Cutting method, device, medium and equipment based on laser path of laser equipment

Abstract

The present invention relates to a cutting method, device, medium and equipment based on the laser path of a laser device, comprising obtaining the intensity and cutting depth of an object to be cut and the attribute parameters of the laser device during the cutting process; determining the spiral laser path of the laser used by the laser device to cut the object to be cut according to the intensity, cutting depth and attribute parameters; determining the required wedge angle of the target angle of a wedge mirror in the laser device according to the spiral laser path, and replacing the wedge mirror in the laser device with the required wedge angle as the target; when the wedge mirror is replaced with a wedge mirror whose wedge angle meets the required wedge angle, controlling the laser device to emit laser to the replaced wedge mirror and move along a preset cutting path at a moving speed in the attribute parameters, so that the replaced wedge mirror transmits the laser to the focusing mirror of the laser device, and the laser passing through the focusing mirror during the movement performs laser cutting on the object to be cut according to the spiral laser path.

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