​the second overlapping portion, thereby realizing an integrated structural design of the circuit board, the chip and the light-emitting unit, which is beneficial to saving material cost and assembly cost, realizing a narrow frame design of the display module and improving the heat dissipation effect of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0030] Figure 1 A schematic diagram of the structure of a display module provided in an embodiment of the present application;

[0031] Figure 2 A top view of the first surface of the circuit board provided in an embodiment of the present application;

[0032] Figure 3 A top view of the second surface of the circuit board provided in an embodiment of the present application;

[0033] Figure 4 A schematic diagram of a partial structure of a display module provided in an embodiment of the present application;

[0034] Figure 5 A schematic cross-sectional view of a display module provided in an embodiment of the present application;

[0035] Figure 6 This is a schematic cross-sectional view of a display device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0036] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present application. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the present application, and are not used to limit the present application. In the present application, unless otherwise specified, the directional words used, such as "upper" and "lower", generally refer to the upper and lower parts of the actual use or working mode of the device, specifically the direction of the drawings in the accompanying drawings; and "inside" and "outside" refer to the outline of the device.

[0037] In addition, the terms "first" and "second" are used for descriptive purposes only, and features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0038] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed or detachable connections; mechanical or electrical connections; or communication between them; direct or indirect connections through an intermediate medium; and can refer to internal connectivity between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0039] The disclosure below provides many different embodiments for realizing the different structures of the present application. In order to simplify the disclosure of the present application, the components and settings of specific examples are described below. Of course, they are merely examples, and the purpose is not to limit the present application. In addition, the examples of various specific processes and materials provided in the present application, but those of ordinary skill in the art will appreciate the application of other processes and / or the use of other materials.

[0040] The embodiments of the present application provide a display module and a display device. Detailed descriptions are provided below. It should be noted that the order in which the following embodiments are described does not limit the preferred order of the embodiments.

[0041] See also Figure 1 , is a structural diagram of the display module provided in an embodiment of the present application.

[0042] This embodiment provides a display module 1, which includes a display panel 11, a backlight module 12, a circuit board 13 and a chip 14; the backlight module 12 is located on the backlight side of the display panel 11, and the backlight module 12 includes a back plate 121 and a light-emitting unit 123. The back plate 121 includes a bottom plate 1211 and a side plate 1212, and the side plate 1212 extends in a direction away from the bottom plate 1211; the circuit board 13 is provided between the display panel 11 and the backlight module 12 The circuit board 13 and the bottom plate 1211 are arranged opposite to each other, and the end of the circuit board 13 close to the display panel 11 is connected to the display panel 11, and the end of the circuit board 13 close to the backlight module 12 is connected to the backlight module 12. The circuit board 13, the side plate 1212 and the bottom plate 1211 form a accommodating space 120; the chip 14 is arranged on the side of the circuit board 13 away from the side plate 1212, and the chip 14 is connected to the circuit board 13.

[0043] In which, the light-emitting unit 123 is arranged in the accommodating space 120, and the light-emitting unit 123 is connected to the side of the circuit board 13 away from the chip 14; the chip 14 has a first overlapping portion between its orthographic projection on the backplane 121 and the backplane 121, and the chip 14 has a second overlapping portion between its orthographic projection on the light-emitting unit 123 and the light-emitting unit 123, and the area of ​​the first overlapping portion is greater than the area of ​​the second overlapping portion.

[0044] It should be noted that in the prior art, one side of the back panel 121 is usually bent outward to form a hanging ear structure for supporting a printed circuit board. A flexible printed circuit (FPC) is bound to the display panel, and then the printed circuit board is bound and connected to the flexible circuit board. However, due to the external space occupied by the printed circuit board, a narrow frame design of the backlight module cannot be achieved.

[0045] It can be understood that in this embodiment, the circuit board 13 is connected to the display panel 11 at one end close to the display panel 11, and the circuit board 13 is connected to the backlight module 12 at one end close to the backlight module 12. Therefore, compared with the prior art of supporting the circuit board by setting a hanging ear structure, the design provided by this embodiment is conducive to achieving a narrow frame of the display module 1.

[0046] At the same time, the chip 14 is arranged on the side of the circuit board 13 away from the side panel 1212, the chip 14 is connected to the circuit board 13, and the light-emitting unit 123 is connected to the side of the circuit board 13 away from the chip 14, thereby realizing the integrated structural design of the light-emitting element 1231, the chip 14 and the circuit board 13, which is beneficial to saving material costs and assembly costs.

[0047] In addition, the chip 14 has a first overlapping portion between its orthographic projection on the backplane 121 and the backplane 121, and a second overlapping portion between its orthographic projection on the light-emitting unit 123 and the light-emitting unit 123. The area of ​​the first overlapping portion is greater than the area of ​​the second overlapping portion, which is beneficial to improving the heat dissipation effect of the chip 14.

[0048] Please combine Figure 1 and Figure 2 ;in, Figure 2 This is a top view of the first surface of the circuit board provided in an embodiment of the present application.

[0049] In one embodiment, the display panel 11 may be a liquid crystal display panel 11, and the display panel 11 includes an array substrate 111 and a color filter substrate 112 that are relatively arranged. The color filter substrate 112 is located on a side of the array substrate 111 away from the backlight module 12, and the array substrate 111 is connected to the circuit board 13.

[0050] The circuit board 13 can be a printed circuit board (PCB), and the circuit board 13 includes a first surface 1301, and the first surface 1301 is located on a side of the circuit board 13 close to the display panel 11. The first surface 1301 is provided with a binding portion 131 at one end close to the display panel 11; wherein, the display panel 11 is provided with a binding terminal 113 at one end close to the circuit board 13, and the binding terminal 113 is connected to the binding portion 131, thereby realizing the connection between the circuit board 13 and the display panel 11; it should be noted that the binding terminal 113 can be provided on the side of the array substrate 111 close to the circuit board 13.

[0051] Furthermore, a first connection end 132 is provided at one end of the first surface 1301 away from the display panel 11; the chip 14 is located on the first surface 1301 of the circuit board 13, and the chip 14 is connected to the first connection end 132, thereby realizing the connection between the circuit board 13 and the chip 14; it should be noted that this embodiment does not impose any specific restrictions on the type of the chip 14.

[0052] Specifically, a panel binding area 13011 and a chip binding area 13012 are provided on the first surface 1301. The panel binding area 13011 is located on the side of the first surface 1301 close to the display panel 11, and the chip binding area 13012 is located on the side of the first surface 1301 close to the chip 14. The binding portion 131 is located in the panel binding area 13011, and the first connection end 132 is located in the chip binding area 13012.

[0053] It can be understood that this embodiment realizes an integrated structural design of the chip 14 and the circuit board 13 by arranging the chip 14 on the first surface 1301 of the circuit board 13 and connecting the chip 14 to the first connection end 132, which is beneficial to saving material costs and assembly costs.

[0054] Please continue to combine Figure 1 and Figure 2 ; In one embodiment, the backlight module 12 also includes a light guide plate 122, and the light guide plate 122 is located in the accommodating space 120, and the light guide plate 122 is arranged between the bottom plate 1211 and the circuit board 13; wherein, one end of the circuit board 13 close to the side plate 1212 is connected to the side plate 1212, and one end of the circuit board 13 close to the light guide plate 122 is connected to the light guide plate 122.

[0055] It should be noted that, in the relevant technology, the backlight module of a laptop computer with mass production experience usually adopts a back panel setting in a "U" shape, thereby forming a storage space for placing components such as a light guide plate and a light-emitting unit 123; in this embodiment, the circuit board 13 is arranged relative to the bottom plate 1211, and the circuit board 13, the side panel 1212 and the bottom plate 1211 form a storage space 120, and the light guide plate 122 is located in the storage space 120, and the light guide plate 122 is arranged between the bottom plate 1211 and the circuit board 13, and the end of the circuit board 13 close to the side panel 1212 is connected to the side panel 1212, and the end of the circuit board 13 close to the light guide plate 122 is connected to the light guide plate 122, thereby realizing a narrow frame of the backlight module 12, and helping to save material costs and assembly costs.

[0056] Please combine Figure 1 、 Figure 2 、 Figure 3 and Figure 4 ;in, Figure 3 A top view of the second surface of the circuit board provided in an embodiment of the present application; Figure 4 A schematic diagram of the partial structure of a display module provided in an embodiment of the present application.

[0057] In one embodiment, the circuit board 13 includes a second surface 1302, which is located on a side of the circuit board 13 close to the backlight module 12, and an electrostatic release portion 133 is provided at an end of the second surface 1302 close to the side panel 1212; the back panel 121 also includes an extension portion 1213, which is located on a side of the side panel 1212 away from the bottom panel 1211, and the extension portion 1213 extends from the side panel 1212 in a direction away from the light guide plate 122.

[0058] Among them, the side of the extension portion 1213 close to the circuit board 13 is flush with the side of the circuit board 13 close to the extension portion 1213, and the display module 1 also includes a first adhesive portion 15, and the electrostatic release portion 133 is connected to the extension portion 1213 through the first adhesive portion 15; preferably, the first adhesive portion 15 can be a conductive tape, and the electrostatic release portion 133 is exposed copper.

[0059] It can be understood that in this embodiment, an electrostatic release portion 133 is provided on one end of the second surface 1302 close to the side panel 1212, and the electrostatic release portion 133 is connected to the extension portion 1213 through the first adhesive portion 15, so that the circuit board 13 and the back panel 121 are grounded together, increasing the channel for electrostatic release, which is conducive to further reducing the accumulation of static electricity in the display module 1, and achieving the purpose of timely releasing the static electricity generated on the display module 1 or preventing the generation of static electricity.

[0060] Furthermore, in one embodiment, the chip 14 has a first overlapping portion between its orthographic projection on the extension portion 1213 and the extension portion 1213, and the chip 14 has a second overlapping portion between its orthographic projection on the light-emitting unit 123 and the light-emitting unit 123, and the area of ​​the first overlapping portion is greater than the area of ​​the second overlapping portion.

[0061] It can be understood that when the circuit board 13 is arranged between the display panel 11 and the backlight module 12, and the light-emitting element 1231, the chip 14 and the circuit board 13 are designed as an integrated structure, the heat generation and heat flux density of the chip 14 are greatly increased, and the heat dissipation space is reduced. In this embodiment, the area of ​​the first overlapping portion is set to be larger than the area of ​​the second overlapping portion, that is, the overlapping area between the chip 14 and the extension portion 1213 is increased, so that when the chip 14 works for a long time and generates heat, the heat generated by the chip 14 can be transferred to the backplate 121 by utilizing the thermal conductivity of the metal parts, which is beneficial to improving the heat dissipation effect of the chip 14.

[0062] At the same time, the overlapping area between the chip 14 and the light emitting unit 123 is reduced, thereby preventing the heat generated by the chip 14 from being transferred to the light emitting unit 123, reducing heat accumulation in the light emitting unit 123, and improving the service life of the light emitting unit 123.

[0063] Please combine Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 and Figure 5 ;in, Figure 5 This is a cross-sectional schematic diagram of a display module provided in an embodiment of the present application.

[0064] In one embodiment, a second connection end 134 is provided on a side of the second surface 1302 close to the light guide plate 122, and the display module 1 further includes a second adhesive portion 16; wherein, the second connection end 134 is connected to the light guide plate 122 via the second adhesive portion 16; preferably, the second adhesive portion 16 can be a fixing tape.

[0065] Furthermore, a light source setting area 13023, a first connection area 13021 and a second connection area 13022 are provided on the second surface 1302, the light source setting area 13023 is located between the first connection area 13021 and the second connection area 13022, the electrostatic release part 133 is located in the first connection area 13021, and the second connection end 134 is located in the second connection area 13022; wherein, the light-emitting unit 123 is located in the light source setting area 13023, the light-emitting unit 123 is provided between the side panel 1212 and the light guide plate 122, the light-emitting element 1231 is spaced apart from the side panel 1212, and the light-emitting unit 123 is connected to the circuit board 13.

[0066] Specifically, the light-emitting unit 123 includes a plurality of light-emitting elements 1231 located in the accommodating space 120, and the plurality of light-emitting elements 1231 are spaced apart along the first direction X in the light source setting area 13023 of the circuit board 13, and the light-emitting elements 1231 and the circuit board 13 can be welded by a bonding material such as solder; wherein, the light-emitting element 1231 is connected to the light guide plate 122 on a side close to the light guide plate 122, and the light-emitting element 1231 can be a light-emitting diode (LED), and the first direction X can be Figure 5 The X direction is not specifically limited in this embodiment.

[0067] It can be understood that in this embodiment, the light-emitting unit 123 is arranged in the accommodating space 120, and the light-emitting unit 123 includes a plurality of light-emitting elements 1231. The plurality of light-emitting elements 1231 are arranged at intervals along the first direction X in the light source setting area 13023 of the circuit board 13, thereby realizing an integrated structural design of the light-emitting element 1231 and the circuit board 13, which is beneficial to saving material costs and assembly costs; at the same time, the light-emitting element 1231 is connected to the light guide plate 122 on the side close to the light guide plate 122, so that more light is incident on the light guide plate 122, thereby improving the light output efficiency of the light-emitting unit 123, improving the light efficiency of the backlight module 12, and avoiding the risk of light leakage.

[0068] It should be noted that in the prior art, when faced with strong vibration, the bearing ears of the printed circuit board are easily deformed, thereby pulling the flexible circuit board, causing the flexible circuit board to fall off, reducing the reliability and optical image quality of the display device.

[0069] In this embodiment, a accommodating space 120 is formed by arranging the circuit board 13, the side panel 1212 and the bottom panel 1211. The light guide plate 122 and the light-emitting unit 123 are both located in the accommodating space 120, and the light-emitting element 1231 and the circuit board 13 can be welded by bonding materials such as solder. The circuit board 13 is connected to the extension portion 1213 through the first adhesive portion 15, and the circuit board 13 is connected to the light guide plate 122 through the second adhesive portion 16, thereby avoiding the connection between the circuit board 13 and the hanging ear by bonding or screwing in the prior art, thereby enhancing the fixing stability of the circuit board 13 in the direction perpendicular to the bottom panel 1211.

[0070] Furthermore, in one embodiment, the backlight module 12 also includes a reflective sheet 124 located between the base plate 1211 and the light guide plate 122, and the reflective sheet 124 is located between the light guide plate 122 and the base plate 1211. The orthographic projection of the light-emitting unit 123 on the base plate 1211 is located within the orthographic projection of the reflective sheet 124 on the base plate 1211, and the orthographic projection of the light guide plate 122 on the base plate 1211 is located within the orthographic projection of the reflective sheet 124 on the base plate 1211. By setting the reflective sheet 124, this embodiment avoids the light emitted by the light-emitting unit 123 and the light guide plate 122 from being emitted from the base plate 1211, thereby improving the light efficiency of the backlight module 12.

[0071] Furthermore, in one embodiment, the light-emitting element 1231 is spaced apart from the side panel 1212; in the related art, the light-emitting element 1231 generates a large amount of heat when working, and the light-emitting element 1231 expands after being heated. In this embodiment, the light-emitting element 1231 is spaced apart from the side panel 1212, thereby providing a reserved space for the light-emitting element 1231 when it expands due to heat, and heat can be dissipated through the gap to reduce heat accumulation in the backlight module 12, and prevent the formation of a hot spot (Hotspot) in the light-emitting element 1231, thereby improving the service life of the backlight module 12.

[0072] Specifically, the second adhesive portion 16 can be a fixing tape, the second adhesive portion 16 can be a single-layer structure or a multi-layer structure, the material of the second adhesive portion 16 can be a light-shielding material, and the end of the second adhesive portion 16 close to the light-emitting unit 123 is in contact with the light-emitting unit 123; specifically, the second adhesive portion 16 is a multi-layer structure, so that the circuit board 13 and the light guide plate 122 have better adhesion; the material of the circuit board 13 includes but is not limited to one of several composite multi-layer materials such as carbon fiber, silicon carbide, aluminum oxide, aluminum-magnesium alloy, glass fiber, and ceramics.

[0073] It can be understood that in this embodiment, the orthographic projection of the circuit board 13 on the base plate 1211 is set to cover the orthographic projection of the light-emitting unit 123 on the base plate 1211. The material of the second adhesive portion 16 can be a light-shielding material, and the end of the second adhesive portion 16 close to the light-emitting unit 123 is in contact with the light-emitting unit 123, thereby preventing the light emitted by the light-emitting unit 123 and the light guide plate 122 from being emitted from the back of the circuit board 13, that is, preventing the backlight module 12 from leaking light.

[0074] Further, please continue to combine Figure 1 、 Figure 2 and Figure 3 ; In one embodiment, the backlight module 12 also includes a plastic frame 125, and the plastic frame 125 is arranged on the bottom plate 1211, and the plastic frame 125 is located on the side of the light-emitting unit 123 close to the side plate 1212; wherein, the side of the plastic frame 125 close to the circuit board 13 is connected to the circuit board 13, the side of the plastic frame 125 close to the side plate 1212 is connected to the side plate 1212, and the side of the plastic frame 125 close to the bottom plate 1211 is connected to the bottom plate 1211.

[0075] It can be understood that this embodiment strengthens the fixing stability of the circuit board 13 in the direction perpendicular to the side panel 1212 by setting the side of the rubber frame 125 close to the circuit board 13 to be connected to the circuit board 13, the side of the rubber frame 125 close to the side panel 1212 to be connected to the side panel 1212, and the side of the rubber frame 125 close to the bottom panel 1211 to be connected to the bottom panel 1211.

[0076] Furthermore, in one embodiment, the display module 1 also includes an optical film group 17, which is located between the display panel 11 and the light guide plate 122. The optical film group 17 is spaced apart from the display panel 11, thereby providing a reserved space for the optical film group 17 when it expands due to heat, and heat can be dissipated through the gap to reduce heat accumulation in the optical film group 17; it should be noted that the optical film group 17 includes a multilayer optical film, which includes but is not limited to one of a diffuser, a prism, and a brightness enhancement film, and this embodiment does not impose specific restrictions on this.

[0077] Specifically, the second adhesive portion 16 can extend from the circuit board 13 toward the direction close to the optical film group 17. The second adhesive portion 16 can extend between the optical film group 17 and the light guide plate 122, or between the optical film group 17 and the display panel 11. This embodiment does not impose any restrictions on this.

[0078] See also Figure 6 , is a cross-sectional schematic diagram of the display device provided in an embodiment of the present application.

[0079] This embodiment further provides a display device, which includes the display module described in any of the above embodiments.

[0080] It is understandable that the display module 1 has been described in detail in the above embodiment and will not be repeated here; the display device 2 may further include a frame 21, and the frame 21 is integrated with the display module 1.

[0081] In specific applications, the display device 2 can be a display screen of a smart phone, tablet computer, laptop computer, smart bracelet, smart watch, smart glasses, smart helmet, desktop computer, smart TV or digital camera, and can even be used on electronic devices with flexible display screens.

[0082] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0083] The above is a detailed introduction to a display module and a display device provided in the embodiments of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the technical solutions and core ideas of the present application. Ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A display module, characterized in that: include: Display panel; A backlight module is located on one side of the display panel backlight, the backlight module includes a back plate and a light-emitting unit, the back plate includes a bottom plate and a side plate, and the side plate extends in a direction away from the bottom plate; a circuit board, disposed between the display panel and the backlight module, the circuit board being disposed opposite to the bottom plate, the end of the circuit board close to the display panel being connected to the display panel, and the end of the circuit board close to the backlight module being connected to the side plate, the circuit board, the side plate, and the bottom plate forming a receiving space; A chip is provided on a side of the circuit board away from the side plate, and the chip is connected to the circuit board; In which, the light-emitting unit is arranged in the accommodating space, and the light-emitting unit is connected to the side of the circuit board away from the chip; the chip has a first overlapping portion between the orthographic projection of the chip on the backplane and the backplane, and the chip has a second overlapping portion between the orthographic projection of the light-emitting unit and the light-emitting unit, and the area of ​​the first overlapping portion is greater than the area of ​​the second overlapping portion.

2. The display module according to claim 1, wherein: The circuit board includes a first surface, the first surface is located on a side of the circuit board close to the display panel, and a binding portion is provided at one end of the first surface close to the display panel; Wherein, a binding terminal is provided at one end of the display panel close to the circuit board, and the binding terminal is connected to the binding portion.

3. The display module according to claim 2, wherein: A first connection end is provided at an end of the first surface away from the display panel; The chip is located on the first surface of the circuit board, and the chip is connected to the first connection end.

4. The display module according to claim 1, wherein: The backlight module includes: a light guide plate, located in the accommodation space, and arranged between the bottom plate and the circuit board; Wherein, one end of the circuit board close to the side plate is connected to the side plate, and one end of the circuit board close to the light guide plate is connected to the light guide plate.

5. The display module according to claim 4, wherein: The circuit board includes a second surface, the second surface is located on a side of the circuit board close to the backlight module, and an end of the second surface close to the side plate is provided with an electrostatic release portion; The back plate further includes an extension portion, the extension portion is located on a side of the side plate away from the bottom plate, and the extension portion extends from the side plate in a direction away from the light guide plate; Wherein, the display module further includes a first adhesive portion, and the static electricity release portion is connected to the extension portion through the first adhesive portion.

6. The display module according to claim 5, wherein: A second connection end is provided on a side of the second surface close to the light guide plate, and the display module further includes a second adhesive portion; wherein the second connection end is connected to the light guide plate through the second adhesive portion.

7. The display module according to claim 6, wherein: A light source setting area, a first connection area, and a second connection area are provided on the second surface, wherein the light source setting area is located between the first connection area and the second connection area, the electrostatic discharge portion is located in the first connection area, and the second connection end is located in the second connection area; The light emitting unit is located in the light source setting area, the light emitting unit is arranged between the side plate and the light guide plate, and the light emitting unit is spaced apart from the side plate.

8. The display module according to claim 7, wherein: One end of the second adhesive portion close to the light emitting unit contacts the light emitting unit, and the material of the second adhesive portion is a light shielding material.

9. The display module according to claim 1, wherein: The circuit board is a printed circuit board.

10. A display device, characterized in that: The device comprises a display module as claimed in any one of claims 1 to 9.

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