Display module and display device

Abstract

The embodiment of the present application discloses a display module and a display device. The display module of the embodiment of the present application includes a support plate supporting a flexible display panel, the support plate includes a carbon fiber layer, a barrier layer and a conductive layer, and the carbon fiber layer includes a first resin and carbon fiber. The barrier layer is arranged on the carbon fiber layer, and the conductive layer is arranged on the side of the barrier layer away from the carbon fiber layer. The conductive layer includes a second resin and a conductor, and the conductor is dispersed in the second resin; the barrier layer is configured to prevent the first resin and the second resin from blending. Compared with the vapor deposition method, the embodiment of the present application adopts the method of dispersing the conductor in the second resin to form the conductive layer, which saves the preparation cost. In a high temperature environment, the barrier layer can prevent the first resin and the second resin from blending, thereby preventing the first resin from flowing into the conductive layer, causing the resin content of the conductive layer to increase, thereby causing conductive failure.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display module and a display device. Background Art

[0002] Carbon fiber composite panels are used as folding support panels in folding mobile phone screens due to their light weight, high strength and other excellent properties. Compared with metal material support panels, carbon fiber composite panels are affected by the resin matrix and are not conductive. In order to solve the conductivity problem of carbon fiber composite panels, a layer of metal nickel is currently sputtered on the surface of the carbon fiber composite panel to achieve surface conductivity of the carbon fiber composite panel. However, the method of sputtering metal nickel is relatively expensive and the high sputtering temperature affects the flatness of the carbon fiber composite panel, resulting in a decrease in yield. Summary of the invention

[0003] The embodiments of the present application provide a display module and a display device, which can reduce the preparation cost of the support plate and improve the yield of the support plate.

[0004] An embodiment of the present application provides a display module, including a support plate for supporting a flexible display panel, wherein the support plate includes:

[0005] a carbon fiber layer including a first resin and carbon fibers; and

[0006] A barrier layer, disposed on the carbon fiber layer;

[0007] A conductive layer is arranged on a side of the barrier layer away from the carbon fiber layer, the conductive layer comprises a second resin and a conductor, and the conductor is dispersed in the second resin;

[0008] The barrier layer is configured to prevent the first resin and the second resin from blending.

[0009] Optionally, in some embodiments of the present application, the softening temperature of the barrier layer is greater than or equal to 110 degrees Celsius.

[0010] Optionally, in some embodiments of the present application, the thickness of the barrier layer is between 3 microns and 8 microns.

[0011] Optionally, in some embodiments of the present application, the molecular weight of the barrier layer is greater than 10000 D.

[0012] Optionally, in some embodiments of the present application, the thickness of the barrier layer is less than or equal to 1 micron.

[0013] Optionally, in some embodiments of the present application, one side of the barrier layer is directly connected to the carbon fiber layer, and the other side of the barrier layer is directly connected to the conductive layer.

[0014] Optionally, in some embodiments of the present application, the carbon fiber includes a first carbon fiber and a second carbon fiber, the first carbon fiber is dispersed in the first resin, the second carbon fiber is partially disposed in the first resin, and the second carbon fiber is partially disposed in the barrier layer.

[0015] Optionally, in some embodiments of the present application, the carbon fiber includes a first carbon fiber and a second carbon fiber, the first carbon fiber is dispersed in the first resin, the second carbon fiber is partially disposed in the first resin, the second carbon fiber is partially disposed in the barrier layer, the second carbon fiber penetrates the barrier layer, and the second carbon fiber is partially connected to the conductor.

[0016] Optionally, in some embodiments of the present application, the material of the barrier layer includes a thermoplastic resin, and the first resin and the second resin both include a thermosetting resin;

[0017] The carbon fiber layer, the barrier layer and the conductive layer are integrally hot-pressed to form the support plate.

[0018] Optionally, in some embodiments of the present application, the material of the barrier layer includes a thermoplastic resin, and the first resin and the second resin both include a thermosetting resin;

[0019] The barrier layer is a coating layer, and the barrier layer is formed on the surface of the conductive layer to form a conductive composite layer. The conductive composite layer and the carbon fiber layer are integrally hot-pressed to form the support plate.

[0020] Optionally, in some embodiments of the present application, the conductor includes at least one of conductive particles and conductive fibers, and in the conductive layer, the content ratio of the conductor is between 70% and 92%, and the content ratio of the second resin is between 8% and 30%.

[0021] Optionally, in some embodiments of the present application, the conductive layer and the barrier layer are directly connected to form a conductive composite layer, and the surface resistance of the conductive composite layer is smaller than the vertical resistance of the conductive composite layer.

[0022] Optionally, in some embodiments of the present application, the support plate includes a bending area and non-bending areas arranged on both sides of the bending area, and the conductive layer and the barrier layer are correspondingly arranged in the non-bending areas.

[0023] Accordingly, an embodiment of the present application further provides a display device or a display module, which comprises a display panel and a support plate as described in any one of the above embodiments, wherein the display panel is arranged on the support plate;

[0024] The conductive layer is disposed on a side of the carbon fiber layer away from the display panel, and the conductive layer is configured to at least cover electronic components.

[0025] The display module of the embodiment of the present application includes a support plate for supporting a flexible display panel, the support plate includes a carbon fiber layer, a barrier layer and a conductive layer, the carbon fiber layer includes a first resin and carbon fiber. The barrier layer is arranged on the carbon fiber layer, the conductive layer is arranged on a side of the barrier layer away from the carbon fiber layer, the conductive layer includes a second resin and a conductor, and the conductor is dispersed in the second resin; the barrier layer is configured to prevent the first resin and the second resin from blending.

[0026] Among them, compared with the vapor deposition method, the embodiment of the present application adopts the method of dispersing the conductor in the second resin to form a conductive layer, which saves the preparation cost; secondly, the conductive layer adopts a non-vapor deposition process, so it has better flatness. In addition, it should be noted that in a high temperature environment, the barrier layer can prevent the first resin and the second resin from blending, preventing the first resin from flowing into the conductive layer and causing the resin content of the conductive layer to increase, thereby causing conductive failure. Therefore, the barrier layer can prevent the conductive performance of the conductive layer from failing, thereby improving the yield of the support plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 is a schematic diagram of a cross-sectional structure of a support plate provided in an embodiment of the present application;

[0028] Figure 2 It is a plan view of a support plate provided in an embodiment of the present application;

[0029] Figure 3 is another plan view of a support plate provided in an embodiment of the present application;

[0030] Figure 4 is another schematic plan view of a support plate provided in an embodiment of the present application;

[0031] Figure 5 is another schematic diagram of a cross-sectional structure of a support plate provided in an embodiment of the present application;

[0032] Figure 6 It is a schematic diagram of the structure of the display device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the present application, and are not used to limit the present application. In the present application, the various embodiments can be combined with each other but will not be repeated one by one, and in the absence of contrary instructions, the directional words used, such as "upper" and "lower", usually refer to the upper and lower parts of the device in actual use or working state, specifically the drawing direction in the drawings; while "inside" and "outside" refer to the outline of the device; the terms "first", "second", "third", etc. are used only as markings, and no numerical requirements are imposed or order is established.

[0034] The embodiments of the present application provide a support plate, a display module and a display device, which are described in detail below. It should be noted that the description order of the following embodiments is not intended to limit the preferred order of the embodiments.

[0035] exist Figures 1 to 5 In the embodiment, the first direction F1 may be a direction parallel to one side of the support plate 100 in a plan view, and may be, for example, a lateral direction of the support plate 100. The second direction F2 may be a direction parallel to the other side of the support plate 100 in a plan view. The third direction F3 may be a thickness direction of the support plate 100. However, the present invention is not limited thereto, and for example, the first direction F1 and the second direction F2 may also be non-perpendicular to each other.

[0036] Optionally, the support plate 100 includes a bending zone wz and non-bending zones nw arranged on both sides of the bending zone wz.

[0037] The non-bending area nw is used to support the straight part of the flexible display panel, and the bending area wz is used to support the bending part of the flexible display panel.

[0038] In some embodiments of the present application, the bending zone wz of the support plate 100 is provided with an opening, and the opening penetrates the support plate 100 in the third direction F3 to reduce bending stress and thereby improve the bending performance of the bending zone wz of the support plate 100 .

[0039] It is understandable that the support plate 100 can be applied to a foldable flexible panel with a teardrop-shaped bend, but is not limited thereto. For example, it can also be applied to an inward-bending foldable flexible panel or an outward-bending foldable flexible panel.

[0040] Please refer to Figure 1The embodiment of the present application provides a support plate 100 configured to support a flexible display panel. The support plate 100 includes a carbon fiber layer 11 , a barrier layer 12 and a conductive layer 13 .

[0041] The carbon fiber layer 11 includes a first resin 111 and carbon fibers xw. The barrier layer 12 is disposed on the carbon fiber layer 11. The conductive layer 13 is disposed on a side of the barrier layer 12 away from the carbon fiber layer 11. The conductive layer 13 includes a second resin 131 and a conductor dd, and the conductor dd is dispersed in the second resin 131.

[0042] The barrier layer 12 is configured to prevent the first resin 111 and the second resin 131 from being fused.

[0043] Among them, compared with the use of vapor deposition process to form a metal nickel layer as a conductive layer on the carbon fiber plate, the embodiment of the present application adopts the method of dispersing the conductor dd in the second resin 131 to form the conductive layer 13, which saves the preparation cost; secondly, the conductive layer 13 adopts a non-vapor deposition process, so it has better flatness. In addition, it should be noted that in a high temperature environment, the barrier layer 12 can block the blending of the first resin 111 and the second resin 131, and prevent the first resin 111 from flowing into the conductive layer 13, causing the resin content of the conductive layer 13 to increase, thereby causing conductive failure. Therefore, the barrier layer 12 can prevent the conductive performance of the conductive layer 13 from failing, thereby improving the yield of the support plate 100.

[0044] It should be explained that if the conductive layer 13 directly contacts the carbon fiber layer 11, because both the conductive layer 13 and the carbon fiber layer 11 include thermosetting resin materials, when the two are hot-pressed, the resin at this time is not completely cured, and the fluidity of the two after being heated is strong. The two will fuse resins under hot pressing, causing the resin content in the conductive layer 13 to increase significantly, causing conductive failure. Therefore, the barrier layer 12 is used to separate the conductive layer 13 and the carbon fiber layer 11, so that the first resin 111 of the carbon fiber layer 11 and the second resin 131 of the conductive layer 13 can be prevented from fusing in a high temperature environment.

[0045] Optionally, in some embodiments of the present application, one side of the barrier layer 12 is directly connected to the carbon fiber layer 11 , and the other side of the barrier layer 12 is directly connected to the conductive layer 13 .

[0046] By sequentially contacting and connecting the carbon fiber layer 11 , the barrier layer 12 , and the conductive layer 13 , an adhesive layer can be saved, thereby reducing the thickness and weight of the support plate 100 .

[0047] In some embodiments of the present application, the carbon fiber layer 11 may be a composite carbon fiber layer, but is not limited thereto, and may be, for example, a single-layer carbon fiber layer.

[0048] The carbon fiber layer 11 includes a first resin 111 and carbon fibers xw. The carbon fibers xw are dispersed in the first resin 111. The carbon fiber layer 11 can be made by processes such as prepreg, cutting, lamination, and molding. Compared with stainless steel of the same volume, the carbon fiber layer 11 has a lighter weight and can meet the support requirements of the flexible display panel.

[0049] Optionally, the first resin 111 is a thermosetting resin, such as epoxy resin, phenolic resin, polyester resin, vinyl ester resin, etc.

[0050] Optionally, in some embodiments of the present application, the carbon fiber xw includes a first carbon fiber x1 and a second carbon fiber x2, the first carbon fiber x1 is dispersed in the first resin 111, the second carbon fiber x2 is partially disposed in the first resin 111, and the second carbon fiber x2 is partially disposed in the barrier layer 12.

[0051] It is understandable that a portion of the second carbon fiber x2 is disposed in the first resin 111 , and another portion of the second carbon fiber x2 is inserted into the barrier layer 12 , which can improve the firmness of the barrier layer 12 and the carbon fiber layer 11 .

[0052] Optionally, the lengths of the first carbon fiber x1 and the second carbon fiber x2 are both less than or equal to 1 micrometer. The barrier layer 12 is thicker, and the carbon fiber xw cannot penetrate the barrier layer 12, thereby improving the barrier effect of the barrier layer 12.

[0053] Optionally, in some embodiments, the length of the first carbon fiber x1 and the second carbon fiber x2 may also be greater than 3 microns, that is, by increasing the length of the carbon fiber xw, the second carbon fiber x2 penetrates the barrier layer 12 and is connected to the conductor dd of the conductive layer 13, so as to achieve electrical conductivity between the barrier layer 12 and the conductive layer 13 in the thickness direction.

[0054] In some embodiments of the present application, the conductive layer 13 includes a second resin 131 and a conductor dd, and the conductor dd is dispersed in the second resin 131 .

[0055] The content ratio of the conductor dd is between 70% and 92%, and the content ratio of the second resin 131 is between 8% and 30%.

[0056] It should be explained that the content ratio of the conductor dd is the volume percentage of the conductor dd in the conductive layer 13 , and the content ratio of the second resin 131 is the volume percentage of the second resin 131 in the conductive layer 13 .

[0057] It is understandable that the greater the content ratio of the conductor dd, the better the conductivity of the conductive layer 13, but the weaker the firmness. The function of the conductive layer 13 is to prevent static electricity, and it can be grounded. In conventional requirements, the surface resistance of the conductive layer 13 at room temperature needs to be less than 2 ohms to meet the requirements of grounding and antistatic.

[0058] Therefore, the content ratio of the conductor dd is set to be more than twice the content ratio of the second resin 131 to ensure that the conductivity requirements of the conductive layer 13 are met and the conductive layer 13 has better integrity.

[0059] For example, the content ratio of the conductor dd is 70%, and the content ratio of the second resin 131 is 30%; the content ratio of the conductor dd is 75%, and the content ratio of the second resin 131 is 25%; the content ratio of the conductor dd is 80%, and the content ratio of the second resin 131 is 20%; the content ratio of the conductor dd is 86%, and the content ratio of the second resin 131 is 14%; or, the content ratio of the conductor dd is 92%, and the content ratio of the second resin 131 is 8%, and so on.

[0060] Optionally, in some embodiments of the present application, the conductive layer 13 and the barrier layer 12 are directly connected to form a conductive composite layer, and the surface resistance of the conductive composite layer is smaller than the vertical resistance of the conductive composite layer.

[0061] It should be understood that the surface resistance of the conductive composite layer is the room temperature surface resistance of the conductive layer 13, and the vertical resistance of the conductive composite layer is the room temperature resistance of the conductive composite layer in the thickness direction. Room temperature resistance refers to the resistance measured under room temperature conditions.

[0062] Among them, based on the skin effect of current, as long as the surface resistance of the conductive composite layer meets the requirements, the effect of conducting static electricity can be achieved. Of course, the smaller the vertical resistance of the conductive composite layer, the better the conductive performance of the conductive composite layer, thereby improving the effect of conducting static electricity of the conductive composite layer.

[0063] Optionally, in some embodiments of the present application, the conductor dd includes at least one of conductive particles d1 and conductive fibers d2. For example, the conductor dd may include only conductive particles d1 or conductive fibers d2, or the conductor dd may include both conductive particles d1 and conductive fibers d2.

[0064] Among them, the conductive particles d1 and the conductive fibers d2 are dispersed in the second resin 131. Based on the conductive particles d1 being point-like and the conductive fibers d2 being thread-like, the combination of the two facilitates the formation of a conductive path and can further reduce the resistance. For example, based on the conductive particles d1 and the conductive fibers d2 being dispersed in the second resin 131 and the content ratio of the conductor dd being greater than or equal to 70%, the surface resistance of the conductive layer 13 at room temperature can be less than 0.1 ohm.

[0065] Optionally, in some embodiments of the present application, the content ratio of the conductive fibers d2 is greater than the content ratio of the conductive particles d1, so as to improve the conductivity of the conductive layer 13 in the thickness direction.

[0066] Optionally, in some embodiments of the present application, the second resin 131 is a thermosetting resin, such as epoxy resin, phenolic resin, polyester resin, vinyl ester resin, etc.

[0067] The materials of the conductive particles d1 and the conductive fibers d2 may include, but are not limited to, metals such as copper, nickel, silver, gold, and conductive materials such as metal oxides.

[0068] Optionally, in some embodiments of the present application, the thickness of the conductive layer 13 is between 8 microns and 25 microns, for example, it can be 8 microns, 9 microns, 10 microns, 11 microns, 12 microns, 13 microns, 14 microns, 15 microns, 16 microns, 17 microns, 18 microns, 19 microns, 20 microns, 21 microns, 22 microns, 23 microns, 24 microns or 25 microns.

[0069] Please refer to Figures 2 to 4 In some embodiments, the conductive layer 13 and the barrier layer 12 are correspondingly arranged in the non-bending area nw. That is, the conductive layer 13 and the barrier layer 12 are not arranged in the bending area wz to avoid increasing the bending stress in the bending area wz.

[0070] It is understandable that the back of the conductive layer 13 is generally provided with electronic components, and the conductive layer 13 is used to conduct static electricity to the ground, thereby achieving the effect of protecting the electronic components. Therefore, the conductive layer 13 can be adaptively arranged according to the position, shape and size of the electronic components.

[0071] The conductive layer 13 is at least disposed at the four corners of the support plate 100 to ensure the need to remove static electricity and facilitate grounding. Figure 2 As shown; for example, the conductive layer 13 can be arranged on the side of the non-bending region nw away from the bending region wz, such as Figure 3 As shown; for example, the conductive layer 13 is semi-frame-shaped and extends along the periphery of the non-bending area nw, such as Figure 4As shown; or for example, the conductive layer 13 can cover the entire surface of the two non-bending areas nw.

[0072] Optionally, in some embodiments of the present application, the softening temperature of the barrier layer 12 is greater than or equal to 110 degrees Celsius. For example, it may be 110 degrees Celsius, 115 degrees Celsius, 120 degrees Celsius, 125 degrees Celsius, 130 degrees Celsius, 135 degrees Celsius, 140 degrees Celsius, 145 degrees Celsius, 150 degrees Celsius, 155 degrees Celsius, 160 degrees Celsius, 165 degrees Celsius, 170 degrees Celsius, 175 degrees Celsius or 180 degrees Celsius.

[0073] It is understandable that the higher the softening temperature of the barrier layer 12, the stronger its heat resistance, and the worse the thermal fluidity of the material at high temperature, so that the effect of preventing the first resin 111 and the second resin 131 from blending is better. In addition, the general hot pressing temperature is between 80 degrees Celsius and 120 degrees Celsius. Based on the consideration of hot pressing efficiency and stability, the hot pressing temperature is usually selected between 100 degrees Celsius and 110 degrees Celsius. Therefore, the softening temperature of the barrier layer 12 is selected to be greater than or equal to 110 degrees Celsius, so that during the hot pressing process, the first resin 111 and the second resin 131 will not blend.

[0074] Optionally, in some embodiments of the present application, the thickness of the barrier layer 12 is between 3 micrometers and 8 micrometers. For example, the thickness of the barrier layer 12 can be 3 micrometers, 4 micrometers, 5 micrometers, 6 micrometers, 7 micrometers or 8 micrometers.

[0075] It is understandable that the greater the thickness of the barrier layer 12, the better the barrier effect. Based on the consideration of thickness and barrier performance, the thickness of the barrier layer 12 is selected to be between 3 microns and 8 microns.

[0076] Optionally, in some embodiments of the present application, the material of the barrier layer 12 includes a thermoplastic resin, and the first resin 111 and the second resin 131 both include a thermosetting resin.

[0077] The carbon fiber layer 11 , the barrier layer 12 and the conductive layer 13 are integrally hot-pressed to form the support plate 100 .

[0078] It is understandable that thermoplastic resin has the property of softening when heated and hardening when cooled without chemical reaction, and can maintain this property even after repeated heating. At the same time, thermoplastic resin and thermosetting resin also have excellent adhesion when hot-pressed. Therefore, hot-pressing the carbon fiber layer 11, the barrier layer 12 and the conductive layer 13 as a whole can not only reduce the thickness of the support plate 100, but also maintain excellent firmness.

[0079] Optionally, the thermoplastic material of the barrier layer 12 may be polyetheretherketone (PEEK), acrylic (PMMA), polycarbonate (PC), etc.

[0080] Figure 5 The support plate 100 of one or more embodiments of the present application is shown. Figure 5 In the present invention, parts different from those of the above-described embodiment will be described to avoid redundancy.

[0081] Please refer to Figure 5 In some embodiments of the present application, the molecular weight of the barrier layer 12 is greater than 10,000 Daltons.

[0082] It is understandable that the polymer material itself does not have fluidity and needs to be added with a solvent to have fluidity. The barrier layer 12 can be formed by coating a polymer slurry with a solvent added on the conductive layer 13 and removing the solvent by heating. Based on the property that the polymer material does not have fluidity, the first resin 111 and the second resin 131 are prevented from passing through the barrier layer 12 and blending during hot pressing.

[0083] In addition, the molecular weight of the thermosetting resin before it is heat-cured depends on the type of resin and the preparation process. Even if they are of the same type, different preparation processes will lead to different molecular weights.

[0084] Optionally, the molecular weight of the polyester resin in the thermosetting resin before heat curing may be between 400 D and 500 D; the molecular weight of the phenolic resin in the thermosetting resin before heat curing may be between 1000 D and 9000 D. Taking the first resin 111 and the second resin 131 as epoxy resin as an example, the molecular weight of the epoxy resin before curing is between 800 D and 7000 D, so the molecular weight of the barrier layer 12 is greater than 10000 D to better prevent the first resin 111 and the second resin 131 with smaller molecular weight from passing through the barrier layer 12 and blending.

[0085] Optionally, in some embodiments of the present application, the thickness of the barrier layer 12 is less than or equal to 1 micron.

[0086] It can be understood that, compared with the above-mentioned embodiment in which the barrier layer 12 is thicker, the barrier layer 12 of the embodiment of the present application can be coated directly on the surface of the conductive layer 13 or the carbon fiber layer 11 by coating. Since the barrier layer 12 is directly formed on the conductive layer 13 or the carbon fiber layer 11 by coating, the thickness of the barrier layer 12 can be reduced, so that the thickness of the barrier layer 12 is small, wherein the thickness of the barrier layer 12 can be less than or equal to 1 micron.

[0087] Optionally, the thickness of the barrier layer 12 may be 1 micron, 0.9 micron, 0.8 micron, 0.7 micron, 0.6 micron, 0.5 micron, 0.4 micron, 0.3 micron or 0.2 micron, etc.

[0088] Optionally, in some embodiments of the present application, the carbon fiber xw includes a first carbon fiber x1 and a second carbon fiber x2, the first carbon fiber x1 is dispersed in the first resin 111, the second carbon fiber x2 is partially disposed in the first resin 111, and the second carbon fiber x2 is partially disposed in the barrier layer 12.

[0089] The second carbon fiber x2 penetrates the barrier layer 12, and a part of the second carbon fiber x2 is connected to the conductor dd.

[0090] It can be understood that, compared with the above-mentioned embodiment in which the barrier layer 12 is thicker, based on the fact that the length of the second carbon fiber x2 is less than or equal to 1 micron, the embodiment of the present application reduces the thickness of the barrier layer 12 to less than or equal to 1 micron, so that the second carbon fiber x2 can penetrate the barrier layer 12 and connect to the conductor dd, so that the conductive layer 13 can be electrically connected to the carbon fiber layer 11, thereby improving the conductive performance of the support plate 100 in the thickness direction F3.

[0091] Optionally, in some embodiments of the present application, the material of the barrier layer 12 includes a thermoplastic resin, and the first resin 111 and the second resin 131 both include a thermosetting resin.

[0092] The barrier layer 12 is a coating layer, and the barrier layer 12 is formed on the surface of the conductive layer 13 to form a conductive composite layer. The conductive composite layer and the carbon fiber layer 11 are integrally hot-pressed to form the support plate 100 .

[0093] That is to say, the material of the barrier layer 12 is first coated on the conductive layer 13, and the solvent in the material of the barrier layer 12 is removed to form a conductive composite layer in which the barrier layer 12 and the conductive layer 13 are superimposed. Subsequently, the conductive composite layer is directly stacked on the carbon fiber layer 11, and an integrated hot pressing treatment is performed in a high temperature environment to form a support plate 100.

[0094] Optionally, the thermoplastic resin material of the barrier layer 12 may be a thermoplastic resin powder coating such as saturated polyester resin, polyetheretherketone, etc.

[0095] It should be noted that the present application is based on the test data of conductivity and adhesion of three comparative examples. Among them, the support plate of the first comparative example only includes a carbon fiber layer; the support plate of the second comparative example includes a carbon fiber layer and a metal nickel layer, and the metal nickel layer is directly formed on the carbon fiber layer by physical vapor deposition. The support plate of the third comparative example corresponds to Figure 1 The support plate of the fourth comparative example corresponds to Figure 5 The support plate of the structure. Please refer to the following table:

[0096]

[0097] It should be noted that the resistance of the first comparative example is the resistance of the carbon fiber layer. The resistance of the second comparative example is the resistance of the metal nickel layer. The resistance of the third comparative example to the fourth comparative example is the resistance of the composite conductive layer formed by stacking the conductive layer 13 and the barrier layer 12. In the second comparative example, the conductive film is the metal nickel layer. In the third comparative example and the fourth comparative example, the conductive film is the composite conductive layer formed by stacking the conductive layer 13 and the barrier layer 12.

[0098] According to the above table, in the comparison of surface resistance at room temperature, boiling surface resistance and salt spray surface resistance, the third and fourth comparisons are much smaller than the second comparison, that is, the surface conductivity of the conductive layer 13 of the third and fourth comparisons is better, which is more conducive to electrostatic discharge.

[0099] In the comparison of room temperature vertical resistance, the fourth comparative example is close to the second comparative example, and the third comparative example has a larger room temperature vertical resistance because the barrier layer 12 completely isolates the carbon fibers of the carbon fiber layer and the conductive layer 13. In other words, the composite conductive layer of the fourth comparative example has a vertical conductivity close to that of the second embodiment, and its vertical conductivity is better than that of the third comparative example.

[0100] In the corresponding comparison of room temperature adhesion and boiling adhesion, the third and fourth comparisons are the same as the second comparison; in the comparison of salt spray adhesion, the third and fourth comparisons are greater than the second comparison. In other words, the third and fourth comparisons use a hot pressing integrated molding process, so that the composite conductive layer has an adhesion strength equivalent to that of the second comparison, and even in a salt spray environment, its adhesion is stronger.

[0101] The embodiment of the present application further provides a display module, which includes a display panel 200 and a support plate 100 as described in any one of the above embodiments, wherein the display panel 200 is disposed on the support plate 100;

[0102] The conductive layer 13 is disposed on a side of the carbon fiber layer 11 away from the display panel 200 , and the conductive layer 13 is configured to at least cover the electronic components.

[0103] Optionally, the display panel 200 is a flexible panel. The display panel 200 may be an electroluminescent panel, such as an organic light emitting display panel, a quantum dot light emitting display panel or a light emitting diode display panel.

[0104] It should be noted that the structure of the support plate 100 of the display module of the embodiment of the present application is similar to or the same as the structure of the support plate 100 described in any of the above embodiments, so it will not be described in detail here.

[0105] Please refer to Figure 6, accordingly, the embodiment of the present application further provides a display device 1000, which includes a display panel 200 and a support plate 100 as described in any one of the above embodiments, and the display panel 200 is disposed on the support plate 100;

[0106] The conductive layer 13 is disposed on a side of the carbon fiber layer 11 away from the display panel 200 , and the conductive layer 13 is configured to at least cover the electronic components.

[0107] It should be noted that the structure of the support plate 100 of the display device 1000 in the embodiment of the present application is similar to or the same as the structure of the support plate 100 described in any of the above embodiments, so it will not be described in detail here.

[0108] That is to say, the display device 1000 of the embodiment of the present application includes the display module of any of the above embodiments.

[0109] The support plate 100 of the display device 1000 of the embodiment of the present application is configured to support the display panel 200. The support plate 100 includes a carbon fiber layer 11, a barrier layer 12 and a conductive layer 13, and the carbon fiber layer 11 includes a first resin 111 and carbon fibers xw. The barrier layer 12 is disposed on the carbon fiber layer 11, and the conductive layer 13 is disposed on a side of the barrier layer 12 away from the carbon fiber layer 11. The conductive layer 13 includes a second resin 131 and a conductor dd, and the conductor dd is dispersed in the second resin 131. The barrier layer 12 is configured to prevent the first resin 111 and the second resin 131 from blending.

[0110] Among them, compared with the vapor deposition method, the embodiment of the present application adopts the method of dispersing the conductor dd in the second resin 131 to form the conductive layer 13, which saves the preparation cost; secondly, the conductive layer 13 adopts a non-vapor deposition process, so it has better flatness. In addition, it should be noted that in a high temperature environment, the barrier layer 12 can block the fusion of the first resin 111 and the second resin 131, and prevent the first resin 111 from flowing into the conductive layer 13, causing the resin content of the conductive layer 13 to increase, thereby causing conductive failure. Therefore, the barrier layer 12 can prevent the conductive performance of the conductive layer 13 from failing, thereby improving the yield of the support plate 100.

[0111] Optionally, the display panel 200 is a flexible panel. The display panel 200 may be an electroluminescent panel, such as an organic light emitting display panel, a quantum dot light emitting display panel or a light emitting diode display panel.

[0112] Optionally, the display device 1000 may be applied to and used in various products including, for example, televisions, notebook computers, monitors, billboards, Internet of Things (IoT) devices, and portable electronic devices including mobile phones, smart phones, tablet personal computers, mobile communication terminals, electronic organizers, electronic books, portable multimedia players (PMPs), navigation, and ultra mobile personal computers (UMPCs).

[0113] In addition, the display device 1000 according to some embodiments may be applied to a wearable device and may be used in a wearable device, including a smart watch, a watch phone, a glasses-type display, and a head-mounted display (HMD). In addition, according to some embodiments, the display device 1000 may be applied to an instrument panel for a car, a display screen in a central dashboard or a central information display (CID) arranged on a dashboard for a car, an interior mirror display replacing a side mirror of a car, and a display of an entertainment system arranged on the back of a front seat for rear seat passengers in a car.

[0114] The above is a detailed introduction to a support plate, a display module and a display device provided in the embodiments of the present application. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea; at the same time, for technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A display module, comprising a support plate for supporting a flexible display panel, characterized in that: The support plate comprises: a carbon fiber layer, comprising a first resin and carbon fibers, wherein the carbon fibers are dispersed in the first resin, and the first resin comprises a thermosetting resin; and A barrier layer, disposed on the carbon fiber layer; A conductive layer is arranged on a side of the barrier layer away from the carbon fiber layer, the conductive layer comprises a second resin and a conductor, and the conductor is dispersed in the second resin; One side of the barrier layer is directly connected to the carbon fiber layer, and the other side of the barrier layer is directly connected to the conductive layer. The barrier layer is configured to block the thermosetting resin from flowing into the conductive layer during a hot pressing process.

2. The display module according to claim 1, characterized in that: The softening temperature of the barrier layer is greater than or equal to 110 degrees Celsius.

3. The display module according to claim 2, characterized in that: The thickness of the barrier layer is between 3 micrometers and 8 micrometers.

4. The display module according to claim 1, characterized in that: The molecular weight of the barrier layer is greater than 10000 D.

5. The display module according to claim 4, characterized in that: The thickness of the barrier layer is less than or equal to 1 micron.

6. The display module according to any one of claims 1 to 5, characterized in that: The carbon fibers include first carbon fibers and second carbon fibers, the first carbon fibers are dispersed in the first resin, the second carbon fibers are partially disposed in the first resin, and the second carbon fibers are partially disposed in the barrier layer.

7. The display module according to claim 5, characterized in that: The carbon fiber includes a first carbon fiber and a second carbon fiber, the first carbon fiber is dispersed in the first resin, a portion of the second carbon fiber is disposed in the first resin, a portion of the second carbon fiber is disposed in the barrier layer, the second carbon fiber penetrates the barrier layer, and a portion of the second carbon fiber is connected to the conductor.

8. The display module according to claim 3, characterized in that: The material of the barrier layer includes a thermoplastic resin, and the first resin and the second resin both include a thermosetting resin; The carbon fiber layer, the barrier layer and the conductive layer are integrally hot-pressed to form the support plate.

9. The display module according to claim 5, characterized in that: The material of the barrier layer includes a thermoplastic resin, and the second resin includes a thermosetting resin; The barrier layer is a coating layer, and the barrier layer is formed on the surface of the conductive layer to form a conductive composite layer. The conductive composite layer and the carbon fiber layer are integrally hot-pressed to form the support plate.

10. The display module according to any one of claims 1 to 5, characterized in that: The conductor includes at least one of conductive particles and conductive fibers. In the conductive layer, the content ratio of the conductor is between 70% and 92%, and the content ratio of the second resin is between 8% and 30%.

11. The display module according to claim 10, characterized in that: The conductive layer and the barrier layer are directly connected to form a conductive composite layer, and the surface resistance of the conductive composite layer is smaller than the vertical resistance of the conductive composite layer.

12. The display module according to any one of claims 1 to 5, characterized in that: The support plate includes a bending area and non-bending areas arranged on both sides of the bending area, and the conductive layer and the barrier layer are correspondingly arranged in the non-bending areas.

13. A display device, characterized in that: Comprising the display module according to any one of claims 1 to 12; The conductive layer is disposed on a side of the carbon fiber layer away from the display panel, and the conductive layer is configured to at least cover electronic components.

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