Liquid cooling plate assembly and server liquid cooling device

Abstract

The application discloses a liquid cooling plate assembly and a server liquid cooling device. The liquid cooling plate assembly comprises a first liquid cooling plate for cooling a main heat dissipation device, a second liquid cooling plate for cooling a secondary heat dissipation device, an introduction part and a discharge part. The first liquid cooling plate is provided with a first liquid cooling channel, a second liquid cooling channel higher than the first liquid cooling channel, and a circulation channel communicated between a second outlet of the second liquid cooling channel and a first inlet of the first liquid cooling channel. A thermal expansion spring sheet is arranged in the circulation channel. When the liquid cooling plate assembly is in a first state, the circulation channel is blocked by the expanded thermal expansion spring sheet, and the introduction part, the first liquid cooling channel, the second liquid cooling plate, the second liquid cooling channel and the discharge part are sequentially communicated. When the liquid cooling plate assembly is in a second state, the first liquid cooling channel, the second liquid cooling plate, the second liquid cooling channel and the circulation channel are sequentially communicated. Through the arrangement of the first liquid cooling channel and the second liquid cooling channel, the present scheme realizes stepped heat dissipation, and effectively improves the cooling capacity utilization rate.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of server cooling, in particular to a liquid cooling plate assembly and a server liquid cooling device. BACKGROUND

[0002] Servers are widely used in the electronic information technology industry to provide functions such as data transfer, processing, encryption, decryption, and calculation. With the continuous development of the electronic information technology industry, the number of electronic devices inside the server is also increasing, resulting in an increasing amount of heat inside the server. Therefore, air cooling, liquid cooling, and other heat dissipation means are set up to dissipate heat from the electronic devices.

[0003] To this end, a liquid cooling plate is independently set up for different electronic devices, and the liquid cooling plate is integrated into a refrigerant circulation pipeline, so that the refrigerant can flow through the liquid cooling plate to carry away the heat of the corresponding electronic device. This is the mainstream improvement scheme in the field. However, in fact, this improvement scheme requires a compressor or a liquid pump to operate for a long time, resulting in high overall power consumption and low refrigerant cooling capacity utilization.

[0004] Therefore, how to improve the cooling capacity utilization and reduce the power consumption of the heat dissipation scheme while ensuring normal server cooling is a technical problem that needs to be solved by those skilled in the art. SUMMARY

[0005] The purpose of the present application is to provide a liquid cooling plate assembly and a server liquid cooling device to solve the technical problem that the liquid cooling plate in the prior art cannot improve the cooling capacity utilization and reduce the power consumption while ensuring normal cooling.

[0006] To achieve this purpose, the present application adopts the following technical scheme:

[0007] A liquid cooling plate assembly capable of converting between a first state and a second state, comprising:

[0008] A first liquid cooling plate for cooling a main heat dissipation device, configured with a first liquid cooling channel, a second liquid cooling channel higher than the first liquid cooling channel, and a circulation channel connected between a second outlet of the second liquid cooling channel and a first inlet of the first liquid cooling channel;

[0009] A second liquid cooling plate for cooling a secondary heat dissipation device, connected between a first outlet of the first liquid cooling channel and a second outlet of the second liquid cooling channel, and arranged higher than the first liquid cooling plate;

[0010] An introduction part connected to the first inlet for introducing refrigerant;

[0011] An exhaust part connected to the second outlet for exhausting refrigerant;

[0012] A thermal expansion spring sheet arranged in the circulation channel;

[0013] When the liquid cooling plate assembly is in the first state, the circulation channel is blocked by the thermal expansion spring, and the inlet portion, the first liquid cooling channel, the second liquid cooling plate, the second liquid cooling channel, and the outlet portion are sequentially communicated;

[0014] When the liquid cooling plate assembly is in the second state, the first liquid cooling channel, the second liquid cooling plate, the second liquid cooling channel, and the circulation channel are sequentially communicated.

[0015] Optionally, the first liquid cooling plate is provided with a trigger hole extending to the wall of the circulation channel, and a trigger device is arranged on the first liquid cooling plate, a pressing rod in sliding connection with the trigger hole is arranged on a trigger end of the trigger device; a flow guide hole is arranged on the pressing rod;

[0016] When the liquid cooling plate assembly is in the second state, the pressing rod is pushed by the trigger end and abuts against the thermal expansion spring, so that the flow guide hole is located in the circulation channel.

[0017] Optionally, the trigger device is arranged in a mounting groove between the inlet portion and the outlet portion; the trigger device comprises an electromagnet fixedly connected in the mounting groove and an electromagnetic push plate in sliding connection with the mounting groove, and the pressing rod is arranged on the electromagnetic push plate.

[0018] Optionally, the thermal expansion spring comprises a spring body arranged opposite to the pressing rod, and the spring body abuts against the hole edge of the trigger hole; spring support portions are respectively arranged at two ends of the spring body, the spring support portions are arranged obliquely relative to the spring body, and the distal ends of the spring support portions are bent to form spring extension portions, and the spring extension portions abut against the wall of the circulation channel.

[0019] Optionally, the second liquid cooling plate is in communication with the first liquid cooling plate through a hose;

[0020] Two ends of the second liquid cooling plate are respectively provided with side plates, and a plurality of secondary heat dissipation devices are arranged between the two side plates; a pressing plate and a top plate are sequentially and spaced apart above the second liquid cooling plate; the second liquid cooling plate is arranged on the secondary heat dissipation devices by the pressing plate, and a plurality of fan units are arranged on the top plate.

[0021] Optionally, a plurality of elastic support columns are arranged between the fan units and the pressing plate, one end of each elastic support column abuts against a fan unit, the other end abuts against the pressing plate, and an air inlet channel is left between the elastic support columns;

[0022] The side plate is provided with a clamping groove, and the end portion of the pressing plate is provided with a clamping block, and the clamping block is clamped in the clamping groove.

[0023] Optionally, a heat-conducting member is arranged between two adjacent secondary heat-dissipation devices, and the top end of the heat-conducting member abuts against the second liquid cooling plate.

[0024] Optionally, the first liquid cooling plate is provided with a second liquid cooling plate at each end, and the second liquid cooling plates on the two sides are symmetrically arranged.

[0025] Optionally, the introduction part comprises a first converging part and a plurality of introduction interfaces arranged at the center of the first liquid cooling plate.

[0026] The discharge part comprises a second converging part and a plurality of discharge interfaces, and the plurality of discharge interfaces are arranged around the introduction part.

[0027] A server liquid cooling device comprises a liquid pump, a condenser and the liquid cooling plate assembly, wherein the refrigerant liquid is cooled by the condenser and then enters the liquid cooling plate assembly through the liquid pump.

[0028] Compared with the prior art, the present application has the following beneficial effects:

[0029] The liquid cooling plate assembly and the server liquid cooling device provided by the present application have the following advantages: in the first state with a relatively high temperature, the thermal expansion spring is expanded by heat, so that the circulation channel is blocked, at this time, the refrigerant liquid flows from the outside through the introduction part, sequentially flows through the first liquid cooling channel, the second liquid cooling plate and the second liquid cooling channel, and is finally discharged from the discharge part, thereby taking away the heat of the primary heat-dissipation device and the secondary heat-dissipation device. In the second state with a relatively low temperature, the circulation channel is no longer blocked by the thermal expansion spring, and the whole forms a closed pipeline, at this time, part of the refrigerant liquid in the first liquid cooling channel is heated and moves to the second liquid cooling plate which is higher by using the heat siphon principle, the cooling of the refrigerant liquid is realized by using the low-temperature environment, and the refrigerant liquid flows to the second liquid cooling channel and the circulation channel by using gravity, thereby reducing the dependence of the refrigerant liquid on the external circulation and realizing the purpose of reducing power consumption. At the same time, in the first state or the second state, the refrigerant liquid sequentially flows through the first liquid cooling channel, the second liquid cooling plate and the second liquid cooling channel, and for the primary heat-dissipation device, the first liquid cooling channel and the second liquid cooling channel are used to realize the stepped heat dissipation, thereby effectively improving the cooling capacity utilization rate. Therefore, the liquid cooling plate assembly and the server liquid cooling device can realize the technical effects of improving the cooling capacity utilization rate and reducing the power consumption under the premise of ensuring the heat dissipation effect. BRIEF DESCRIPTION OF DRAWINGS

[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor under the premise of the drawings.

[0031] The structures, proportions, sizes, etc., shown in the accompanying drawings of this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the conditions under which the present invention can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and objectives that the present invention can produce, should still fall within the scope of the technical content disclosed in the present invention.

[0032] Figure 1 This is a schematic diagram of the overall structure of the liquid cooling plate assembly provided in an embodiment of the present invention;

[0033] Figure 2 This is a first exploded structural diagram of the liquid cooling plate assembly provided in an embodiment of the present invention;

[0034] Figure 3 This is a second exploded structural diagram of the liquid cooling plate assembly provided in an embodiment of the present invention;

[0035] Figure 4 A partial structural schematic diagram of the liquid cooling plate assembly provided in an embodiment of the present invention;

[0036] Figure 5 This is a schematic diagram of the piping structure of the liquid cooling plate assembly provided in an embodiment of the present invention;

[0037] Figure 6 This is a schematic diagram of the first cross-sectional structure of the liquid cooling plate assembly provided in an embodiment of the present invention;

[0038] Figure 7 for Figure 6 A magnified schematic diagram of the structure at point A;

[0039] Figure 8 This is a second cross-sectional structural diagram of the liquid cooling plate assembly provided in an embodiment of the present invention;

[0040] Figure 9 This is a third exploded structural diagram of the liquid cooling plate assembly provided in an embodiment of the present invention;

[0041] Illustration description: 001, main heat dissipation device; 002, secondary heat dissipation device; 003, mounting slot;

[0042] 100. First liquid cooling plate; 101. Trigger hole; 110. First liquid cooling channel; 120. Second liquid cooling channel; 130. Circulation channel;

[0043] 200, Second liquid cooling plate; 210, Flexible hose; 220, Side plate; 221, Slot; 230, Pressure plate; 231, Locking block; 240, Top plate; 250, Fan unit; 260, Flexible support column;

[0044] 300, introduction part; 310, first confluence part; 320, introduction interface; 400, discharge part; 410, first confluence part; 420, discharge interface; 500, thermal expansion spring piece; 510, spring piece body; 520, spring piece support part; 530, spring piece extension part;

[0045] 600, trigger device; 610, electromagnet; 620, electromagnetic push plate; 700, pressing rod; 701, flow guide hole. DETAILED DESCRIPTION

[0046] In order to make the inventive purposes, features and advantages of the present application more obvious and easy to understand, the technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the following described embodiments are only some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0047] In the description of the present application, it should be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there can be a component disposed therebetween.

[0048] The technical solutions of the present application will be further described below in conjunction with the drawings and through specific embodiments.

[0049] Embodiment one:

[0050] Servers are generally used in data processing, data calculation, data transfer and other scenarios, and are configured with main heat dissipation devices 001 such as central processing units and graphics processing units which have high power consumption, and secondary heat dissipation devices 002 such as memories and internal storage devices which have low power consumption. Obviously, the heat generated by the above-mentioned main heat dissipation devices 001 is greater than the heat generated by the secondary heat dissipation devices 002. At the same time, the server has the characteristics of high integration, so the main heat dissipation devices 001 and the secondary heat dissipation devices 002 are generally arranged adjacent to each other, and the corresponding heat dissipation structure performs overall heat dissipation on the server or independent heat dissipation on each device.

[0051] The embodiment discloses a liquid cooling plate assembly which is suitable for the scenario of heat dissipation of a server, can meet the heat dissipation requirements of many devices in the server at the same time, and has the advantages of low power consumption, high cold energy utilization rate, compact structure, high structural stability and the like through optimization of the structure of the liquid cooling plate assembly.

[0052] As shown in Figures 1 to 8 The liquid cooling plate assembly in the embodiment can be converted between a first state and a second state, the ambient temperature of the first state is higher than that of the second state, and the liquid cooling plate assembly specifically comprises: a first liquid cooling plate 100, a second liquid cooling plate 200, an introduction part 300, an exhaust part 400 and a thermal expansion spring 500.

[0053] The first liquid cooling plate 100 is used for cooling a main heat dissipation device 001, as shown in Figures 5 to 8 is configured with a first liquid cooling channel 110, a second liquid cooling channel 120 which is higher than the first liquid cooling channel 110, and a circulation channel 130 which is communicated between the second outlet of the second liquid cooling channel 120 and the first inlet of the first liquid cooling channel 110;

[0054] The second liquid cooling plate 200 is used for cooling a secondary heat dissipation device 002, as shown in Figures 1 to 5 is communicated between the first outlet of the first liquid cooling channel 110 and the second outlet of the second liquid cooling channel 120, and is arranged higher than the first liquid cooling plate 100;

[0055] The introduction part 300 is installed above the first liquid cooling plate 100 and communicated with the first inlet, and is used for introducing refrigerant; the exhaust part 400 is installed above the first liquid cooling plate 100 and communicated with the second outlet, and is used for discharging refrigerant; the thermal expansion spring 500 is arranged in the circulation channel 130.

[0056] It should be understood that a condensing device for cooling the refrigerant is further arranged outside the liquid cooling plate assembly, including but not limited to a condenser with air as a cold source, a condenser with cold water as a cold source, which is not limited in the embodiment, can cool the refrigerant again, and can be pumped into the introduction part 300 again.

[0057] When the liquid cooling plate assembly is in the first state with a higher ambient temperature, the circulation channel 130 is blocked by the expanded thermal expansion spring 500, and the introduction part 300, the first liquid cooling channel 110, the second liquid cooling plate 200, the second liquid cooling channel 120 and the exhaust part 400 are sequentially communicated; at this time, the refrigerant obtains cold energy through the external condensing device, and then sequentially flows through the introduction part 300, the first liquid cooling channel 110, the second liquid cooling plate 200, the second liquid cooling channel 120 and the exhaust part 400, thereby taking away the heat of the main heat dissipation device 001 and the secondary heat dissipation device 002, and is suitable for the case that the server is fully loaded or the overall power consumption is high.

[0058] When the liquid cooling plate assembly is in the second state of a lower ambient temperature, the first liquid cooling channel 110, the second liquid cooling plate 200, the second liquid cooling channel 120 and the circulation channel 130 are sequentially communicated. At this time, the refrigerant does not need to pass through an external condensing device, but is driven by the heat siphon principle and gravity to realize circulation in the closed pipeline between the first liquid cooling plate 100 and the second liquid cooling plate 200, and takes away heat through the environment, which is suitable for the case of low load or low overall power consumption of the server. It should be pointed out that in this state, the heat generated by the main heat dissipation device 001 causes part of the refrigerant in the first liquid cooling channel 110 to be heated and the density to be reduced, so as to flow into the second liquid cooling plate 200. At this time, the secondary heat dissipation device 002 is in a state of basically not working, and the refrigerant is cooled and flows to the second liquid cooling channel 120 and the circulation channel 130 under the action of gravity to realize circulation.

[0059] Specifically, the liquid cooling plate assembly in the embodiment, in the first state of a higher temperature, the thermal expansion spring 500 is heated and expanded to block the circulation channel 130. At this time, the refrigerant is introduced from the outside through the introduction part 300, sequentially flows through the first liquid cooling channel 110, the second liquid cooling plate 200, the second liquid cooling channel 120, and finally is discharged from the discharge part 400, so as to take away the heat of the main heat dissipation device 001 and the secondary heat dissipation device 002. In the second state of a lower temperature, the circulation channel 130 is no longer blocked by the thermal expansion spring 500, and forms a closed pipeline as a whole. At this time, part of the refrigerant in the first liquid cooling channel 110 is heated and moves to the higher second liquid cooling plate 200 by the heat siphon principle, and the cooling of the refrigerant is realized by the low-temperature environment. The refrigerant flows to the second liquid cooling channel 120 and the circulation channel 130 by gravity, thereby reducing the dependence of the refrigerant on external circulation (condensing device) and achieving the purpose of reducing power consumption.

[0060] At the same time, whether in the first state or the second state, the refrigerant will sequentially flow through the first liquid cooling channel 110, the second liquid cooling plate 200 and the second liquid cooling channel 120. For the main heat dissipation device 001, a refrigerant circuit in the shape of "C" is arranged above it. For this, the first liquid cooling channel 110 and the second liquid cooling channel 120 realize stepped heat dissipation, effectively improving the refrigeration utilization rate. Therefore, the liquid cooling plate assembly can realize the technical effects of improving the refrigeration utilization rate and reducing the power consumption on the premise of guaranteeing the heat dissipation effect. In addition, compared with the conventional improvement scheme for the pipeline, the scheme improves the flow channel and structure of the liquid cooling plate, reduces the complexity of the pipeline system, makes the server liquid cooling device more miniaturized, has the advantage of high integration, and meets the requirement of miniaturization of the current equipment.

[0061] Further, as shown in FIG. 6, the liquid cooling plate assembly in the embodiment can further include a third liquid cooling plate 300, which is arranged between the first liquid cooling plate 100 and the second liquid cooling plate 200. Figures 5 to 7As shown, the first liquid cooling plate 100 is provided with a trigger hole 101 extending to the pipe wall of the circulation channel 130, and the first liquid cooling plate 100 is provided with a trigger device 600, and the trigger end of the trigger device 600 is provided with a pressing rod 700 which is in sliding connection with the trigger hole 101; the pressing rod 700 is provided with a flow guide hole 701; when the liquid cooling plate assembly is in the second state, the pressing rod 700 is pushed by the trigger end and abuts against the thermal expansion spring 500, so that the flow guide hole 701 is located in the circulation channel 130.

[0062] For example, the liquid cooling plate assembly, i.e. the server liquid cooling device, is provided with a temperature sensor for obtaining the ambient temperature or the refrigerant temperature, and when the above-mentioned temperatures are lower than the preset temperature, the pressing rod 700 can be pushed by the trigger device 600, on the one hand, to make the thermal expansion spring 500 after the preliminary contraction further separate from the circulation channel 130, and on the other hand, the flow guide hole 701 on the pressing rod 700 gradually enters the circulation channel 130, so that the refrigerant can gradually enter the circulation channel 130 from the second liquid cooling channel 120, avoiding the local temperature change too fast and causing failure, thereby improving the overall reliability of the system. At the same time, when the above-mentioned temperatures are lower than the preset temperature, the condensing device of the server liquid cooling device stops working to reduce energy consumption, at this time, the introduction part 300 and the discharge part 400 are equivalent to be blocked and do not participate in the circulation of the refrigerant.

[0063] As a preferred embodiment, the trigger device 600 is arranged in the mounting groove 003 between the introduction part 300 and the discharge part 400; the trigger device 600 includes an electromagnet 610 fixedly connected in the mounting groove 003 and an electromagnetic push plate 620 in sliding connection with the mounting groove 003, and the pressing rod 700 is arranged on the electromagnetic push plate 620. The above structure makes the overall structure of the liquid cooling plate assembly more compact. As other optional embodiments, the trigger device 600 can be selected from structures such as telescopic air cylinders, telescopic rod motors, etc., which have the function of controlling the lifting of the pressing rod 700.

[0064] Further, as shown in Figure 6 and Figure 7 The thermal expansion spring 500 includes a spring body 510 arranged opposite to the pressing rod 700, and the spring body 510 abuts against the hole edge of the trigger hole 101; the two ends of the spring body 510 respectively extend with spring support portions 520, the spring support portions 520 are arranged obliquely relative to the spring body 510, and the distal ends of the spring support portions 520 are bent and formed with spring extension portions 530, and the spring extension portions 530 abut against the pipe wall of the circulation channel 130.

[0065] It should be noted that the pipe wall of the circulation channel 130 is provided with a positioning block (not shown in the figure). When the thermal expansion spring 500 is installed on the circulation channel 130, the positioning block is abutted with the spring support part 520 to realize the positioning installation of the spring support part 520 in the circulation channel 130. In addition, the spring support part 520 can also be pre-fixed in the circulation channel 130 by means of gluing, welding and the like, and then the assembly of the first liquid cooling plate 100 is completed.

[0066] For the thermal expansion spring 500, it will expand at a higher temperature, so that the gap between the thermal expansion spring 500 and the circulation channel 130 is completely blocked, realizing the closure of the circulation channel 130. In addition, the thermal expansion spring 500 is in the shape of a "few" as a whole, so that when the thermal expansion spring 500 is pressed by the pressing rod 700, its shape is smoothly transitioned, making the flow path of the refrigerant more smooth, guiding the refrigerant to flow smoothly, reducing the vortex and turbulence phenomenon in the fluid flow.

[0067] On the basis of the above embodiment, as shown in Figures 1 to 8 The second liquid cooling plate 200 is communicated with the first liquid cooling plate 100 through the hose 210; so that the second liquid cooling plate 200 has a free space relative to the first liquid cooling plate 100. When the first liquid cooling plate 100 is attached to the main heat dissipation device 001, the assembly error between the main heat dissipation device 001 and the secondary heat dissipation device 002 can be eliminated, realizing the complete attachment of the second liquid cooling plate 200 and the secondary heat dissipation device 002, and further improving the utilization rate.

[0068] At the same time, in order to realize the stable installation of the second liquid cooling plate 200, the two ends of the second liquid cooling plate 200 are respectively provided with side plates 220, and a plurality of secondary heat dissipation devices 002 are arranged between the two side plates 220. The pressing plate 230 and the top plate 240 are sequentially and spacedly arranged above the second liquid cooling plate 200; the second liquid cooling plate 200 is pressed on the secondary heat dissipation device 002 by the pressing plate 230, and a plurality of fan units 250 are installed on the top plate 240. For the liquid cooling plate assembly, by arranging the pressing plate 230 and the fan unit 250, on the one hand, in the second state, the fan unit 250 with low power consumption can be used to promote the heat exchange between the indoor airflow and the second liquid cooling plate 200, and on the other hand, the indirect installation and positioning of the liquid cooling plate assembly can be realized, reducing the accidental damage of the liquid cooling plate assembly during assembly (such as installing the liquid cooling plate assembly by bolts), thereby improving the stability of the installation.

[0069] More specifically, a plurality of elastic support columns 260 are arranged between the fan unit 250 and the pressing plate 230, one end of the elastic support column 260 abuts against the fan unit 250, the other end abuts against the pressing plate 230, and an air inlet channel is left between the plurality of elastic support columns 260; the side plate 220 is provided with a clamping groove 221, and the end of the pressing plate 230 is provided with a clamping block 231 which is clamped in the clamping groove 221.

[0070] Exemplarily, after the second liquid cooling plate 200 is positioned on the secondary heat dissipation device 002, the pressing plate 230 is stacked on the second liquid cooling plate 200 through the limiting of the clamping block 231 and the clamping groove 221, and then the fan unit 250 provided with the elastic support column 260 is installed, on the one hand, to leave an air inlet channel to realize heat exchange, and on the other hand, to use the elastic support column 260 to adhere the second liquid cooling plate 200 to the secondary heat dissipation device 002, thereby completing the stable installation of the second liquid cooling plate 200 and effectively prolonging the service life of the device.

[0071] On the basis of the above-mentioned embodiments, a heat conduction member (not shown in the figure) is further installed between the two adjacent secondary heat dissipation devices 002, and the top end of the heat conduction member abuts against the second liquid cooling plate 200, so as to further improve the heat exchange effect.

[0072] On the basis of the above-mentioned embodiments, the two ends of the first liquid cooling plate 100 are provided with the second liquid cooling plate 200, and the second liquid cooling plates 200 on the two sides are symmetrically arranged.

[0073] On the basis of the above-mentioned embodiments, the introduction part 300 includes a first converging part 310 and a plurality of introduction interfaces 320 located in the center of the first liquid cooling plate 100; the discharge part 400 includes a second converging part 410 and a plurality of discharge interfaces 420, and the plurality of discharge interfaces 420 are arranged around the introduction part 300. It should be noted that by adopting the above-mentioned arrangement, the refrigerant can be diffused from the center to complete the heat dissipation of the main heat dissipation device 001, and at the same time, the refrigerant can be discharged from the four corners after absorbing heat, thereby completing the overall layout of the stepped temperature drop, so as to effectively improve the utilization rate of cold energy.

[0074] For the convenience of those skilled in the art to understand, in the first state, the temperature of the refrigerant entering through the introduction part 300 is T1, the temperature of the refrigerant entering the second liquid cooling plate 200 after absorbing the heat of the main heat dissipation device 001 is T2, and the temperature of the refrigerant after absorbing the heat of the secondary heat dissipation device 002 and being exchanged by the fan unit 250 is T3, and the temperature of the environment is T0. At this time, T2>T0>T3>T1, or T0>T2>T3>T1, thereby constructing an efficient heat dissipation environment for the main heat dissipation device 001.

[0075] Example two:

[0076] The server liquid cooling device in the embodiment comprises a liquid pump, a condenser and the liquid cooling plate assembly in the first embodiment, wherein the refrigerant is cooled by the condenser and then enters the liquid cooling plate assembly through the liquid pump, and the liquid pump and the condenser constitute a condensing device. The server liquid cooling device in the embodiment references the liquid cooling plate assembly in the first embodiment and has the same advantages.

[0077] Therefore, the server liquid cooling device has the advantages of low energy consumption, high cooling capacity utilization, compact structure, stable structure and the like.

[0078] The above embodiments are only used to illustrate the technical solutions of the present application, but not to limit the same. Although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that the technical solutions recorded in the foregoing embodiments can be modified or some technical features can be replaced by equivalent features. The modification or replacement does not change the essence of the corresponding technical solution from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A liquid cold plate assembly, comprising: capable of being switched between a first state and a second state, comprising: a first liquid cooling plate (100) for cooling a main heat dissipation device (001), configured with a first liquid cooling channel (110), a second liquid cooling channel (120) higher than the first liquid cooling channel (110), and a circulation channel (130) connecting between a second outlet of the second liquid cooling channel (120) and a first inlet of the first liquid cooling channel (110); the first liquid cooling plate (100) is provided with a trigger hole (101) extending to a pipe wall of the circulation channel (130), and a trigger device (600) is arranged on the first liquid cooling plate (100), a trigger end of the trigger device (600) is provided with a pressing rod (700) in sliding connection with the trigger hole (101); the pressing rod (700) is provided with a flow guide hole (701); a second liquid cooling plate (200) for cooling a secondary heat dissipation device (002), connected between the first outlet of the first liquid cooling channel (110) and the second outlet of the second liquid cooling channel (120), and arranged higher than the first liquid cooling plate (100); an introduction part (300) connected to the first inlet for introducing refrigerant; the introduction part (300) comprises a first converging part (310) and a plurality of introduction interfaces (320) arranged in the center of the first liquid cooling plate (100); an exhaust part (400) connected to the second outlet for discharging refrigerant; the exhaust part (400) comprises a second converging part (410) and a plurality of exhaust interfaces (420), and the plurality of exhaust interfaces (420) are arranged around the introduction part (300); a thermal expansion spring (500) arranged in the circulation channel (130); when the liquid cooling plate assembly is in the first state, the circulation channel (130) is blocked by the thermal expansion spring (500) in an expanded state, and the introduction part (300), the first liquid cooling channel (110), the second liquid cooling plate (200), the second liquid cooling channel (120), and the exhaust part (400) are connected in sequence; when the liquid cooling plate assembly is in the second state, the first liquid cooling channel (110), the second liquid cooling plate (200), the second liquid cooling channel (120), and the circulation channel (130) are connected in sequence; and the pressing rod (700) is pushed by the trigger end and abuts against the thermal expansion spring (500), so that the flow guide hole (701) is located in the circulation channel (130).

2. The liquid cold plate assembly of claim 1, wherein, The trigger device (600) is arranged in a mounting groove (003) between the introduction part (300) and the exhaust part (400); the trigger device (600) comprises an electromagnet (610) fixedly connected in the mounting groove (003) and an electromagnetic push plate (620) in sliding connection with the mounting groove (003), and the pressing rod (700) is arranged on the electromagnetic push plate (620).

3. The liquid cold plate assembly of claim 1, wherein, The thermal expansion elastic sheet (500) comprises an elastic sheet body (510) arranged opposite to the pressing rod (700), and the elastic sheet body (510) abuts against the hole edge of the trigger hole (101); both ends of the elastic sheet body (510) respectively extend with elastic sheet support parts (520), the elastic sheet support parts (520) are arranged obliquely relative to the elastic sheet body (510), and the ends of the elastic sheet support parts (520) are bent and formed with elastic sheet extension parts (530), and the elastic sheet extension parts (530) abut against the pipe wall of the circulation channel (130).

4. The liquid cold plate assembly of claim 1, wherein, The second liquid cooling plate (200) is communicated with the first liquid cooling plate (100) through a hose (210); Both ends of the second liquid cooling plate (200) are respectively provided with side plates (220), and a plurality of secondary heat dissipation devices (002) are arranged between the two side plates (220); the side plates (220) are sequentially and spacedly provided with a pressing plate (230) and a top plate (240) above the second liquid cooling plate (200); the second liquid cooling plate (200) is pressed on the secondary heat dissipation devices (002) by the pressing plate (230), and a plurality of fan units (250) are installed on the top plate (240).

5. The liquid cold plate assembly of claim 4, wherein, A plurality of elastic support columns (260) are arranged between the fan units (250) and the pressing plate (230), one end of the elastic support column (260) abuts against the fan unit (250), the other end abuts against the pressing plate (230), and an air inlet channel is left between the plurality of elastic support columns (260); The side plate (220) is provided with a clamping groove (221), and the end of the pressing plate (230) is provided with a clamping block (231), and the clamping block (231) is clamped in the clamping groove (221).

6. The liquid cold plate assembly of claim 5, wherein, A heat conduction member is also installed between two adjacent secondary heat dissipation devices (002), and the top end of the heat conduction member abuts against the second liquid cooling plate (200).

7. The liquid cold plate assembly of claim 1, wherein, Both ends of the first liquid cooling plate (100) are provided with the second liquid cooling plate (200), and the second liquid cooling plates (200) on both sides are symmetrically arranged.

8. A liquid cooling apparatus for a server, comprising: The liquid cooling plate assembly comprises a liquid pump, a condenser and the liquid cooling plate assembly of any one of claims 1-7, wherein the refrigerant liquid is cooled by the condenser and then enters the liquid cooling plate assembly by the liquid pump. The liquid cooling plate assembly comprises a liquid pump, a condenser and the liquid cooling plate assembly of any one of claims 1-7, wherein the refrigerant liquid is cooled by the condenser and then enters the liquid cooling plate assembly by the liquid pump.

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