A ceramic package tube cutting frame device and a cutting frame method

By using a ceramic package shell cutting device and laser cutting technology, the problem of package shell delamination and damage during lead and wire removal has been solved, achieving non-destructive removal and improving product reliability.

CN118720005BActive Publication Date: 2026-11-03NORTH ELECTRON RES INST ANHUI CO LTD
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Patent Information

Application Number
CN202411086865.4
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-08-08
Publication Date
2026-11-03
Estimated Expiration
2044-08-08

AI Technical Summary

Technical Problem

When cutting off the pins and leads of ceramic packaged tubes, it is easy to cause delamination and damage to the packaged tube body, which affects product reliability.

Method used

A ceramic encapsulation tube shell cutting frame device is adopted, including a lower punching die and a reciprocating upper punching die. Multiple punching tools and a placement table are used to fix and separate the pins and leads. Combined with laser cutting technology, the flatness of the pins and leads is ensured, and the impact force is reduced through elastic connection.

Benefits of technology

It effectively prevents the pins and leads from bending and deforming during the cutting process, ensuring the integrity of the package and improving product reliability.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application discloses a ceramic package tube shell cutting outer frame device and a cutting rib method. The device comprises a punching lower die and a punching upper die which can move reciprocally along the vertical direction. The punching lower die comprises at least a placement table with a placement groove. The punching upper die comprises at least two first punching cutters. During the punching operation, the package shell body is embedded in the placement groove, the pins and the lead wires are placed on the placement table, and the outer frame is in a suspended state. The two first punching cutters can be clamped on the top and the edge of the outer frame. During the punching operation, the placement groove fixes the package shell body, and the pins and the lead wires are supported by the placement table, so that the flatness of the pins and the lead wires is ensured during the punching and cutting of the outer frame, and the pins and the lead wires are prevented from being bent and deformed. The laser cutting process is used to realize the lossless cutting of the pins and the lead wires.
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Description

Technical Field

[0001] This invention relates to the field of packaging shell rib cutting technology, and more specifically to a ceramic packaging tube shell rib cutting device and rib cutting method. Background Technology

[0002] With the increasing demands for reliability, miniaturization, and low cost from fields such as military, aviation, aerospace, and automotive electronics, traditional non-hermetic plastic encapsulation is no longer sufficient. Ceramic Kovar integrated encapsulation has become a preferred option. The final process for this type of encapsulation is lead cutting and shaping to meet component installation requirements. How to remove leads with high quality and without damage has become the key to ensuring product reliability.

[0003] Due to the high reliability and long-term storage requirements of electronic products in military and aerospace applications, integrated ceramic Kovar casings typically require electroplating of a layer of nickel or gold onto the Kovar metal surface to protect the Kovar alloy for reliability. For details regarding the electroplating process during manufacturing, please refer to... Figure 1 The bonding points inside the housing and the external metal pins B are directly connected to the outer frame C of the housing, allowing for direct electroplating. However, the chip bonding area and the packaging area cannot be directly connected to the outer frame C of the housing. Therefore, to ensure the reliability of the plating in various parts of the housing, two electroplating leads D are added to the side of the housing to connect with the chip bonding area and the packaging area on the housing.

[0004] After this type of package is completed, in order to adapt to assembly requirements of different sizes, the pin B size needs to be customized, and the electroplated leads D on the side of the package body A needs to be cut off. The electroplated leads D are connected to the package body A by soldering. The cutting process can easily cause delamination and damage to the package body E, resulting in quality and reliability issues. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide a ceramic package shell cutting frame device and a rib cutting method to prevent delamination and damage to the package shell body when cutting pins and leads.

[0006] To solve the above technical problems, the present invention adopts the following technical solution: a ceramic encapsulation tube shell cutting outer frame device, including a lower punching die and an upper punching die that can reciprocate in the vertical direction, wherein the lower punching die includes at least a placement platform with a placement groove, and the upper punching die includes at least two first stamping cutters.

[0007] During the punching operation, the package housing body is embedded in the placement slot, the pins and leads rest on the placement platform, the outer frame is suspended in the air, and the two first punching tools can be stuck on the top and edge of the outer frame.

[0008] Furthermore, the stamping end of the first stamping tool has a notch on the side near the outer frame, and the side of the notch gradually slopes outward from top to bottom.

[0009] Furthermore, the top surface of the notch gradually slopes upward from right to left.

[0010] Furthermore, the lower punching die also includes two second limiting blocks with grooves respectively disposed on both sides of the placement table, and the upper punching die also includes two second stamping cutters;

[0011] During the punching operation, the corresponding lead wire portion of the outer frame is placed on the second limiting block, and the two second punching tools can abut against the top of the corresponding outer frame and extend into the groove.

[0012] Furthermore, the upper punching die also includes a positioning post arranged in a vertical direction, and the lower punching die also includes a mounting plate for mounting the placement platform, and the mounting plate is provided with a sliding groove that mates with the positioning post.

[0013] Furthermore, the upper punching die also includes a pressure plate and a connecting plate that is elastically connected to the pressure plate in the vertical direction, and the first punching tool and the second punching tool are assembled on the pressure plate.

[0014] Furthermore, it also includes an operating table, a protective cover disposed on the operating table, a lifting assembly disposed within the protective cover, a track disposed on the operating table with one end extending into the protective cover, and a slide table slidably disposed on the track, wherein the lower punching die is detachably connected to the slide table, and the upper punching die is connected to the lifting assembly.

[0015] Furthermore, the control panel is also equipped with a drawer that slides out for placing waste materials.

[0016] Furthermore, the protective cover is made of a transparent material.

[0017] A method for cutting the ribs of a ceramic encapsulation tube shell, applied to the ceramic encapsulation tube shell outer frame cutting device as described above, characterized in that it includes:

[0018] S1. Pull out the slide table and install the punching die on the slide table;

[0019] S2. Place the product to be cut with its top facing down on the placement platform, and push the slide into the protective cover;

[0020] S3. Activate the lifting assembly to make the lower punching die punch downwards, separating the product pins and leads from the outer frame;

[0021] S4. Pull out the slide table, remove the punching die, and place it on the laser cutting platform;

[0022] S5. Use a laser to cut off the side leads and wires along the ceramic housing.

[0023] The beneficial effects of this invention are reflected in:

[0024] When the cutting device of the present invention performs the punching operation, the placement groove fixes the packaging shell body, and the pins and leads are supported by the placement platform to ensure the flatness of the pins and leads during the punching and cutting of the outer frame, and to prevent the pins and leads from bending and deforming. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the ceramic encapsulation shell structure in the background technology.

[0026] Figure 2 This is a schematic diagram of the ceramic encapsulation tube shell cutting outer frame device of the present invention;

[0027] Figure 3 This is a schematic diagram of the combined structure of the upper and lower punching dies of the present invention;

[0028] Figure 4 This is a schematic diagram of the punching die portion of the present invention;

[0029] Figure 5 This is a schematic diagram of the upper punching die of the present invention;

[0030] Figure 6 The side view of the punching upper die part of the present invention.

[0031] The components in the attached diagram are labeled as follows: 1. Lower punching die; 101. Placement platform; 1011. Placement groove; 102. Second limiting block; 1021. Groove; 103. Mounting plate; 1031. Slide groove; 2. Upper punching die; 201. First stamping cutter; 2011. Notch; 202. Second stamping cutter; 203. Positioning post; 204. Pressure plate; 205. Connecting plate; 3. Operating platform; 4. Protective cover; 5. Lifting assembly; 6. Rail; 7. Slide table; 8. Drawer; A. Encapsulated housing body; B. Pin; C. Outer frame; D. Lead wire. Detailed Implementation

[0032] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0033] The ceramic encapsulation tube shell cutting frame device of the present invention, see [link to invention]. Figure 1 , 2 4, 5, 6, including a lower punching die 1 and an upper punching die 2 that can reciprocate in the vertical direction, wherein the lower punching die 1 includes at least a placement table 101 with a placement groove 1011, and the upper punching die 2 includes at least two first stamping tools 201.

[0034] During the punching operation, the package housing body A is embedded in the placement groove 1011, the pins B and leads D rest on the placement platform 101, and the outer frame C is suspended in the air. The two first punching tools 201 can be clamped on the top and edge of the outer frame C. With this design, during the punching operation, the placement groove 1011 fixes the package housing body A, and the pins B and leads D are supported by the placement platform 101, ensuring the flatness of the pins B and leads D during the punching and cutting of the outer frame C, and preventing the pins B and leads D from bending and deforming. In addition, multiple placement platforms 101 can be set, and multiple first punching tools 201 can also be set, realizing the punching of multiple products at one time.

[0035] In this embodiment, see Figure 5 , 6 The first stamping cutter 201 has a notch 2011 on the side of the stamping end near the outer frame C, and the side of the notch 2011 gradually slopes outward from top to bottom. This design makes it easy for the outer frame C to enter the notch 2011 when the first stamping cutter 201 performs downward punching.

[0036] In this embodiment, see Figure 5 , 6 Furthermore, the top surface of the notch 2011 gradually slopes upward from right to left. This design ensures that when the first stamping cutter 201 performs downward punching, the edge at the location of the notch 2011 forms a wedge-shaped cutter, facilitating the separation of the outer frame C.

[0037] In this embodiment, see Figure 5 , 6 The lower punching die 1 also includes two second limiting blocks 102 with grooves 1021 respectively disposed on both sides of the placement platform 101, and the upper punching die 2 also includes two second punching tools 202.

[0038] During the punching operation, the portion of the outer frame C connected to the lead wire D is placed on the second limiting block 102, and the two second punching tools 202 can abut against the top of the corresponding outer frame C and extend into the groove 1021. This design provides a separate tool for the portion of the outer frame C connected to the lead wire D, allowing for targeted separation based on the different connection methods between the pin B and the lead wire D and the outer frame C, ensuring effective separation.

[0039] In this embodiment, see Figure 3 The upper punching die 2 further includes a positioning post 203 arranged vertically, and the lower punching die 1 further includes a mounting plate 103 for mounting the placement table 101, and the mounting plate 103 has a sliding groove 1031 that mates with the positioning post 203. This design ensures accurate alignment of the upper punching die 2 and the lower punching die 1 when the upper punching die 2 reciprocates vertically, through the cooperation of the positioning post 203 and the sliding groove 1031. Specifically, it ensures accurate alignment of the first stamping tool 201 and the second stamping tool 202 with the placement table 101 and the second limiting block 102.

[0040] In this embodiment, see Figure 3 The upper punching die 2 further includes a pressure plate 204 and a connecting plate 205 elastically connected to the pressure plate 204 in the vertical direction. The first punching cutter 201 and the second punching cutter 202 are mounted on the pressure plate 204. This design allows for flexible punching through the elastic connection when the first punching cutter 201 and the second punching cutter 202 move vertically to perform punching, reducing the impact force on small punched products during punching. The elastic connection can be achieved using a spring.

[0041] In this embodiment, see Figure 2 It also includes an operating table 3, a protective cover 4 mounted on the operating table 3, a lifting assembly 5 mounted inside the protective cover 4, a track 6 mounted on the operating table 3 with one end extending into the protective cover 4, and a slide table 7 slidably mounted on the track 6. The lower punching die 1 is detachably connected to the slide table 7, and the upper punching die 2 is connected to the lifting assembly 5. This design allows the punching operation to be performed inside the protective cover 4, providing better protection for the operator. The detachability of the lower punching die 1 and the slide table 7 facilitates the removal of the slide table 7 for subsequent operations on the punched product. In this embodiment, the lower punching die 1 and the slide table 7 can be detached using a threaded connection or similar method, and the lifting assembly 5 can be a lifting cylinder.

[0042] In this embodiment, see Figure 2The workbench 3 is also equipped with a drawer 8 that slides down for placing waste. This design allows for centralized collection of waste, keeping the workbench clean and facilitating subsequent cleaning.

[0043] In this embodiment, see Figure 2 The protective cover 4 is made of a transparent material. This design allows the punching process to be observed from the outside, enabling timely intervention in case of operational errors.

[0044] The present invention provides a method for cutting the ribs of a ceramic encapsulation tube shell, applied to the ceramic encapsulation tube shell outer frame cutting device as described above, characterized in that it includes:

[0045] S1. Pull out the slide table 7 and install the punching die 1 on the slide table 7;

[0046] S2. Place the product to be cut with the top facing down on the placement table 101, and push the slide table 7 into the protective cover 4;

[0047] S3. Activate the lifting assembly 5, causing the lower punching die 1 to punch downwards, thus producing...

[0048] Pin B and lead D are separated from the outer frame C;

[0049] S4. Pull out the slide table 7, remove the punching die 1, and place it on the laser cutting platform;

[0050] S5. Use a laser to cut off the side pin B and lead D along the ceramic housing.

[0051] This design also distributes the cutting of the outer frame C, pins B, and leads D. During the punching operation, the platform 101 provides support to ensure the flatness of pins B and leads D during the punching and cutting of the outer frame C, preventing pins B and leads D from bending and deforming. When cutting pins B and leads D, laser cutting technology is used to achieve non-destructive cutting.

[0052] It should be noted that if the embodiments of the present invention involve directional indicators such as up, down, left, right, front, back, etc., the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture as shown in the attached figure. If the specific posture changes, the directional indicators will also change accordingly.

[0053] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the meaning of "and / or" throughout the text includes three parallel solutions; for example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, "multiple" refers to two or more. Moreover, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0054] It should be understood that the examples and embodiments described herein are for illustrative purposes only and are not intended to limit the invention. Those skilled in the art can make various modifications or changes based on them. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the invention should be included within the protection scope of the invention.

Claims

1. A device for cutting the outer frame of a ceramic encapsulation tube shell, characterized in that, It includes a lower punching die (1) and an upper punching die (2) that can reciprocate in the vertical direction, wherein the lower punching die (1) includes at least a placement platform (101) with a placement slot (1011) and the upper punching die (2) includes at least two first stamping tools (201). During the punching operation, the package housing body (A) is embedded in the placement slot (1011), the pins (B) and leads (D) rest on the placement platform (101), and the outer frame (C) is in a suspended state. The two first punching tools (201) can be stuck on the top and edge of the outer frame (C). The lower punching die (1) also includes two second limiting blocks (102) with grooves (1021) respectively disposed on both sides of the placement platform (101), and the upper punching die (2) also includes two second stamping tools (202). During the punching operation, the outer frame (C) with the corresponding lead wire (D) is placed on the second limiting block (102), and the two second punching tools (202) can abut against the top of the corresponding outer frame (C) and extend into the groove (1021).

2. The ceramic encapsulation tube shell cutting frame device according to claim 1, characterized in that, The first stamping cutter (201) has a notch (2011) on the side of the stamping end near the outer frame (C), and the side of the notch (2011) gradually slopes outward from top to bottom.

3. The ceramic encapsulation tube shell cutting frame device according to claim 2, characterized in that, The top surface of the gap (2011) gradually slopes upward from right to left.

4. The ceramic encapsulation tube shell cutting frame device according to claim 1, characterized in that, The upper punching die (2) further includes a positioning post (203) arranged in the vertical direction, and the lower punching die (1) further includes a mounting plate (103) for mounting the placement platform (101), and the mounting plate (103) is provided with a sliding groove (1031) that is fitted through and cooperates with the positioning post (203).

5. The ceramic encapsulation tube shell cutting frame device according to claim 1, characterized in that, The punching die (2) further includes a pressure plate (204) and a connecting plate (205) that is elastically connected to the pressure plate (204) in the vertical direction, and the first punching tool (201) and the second punching tool (202) are assembled on the pressure plate (204).

6. The ceramic encapsulation tube shell cutting frame device according to any one of claims 1-5, characterized in that, It also includes an operating table (3), a protective cover (4) set on the operating table (3), a lifting assembly (5) set inside the protective cover (4), a track (6) set on the operating table (3) with one end extending into the protective cover (4), and a slide (7) slidably set on the track (6). The lower punching die (1) is detachably connected to the slide (7), and the upper punching die (2) is connected to the lifting assembly (5).

7. The ceramic encapsulation tube shell cutting frame device according to claim 6, characterized in that, The control panel (3) is also equipped with a drawer (8) for placing waste materials.

8. The ceramic encapsulation tube shell cutting frame device according to claim 6, characterized in that, The protective cover (4) is made of transparent material.

9. A method for cutting the ribs of a ceramic encapsulation tube shell, applied to the ceramic encapsulation tube shell outer frame cutting device as described in claim 6, characterized in that, include: S1. Pull out the slide (7) and install the punching die (1) on the slide (7); S2. Place the product to be cut with the top facing down on the placement table (101), and push the slide (7) into the protective cover (4); S3. Activate the lifting assembly (5) to make the upper punching die (2) punch downwards, separating the product pins (B) and leads (D) from the outer frame (C); S4. Pull out the slide (7), remove the punching die (1), and place it on the laser cutting platform; S5. Use a laser to cut off the side leads (B) and wires (D) along the ceramic housing.

Citation Information

Patent Citations

  • Lead punching device for ceramic four-side lead flat packaging device

    CN117253804A

  • A splice bar excision cutter for semiconductor device encapsulation

    CN206474557U