Method for manufacturing display panel, display panel and electronic device

Abstract

Embodiments of the present application provide a display panel preparation method, a display panel and an electronic device, and relate to the technical field of display. In the display panel preparation method, the first opening (pixel opening) is first made and then the third opening (isolation opening) is made, which can avoid the existence of residual glue on the side wall of the isolation structure, thereby overcoming the process failure caused by the existence of residual glue on the side wall, and improving the process yield of the display panel. On the other hand, since the pixel definition layer has different distribution densities of openings in different regions, by performing opening etching on different regions respectively, the etching of two regions in one process can be considered at the same time, the problem that a larger etching loading region cannot be completely etched, or the lower film layer of a smaller etching loading region is damaged by etching can be avoided, and the process yield of the display panel is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a preparation method of display panel, display panel and electronic equipment. BACKGROUND

[0002] Organic Light Emitting Diode (OLED) is considered to be the next generation of flat panel display technology after liquid crystal. It is widely used in mobile phones, televisions, notebook computers, desktop computers and other consumer electronic products because of its excellent color and picture quality, and becomes the mainstream of display panels.

[0003] However, the process performance of the current OLED display product still needs to be further improved. SUMMARY

[0004] In order to overcome the technical problems mentioned in the above technical background, the present application provides a preparation method of display panel, display panel and electronic equipment.

[0005] In a first aspect of the present application, a preparation method of display panel is provided, the display panel has a display area and a frame area surrounding at least part of the display area, and the method comprises:

[0006] providing a substrate;

[0007] forming a pixel definition material layer on one side of the substrate;

[0008] respectively patterning the pixel definition material layer located in the display area and the pixel definition material layer located in the frame area to form a pixel definition layer having a first opening in the display area and a second opening in the frame area, wherein the density of the first opening and the density of the second opening are different;

[0009] forming an isolation structure material layer on the side of the pixel definition layer away from the substrate, and patterning the isolation structure material layer to form an isolation structure, wherein the isolation structure comprises a third opening located in the display area, and the first opening and the third opening are communicated;

[0010] forming a light emitting device in the third opening.

[0011] In a possible implementation manner of the present application, the step of respectively patterning the pixel definition material layer located in the display area and the pixel definition material layer located in the frame area to form a pixel definition layer having a first opening in the display area and a second opening in the frame area comprises:

[0012] performing first patterning on the pixel defining material layer located in the display area to obtain a first opening located in the display area;

[0013] performing second patterning on the pixel defining material layer located in the frame area to form the pixel defining layer and obtain a second opening located in the frame area.

[0014] In a possible implementation of the present application, the step of performing patterning on the pixel defining material layer located in the display area and the pixel defining material layer located in the frame area respectively to form the pixel defining layer having the first opening in the display area and the second opening in the frame area comprises:

[0015] performing first patterning on the pixel defining material layer located in the frame area to obtain the second opening located in the frame area;

[0016] performing second patterning on the pixel defining material layer located in the display area to form the pixel defining layer and obtain the first opening located in the display area.

[0017] In a possible implementation of the present application, the second opening comprises a first partial opening, and the step of manufacturing a separation structure material layer on a side of the pixel defining layer away from the substrate, and performing patterning on the separation structure material layer to form a separation structure comprises:

[0018] manufacturing a separation structure material layer on a side of the pixel defining layer away from the substrate, wherein the separation structure fills the first partial opening;

[0019] manufacturing a photoresist layer on a side of the separation structure material layer away from the substrate;

[0020] performing patterning on the photoresist layer to form a photoresist opening on the photoresist layer;

[0021] In a possible implementation of the present application, the second opening further comprises a second partial opening, and the separation structure further comprises a fourth opening located in the frame area, and the step of performing patterning on the photoresist layer to form a photoresist opening on the photoresist layer comprises:

[0022] performing patterning on the photoresist layer to form the photoresist opening, wherein in the display area, a normal projection of the photoresist opening on the substrate covers a normal projection of the first opening on the substrate, and in the frame area, a normal projection of the photoresist opening on the substrate covers part of a normal projection of the second partial opening on the substrate.

[0023] In a possible implementation manner of the present application, the isolation structure material layer comprises a first isolation structure material layer and a second isolation structure material layer which are sequentially stacked, and the step of etching the isolation structure material layer through the adhesive layer opening to form the isolation structure comprises:

[0024] The first isolation structure material layer and the second isolation structure material layer are etched through the adhesive layer opening to form a first isolation portion and a second isolation portion respectively, and the isolation structure is formed by the first isolation portion and the second isolation portion, wherein the isolation structure forms the third opening in the display area and forms the fourth opening in the frame area, and a normal projection of the first isolation portion on the substrate is located in a normal projection of the second isolation portion on the substrate.

[0025] In a possible implementation manner of the present application, the step of etching the first isolation structure material layer and the second isolation structure material layer through the adhesive layer opening to form a first isolation portion and a second isolation portion respectively, and forming the isolation structure by the first isolation portion and the second isolation portion comprises:

[0026] The second isolation structure material layer is etched through the adhesive layer opening to form a second isolation portion;

[0027] The first isolation structure material layer which is not shielded by the second isolation portion is etched to form a first isolation portion, and the isolation structure is formed by the first isolation portion and the second isolation portion.

[0028] In a possible implementation manner of the present application, the method further comprises:

[0029] A packaging layer is made on a side of the light-emitting device away from the substrate, wherein the packaging layer is used for packaging light-emitting devices located in different third openings, on a side wall of the isolation structure facing the third opening, a part of a film layer of the light-emitting device at least partially overlaps the side wall on a side close to the substrate, and the packaging layer covers the light-emitting device and contacts another part of the side wall on a side away from the substrate.

[0030] A second aspect of the present application further provides a display panel, the display panel having a display area and a frame area at least partially surrounding the display area, and the display panel comprising:

[0031] a substrate;

[0032] a pixel definition layer located on a side of the substrate, the pixel definition layer comprising a first opening located in the display area and a second opening located in the frame area;

[0033] An isolation structure is located at least on a side of the pixel defining layer away from the substrate, and defines a third opening on the pixel defining layer in the display area, the third opening being in communication with the first opening, wherein a density of the first opening is different from a density of the second opening.

[0034] A light emitting device is located at least partially in the third opening.

[0035] In a possible implementation manner of the present application, the second opening includes a first partial opening, and the isolation structure is connected to the conductive trace in the substrate through the first partial opening in the frame area.

[0036] Preferably, the density of the first opening is greater than the density of the first partial opening.

[0037] Preferably, an area of the first partial opening is greater than an area of the first opening.

[0038] Preferably, the pixel defining layer is an inorganic pixel defining layer.

[0039] Preferably, the pixel defining layer is an inorganic pixel defining layer.

[0040] In a possible implementation manner of the present application, the isolation structure further includes a fourth opening in the frame area, and the second opening further includes a second partial opening.

[0041] The number of the fourth openings is less than the number of the second openings.

[0042] Preferably, a normal projection of the second partial opening on the substrate overlaps a normal projection of the fourth opening on the substrate.

[0043] Preferably, the normal projection of the second partial opening on the substrate is located within the normal projection of the fourth opening on the substrate.

[0044] Preferably, a normal projection of one of the fourth openings on the substrate covers a normal projection of one of the second partial openings on the substrate.

[0045] In a possible implementation manner of the present application, a density of the third opening is the same as a density of the fourth opening.

[0046] Preferably, an area of the fourth opening is greater than an area of the third opening.

[0047] In a possible implementation manner of the present application, the substrate includes a planarization layer and a conductive layer, the planarization layer and the conductive layer are stacked in a direction away from the substrate, and the pixel defining layer is located on a side of the planarization layer away from the substrate.

[0048] In the frame region, the planarization layer comprises a fifth opening, and the isolation structure is connected with a conductive trace in the conductive layer through the first partial opening and the fifth opening.

[0049] Preferably, at least part of the isolation structure is located in the first partial opening and the fifth opening.

[0050] In a possible implementation of the present application, the orthographic projection of the first opening on the substrate is located within the orthographic projection of the third opening on the substrate.

[0051] Preferably, in a direction away from the substrate, the light-emitting device comprises a first electrode, a light-emitting material layer and a second electrode which are sequentially stacked.

[0052] Preferably, at least part of the first electrode is exposed from the position of the first opening.

[0053] Preferably, on the side wall of the isolation structure facing the third opening, the second electrode overlaps a part of the side wall close to the substrate.

[0054] In a possible implementation of the present application, the isolation structure comprises a first isolation portion and a second isolation portion which are sequentially stacked, the second isolation portion is arranged on a side of the first isolation portion away from the substrate, and the orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the second isolation portion on the substrate.

[0055] The second electrode overlaps the first isolation portion.

[0056] Preferably, the side wall of the isolation structure facing the third opening comprises a side wall of the first isolation portion facing the third opening.

[0057] In a possible implementation of the present application, the isolation structure further comprises a third isolation portion, in a direction away from the substrate, the third isolation portion, the first isolation portion and the second isolation portion are sequentially stacked, the orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the third isolation portion on the substrate, and the orthographic projection of the third isolation portion on the substrate is located within the orthographic projection of the second isolation portion on the substrate.

[0058] Preferably, the second electrode further overlaps the third isolation portion.

[0059] Preferably, the side wall of the isolation structure facing the third opening comprises a side wall of the first isolation portion and a side wall of the third isolation portion facing the third opening.

[0060] Preferably, the material of the first isolation portion comprises aluminum, silver or copper, the material of the second isolation portion comprises titanium or molybdenum, and the material of the third isolation portion comprises molybdenum or titanium.

[0061] In a possible implementation of the present application, the display panel comprises a first encapsulation layer.

[0062] The first encapsulation layer comprises a plurality of encapsulation units for encapsulating the light emitting device in the third opening, the encapsulation units covering the light emitting device and contacting another part of the sidewall away from the substrate side;

[0063] Preferably, two adjacent encapsulation units for respectively encapsulating light emitting devices of different colors are disconnected away from the substrate side of the isolation structure.

[0064] Preferably, there is a gap between the isolation structure and the encapsulation units away from the substrate side of the isolation structure.

[0065] Preferably, the orthographic projection of the first encapsulation layer on the substrate is located outside the orthographic projection of the second partial opening on the substrate.

[0066] In a possible implementation of the present application, the display panel further comprises a second encapsulation layer.

[0067] The second encapsulation layer is located away from the substrate side of the first encapsulation layer, and the second encapsulation layer at least covers the first encapsulation layer.

[0068] Preferably, the second encapsulation layer has a flat surface away from the substrate side.

[0069] Preferably, the second encapsulation layer fills the gap between the isolation structure and the encapsulation units.

[0070] Preferably, the second encapsulation layer fills the fourth opening and the second partial opening and contacts the planarization layer in the substrate.

[0071] Preferably, the display panel further comprises a third encapsulation layer, and the third encapsulation layer is located away from the substrate side of the second encapsulation layer.

[0072] Preferably, the third encapsulation layer fills the second partial opening.

[0073] Preferably, the first encapsulation layer and the third encapsulation layer are inorganic encapsulation layers, and the second encapsulation layer is an organic encapsulation layer.

[0074] The third aspect of the present application also provides an electronic device comprising the display panel prepared according to any one of the possible implementation manners of the first aspect or the display panel according to any one of the possible implementation manners of the second aspect.

[0075] The present application provides a display panel preparation method, a display panel and an electronic device. In the display panel preparation method, the first opening (pixel opening) is first made and then the third opening (isolation opening) is made, so that residual glue on the sidewall of the isolation structure can be avoided, thereby overcoming process defects caused by residual glue on the sidewall, and improving the process yield of the display panel. On the other hand, since the pixel definition layer has different distribution densities of openings in different regions, by performing opening etching on different regions respectively, the etching of two regions at the same time in one process can be avoided, and the problems that a large region cannot be completely etched or the lower film layer of a small region is damaged by etching can be avoided, thereby improving the process yield of the display panel. BRIEF DESCRIPTION OF DRAWINGS

[0076] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0077] Figure 1 The area schematic diagram of the display panel provided by the present embodiment is illustrated;

[0078] Figure 2 The flowchart of the display panel preparation method provided by the present embodiment is illustrated;

[0079] Figure 3 For Figure 2 The corresponding process flowchart is shown;

[0080] Figure 4 To achieve Figure 2 One of the flowcharts of step S13 in the present embodiment;

[0081] Figure 5 To achieve Figure 2 The second flowchart of step S13 in the present embodiment;

[0082] Figure 6 To achieve Figure 2 The flowchart of step S14 in the present embodiment;

[0083] Figure 7 For Figure 6 The corresponding process flowchart is shown.

[0084] Figure 8 One of the schematic diagrams illustrating a portion of the film layer structure of the display panel in the display area provided in this embodiment is illustrated.

[0085] Figure 9 A diagram illustrating the positional relationship between the isolation structure and the third opening in the display panel provided in this embodiment is shown.

[0086] Figure 10 One of the schematic diagrams illustrating the distribution of openings on a display panel is shown;

[0087] Figure 11 Example Figure 10 A schematic diagram of the cross-section along the AA direction;

[0088] Figure 12 Example 2: Schematic diagram showing the distribution of openings on the display panel;

[0089] Figure 13 Example Figure 12 One of the schematic diagrams of the cross section in the AA direction;

[0090] Figure 14 Example Figure 12 Schematic diagram of the cross section in the AA direction (Part 2);

[0091] Figure 15 This embodiment illustrates a second schematic diagram of a portion of the film layer structure in the display area of ​​the display panel.

[0092] Figure 16 A schematic diagram of an isolation structure provided in this embodiment is illustrated.

[0093] Figure 17 Another schematic diagram of the isolation structure provided in this embodiment is illustrated;

[0094] Figure 18 This embodiment illustrates a schematic diagram of a portion of the film layer structure in the display area of ​​the display panel.

[0095] Figure 19 A schematic diagram illustrating a portion of the film layer structure in the bezel area of ​​the display panel provided in this embodiment is shown.

[0096] Figure 20 The fourth example illustrates a partial film layer structure of the display panel in the display area provided in this embodiment.

[0097] Icon: 1 - display panel; 11 - substrate; 1101 - planarization layer; 1102 - conductive layer; 111 - conductive trace; 12 - pixel definition layer; 1201 - first opening; 1202 - second opening; 1202a - first partial opening; 1202b - second partial opening; 13 - isolation structure; 1301 - third opening; 1302 - fourth opening; 11011 - fifth opening; 131 - first isolation portion; 132 - second isolation portion; 133 - third isolation portion; 14 - light emitting device; 141 - first electrode; 142 - light emitting material layer; 143 - second electrode; 15 - encapsulation layer; 151 - first encapsulation layer; 1511 - encapsulation unit; 152 - second encapsulation layer; 153 - third encapsulation layer; 20 - pixel definition material layer; 30 - isolation structure material layer; 301 - first isolation structure material layer; 302 - second isolation structure material layer; 40 - photoresist layer; 401 - photoresist layer opening. DETAILED DESCRIPTION

[0098] In order to make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the following will be combined with the accompanying drawings for the embodiments of the present application to make a clear and complete description of the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the accompanying drawings can be arranged and designed in various different configurations.

[0099] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. All other embodiments obtained by a person of ordinary skill in the art without creative work based on the embodiments in the present application are within the scope of protection of the present application.

[0100] It should be noted that: similar reference numerals and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

[0101] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "vertical", "horizontal", "inner", "outer", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship when the product of the present application is usually placed, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third", and the like are only used for differentiation in description, and cannot be understood as indicating or implying relative importance.

[0102] It should be noted that the different features among the embodiments of the present application can be combined with each other in the case of no conflict.

[0103] Increasing the density (i.e., pixel density) of light emitting devices in a display panel is an important way to improve display effect. However, the display panel manufactured by the fine metal mask (FMM) technology cannot further increase the density of light emitting devices due to technical limitations. The inventors have found through long-term research that, in order to solve the technical problem that the density of light emitting devices cannot be further increased, an isolation structure is arranged in some display panels, so that the light emitting material layer and the cathode are disconnected at the position of the isolation structure when the whole layer of light emitting material layer and the cathode are evaporated. Through multiple evaporation and etching processes, light emitting devices of different colors can be formed in different isolation openings, i.e., light emitting device patterning.

[0104] Patents PCT / CN2023 / 134518, Patent 202310759370.2, Patent 202310740412.8, Patent 202310707209.0, Patent 202311499823.9, Patent 202310692671.8, Patent 202311091555.7 and Patent 202311346196.5 disclose related technical solutions of isolation structures and encapsulation layers, the contents of which are incorporated by reference into the present application for reference.

[0105] In the above display panel, the inventors have found that there may be technical problems such as non-lighting of light emitting device points and dark spots. The inventors have further found that the main cause of the above technical problems is that the cathode and the isolation structure are not well overlapped or the light emitting material layer is corroded, for example, the sidewall of the isolation structure is corroded, resulting in a decrease in the overlap area of the cathode and the sidewall of the isolation structure or no overlap, and the light emitting material layer is corroded and cannot work normally. The inventors have found through further research on the above-mentioned defects that the corrosion of the sidewall of the isolation structure and the light emitting material layer is caused by the chemical solution used to remove the surface oxide layer of the isolation structure before the evaporation film layer. In the related art, the pixel opening is generally made after the isolation opening is made. When the pixel opening is made, the photoresist in the undercut structure of the isolation structure cannot be affected by light, resulting in that the photoresist is left at this position (the sidewall of the isolation structure), and the residual glue can adsorb the chemical solution used to remove the surface oxide layer of the isolation structure. The chemical solution in the residual glue can corrode the sidewall of the isolation structure or the light emitting material layer evaporated subsequently, thereby causing process defects such as non-lighting of light emitting device points and dark spots.

[0106] To address the aforementioned technical problems, the inventors have innovatively designed the following technical solutions, which will be described in detail below with reference to the accompanying drawings. It should be noted that the deficiencies in the existing solutions are the result of the inventors' practical experience and careful research. Therefore, the discovery process of the aforementioned technical problems and the solutions proposed in this embodiment below are contributions made by the inventors to this application during the invention process, and should not be construed as technical content known to those skilled in the art.

[0107] This embodiment also provides a method for manufacturing a display panel, please refer to... Figure 1 , Figure 2 and Figure 3 ,in, Figure 1 A schematic diagram illustrating the area distribution of the display panel is provided. Figure 2 A schematic flowchart illustrating the method for manufacturing the display panel provided in this embodiment is illustrated. Figure 3 for Figure 2 According to the corresponding process diagram, the display panel 1 has a display area 10A and a border area 10B that at least partially surrounds the display area 10A. The following is in conjunction with... Figure 1 , Figure 2 and Figure 3 The method for manufacturing the display panel provided in this embodiment will be described in detail.

[0108] Step S11: Provide a substrate 11.

[0109] In this embodiment, the substrate 11 has a multi-layer structure, including at least a plurality of metal layers and an insulating layer located between adjacent metal layers, and a pixel driving circuit for providing driving signals to the light-emitting device is formed in the substrate 11.

[0110] Step S12: A pixel defining material layer 20 is formed on one side of the substrate 11.

[0111] In this embodiment, the pixel defining material layer 20 is an inorganic pixel defining layer. The pixel defining material layer 20 can be a single film layer or a multi-film layer. For example, when the pixel defining material layer 20 is a single film layer, the pixel defining material layer 20 can be a silicon oxide layer or a silicon nitride layer; when the pixel defining material layer 20 is a multi-film layer, the pixel defining material layer 20 can be a stacked structure formed by alternating silicon oxide layers and silicon nitride layers.

[0112] Step S13: The pixel defining material layer 20 located in the display area 10A and the pixel defining material layer 20 located in the border area 10B are respectively patterned to form a pixel defining layer 12 having a first opening 1201 in the display area 10A and a second opening in the border area 10B.

[0113] In the embodiment, the first opening 1201 in the display area 10A and the second opening in the frame area 10B can be formed by two separate etching processes.

[0114] In step S14, the isolation structure material layer 30 is formed on the side of the pixel definition layer 12 away from the substrate 11, and the isolation structure material layer 30 is patterned to form the isolation structure 13.

[0115] In the embodiment, a photoresist layer can be coated on the isolation structure material layer 30, and then exposed, developed, and etched to form the isolation structure 13. The isolation structure 13 includes a third opening 1301 in the display area, and the first opening 1201 and the third opening 1301 are in communication.

[0116] In step S15, the light emitting device 14 is formed in the third opening 1301.

[0117] In the embodiment, at least part of the film layers of the light emitting device can be formed in the third opening 1301 by evaporation. For example, the light emitting material layer and the second electrode of the light emitting device 14 can be formed by evaporation.

[0118] The method provided above can avoid the presence of residual glue on the sidewall of the isolation structure 13 by first forming the first opening 1201 (pixel opening) and then forming the third opening 1301 (isolation opening), thereby overcoming process defects caused by the presence of residual glue on the sidewall and improving the process yield of the display panel 1. On the other hand, since the pixel definition layer has different distribution densities of openings in different areas, the etching of different areas can be performed separately to avoid the problem that the etching of two areas cannot be considered simultaneously in one process, the problem that a larger area cannot be completely etched due to etching loading, or the problem that the film layer below a smaller area is damaged due to etching, thereby improving the process yield of the display panel 1.

[0119] In the embodiment, part of the second opening can be used to connect the isolation structure 12 and the conductive trace in the substrate 11, and another part of the second opening can be used as a gas permeable hole of the frame area 10B. In the embodiment, the density of the first opening 1201 is different from the density of the second opening. For example, the density of the first opening 1201 is less than the density of the second opening. Since the density of the first opening 1201 is different from the density of the second opening, the etching consumption of the display area 10A and the frame area 10B is different when the pixel definition material layer 20 is etched to form the opening. For example, when the density of the first opening 1201 is less than the density of the second opening, the etching consumption of the frame area 10B is greater than the etching consumption of the display area 10A, that is, the etching loading of the two areas is different. To solve the above technical problem, the following two embodiments are provided for implementing step S13.

[0120] In a possible implementation, referring to Figure 4 , step S13 comprises the following steps.

[0121] Step S131-1, performing first patterning on the pixel defining material layer corresponding to the frame region to obtain a first opening located in the frame region.

[0122] Step S132-1, performing second patterning on the pixel defining material layer corresponding to the display region to form the pixel defining layer and obtain a second opening located in the display region.

[0123] In another possible implementation, referring to Figure 5 , step S13 comprises the following steps.

[0124] Step S131-2, performing first patterning on the pixel defining material layer corresponding to the display region to obtain a second opening located in the display region.

[0125] Step S132-2, performing second patterning on the pixel defining material layer corresponding to the frame region to form the pixel defining layer and obtain a first opening located in the frame region.

[0126] Further, in the embodiment, referring to Figure 6 and Figure 7 , the second opening 1202 comprises a first partial opening 1202a, and step S14 can be implemented in the following manner.

[0127] Step S141, manufacturing an isolation structure material layer 30 on a side of the pixel defining layer 12 away from the substrate 11.

[0128] In the embodiment, the isolation structure material layer 30 fills the first partial opening 1202a

[0129] Step S142, manufacturing a photoresist layer 40 on a side of the isolation structure material layer 30 away from the substrate 11.

[0130] Step S143, performing patterning on the photoresist layer 40 to form a photoresist opening 401 in the photoresist layer 40.

[0131] In the embodiment, the second opening 1202 further comprises a second partial opening 1202b, and the isolation structure 13 further comprises a fourth opening 1302 located in the frame region 10B, and the photoresist layer 40 is patterned to form the photoresist opening 401, wherein in the display region, a normal projection of the photoresist opening 401 on the substrate 11 covers a normal projection of the first opening on the substrate 11, and in the frame region, a normal projection of the photoresist opening 401 on the substrate 11 covers a normal projection of part of the second partial opening 1202b on the substrate 11.

[0132] In step S144, the isolation structure material layer 30 is etched through the adhesive layer opening 401 to form the isolation structure 13.

[0133] In this embodiment, the isolation structure material layer 30 includes a first isolation structure material layer 301 and a second isolation structure material layer 302 which are sequentially stacked.

[0134] The first isolation structure material layer 301 and the second isolation structure material layer 302 are etched through the adhesive layer opening to form a first isolation portion 131 and a second isolation portion 132, respectively, and the isolation structure 13 is formed by the first isolation portion 131 and the second isolation portion 132, wherein the orthographic projection of the first isolation portion 131 on the substrate 11 is located within the orthographic projection of the second isolation portion 132 on the substrate 11. The isolation structure 13 forms a third opening 1301 in the display area and forms a fourth opening 1302 in the frame area.

[0135] In detail, in the process of forming the isolation structure 13, first, the second isolation structure material layer 302 is etched through the adhesive layer opening 401 to form the second isolation portion 132; then, the first isolation structure material layer 301 which is not shielded by the second isolation portion 132 is etched to form the first isolation portion 131, and the isolation structure 13 is formed by the first isolation portion 131 and the second isolation portion 132.

[0136] Further, the preparation method of the display panel provided in this embodiment further includes manufacturing an encapsulation layer on the side of the light emitting device 14 away from the substrate 11, wherein the encapsulation layer is used to encapsulate the light emitting device 14 located in different third openings 1301, on the side wall of the isolation structure 13 facing the third opening 1301, at least part of the film layer of the light emitting device 14 is partially overlapped with the side wall on the side close to the substrate 11, and the encapsulation layer covers the light emitting device 14 and contacts another part of the side wall on the side away from the substrate 11.

[0137] Based on the same inventive concept, this embodiment further provides a display panel, please refer to Figure 1 , Figure 8 , Figure 9 and Figure 10 In this embodiment, the display panel 1 has a display area 10A and a frame area 10B, the display area 10A is used to display an image, and the frame area 10B is at least partially arranged around the display area 10A. For example, the frame area 10B can include an upper frame area, a lower frame area, a left frame area and a right frame area which surround the display area 10A. The display panel 1 includes a substrate 11, a pixel definition layer 12, an isolation structure 13 and a light emitting device 14. The substrate 11 is a multi-film layer structure, and at least includes a plurality of metal layers and an insulating layer between adjacent metal layers. The substrate 11 has a pixel circuit formed therein for providing driving signals to the light emitting device 14.

[0138] The pixel defining layer 12 is located on one side of the substrate 11, and the pixel defining layer 12 includes first openings 1201 located in the display area 10A and second openings 1202 located in the frame area 10B, and the second openings 1202 can be located in the lower frame area. The density of the first openings 1201 and the density of the second openings 1202 are different, and the density of the openings refers to the opening area per unit area, and the greater the density of the openings, the greater the opening area per unit area.

[0139] The isolation structure 13 is located at least on the side of the pixel defining layer 12 away from the substrate 11, and in the display area 10A, the isolation structure 13 defines third openings 1301 on the pixel defining layer 12, and the third openings 1301 and the first openings 1201 are in communication to form a space for accommodating the light emitting device 14. Exemplarily, the orthographic projection of the first openings 1201 on the substrate 11 is located within the orthographic projection of the third openings 1301 on the substrate 11. The light emitting device 14 is at least partially located in the third openings 1301.

[0140] On the side wall of the isolation structure 13 facing the third openings 1301, a part of the film layer of the light emitting device 14 overlaps with a part of the side wall close to the substrate 11, so as to provide the light emitting device 14 with electrical signals through the isolation structure 13.

[0141] Further, please refer to Figure 10 and Figure 11 The second openings 1202 include first part openings 1202a, and in the frame area 10B, the isolation structure 13 is connected with the conductive traces 111 in the substrate 11 through the first part openings 1202a. The conductive traces 111 provide the isolation structure 13 with a power voltage signal (such as an ELVSS signal), and by controlling the area of the first part openings 1202a through which the isolation structure 13 and the conductive traces 111 in the substrate 11 are in communication, the connection area of the isolation structure 13 and the conductive traces 111 in the substrate 11 can be controlled, thereby controlling the connection resistance therebetween. The greater the area of the first part openings 1202a through which the isolation structure 13 and the conductive traces 111 in the substrate 11 are in communication, the smaller the connection resistance therebetween, which is beneficial to improving the stability of the power voltage signal transmission. Exemplarily, in the present embodiment, the area of the first part openings 1202a is greater than the area of the first openings 1201. In addition, in order to make the display panel 1 have a higher pixel density (PPI), the density of the first openings 1201 is greater than the density of the first part openings 1202a.

[0142] The pixel defining layer 12 is an inorganic pixel defining layer. The pixel defining layer 12 can be a single film layer or a multi-film layer. For example, when the pixel defining layer 12 is a single film layer, the pixel defining layer 12 can be a silicon oxide layer or a silicon nitride layer. When the pixel defining layer 12 is a multi-film layer, the pixel defining layer 12 can be a stack structure formed by alternately arranging silicon oxide layers and silicon nitride layers.

[0143] In this embodiment, by connecting the isolation structure 13 and the conductive trace 111 together in the frame area 10B, a stable power voltage signal can be provided for the isolation structure 12 in the display area 10B, so that the display uniformity of the entire display area 10A can be ensured.

[0144] In a possible implementation, please refer to Figure 12 and Figure 13 The isolation structure 13 can further include fourth openings 1302 in the frame area 10B, and the second openings 1202 further include second partial openings 1202b. The number of the fourth openings 1302 is less than the number of the second openings 1202. In the frame area 10B, the fourth openings 1302 and the second partial openings 1202b serve as gas permeation holes, so that the gas released by the film layers (for example, organic layers) in the substrate 11 under high-temperature process conditions can be discharged through the gas permeation holes, and the structural stability of the display panel 1 can be ensured.

[0145] The orthographic projection of the second partial openings 1202b on the substrate 11 overlaps the orthographic projection of the fourth openings 1302 on the substrate 11. In order to improve the gas permeation efficiency, the orthographic projection of the second partial openings 1202b on the substrate 11 is located within the orthographic projection of the fourth openings 1302 on the substrate 11, and the area of the orthographic projection of the second partial openings 1202b on the substrate 11 is less than the area of the orthographic projection of the fourth openings 1302 on the substrate 11. For example, in this embodiment, one orthographic projection of the fourth openings 1302 on the substrate 11 can cover one orthographic projection of the second partial openings 1202b on the substrate 11.

[0146] In a possible implementation, the density of the third openings 1301 and the density of the fourth openings 1401 can be the same. When the third openings 1301 and the fourth openings 1401 are etched, the consumption of the etching liquid in the display area 10A and the frame area 10B is the same (i.e., the etching loading is the same), so that the third openings 1301 and the fourth openings 1401 can be formed simultaneously in one etching process, and the uniformity of the appearance of the openings formed at different positions in the display area 10A can be ensured. In addition, in this embodiment, the area of the fourth openings 1302 can be greater than the area of the third openings 1301, so that the display area 10A can have a higher pixel density, and the frame area 10B can have a good gas permeation effect.

[0147] Further, referring to Figure 14 The substrate 11 can further include a planarization layer 1101 and a conductive layer 1102, which are stacked in a direction away from the substrate 11, and the pixel defining layer 12 is disposed on a side of the planarization layer 1101 away from the substrate 11, wherein the conductive traces 111 can be located in the conductive layer 1102. In the frame region 10B, the planarization layer 1101 includes a fifth opening 11011, and the isolation structure 13 is connected to the conductive traces 111 in the conductive layer 1102 through the first partial opening 1202a and the fifth opening 11011. For example, at least part of the isolation structure 13 is located in the first partial opening 1202a and the fifth opening 11011.

[0148] Further, referring to Figure 15 In a direction away from the substrate 11, the light emitting device 14 includes a first electrode 141, a light emitting material layer 142, and a second electrode 143, which are sequentially stacked. At least part of the first electrode 141 is exposed from the first opening position, and the second electrode 143 extends from the first opening to the side wall of the isolation structure 13 toward the third opening 1301 via the pixel defining layer 12, and the second electrode 143 overlaps with a portion of the side wall of the isolation structure 13 toward the third opening 1301, which is closer to the substrate 11, and the orthographic projection of the first opening on the substrate 11 is located within the orthographic projection of the third opening 1301 on the substrate 11, that is, the first opening and the third opening 1301 are in communication. The isolation structure 13 can connect the second electrodes 143 of different light emitting devices 14 together to provide the same voltage (such as ELVSS voltage) to the second electrodes 143 of different light emitting devices 14 through the isolation structure 13. For example, the first electrode 141 can be an anode of the light emitting device 14, and the second electrode 143 can be a cathode of the light emitting device 14.

[0149] In this embodiment, the isolation structure 13 can enclose a plurality of third openings 1301, and the isolation structure 13 can form film layers of light emitting devices of different colors in different third openings 1301 without the need for a fine metal mask, thereby reducing the manufacturing cost of the display panel. The isolation structure 13 can separate the light emitting material layer 142 and the second electrode 143 in the light emitting device, so that the different light emitting devices 14 are independent of each other, thereby improving the cross talk between adjacent light emitting devices 14 and improving the display effect. In addition, the adjacent light emitting devices 14 can be independently encapsulated to improve the encapsulation yield. At the same time, due to the presence of the isolation structure 13, the light emitting material layer 142 and the second electrode 143 in the light emitting device 14 of each color in the display panel can be prepared in a whole plane and then patterned, thereby canceling the fine metal mask to save the manufacturing cost of the display panel.

[0150] Referring to Figure 16In the embodiment, the isolation structure 13 comprises a first isolation portion 131 and a second isolation portion 132, the first isolation portion 131 and the second isolation portion 132 are sequentially stacked in the direction away from the substrate 11, for example, the second electrode 143 of the light emitting device 14 is overlapped with the first isolation portion 131. The orthographic projection of the first isolation portion 131 on the substrate 11 is within the orthographic projection of the second isolation portion 132 on the substrate 11. Alternatively, the area of the orthographic projection of the first isolation portion 131 on the substrate 11 is less than the area of the orthographic projection of the second isolation portion 132 on the substrate 11. The cross section of the isolation structure 13 can be T-shaped, the side wall of the isolation structure 13 towards the third opening 1301 comprises the side wall of the first isolation portion 131 towards the third opening 1301. The first isolation portion 131 comprises a conductive material, the first isolation portion 131 is electrically connected with the second electrode 143. In the direction perpendicular to the plane where the substrate 11 is located and along the line connecting adjacent third openings 1301, the cross section shape of the first isolation portion 131 is a right trapezoid, that is, the orthographic projection of the top surface of the first isolation portion 131 away from the substrate 11 on the substrate 11 is within the orthographic projection of the bottom surface of the first isolation structure 131 close to the substrate 11 on the substrate 11.

[0151] In the embodiment, further referring to Figure 17 , the isolation structure 13 further comprises a third isolation portion 133, the third isolation portion 133, the first isolation portion 131 and the second isolation portion 132 are sequentially stacked in the direction away from the substrate 11, for example, the second electrode 143 of the light emitting device 14 is overlapped with the third isolation portion 133. The orthographic projection of the first isolation portion 131 on the substrate 11 is within the orthographic projection of the third isolation portion 133 on the substrate 11, alternatively, the area of the orthographic projection of the first isolation portion 131 on the substrate 11 is less than the area of the orthographic projection of the third isolation portion 133 on the substrate 11. In the embodiment, the area of the orthographic projection of the third isolation portion 133 on the substrate 11 is also less than the area of the orthographic projection of the second isolation portion 132 on the substrate 11. The cross section of the isolation structure 13 can be H-shaped, the side wall of the isolation structure 13 towards the third opening 1301 comprises the side wall of the first isolation portion 131 and the side wall of the third isolation portion 133 towards the third opening 1301. At least one of the third isolation portion 133, the first isolation portion 131 and the second isolation portion 132 can comprise a conductive material. At least one of the third isolation portion 133 and the first isolation portion 131 is electrically connected with the second electrode 143.

[0152] In the embodiment, the material of the first isolation portion 131 comprises aluminum, silver or copper, and / or, the material of the second isolation portion 132 comprises titanium or molybdenum, and / or, the material of the third isolation portion 133 comprises molybdenum or titanium.

[0153] Referring to Figure 18In the embodiment, the display panel comprises a first encapsulation layer 151, the first encapsulation layer 151 comprises a plurality of encapsulation units 1511 for encapsulating different light emitting devices 14. The encapsulation units 1511 are used for encapsulating the light emitting devices 14 in the third openings 1301, and two adjacent encapsulation units 1511 for encapsulating light emitting devices 14 of different colors are disconnected on the side of the isolation structure 13 away from the substrate 11.

[0154] On the side wall of the isolation structure 13 facing the third opening 1301, part of the film layer of the light emitting device 14 (such as the second electrode 143) overlaps part of the side wall, and the encapsulation unit 1511 contacts another part of the side wall. As shown in Figure 18 , the second electrode 143 in the light emitting device 14 overlaps the part of the side wall close to the substrate 11, and the encapsulation unit 1511 overlaps the part away from the substrate 11. In the embodiment, the encapsulation unit 1511 located on the side of the isolation structure 13 away from the substrate 11 also has a gap between the isolation structure 13.

[0155] In the embodiment, please refer to Figure 19 , Figure 19 The schematic diagram of the partial film layer structure of the display panel in the frame area is shown, the orthographic projection of the first encapsulation layer 151 on the substrate 11 is located outside the orthographic projection of the second partial opening 1202b on the substrate 11. In this way, the first encapsulation layer 151 can avoid affecting the air permeability of the second partial opening 1202b, and ensure that the frame area of the display panel 1 has good air permeability.

[0156] Further, please refer to Figure 19 and Figure 20 In the embodiment, the display panel 1 further comprises a second encapsulation layer 152, the second encapsulation layer 152 is located on the side of the first encapsulation layer 151 away from the substrate 11, and the second encapsulation layer 152 has a flat surface on the side away from the substrate 11.

[0157] Optionally, the second encapsulation layer 152 fills the gap between the encapsulation unit 1511 and the isolation structure 13.

[0158] Optionally, the second encapsulation layer 152 fills the fourth opening 1302 and the second partial opening 1202b, and contacts the planarization layer 1101 in the substrate 11.

[0159] Further, please refer to Figure 20 , the display panel 1 further comprises a third encapsulation layer 153, the third encapsulation layer 153 is located on the side of the second encapsulation layer 152 away from the substrate 11.

[0160] Optionally, the first encapsulation layer 151 and the third encapsulation layer 153 are inorganic encapsulation layers, and the second encapsulation layer 152 is an organic encapsulation layer. For example, the first encapsulation layer 151 and the third encapsulation layer 153 can be formed by a chemical vapor deposition (CVD) method, and the second encapsulation layer 152 can be formed by an ink-jet printing (IJP) method.

[0161] Based on the same inventive concept, the embodiments of the present application also provide an electronic device, which comprises the display panel provided by the present application or the display panel prepared by the display panel manufacturing method provided by the embodiments of the present application. The electronic device can include a mobile phone, a tablet computer, a smart wearable device, a television, a notebook computer, a display, and the like.

[0162] The embodiments of the present application provide a display panel manufacturing method, a display panel and an electronic device. In the display panel manufacturing method, the first opening (pixel opening) is first made, and then the third opening (isolation opening) is made. This can avoid the existence of residual glue on the sidewall of the isolation structure, thereby overcoming the process failure caused by the existence of residual glue on the sidewall, and improving the process yield of the display panel. On the other hand, since the pixel definition layer has different distribution densities of openings in different regions, by performing opening etching on different regions respectively, the etching of two regions at the same time in one process can be avoided, the problem that a larger etching loading region cannot be completely etched, or the lower film layer of a smaller etching loading region is damaged by etching can be avoided, and the process yield of the display panel is improved.

[0163] The above only describes the preferred embodiments of the present application and is not used to limit the present application. For those skilled in the art, the present application can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A method for manufacturing a display panel, characterized by, The display panel has a display area and a frame area surrounding the display area at least partially, and the method comprises: providing a substrate; forming a pixel definition material layer on one side of the substrate; respectively performing patterning treatment on the pixel definition material layer in the display area and the pixel definition material layer in the frame area to form a pixel definition layer having first openings in the display area and second openings in the frame area, wherein the density of the first openings is different from the density of the second openings; forming an isolation structure material layer on the side of the pixel definition layer away from the substrate, and performing patterning treatment on the isolation structure material layer to form an isolation structure, wherein the isolation structure comprises third openings in the display area, and the first openings and the third openings are communicated; forming a light emitting device in the third openings; forming an encapsulation layer on the side of the light emitting device away from the substrate, wherein the encapsulation layer is used for encapsulating the light emitting devices in different third openings, and on the side wall of the isolation structure facing the third openings, a part of the film layer of the light emitting device at least partially overlaps with the side wall on the side close to the substrate, and the encapsulation layer covers the light emitting device and contacts another part of the side wall on the side away from the substrate.

2. The method of producing a display panel according to claim 1, wherein The step of respectively performing patterning treatment on the pixel definition material layer in the display area and the pixel definition material layer in the frame area to form a pixel definition layer having first openings in the display area and second openings in the frame area comprises: performing first patterning treatment on the pixel definition material layer in the display area to obtain the first openings in the display area; performing second patterning treatment on the pixel definition material layer in the frame area to form the pixel definition layer and obtain the second openings in the frame area.

3. The method of producing a display panel according to claim 1, wherein The step of respectively performing patterning treatment on the pixel definition material layer in the display area and the pixel definition material layer in the frame area to form a pixel definition layer having first openings in the display area and second openings in the frame area comprises: performing first patterning treatment on the pixel definition material layer in the frame area to obtain the second openings in the frame area; performing second patterning treatment on the pixel definition material layer in the display area to form the pixel definition layer and obtain the first openings in the display area.

4. The production method of a display panel according to claim 2 or 3, wherein The second openings comprise first part openings, and the step of forming an isolation structure material layer on the side of the pixel definition layer away from the substrate, and performing patterning treatment on the isolation structure material layer to form an isolation structure comprises: forming an isolation structure material layer on the side of the pixel definition layer away from the substrate, wherein the isolation structure fills the first part openings; forming a photoresist layer on the side of the isolation structure material layer away from the substrate; performing patterning treatment on the photoresist layer to form a photoresist layer opening on the photoresist layer; performing etching on the isolation structure material layer through the photoresist layer opening to form the isolation structure.

5. The method of producing a display panel according to claim 4, wherein The second opening further comprises a second partial opening, and the isolation structure further comprises a fourth opening in the frame region, and the patterning the photoresist layer to form the photoresist openings comprises: patterning the photoresist layer to form the photoresist openings, wherein in the display region, a normal projection of the photoresist openings on the substrate covers a normal projection of the first openings on the substrate, and in the frame region, a normal projection of the photoresist openings on the substrate covers part of a normal projection of the second partial openings on the substrate.

6. The method of claim 5, wherein the isolation structure material layer comprises a first isolation structure material layer and a second isolation structure material layer stacked in sequence, and the etching the isolation structure material layer through the photoresist openings to form the isolation structure comprises: etching the first isolation structure material layer and the second isolation structure material layer through the photoresist openings to form a first isolation portion and a second isolation portion respectively, and the isolation structure is formed by the first isolation portion and the second isolation portion, wherein the isolation structure forms the third opening in the display region and forms the fourth opening in the frame region, and a normal projection of the first isolation portion on the substrate is located within a normal projection of the second isolation portion on the substrate.

7. The method of producing a display panel according to claim 6, wherein The etching the first isolation structure material layer and the second isolation structure material layer through the photoresist openings to form a first isolation portion and a second isolation portion respectively, and the isolation structure is formed by the first isolation portion and the second isolation portion, comprises: etching the second isolation structure material layer through the photoresist openings to form a second isolation portion; etching the first isolation structure material layer not covered by the second isolation portion to form a first isolation portion, and the isolation structure is formed by the first isolation portion and the second isolation portion.

8. A display panel, characterized by, The display panel has a display region and a frame region at least partially surrounding the display region, and the display panel comprises: a substrate; a pixel definition layer located on one side of the substrate, the pixel definition layer comprising a first opening in the display region and a second opening in the frame region; an isolation structure located at least on a side of the pixel definition layer away from the substrate, the isolation structure defining a third opening on the pixel definition layer in the display region, the third opening being in communication with the first opening, wherein a density of the first opening and a density of the second opening are different; a light emitting device located at least partially in the third opening; a first encapsulation layer comprising a plurality of encapsulation units, the encapsulation units being used to encapsulate the light emitting device in the third opening, and on a side wall of the isolation structure facing the third opening, a part of a film layer of the light emitting device at least partially overlaps with the side wall on a side close to the substrate, and the encapsulation units cover the light emitting device and contact another part of the side wall on a side away from the substrate.

9. The display panel of claim 8, wherein The second opening includes a first partial opening, and the isolation structure is connected to the conductive trace in the substrate through the first partial opening in the frame region. The density of the first opening is greater than the density of the first partial opening.

10. The display panel of claim 9, wherein, The area of the first partial opening is greater than the area of the first opening.

11. The display panel of claim 10, wherein, The isolation structure further includes a fourth opening in the frame region, and the second opening further includes a second partial opening. The number of the fourth openings is less than the number of the second openings. The orthogonal projection of the second partial opening on the substrate overlaps the orthogonal projection of the fourth opening on the substrate.

12. The display panel of claim 11, wherein, The orthogonal projection of the second partial opening on the substrate is located within the orthogonal projection of the fourth opening on the substrate.

13. The display panel of claim 11, wherein, The density of the third opening is the same as the density of the fourth opening.

14. The display panel of claim 13, wherein, The area of the fourth opening is greater than the area of the third opening.

15. The display panel of claim 9, wherein, The substrate includes a planarization layer and a conductive layer, and the planarization layer and the conductive layer are stacked in a direction away from the substrate. The pixel definition layer is disposed on a side of the planarization layer away from the substrate. In the frame region, the planarization layer includes a fifth opening, and the isolation structure is connected to the conductive trace in the conductive layer through the first partial opening and the fifth opening. At least part of the isolation structure is located in the first partial opening and the fifth opening.

16. An electronic device, comprising: The electronic device includes the display panel prepared by the preparation method of any one of claims 1-7 or the display panel of any one of claims 8-15.

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