A dust cleaning device for polysilicon processing

Abstract

The present invention relates to the technical field of polysilicon processing, and discloses a dust cleaning device for polysilicon processing, comprising a supporting component, a connecting component, a fixing component, a vibration component and an adjustment component. The supporting component is used to support and connect various components, and the connecting component is used to fix the fixing component, the vibration component and the adjustment component. By setting the connecting component, the dust on the silicon wafer can be cleaned more thoroughly in cooperation with the fixing component and the vibration component; by setting the fixing component, the polysilicon can be stably positioned and clamped; by setting the vibration component, the dust on the silicon wafer can be vibrated and dropped; by setting the adjustment component, the stability of the two ends of the connecting shaft can be adjusted to facilitate the motor to drive the connecting shaft to rotate; by setting the connecting pipe and the spiral plate, the airflow in the connecting pipe will be accelerated when entering the spiral plate, which is convenient for cleaning and collecting dust and preventing dust from accumulating in the spiral plate.

Description

Technical Field

[0001] The invention relates to the technical field of polysilicon processing, and in particular to a dust cleaning device used for polysilicon processing. Background Art

[0002] Polycrystalline silicon is a form of single-element silicon. When molten single-element silicon solidifies under supercooling conditions, silicon atoms are arranged in the form of diamond lattices to form many crystal nuclei. If these crystal nuclei grow into grains with different crystal plane orientations, these grains will combine and crystallize into polycrystalline silicon. At present, the existing dust cleaning structure for polycrystalline silicon processing has the following problems: it is inconvenient to stably position and clamp the polycrystalline silicon, the processing accuracy is low, and it is difficult to automatically clean the dust on the surface of the polycrystalline silicon. Therefore, it is urgent to invent a dust cleaning device for polycrystalline silicon processing to solve the above problems. Summary of the invention

[0003] In view of the deficiencies in the prior art, the present invention provides a dust cleaning device for polysilicon processing.

[0004] To achieve the above-mentioned solution, the present invention provides the following technical solutions: a dust cleaning device for polysilicon processing, comprising a supporting component, a connecting component, a fixing component, a vibration component and an adjustment component, the supporting component is used to support and connect various components, the connecting component is used to fix the fixing component, the vibration component and the adjustment component, the fixing component is used to fix and install silicon wafers, the vibration component is used to generate vibration to clean dust from the silicon wafers, and the adjustment component is used to dynamically adjust the silicon wafers during the dust cleaning process. The supporting component comprises a bracket, a blower and a motor, the blower is fixedly installed in the middle position of the top of the bracket, the bottom of the blower is connected to the connecting component, and the motor is fixedly installed on one side of the bracket near the connecting component.

[0005] Preferably, the connecting assembly includes a dust cleaning bin, a connecting pipe, a spiral plate and two connecting shafts. The two connecting shafts are movably installed in the middle positions on both sides of the dust cleaning bin, respectively. The connecting pipe is fixedly installed at the bottom of the dust cleaning bin and is connected with the dust cleaning bin. Below the connecting pipe is a spiral plate. A cover plate is fixedly installed above and below the spiral plate. The connecting pipe and the spiral plate are connected to each other. A hatch is opened on one side of the dust cleaning bin. The hatch is used to open and close the dust cleaning bin to facilitate the access to silicon wafers.

[0006] Preferably, the motor is movably connected to one end of the connecting shaft on one side of the dust cleaning bin, and one end of the connecting shaft on the other side of the dust cleaning bin is fixedly installed with a stabilizing block. The connecting shaft is movably connected to the adjustment component at a position close to the outside of the dust cleaning bin, and the connecting shaft is fixedly connected to the vibration component at a position close to the inside of the dust cleaning bin. Six evenly distributed fixed components are fixedly connected between the two connecting shafts, and a connecting support rod is fixedly connected to the bottom between the vibration component and the adjustment component, and the bottom of the connecting support rod is fixedly installed on the dust cleaning bin.

[0007] Preferably, the fixing assembly includes two clamping plates and a second connecting rod, the two clamping plates are annular and the upper sides close to each other are inclined surfaces for easy insertion and installation of the silicon wafer, the sides close to each other of the two clamping plates are rough surfaces for easy fixation of the silicon wafer, a first connecting rod is fixedly installed on both sides of the clamping plates, a first connecting hole is provided on the outer side of the first connecting rod, the second connecting rod is movably connected in the first connecting hole, first limit blocks are fixedly installed on both ends of the second connecting rod, and a first spring is provided between the first connecting rod and the first limit block.

[0008] Preferably, a third connecting rod is fixedly installed at the bottom of each of the two splints, a second connecting hole is opened at the lower part of the third connecting rod, the bottom end of the second connecting hole is an arc convex surface, a fourth connecting rod is movably installed between the two second connecting holes, the top end of the fourth connecting rod is an arc concave surface and engages with the second connecting hole, and a second limit block is fixedly installed at both ends of the fourth connecting rod.

[0009] Preferably, the vibration assembly includes a toothed ring, a gear is provided on the inner side of the toothed ring, the center position of the inner side of the toothed ring is a connecting shaft, six fifth connecting rods are evenly arranged between the connecting shaft and the toothed ring, a vibration ball is fixedly installed on the fifth connecting rod near one end of the toothed ring, and the other end of the fifth connecting rod is fixedly connected to the connecting shaft. When the connecting shaft rotates, the fifth connecting rod and the vibration ball will be driven to rotate. The rotation of the vibration ball will contact the teeth on the toothed ring and generate vibration, thereby driving the connecting shaft to vibrate.

[0010] Preferably, six sixth connecting rods are fixedly installed on one end of the connecting shaft close to the fixed component, the sixth connecting rod is fixedly connected to the third limit block, both ends of the third limit block are fixedly connected to a first limit block, the third limit block and the first connecting rod do not contact each other, when the connecting shaft vibrates, the third limit block will drive the vibration of the sixth connecting rod, the third limit block will drive the second connecting rod to vibrate through the first limit block, and the second connecting rod will drive the clamping plate to vibrate through the first connecting rod, thereby vibrating and dusting the silicon wafers between the clamping plates.

[0011] Preferably, the adjustment assembly includes a first connecting ring and a second connecting ring, the second connecting ring is located at the center position of the inner side of the first connecting ring, six circular holes are evenly opened on the first connecting ring, an adjustment movable rod is movably installed in the hole, an adjustment shaft is fixedly installed at the bottom of the adjustment movable rod, and six grooves are evenly opened on the second connecting ring, the positions of the grooves correspond one by one to the positions of the circular holes on the first connecting ring, and both ends of the adjustment shaft are movably installed in the grooves.

[0012] Preferably, a second spring is provided between the first connecting ring and the second connecting ring, and the second spring is sleeved on the outside of the adjusting movable rod. One end of the second spring is fixedly connected to the inside of the first connecting ring, and the other end of the second spring is fixedly connected to the outside of the second connecting ring. The middle of the second connecting ring is movably connected to the connecting shaft. When the connecting shaft vibrates, the second connecting ring will vibrate. When the second connecting ring vibrates, the adjusting shaft will rotate, the adjusting movable rod will move, and the second spring will deform, thereby absorbing the vibration kinetic energy at the adjustment component to adjust the stability of both ends of the connecting shaft.

[0013] Compared with the prior art, the present invention provides a dust cleaning device for polysilicon processing, which has the following beneficial effects:

[0014] 1. The dust cleaning device for polysilicon processing can clean the dust on the silicon wafer more thoroughly by setting a connecting component and using a hair dryer to blow and clean the silicon wafer in cooperation with a fixing component and a vibration component. A connecting pipe and a cover plate are set, and the spiral plate is a spiral partition plate, which is convenient for discharging dust with the airflow to prevent the airflow from flowing back. At the same time, the cross-sectional area of ​​the connecting pipe is larger than the cross-sectional area of ​​the spiral plate, which will produce a narrow tube effect, so that the airflow in the connecting pipe will be accelerated when entering the spiral plate, which is convenient for cleaning and collecting dust and prevents dust from accumulating in the spiral plate.

[0015] 2. The dust cleaning device for polysilicon processing opens two clamping plates by setting a fixing component. The clamping plates will drive the first connecting rod and the third connecting rod to move. The first connecting holes at both ends of the first connecting rod will move along the second connecting rod. The movement of the first connecting rod will compress the first spring between the first connecting rod and the first limiting block. When the clamping plates are opened to a suitable position, the silicon wafer can be placed between the two clamping plates. At this time, the bottom of the silicon wafer will contact the fourth connecting rod between the third connecting rods. The side of the fourth connecting rod close to the silicon wafer is an arc surface that can fit with the silicon wafer. The second limiting blocks at both ends of the fourth connecting rod will limit the third connecting rod. After the silicon wafer is installed, the clamping plates are released, and the first spring between the first connecting rod and the first limiting block will provide a force to the first connecting rod to make the first connecting rod drive the clamping plates to approach, so that the clamping plates clamp the silicon wafer, thereby stably positioning and clamping the polysilicon.

[0016] 3. The dust cleaning device for polysilicon processing is provided with a vibration component. When the motor rotates, it drives the connecting shaft to rotate. When the connecting shaft rotates, it drives the fifth connecting rod to rotate. When the fifth connecting rod rotates, it drives the vibration ball to rotate. When the vibration ball rotates, it contacts the teeth on the inner side of the toothed ring and generates vibration. The vibration of the vibration ball drives the fifth connecting rod to vibrate. The vibration of the fifth connecting rod drives the connecting shaft to vibrate. The vibration of the connecting shaft drives the sixth connecting rod to vibrate. The vibration of the sixth connecting rod drives the third limit block to vibrate. The vibration of the third limit block drives the first limit block to vibrate. The vibration of the first limit block drives the second connecting rod to vibrate. The vibration of the second connecting rod drives the first connecting rod to vibrate. The vibration of the first connecting rod drives the clamping plate to vibrate. The vibration of the clamping plate drives the silicon wafer to vibrate, so that dust on the silicon wafer can be shaken off.

[0017] 4. The dust cleaning device for polysilicon processing is provided with a moving component. When the connecting shaft vibrates, it will drive the second connecting ring to vibrate. When the second connecting ring vibrates, it will drive the adjusting shaft to rotate between the grooves. At the same time, when the second connecting ring vibrates, it will drive the second connecting ring to move. When the second connecting ring moves, it will drive the adjusting movable rod to move. At this time, the adjusting movable rod will move at the circular hole on the first connecting ring. When the adjusting movable rod and the second connecting ring move, the second spring between the second connecting ring and the first connecting ring will be deformed, thereby absorbing the vibration kinetic energy of the connecting shaft near one end of the dust cleaning bin to adjust the stability of the two ends of the connecting shaft, so as to facilitate the motor to drive the connecting shaft to rotate.

[0018] 5. The dust cleaning device for polysilicon processing is provided with a connecting pipe and a spiral plate, and a blower is started. The blower provides a fast airflow above the fixed component and brings the fallen dust into the connecting pipe. The dust in the connecting pipe enters the spiral plate with the airflow and is discharged and collected. When the airflow enters the cover plate, the spiral plate is a spiral partition, which is convenient for discharging the dust with the airflow and preventing the airflow from flowing back. At the same time, the cross-sectional area of ​​the connecting pipe is larger than the cross-sectional area of ​​the spiral plate, which will produce a narrow tube effect, so that the airflow in the connecting pipe entering the spiral plate will be accelerated, which is convenient for cleaning and collecting dust and preventing dust from accumulating in the spiral plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the main structure of the present invention;

[0020] Figure 2 This is a schematic diagram of the internal structure of the dust removal bin of the present invention;

[0021] Figure 3 It is a schematic diagram of the connection structure of the fixing component, the vibration component and the adjustment component of the present invention;

[0022] Figure 4It is a schematic diagram of the structure of the fixing component and the vibration component of the present invention;

[0023] Figure 5 This is a schematic diagram of the structure of the vibration assembly of the present invention;

[0024] Figure 6 It is a schematic diagram of the structure of the fixing component and the vibration component of the present invention;

[0025] Figure 7 It is a schematic diagram of the splint structure of the present invention;

[0026] Figure 8 It is a schematic diagram of the structure of the mobilization component of the present invention.

[0027] In the figure: 100, support assembly; 101, bracket; 102, hair dryer; 103, motor; 200, connecting assembly; 201, dust removal bin; 202, connecting pipe; 203, cover plate; 204, spiral plate; 205, hatch; 206, connecting support rod; 207, connecting shaft; 208, stabilizing block, 300, fixing assembly; 301, clamping plate; 302, first connecting rod; 303, first connecting hole; 304, second connecting rod; 305, first limit block; 306, connecting rod; 207, connecting shaft; 208, stabilizing block; 309, fixing assembly; 310, clamping plate; 311, clamping plate; 312, first connecting rod; 313, first connecting hole; 314, second connecting rod; 315, first limit block; 316, second limit block; 317, second limit block; 318, second limit block; 319, second limit block; 320, first limit block; 321, second limit block; 322, first limit block; 323, first limit block; 324, second limit block; 325, first limit block; 326, first limit block; 327, second limit block; 328, first limit block; 329, first limit block; 330, first limit block; 331, second limit block; 332, first limit block; 333, first limit block; 334, second limit block; 335, first limit block; 336, first limit block; 337, first limit block; 338, first limit block; 339, first limit block; 340, first limit block; 341, first limit block; 342, first limit block; 343, first limit block; 344, second 6. First spring; 307. Third connecting rod; 308. Second connecting hole; 309. Fourth connecting rod; 310. Second limiting block; 400. Vibration assembly; 401. Toothed ring; 402. Vibration ball; 403. Fifth connecting rod; 404. Sixth connecting rod; 405. Third limiting block; 500. Adjustment assembly; 501. First connecting ring; 502. Second connecting ring; 503. Groove; 504. Adjustment shaft; 505. Adjustment movable rod; 506. Second spring. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] See also Figures 1 to 8A dust cleaning device for polysilicon processing includes a support component 100, a connection component 200, a fixing component 300, a vibration component 400 and an adjustment component 500. The support component 100 is used to support and connect various components. The connection component 200 is used to fix the connection between the fixing component 300, the vibration component 400 and the adjustment component 500. The fixing component 300 is used to fix and install silicon wafers. The vibration component 400 is used to generate vibration to clean the silicon wafers. The adjustment component 500 is used to dynamically adjust the silicon wafers during the dust cleaning process. The support component 100 includes a bracket 101, a blower 102 and a motor 103. The blower 102 is fixedly installed in the middle position of the top of the bracket 101. The bottom of the blower 102 is connected to the connection component 200. The motor 103 is fixedly installed on one side of the bracket 101 near the connection component 200.

[0030] The connecting assembly 200 includes a dust cleaning bin 201, a connecting pipe 202, a spiral plate 204 and two connecting shafts 207. The two connecting shafts 207 are movably installed in the middle positions on both sides of the dust cleaning bin 201. The connecting pipe 202 is fixedly installed at the bottom of the dust cleaning bin 201 and is connected to the dust cleaning bin 201. Below the connecting pipe 202 is the spiral plate 204. A cover plate 203 is fixedly installed above and below the spiral plate 204. The connecting pipe 202 and the spiral plate 204 are connected to each other. A hatch 205 is opened on one side of the dust cleaning bin 201. The hatch 205 is used to open and close the dust cleaning bin 201 to facilitate the use of silicon wafers.

[0031] The motor 103 is movably connected to one end of the connecting shaft 207 on one side of the dust cleaning bin 201, and a stabilizing block 208 is fixedly installed on one end of the connecting shaft 207 on the other side of the dust cleaning bin 201. The connecting shaft 207 is movably connected to the adjustment component 500 at a position close to the outer side of the dust cleaning bin 201, and the connecting shaft 207 is fixedly connected to the vibration component 400 at a position close to the inner side of the dust cleaning bin 201. Six evenly distributed fixed components 300 are fixedly connected between the two connecting shafts 207. A connecting support rod 206 is fixedly connected to the bottom between the vibration component 400 and the adjustment component 500, and the bottom of the connecting support rod 206 is fixedly installed on the dust cleaning bin 201.

[0032] The fixing assembly 300 includes two clamping plates 301 and a second connecting rod 304. The two clamping plates 301 are annular and the upper sides close to each other are inclined surfaces to facilitate the insertion and installation of the silicon wafer. The close sides of the two clamping plates 301 are rough surfaces to facilitate the fixing of the silicon wafer. A first connecting rod 302 is fixedly installed on both sides of the clamping plates 301. A first connecting hole 303 is opened on the outer side of the first connecting rod 302. The second connecting rod 304 is movably connected in the first connecting hole 303. First limit blocks 305 are fixedly installed at both ends of the second connecting rod 304. A first spring 306 is provided between the first connecting rod 302 and the first limit block 305.

[0033] A third connecting rod 307 is fixedly installed at the bottom of the two splints 301, and a second connecting hole 308 is opened at the lower part of the third connecting rod 307. The bottom end of the second connecting hole 308 is an arc convex surface. A fourth connecting rod 309 is movably installed between the two second connecting holes 308. The top end of the fourth connecting rod 309 is an arc concave surface and meshes with the second connecting hole 308. A second limit block 310 is fixedly installed at both ends of the fourth connecting rod 309.

[0034] The vibration assembly 400 includes a toothed ring 401, a gear is provided on the inner side of the toothed ring 401, the inner center position of the toothed ring 401 is a connecting shaft 207, six fifth connecting rods 403 are evenly arranged between the connecting shaft 207 and the toothed ring 401, a vibration ball 402 is fixedly installed on one end of the fifth connecting rod 403 close to the toothed ring 401, and the other end of the fifth connecting rod 403 is fixedly connected to the connecting shaft 207. When the connecting shaft 207 rotates, the fifth connecting rod 403 and the vibration ball 402 are driven to rotate. The rotation of the vibration ball 402 will contact the teeth on the toothed ring 401 and generate vibration, thereby driving the connecting shaft 207 to vibrate.

[0035] Six sixth connecting rods 404 are fixedly installed on one end of the connecting shaft 207 close to the fixed component 300, and the sixth connecting rod 404 is fixedly connected to the third limit block 405. A first limit block 305 is fixedly connected to both ends of the third limit block 405, and the third limit block 405 and the first connecting rod 302 do not contact each other. When the connecting shaft 207 vibrates, the third limit block 405 will be driven to vibrate through the sixth connecting rod 404, the third limit block 405 will drive the second connecting rod 304 to vibrate through the first limit block 305, and the second connecting rod 304 will drive the clamping plate 301 to vibrate through the first connecting rod 302, thereby vibrating and dusting the silicon wafers between the clamping plates 301.

[0036] The adjustment component 500 includes a first connecting ring 501 and a second connecting ring 502. The second connecting ring 502 is located at the center position of the inner side of the first connecting ring 501. Six circular holes are evenly opened on the first connecting ring 501. An adjusting movable rod 505 is movably installed in the hole. An adjusting shaft 504 is fixedly installed at the bottom of the adjusting movable rod 505. Six grooves 503 are evenly opened on the second connecting ring 502. The positions of the grooves 503 correspond to the positions of the circular holes on the first connecting ring 501 one by one. Both ends of the adjusting shaft 504 are movably installed in the grooves 503.

[0037] A second spring 506 is provided between the first connecting ring 501 and the second connecting ring 502. The second spring 506 is sleeved on the outer side of the adjusting movable rod 505. One end of the second spring 506 is fixedly connected to the inner side of the first connecting ring 501, and the other end of the second spring 506 is fixedly connected to the outer side of the second connecting ring 502. The middle of the second connecting ring 502 is movably connected to the connecting shaft 207. When the connecting shaft 207 vibrates, the second connecting ring 502 will be driven to vibrate. When the second connecting ring 502 vibrates, the adjusting shaft 504 will be driven to rotate, the adjusting movable rod 505 will move, and the second spring 506 will be deformed, thereby absorbing the vibration kinetic energy at the adjustment component 500 to adjust the stability of the two ends of the connecting shaft 207.

[0038] When in use, the dust cleaning bin 201 is opened through the hatch 205, and the silicon wafer is placed between the two clamping plates 301. During this process, the two clamping plates 301 are opened, and the clamping plates 301 will drive the first connecting rod 302 and the third connecting rod 307 to move. The first connecting holes 303 at both ends of the first connecting rod 302 will move along the second connecting rod 304. The movement of the first connecting rod 302 will compress the first spring 306 between the first connecting rod 302 and the first limiting block 305. When the clamping plates 301 are opened to a suitable position, the silicon wafer can be placed between the two clamping plates 301. At this time, the bottom of the silicon wafer will contact the fourth connecting rod 309 between the third connecting rod 307. The side of the fourth connecting rod 309 close to the silicon wafer is an arc surface that can fit the silicon wafer. The second limiting blocks 310 at both ends of the fourth connecting rod 309 will limit the third connecting rod 307. After the silicon wafer is installed, the clamping plates 301 are released, and the first connecting rod 302 and the third connecting rod 307 are locked. The first spring 306 between the rod 302 and the first limit block 305 will provide a force to the first connecting rod 302 so that the first connecting rod 302 drives the clamping plate 301 to move closer, so that the clamping plate 301 clamps the silicon wafer and rotates the connecting shaft 207. The rotation of the connecting shaft 207 will drive the sixth connecting rod 404 to rotate, and the rotation of the sixth connecting rod 404 will drive the third limit block 405 to rotate. The rotation of the third limit block 405 will drive the first limit block 305 to rotate. The rotation of the first limit block 305 will drive the second connecting rod 304 to rotate. The rotation of the second connecting rod 304 will drive the first connecting rod 302 to rotate. The rotation of the first connecting rod 302 will drive the clamping plate 301 to rotate, and the fixing assembly 300 with the silicon wafer installed will be turned away. Repeat the above steps to install the next fixing assembly 300 without the silicon wafer installed. When the six fixing assemblies 300 are installed, the hatch 205 can be closed.

[0039] Start the motor 103. The rotation of the motor 103 will drive the connecting shaft 207 to rotate. The rotation of the connecting shaft 207 will drive the fifth connecting rod 403 to rotate. The rotation of the fifth connecting rod 403 will drive the vibration ball 402 to rotate. The vibration ball 402 will contact the teeth on the inner side of the toothed ring 401 and vibrate. The vibration of the vibration ball 402 will drive the fifth connecting rod 403 to vibrate. The vibration of the fifth connecting rod 403 will drive the connecting shaft 207 to vibrate. The vibration of the connecting shaft 207 will drive the sixth connecting rod 404 to vibrate. The vibration of the sixth connecting rod 404 will drive the third limit block 405 to vibrate. The vibration of the third limit block 405 will drive the first limit block 305 to vibrate. The vibration of the first limit block 305 will drive the second connecting rod 304 to vibrate. The vibration of the second connecting rod 304 will drive The first connecting rod 302 vibrates, and the vibration of the first connecting rod 302 drives the clamping plate 301 to vibrate. The vibration of the clamping plate 301 drives the silicon wafer to vibrate, so that the dust on the silicon wafer can be shaken off. At the same time, the hair dryer 102 is started, and the hair dryer 102 provides a fast airflow above the fixing component 300, and brings the fallen dust to the connecting tube 202. The dust in the connecting tube 202 will enter the spiral plate 204 with the airflow and be discharged and collected. When the airflow enters the cover plate 203, the cover plate 203 is a spiral partition, which is convenient for discharging dust with the airflow and preventing the airflow from flowing back. At the same time, the cross-sectional area of ​​the connecting tube 202 is larger than the cross-sectional area of ​​the spiral plate 204, which will produce a narrow tube effect, so that the airflow in the connecting tube 202 will be accelerated when entering the spiral plate 204, which is convenient for cleaning and collecting dust and preventing dust from accumulating in the spiral plate 204.

[0040] When the connecting shaft 207 vibrates, it will drive the second connecting ring 502 to vibrate. When the second connecting ring 502 vibrates, it will drive the adjusting shaft 504 to rotate between the grooves 503. At the same time, when the second connecting ring 502 vibrates, it will drive the second connecting ring 502 to move. When the second connecting ring 502 moves, it will drive the adjusting movable rod 505 to move. At this time, the adjusting movable rod 505 will move at the circular hole on the first connecting ring 501. When the adjusting movable rod 505 and the second connecting ring 502 move, the second spring 506 between the second connecting ring 502 and the first connecting ring 501 will be deformed, thereby absorbing the vibration kinetic energy of the connecting shaft 207 close to the dust cleaning bin 201, so as to adjust the stability of the two ends of the connecting shaft 207, so as to facilitate the motor 103 to drive the connecting shaft 207 to rotate.

[0041] When the dust cleaning is completed, the hatch 205 is opened, and the two clamps 301 are opened. The clamps 301 will drive the first connecting rod 302 and the third connecting rod 307 to move. The first connecting holes 303 at both ends of the first connecting rod 302 will move along the second connecting rod 304. The movement of the first connecting rod 302 will compress the first spring 306 between the first connecting rod 302 and the first limit block 305. When the clamps 301 are opened to a suitable position, the silicon wafer can be taken out and the un-dusted silicon wafer can be installed. The connecting shaft 207 is rotated, and the rotation of the connecting shaft 207 will drive the sixth connecting rod 404 to rotate. The rotation of the sixth connecting rod 404 The rotation of the third limit block 405 will drive the first limit block 305 to rotate, the rotation of the first limit block 305 will drive the second connecting rod 304 to rotate, the rotation of the second connecting rod 304 will drive the first connecting rod 302 to rotate, the rotation of the first connecting rod 302 will drive the clamping plate 301 to rotate, the fixed component 300 with the installed silicon wafer will be turned away, and the next fixed component 300 with the silicon wafer not removed will repeat the above steps for unloading, when the six fixed components 300 have completed unloading and installed the uncleaned silicon wafers, the hatch 205 can be closed and the above steps can be repeated for dust cleaning.

[0042] By using the hair dryer 102 to clean the silicon wafer in conjunction with the fixing component 300 and the vibration component 400, the dust on the silicon wafer can be cleaned more thoroughly. By setting the connecting pipe 202 and the spiral plate 204, the spiral plate 204 is a spiral partition, which is convenient for discharging dust with the airflow to prevent the airflow from flowing back. At the same time, the cross-sectional area of ​​the connecting pipe 202 is larger than the cross-sectional area of ​​the spiral plate 204, a narrow tube effect will be generated, so that the airflow in the connecting pipe 202 entering the spiral plate 204 will be accelerated, which is convenient for cleaning and collecting dust and prevents dust from accumulating in the spiral plate 204.

[0043] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A dust cleaning device for polysilicon processing, comprising a support component (100), a connection component (200), a fixing component (300), a vibration component (400) and an adjustment component (500), wherein the support component (100) is used to support and connect various components, the connection component (200) is used to fix the fixing component (300), the vibration component (400) and the adjustment component (500), the fixing component (300) is used to fix and install silicon wafers, the vibration component (400) is used to generate vibration to clean the silicon wafers, and the adjustment component (500) is used to dynamically adjust the silicon wafers during the dust cleaning process, characterized in that: The support assembly (100) comprises a bracket (101), a hair dryer (102) and a motor (103); the hair dryer (102) is fixedly mounted at a middle position on the top of the bracket (101); the bottom of the hair dryer (102) is connected to the connecting assembly (200); and the motor (103) is fixedly mounted at a position on one side of the bracket (101) close to the connecting assembly (200); The connecting assembly (200) comprises a dust cleaning bin (201), a connecting pipe (202), a spiral plate (204) and two connecting rotating shafts (207). The two connecting rotating shafts (207) are movably mounted at the middle positions of both sides of the dust cleaning bin (201). The connecting pipe (202) is fixedly mounted at the bottom of the dust cleaning bin (201) and is in communication with the dust cleaning bin (201). The spiral plate (204) is disposed below the connecting pipe (202). A cover plate (203) is fixedly mounted above and below the spiral plate (204). The connecting pipe (202) and the spiral plate (204) are in communication with each other. A hatch (205) is provided on one side of the dust cleaning bin (201). The hatch (205) is used to open and close the dust cleaning bin (201) to facilitate the access to silicon wafers. The motor (103) is movably connected to one end of a connecting shaft (207) on one side of the dust cleaning bin (201); a stabilizing block (208) is fixedly installed on one end of the connecting shaft (207) on the other side of the dust cleaning bin (201); a position of the connecting shaft (207) close to the outside of the dust cleaning bin (201) is movably connected to an adjustment component (500); a position of the connecting shaft (207) close to the inside of the dust cleaning bin (201) is fixedly connected to a vibration component (400); six evenly distributed fixed components (300) are fixedly connected between the two connecting shafts (207); a connecting support rod (206) is fixedly connected at the bottom between the vibration component (400) and the adjustment component (500); and the bottom of the connecting support rod (206) is fixedly installed on the dust cleaning bin (201); The adjustment assembly (500) comprises a first connecting ring (501) and a second connecting ring (502), the second connecting ring (502) being located at the center of the inner side of the first connecting ring (501), the first connecting ring (501) being evenly provided with six circular holes, an adjusting movable rod (505) being movably installed in the hole, an adjusting rotating shaft (504) being fixedly installed at the bottom of the adjusting movable rod (505), the second connecting ring (502) being evenly provided with six grooves (503), the positions of the grooves (503) corresponding to the positions of the circular holes on the first connecting ring (501), and the two ends of the adjusting rotating shaft (504) being movably installed in the grooves (503); A second spring (506) is provided between the first connecting ring (501) and the second connecting ring (502). The second spring (506) is sleeved on the outside of the adjusting movable rod (505). One end of the second spring (506) is fixedly connected to the inside of the first connecting ring (501), and the other end of the second spring (506) is fixedly connected to the outside of the second connecting ring (502). The middle of the second connecting ring (502) is movably connected to the connecting shaft (207). When the connecting shaft (207) vibrates, the second connecting ring (502) is driven to vibrate. When the second connecting ring (502) vibrates, the adjusting shaft (504) is driven to rotate, the adjusting movable rod (505) is moved, and the second spring (506) is deformed, thereby absorbing the vibration kinetic energy at the adjustment component (500) to adjust the stability of the two ends of the connecting shaft (207).

2. A dust cleaning device for polysilicon processing according to claim 1, characterized in that: The fixing assembly (300) comprises two clamping plates (301) and a second connecting rod (304); the two clamping plates (301) are annular and the upper sides close to each other are inclined surfaces for facilitating the insertion and installation of silicon wafers; the sides close to each other of the two clamping plates (301) are rough surfaces for facilitating the fixing of silicon wafers; a first connecting rod (302) is fixedly installed on both sides of the clamping plates (301); a first connecting hole (303) is provided on the outer side of the first connecting rod (302); the second connecting rod (304) is movably connected in the first connecting hole (303); first limiting blocks (305) are fixedly installed on both ends of the second connecting rod (304); and a first spring (306) is provided between the first connecting rod (302) and the first limiting block (305).

3. A dust cleaning device for polysilicon processing according to claim 2, characterized in that: A third connecting rod (307) is fixedly mounted at the bottom of each of the two clamping plates (301); a second connecting hole (308) is provided at the bottom of the third connecting rod (307); the bottom end of the second connecting hole (308) is a circular arc convex surface; a fourth connecting rod (309) is movably mounted between the two second connecting holes (308); the top end of the fourth connecting rod (309) is a circular arc concave surface and meshes with the second connecting hole (308); and a second limit block (310) is fixedly mounted at both ends of the fourth connecting rod (309).

4. The dust cleaning device for polysilicon processing according to claim 1, characterized in that: The vibration assembly (400) comprises a toothed ring (401), a gear is arranged inside the toothed ring (401), a connecting shaft (207) is arranged at the center of the inside of the toothed ring (401), six fifth connecting rods (403) are evenly arranged between the connecting shaft (207) and the toothed ring (401), a vibration ball (402) is fixedly installed at one end of the fifth connecting rod (403) close to the toothed ring (401), and the other end of the fifth connecting rod (403) is fixedly connected to the connecting shaft (207), when the connecting shaft (207) rotates, the fifth connecting rod (403) and the vibration ball (402) are driven to rotate, and the rotation of the vibration ball (402) contacts the teeth on the toothed ring (401) and generates vibration, thereby driving the connecting shaft (207) to vibrate.

5. A dust cleaning device for polysilicon processing according to claim 4, characterized in that: Six sixth connecting rods (404) are fixedly installed at one end of the connecting shaft (207) close to the fixing assembly (300), the sixth connecting rods (404) are fixedly connected to the third limiting blocks (405), and the third limiting blocks (405) are fixedly connected to the two ends of the third limiting blocks (405), and the third limiting blocks (405) and the first connecting rods (302) do not contact each other. When the connecting shaft (207) vibrates, the third limiting blocks (405) are driven to vibrate through the sixth connecting rods (404), the third limiting blocks (405) are driven to vibrate through the first limiting blocks (305), and the second connecting rods (304) are driven to vibrate through the first connecting rods (302), thereby vibrating and removing dust from the silicon wafers between the clamping plates (301).

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