Electronic packaging and method of manufacturing the same

Abstract

The present invention provides an electronic package and a manufacturing method thereof. The electronic package includes an electronic module embedded in a substrate structure to facilitate thinning of the electronic package, wherein the electronic module includes a flexible substrate and a plurality of electronic components disposed on opposite sides of the flexible substrate.

Description

Technical Field

[0001] The present invention relates to a semiconductor packaging technology, and in particular to an electronic packaging part with embedded components and a manufacturing method thereof. Background Art

[0002] The technologies currently used in the field of chip packaging include chip scale packaging (CSP), direct chip attached packaging (DCA), double-side packaging or multi-chip module packaging (MCM).

[0003] Figure 1 FIG. 1 is a cross-sectional view of a conventional semiconductor package 1. Figure 1 As shown, the semiconductor package 1 is a double-sided packaging type to form a symmetric type, which includes a packaging substrate 10 and a plurality of semiconductor chips 12 arranged on opposite sides of the packaging substrate 10, wherein the packaging substrate 10 has a first surface 10a and a second surface 10b opposite to each other, and a circuit structure 11 is formed on the first surface 10a and the second surface 10b of the packaging substrate 10 respectively, so that the plurality of semiconductor chips 12 are arranged on the circuit structure 11 and electrically connected to the circuit structure 11.

[0004] The conventional semiconductor package 1 meets the multi-functional requirements by distributing a plurality of semiconductor chips 12 on the first surface 10 a and the second surface 10 b of the package substrate 10 .

[0005] However, in the conventional semiconductor package 1 , a plurality of semiconductor chips 12 are disposed on the surface of the package substrate 10 , which makes it difficult to reduce the thickness H of the semiconductor package 1 , and thus fails to meet the requirement of thinning.

[0006] Therefore, how to overcome the problems of the above-mentioned existing manufacturing methods has become a topic that needs to be solved urgently. Summary of the invention

[0007] In view of the above-mentioned defects of the prior art, an object of the present invention is to provide an electronic package and a method for manufacturing the same, which can at least partially solve the problems of the prior art.

[0008] The electronic package of the present invention includes: a substrate structure having a first surface and a second surface opposite to each other and a conductive through hole connecting the first surface and the second surface, wherein the first surface of the substrate structure has a recess; an electronic module embedded in the recess, and the electronic module includes a flexible substrate and a plurality of electronic components arranged on opposite sides of the flexible substrate; a first coating layer formed on the first surface of the substrate structure and in the recess to cover the electronic module; and a first circuit structure arranged on the first coating layer and electrically connecting at least one of the plurality of electronic components to the conductive through hole.

[0009] The present invention also provides a method for manufacturing an electronic package, including: providing a substrate structure and at least one electronic module, the substrate structure having a first surface and a second surface opposite to each other and a conductive through hole connecting the first surface and the second surface, and the electronic module comprising a flexible substrate and a plurality of electronic components arranged on opposite sides of the flexible substrate, wherein the first surface of the substrate structure has a recess; embedding the electronic module in the recess; forming a first coating layer on the first surface of the substrate structure and in the recess so that the first coating layer covers the electronic module; and forming a first circuit structure on the first coating layer so that the first circuit structure electrically connects at least one of the plurality of electronic components to the conductive through hole.

[0010] In the aforementioned electronic package and its manufacturing method, the flexible substrate is a flexible circuit board, which forms a staggered laminated board structure after being bent, so that the staggered laminated board structure is embedded in the recess. For example, the staggered laminated board structure is defined as a first plate portion and a second plate portion of staggered laminates, so that the electronic component on the first plate portion is regarded as a first electronic component, and the electronic component on the second plate portion is regarded as a second electronic component.

[0011] The aforementioned electronic package and its manufacturing method further include: forming a second coating layer on the second surface of the substrate structure; and forming a second circuit structure on the second coating layer, so that the second circuit structure electrically connects another one of the plurality of electronic components with the conductive via. For example, the second coating layer coats another one of the plurality of electronic components on the same side as the second surface of the substrate structure.

[0012] As can be seen from the above, the electronic package and the manufacturing method of the present invention are mainly by embedding the electronic module in the substrate structure. Therefore, compared with the prior art, the thickness of the electronic package of the present invention is thinner, thereby meeting the thinning requirement. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a cross-sectional schematic diagram of a conventional semiconductor package.

[0014] FIG. 2A to FIG. 2EIt is a cross-sectional schematic diagram of a method for manufacturing the first embodiment of the electronic package of the present invention.

[0015] Figure 2A-1 for Figure 2A A partial top view of the diagram.

[0016] Figure 2B-1 for Figure 2B A cross-sectional schematic diagram of another method.

[0017] FIG. 3A to FIG. 3C FIG. 4 is a cross-sectional schematic diagram of a manufacturing method of a second embodiment of an electronic package of the present invention.

[0018] The reference numerals are as follows:

[0019] 1 Semiconductor Package

[0020] 10 Package substrate

[0021] 10a, 20a first surface

[0022] 10b, 20b Second surface

[0023] 11 Line structure

[0024] 12 Semiconductor Chip

[0025] 2,3 Electronic packaging

[0026] 2a Electronic module

[0027] 20 Substrate structure

[0028] 200 recess

[0029] 201 First wiring layer

[0030] 202 Second wiring layer

[0031] 203 Conductive vias

[0032] 21 Flexible substrate

[0033] 21a First side

[0034] 21b Second side

[0035] 210 Bonding layer

[0036] 211 First Board

[0037] 212 Second board

[0038] 22 Electronic components

[0039] 22a First Electronic Components

[0040] 22b Second electronic component

[0041] 23. First coating layer

[0042] 24 First Line Structure

[0043] 240 First circuit layer

[0044] 241 First conductive column

[0045] 35 Second coating layer

[0046] 36 Second Line Structure

[0047] 360 Second Line Layer

[0048] 361 Second conductive column

[0049] 9 Bearing

[0050] 90 Storage Space

[0051] A dotted line area

[0052] D1, D2, H thickness

[0053] R Width DETAILED DESCRIPTION

[0054] The following describes the implementation of the present invention by means of specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0055] It should be noted that the structures, proportions, sizes, etc. shown in the attached drawings of this specification are only used to match the contents disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions for the implementation of the present invention, so they have no substantial technical significance. Any modification of the structure, change of the proportion relationship or adjustment of the size, without affecting the effects and purposes that can be produced by the present invention, should still fall within the scope of the technical contents disclosed in the present invention. At the same time, the terms such as "on", "first", "second", "one", etc. quoted in this specification are only for the convenience of description, and are not used to limit the scope of the implementation of the present invention. The change or adjustment of their relative relationship should also be regarded as the scope of the implementation of the present invention without substantially changing the technical contents.

[0056] FIG. 2A to FIG. 2E It is a cross-sectional schematic diagram of a manufacturing method of a first embodiment of an electronic package 2 of the present invention.

[0057] like Figure 2A As shown, a substrate structure 20 having a recess 200 and an electronic module 2 a are provided, and the electronic module 2 a includes a flexible substrate 21 and a plurality of electronic components 22 disposed on the flexible substrate 21 .

[0058] The substrate structure 20 is a package substrate type, and has a first surface 20 a and a second surface 20 b opposite to each other.

[0059] In the present embodiment, the package substrate is of a core layer type, wherein a first wiring layer 201 and a second wiring layer 202 are arranged on the first surface 20a and the second surface 20b of the substrate structure 20, respectively, and the substrate structure 20 has a plurality of conductive vias 203 connecting the first and second surfaces 20a, 20b, so as to electrically connect the first and second wiring layers 201, 202. For example, the conductive vias 203 are solid metal columns. It should be understood that in other embodiments, the conductive vias 203 may also be hollow columns, which may be filled with plugging materials in the hollow, wherein the plugging materials are of various types, such as conductive glue, ink, etc., and are not particularly limited.

[0060] Furthermore, the substrate structure 20 is disposed on a carrier 9 of a temporary substrate with its second surface 20b to cover one side of the recess 200, serving as the bottom of the recess 200. For example, the carrier 9 has a soft material, such as a release tape, UV thermosetting adhesive or other adhesive materials, so that the second wiring layer 202 is embedded in the soft material of the carrier 9.

[0061] The flexible substrate 21 is a flexible circuit board, which is provided with a plurality of circuits so as to be in a stacked shape after being bent.

[0062] In this embodiment, the flexible circuit board 21 is in an S-shaped or lightning-shaped shape before being bent. Figure 2A-1 As shown, one of the protruding parts (such as Figure 2A or Figure 2A-1 The dotted line portion A) shown is bent toward the direction of the other protruding portion to form a staggered laminated plate structure, that is, the upper and lower layers of the plates do not overlap.

[0063] Furthermore, the flexible substrate 21 is bent to form a laminated plate structure, which defines a staggered first plate portion 211 and a second plate portion 212, so that the outer side of the first plate portion 211 and the outer side of the second plate portion 212 serve as the first side 21a and the second side 21b of the laminated plate structure, respectively. For example, the exposed surface of the first side 21a and the exposed surface of the second side 21b are the same surface of the flexible substrate 21.

[0064] In addition, the first plate portion 211 and the second plate portion 212 may be bonded to each other using a bonding layer 210 such as glue.

[0065] The electronic component 22 is disposed on the flexible substrate 21 and electrically connected to the flexible substrate 21 .

[0066] In this embodiment, the electronic component 22 is an active component, a passive component or a combination of the two, wherein the active component is, for example, a semiconductor chip, and the passive component is, for example, a resistor, a capacitor or an inductor. For example, if the electronic component 22 is a semiconductor chip, it can be electrically connected to the circuit of the flexible substrate 21 by flip chip method; or, the electronic component 22 can also be electrically connected to the circuit of the flexible substrate 21 by wire bonding; or, the electronic component 22 can directly contact the circuit of the flexible substrate 21. However, the method for electrically connecting the electronic component 22 to the flexible substrate 21 is not limited to the above.

[0067] Furthermore, the electronic component 22 is disposed on the first plate portion 211 and the second plate portion 212 of the flexible substrate 21 (or laminate structure), so that the electronic component 22 on the first plate portion 211 is regarded as the first electronic component 22a, and the electronic component 22 on the second plate portion 212 is regarded as the second electronic component 22b. For example, the first and second electronic components 22a, 22b are respectively arranged on the first side 21a and the second side 21b of the flexible substrate 21 (or laminate structure). It should be understood that the electronic component 22 can also be arranged between the first plate portion 211 and the second plate portion 212, that is, the inner side of the first plate portion 211 and / or the inner side of the second plate portion 212.

[0068] In addition, a plurality of electronic components 22 may be disposed on the same surface of the flexible substrate 21 before the flexible substrate 21 is bent.

[0069] like Figure 2B As shown, the electronic module 2 a is placed on a carrier 9 in the recess 200 of the substrate structure 20 .

[0070] In this embodiment, the electronic module 2a is placed on the carrier 9 with the second side 21b of the flexible substrate 21 (or laminate structure). For example, the carrier 9 has at least one accommodation space 90 for accommodating the second electronic component 22b, so that the second electronic component 22b can be reliably disposed in the recess 200, so that the electronic module 2a is embedded in the recess 200.

[0071] It should be understood that the electronic module 2a can be placed on the carrier 9 with the second side 21b of the flexible substrate 21 (or laminate structure) thereof, such as Figure 2B-1 As shown, the substrate structure 20 is then disposed on the carrier 9 with its second surface 20 b so that the electronic module 2 a is embedded in the recess 200 .

[0072] Furthermore, the thickness D1 of the flexible substrate 21 (or the laminate structure) is less than or equal to the thickness D2 of the substrate structure 20 .

[0073] In addition, the flexible substrate 21 (or laminate structure) is flush with or lower than the first surface 20a of the substrate structure 20. It should be understood that, with the carrier 9 as a supporting structure, the flexible substrate 21 (or laminate structure) is flush with the second surface 20b of the substrate structure 20.

[0074] like Figure 2C As shown, a first encapsulation layer 23 is formed on the first surface 20 a of the substrate structure 20 and in the recess 200 , so that the first encapsulation layer 23 encapsulates the electronic module 2 a .

[0075] In this embodiment, the material forming the first coating layer 23 is an insulating material, such as Ajinomoto build-up film (ABF) or other dielectric materials, which can be formed on the carrier 9 by lamination or molding.

[0076] like Figure 2D As shown, a first circuit structure 24 is formed on the first cladding layer 23 so that the first circuit structure 24 electrically connects the substrate structure 20 and the electronic module 2 a.

[0077] In the present embodiment, the first circuit structure 24 includes at least one first circuit layer 240 formed on the first cladding layer 23 and a first conductive column 241 formed in the first cladding layer 23, so that the first circuit layer 240 is electrically connected to the first wiring layer 201 and the first electronic component 22a through the first conductive column 241. For example, the first circuit layer 240 is made by electroplating metal (such as copper) or other methods, and a blind hole can be formed on the first cladding layer 23, and then a metal material is electroplated or deposited in the blind hole to form the first conductive column 241. It should be understood that the first circuit structure 24 adopts a build-up process to form multiple ABF layers on the first cladding layer 23 as required and combine the circuit layers of each ABF to produce a multi-layer circuit layer.

[0078] like Figure 2E As shown, the carrier 9 is removed to obtain the asymmetric electronic package 2 , and the second surface 20 b of the substrate structure 20 and the second electronic component 22 b are exposed.

[0079] Therefore, the manufacturing method of the present invention mainly embeds the electronic module 2 a in the substrate structure 20 . Therefore, compared with the prior art, the thickness of the electronic package 2 of the present invention is thinner to meet the thinning requirement.

[0080] Furthermore, the flexible substrate 21 can form a laminated plate structure after bending, so that the substrate structure 20 can form a recess 200 with a smaller width R, so as to reduce the width of the substrate structure 20. Based on the smaller embedding space of the recess 200, the design of the laminated plate structure can facilitate the configuration of the required number of electronic components 22.

[0081] FIG. 3A to FIG. 3C The cross-sectional view of the manufacturing method of the second embodiment of the electronic package 3 of the present invention is shown in FIG. The difference between this embodiment and the first embodiment is that a second circuit structure 36 is added, and the other processes are substantially the same, so the same points will not be described in detail below.

[0082] like Figure 3A As shown, continued Figure 2C The carrier 9 is removed by a process to expose the second surface 20b of the substrate structure 20 and the second side 21b of the flexible substrate 21 (or laminate structure) of the electronic module 2a.

[0083] In this embodiment, the first cladding layer 23 and the second electronic component 22 b in the concave portion 200 are exposed at the bottom side of the concave portion 200 .

[0084] like Figure 3B As shown, a second encapsulation layer 35 is formed on the second surface 20b of the substrate structure 20 and the second side 21b of the flexible substrate 21 (or laminate structure) of the electronic module 2a, so that the second encapsulation layer 35 covers the recess 200 and encapsulates the second electronic component 22b on the same side as the second surface 20b of the substrate structure 20.

[0085] In this embodiment, the second coating layer 35 is made of insulating material, such as Ajinomoto build-up film (ABF) or other dielectric materials, which can be formed on the substrate structure 20 and the electronic module 2a by lamination or molding.

[0086] It should be understood that the material forming the second cladding layer 35 and the material forming the first cladding layer 23 can be the same or different.

[0087] like Figure 3C As shown, a second circuit structure 36 is formed on the second cladding layer 35 to obtain a symmetrical electronic package 3 , and the second circuit structure 36 electrically connects the substrate structure 20 and the electronic module 2 a .

[0088] In the present embodiment, the second circuit structure 36 includes at least one second circuit layer 360 formed on the second cladding layer 35 and a second conductive column 361 formed in the second cladding layer 35, so that the second circuit layer 360 is electrically connected to the second wiring layer 202 and the second electronic component 22b through the second conductive column 361. For example, the second circuit layer 360 is made by electroplating metal (such as copper) or other methods, and a blind hole can be formed on the second cladding layer 35, and then a metal material is electroplated or deposited in the blind hole to form the second conductive column 361. It should be understood that the second circuit structure 36 adopts a build-up process to form multiple ABF layers on the second cladding layer 35 as required and combine the circuit layers of each ABF to produce a multi-layer circuit layer.

[0089] Furthermore, the number of wiring layers of the first and second circuit structures 24 , 36 can be designed according to requirements, so that the number of layers of the first and second circuit layers 240 , 360 are the same.

[0090] Therefore, the manufacturing method of the present invention facilitates designing asymmetric or symmetric electronic packages 2 , 3 according to requirements by designing the substrate structure 20 .

[0091] The present invention also provides an electronic package 2 , 3 , comprising: a substrate structure 20 having a first surface 20 a and a second surface 20 b opposite to each other, at least one electronic module 2 a embedded in the substrate structure 20 , a first coating layer 23 and a first circuit structure 24 .

[0092] The substrate structure 20 has a conductive through hole 203 connecting the first surface 20 a and the second surface 20 b , wherein the first surface 20 a of the substrate structure 20 has a recess 200 .

[0093] The electronic module 2 a is embedded in the recess 200 , and includes a flexible substrate 21 and a plurality of electronic components 22 disposed on two opposite sides of the flexible substrate 21 .

[0094] The first coating layer 23 is formed on the first surface 20 a of the substrate structure 20 and in the recess 200 to coat the electronic module 2 a .

[0095] The first circuit structure 24 is disposed on the first cladding layer 23 and electrically connects at least one of the plurality of electronic components 22 and the conductive via 203 .

[0096] In one embodiment, the flexible substrate 21 is a flexible circuit board, which is bent to form a staggered laminated board structure so that the staggered laminated board structure is embedded in the recess 200. For example, the staggered laminated board structure is defined with staggered first board portions 211 and second board portions 212, so that the electronic component 22 on the first board portion 211 is regarded as a first electronic component 22a, and the electronic component 22 on the second board portion 212 is regarded as a second electronic component 22b.

[0097] In one embodiment, the electronic package 3 further includes: a second coating layer 35 formed on the second surface 20b of the substrate structure 20; and a second circuit structure 36 disposed on the second coating layer 35 and electrically connecting another one of the plurality of electronic components 22 and the conductive via 203. For example, the second coating layer 35 coats another one of the plurality of electronic components 22 on the same side as the second surface 20b of the substrate structure 20.

[0098] In summary, the electronic package and the manufacturing method thereof of the present invention embeds the electronic module in the substrate structure, so the thickness of the electronic package of the present invention is thinner to meet the thinning requirement.

[0099] Furthermore, the flexible substrate can form a laminated plate structure after bending, so that the substrate structure can form a recessed portion with a smaller width, thereby facilitating the reduction of the width of the substrate structure. Moreover, based on the smaller embedding space of the recessed portion, the design of the laminated plate structure facilitates the configuration of the required number of electronic components.

[0100] The above embodiments are used to illustrate the principles and effects of the present invention, but are not used to limit the present invention. Those skilled in the art may modify the above embodiments without violating the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be as listed in the claims.

Claims

1. An electronic package, comprising: A substrate structure having a first surface and a second surface opposite to each other and a conductive through hole connecting the first surface and the second surface, wherein the first surface of the substrate structure has a recess; An electronic module is embedded in the concave portion, and the electronic module includes a flexible substrate and a plurality of electronic components disposed on opposite sides of the flexible substrate, and the flexible substrate is a flexible circuit board, which is bent to form a staggered laminated board structure, so that the staggered laminated board structure is embedded in the concave portion; A first coating layer formed on the first surface of the substrate structure and in the recess to coat the electronic module; and The first circuit structure is disposed on the first cladding layer and electrically connects at least one of the plurality of electronic components and the conductive through hole.

2. The electronic package according to claim 1, wherein: The staggered laminated board structure is defined with a first board portion and a second board portion which are staggered and laminated, so that the electronic component on the first board portion is regarded as a first electronic component, and the electronic component on the second board portion is regarded as a second electronic component.

3. The electronic package of claim 1, wherein: The electronic package also includes: A second cladding layer is formed on the second surface of the substrate structure; and The second circuit structure is disposed on the second cladding layer and electrically connects another one of the plurality of electronic components and the conductive through hole.

4. The electronic package as claimed in claim 3, wherein: The second covering layer covers another one of the plurality of electronic components on the same side as the second surface of the substrate structure.

5. A method for manufacturing an electronic package, comprising: A substrate structure and at least one electronic module are provided, wherein the substrate structure has a first surface and a second surface opposite to each other and a conductive through hole connecting the first surface and the second surface, and the electronic module includes a flexible substrate and a plurality of electronic components disposed on two opposite sides of the flexible substrate, wherein a recess is provided on the first surface of the substrate structure, and the flexible substrate is a flexible circuit board, which forms a staggered laminated board structure after being bent, so that the staggered laminated board structure is embedded in the recess; embedding the electronic module in the recess; forming a first coating layer on the first surface of the substrate structure and in the recess, so that the first coating layer covers the electronic module; and A first circuit structure is formed on the first cladding layer so that the first circuit structure electrically connects at least one of the plurality of electronic components and the conductive through hole.

6. The method for manufacturing an electronic package as claimed in claim 5, wherein: The staggered laminated board structure is defined with a first board portion and a second board portion which are staggered and laminated, so that the electronic component on the first board portion is regarded as a first electronic component, and the electronic component on the second board portion is regarded as a second electronic component.

7. The method for manufacturing an electronic package as claimed in claim 5, wherein: The method also includes: forming a second cladding layer on the second surface of the substrate structure; and A second circuit structure is formed on the second cladding layer so that the second circuit structure electrically connects another one of the plurality of electronic components and the conductive through hole.

8. The method for manufacturing an electronic package as claimed in claim 7, wherein: The second covering layer covers another one of the plurality of electronic components on the same side as the second surface of the substrate structure.

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