An exhaust gas recovery and treatment device, method, equipment and semiconductor process system

Abstract

The present invention relates to an exhaust gas recovery and treatment device, method, equipment and semiconductor process system. The exhaust gas recovery and treatment device includes a condensation unit, a liquid storage unit, a desorption and adsorption unit, a purification unit, a transportation unit, a first pressure relief unit and a second pressure relief unit. Its advantages are as follows: by connecting the condensation unit with the upstream gas treatment equipment and the liquid storage unit, all the liquid molecules carried in the high-temperature gas can be condensed and the condensed liquid is stored inside the liquid storage unit; by connecting the desorption and adsorption unit with the liquid storage unit, the liquid molecules in the condensed gas can be further removed to ensure the dryness of the condensed gas; by connecting the purification unit with the desorption and adsorption unit, only small-molecule hydrogen can pass through the purification unit, so as to remove the impurities in the dry gas and transport the impurities to the exhaust gas combustion treatment device for treatment, further improving the purity of hydrogen.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor gas process treatment, and particularly to a tail gas recovery and treatment device, method, equipment and semiconductor process system. Background Art

[0002] The most widely used and largest amount of gas in semiconductor processes is hydrogen. This system is a recovery system for H2 tail gas in semiconductors. Currently, in semiconductor manufacturing processes, the gas remaining after these processes comes out of the clean room through a vacuum tube and needs to be first treated by a tail gas treatment device through methods such as combustion, water washing, condensation, adsorption, etc., and then discharged into the central waste gas treatment system. This treatment method causes great waste.

[0003] In the process of hydrogen preparation, the prepared gas contains a large amount of miscellaneous gas that needs to be treated by filtration and purification. Currently, for the purification and filtration of H2, Chinese Patent (CN117531327A) discloses a hydrogen purification device in the process of producing polysilicon by the improved Siemens method. A pre-condensation unit is connected to the tail gas of the process of producing polysilicon by the improved Siemens method. The tail gas is processed by the pre-condensation unit to obtain a first processed gas; a compression unit is connected to the pre-condensation unit. The first processed gas is compressed by the compression unit to obtain a second processed gas, and the pressure of the second processed gas is 1.2 - 1.5 MPa; a post-condensation unit is connected to the compression unit. The second processed gas is gradually cooled by the post-condensation unit to obtain a third processed fluid, and the temperature of the third processed fluid is not higher than -70 °C; an absorption and desorption unit is connected to the post-condensation unit. The third processed fluid is processed by the absorption and desorption unit to remove at least 99% of HCl to obtain a fourth processed gas; a desorption and adsorption unit is connected to the absorption and desorption unit. The fourth processed gas is processed by the desorption and adsorption unit to obtain H2 with a purity not lower than 99.999%.

[0004] However, the above hydrogen purification device has the following defects in actual use:

[0005] 1. The working environment requirements of the hydrogen purification device in the prior art are relatively high, requiring a low-temperature environment, and it is not suitable for use in semiconductor machines;

[0006] 2. The hydrogen purification device in the prior art can only separate hydrogen from HCL gas, which has limitations;

[0007] 3. The adsorption barrels in the hydrogen purification device in the prior art need to be replaced irregularly, and when replacing the adsorption barrels or when a single device needs to be repaired, it is necessary to stop the machine, which affects the efficiency;

[0008] 4. In the hydrogen purification device in the prior art, there is no detection device and safety device, so it is impossible to monitor the real-time state of the pipeline and play a protective role in the event of an accident in the overall device.

[0009] Currently, for problems such as high requirements for the working environment, being able to separate hydrogen only in HCL gas, low efficiency, and being unable to monitor the real-time state of the pipeline in the related art, no effective solution has been proposed yet. Summary of the Invention

[0010] The purpose of the present invention is to provide a tail gas recovery and treatment device, method, equipment, and semiconductor process system for the deficiencies in the prior art, so as to solve problems such as high requirements for the working environment, being able to separate hydrogen only in HCL gas, low efficiency, and being unable to monitor the real-time state of the pipeline in the related art.

[0011] To achieve the above purpose, the technical solution adopted by the present invention is:

[0012] In the first aspect, the present invention provides a tail gas recovery and treatment device, including:

[0013] A condensation unit, which is connected to the upstream gas treatment equipment and is used to condense the high-temperature gas after water washing to obtain condensed gas and condensed liquid;

[0014] A liquid storage unit, which is respectively connected to the condensation unit, the waste liquid treatment device, and the tail gas combustion treatment device, and is located downstream of the condensation unit, and is used to store the condensed liquid;

[0015] A desorption and adsorption unit, which is connected to the liquid storage unit and is located downstream of the liquid storage unit, and is used to adsorb H2O in the condensed gas and obtain dry gas;

[0016] A purification unit, which is respectively connected to the desorption and adsorption unit and the tail gas combustion treatment device, and is located downstream of the desorption and adsorption unit, and is used to purify the dry gas to obtain high-purity hydrogen;

[0017] A conveying unit, which is respectively connected to the purification unit and the downstream semiconductor process equipment, and is used to convey the high-purity hydrogen to the downstream semiconductor process equipment;

[0018] A first pressure relief unit, which is respectively connected to the liquid storage unit and the tail gas combustion treatment device, and is used to relieve the pressure of the pipeline;

[0019] A second pressure relief unit, which is respectively connected to the conveying unit and the tail gas combustion treatment device, and is used to relieve the pressure of the pipeline.

[0020] In some of these embodiments, the condensation unit includes:

[0021] A condensation element that is respectively connected to the upstream gas treatment device and the liquid storage unit, and is used for condensing the high-temperature gas after water washing to obtain condensed gas and condensed liquid;

[0022] A heat exchange element that is connected to the condensation element and is used for delivering low-temperature liquid to the condensation element.

[0023] In some of these embodiments, the liquid storage unit includes:

[0024] A liquid storage element that is respectively connected to the condensation unit, the desorption and adsorption unit, the first pressure relief unit, the waste liquid treatment device, and the tail gas combustion treatment device, and is located downstream of the condensation unit and upstream of the desorption and adsorption unit, and is used for storing condensed liquid;

[0025] A constant temperature element that is arranged on the liquid storage element and covers the outer side wall of the liquid storage element, and is used for maintaining the internal temperature of the liquid storage element constant.

[0026] In some of these embodiments, the desorption and adsorption unit includes:

[0027] An adsorption element that is respectively connected to the liquid storage unit and the purification unit, and is located downstream of the liquid storage unit and upstream of the purification unit, and is used for filtering H2O in the condensed gas and obtaining dry gas;

[0028] A desorption element that is connected to the adsorption element and is used for delivering high-temperature nitrogen to the adsorption element.

[0029] In some of these embodiments, the purification unit includes:

[0030] A purification element that is respectively connected to the desorption and adsorption unit, the delivery unit, and the tail gas combustion treatment device, and is located downstream of the desorption and adsorption unit and upstream of the delivery unit, and is used for filtering impurities in the dry gas and obtaining high-purity hydrogen.

[0031] In some of these embodiments, the delivery unit includes:

[0032] A delivery element that is respectively connected to the purification unit, the second pressure relief unit, and the downstream semiconductor process equipment, and is used for delivering high-purity hydrogen to the downstream semiconductor process equipment;

[0033] A vacuum element that is arranged on the delivery element and is used for providing vacuum negative pressure at the connection between the purification unit and the delivery element.

[0034] In some of these embodiments, the first pressure relief unit includes:

[0035] A first pressure relief element, which is respectively connected to the liquid storage unit and the tail gas combustion treatment device, and is used to relieve the pressure of the liquid storage unit.

[0036] In some of these embodiments, the second pressure relief unit includes:

[0037] A second pressure relief element, which is respectively connected to the conveying unit and the tail gas combustion treatment device, and is used to relieve the pressure of the conveying unit.

[0038] In some of these embodiments, it further includes:

[0039] A gas analysis unit, which is connected to the conveying unit and is located at the connection between the conveying unit and the downstream semiconductor process equipment, and is used to analyze the gas input into the downstream semiconductor process equipment.

[0040] In a second aspect, the present invention also provides a method for recovering and treating tail gas, which is applied to the tail gas recovery and treatment device as described in the first aspect, and includes:

[0041] The condensation unit obtains high-temperature gas and condenses the high-temperature gas to obtain condensed gas and condensed liquid;

[0042] The desorption and adsorption unit obtains the condensed gas and adsorbs H2O in the condensed gas to obtain dry gas;

[0043] The purification unit obtains the filtered gas and purifies the dry gas to obtain high-purity hydrogen.

[0044] In a third aspect, the present invention also provides a tail gas recovery and treatment equipment, including:

[0045] The tail gas recovery and treatment device as described in the first aspect;

[0046] A waste liquid treatment device, which is connected to the liquid storage unit in the tail gas recovery and treatment device, and is used to treat and discharge the waste liquid stored in the liquid storage unit;

[0047] A tail gas combustion treatment device, which is connected to the liquid storage unit, the purification unit, the first pressure relief unit, and the second pressure relief unit in the tail gas recovery and treatment device, and is used to burn and discharge the miscellaneous gas generated during purification and the gas during the pressure relief process.

[0048] In a fourth aspect, the present invention also provides a semiconductor process system, including:

[0049] The tail gas recovery and treatment device of the first aspect; or

[0050] The tail gas recovery and treatment equipment as described in the third aspect.

[0051] The present invention adopts the above technical solutions, and compared with the prior art, has the following technical effects:

[0052] A tail gas recovery and treatment device, method, equipment and semiconductor process system of the present invention can condense all the liquid molecules carried in the high-temperature gas by connecting the condensation unit with the upstream gas treatment equipment and the liquid storage unit, and store the condensed liquid inside the liquid storage unit; by connecting the desorption and adsorption unit with the liquid storage unit, the liquid molecules in the condensed gas can be further removed to ensure the dryness of the condensed gas; by connecting the purification unit with the desorption and adsorption unit, only small molecule hydrogen can pass through the purification unit, so as to remove the impurities in the dry gas and transport the impurities to the tail gas combustion treatment device for treatment, further improving the purity of hydrogen; by connecting the first pressure relief unit with the liquid storage unit and the tail gas combustion treatment device respectively, and connecting the second pressure relief unit with the conveying unit and the tail gas combustion treatment device respectively, the liquid storage unit and the conveying unit can be pressure relieved when the pressure in the device pipeline is too high, ensuring the safety of the overall device during operation. Description of the Drawings

[0053] Figure 1 It is a schematic diagram (one) of the tail gas recovery and treatment device according to an embodiment of the present invention;

[0054] Figure 2 It is a schematic diagram (one) of the condensation unit, liquid storage unit, desorption and adsorption unit, purification unit, conveying unit, first pressure relief unit and second pressure relief unit according to an embodiment of the present invention;

[0055] Figure 3 It is a schematic diagram (two) of the condensation unit, liquid storage unit, desorption and adsorption unit, purification unit, conveying unit, first pressure relief unit and second pressure relief unit according to an embodiment of the present invention;

[0056] Figure 4 It is a schematic diagram (two) of the tail gas recovery and treatment device according to an embodiment of the present invention;

[0057] Figure 5 It is a schematic diagram of a specific embodiment of the tail gas recovery and treatment device according to an embodiment of the present invention.

[0058] The reference numerals therein are: 100, condensation unit; 110, condensation element; 120, heat exchange element; 130, first switching valve element; 140, first monitoring element; 200, liquid storage unit; 210, liquid storage element; 220, constant temperature element; 230, second switching valve element; 240, second monitoring element; 250, third monitoring element; 260, fourth monitoring element; 270, fifth monitoring element; 300, desorption and adsorption unit; 310, adsorption element; 320, desorption element; 330, third switching valve element; 340, first one-way valve element; 350, sixth monitoring element; 400, purification unit; 410, purification element; 420, fourth switching valve element; 430, second one-way valve element; 440, seventh monitoring element; 450, eighth monitoring element; 500, conveying unit; 510, conveying element; 520, vacuum element; 530, fifth switching valve element; 540, third one-way valve element; 550, ninth monitoring element; 600, first pressure relief unit; 610, first pressure relief element; 620, fourth one-way valve element; 700, second pressure relief unit; 710, second pressure relief element; 720, sixth switching valve element; 730, fifth one-way valve element; 800, gas analysis unit. Detailed implementation manners

[0059] In order to make the objectives, technical solutions and advantages of the present application clearer and more understandable, the present application will be described and explained below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application. Based on the embodiments provided in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present application.

[0060] Obviously, the accompanying drawings in the following description are only some examples or embodiments of the present application. For those of ordinary skill in the art, without creative efforts, the present application can also be applied to other similar scenarios based on these drawings. In addition, it can also be understood that although the efforts made in this development process may be complex and lengthy, for those of ordinary skill in the art related to the content disclosed in the present application, some design, manufacturing or production changes based on the technical content disclosed in the present application are only conventional technical means and should not be understood that the content disclosed in the present application is insufficient.

[0061] References to "embodiments" in this application mean that the specific features, structures, or characteristics described in connection with the embodiments can be included in at least one embodiment of this application. The phrase appears in various places in the specification and does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. It is explicitly and implicitly understood by those of ordinary skill in the art that the embodiments described in this application can be combined with other embodiments without conflict.

[0062] Unless otherwise defined, the technical terms or scientific terms involved in this application shall have the ordinary meaning as understood by those of ordinary skill in the technical field to which this application belongs. The words such as "a", "an", "one", "the", and the like involved in this application do not indicate a limitation in quantity and can represent a singular or plural number. The terms "comprising", "including", "having", and any variations thereof involved in this application are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or device that includes a series of steps or modules (units) is not limited to the listed steps or units, but may further include unlisted steps or units, or may further include other steps or units inherent to these processes, methods, products, or devices. The terms "connected", "coupled", and the like involved in this application are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. The "plurality" involved in this application means two or more. "And / or" describes the association relationship of associated objects and indicates that three relationships may exist. For example, "A and / or B" may represent: A exists alone, A and B exist simultaneously, and B exists alone. The character " / " generally represents an "or" relationship between the associated objects before and after. The terms "first", "second", "third", etc. involved in this application are only used to distinguish similar objects and do not represent a specific order for the objects.

[0063] Embodiment 1

[0064] This embodiment relates to the tail gas recovery and treatment device in the present invention.

[0065] Such as Figure 1As shown in the figure, an exhaust gas recovery and treatment device includes a condensation unit 100, a liquid storage unit 200, a desorption and adsorption unit 300, a purification unit 400, a conveying unit 500, a first pressure relief unit 600, and a second pressure relief unit 700. Among them, the condensation unit 100 is connected to the upstream gas treatment equipment and is used for condensing the high-temperature gas after water washing to obtain a condensed gas and a condensed liquid; the liquid storage unit 200 is respectively connected to the condensation unit 100, the waste liquid treatment device, and the exhaust gas combustion treatment device, and is located downstream of the condensation unit 100 and is used for storing the condensed liquid; the desorption and adsorption unit 300 is connected to the liquid storage unit 200 and is located downstream of the liquid storage unit 200 and is used for adsorbing H2O in the condensed gas to obtain a dry gas; the purification unit 400 is respectively connected to the desorption and adsorption unit 300 and the exhaust gas combustion treatment device, and is located downstream of the desorption and adsorption unit 300 and is used for purifying the dry gas to obtain high-purity hydrogen; the conveying unit 500 is respectively connected to the purification unit 400 and the downstream semiconductor process equipment and is used for conveying the high-purity hydrogen to the downstream semiconductor process equipment; the first pressure relief unit 600 is respectively connected to the liquid storage unit 200 and the exhaust gas combustion treatment device and is used for relieving the pressure of the pipeline; the second pressure relief unit 700 is respectively connected to the conveying unit 500 and the exhaust gas combustion treatment device and is used for relieving the pressure of the pipeline.

[0066] As Figure 2 shown in the figure, the condensation unit 100 includes a condensation element 110 and a heat exchange element 120. Among them, the condensation element 110 is respectively connected to the upstream gas treatment equipment and the liquid storage unit 200 and is used for condensing the high-temperature gas after water washing to obtain a condensed gas and a condensed liquid; the heat exchange element 120 is connected to the condensation element 110 and is used for conveying a low-temperature liquid to the condensation element 110.

[0067] Specifically, the condensation element 110 includes a condenser, a first condensation pipeline, and a second condensation pipeline. Among them, the condenser is respectively connected to the upstream gas treatment equipment and the liquid storage unit 200 and is used for condensing the high-temperature gas after water washing and obtaining a condensed gas and a condensed liquid; the first end of the first condensation pipeline is connected to the upstream gas treatment equipment, and the second end of the first condensation pipeline is connected to the condenser and is used for conveying the high-temperature gas after water washing; the first end of the second condensation pipeline is connected to the condenser, and the second end of the second condensation pipeline is connected to the liquid storage unit 200 and is used for conveying the condensed liquid and the condensed gas.

[0068] More specifically, the condenser includes a condenser body, a first condensation inlet, a first condensation outlet, a second condensation inlet, a second condensation outlet, a first valve body, and a second valve body. Among them, the first condensation inlet is formed on the condenser body, and the first condensation inlet is communicated with the first condensation pipeline; the second condensation outlet is formed on the condenser body, and the first condensation outlet is communicated with the second condensation pipeline; the second condensation inlet is formed on the condenser body, and the second condensation inlet is communicated with the heat exchange element 120; the second condensation outlet is formed on the condenser body, and the second condensation outlet is communicated with the heat exchange element 120; the first valve body is communicated with the second condensation inlet and is used to control the communication between the second condensation inlet and the heat exchange element 120; the second valve body is communicated with the second condensation outlet and is used to control the communication between the second condensation inlet and the heat exchange element 120. In addition, the working environment of the condenser body is between 1 and 10 degrees Celsius, and the condenser body can liquefy the liquid molecules in the high-temperature gas.

[0069] In some of these embodiments, the condenser includes, but is not limited to, a water-cooled condenser.

[0070] More specifically, the first condensation pipeline includes a first condensation main pipeline and a first condensation branch pipeline. Among them, the first end of the first condensation main pipeline is communicated with the upstream gas treatment equipment, and the second end of the first condensation main pipeline is communicated with the first condensation branch pipeline; the first end of the first condensation branch pipeline is communicated with the second end of the first condensation main pipeline, and the second end of the first condensation branch pipeline is communicated with the first condensation inlet of the condenser. It should be noted that the first end and the second end of the first condensation main pipeline are respectively the two ends in its length direction; the first end and the second end of the first condensation branch pipeline are respectively the two ends in its length direction.

[0071] In some of these embodiments, the first condensation pipeline includes, but is not limited to, a stainless steel pipe.

[0072] More specifically, the second condensation pipeline includes a second condensation branch pipeline and a second condensation main pipeline. Among them, the first end of the second condensation branch pipeline is communicated with the first condensation outlet of the condenser, and the second end of the second condensation branch pipeline is communicated with the second condensation main pipeline; the first end of the second condensation main pipeline is communicated with the second end of the second condensation branch pipeline, and the second end of the second condensation main pipeline is communicated with the liquid storage unit 200. It should be noted that the first end and the second end of the second condensation branch pipeline are respectively the two ends in its length direction; the first end and the second end of the second condensation main pipeline are respectively the two ends in its length direction.

[0073] In some of these embodiments, the second condensation pipeline includes, but is not limited to, a stainless steel pipe.

[0074] Specifically, the heat exchange element 120 includes a water bath, a first heat exchange pipeline, and a second heat exchange pipeline. Among them, the water bath is communicated with the condenser through the first heat exchange pipeline and the second heat exchange pipeline; the first end of the first heat exchange pipeline is communicated with the water bath, and the second end of the first heat exchange pipeline is communicated with the condenser; the first end of the second heat exchange pipeline is communicated with the condenser, and the second end of the second heat exchange pipeline is communicated with the water bath.

[0075] More specifically, the water bath includes a water bath body, a water bath inlet, and a water bath outlet. Among them, the water bath inlet is formed on the water bath body, and the water bath inlet can be communicated with the first heat exchange pipeline; the water bath outlet is formed on the water bath body, and the water bath outlet can be communicated with the second heat exchange pipeline.

[0076] In some of these embodiments, the water bath includes, but is not limited to, a heat exchanger.

[0077] More specifically, the first end of the first heat exchange pipeline is communicated with the water bath outlet of the water bath body, and the second end of the first heat exchange pipeline is communicated with the second condensation inlet of the condenser body. It should be noted that the first end and the second end of the first heat exchange pipeline are respectively the two ends in its length direction.

[0078] In some of these embodiments, the first heat exchange pipeline includes, but is not limited to, a stainless steel pipe.

[0079] More specifically, the first end of the second heat exchange pipeline is communicated with the second condensation outlet of the condenser body, and the second end of the second heat exchange pipeline is communicated with the water bath inlet of the water bath. It should be noted that the first end and the second end of the second heat exchange pipeline are respectively the two ends in its length direction.

[0080] In some of these embodiments, the second heat exchange pipeline includes, but is not limited to, a stainless steel pipe.

[0081] Further, the condensation unit 100 further includes a first switching valve element 130. Among them, the first switching valve element 130 is arranged on the pipelines where the condensation element 110 is respectively communicated with the upstream gas treatment equipment, the liquid storage unit 200, and the heat exchange element 120, and is used to control the flow of these pipelines.

[0082] Specifically, the first switching valve element 130 includes a first manual diaphragm valve, a second manual diaphragm valve, a third manual diaphragm valve, and a fourth manual diaphragm valve. Among them, the first manual diaphragm valve is arranged on the first main condensation pipeline and is used to control the flow of the first main condensation pipeline; the second manual diaphragm valve is arranged on the first condensation branch pipeline and is used to control the flow of the first condensation branch pipeline; the third manual diaphragm valve is arranged on the second condensation branch pipeline and is used to control the flow of the second condensation branch pipeline; the fourth manual diaphragm valve is arranged on the second main condensation pipeline and is used to control the flow of the second main condensation pipeline.

[0083] In some of these embodiments, the first switching valve element 130 includes, but is not limited to, a diaphragm valve.

[0084] As Figure 2 shown, the liquid storage unit 200 includes a liquid storage element 210 and a constant temperature element 220. Among them, the liquid storage element 210 is respectively communicated with the condensation unit 100, the desorption and adsorption unit 300, the first pressure relief unit 600, the waste liquid treatment device, and the tail gas combustion treatment device, and is located downstream of the condensation unit 100 and upstream of the desorption and adsorption unit 300 for storing condensed liquid; the constant temperature element 220 is arranged on the liquid storage element 210 and covers the outer side wall of the liquid storage element 210 for maintaining the internal temperature of the liquid storage element 210 constant.

[0085] Specifically, the liquid storage element 210 includes a liquid storage tank, a first liquid storage pipeline, a second liquid storage pipeline, a third liquid storage pipeline, and a fourth liquid storage pipeline. Among them, the liquid storage tank is respectively communicated with the condensation unit 100, the desorption and adsorption unit 300, the waste liquid treatment device, and the tail gas combustion treatment device, and is located downstream of the condensation unit 100 and upstream of the desorption and adsorption unit 300 for storing condensed liquid; the first end of the first liquid storage pipeline is communicated with the condensation unit 100, and the second end of the first liquid storage pipeline is communicated with the liquid storage tank for transporting condensed liquid and condensed gas; the first end of the second liquid storage pipeline is communicated with the liquid storage tank, and the second end of the second liquid storage pipeline is communicated with the desorption and adsorption unit 300 for transporting condensed gas; the first end of the third liquid storage pipeline is communicated with the liquid storage tank, and the second end of the third liquid storage pipeline is communicated with the waste liquid treatment device for transporting condensed liquid; the first end of the fourth liquid storage pipeline is communicated with the second liquid storage pipeline, and the second end of the fourth liquid storage pipeline is communicated with the tail gas combustion treatment device for direct discharge in special cases.

[0086] More specifically, the liquid storage tank includes a liquid storage tank body, a first liquid storage port, a second liquid storage port, and a third liquid storage port. Among them, the first liquid storage port is formed at the top of the liquid storage tank body and can be communicated with the first liquid storage pipeline; the second liquid storage port is formed at the top of the liquid storage tank body and can be communicated with the second liquid storage pipeline; the third liquid storage port is formed at the bottom of the liquid storage tank body and can be communicated with the third liquid storage pipeline.

[0087] In some of these embodiments, the liquid storage tank includes, but is not limited to, a stainless steel tank.

[0088] More specifically, the first liquid storage pipeline includes a first main liquid storage pipeline and a first branched liquid storage pipeline. Among them, the first end of the first main liquid storage pipeline is communicated with the second end of the second main condensation pipeline, and the second end of the second main liquid storage pipeline is communicated with the first branched liquid storage pipeline; the first end of the second branched liquid storage pipeline is communicated with the second end of the second main liquid storage pipeline, and the second end of the second branched liquid storage pipeline is communicated with the first liquid storage port of the liquid storage tank body. It should be noted that the first end and the second end of the first main liquid storage pipeline are respectively the two ends in its length direction; the first end and the second end of the first branched liquid storage pipeline are respectively the two ends in its length direction.

[0089] In some of these embodiments, the first liquid storage pipeline includes, but is not limited to, a stainless steel pipe.

[0090] More specifically, the second liquid storage pipeline includes a second branched liquid storage pipeline and a second main liquid storage pipeline. Among them, the first end of the second branched liquid storage pipeline is communicated with the second liquid storage port of the liquid storage tank body, and the second end of the second branched liquid storage pipeline is communicated with the second main liquid storage pipeline; the first end of the second main liquid storage pipeline is communicated with the second end of the second branched liquid storage pipeline, and the second end of the second main liquid storage pipeline is communicated with the adsorption and desorption unit. It should be noted that the first end and the second end of the second branched liquid storage pipeline are respectively the two ends in its length direction; the first end and the second end of the second main liquid storage pipeline are respectively the two ends in its length direction.

[0091] In some of these embodiments, the second liquid storage pipeline includes, but is not limited to, a stainless steel pipe.

[0092] More specifically, the third liquid storage pipeline includes a third branched liquid storage pipeline and a third main liquid storage pipeline. Among them, the first end of the third branched liquid storage pipeline is communicated with the third liquid storage port of the liquid storage tank body, and the second end of the third branched liquid storage pipeline is communicated with the third main liquid storage pipeline; the first end of the third main liquid storage pipeline is communicated with the second end of the third branched liquid storage pipeline, and the second end of the third main liquid storage pipeline is communicated with the waste liquid treatment device. It should be noted that the first end and the second end of the third branched liquid storage pipeline are respectively the two ends in its length direction; the first end and the second end of the third main liquid storage pipeline are respectively the two ends in its length direction.

[0093] In some of these embodiments, the third liquid storage pipeline includes, but is not limited to, a stainless steel pipe.

[0094] More specifically, the first end of the fourth liquid storage pipeline is communicated with the second main liquid storage pipeline, and the second end of the fourth liquid storage pipeline is communicated with the tail gas combustion treatment device. It should be noted that the first end and the second end of the fourth liquid storage pipeline are respectively the two ends in its length direction.

[0095] In some of these embodiments, the fourth liquid storage pipeline includes, but is not limited to, a stainless steel pipe.

[0096] Specifically, the cooling coil of the constant temperature element 220 is wound around the outer wall of the liquid storage tank, and the temperature inside the liquid storage tank can be kept constant through the heat exchange between the cooling coil and the liquid storage tank.

[0097] In some of these embodiments, the constant temperature element 220 includes, but is not limited to, a constant temperature refrigeration compressor.

[0098] Furthermore, the liquid storage unit 200 further includes a second switching valve element 230. Among them, the second switching valve element 230 is arranged on the pipeline connecting the liquid storage element 210 with the condensation unit 100, the desorption and adsorption unit 300, and the waste liquid treatment device, and is used to control the flow of this pipeline.

[0099] Specifically, the second switching valve element 230 includes a fifth manual diaphragm valve, a sixth manual diaphragm valve, a seventh manual diaphragm valve, an eighth manual diaphragm valve, a ninth manual diaphragm valve, and a tenth manual diaphragm valve. Among them, the fifth manual diaphragm valve is arranged on the first liquid storage branch pipeline and is used to control the flow of the first liquid storage branch pipeline; the sixth manual diaphragm valve is arranged on the second liquid storage branch pipeline and is used to control the flow of the second liquid storage branch pipeline; the seventh manual diaphragm valve is arranged on the second main liquid storage pipeline and is used to control the flow of the second main liquid storage pipeline; the eighth manual diaphragm valve is arranged on the third liquid storage branch pipeline and is used to control the flow of the third liquid storage branch pipeline; the ninth manual diaphragm valve and the tenth manual diaphragm valve are arranged on the fourth liquid storage pipeline, and the tenth manual diaphragm valve is located downstream of the ninth manual diaphragm valve and is used to control the flow of the fourth liquid storage pipeline.

[0100] In some of these embodiments, the second switching valve element 230 includes, but is not limited to, a diaphragm valve.

[0101] As Figure 2 shown, the desorption and adsorption unit 300 includes an adsorption element 310 and a desorption element 320. Among them, the adsorption element 310 is respectively connected with the liquid storage unit 200 and the purification unit 400, and is located downstream of the liquid storage unit 200 and upstream of the purification unit 400, and is used to filter H2O in the condensed gas and obtain dry gas; the desorption element 320 is connected with the adsorption element 310 and is used to transport high-temperature nitrogen to the adsorption element 310.

[0102] Specifically, the adsorption element 310 includes an adsorption tank, a first adsorption pipeline, and a second adsorption pipeline. Among them, the first end of the first adsorption pipeline is connected with the liquid storage unit 200, and the second end of the first adsorption pipeline is connected with the adsorption tank and is used to transport the condensed gas; the first end of the second adsorption pipeline is connected with the adsorption tank, and the second end of the second adsorption pipeline is connected with the purification unit 400 and is used to transport the dry gas.

[0103] More specifically, the adsorption tank includes an adsorption tank body, a first adsorption port, a second adsorption port, a third adsorption port, and a fourth adsorption port. Among them, the first adsorption port is formed on the adsorption tank body, and the first adsorption port can be connected to the first adsorption pipeline; the second adsorption port is formed on the adsorption tank body, and the second adsorption port can be connected to the second adsorption pipeline; the third adsorption port is formed on the adsorption tank body, and the third adsorption port can be connected to the desorption element 320; the fourth adsorption port is formed on the adsorption tank body, and the fourth adsorption port can be connected to the waste collection device.

[0104] In some of these embodiments, the adsorption tank includes, but is not limited to, an activated carbon adsorption tank.

[0105] More specifically, the first adsorption pipeline includes a first adsorption main pipeline and a first adsorption branch pipeline. Among them, the first end of the first adsorption main pipeline is connected to the second liquid storage main pipeline, and the second end of the first adsorption main pipeline is connected to the first adsorption branch pipeline; the first end of the first adsorption branch pipeline is connected to the second end of the first adsorption main pipeline, and the second end of the first adsorption branch pipeline is connected to the first adsorption port of the adsorption tank body. It should be noted that the first end and the second end of the first adsorption main pipeline are respectively the two ends in its length direction; the first end and the second end of the first adsorption branch pipeline are respectively the two ends in its length direction.

[0106] In some of these embodiments, the first adsorption pipeline includes, but is not limited to, a stainless steel pipe.

[0107] More specifically, the second adsorption pipeline includes a second adsorption branch pipeline and a second adsorption main pipeline. Among them, the first end of the second adsorption branch pipeline is connected to the second adsorption port of the adsorption tank body, and the second end of the second adsorption branch pipeline is connected to the second adsorption main pipeline; the first end of the second adsorption main pipeline is connected to the second end of the second adsorption branch pipeline, and the second end of the second adsorption main pipeline is connected to the waste liquid treatment device. It should be noted that the first end and the second end of the second adsorption branch pipeline are respectively the two ends in its length direction; the first end and the second end of the second adsorption main pipeline are respectively the two ends in its length direction.

[0108] In some of these embodiments, the second adsorption pipeline includes, but is not limited to, a stainless steel pipe.

[0109] Specifically, the desorption element 320 includes a desorption gas source, a first desorption pipeline, and a second desorption pipeline. Among them, the first end of the first desorption pipeline is connected to the nitrogen source, the second end of the first desorption pipeline is connected to the adsorption tank, and is used to transport high-temperature nitrogen; the first end of the second desorption pipeline is connected to the adsorption tank, and the second end of the second desorption pipeline is connected to the waste collection device, and is used to transport waste.

[0110] In some of these embodiments, the desorption gas source includes, but is not limited to, a high-temperature nitrogen source.

[0111] More specifically, the first end of the first desorption pipeline is communicated with the desorption gas source, and the second end of the first desorption pipeline is communicated with the third adsorption port of the adsorption tank body. It should be noted that the first end and the second end of the first adsorption pipeline are respectively the two ends in its length direction.

[0112] In some of these embodiments, the first desorption pipeline includes, but is not limited to, a stainless steel pipe.

[0113] More specifically, the first end of the second adsorption pipeline is communicated with the fourth adsorption port of the adsorption tank body, and the second end of the second adsorption pipeline is communicated with the waste collection device. It should be noted that the first end and the second end of the second adsorption pipeline are respectively the two ends in its length direction.

[0114] In some of these embodiments, the second desorption pipeline includes, but is not limited to, a stainless steel pipe.

[0115] Furthermore, the desorption and adsorption unit 300 further includes a third switching valve element 330. Among them, the third switching valve element 330 is arranged on the pipeline communicating the adsorption element 310 with the liquid storage unit 200, the purification unit 400, and the desorption element 320, and is used to control the flow of this pipeline.

[0116] Specifically, the third switching valve element 330 includes an eleventh manual diaphragm valve, a twelfth manual diaphragm valve, and a thirteenth manual diaphragm valve. Among them, the eleventh manual diaphragm valve is arranged on the first adsorption branch pipeline and is used to control the flow of the first adsorption branch pipeline; the twelfth manual diaphragm valve is arranged on the second adsorption branch pipeline and is used to control the flow of the second adsorption branch pipeline; the thirteenth manual diaphragm valve is arranged on the second adsorption main pipeline and is used to control the flow of the second adsorption main pipeline.

[0117] In some of these embodiments, the second switching valve element 230 includes, but is not limited to, a diaphragm valve.

[0118] Furthermore, the desorption and adsorption unit 300 further includes a first check valve element 340. Among them, the first check valve element 340 is arranged on the pipeline communicating the adsorption element 310 with the purification unit 400, and is used to prevent the gas inside this pipeline from flowing backward.

[0119] Specifically, the first check valve element 340 includes a first check valve. Among them, the first check valve is arranged on the second adsorption main pipeline and is located upstream of the thirteenth manual diaphragm valve, and is used to prevent the gas inside the second adsorption main pipeline from flowing backward.

[0120] In some of these embodiments, the first check valve element 340 includes, but is not limited to, a check valve.

[0121] Such as Figure 2As shown, the purification unit 400 includes a purification element 410. Among them, the purification element 410 is respectively connected to the desorption adsorption unit 300, the conveying unit 500, and the tail gas combustion treatment device, and is located downstream of the desorption adsorption unit 300 and upstream of the conveying unit 500, and is used to filter the impurities in the dry gas and obtain high-purity hydrogen.

[0122] Specifically, the purification element 410 includes a separation membrane tank, a first purification pipeline, a second purification pipeline, and a third purification pipeline. Among them, the separation membrane tank is respectively connected to the desorption adsorption unit 300, the conveying unit 500, and the tail gas combustion treatment equipment, and is located downstream of the desorption adsorption unit 300 and upstream of the conveying unit 500, and is used to filter the impurities in the dry gas and obtain high-purity hydrogen; the first end of the first purification pipeline is connected to the desorption adsorption unit 300, and the second end of the first purification pipeline is connected to the separation membrane tank, and is used to convey the dry gas; the first end of the second purification pipeline is connected to the separation membrane tank, and the second end of the second purification pipeline is connected to the conveying unit 500, and is used to convey high-purity hydrogen; the first end of the third purification pipeline is connected to the separation membrane tank, and the second end of the third purification pipeline is connected to the tail gas combustion treatment equipment, and is used to convey the impurities.

[0123] More specifically, the separation membrane tank includes a separation membrane tank body, a first purification port, a second purification port, and a third purification port. Among them, the first purification port is formed at the bottom of the separation membrane tank body, and the first purification port can be connected to the first purification pipeline; the second purification port is formed at the top of the separation membrane tank body, and the second purification port can be connected to the second purification pipeline; the third purification port is formed at the top of the separation membrane tank body, and the third purification port can be connected to the third purification pipeline.

[0124] In some of these embodiments, the separation membrane tank includes, but is not limited to, a small molecule separation membrane tank.

[0125] More specifically, the first purification pipeline includes a first purification main pipeline and a first purification branch pipeline. Among them, the first end of the first purification main pipeline is connected to the second end of the second adsorption main pipeline, and the second end of the first purification main pipeline is connected to the first purification branch pipeline; the first end of the first purification branch pipeline is connected to the second end of the first purification main pipeline, and the second end of the first purification branch pipeline is connected to the first purification port of the separation membrane tank body. It should be noted that the first end and the second end of the first purification main pipeline are respectively the two ends in its length direction; the first end and the second end of the first purification branch pipeline are respectively the two ends in its length direction.

[0126] In some of these embodiments, the first purification pipeline includes, but is not limited to, a stainless steel pipe.

[0127] More specifically, the second purification pipeline includes a second purification branch pipeline and a second purification main pipeline. Among them, the first end of the second purification branch pipeline is communicated with the second purification port of the separation membrane tank body, and the second end of the second purification branch pipeline is communicated with the second purification main pipeline; the first end of the second purification main pipeline is communicated with the second end of the second purification branch pipeline, and the second end of the second purification main pipeline is communicated with the conveying unit 500. It should be noted that the first end and the second end of the second purification branch pipeline are respectively the two ends in its length direction; the first end and the second end of the second purification main pipeline are respectively the two ends in its length direction.

[0128] In some of these embodiments, the second purification pipeline includes, but is not limited to, a stainless steel pipe.

[0129] More specifically, the first end of the third purification pipeline is communicated with the third purification port of the separation membrane tank body, and the second end of the third purification pipeline is communicated with the tail gas combustion treatment device. It should be noted that the first end and the second end of the third purification pipeline are respectively the two ends in its length direction.

[0130] In some of these embodiments, the third purification pipeline includes, but is not limited to, a stainless steel pipe.

[0131] Furthermore, the purification unit 400 further includes a fourth switching valve element 420. Among them, the fourth switching valve element 420 is arranged on the pipeline where the purification element 410 is communicated with the desorption and adsorption unit 300, the conveying unit 500, and the tail gas combustion treatment device, and is used to control the flow of this pipeline.

[0132] Specifically, the fourth switching valve element 420 includes a fourteenth manual diaphragm valve, a fifteenth manual diaphragm valve, a sixteenth manual diaphragm valve, and a seventeenth manual diaphragm valve. Among them, the fourteenth manual diaphragm valve is arranged on the first purification branch pipeline and is used to control the flow of the first purification branch pipeline; the fifteenth manual diaphragm valve is arranged on the second purification branch pipeline and is used to control the flow of the second purification branch pipeline; the sixteenth manual diaphragm valve is arranged on the second purification main pipeline and is used to control the flow of the second purification main pipeline; the seventeenth manual diaphragm valve is arranged on the third purification pipeline and is used to control the flow of the third purification pipeline.

[0133] In some of these embodiments, the fourth switching valve element 420 includes, but is not limited to, a diaphragm valve.

[0134] Furthermore, the purification unit 400 further includes a second one-way valve element 430. Among them, the second one-way valve element 430 is arranged on the pipeline where the purification element 410 is communicated with the tail gas combustion treatment device, and is used to prevent the gas inside this pipeline from flowing back.

[0135] Specifically, the second one-way valve element 430 includes a second one-way valve. The second one-way valve is disposed in the third purification pipeline and downstream of the seventeenth manual diaphragm valve, and is used to prevent the gas inside the third purification pipeline from flowing backward.

[0136] In some of these embodiments, the second one-way valve element 430 includes, but is not limited to, a one-way valve.

[0137] As Figure 2 shown, the conveying unit 500 includes a conveying element 510 and a vacuum element 520. The conveying element 510 is respectively connected to the purification unit 400, the second pressure relief unit 700, and a downstream semiconductor process device, and is used to convey high-purity hydrogen to the downstream semiconductor process device; the vacuum element 520 is disposed on the conveying element 510 and is used to provide a vacuum negative pressure at the connection between the purification unit 400 and the conveying element 510.

[0138] Specifically, the conveying element 510 includes a first conveying pipeline and a second conveying pipeline. The first end of the first conveying pipeline is connected to the purification unit 400, and the second end of the first conveying pipeline is connected to the downstream semiconductor process device, and is used to convey high-purity hydrogen; the first end of the second conveying pipeline is connected to the first conveying pipeline and is upstream of the vacuum element 520, and the second end of the second conveying pipeline is connected to the first conveying pipeline and is downstream of the vacuum element 520, and is used to convey high-purity hydrogen.

[0139] More specifically, the first end of the first conveying pipeline is connected to the second end of the second purification main pipeline, and the second end of the first conveying pipeline is connected to the downstream semiconductor process device. It should be noted that the first end and the second end of the first conveying pipeline are respectively the two ends in its length direction.

[0140] In some of these embodiments, the first conveying pipeline includes, but is not limited to, a stainless steel pipe.

[0141] More specifically, the second conveying pipeline can discharge the gas in the first conveying pipeline to the downstream semiconductor process device when the vacuum element 520 is being repaired. It should be noted that the first end and the second end of the second conveying pipeline are respectively the two ends in its length direction.

[0142] In some of these embodiments, the second conveying pipeline includes, but is not limited to, a stainless steel pipe.

[0143] Specifically, the vacuum element 520 is disposed on the first conveying pipeline and is between the connections at both ends of the first conveying pipeline and the second conveying pipeline.

[0144] In some of these embodiments, the vacuum element 520 includes, but is not limited to, a vacuum pump.

[0145] Further, the conveying unit 500 further includes a fifth switching valve element 530. Among them, the fifth switching valve element 530 is arranged on the conveying element 510 and is used to control the flow of the conveying element 510.

[0146] Specifically, the fifth switching valve element 530 includes an eighteenth manual diaphragm valve, a nineteenth manual diaphragm valve, a twentieth manual diaphragm valve, a twenty-first manual diaphragm valve, and a pneumatic diaphragm valve. Among them, the eighteenth manual diaphragm valve is arranged on the first conveying pipeline and is located downstream of the connection between the first end of the second conveying pipeline and the first conveying pipeline; the nineteenth manual diaphragm valve is arranged on the first conveying pipeline and is located upstream of the connection between the second end of the second conveying pipeline and the first conveying pipeline; the twentieth manual diaphragm valve is arranged on the first conveying pipeline and is located downstream of the connection between the second end of the second conveying pipeline and the first conveying pipeline; the pneumatic diaphragm valve is arranged on the first conveying pipeline and is located downstream of the twentieth manual diaphragm valve; the twenty-first manual diaphragm valve is arranged on the second conveying pipeline and is used to control the flow of the second conveying pipeline.

[0147] In some of these embodiments, the fifth switching valve element 530 includes, but is not limited to, a diaphragm valve.

[0148] Further, the conveying unit 500 further includes a third check valve element 540. Among them, the third check valve element 540 is arranged on the conveying element 510 and is used to prevent the gas inside the conveying element 510 from flowing back.

[0149] Specifically, the third check valve element 540 includes a third check valve. Among them, the third check valve is arranged on the first conveying pipeline and is located between the twenty-first manual diaphragm valve and the pneumatic diaphragm valve and is used to prevent the gas inside the first conveying pipeline from flowing back.

[0150] In some of these embodiments, the third check valve element 540 includes, but is not limited to, a check valve.

[0151] As Figure 2 shown, the first pressure relief unit 600 includes a first pressure relief element 610. Among them, the first pressure relief element 610 is respectively connected to the liquid storage unit 200 and the tail gas combustion treatment device and is used to relieve the pressure of the liquid storage unit 200.

[0152] Specifically, the first pressure relief element 610 includes a first pressure relief pipeline and a first pressure relief valve. Among them, the first end of the first pressure relief pipeline is connected to the fourth liquid storage pipeline, the connection between the first end of the first pressure relief pipeline and the fourth liquid storage pipeline is located between the ninth manual diaphragm valve and the tenth manual diaphragm valve, and the second end of the first pressure relief pipeline is connected to the tail gas combustion treatment device; the first pressure relief valve is arranged on the first pressure relief pipeline and is used to relieve the pressure of the liquid storage tank through the first pressure relief pipeline and the second liquid storage pipeline.

[0153] It should be noted that the first end and the second end of the first pressure relief pipeline are respectively the two ends in its length direction.

[0154] In some of these embodiments, the first pressure relief pipeline includes, but is not limited to, a stainless steel pipe.

[0155] In some of these embodiments, the first pressure relief valve includes, but is not limited to, a spring-type pressure relief valve.

[0156] Furthermore, the first pressure relief unit 600 further includes a fourth check valve element 620. Among them, the fourth check valve element 620 is arranged on the pipeline connecting the first pressure relief element 610 and the tail gas combustion treatment device, and is used to prevent the gas inside the pipeline from flowing back.

[0157] Specifically, the fourth check valve element 620 includes a fourth check valve. Among them, the fourth check valve is arranged on the first pressure relief pipeline and is located downstream of the first pressure relief valve, and is used to prevent the gas inside the first pressure relief pipeline from flowing back.

[0158] In some of these embodiments, the fourth check valve element 620 includes, but is not limited to, a check valve.

[0159] As Figure 2 shown, the second pressure relief unit 700 includes a second pressure relief element 710. Among them, the second pressure relief element 710 is respectively connected to the conveying unit 500 and the tail gas combustion treatment device, and is used to relieve the pressure of the conveying unit 500.

[0160] Specifically, the second pressure relief element 710 includes a second pressure relief pipeline and a second pressure relief valve. Among them, the first end of the second pressure relief pipeline is connected to the first conveying pipeline, the connection between the first end of the second pressure relief pipeline and the first conveying pipeline is located between the nineteenth manual diaphragm valve and the twentieth manual diaphragm valve, and the second end of the second pressure relief pipeline is connected to the tail gas combustion treatment device; the second pressure relief valve is arranged on the second pressure relief pipeline and is used to relieve the pressure of the first conveying pipeline through the second pressure relief pipeline.

[0161] It should be noted that the first end and the second end of the second pressure relief pipeline are respectively the two ends in its length direction.

[0162] In some of these embodiments, the second pressure relief pipeline includes, but is not limited to, a stainless steel pipe.

[0163] In some of these embodiments, the second pressure relief valve includes, but is not limited to, a spring-type pressure relief valve.

[0164] Furthermore, the second pressure relief unit 700 further includes a sixth switching valve element 720. Among them, the sixth switching valve element 720 is arranged on the second pressure relief element 710 and is used to control the flow of the second pressure relief element 710.

[0165] Specifically, the sixth switching valve element 720 includes a twenty-second manual diaphragm valve. The twenty-second manual diaphragm valve is disposed in the second pressure relief pipeline and upstream of the second pressure relief valve, and is used to control the flow of the second pressure relief pipeline.

[0166] In some embodiments thereof, the sixth switching valve element 720 includes, but is not limited to, a diaphragm valve.

[0167] Furthermore, the second pressure relief unit 700 further includes a fifth check valve element 730. The fifth check valve element 730 is disposed on the pipeline connecting the second pressure relief element 710 and the tail gas combustion treatment device, and is used to prevent the gas inside the pipeline from flowing backward.

[0168] Specifically, the fifth check valve element 730 includes a fifth check valve. The fifth check valve is disposed in the second pressure relief pipeline and downstream of the second pressure relief valve, and is used to prevent the gas inside the second pressure relief pipeline from flowing backward.

[0169] In some embodiments thereof, the fifth check valve element 730 includes, but is not limited to, a check valve.

[0170] The usage method of this embodiment is as follows:

[0171] (1) Condensation

[0172] Open the first switching valve element 130, so that the high-temperature gas in the upstream gas treatment equipment can flow to the condensation element 110 and the low-temperature liquid in the heat exchange element 120 can flow to the condensation element 110, so that the condensation element 110 can condense the high-temperature gas after water washing to obtain condensed gas and condensed liquid;

[0173] Open the second switching valve element 230, so that the condensed liquid generated by the condensation element 110 can flow to the liquid storage element 210.

[0174] (2) Desorption and adsorption

[0175] Open the third switching valve element 330, so that the condensed gas in the liquid storage element 210 can flow to the adsorption element 310 and the high-temperature nitrogen in the desorption element 320 is transported to the adsorption element 310, so as to remove the liquid molecules in the condensed gas and obtain dry gas.

[0176] (3) Purification

[0177] Open the fourth switching valve element 420, so that the dry gas processed by the adsorption element 310 flows to the purification element 410. The purification element 410 only allows small molecule hydrogen to pass through, so as to remove the impurities in the dry gas and obtain high-purity hydrogen.

[0178] (4) Transportation

[0179] Open the fifth switching valve element 530 so that high-purity hydrogen can flow through the conveying element 510 to the downstream semiconductor process equipment, thereby performing subsequent process flows.

[0180] (V) Pressure relief

[0181] In the case where the internal pressure of the liquid storage element 210 is too high, open the first pressure relief element 610, thereby conveying the condensed gas inside the liquid storage element 210 to the tail gas combustion treatment device to achieve pressure relief of the liquid storage element 210;

[0182] In the case where the internal pressure of the conveying element 510 is too high, open the second pressure relief element 710, thereby conveying the high-purity hydrogen inside the conveying element 510 to the tail gas combustion treatment device to achieve pressure relief of the conveying element 510.

[0183] The advantages of this embodiment are as follows. By connecting the condensation unit with the upstream gas treatment equipment and the liquid storage unit, all the liquid molecules carried in the high-temperature gas can be condensed, and the condensed liquid is stored inside the liquid storage unit; by connecting the desorption and adsorption unit with the liquid storage unit, the liquid molecules in the condensed gas can be further removed to ensure the dryness of the condensed gas; by connecting the purification unit with the desorption and adsorption unit, only small-molecule hydrogen can pass through the purification unit, thereby removing the impurities in the dry gas and conveying the impurities to the tail gas combustion treatment device for treatment, further improving the purity of hydrogen; by connecting the first pressure relief unit with the liquid storage unit and the tail gas combustion treatment device respectively, and connecting the second pressure relief unit with the conveying unit and the tail gas combustion treatment device respectively, the liquid storage unit and the conveying unit can be pressure-relieved in the case where the pressure in the device pipeline is too high, ensuring the safety during the operation of the overall device.

[0184] Embodiment 2

[0185] This embodiment is a variant embodiment of Embodiment 1.

[0186] As Figure 3 shown, the condensation unit 100 further includes a first monitoring element 140. Among them, the first monitoring element 140 is arranged on the pipeline between the condensation element 110 and the liquid storage unit 200 for real-time monitoring of the temperature inside the pipeline.

[0187] Specifically, the first monitoring element 140 is connected to the second condensation branch pipeline and is located upstream of the third manual diaphragm valve.

[0188] In some of these embodiments, the first monitoring element 140 includes, but is not limited to, a temperature sensor.

[0189] As Figure 3As shown, the liquid storage unit 200 further includes a second monitoring element 240 and / or a third monitoring element 250 and / or a fourth monitoring element 260 and / or a fifth monitoring element 270. Among them, the second monitoring element 240 is communicated with the liquid storage element 210 for real-time monitoring of the temperature inside the liquid storage element 210; the third monitoring element 250 is arranged inside the liquid storage element 210 for real-time monitoring of the liquid level inside the liquid storage element 210; the fourth monitoring element 260 is arranged on the pipeline where the liquid storage element 210 is communicated with the desorption adsorption unit 300 for real-time monitoring of the temperature inside the pipeline; the fifth monitoring element is arranged on the pipeline where the liquid storage element 210 is communicated with the desorption adsorption unit 300 for real-time monitoring of the pressure inside the pipeline.

[0190] Specifically, the second monitoring element 240 is communicated with the liquid storage tank for real-time monitoring of the temperature inside the liquid storage tank; the third monitoring element 250 is installed inside the liquid storage tank for real-time monitoring of the liquid level inside the liquid storage tank; the fourth monitoring element 260 is communicated with the second main liquid storage pipeline and is located downstream of the seventh manual diaphragm valve for real-time monitoring of the temperature inside the second main liquid storage pipeline; the fifth monitoring element 270 is communicated with the second main liquid storage pipeline and is located downstream of the fourth monitoring element 260 for real-time monitoring of the pressure inside the second main liquid storage pipeline.

[0191] In some of the embodiments, the second monitoring element 240 includes, but is not limited to, a temperature sensor.

[0192] In some of the embodiments, the third monitoring element 250 includes, but is not limited to, a float sensor.

[0193] In some of the embodiments, the fourth monitoring element 260 includes, but is not limited to, a temperature sensor.

[0194] In some of the embodiments, the fifth monitoring element 270 includes, but is not limited to, a pressure sensor.

[0195] As Figure 3 shown, the desorption adsorption unit 300 further includes a sixth monitoring element 350. Among them, the sixth monitoring element 350 is arranged on the pipeline where the adsorption element 310 is communicated with the purification unit 400 for real-time monitoring of the pressure inside the pipeline.

[0196] Specifically, the sixth monitoring element 350 is arranged on the second main adsorption pipeline and is located upstream of the first one-way valve element 340 for real-time monitoring of the pressure inside the second main adsorption pipeline.

[0197] In some of the embodiments, the sixth monitoring element 350 includes, but is not limited to, a pressure sensor.

[0198] As Figure 3As shown, the purification unit 400 further includes a seventh monitoring element 440 and / or an eighth monitoring element 450. Among them, the seventh monitoring element 440 is connected to the purification element 410 for real-time monitoring of the pressure inside the purification element 410; the eighth monitoring element 450 is disposed on the pipeline where the purification element 410 is connected to the conveying unit 500 for real-time monitoring of the pressure inside the pipeline.

[0199] Specifically, the seventh monitoring element 440 is connected to the separation membrane tank for real-time monitoring of the pressure inside the separation membrane tank; the eighth monitoring element 450 is disposed on the second main purification pipeline for real-time monitoring of the pressure inside the second main purification pipeline.

[0200] In some embodiments, the seventh monitoring element 440 includes, but is not limited to, a pressure sensor.

[0201] In some embodiments, the eighth monitoring element 450 includes, but is not limited to, a pressure sensor.

[0202] As Figure 3 shown, the conveying unit 500 further includes a ninth monitoring element 550. Among them, the ninth monitoring element 550 is disposed on the pipeline where the conveying element 510 is connected to the downstream semiconductor process equipment for real-time monitoring of the pressure inside the pipeline.

[0203] Specifically, the ninth monitoring element 550 is connected to the first conveying pipeline and is located between the twenty-first manual diaphragm valve and the third one-way valve for real-time monitoring of the pressure inside the first conveying pipeline.

[0204] In some embodiments, the ninth monitoring element 550 includes, but is not limited to, a pressure sensor.

[0205] The usage method, advantages of this embodiment are the same as those of Embodiment 1 and will not be elaborated here.

[0206] Embodiment 3

[0207] This embodiment is a variant embodiment of Embodiments 1 - 2.

[0208] As Figure 4 shown, the tail gas recovery and treatment device further includes a gas analysis unit 800. Among them, the gas analysis unit 800 is connected to the conveying unit 500 and is located at the connection of the conveying unit 500 and the downstream semiconductor process equipment for analyzing the gas input into the downstream semiconductor process equipment.

[0209] Specifically, the gas analysis unit 800 is connected to the first conveying pipeline and is located between the third one-way valve and the twenty-first manual diaphragm valve to test whether the purified high-purity hydrogen meets the requirements.

[0210] It should be noted that the preset requirement is that the concentration of high-purity hydrogen is between 4N and 6N.

[0211] In some of these embodiments, the gas analysis unit 800 includes, but is not limited to, a gas analyzer.

[0212] The usage method and advantages of this embodiment are the same as those of Embodiment 1, and will not be elaborated here.

[0213] Embodiment 4

[0214] This embodiment is a variant embodiment of Embodiments 1 to 3.

[0215] There are at least two of the condensation unit 100, the liquid storage unit 200, the desorption and adsorption unit 300, the purification unit 400, and the first pressure relief unit 600. Among them, several condensation units 100 are arranged in parallel, several liquid storage units 200 are arranged in parallel, several desorption and adsorption units 300 are arranged in parallel, and several purification units 400 are arranged in parallel; the first pressure relief unit 600 is respectively connected to the corresponding liquid storage unit 200.

[0216] In some of these embodiments, there are two of the condensation unit 100, the liquid storage unit 200, the desorption and adsorption unit 300, the purification unit 400, and the first pressure relief unit 600. Among them, two condensation units 100 are arranged in parallel, two liquid storage units 200 are arranged in parallel, two desorption and adsorption units 300 are arranged in parallel, and two purification units 400 are arranged in parallel; the two first pressure relief units 600 are respectively connected to the corresponding liquid storage units 200.

[0217] It should be noted that in the case where one condensation unit 100 needs to be repaired, it can be switched to another condensation unit 100.

[0218] It should be noted that in the case where one liquid storage unit 200 needs to be repaired, it can be switched to another liquid storage unit 200.

[0219] It should be noted that in the case where one desorption and adsorption unit 300 needs to be repaired, it can be switched to another desorption and adsorption unit 300.

[0220] It should be noted that in the case where one purification unit 400 needs to be repaired, it can be switched to another purification unit 400.

[0221] In some of these embodiments, the two condensation units 100 share a first main condensation pipeline.

[0222] In some of these embodiments, the two condensation units 100 share a second main condensation pipeline.

[0223] In some of these embodiments, the two liquid storage units 200 share a first main liquid storage pipeline.

[0224] In some of these embodiments, two liquid storage units 200 share a second main liquid storage pipeline.

[0225] In some of these embodiments, two liquid storage units 200 share a third main liquid storage pipeline.

[0226] In some of these embodiments, two desorption and adsorption units 300 share a first main adsorption pipeline.

[0227] In some of these embodiments, two desorption and adsorption units 300 share a second main adsorption pipeline.

[0228] In some of these embodiments, two purification units 400 share a first main purification pipeline.

[0229] In some of these embodiments, two purification units 400 share a second main purification pipeline.

[0230] The usage method and advantages of this embodiment are the same as those of Embodiment 1, and will not be elaborated here.

[0231] Embodiment 5

[0232] This embodiment relates to the tail gas recovery and treatment method in the present invention, and is applied to the tail gas recovery and treatment device described in Embodiments 1 to 4.

[0233] A tail gas recovery and treatment method includes:

[0234] The condensation unit 100 obtains high-temperature gas and condenses the high-temperature gas to obtain condensed gas and condensed liquid;

[0235] The desorption and adsorption unit 300 obtains the condensed gas and adsorbs H2O in the condensed gas to obtain dry gas;

[0236] The purification unit 400 obtains the filtered gas and purifies the dry gas to obtain high-purity hydrogen;

[0237] Wherein, when the pressure inside the liquid storage unit 200 is too high, the first pressure relief unit 600 relieves the pressure of the liquid storage unit 200;

[0238] When the pressure inside the conveying unit 500 is too high, the second pressure relief unit 700 relieves the pressure of the conveying unit 500.

[0239] Furthermore, the tail gas recovery and treatment method includes:

[0240] (1) Condensation

[0241] Open the first switching valve element 130 so that the high-temperature gas in the upstream gas treatment equipment can flow to the condensation element 110 and the low-temperature liquid in the heat exchange element 120 can flow to the condensation element 110, so that the condensation element 110 can condense the high-temperature gas after water washing to obtain condensed gas and condensed liquid;

[0242] Open the second switching valve element 230 so that the condensed liquid generated by the condensation element 110 can flow to the liquid storage element 210.

[0243] (II) Desorption and adsorption

[0244] Open the third switching valve element 330 so that the condensed gas in the liquid storage element 210 can flow to the adsorption element 310 and the desorption element 320 conveys high-temperature nitrogen to the adsorption element 310, thereby removing the liquid molecules in the condensed gas and obtaining dry gas.

[0245] (III) Purification

[0246] Open the fourth switching valve element 420 so that the dry gas processed by the adsorption element 310 flows to the purification element 410. The purification element 410 only allows small molecule hydrogen to pass through, thereby removing the impurities in the dry gas and obtaining high-purity hydrogen.

[0247] (IV) Transportation

[0248] Open the fifth switching valve element 530 so that the high-purity hydrogen can flow through the transportation element 510 to the downstream semiconductor process equipment, thereby performing subsequent process flows.

[0249] (V) Pressure relief

[0250] In the case that the internal pressure of the liquid storage element 210 is too high, open the first pressure relief element 610, thereby conveying the condensed gas inside the liquid storage element 210 to the tail gas combustion treatment device to realize the pressure relief of the liquid storage element 210;

[0251] In the case that the internal pressure of the transportation element 510 is too high, open the second pressure relief element 710, thereby conveying the high-purity hydrogen inside the transportation element 510 to the tail gas combustion treatment device to realize the pressure relief of the transportation element 510.

[0252] More specifically, the tail gas recovery and treatment method of this embodiment is as follows:

[0253] (1) Open the first valve body and the second valve body so that the low-temperature liquid in the water bath flows to the condenser;

[0254] (2) Open the first manual diaphragm valve and the second manual diaphragm valve so that the high-temperature gas flows to the condenser, and the condenser condenses the high-temperature gas to obtain condensed liquid and condensed gas;

[0255] (3) Open the third manual diaphragm valve, the fourth manual diaphragm valve, and the fifth manual diaphragm valve, so that the condensed liquid and the condensed gas flow towards the liquid storage tank, and the liquid storage tank can store the condensed liquid;

[0256] (4) Open the sixth manual diaphragm valve, the seventh manual diaphragm valve, and the eleventh manual diaphragm valve, so that the condensed gas can flow towards the adsorption tank, and the adsorption tank can adsorb the liquid molecules in the condensed gas and obtain dry gas;

[0257] (5) Open the twelfth manual diaphragm valve, the thirteenth manual diaphragm valve, and the fourteenth manual diaphragm valve, so that the dry gas can flow towards the separation membrane tank, and the separation membrane tank only allows small molecule hydrogen to pass through and obtain high-purity hydrogen and miscellaneous gas;

[0258] (6) Open the fifteenth manual diaphragm valve and the sixteenth manual diaphragm valve, so that the high-purity hydrogen can lead to the first delivery pipeline;

[0259] (7) Start the vacuum pump and open the eighteenth manual diaphragm valve, the nineteenth manual diaphragm valve, the twentieth manual diaphragm valve, and the pneumatic diaphragm valve. The vacuum pump forms a vacuum negative pressure in the first delivery pipeline, and the high-purity hydrogen can flow through the first delivery pipeline to the downstream semiconductor process equipment.

[0260] Further, the tail gas recovery and treatment method of this embodiment further includes:

[0261] (8) When the liquid level inside the liquid storage tank monitored by the third monitoring element 250 exceeds the preset threshold, open the eighth manual diaphragm valve, so that the liquid inside the liquid storage tank can be discharged to the waste liquid treatment device;

[0262] (9) When it is necessary to evacuate the gas inside the liquid storage tank, open the ninth manual diaphragm valve and the tenth manual diaphragm valve, so that the gas inside the liquid storage tank is discharged to the tail gas combustion treatment device;

[0263] (10) When the pressure inside the separation membrane tank monitored by the seventh monitoring element 440 is too high, open the seventeenth manual diaphragm valve, so that the miscellaneous gas in the separation membrane tank can flow towards the tail gas combustion treatment device;

[0264] (11) When the vacuum pump needs to be repaired, open the twenty-first manual diaphragm valve, so that the gas at both ends of the vacuum pump can be discharged through the second delivery pipeline;

[0265] (12) When the pressure inside the fourth liquid storage pipeline is too high, the first pressure relief valve automatically opens, and the gas inside the fourth liquid storage pipeline can flow through the first pressure relief pipeline to the tail gas combustion treatment device;

[0266] When the internal pressure of the first conveying pipeline is too high, open the twenty-second manual diaphragm valve, and the second pressure relief valve will automatically open. The gas inside the first conveying pipeline can flow through the second pressure relief pipeline to the tail gas combustion treatment device.

[0267] Embodiment 6

[0268] This embodiment relates to a specific implementation manner of the tail gas recovery treatment device and method of the present invention.

[0269] As Figure 5 shown, the condensation unit 100 includes condensers (CONDA, CONDB), manual diaphragm valves (MV1, MV2A, MV2B, MV3A, MV3B, MV4), ball valves (BV1A, BV1B, BV2A, BV2B), pressure sensors (PT1A, PT1B), and a water bath device (HX1).

[0270] The liquid storage unit 200 includes liquid storage tanks (CANA, CANB), manual diaphragm valves (MV5A, MV5B, MV6A, MV6B, MV7, MV8A, MV8B, MV9A, MV9B, MV10A, MV10B), cooling coils (HX2A, HX2B), liquid level sensors (LEA, LEB), pressure sensors (PT2A, PT2B, PT4), and a temperature sensor (PT3).

[0271] The desorption and adsorption unit 300 includes desorption and adsorption tanks (TDA, TDB), manual diaphragm valves (MV11A, MV11B, MV12A, MV12B, MV13), check valves (CV1), and a pressure sensor (PT5).

[0272] The purification unit 400 includes separation membrane tanks (ROA, ROB), manual diaphragm valves (MV14A, MV14B, MV15A, MV15B, MV16, MV17A, MV17B), check valves (CV2A, CV2B), and pressure sensors (PT6A, PT6B, PT7).

[0273] The conveying unit 500 includes a vacuum pump (DRY), manual diaphragm valves (MV18, MV19, MV20, MV21), check valves (CV3), a pressure sensor (PT8), and a pneumatic diaphragm valve (PV1).

[0274] The first pressure relief unit 600 includes pressure relief valves (SV1A, SV1B) and check valves (CV4A, CV4B).

[0275] The second pressure relief unit 700 includes a pressure relief valve (SV2), a check valve (CV5), and a manual diaphragm valve (MV22).

[0276] The analysis unit includes a gas analyzer (GD).

[0277] The specific implementation method is as follows:

[0278] (1) When using CONDA, open BV1A and BV1B so that the cryogenic liquid in HX1 flows to the condenser; when using CONDB, open BV2A and BV2B so that the cryogenic liquid in HX1 flows to the condenser;

[0279] (2) Open MV1 and MV2A so that the high-temperature gas flows to CONDA, and CONDA condenses the high-temperature gas to obtain condensed liquid and condensed gas; when switching to CONDB, open MV1 and MV2B so that the high-temperature gas flows to CONDB;

[0280] (3) When using CONDA, open MV3A, MV4, and MV5A so that the condensed liquid and condensed gas flow to CANA, and CANA can store the condensed liquid;

[0281] When using CONDB, open MV3B, MV4, and MV5A so that the condensed liquid and condensed gas flow to CANA, and CANA can store the condensed liquid;

[0282] When it is necessary to switch to CANB, open MV5B so that the condensed liquid and condensed gas flow to CANB;

[0283] (4) When using CANA, open MV6A, MV7, and MV11A so that the condensed gas can flow to TDA, and TDA can adsorb the liquid molecules in the condensed gas to obtain dry gas;

[0284] When using CANB, open MV6B, MV7, and MV11A so that the condensed gas can flow to TDA, and TDA can adsorb the liquid molecules in the condensed gas to obtain dry gas;

[0285] When it is necessary to switch to TDB, open MV11B so that the condensed gas can flow to TDB;

[0286] (5) When using TDA, open MV12A, MV13, and MV14A so that the dry gas can flow to ROA, and ROA only allows small-molecule hydrogen to pass through to obtain high-purity hydrogen and miscellaneous gas;

[0287] When using TDB, open MV12B, MV13, and MV14A so that the dry gas can flow to ROA, and ROA only allows small-molecule hydrogen to pass through to obtain high-purity hydrogen and miscellaneous gas;

[0288] In the case where it is necessary to switch to ROB, open MV14B so that the dry gas can flow to ROA;

[0289] (6) When using ROA, open MV15A and MV16 so that high-purity hydrogen can lead to the first delivery pipeline; when using ROB, open MV15B and MV16 so that high-purity hydrogen can lead to the first delivery pipeline;

[0290] (7) Start DRY and open MV18, MV19, MV20 and PV1. DRY forms a vacuum negative pressure in the first delivery pipeline, and high-purity hydrogen can flow through the first delivery pipeline to the downstream semiconductor process equipment.

[0291] Furthermore, the tail gas recovery and treatment method of this embodiment further includes:

[0292] (8) When the liquid levels inside CANA and CANB monitored by LEA and LEB exceed the preset threshold, open MV8A and MV8B so that the liquid inside CANA and CANB can be drained to the waste liquid treatment device;

[0293] (9) When it is necessary to evacuate the gas inside CANA and CANB, open MV9A, MV9B, MV10A and MV10B so that the gas inside CANA and CANB is discharged to the tail gas combustion treatment device;

[0294] (10) When the pressures inside ROA and ROB monitored by PT6A and PT6B are too high, open MV17A and MV17B so that the miscellaneous gas of ROA and ROB can flow to the tail gas combustion treatment device;

[0295] (11) When DRY needs to be repaired, open MV21 so that the gas at both ends of DRY can be discharged through the second delivery pipeline;

[0296] (12) When the pressures inside CANA and CANB are too high, SV1A and SV1B automatically open, and the gas inside the fourth liquid storage pipeline can flow to the tail gas combustion treatment device through the first pressure relief pipeline;

[0297] (13) When the pressure inside the first delivery pipeline is too high, open MV22 and SV2 automatically opens, and the gas inside the first delivery pipeline can flow to the tail gas combustion treatment device through the second pressure relief pipeline.

[0298] Embodiment 7

[0299] This embodiment relates to the tail gas recovery and treatment equipment in the present invention.

[0300] An exhaust gas recovery and treatment device includes an exhaust gas recovery and treatment device, a waste liquid treatment device, and an exhaust gas combustion treatment device as described in Embodiments 1 to 4. Among them, the waste liquid treatment device is connected to the liquid storage unit 200 in the exhaust gas recovery and treatment device for treating and discharging the waste liquid stored in the liquid storage unit 200; the exhaust gas combustion treatment device is connected to the liquid storage unit 200, the purification unit 400, the first pressure relief unit 600, and the second pressure relief unit 700 in the exhaust gas recovery and treatment device for burning and discharging the miscellaneous gas generated during purification and the gas during the pressure relief process.

[0301] Embodiment 8

[0302] This embodiment relates to the semiconductor process system in the present invention.

[0303] A semiconductor process system includes an exhaust gas recovery and treatment device as described in Embodiments 1 to 4.

[0304] Furthermore, the exhaust gas recovery and treatment device is also connected to a waste liquid treatment device, an exhaust gas combustion treatment device, an upstream gas treatment device, and a downstream semiconductor process device.

[0305] A semiconductor process system, such as the exhaust gas recovery and treatment device described in Embodiment 6.

[0306] Furthermore, the exhaust gas recovery and treatment device is also connected to an upstream gas treatment device and a downstream semiconductor process device.

[0307] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as within the scope described in this specification.

[0308] The above-described embodiments only represent several implementation manners of the present application. Their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. A tail gas recovery and treatment device, characterized in that: include: A condensation unit, the condensation unit is connected to the upstream gas processing equipment and is used to condense the water-washed high-temperature gas to obtain condensed gas and condensed liquid; A liquid storage unit, which is respectively connected to the condensing unit, the waste liquid treatment device, and the tail gas combustion treatment device, and is located downstream of the condensing unit and is used to store condensed liquid; A desorption adsorption unit, which is connected to the liquid storage unit and is located downstream of the liquid storage unit, and is used to adsorb H2O in the condensed gas and obtain dry gas; A purification unit, which is connected to the desorption adsorption unit and the tail gas combustion treatment device respectively and is located downstream of the desorption adsorption unit, and is used to purify the dry gas to obtain high-purity hydrogen; A delivery unit, the delivery unit is connected to the purification unit and the downstream semiconductor process equipment respectively, and is used to deliver high-purity hydrogen to the downstream semiconductor process equipment; A first pressure relief unit, the first pressure relief unit is connected to the liquid storage unit and the tail gas combustion treatment device respectively, and is used to relieve pressure on the pipeline; A second pressure relief unit, which is connected to the conveying unit and the tail gas combustion treatment device respectively, and is used to relieve pressure on the pipeline; A gas analysis unit, which is connected to the delivery unit and is located at the connection point between the delivery unit and the downstream semiconductor process equipment, and is used to analyze the gas input to the downstream semiconductor process equipment; wherein the condensation unit includes: A condensing element, the condensing element is connected to the upstream gas processing equipment and the liquid storage unit respectively, and is used to condense the water-washed high-temperature gas to obtain condensed gas and condensed liquid; a heat exchange element, the heat exchange element being connected to the condensing element and used for conveying cryogenic liquid to the condensing element; a first switch valve element, the first switch valve element being arranged on a pipeline in which the condensing element is respectively connected to an upstream gas processing device, a liquid storage unit, and a heat exchange element, and used for controlling the flow of the pipeline; The liquid storage unit includes: A liquid storage element, which is respectively connected to the condensing unit, the desorption adsorption unit, the first pressure relief unit, the waste liquid treatment device, and the tail gas combustion treatment device, and is located downstream of the condensing unit and upstream of the desorption adsorption unit, and is used to store condensed liquid; A constant temperature element, which is disposed on the liquid storage element and covers the outer wall of the liquid storage element, and is used to maintain a constant internal temperature of the liquid storage element; A second switch valve element, the second switch valve element is arranged on a pipeline connected to the liquid storage element and the condensation unit, the desorption adsorption unit, and the waste liquid treatment device, respectively, and is used to control the flow of the pipeline; The desorption adsorption unit includes: An adsorption element, which is connected to the liquid storage unit and the purification unit respectively, and is located downstream of the liquid storage unit and upstream of the purification unit, and is used to filter H2O in the condensed gas and obtain dry gas; A desorption element, the desorption element is connected to the adsorption element and is used to transport high-temperature nitrogen to the adsorption element; A third switch valve element, which is disposed on a pipeline in which the adsorption element is connected to the liquid storage unit, the purification unit, and the desorption element, respectively, and is used to control the flow of the pipeline; A first one-way valve element, which is disposed on a pipeline connecting the adsorption element and the purification unit, and is used to prevent gas backflow inside the pipeline; The purification unit includes: A purification element, which is connected to the desorption adsorption unit, the conveying unit, and the tail gas combustion treatment device respectively, and is located downstream of the desorption adsorption unit and upstream of the conveying unit, and is used to filter impurities in the dry gas and obtain high-purity hydrogen; A fourth switch valve element, which is disposed on a pipeline in which the purification element is connected to the desorption adsorption unit, the delivery unit, and the tail gas combustion treatment device, respectively, and is used to control the flow of the pipeline; A second one-way valve element, which is arranged on a pipeline connecting the purification element and the tail gas combustion treatment device, and is used to prevent the gas inside the pipeline from flowing back; The conveying unit includes: A conveying element, the conveying element is respectively connected to the purification unit, the second pressure relief unit, and the downstream semiconductor process equipment, and is used to convey high-purity hydrogen to the downstream semiconductor process equipment; A vacuum element, which is arranged on the conveying element and is used to provide a vacuum negative pressure at the connection point between the purification unit and the conveying element; A fifth switch valve element, which is disposed on the conveying element and is used to control the flow of the conveying element; A third one-way valve element, which is disposed on the delivery element and is used to prevent the gas inside the delivery element from flowing back; The first pressure relief unit includes: a first pressure relief element, the first pressure relief element being connected to the liquid storage unit and the tail gas combustion treatment device respectively, and being used for relieving pressure on the liquid storage unit; a fourth one-way valve element, which is arranged on a pipeline connecting the first pressure relief element and the exhaust gas combustion treatment device, and is used to prevent the gas inside the pipeline from flowing back; The second pressure relief unit includes: A second pressure relief element, the second pressure relief element is connected to the conveying unit and the tail gas combustion treatment device respectively, and is used to relieve pressure on the conveying unit; a sixth switch valve element, the sixth switch valve element being arranged on the second pressure relief element and being used for controlling the flow of the second pressure relief element; The fifth one-way valve element is arranged on the pipeline connecting the second pressure relief element and the exhaust gas combustion treatment device, and is used to prevent the gas inside the pipeline from flowing back.

2. The tail gas recovery and treatment device according to claim 1, characterized in that: The condensing unit also includes: A first monitoring element, which is disposed on the pipeline between the condensing element and the liquid storage unit and is used to monitor the temperature inside the pipeline in real time; and / or The liquid storage unit also includes: A second monitoring element, the second monitoring element is connected to the liquid storage element and is used to monitor the temperature inside the liquid storage element in real time; and / or The liquid storage unit also includes: a third monitoring element, which is disposed inside the liquid storage element and is used to monitor the liquid level inside the liquid storage element in real time; and / or The liquid storage unit also includes: A fourth monitoring element, which is disposed on a pipeline connecting the liquid storage element and the desorption adsorption unit, and is used to monitor the temperature inside the pipeline in real time; and / or The liquid storage unit also includes: A fifth monitoring element, which is disposed on a pipeline connecting the liquid storage element and the desorption adsorption unit, and is used to monitor the pressure inside the pipeline in real time; and / or The desorption adsorption unit also includes: a sixth monitoring element, which is disposed on a pipeline connecting the adsorption element and the purification unit and is used to monitor the pressure inside the pipeline in real time; and / or The purification unit also includes: a seventh monitoring element, the seventh monitoring element being in communication with the purification element and being used for monitoring the pressure inside the purification element in real time; and / or The purification unit also includes: an eighth monitoring element, which is disposed on a pipeline connecting the purification element and the delivery unit and is used to monitor the pressure inside the pipeline in real time; and / or The conveying unit also includes: The ninth monitoring element is arranged on a pipeline connecting the conveying element and the downstream semiconductor process equipment, and is used for real-time monitoring of the pressure inside the pipeline.

3. The tail gas recovery and treatment device according to any one of claims 1 to 2, characterized in that: There are at least two condensation units, liquid storage units, desorption adsorption units, purification units, and first pressure relief units; Among them, a number of condensation units are arranged in parallel, a number of liquid storage units are arranged in parallel, a number of desorption adsorption units are arranged in parallel, a number of purification units are arranged in parallel, and the first pressure relief units are connected to the corresponding liquid storage units respectively.

4. A tail gas recovery and treatment method, characterized in that: The tail gas recovery and treatment device applied to any one of claims 1 to 3 comprises: The condensation unit obtains high-temperature gas and condenses the high-temperature gas to obtain condensed gas and condensed liquid; The desorption adsorption unit obtains the condensed gas and adsorbs H2O in the condensed gas to obtain dry gas; The purification unit obtains the filtered gas and purifies the dry gas to obtain high-purity hydrogen; Wherein, when the pressure inside the liquid storage unit is too high, the first pressure relief unit relieves the pressure of the liquid storage unit; When the pressure inside the delivery unit is too high, the second pressure relief unit relieves the pressure in the delivery unit.

5. A tail gas recovery and treatment device, characterized in that: include: The tail gas recovery and treatment device according to any one of claims 1 to 3; A waste liquid treatment device, the waste liquid treatment device is connected to the liquid storage unit in the tail gas recovery treatment device, and is used to treat and discharge the waste liquid stored in the liquid storage unit; The tail gas combustion treatment device is connected with the liquid storage unit, the purification unit, the first pressure relief unit and the second pressure relief unit in the tail gas recovery treatment device, and is used for burning and discharging the impurities generated by the purification and the gas in the pressure relief process.

6. A semiconductor process system, characterized in that: include: The tail gas recovery and treatment device according to any one of claims 1 to 3; or The tail gas recovery and treatment equipment as claimed in claim 5.

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