Display panel, display device and preparation method of display panel

Abstract

The application discloses a display panel, a display device and a preparation method of the display panel. The display panel comprises a substrate, an isolation structure located on one side of the substrate, the isolation structure comprising an isolation part and an isolation opening formed by the isolation part, and a light-emitting unit arranged in the isolation opening. The isolation part comprises a first sub-layer and a second sub-layer arranged in layers, the second sub-layer is located on the side of the first sub-layer facing the substrate, the orthographic projection of the first sub-layer on the substrate is located within the orthographic projection of the second sub-layer on the substrate, and the material of the second sub-layer comprises a corrosion-resistant conductive material. The application can improve the yield of the display panel.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a display panel, a display device, and a method for manufacturing the display panel. Background Technology

[0002] Organic light-emitting diode (OLED) display panels, as flat panel displays, are widely used in various consumer electronics products such as mobile phones, televisions, personal digital assistants, digital cameras, laptops, and desktop computers due to their advantages such as high image quality, energy saving, thin body, and wide range of applications, becoming the mainstream display panel. Summary of the Invention

[0003] This application provides a display panel, a display device, and a method for manufacturing the display panel, aiming to improve the yield of the display panel.

[0004] An embodiment of the first aspect of this application provides a display panel, the display panel comprising: a substrate; an isolation structure located on one side of the substrate, the isolation structure including an isolation portion and an isolation opening formed by the isolation portion; and a light-emitting unit disposed in the isolation opening, wherein the isolation portion includes a first sub-layer and a second sub-layer stacked thereon, the second sub-layer being located on the side of the first sub-layer facing the substrate, the orthographic projection of the first sub-layer onto the substrate being located within the orthographic projection of the second sub-layer onto the substrate, and the material of the second sub-layer comprising a corrosion-resistant conductive material.

[0005] According to an embodiment of the first aspect of this application, the isolation portion further includes a third sublayer, which is located on the side of the first sublayer away from the substrate, and the orthographic projection of the first sublayer onto the substrate is located within the orthographic projection of the third sublayer onto the substrate.

[0006] According to any of the foregoing embodiments of the first aspect of this application, the orthographic projection of the second sublayer onto the substrate lies within the orthographic projection of the third sublayer onto the substrate.

[0007] According to any of the foregoing embodiments of the first aspect of this application, the projected area of ​​the second sublayer on the substrate is smaller than the projected area of ​​the third sublayer on the substrate.

[0008] According to any of the foregoing embodiments of the first aspect of this application, along a direction perpendicular to the stacking of the first sublayer and the second sublayer, the dimension of the second sublayer extending out of the first sublayer is smaller than the dimension of the third sublayer extending out of the first sublayer.

[0009] According to any of the foregoing embodiments of the first aspect of this application, the material of the third sublayer includes a conductive material.

[0010] According to any of the foregoing embodiments of the first aspect of this application, the material of the third sub-layer includes an insulating material, and the first sub-layer further includes a first through hole extending along the thickness direction of the display panel, wherein a first insulating portion connected to the third sub-layer is disposed in the first through hole.

[0011] According to any of the foregoing embodiments of the first aspect of this application, the first through hole penetrates the first sub-layer along the thickness direction.

[0012] According to any of the foregoing embodiments of the first aspect of this application, the first sublayer includes a plurality of first conductive portions, each first conductive portion being disposed around each isolation opening, and two adjacent first conductive portions being spaced apart to form a first through hole.

[0013] According to any of the foregoing embodiments of the first aspect of this application, the second sublayer further includes a second through hole extending along the thickness direction, the second through hole communicating with the first through hole, and a second insulating portion connected to the first insulating portion is disposed in the second through hole.

[0014] According to any of the foregoing embodiments of the first aspect of this application, the second through hole penetrates the second sublayer along the thickness direction.

[0015] According to any of the foregoing embodiments of the first aspect of this application, the second sublayer includes a plurality of second conductive portions, each second conductive portion being disposed around each isolation opening, and two adjacent second conductive portions being spaced apart to form a second through hole.

[0016] According to any of the foregoing embodiments of the first aspect of this application, a power signal line is further provided in the substrate, and the power signal line is connected to a second sublayer via.

[0017] According to any of the foregoing embodiments of the first aspect of this application, the isolation portion further includes a fourth sub-layer located on the side of the second sub-layer facing the substrate, and the fourth sub-layer and the second sub-layer are made of different materials.

[0018] According to any of the foregoing embodiments of the first aspect of this application, the fourth sub-layer further includes a fourth through hole extending along the thickness direction, the fourth through hole being interconnected with the second through hole and the first through hole, and a fourth insulating portion interconnected with the second insulating portion is provided in the fourth through hole.

[0019] According to any of the foregoing embodiments of the first aspect of this application, the fourth through hole penetrates the fourth sub-layer along the thickness direction.

[0020] According to any of the foregoing embodiments of the first aspect of this application, the fourth sublayer includes a plurality of fourth conductive portions, each fourth conductive portion being disposed around each isolation opening, and two adjacent fourth conductive portions being spaced apart to form a fourth through hole.

[0021] According to any of the foregoing embodiments of the first aspect of this application, the orthographic projection of the fourth sublayer onto the substrate lies within the orthographic projection of the third sublayer onto the substrate.

[0022] According to any of the foregoing embodiments of the first aspect of this application, the orthographic projection of the second sublayer on the substrate is located within the orthographic projection of the fourth sublayer on the substrate, or the orthographic projection of the second sublayer on the substrate overlaps with the orthographic projection of the fourth sublayer on the substrate.

[0023] According to any of the foregoing embodiments of the first aspect of this application, the material of the fourth sublayer includes molybdenum.

[0024] According to any of the foregoing embodiments of the first aspect of this application, the material of the second sublayer includes at least one of titanium, indium tin oxide, and indium zinc oxide.

[0025] According to any of the foregoing embodiments of the first aspect of this application, it further includes a first electrode located on the side of the light-emitting unit away from the substrate; the first electrode is electrically connected to the second sub-layer, and / or the material of the first sub-layer includes a conductive material, and the first electrode and the first sub-layer are electrically connected to each other.

[0026] According to any of the foregoing embodiments of the first aspect of this application, the first electrode is electrically connected to the second sublayer, a portion of the second sublayer extends out of the first sublayer to form an extension, and the first electrode overlaps the side of the extension away from the substrate.

[0027] A second aspect of this application provides a display device including a display panel as described in the first aspect embodiment.

[0028] An embodiment of the third aspect of this application provides a method for manufacturing a display panel, comprising:

[0029] A second submaterial layer and a first submaterial layer are sequentially disposed on the substrate;

[0030] A first sub-material layer is patterned to form a first sub-layer, and a second sub-material layer is patterned to form a second sub-layer. The first sub-layer and the second sub-layer are combined to form an isolation portion, and the isolation portion encloses an isolation opening. The orthographic projection of the first sub-layer onto the substrate is located within the orthographic projection of the second sub-layer onto the substrate, and the material of the second sub-layer includes a corrosion-resistant conductive material. The multiple isolation openings include a first opening, a second opening, and a third opening.

[0031] A first light-emitting material layer, a first electrode material layer, and a first encapsulation material layer are sequentially disposed on a substrate;

[0032] The first light-emitting material layer, the first electrode material layer, and the first encapsulation material layer in the areas where the second and third openings are located are removed to form the first light-emitting unit, the first electrode, and the first encapsulation unit located in the first opening.

[0033] According to an embodiment of the third aspect of this application, the step of sequentially disposing of a second sub-material layer and a first sub-material layer on a substrate further includes: sequentially disposing of a fourth sub-material layer, a second sub-material layer, and a first sub-material layer on the substrate;

[0034] After the steps of patterning the first sub-material layer to form the first sub-layer and patterning the second sub-material layer to form the second sub-layer, the process further includes: patterning the fourth sub-material layer to form the fourth sub-layer.

[0035] According to any of the foregoing embodiments of the third aspect of this application, in the steps of patterning a first sub-material layer to form a first sub-layer and patterning a second sub-material layer to form a second sub-layer: a dry etching process is used to pattern the second sub-material layer to form a second sub-layer;

[0036] In the step of patterning the fourth sub-material layer to form the fourth sub-layer: a wet etching process is used to pattern the fourth sub-material layer to form the fourth sub-layer.

[0037] According to any of the foregoing embodiments of the third aspect of this application, the step of sequentially disposing of the second sub-material layer and the first sub-material layer on the substrate further includes: sequentially disposing of the second sub-material layer, the first sub-material layer, and the third sub-material layer on the substrate;

[0038] Before the steps of patterning a first sub-material layer to form a first sub-layer and patterning a second sub-material layer to form a second sub-layer, the method further includes: patterning a third sub-material layer to form a third sub-layer, wherein the orthographic projection of the first sub-layer onto the substrate lies within the orthographic projection of the third sub-layer onto the substrate.

[0039] According to the embodiments of this application, the display panel includes a substrate, an isolation structure, and light-emitting units. The isolation structure includes an isolation portion and an isolation opening formed by the isolation portion. Light-emitting units are disposed within the isolation opening to achieve light emission and display of the display panel. During the fabrication of the display panel, organic light-emitting materials can be separated by the isolation portion to form independent light-emitting units, eliminating the need for a precision mask fabrication process. The isolation portion includes a first sub-layer and a second sub-layer. The orthographic projection of the first sub-layer onto the substrate lies within the orthographic projection of the second sub-layer onto the substrate; that is, the size of the second sub-layer is greater than or equal to the size of the first sub-layer. During the subsequent fabrication of the first electrode on the light-emitting unit, the first electrode can be overlapped with the second sub-layer to achieve interconnection between multiple first electrodes. The material of the second sub-layer includes a corrosion-resistant conductive material, making the second sub-layer less susceptible to corrosion and breakage, thereby improving the connection yield between the first electrode and the second sub-layer, and thus improving the yield of the display panel. Attached Figure Description

[0040] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings, in which the same or similar reference numerals denote the same or similar features, and the drawings are not drawn to scale.

[0041] Figure 1 This illustration shows a partial structural diagram of a display panel provided in an embodiment of this application;

[0042] Figure 2 Show Figure 1 Sectional view at point AA;

[0043] Figure 3 Another example is shown. Figure 1 Sectional view at point AA;

[0044] Figure 4 Show Figure 1 Sectional view at point BB;

[0045] Figure 5 Another example is shown. Figure 1 Sectional view at point AA;

[0046] Figure 6 Another example is shown. Figure 1 Sectional view at point AA;

[0047] Figure 7 Another example is shown. Figure 1 Sectional view at point BB;

[0048] Figure 8 In another example Figure 1 Sectional view at point AA;

[0049] Figure 9 A schematic diagram illustrating the manufacturing process of the display panel provided in an embodiment of this application is shown.

[0050] Figures 10 to 17 This diagram illustrates the process structure of the method for manufacturing a display panel according to an embodiment of this application. Attached image description:

[0052] 10. Display panel; 11. Red subpixel; 12. Green subpixel; 13. Blue subpixel;

[0053] 100. Substrate;

[0054] 200. Isolation structure; 210. Isolation portion; 211. First sub-layer; 211a. First through-hole; 211b. First conductive portion; 211c. First insulating portion; 212. Second sub-layer; 212a. Second through-hole; 212b. Second conductive portion; 212c. Second insulating portion; 213. Third sub-layer; 214. Fourth sub-layer; 214a. Fourth through-hole; 214b. Fourth conductive portion; 214c. Fourth insulating portion; 220. Isolation opening; 221. First opening; 222. Second opening; 223. Third opening;

[0055] 300, Light-emitting unit; 310, First light-emitting unit; 320, Second light-emitting unit; 330, Third light-emitting unit;

[0056] 400, First electrode layer; 410, First electrode;

[0057] 500, Encapsulation layer; 510, Encapsulation unit; 511, First encapsulation unit; 512, Second encapsulation unit; 513, Third encapsulation unit;

[0058] 600, Pixel definition layer; 610, Pixel limiting section; 620, Pixel opening; 630, Accommodation opening. Detailed Implementation

[0059] The features and exemplary embodiments of various aspects of this application will now be described in detail. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain this application and are not configured to limit this application. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples of this application.

[0060] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.

[0061] It should be understood that when describing the structure of a component, when referring to a layer or region as being "above" or "on top of" another layer or region, it can mean that it is directly above the other layer or region, or that it contains other layers or regions between it and the other layer or region. Furthermore, if the component is flipped over, that layer or region will be located "below" or "under" the other layer or region.

[0062] It should be understood that the term "and / or" used in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0063] In the embodiments of this application, the term "connection" can refer to two components being directly connected, or it can refer to two components being connected via one or more other components.

[0064] Various modifications and variations can be made to this application without departing from its spirit or scope, which will be apparent to those skilled in the art. Therefore, this application is intended to cover modifications and variations falling within the scope of the corresponding claims (the claimed technical solutions) and their equivalents. It should be noted that the embodiments provided in this application can be combined with each other without contradiction.

[0065] This application provides a display panel, a display device, and a method for manufacturing the display panel. The following description, in conjunction with the accompanying drawings, will illustrate various embodiments of the display panel, the display device, and the method for manufacturing the display panel.

[0066] The display panel provided in the embodiments of this application is described below. The display panel provided in the embodiments of this application may be an OLED display panel.

[0067] Figure 1 This is a partial structural schematic diagram of a display panel 10 provided in an embodiment of this application. Figure 2 An example is shown. Figure 1 Sectional view at point AA.

[0068] like Figure 1 and Figure 2As shown, an embodiment of the first aspect of this application provides a display panel 10, which includes a substrate 100, an isolation structure 200, and a light-emitting unit 300. The isolation structure 200 is located on one side of the substrate 100 and includes an isolation portion 210 and an isolation opening 220 formed by the isolation portion 210. The light-emitting unit 300 is disposed in the isolation opening 220. The isolation portion 210 includes a first sub-layer 211 and a second sub-layer 212 stacked together. The second sub-layer 212 is located on the side of the first sub-layer 211 facing the substrate 100. The orthographic projection of the first sub-layer 211 onto the substrate 100 is located within the orthographic projection of the second sub-layer 212 onto the substrate 100. The material of the second sub-layer 212 includes a corrosion-resistant conductive material.

[0069] According to the embodiments of this application, the display panel 10 includes a substrate 100, an isolation structure 200, and light-emitting units 300. The isolation structure 200 includes an isolation portion 210 and an isolation opening 220 formed by the isolation portion 210. The light-emitting units 300 are disposed within the isolation opening 220 to realize the light emission display of the display panel 10. During the fabrication process of the display panel 10, organic light-emitting materials can be separated from each other by the isolation portion 210 to form independent light-emitting units 300, which can eliminate the need for a precision mask fabrication process. The isolation portion 210 includes a first sub-layer 211 and a second sub-layer 212. The orthographic projection of the first sub-layer 211 onto the substrate 100 is located within the orthographic projection of the second sub-layer 212 onto the substrate 100, that is, the size of the second sub-layer 212 is greater than or equal to the size of the first sub-layer 211. When the first electrode 410 on the light-emitting unit 300 is subsequently fabricated, the first electrode 410 can be overlapped with the second sub-layer 212 to achieve interconnection between multiple first electrodes 410. The material of the second sub-layer 212 includes a corrosion-resistant conductive material, which makes the second sub-layer 212 less susceptible to corrosion and breakage, thereby improving the connection yield of the first electrode 410 and the second sub-layer 212, and thus improving the yield of the display panel 10.

[0070] Optionally, the light-emitting unit 300 includes at least one of a hole injection layer, a hole transport layer, an electron blocking layer, a light-emitting structure layer, a hole blocking layer, an electron transport layer, and an electron injection layer.

[0071] Optionally, the display panel 10 further includes a first electrode layer 400, which includes a first electrode 410 located on the side of the light-emitting unit 300 facing away from the substrate 100. The first electrode 410 and the second sub-layer 212 are electrically connected to each other, such that multiple first electrodes 410 can be electrically connected to each other through the second sub-layer 212. Optionally, at least a portion of the second sub-layer 212 extends out of the first sub-layer 211 to form an extension, and the first electrode 410 can overlap the side of the extension facing away from the substrate 100. The extension refers to the portion of the second sub-layer 212 that extends out of the first sub-layer 211.

[0072] Optional, such as Figure 3 As shown, the display panel 10 also includes an encapsulation layer 500, which includes an encapsulation unit 510 located on the side of the first electrode 410 facing away from the substrate 100. The encapsulation unit 510 is used to provide sealing protection to the light-emitting unit 300.

[0073] Optional, such as Figure 1 As shown, the display panel 10 includes a red sub-pixel 11, a green sub-pixel 12, and a blue sub-pixel 13, which are formed in different process steps for different colors. Figure 4 As shown, the light-emitting unit 300 may include a first light-emitting unit 310 for emitting red light, a second light-emitting unit 320 for emitting green light, and a third light-emitting unit 330 for emitting green light. The encapsulation unit 510 includes a first encapsulation unit 511 for encapsulating the first light-emitting unit 310, a second encapsulation unit 512 for encapsulating the second light-emitting unit 320, and a third encapsulation unit 513 for encapsulating the third light-emitting unit 330. The isolation opening 220 includes a first opening 221 for accommodating the first light-emitting unit 310, a second opening 222 for accommodating the second light-emitting unit 320, and a third opening 223 for accommodating the third light-emitting unit 330.

[0074] For example, the first light-emitting unit 310, the first electrode 410, and the first encapsulation unit 511 of the red sub-pixel 11 can be deposited onto the substrate 100 with the isolation structure 200. Due to the presence of the isolation structure 200, the first light-emitting unit 310 and the first electrode 410 can be separated by the isolation structure 200 to form independent first light-emitting units 310 and first electrodes 410 located in each isolation opening 220. At this time, the light-emitting unit 300, the first electrode 410, and the encapsulation unit 510 of the red sub-pixel 11 are also provided in the second opening 222 and the third opening 223, and need to be etched away. When etching the first electrode 410 and the light-emitting unit 300 within the second opening 222 and the third opening 223, an acidic etching solution can be used for removal. Since the material of the second sub-layer 212 includes a corrosion-resistant conductive material, the second sub-layer 212 within the second opening 222 and the third opening 223 is not easily corroded and broken. When the first electrode 410 within the second opening 222 and the third opening 223 is subsequently fabricated, the connection yield between the first electrode 410 within the second opening 222 and the second sub-layer 212 can be guaranteed, thereby improving the overall yield of the display panel 10.

[0075] Optionally, the display panel 10 further includes a pixel definition layer 600, which includes a pixel defining portion 610 and a pixel opening 620 formed by the pixel defining portion 610. The pixel opening 620 is located within the isolation opening 220, and the light-emitting unit 300 is located within the pixel opening 620. The isolation structure 200 may be located on the pixel defining portion 610, or, as... Figure 5 As shown, the pixel limiting portion 610 also encloses and forms a receiving opening 630, and the isolation structure 200 is located on the substrate 100 exposed by the receiving opening 630.

[0076] Optionally, the display panel also includes pixel electrodes located on the side of the light-emitting unit 300 away from the first electrode 410.

[0077] In some alternative embodiments, such as Figure 3 As shown, the isolation portion 210 also includes a third sub-layer 213, which is located on the side of the first sub-layer 211 away from the substrate 100, and the orthographic projection of the first sub-layer 211 onto the substrate 100 is located within the orthographic projection of the third sub-layer 213 onto the substrate 100.

[0078] In these optional embodiments, the isolation portion 210 further includes a third sub-layer 213, which is located above the first sub-layer 211. The orthographic projection of the first sub-layer 211 onto the substrate 100 is located within the orthographic projection of the third sub-layer 213 onto the substrate 100. That is, the size of the first sub-layer 211 is less than or equal to the size of the third sub-layer 213, so that a step or concave structure can be formed at the edge of the isolation portion 210, making the organic material or the first electrode layer 400 easily break at the edge of the isolation portion 210 to form independent light-emitting units 300 and first electrodes 410.

[0079] Optionally, the size of the first sub-layer 211 is smaller than the size of the third sub-layer 213, and the third sub-layer 213 extends out of the first sub-layer 211 in a direction perpendicular to the stacking of the third sub-layer 213 and the first sub-layer 211. For example, the third sub-layer 213 extends out of the first sub-layer 211 from different positions in the circumferential direction, so that the side of the third sub-layer 213 facing the substrate 100 can form a concave structure, where the organic light-emitting material is more easily broken into independent light-emitting units 300.

[0080] Optionally, the orthographic projection of the second sublayer 212 onto the substrate 100 lies within the orthographic projection of the third sublayer 213 onto the substrate 100. That is, the size of the second sublayer 212 is less than or equal to the size of the third sublayer 213, which can improve the problem that organic light-emitting materials tend to fall onto the second sublayer 212, resulting in poor connection between the second sublayer 212 and the first electrode 410.

[0081] Optionally, the projected area of ​​the second sublayer 212 on the substrate 100 is smaller than the projected area of ​​the third sublayer 213 on the substrate 100. That is, the size of the second sublayer 212 is smaller than the size of the third sublayer 213. When the organic material layer falls on the isolation structure 200, the third sublayer 213 blocks the organic material layer, making it difficult for the organic material layer to fall on the second sublayer 212. This can improve the problem that the organic light-emitting material easily falls on the second sublayer 212, resulting in poor connection between the second sublayer 212 and the first electrode 410.

[0082] Optionally, the size of the first sublayer 211 is smaller than the size of the second sublayer 212, so that the first electrode 410 can be easily attached to the second sublayer 212.

[0083] Optional, continue to refer to Figure 2 Along a direction perpendicular to the stacking of the first sub-layer 211 and the second sub-layer 212, the dimension 'a' of the second sub-layer 212 extending beyond the first sub-layer 211 is smaller than the dimension 'b' of the third sub-layer 213 extending beyond the first sub-layer 211. When the organic material layer falls on the isolation structure 200, the third sub-layer 213 blocks it, making it difficult for the organic material layer to fall onto the second sub-layer 212. This improves the problem of the organic light-emitting material easily falling onto the second sub-layer 212, leading to poor connection between the second sub-layer 212 and the first electrode 410.

[0084] The stacking direction of the first sub-layer 211 and the second sub-layer 212, and the stacking direction of the third sub-layer 213 and the first sub-layer 211, are the thickness direction of the display panel 10. The direction perpendicular to the thickness direction can be any direction pointing from the first sub-layer 211 to its periphery.

[0085] Optionally, the material of the first sublayer 211 includes a conductive material, enabling the plurality of first electrodes 410 to be electrically connected to each other through the second sublayer 212 and the first sublayer 211.

[0086] There are various ways to set the material of the third sub-layer 213. The material of the third sub-layer 213 may include conductive material to increase the electrical connection area between adjacent first electrodes 410.

[0087] In some other alternative embodiments, such as Figure 6 As shown, the material of the third sub-layer 213 includes an insulating material, and the first sub-layer 211 also includes a first through hole 211a extending along the thickness direction of the display panel 10. A first insulating part 211c that is interconnected with the third sub-layer 213 is provided in the first through hole 211a.

[0088] In these optional embodiments, the material of the third sub-layer 213 includes an insulating material. A first through-hole 211a is provided on the first sub-layer 211. During the fabrication of the third sub-layer 213, the insulating material can fall into the first through-hole 211a to form a first insulating portion 211c, and the insulating material falls onto the first sub-layer 211 to form the third sub-layer 213. By providing the first insulating portion 211c, when adjacent light-emitting units 300 overlap with the first sub-layer 211 and / or the second sub-layer 212, crosstalk between charge carriers between adjacent light-emitting units 300 can be improved, thereby enhancing the display effect of the display panel 10.

[0089] Optionally, the first sublayer 211 includes a plurality of first conductive portions 211b, each first conductive portion 211b being disposed around each isolation opening 220, and a first through-hole 211a being formed between adjacent first conductive portions 211b. That is, the first through-hole 211a divides the first sublayer 211 into a plurality of mutually insulated first conductive portions 211b. Specifically, the first through-hole 211a is disposed through the first sublayer 211 along the thickness direction Z. Optionally, the first through-hole 211a has a grid-like appearance in its orthographic projection onto the substrate 100.

[0090] In these optional embodiments, multiple first conductive parts 211b are arranged independently, and adjacent first conductive parts 211b are insulated from each other by first insulating parts 211c, which can better improve the problem of easy crosstalk between adjacent light-emitting units 300.

[0091] Optionally, the second sub-layer 212 further includes a second through-hole 212a extending along the thickness direction. The second through-hole 212a communicates with the first through-hole 211a, and a second insulating portion 212c connected to the first insulating portion 211c is provided inside the second through-hole 212a. By providing the second insulating portion 212c, the problem of easy crosstalk between adjacent light-emitting units 300 can be better improved.

[0092] Optionally, the second sub-layer 212 includes a plurality of second conductive portions 212b, each second conductive portion 212b being disposed around each isolation opening 220, and two adjacent second conductive portions 212b being spaced apart to form a second through hole 212a. That is, the second through hole 212a is disposed through the second sub-layer 212 along the thickness direction Z.

[0093] In these embodiments, multiple second conductive parts 212b are arranged independently of each other, and multiple first conductive parts 211b are also arranged independently of each other, so that multiple first electrodes 410 connected to the second conductive parts 212b and the first conductive parts 211b are arranged independently of each other, enabling independent control of the first electrodes 410.

[0094] Optionally, each first conductive portion 211b is located on the side of each second conductive portion 212b away from the substrate 100, and the first conductive portion 211b and the second conductive portion 212b are correspondingly arranged to improve the short-circuit connection problem between adjacent first conductive portions 211b and second conductive portions 212b.

[0095] Optionally, a power signal line is also provided in the substrate 100, and the power signal line is connected to the second sublayer 212 via a via. For example, the power signal line is connected to the second conductive portion 212b of the second sublayer 212 via a via, so that the first electrode 410 connected to the second conductive portion 212b can be electrically connected to the power signal line.

[0096] In some alternative embodiments, such as Figure 3 and Figure 7 As shown, the isolation portion 210 also includes a fourth sub-layer 214 located on the side of the second sub-layer 212 facing the substrate 100. The fourth sub-layer 214 is made of a different material than the second sub-layer 212. When the isolation portion 210 is disposed on the pixel defining portion 610, the fourth sub-layer 214 can mitigate the impact on the pixel defining portion 610 during the patterning process of the second sub-layer 212. When the isolation portion 210 is disposed on the substrate 100 exposed by the receiving opening 630, the fourth sub-layer 214 can mitigate the impact on the substrate 100 during the patterning process of the second sub-layer 212.

[0097] Optionally, the orthographic projection of the fourth sublayer 214 onto the substrate 100 is located within the orthographic projection of the third sublayer 213 onto the substrate 100, and the shielding of the third sublayer 213 makes it difficult for organic materials to fall onto the fourth sublayer 214.

[0098] Optionally, the orthographic projection of the second sublayer 212 onto the substrate 100 lies within the orthographic projection of the fourth sublayer 214 onto the substrate 100, or the orthographic projection of the second sublayer 212 onto the substrate 100 overlaps with the orthographic projection of the fourth sublayer 214 onto the substrate 100, such that the fourth sublayer 214 can be fabricated after the second sublayer 212 has been fabricated.

[0099] There are various ways to set the material of the fourth sub-layer 214, such as molybdenum. By using a dry etching process to form the second sub-layer 212, the fourth sub-layer 214 is less susceptible to the effects of dry etching, and can provide better protection to the pixel limiting part 610 or the substrate 100.

[0100] Optional, such as Figure 8As shown, when the isolation portion 210 includes a fourth sub-layer 214, the fourth sub-layer 214 further includes a fourth through-hole 214a extending along the thickness direction. The fourth through-hole 214a communicates with the second through-hole 212a, and a fourth insulating portion 214c, which is connected to the second insulating portion 212c, is provided inside the fourth through-hole 214a. By providing the fourth insulating portion 214c, the problem of easy crosstalk between adjacent light-emitting units 300 can be better improved.

[0101] Optionally, the fourth sublayer 214 includes a plurality of fourth conductive portions 214b, each fourth conductive portion 214b being disposed around each isolation opening 220, and two adjacent fourth conductive portions 214b being spaced apart to form a fourth through hole 214a, so as to facilitate independent control of the first electrode 410.

[0102] There are various ways to set the material of the second sublayer 212. The material of the second sublayer 212 may include at least one of titanium, indium tin oxide, and indium zinc oxide, so as to improve the corrosion resistance of the second sublayer 212 and make the second sublayer 212 have good electrical conductivity.

[0103] The second aspect of this application also provides a display device, including the display panel 1010 of any of the first aspect embodiments described above. Since the display device provided in the second aspect of this application includes the display panel 1010 of any of the first aspect embodiments described above, the display device provided in the second aspect of this application has the beneficial effects of the display panel 1010 of any of the first aspect embodiments described above, which will not be elaborated further here.

[0104] The display devices in this application include, but are not limited to, mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, control consoles, and other devices with display functions.

[0105] Please refer to the following: Figures 1 to 9 The third aspect of this application also provides a method for manufacturing a display panel 10, wherein the display panel 10 can be any of the display panels 10 described in the first aspect. The method for manufacturing the display panel 10 includes:

[0106] Step S01: Sequentially deposit a second sub-material layer and a first sub-material layer on the substrate 100;

[0107] Step S02: The first sub-material layer is patterned to form a first sub-layer 211, and the second sub-material layer is patterned to form a second sub-layer 212. The first sub-layer 211 and the second sub-layer 212 are combined to form an isolation portion 210. The isolation portion 210 surrounds an isolation opening 220. The orthographic projection of the first sub-layer 211 on the substrate 100 is located within the orthographic projection of the second sub-layer 212 on the substrate 100. The material of the second sub-layer 212 includes a corrosion-resistant conductive material. The plurality of isolation openings 220 include a first opening 221, a second opening 222, and a third opening 223.

[0108] Step S:3: Sequentially deposit a first light-emitting material layer, a first electrode 410 material layer, and a first encapsulation material layer on the substrate 100.

[0109] Step S04: Remove the first light-emitting material layer, the first electrode 410 material layer, and the first encapsulation material layer in the areas where the second opening 222 and the third opening 223 are located to form the first light-emitting unit 310, the first electrode 410, and the first encapsulation unit 511 located in the first opening 221.

[0110] Optionally, the first opening 221, the second opening 222, and the third opening 223 are used to accommodate light-emitting units 300 of different colors. For example, the light-emitting units 300 of the display panel 10 include a first light-emitting unit 310, a second light-emitting unit 320, and a third light-emitting unit 330, which are used to emit light of different colors.

[0111] In the method for manufacturing the display panel 10 provided in this application embodiment, an isolation structure 200 including an isolation portion 210 and an isolation opening 220 is first formed on a substrate 100 through steps S01 and S02. In the subsequent step S03, when the first light-emitting material layer is manufactured, the first light-emitting material layer is easily broken at the location of the isolation portion 210 to form a plurality of first light-emitting units 310 spaced apart from each other. The first electrode 410 material layer can also be broken at the location of the isolation portion 210 to form a plurality of independently distributed first electrodes 410. Since the first light-emitting material layer, the first electrode 410 material layer, and the first encapsulation material layer are disposed across the entire surface, the first light-emitting material layer, the first electrode 410 material layer, and the first encapsulation material layer are removed from the second opening 222 and the third opening 223 in step S04, so that the first light-emitting unit 310 is located in the first opening 221. In step S04, when removing the first light-emitting material layer, the first electrode 410 material layer and the first encapsulation material layer, since the first electrode 410 material layer includes metal material, it needs to be removed with an etchant. The material of the second sub-layer 212 includes corrosion-resistant conductive material, which makes the second sub-layer 212 less prone to breakage when viewed from above. This can improve the connection yield of the first electrode 410 and the second sub-layer 212, thereby improving the yield of the display panel 10.

[0112] Optionally, after step S04, a second light-emitting material layer, a second electrode material layer, and a second encapsulation material layer can be sequentially deposited on the substrate 100. The second light-emitting material layer, the second electrode material layer, and the second encapsulation material layer located at the first opening 221 and the third opening 223 are then removed to form a second light-emitting unit 320, a first electrode 410, and a second encapsulation unit 512 located at the second opening 222. Next, a third light-emitting material layer, a third electrode material layer, and a third encapsulation material layer are sequentially deposited on the substrate 100. The third light-emitting material layer, the third electrode material layer, and the third encapsulation material layer located at the first opening 221 and the second opening 222 are then removed to form a third light-emitting unit 330, a first electrode 410, and a third encapsulation unit 513 located at the third opening 223. This completes the fabrication of the first light-emitting unit 310, the second light-emitting unit 320, and the third light-emitting unit 330, enabling the display panel 10 to possess first light-emitting units 310, second light-emitting units 320, and third light-emitting units 330 for emitting different colors of light.

[0113] Optionally, the material of the first sublayer 211 may include a conductive material. For example, the material of the first sublayer 211 may include aluminum.

[0114] In step S02, when patterning the first sub-material layer and the second sub-material layer, photolithography can be used to sequentially pattern the first sub-material layer to form the first sub-layer 211, and then photolithography can be used to pattern the second sub-material layer to form the second sub-layer 212. Alternatively, an etching solution can be used to pattern the first and second sub-material layers. By adjusting the composition of the etching solution, the etching rate of the first sub-material layer can be made greater than that of the second sub-material layer, thereby making the size of the first sub-layer 211 smaller than that of the second sub-layer 212.

[0115] Optionally, as described above, the isolation portion 210 may further include a fourth sub-layer 214. In step S01, a fourth sub-material layer, a second sub-material layer, and a first sub-material layer are sequentially formed on the substrate 100. After step S02, the process further includes patterning the fourth sub-material layer to form the fourth sub-layer 214.

[0116] In these alternative embodiments, when the second sub-layer 212 is patterned, the presence of the fourth sub-material layer makes the pixel limiting portion 610 or the substrate 100 covered by the fourth sub-material layer less susceptible to influence, thereby improving the yield of the display panel 10.

[0117] Optionally, in step S02, a dry etching process can be used to pattern the second sub-material layer to form the second sub-layer 212; in the step of patterning the fourth sub-material layer to form the fourth sub-layer 214, a wet etching process can be used to pattern the fourth sub-material layer to form the fourth sub-layer 214. Since the materials of the fourth sub-layer 214 and the second sub-layer 212 are different, the fourth sub-layer 214 needs to be prepared using a different process than the second sub-layer 212. When the second sub-layer 212 is prepared using a dry etching process, the fourth sub-material layer is less affected and can provide better protection to the pixel limiting portion 610 or the substrate 100, thereby improving the yield of the display panel 10.

[0118] Optionally, as described above, the isolation portion 210 further includes a third sub-layer 213. In this case, in step S01, a second sub-material layer, a first sub-material layer, and a third sub-material layer are sequentially disposed on the substrate 100. Before step S02, the method further includes: patterning the third sub-material layer to form the third sub-layer 213, wherein the orthographic projection of the first sub-layer 211 onto the substrate 100 lies within the orthographic projection of the third sub-layer 213 onto the substrate 100.

[0119] The following is combined with Figures 10 to 17 ,by Figure 7 The following example illustrates the preparation method of the display panel 10 provided in this application embodiment.

[0120] Step 1: As Figure 10As shown, a fourth sub-material layer, a second sub-material layer, a first sub-material layer and a third sub-material layer are sequentially disposed on the substrate 100.

[0121] Step Two: As Figure 11 As shown, the third sub-material layer is patterned to form the third sub-layer 213.

[0122] For example, the material of the third sub-material layer is titanium, and the titanium is patterned by dry etching to form the third sub-layer 213.

[0123] Step 3: As Figure 12 As shown, the first sub-material layer is patterned to form the first sub-layer 211.

[0124] For example, the material of the first sub-material layer is aluminum, and the first sub-material layer is patterned using a wet etching acidic solution to form the first sub-layer 211.

[0125] Step Four: As Figure 13 As shown, the second sub-material layer is patterned to form the second sub-layer 212. Due to the presence of the fourth sub-material layer, step four is less likely to damage the pixel limiting layer 600 or the substrate 100.

[0126] For example, the material of the second sub-material layer is titanium, and the second sub-material layer is patterned by dry etching to form the second sub-layer 212.

[0127] Step 5: As Figure 14 As shown, the fourth sub-material layer is patterned to form a fourth sub-layer 214. The fourth sub-layer 214, the second sub-layer 212, the first sub-layer 211, and the third sub-layer 213 combine to form an isolation portion 210, which encloses an isolation opening 220. The isolation opening 220 includes a first opening 221, a second opening 222, and a third opening 223. At least a portion of the pixel definition layer 600 is exposed through the isolation opening 220.

[0128] For example, the material of the fourth sub-material layer is molybdenum, and the fourth sub-material layer is patterned using a wet etching acidic solution to form the fourth sub-layer 214.

[0129] Step Six: As Figure 15 As shown, the pixel definition layer 600 exposed by the isolation opening 220 is patterned to form the pixel opening 620.

[0130] Step Seven: As Figure 16 As shown, a first light-emitting material layer, a first electrode 410 material layer, and a first encapsulation material layer are sequentially disposed on a substrate 100 with an isolation portion 210.

[0131] Step 8: As Figure 17As shown, the first light-emitting material layer, the first electrode 410 material layer, and the first encapsulation material layer in the areas where the second opening 222 and the third opening 223 are located are removed to form the light-emitting unit 300, the first electrode 410, and the first encapsulation unit 511 located in the first opening 221.

[0132] Optionally, after step eight, a second light-emitting material layer, a second electrode material layer, and a second encapsulation material layer may be further deposited on the substrate 100. The second light-emitting material layer, the second electrode material layer, and the second encapsulation material layer in the areas where the first opening 221 and the third opening 223 are located are then removed to form a second light-emitting unit 320, a first electrode 410, and a second encapsulation unit 512 located at the second opening 222. Alternatively, a third light-emitting material layer, a third electrode material layer, and a third encapsulation material layer may be further deposited on the substrate 100. The third light-emitting material layer, the third electrode material layer, and the third encapsulation material layer in the areas where the first opening 221 and the second opening 222 are located are then removed to form a third light-emitting unit 330, a first electrode 410, and a third encapsulation unit 513 located at the third opening 223.

[0133] In the preparation method provided in this application embodiment, when the light-emitting material layer and the electrode material layer are removed by the etching solution, since the material of the second sub-layer 212 includes a corrosion-resistant conductive material, the second sub-layer 212 is not easily affected, which can improve the electrical connection between the first electrode 410 and the first sub-layer 211 in the second opening 222 and the third opening 223, and improve the yield of the display panel 10.

[0134] The embodiments described above are not exhaustive, nor do they limit the application to the specific embodiments described herein. Clearly, many modifications and variations can be made based on the above description. These embodiments are selected and specifically described in this specification to better explain the principles and practical applications of this application, thereby enabling those skilled in the art to effectively utilize this application and its modifications. This application is limited only by the claims and their full scope and equivalents.

Claims

1. A display panel, characterized by, The display panel comprises: a substrate; an isolation structure on one side of the substrate, the isolation structure comprising an isolation portion and an isolation opening enclosed by the isolation portion; a light-emitting unit arranged in the isolation opening, wherein the isolation portion comprises a first sub-layer and a second sub-layer arranged in a stack, the second sub-layer is on a side of the first sub-layer facing the substrate, a projection of the first sub-layer on the substrate is within a projection of the second sub-layer on the substrate, and a material of the second sub-layer comprises a corrosion-resistant conductive material, the isolation portion further comprises a third sub-layer on a side of the first sub-layer away from the substrate, and a projection of the first sub-layer on the substrate is within a projection of the third sub-layer on the substrate, a width of an end of the first sub-layer away from the substrate is smaller than a width of an end of the first sub-layer close to the substrate.

2. The display panel of claim 1, wherein, a projection of the second sub-layer on the substrate is within a projection of the third sub-layer on the substrate.

3. The display panel of claim 1, wherein, an area of the projection of the second sub-layer on the substrate is smaller than an area of the projection of the third sub-layer on the substrate.

4. The display panel of claim 1, wherein, in a direction perpendicular to the first sub-layer and the second sub-layer arranged in a stack, a dimension of the second sub-layer protruding from the first sub-layer is smaller than a dimension of the third sub-layer protruding from the first sub-layer.

5. The display panel of claim 1, wherein: a material of the third sub-layer comprises a conductive material; or, a material of the third sub-layer comprises an insulating material, the first sub-layer further comprises a first through hole extending in a thickness direction of the display panel, and a first insulating portion in the first through hole is connected to the third sub-layer.

6. The display panel of claim 5, wherein, the first through hole penetrates the first sub-layer in the thickness direction.

7. The display panel of claim 5, wherein, the first sub-layer comprises a plurality of first conductive portions, each first conductive portion surrounds each isolation opening, and two adjacent first conductive portions are spaced apart to form the first through hole.

8. The display panel of claim 5, wherein, the second sub-layer further comprises a second through hole extending in the thickness direction, the second through hole is connected to the first through hole, and a second insulating portion in the second through hole is connected to the first insulating portion.

9. The display panel of claim 8, wherein, the second through hole penetrates the second sub-layer in the thickness direction.

10. The display panel of claim 8, wherein, the second sub-layer comprises a plurality of second conductive portions, each second conductive portion surrounds each isolation opening, and two adjacent second conductive portions are spaced apart to form the second through hole.

11. The display panel of claim 8, wherein, the isolation portion further comprises a fourth sub-layer on a side of the second sub-layer facing the substrate, a material of the fourth sub-layer is different from that of the second sub-layer, the fourth sub-layer further comprises a fourth through hole extending in the thickness direction, the fourth through hole is connected to the second through hole and the first through hole, and a fourth insulating portion in the fourth through hole is connected to the second insulating portion.

12. The display panel of claim 11, wherein, the fourth through hole penetrates the fourth sub-layer in the thickness direction.

13. The display panel of claim 11, wherein, the fourth sub-layer comprises a plurality of fourth conductive portions, each fourth conductive portion surrounds each isolation opening, and two adjacent fourth conductive portions are spaced apart to form the fourth through hole.

14. The display panel of claim 1, wherein, The substrate is further provided with a power signal line, the power signal line is connected with the second sub-layer via hole.

15. The display panel of claim 1, wherein, The isolation part further comprises a fourth sub-layer, which is located on the side of the second sub-layer facing the substrate, and the material of the fourth sub-layer is different from that of the second sub-layer.

16. The display panel of claim 15, wherein, The fourth sub-layer is located within the third sub-layer in the orthographic projection of the substrate.

17. The display panel of claim 15, wherein, The second sub-layer is located within the fourth sub-layer in the orthographic projection of the substrate, or the orthographic projection of the second sub-layer overlaps with that of the fourth sub-layer in the orthographic projection of the substrate.

18. The display panel of claim 15, wherein, The material of the fourth sub-layer comprises molybdenum.

19. The display panel of claim 1, wherein, The material of the second sub-layer comprises at least one of titanium, indium tin oxide, and indium zinc oxide.

20. The display panel of claim 1, wherein, Further comprising a first electrode, which is located on the side of the light-emitting unit facing away from the substrate. The first electrode is electrically connected with the second sub-layer, and / or the material of the first sub-layer comprises conductive material, and the first electrode is electrically connected with the first sub-layer.

21. The display panel of claim 20, wherein, The first electrode is electrically connected with the second sub-layer, and part of the second sub-layer extends from the first sub-layer to form an extension, and the first electrode is overlapped on the side of the extension facing away from the substrate.

22. A display device comprising: The display panel of any one of claims 1-21.

23. A method for manufacturing a display panel, characterized in that, The display panel comprises: sequentially arranging a second sub-material layer, a first sub-material layer, and a third sub-material layer on a substrate; performing patterning treatment on the third sub-material layer to form a third sub-layer, performing patterning treatment on the first sub-material layer to form a first sub-layer, and performing patterning treatment on the second sub-material layer to form a second sub-layer, wherein the first sub-layer, the second sub-layer, and the third sub-layer combine to form an isolation part, the isolation part encloses an isolation opening, the width of the first sub-layer at the end away from the substrate is smaller than the width of the first sub-layer at the end close to the substrate, the orthographic projection of the first sub-layer on the substrate is within the orthographic projection of the second sub-layer on the substrate, the material of the second sub-layer comprises corrosion-resistant conductive material, the third sub-layer is located on the side of the first sub-layer facing away from the substrate, the orthographic projection of the first sub-layer on the substrate is within the orthographic projection of the third sub-layer on the substrate, and the plurality of isolation openings comprise a first opening, a second opening, and a third opening; sequentially arranging a first light-emitting material layer, a first electrode material layer, and a first encapsulating material layer on the substrate; removing the first light-emitting material layer, the first electrode material layer, and the first encapsulating material layer in the regions where the second opening and the third opening are located to form a first light-emitting unit, a first electrode, and a first encapsulating unit located in the first opening.

24. The method of producing a display panel according to claim 23, wherein In the step of sequentially arranging a second sub-material layer and a first sub-material layer on a substrate, further comprising: sequentially arranging a fourth sub-material layer, a second sub-material layer, and a first sub-material layer on a substrate. After the steps of performing patterning treatment on the first sub-material layer to form a first sub-layer and performing patterning treatment on the second sub-material layer to form a second sub-layer, further comprising: performing patterning treatment on the fourth sub-material layer to form a fourth sub-layer.

25. The method of producing a display panel according to claim 24, wherein In the step of patterning the first sub-material layer to form a first sub-layer and patterning the second sub-material layer to form a second sub-layer, a dry etching process is selected to pattern the second sub-material layer to form the second sub-layer; In the step of patterning the fourth sub-material layer to form a fourth sub-layer, a wet etching process is selected to pattern the fourth sub-material layer to form the fourth sub-layer.

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