Laser scribe energy adjustment method, apparatus, and device

Abstract

The application relates to a laser scribing energy adjusting method, device and equipment, and belongs to the technical field of laser scribing, wherein the method comprises the following steps: acquiring the current working position information of a scanning rotating mirror in real time; determining the laser power standard value corresponding to the working position information according to the working position information and a preset laser power calculation method; and adjusting the current laser power of a laser scribing device according to the laser power standard value. According to the laser scribing energy adjusting method, the corresponding laser power standard value is determined according to the real-time working position information of the scanning rotating mirror, the laser power standard value is used to correct the current output laser power of the laser scribing device, the energy homogenization of the laser on the whole silicon steel plate working surface is realized, the loss reduction effect of the oriented silicon steel laser scribing is improved, and the quality of the finally prepared silicon steel product is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of laser scoring, in particular to a laser scoring energy adjustment method, device and equipment. BACKGROUND

[0002] The laser scoring technology is to shape the high-energy laser beam output by a laser, and then reflect it to an oriented silicon steel strip through optical devices (scanning galvanometer, galvanometer, etc.), and make equidistant scoring perpendicular to the rolling direction, cut and refine the main domain, so as to reduce the eddy current loss of silicon steel sheet.

[0003] In the traditional technology, a scanning galvanometer is usually used to control the laser scanning direction. When the laser is incident on the mirror at a certain angle, the scanning galvanometer with multiple reflecting surfaces can realize periodic laser path when rotating, thereby completing laser scoring. However, when the scanning galvanometer scans, the scanning trajectory speed of the uniform-rotation galvanometer on the plane target is nonlinear. When laser scoring, the silicon steel plate is located below the galvanometer, and the laser moves from one side to the other side of the vertical rolling direction after being reflected. The linear speed of the silicon steel plate at the two sides of the working width is the maximum, and the linear speed at the center is the minimum. In the laser scoring process, the laser energy absorbed by the silicon steel plate is related to the laser power and the scanning speed. The greater the power and the smaller the speed, the greater the absorbed laser energy. That is, under the same laser power, the position at the two sides of the working width of the silicon steel plate has lower irradiation laser energy and lower laser scoring loss reduction effect than the position at the center due to the greater scanning speed, resulting in poor uniformity of the score on the silicon steel plate, and the quality of the finally obtained silicon steel plate is not reliable. SUMMARY

[0004] Therefore, it is necessary to provide a laser scoring energy adjustment method, device and equipment aiming at the above technical problems.

[0005] In a first aspect, the present application provides a laser scoring energy adjustment method. The method comprises:

[0006] real-time acquisition of current working position information of the scanning galvanometer;

[0007] determination of a laser power standard value corresponding to the working position information according to the working position information and a preset laser power calculation method;

[0008] adjustment of the current laser power of the laser scoring equipment according to the laser power standard value.

[0009] In one of the embodiments, the working position information is the rotation angle of the scanning galvanometer relative to the initial position in a single period, and the period of the scanning galvanometer is determined according to the number of working surfaces thereof. The initial position is the intersection of the two adjacent mirror surfaces of the scanning galvanometer where the laser is incident.

[0010] In one of the embodiments, the laser power standard value corresponding to the working position information is determined according to the working position information and a preset laser power calculation method, including:

[0011] According to the rotation angle of the scanning mirror relative to the initial position in a single period, the current mirror angle velocity of the scanning mirror is determined, and the working parameter information of the laser marking device is obtained;

[0012] According to the mirror angle velocity and the working parameter information, the laser power standard value corresponding to the current rotation angle of the scanning mirror is determined.

[0013] In one of the embodiments, the working parameter information of the laser marking device includes a laser scanning angle from a laser exit point to a working surface boundary of the silicon steel plate, an irradiation time length of the laser on the working surface of the silicon steel plate in a single period, and a current power setting value of the laser marking device.

[0014] In one of the embodiments, the working state of the laser in a single period is a continuous first non-marking state, a marking working state, and a second non-marking state, respectively. When the laser is in the first non-marking state or the second non-marking state, the irradiation time length is zero. When the laser is in the marking working state, the irradiation time length is determined according to the current time and the time when the laser is in the first non-marking state.

[0015] In one of the embodiments, the method further includes: when the laser is in the first non-marking state or the second non-marking state, the laser power standard value is determined according to the current power setting value, the mirror angle velocity, and the laser scanning angle.

[0016] In one of the embodiments, the current laser power of the laser marking device is adjusted according to the laser power standard value, including:

[0017] A preset waiting time length of the laser marking device is obtained, and the laser power standard value is updated according to the preset waiting time length and a laser power calculation method, to obtain an updated laser power standard value;

[0018] The current laser power of the laser marking device is adjusted according to the updated laser power standard value.

[0019] In one of the embodiments, the preset waiting time length is a time delay of the laser marking device.

[0020] In a second aspect, the application further provides a laser marking energy adjusting device. The device includes:

[0021] A working position information acquisition module is configured to acquire the current working position information of the scanning mirror in real time;

[0022] The laser power standard value determination module is configured to determine a laser power standard value corresponding to the working position information according to the working position information and a preset laser power calculation method.

[0023] The laser power adjustment module is configured to adjust the current laser power of the laser marking device according to the laser power standard value.

[0024] In a third aspect, the present application further provides a laser marking energy adjustment device, which comprises the laser marking energy adjustment apparatus provided in the second aspect, and further comprises a memory and a processor, wherein the memory stores a computer program, and the processor implements the following steps when executing the computer program:

[0025] The current working position information of the scanning rotating mirror is acquired in real time.

[0026] The laser power standard value corresponding to the working position information is determined according to the working position information and a preset laser power calculation method.

[0027] The current laser power of the laser marking device is adjusted according to the laser power standard value.

[0028] The laser marking energy adjustment method, apparatus and device provided in the above embodiment, wherein the method comprises the following steps: acquiring the current working position information of the scanning rotating mirror in real time; determining the laser power standard value corresponding to the working position information according to the working position information and a preset laser power calculation method; and adjusting the current laser power output by the laser marking device according to the laser power standard value. The laser marking energy adjustment method provided in the present application determines the corresponding laser power standard value according to the real-time working position information of the scanning rotating mirror, and adjusts the current laser power output by the laser marking device according to the laser power standard value, so as to realize the energy homogenization of the laser on the entire working surface of the silicon steel plate, thereby improving the loss reduction effect of the oriented silicon steel laser marking, and further improving the quality of the finally prepared silicon steel product. BRIEF DESCRIPTION OF DRAWINGS

[0029] Figure 1 It is a schematic diagram of the application environment of the laser marking energy adjustment method in one embodiment;

[0030] Figure 2 It is a schematic diagram of the working of the scanning rotating mirror in the laser marking device in one embodiment;

[0031] Figure 3 It is a flowchart of the laser marking energy adjustment method in one embodiment;

[0032] Figure 4 It is a flowchart for determining the laser power standard value in one embodiment;

[0033] Figure 5Fig. 1 is a schematic diagram showing the geometric relationship between the silicon steel plate and the laser in one embodiment for embodying the laser marking;

[0034] Figure 6 Fig. 4 is a flow chart showing the process of adjusting the current laser power of the laser marking device according to the updated laser power standard value in one embodiment;

[0035] Figure 7 Fig. 5 is a schematic diagram showing the algorithm logic for balancing the laser marking energy in one embodiment;

[0036] Figure 8 Fig. 6 is a schematic diagram showing the relative position relationship between the silicon steel plate sample and the scanning mirror in one embodiment;

[0037] Figure 9 Fig. 7 is a structural block diagram of the laser marking energy adjusting device in one embodiment.

[0038] BRIEF DESCRIPTION OF THE DRAWINGS

[0039] 1, sensor; 2, laser incident on the scanning mirror; 3, scanning mirror; 4, area on the mirror surface of the scanning mirror reflecting the laser to the working width of the silicon steel plate; 5, scanning range of the laser during marking; 6, working width of the silicon steel plate; 7, marking. DETAILED DESCRIPTION

[0040] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and do not limit the present application.

[0041] The laser marking energy adjusting method provided by the embodiments of the present application can be applied in the application environment as shown in Figure 1 . Among them, the terminal 102 communicates with the server 104 through the network. The data storage system can store the data required to be processed by the server 104. The data storage system can be integrated on the server 104, or placed on the cloud or other network servers. Among them, the terminal 102 can be but not limited to various personal computers, notebook computers, smart phones, tablet computers, Internet of Things devices, etc. The server 104 can be realized by an independent server or a server cluster composed of multiple servers.

[0042] The terminal 102 in the embodiments of the present application takes the laser marking device as an example, and refers to Figure 2 , the structure and components related to the online laser marking energy adjusting method of the present application in the laser marking device specifically include the sensor 1, the scanning mirror 3 and the laser (not shown in the figure), Figure 2 The arrow in indicates the direction, which is also the rolling direction of the silicon steel plate, and the transmission direction of the silicon steel, Figure 2The scanning mirror 3 in the middle is a regular polygonal prism. Figure 2 The scanning mirror 3 has eight mirror surfaces. When the laser emits laser light into the scanning mirror 3, the laser 2 incident on the scanning mirror is reflected downwards onto the working surface 6 of the silicon steel plate to be marked, forming a mark 7. Due to the inherent characteristics of the scanning mirror 3 and the laser marking equipment configuration, only a portion of each mirror surface is used to reflect the laser light onto the working surface of the silicon steel plate. Figure 2 The laser is reflected onto the working surface 6 of the silicon steel plate by the rotating mirror 3. Therefore, it is necessary to determine the working position information of the scanning rotating mirror 3 at a certain moment in order to determine whether the laser is currently etching the working surface 6 of the silicon steel plate.

[0043] In one embodiment, such as Figure 3 As shown, this method is applied to Figure 1 Taking a terminal as an example, it can be understood that this method can also be applied to a server, and to a system that includes both a terminal and a server, and is implemented through the interaction between the terminal and the server. In this embodiment, the method includes the following steps:

[0044] Step 302: Obtain the current working position information of the scanning rotating mirror in real time.

[0045] Specifically, since the scanning mirror periodically reflects the laser, its working position at any given moment can be defined as the rotation angle α of the scanning mirror relative to its initial position within a single cycle. The initial position is defined as the intersection of the two mirror surfaces of the scanning mirror where the laser is incident. The specific working position of the scanning mirror at any given moment can be determined by a sensor. A timer t is started each time the scanning mirror rotates to the beginning position of a cycle, until a new timer begins for the next cycle. t∈(0,T). T is the rotation period of the scanning mirror, N is the number of working surfaces of the scanning mirror, and the relative rotation angle α ∈ (0, α) within the corresponding period. T ω is the angular velocity of the scanning mirror, which is determined by the ratio of the rotation angle α to the rotation time. The angle by which the scanning mirror reflects the laser onto the entire working surface of the silicon steel plate is defined as the working rotation angle range.

[0046] Single-cycle rotation angle α T The geometric constant of the scanning rotating mirror can be calculated from the number of working surfaces of the multi-faceted scanning rotating mirror. N represents the number of working surfaces of the scanning mirror; the range of the working rotation angle is (x1α) T ,x2α T x1 and x2 are the working rotation angle constants of the scanning mirror, which are related to the structure of the scanning mirror and the relative position of the laser incident point, and there exists a relationship of 0 < x1 < x2 < 1. According to Figure 2It can be seen that when α = x1α T , the scanning mirror rotates to the critical angle of starting the notch, at which the laser is at the boundary position of the working amplitude; when α = x2α T , the scanning mirror rotates to the critical angle of ending the notch, at which the laser is at the other boundary position of the working amplitude.

[0047] In step 304, according to the working position information and the preset laser power calculation method, the laser power standard value corresponding to the working position information is determined.

[0048] wherein the laser energy E during the notching is related to the laser power p and the laser movement speed V, and has a relationship The laser energy here is also commonly known as laser line energy density, indicating the laser energy parameter affected by the laser process, and the laser power p is also the output power of the laser notching device. Due to the fixed limitation of the laser notching device, the movement of the laser on the working amplitude is not uniform, so that the laser line energy density is not uniform, affecting the loss reduction effect of the oriented silicon steel.

[0049] Specifically, when the mirror scans, the scanning track speed of the uniformly rotating mirror on the plane target is nonlinear. When the laser notches, the silicon steel plate is located below the mirror, and the laser moves from one side to the other side in the direction perpendicular to the silicon steel plate after being reflected, and the linear speed is maximum at both sides of the working amplitude of the silicon steel plate and minimum at the center. During the laser notching process, the laser energy absorbed by the silicon steel plate is related to the laser power and the scanning speed, and the greater the power and the smaller the speed, the greater the laser energy absorbed. Therefore, when using a multi-surface scanning mirror for laser notching, under the same laser power, the working amplitude of the silicon steel plate at both sides is compared with the center position, and due to the greater scanning speed, the laser energy received is lower, the laser notching loss reduction effect is reduced, and the finished product quality and uniformity of the silicon steel plate are adversely affected.

[0050] Further, according to the geometric relationship between the laser and the working range, the laser movement speed can be obtained as Figure 2

[0051]

[0052] At this point, the scanning speed v t of the laser at time t can be obtained. In the formula, ∈ is the angular velocity of the mirror; D is the working distance, indicating the distance from the laser exit point to the working amplitude; φ is the laser scanning angle, i.e. the angle between the laser exit point and the boundary of the working amplitude of the silicon steel plate; ω is the angular velocity of the scanning mirror; and Δt is a variable related to the rotation period time.

[0053] ​According to the calculation formula of the scanning speed of the laser at the time t and the calculation formula of the laser energy E when the notch is formed, the laser power calculation method can be obtained, so that the laser power standard value corresponding to the working position information can be determined, and the reliability of the laser power standard value obtained by the above scientific calculation method is high, so as to ensure the reliability when the current laser power of the laser notch forming equipment is adjusted according to the laser power standard value.

[0054] Step 306, adjusting the current laser power of the laser notch forming equipment according to the laser power standard value.

[0055] Specifically, after obtaining the laser power standard value, the numerical value of the laser power of the laser notch forming equipment is adjusted to be the same as the numerical value of the laser power standard value.

[0056] In the above laser notch energy adjustment method, the corresponding laser power standard value is determined according to the real-time working position information of the scanning rotating mirror, and the current output laser power of the laser notch forming equipment is adjusted according to the laser power standard value, so as to realize the energy uniformization of the laser on the entire silicon steel plate working surface, thereby improving the loss reduction effect of the oriented silicon steel laser notch, and further improving the quality of the finally prepared silicon steel product.

[0057] In one embodiment, as shown in Figure 4 , the laser power standard value corresponding to the working position information is determined according to the working position information and the preset laser power calculation method, including:

[0058] Step 402, determining the rotating angle speed of the scanning rotating mirror according to the rotating angle of the scanning rotating mirror relative to the initial position in a single period, and obtaining the working parameter information of the laser notch forming equipment.

[0059] According to the above content, it can be known that the rotating angle speed of the scanning rotating mirror is the rotating angle speed ω of the scanning rotating mirror. The working parameter information of the laser notch forming equipment includes a plurality of parameter information for representing the working state of the laser, for example, the laser scanning angle of the laser exit point to the boundary of the silicon steel plate working surface, the irradiation time length of the laser on the silicon steel plate working surface in a single period, and the current power setting value of the laser notch forming equipment, etc. These parameter information affect the energy uniformity and notch quality of the laser notch on the silicon steel plate.

[0060] Specifically, referring to Figure 2 and Figure 5 , Figure 5 is a schematic view of the geometric relationship between the silicon steel plate and the laser when the notch is formed, the current rotating angle speed of the scanning rotating mirror corresponds to ω in Figure 2 ; the laser scanning angle of the laser exit point to the boundary of the silicon steel plate working surface corresponds to θ in Figure 5φ; the irradiation time length of the laser on the working surface of the silicon steel sheet in a single period is related to the working state of the laser, the working state of the laser includes a notch working state and a non-notch state, and the laser marking device is in a continuous working state, that is, the laser is in a state of always emitting, but due to the reflection of the scanning mirror, the laser can be reflected onto the silicon steel sheet sometimes and cannot be reflected onto the silicon steel sheet sometimes, so according to this situation, in the embodiment, the state in which the reflected laser can irradiate and etch the working surface of the silicon steel sheet is defined as the notch working state, and the state in which the reflected laser cannot irradiate and etch the working surface of the silicon steel sheet is defined as the non-notch state. Furthermore, the working state of the laser in a single period can be further divided into a continuous first non-notch state, a notch working state and a second non-notch state, that is, the laser of the embodiment has two time lengths in a single period in the non-notch state and has a time length in the notch working state, that is, when the laser is in the first non-notch state or the second non-notch state, the irradiation time length is zero; when the laser is in the notch working state, the irradiation time length can be determined according to the current time and the time length of the first non-notch state of the laser.

[0061] In step 404, the laser power standard value corresponding to the current rotation angle of the scanning mirror is determined according to the mirror angle speed and the working parameter information.

[0062] In the above calculation formula of the laser energy E, it can be seen that the laser power standard value is related to the laser power p and the laser movement speed V, and the laser movement speed is related to the mirror angle speed and the working parameter information of the laser marking device. After obtaining the specific value of the laser movement speed, the laser power standard value can be determined according to the ratio of the laser power p to the laser movement speed V.

[0063] Specifically, the linear energy density of the laser perpendicular to the silicon steel sheet is taken as the reference, at this time the linear speed of the laser v min When the power, that is, the current power setting value of the laser, is P0, in order to keep the linear energy density E of the laser unchanged, the calculation formula of the laser power standard value is:

[0064]

[0065] In the formula, v t is the scanning speed of the laser at time t; P0 is the current power setting value of the laser; φ is the laser scanning angle, that is, the angle between the laser exit point and the boundary of the working surface of the silicon steel sheet; ω is the mirror angle speed of the scanning mirror; and Δt is a variable related to the rotation period time, that is, the irradiation time length of the laser on the silicon steel sheet.

[0066] For example, the rotation position of the scanning rotor at a certain time, i.e., the working position, is determined by the sensor, and the time t is counted when the scanning rotor rotates to the periodic starting position each time until the next period starts a new time t∈(0, T). According to the current angular velocity of the scanning rotor, there are When t∈[x1T, x2T], at this time, α∈[x1α T , x2α T ], the laser is performing marking on the working surface of the silicon steel sheet, i.e., the laser is in a marking working state, and the laser power needs to be calculated and adjusted; when t∈(0, x1T)∪(x2T, T), at this time, α∈(0, x1α T )∪(x2α T , α T ), the laser is in a non-marking state, wherein, when t∈(0, x1T), the laser is in a first non-marking state, and when t∈(x2T, T), the laser is in a second non-marking state. In the non-marking state, the laser power needs to be adjusted to the power value corresponding to t∈x1T to prepare for the next marking period. Specifically, when the laser is in the last non-marking state in a single period, it means that the current marking period has ended and the next marking period is about to start. In this time period, the laser power needs to be adjusted to the appropriate power required at the start of the next marking period so that consistent marking effect can be maintained at the start of the new marking period. It also helps to ensure uniform distribution and stability of laser energy at the start of the next marking period. In addition, pre-adjusting the laser power value can make the entire marking process smoother and more efficient, which helps to reduce the pause and adjustment time in the marking process caused by power adjustment and improve production efficiency.

[0067] In one embodiment, when the laser is in a non-marking state, the standard value of the laser power is determined according to the current power setting value, the angular velocity of the rotor, and the laser scanning angle; when the laser is in a marking working state, the irradiation time is determined according to the current time and the time length of the first non-marking state of the laser.

[0068] Specifically, due to the structural characteristics of the scanning rotor, the single mirror surface only reflects the laser to the working surface in a part of a specific area (which is the area on the single mirror surface that reflects the laser to the working surface). The position and size of this area are related to the design of the equipment. Δt represents the irradiation time of the laser on the working surface of the silicon steel sheet in a single period, and there are:

[0069]

[0070] According to the above content, T is the rotation period of the scanning rotor, when t∈[x1T, x2T], at this time, the rotation angle α of the scanning rotor∈[x1α T , x2α TWhen the current time t is x1T, the rotation angle a of the scanning rotating mirror is x1a T , and the irradiation time is taken into account in calculating the laser power standard value; when the current time t is x2T, the rotation angle a of the scanning rotating mirror is x2a T ; when t∈(0, x1T)∪(x2T, T), at this time a∈(0, x1a T )∪(x2a T , a T ), the laser does not mark the working width of the silicon steel plate, and the irradiation time does not need to be taken into account in calculating the laser power standard value.

[0071] In one embodiment, as shown in Figure 6 , adjusting the current laser power of the laser marking device according to the laser power standard value comprises:

[0072] Step 602, obtaining the preset waiting time of the laser marking device, and updating the laser power standard value according to the preset waiting time and the laser power calculation method to obtain the updated laser power standard value.

[0073] Wherein, the preset waiting time of the laser marking device is the delay of the laser. Because the laser has a delay in adjusting and outputting the laser power, a short period of time is needed to output the laser with matching power after adjusting the laser power, so the delay needs to be considered in the calculation of the laser power standard value.

[0074] For example, for a laser with a delay of t w , the adjusted power value P t ′=P(t+t w ) when the laser is in the marking working state t, and the matching laser power is obtained at t+t w , thereby ensuring the reliability of the laser power standard value, and the specific execution logic is shown in Figure 7 .

[0075] Step 604, adjusting the current laser power of the laser marking device according to the updated laser power standard value.

[0076] Specifically, after obtaining the updated laser power standard value, the laser marking device will adjust the current laser power output value in time according to the updated laser power standard value, so as to ensure that the laser energy remains uniform in the vertical rolling direction of the silicon steel plate during laser marking, thereby obtaining consistent marking effect, enhancing the iron loss reduction effect of laser marking, and further improving the quality of oriented silicon steel products.

[0077] In addition, in order to verify the reliability of the laser marking energy adjustment method in the embodiments of the present application, the applicant has carried out a large number of tests. Specifically, the same batch and same brand of unmarked oriented silicon steel sheets with a thickness of 0.20 mm are cut into 100x500 mm size, and the initial iron loss value is measured, and then they are placed in parallel in the laser marking machine for equal interval marking. The placement mode is as shown in Figure 8 Figure 8 The direction indicated by the RD arrow in the figure is the rolling direction of the oriented silicon steel sheet. For different samples in the same embodiment / comparative example, the basic marking parameters are kept unchanged, the embodiment uses the laser marking energy adjustment method of the present application to adjust the laser energy online, and the comparative example uses the conventional laser marking processing method. The iron loss value of the sample is measured after laser marking. The laser parameters and marking effect of the embodiment and the comparative example are shown in Tables 1-4.

[0078] Table 1

[0079]

[0080] Table 2

[0081]

[0082] Table 3

[0083]

[0084] Table 4

[0085]

[0086]

[0087] According to the comparison of the experimental results of Comparative Example 1 and Comparative Example 2, it can be seen that when the laser power and laser energy decrease, the loss reduction rate of the oriented silicon steel sheet decreases significantly. According to Examples 1 and 2 and Comparative Examples 1 and 2, under the same laser power and mirror rotation speed, the loss reduction rate of the sample near the edge of the working surface of the oriented silicon steel sheet in Comparative Examples 1 and 2 is significantly lower, and the iron loss reduction of the sample in the middle of the working surface is equivalent to that in the embodiment, which shows that in the comparative example without the laser marking energy adjustment method of the present application, the energy of the laser near the edge of the working surface is low, and the iron loss reduction is significantly affected. The balanced treatment of the laser energy by the laser marking energy adjustment method of the present application can effectively avoid this situation, achieve energy balance in the whole surface, and improve the overall magnetic properties of the oriented silicon steel material.

[0088] In summary, the laser marking energy adjustment method of the present application can effectively improve the loss reduction effect of the laser marking equipment on the oriented silicon steel, improve the performance uniformity of the oriented silicon steel product, and does not need to make large-scale modifications to the equipment, and has high practicability.​

[0089] In one detailed embodiment, when the laser marking energy online adjustment is implemented, the rotation angle a of the scanning rotating mirror at the current time relative to the initial position, the current power setting value P0 of the laser, the rotating mirror angular velocity ω of the scanning rotating mirror, the laser scanning angle φ and the irradiation time length of the laser on the silicon steel plate are obtained first; when the current time t∈[x1T,x2T], that is, a∈[x1a T ,x2a T ], it is judged that the laser is marking on the working surface of the silicon steel plate at this time, that is, the laser is in the marking working state, and the laser power needs to be calculated and adjusted. When adjusting, the laser power standard value at the current time is calculated according to the calculation formula of the laser power standard value, but when calculating the irradiation time length Δt, the preset waiting time (delay) of the laser needs to be added to ensure the reliability and accuracy of the laser power standard value; when t∈(0,x1T)∪(x2T,T), a∈(0,x1a T )∪(x2a T ,a T ), the laser is in a non-marking state, and the laser power needs to be adjusted to the power value corresponding to t=x1T to prepare for the next marking period; and the current laser power output value of the laser is updated according to the calculated laser power standard value. In this way, the energy homogenization of the laser on the entire working surface of the silicon steel plate can be realized, thereby improving the loss reduction effect of the oriented silicon steel laser marking, and further improving the quality of the finally prepared silicon steel product.

[0090] It should be understood that although each step in the flowchart involved in each of the above embodiments is displayed in sequence according to the arrow, these steps are not necessarily executed in sequence according to the arrow. Unless otherwise specified herein, the execution of these steps is not strictly limited in sequence, and these steps can be executed in other sequences. Moreover, at least part of the steps in the flowchart involved in each of the above embodiments can include multiple steps or stages, which are not necessarily executed at the same time, but can be executed at different times, and the execution sequence of these steps or stages is not necessarily sequential, but can be executed alternately or alternately with at least part of other steps or steps or stages in other steps.

[0091] Based on the same inventive concept, the embodiments of the present application also provide a laser marking energy adjustment device for implementing the above-mentioned laser marking energy adjustment method. The implementation scheme for solving the problem provided by the device is similar to the implementation scheme described in the above method, so the specific limitations in one or more laser marking energy adjustment device embodiments provided below can refer to the limitations of the laser marking energy adjustment method described above, which will not be repeated here.

[0092] In one embodiment, as shown in FIG. 9, a laser scoring energy adjustment device is provided, comprising: a working position information acquisition module 902, a laser power standard value determination module 904, and a laser power adjustment module 906, wherein: Figure 9 The working position information acquisition module 902 is configured to acquire real-time working position information of the scanning mirror.

[0093] The laser power standard value determination module 904 is configured to determine a laser power standard value corresponding to the working position information according to the working position information and a preset laser power calculation method.

[0094] The laser power adjustment module 906 is configured to adjust the current laser power of the laser scoring device according to the laser power standard value.

[0095] In one embodiment, the working position information acquisition module 902 is further configured to: the working position information is the rotation angle of the scanning mirror relative to an initial position within a single period, the period of the scanning mirror is determined according to the number of working surfaces thereof, and the initial position is the intersection of the two adjacent mirror surfaces of the scanning mirror where the laser is incident.

[0096] In one embodiment, the laser power standard value determination module 904 is further configured to: acquire the current mirror angular velocity of the scanning mirror, the laser scanning angle of the laser exit point to the working surface boundary of the silicon steel plate, the irradiation time length of the laser on the working surface of the silicon steel plate within a single period, and the current power setting value of the laser scoring device; and determine the laser power standard value corresponding to the current rotation angle of the scanning mirror according to the current power setting value, the mirror angular velocity, the laser scanning angle, and the irradiation time length.

[0097] In one embodiment, the laser power standard value determination module 904 is further configured to: the irradiation time length is related to the working state of the laser, and the working state of the laser includes a scoring working state and a non-scoring state, and the working state of the laser within a single period is a continuous first non-scoring state, a scoring working state, and a second non-scoring state.

[0098] In one embodiment, the laser power standard value determination module 904 is further configured to: when the laser is in the non-scoring state, the laser power standard value is determined according to the current power setting value, the mirror angular velocity, and the laser scanning angle; and when the laser is in the scoring working state, the irradiation time length is determined according to the current time and the time length of the first non-scoring state of the laser.

[0099] In one embodiment, the laser power standard value determination module 904 is further configured to: when the laser is in the non-scoring state, the laser power standard value is determined according to the current power setting value, the mirror angular velocity, and the laser scanning angle; and when the laser is in the scoring working state, the irradiation time length is determined according to the current time and the time length of the first non-scoring state of the laser.

[0100] In an embodiment, the laser power adjustment module 906 is further configured to: obtain a preset waiting time length of the laser scoring device, and update the laser power standard value according to the preset waiting time length and the laser power calculation method to obtain an updated laser power standard value; and adjust the current laser power of the laser scoring device according to the updated laser power standard value.

[0101] The above-mentioned modules in the laser scoring energy adjustment device can be implemented wholly or partially by software, hardware, or a combination thereof. The above-mentioned modules can be embedded in or independent of a processor in a computer device in hardware form, or can be stored in a memory in a computer device in software form, so as to be called and executed by a processor to perform the operations corresponding to the above-mentioned modules.

[0102] In an embodiment, a laser scoring energy adjustment device is provided, which comprises the above-mentioned laser scoring energy adjustment device, and further comprises a memory and a processor. The memory stores a computer program, and the processor implements the steps of any one of the above-mentioned laser scoring energy adjustment methods when executing the computer program.

[0103] In an embodiment, a computer device is provided, which comprises a memory and a processor. The memory stores a computer program, and the processor implements the steps of the above-mentioned method embodiments when executing the computer program.

[0104] In an embodiment, a computer readable storage medium is provided, which stores a computer program. The computer program is executed by a processor to implement the steps of the above-mentioned method embodiments.

[0105] In an embodiment, a computer program product is provided, which comprises a computer program. The computer program is executed by a processor to implement the steps of the above-mentioned method embodiments.

[0106] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data for analysis, stored data, displayed data, etc.) involved in the present application are all information and data authorized by the user or authorized by all parties.

[0107] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program. The computer program can be stored in a non-volatile computer readable storage medium, and when the computer program is executed, the processes of the above-mentioned embodiments of the methods can be included. Any reference to memory, database or other medium used in the embodiments provided in the present application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (Read-Only Memory, ROM), magnetic tape, floppy disk, flash memory, optical storage, high-density embedded non-volatile memory, resistive memory (ReRAM), magnetoresistive random access memory (Magnetoresistive Random Access Memory, MRAM), ferroelectric memory (Ferroelectric Random Access Memory, FRAM), phase change memory (Phase Change Memory, PCM), graphene memory, etc. Volatile memory can include random access memory (Random Access Memory, RAM) or external cache memory, etc. As an illustration but not limitation, RAM can be in various forms, such as static random access memory (Static Random Access Memory, SRAM) or dynamic random access memory (Dynamic Random Access Memory, DRAM), etc. The database involved in the embodiments provided in the present application can include at least one of a relational database and a non-relational database. The non-relational database can include a distributed database based on a block chain, etc., without being limited thereto. The processor involved in the embodiments provided in the present application can be a general-purpose processor, a central processing unit, a graphics processing unit, a digital signal processor, a programmable logic device, a data processing logic device based on quantum computing, etc., without being limited thereto.

[0108] Any combination of the technical features of the above embodiments can be made. In order to make the description simple, all possible combinations of the technical features in the above embodiments are not described, however, as long as the combination of the technical features does not exist contradictory, it should be considered as the scope of the present application.

[0109] The above embodiments only express several implementation manners of the present application, and the description is more specific and detailed, but it should not be understood as a limitation on the scope of the patent of the present application. It should be pointed out that for ordinary skilled in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are within the scope of protection of the present application. Therefore, the protection scope of the present application should be subject to the appended claims.

Claims

1. A method of adjusting the energy of a laser scribe, suitable for a laser scribe apparatus using a polygon mirror as a scanning galvanometer, characterized in that, The method comprises: real-time acquisition of current working position information of the scanning rotating mirror, wherein the working position information is a rotating angle of the scanning rotating mirror relative to an initial position in a single period, the period of the scanning rotating mirror is determined according to the number of working surfaces thereof, and the initial position is a position at which laser light is incident at a boundary between two adjacent mirror surfaces of the scanning rotating mirror; determination of a laser power standard value corresponding to the working position information according to the working position information and a preset laser power calculation method; adjustment of current laser power of the laser marking device according to the laser power standard value. The determination of the laser power standard value corresponding to the working position information according to the working position information and the preset laser power calculation method comprises: determination of a rotating mirror angular velocity of the scanning rotating mirror at the current time according to the rotating angle of the scanning rotating mirror relative to the initial position in the single period, and acquisition of working parameter information of the laser marking device; determination of the laser power standard value corresponding to the rotating angle of the scanning rotating mirror at the current time according to the rotating mirror angular velocity and the working parameter information. The working parameter information of the laser marking device comprises a laser scanning included angle from a laser exit point to a working surface boundary of a silicon steel plate, an irradiation time length of laser light on the working surface of the silicon steel plate in a single period, and a current power setting value of the laser marking device. The working state of the laser light in a single period is a continuous first non-marking state, a marking working state, and a second non-marking state, respectively. When the laser light is in the first non-marking state or the second non-marking state, the irradiation time length is zero. When the laser light is in the marking working state, the irradiation time length is determined according to the current time and the time length during which the laser light is in the first non-marking state. The method further comprises: when the laser light is in the first non-marking state or the second non-marking state, the laser power standard value is determined according to the current power setting value, the rotating mirror angular velocity, and the laser scanning included angle. The adjustment of the current laser power of the laser marking device according to the laser power standard value comprises: acquisition of a preset waiting time length of the laser marking device, and updating of the laser power standard value according to the preset waiting time length and the laser power calculation method to obtain an updated laser power standard value; adjustment of the current laser power of the laser marking device according to the updated laser power standard value.

2. The method of claim 1, wherein, The preset waiting time length is a time delay of the laser marking device.

3. A laser scribe energy adjustment apparatus, comprising: a laser scribe energy adjustment device; and a laser scribe energy adjustment controller configured to control the laser scribe energy adjustment device. The method of claim 1 or 2 is implemented by the device comprising: a working position information acquisition module configured to acquire current working position information of the scanning rotating mirror in real time; a laser power standard value determination module configured to determine a laser power standard value corresponding to the working position information according to the working position information and a preset laser power calculation method; and a laser power adjustment module configured to adjust current laser power of the laser marking device according to the laser power standard value.

4. A laser scribe energy adjustment apparatus comprising the laser scribe energy adjustment device of claim 3, the laser scribe energy adjustment apparatus further comprising a memory and a processor, the memory storing a computer program, wherein, The processor, when executing the computer program, implements the steps of the method according to any one of claims 1 to 2.

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