A packaging device for processing precision semiconductor components

Abstract

The present invention discloses a packaging device for processing precision semiconductor components. The present invention relates to the technical field of packaging devices, including a packaging rack, a pre-pressurizer is arranged on the top of the packaging rack, a hot press aligner is installed at the output end of the pre-pressurizer, and a feeder is arranged in the middle of the upper surface of the packaging rack. The packaging device for processing precision semiconductor components supports and clamps the ceramic substrate of the semiconductor component to be packaged through the cooperation of the feeder and the clamper, and then sends it to the bottom of the hot press aligner to cooperate with the setting of the pre-pressurizer, so that the hot press aligner moves down, and the ceramic substrate is pre-fixed. In the pre-fixing process, the ceramic substrate is aligned to ensure the alignment effect of the substrate. In the process of hot press pre-fixing, the resin is quickly softened and begins to solidify after being heated, and the position of the substrate is fixed to prevent displacement in subsequent operations, thereby ensuring the accuracy of packaging alignment.

Description

Technical Field

[0001] The present invention relates to the technical field of packaging equipment, and in particular to packaging equipment for processing precision semiconductor components. Background Art

[0002] Precision semiconductor components are the basic building blocks of electronic technology. Semiconductor components play a vital role in various electronic devices and systems. The packaging of semiconductor components is to use packaging equipment to encapsulate the manufactured semiconductor chips in a protective shell through a series of fine processes. The purpose is to protect the chip from physical damage, chemical corrosion and environmental influences. Usually, the semiconductor chip is encapsulated in a ceramic substrate, and then the two layers of ceramic substrates are bonded with high-strength resin and sintered and packaged to achieve the packaging and molding purpose of semiconductor components.

[0003] During the packaging process, after the resin is coated on a layer of ceramic substrate, it needs to be covered with another layer of ceramic substrate and pre-fixed to ensure the quality of the sintering process. However, poor substrate alignment is prone to occur during pre-fixing, which makes it difficult to ensure the quality of the packaged precision semiconductor components, resulting in malfunction or failure of the final packaged device. Summary of the invention

[0004] To achieve the above objectives, the present invention is implemented through the following technical solutions: a packaging device for processing precision semiconductor components, including a packaging rack, the packaging rack serves as a supporting structure of the entire device, provides stability and installation foundation, a pre-pressurizer is arranged on the top of the packaging rack, the pre-pressurizer performs pre-pressing treatment on the semiconductor components to prepare for subsequent packaging, a hot pressing aligner is installed at the output end of the pre-pressurizer, the hot pressing aligner applies heat to assist in pre-fixing the ceramic substrates of the semiconductor components and ensure accurate position alignment during hot pressing packaging, a feeder is arranged in the middle of the upper surface of the packaging rack, the feeder is used to transport semiconductor components for processing, and the feeder is located directly below the hot pressing aligner, a clamp is installed on the top of the feeder, the clamp is used to clamp the ceramic substrate of the semiconductor components;

[0005] The hot pressing aligner comprises an electric heating element, which generates heat for heating the packaging process. The electric heating element is installed on the output end of the prepressor. A heat-conducting hot pressing element is installed on the output end of the electric heating element. The heat-conducting hot pressing element transfers heat and assists the hot pressing operation. An alignment element is arranged on the outer edge surface of the heat-conducting hot pressing element. The alignment element is used to assist in achieving precise alignment between the ceramic substrates.

[0006] The alignment part includes an outer baffle plate, which plays a blocking role. The outer baffle plate is arranged on the outer edge surface of the heat-conducting hot pressing part, and a hinge seat is fixedly installed on the bottom end of the inner edge surface of the outer baffle plate. A fitting alignment plate is hinged on the outer edge surface of the hinge seat. The fitting alignment plate is used to cooperate with the downward pressure to achieve accurate alignment between the substrates when contacting the ceramic substrate. The hinge seat is used to achieve hinged rotation between the outer baffle plate and the hinge seat. A heat-resistant elastic plate is fixedly connected to the surface of the fitting alignment plate on one side close to the outer baffle plate. One side of the heat-resistant elastic plate is fixed to the inner edge surface of the outer baffle plate, and the heat-resistant elastic plate is located above the hinge seat. The heat-resistant elastic plate has heat-resistant performance and provides elastic force to ensure the contact between the hinge seat and the ceramic substrate, so as to achieve the pushing of the ceramic substrate to assist in substrate alignment.

[0007] Preferably, the preloader includes a vertical plate, which serves to support and connect other components. The vertical plate is fixedly mounted on the top of the packaging frame, and a mounting plate is fixedly mounted on the outer edge surface of the vertical plate. A lifting cylinder is fixedly mounted on the top of the mounting plate, and the lifting cylinder is used to provide power to drive related components to perform lifting movements. The output shaft of the lifting cylinder passes through the mounting plate and slides with the inner wall of the mounting plate. The mounting plate is used to install and fix the lifting cylinder, and the end of the output shaft of the lifting cylinder is fixedly connected to the lifting plate. The lifting plate moves up and down under the action of the lifting cylinder, and a limiting slot plate arranged below the mounting plate is fixedly mounted on the outer edge surface of the vertical plate, and the inner wall of the lifting plate slides with the outer edge surface of the limiting slot plate. The limiting slot plate is used to limit the moving range of the lifting plate and provide guidance.

[0008] Preferably, the electric heating element includes an electric heating box, which is fixedly mounted on the outer edge surface of the lifting plate, and a mounting frame shell is fixedly mounted on the bottom of the electric heating box, and the mounting frame shell is through-set, and an electric heating tube is fixedly mounted on the inner edge surface of the mounting frame shell, and the electric heating box and the electric heating tube cooperate to generate heat for heating the packaging process, so that the resin can quickly soften and begin to solidify after being heated, thereby fixing the position of the two layers of the substrate to prevent displacement in subsequent operations and ensure alignment accuracy, the wiring terminal of the electric heating tube is electrically connected to the output end of the electric heating box, the mounting frame shell is used to install the electric heating tube, and the mounting frame shell is through-set to facilitate heat transfer.

[0009] Preferably, the heat-conducting hot pressing part includes a heat-insulating carrier plate, which is fixedly mounted on the bottom of the mounting frame shell, the heat-insulating carrier plate plays a heat-insulating role and can prevent heat loss and affect other components, the outer baffle plate is fixedly mounted on the outer edge surface of the heat-insulating carrier plate, the bottom of the heat-insulating carrier plate is fixedly connected with a heat-conducting strip, a plurality of the heat-conducting strips are provided, and the plurality of the heat-conducting strips are evenly distributed on the bottom surface of the heat-insulating carrier plate, a heat-conducting groove is provided on the bottom surface of the heat-conducting strip, the heat-conducting strip and the heat-conducting groove enhance the heat conduction efficiency and make the heat evenly distributed, a metal bottom plate is fixedly mounted on the bottom surface of the heat-conducting strip, a through groove is provided in the middle of the bottom surface of the metal bottom plate, a heat-insulating plate is fixedly mounted on the inner wall of the through groove, and the provision of the heat-insulating plate prevents the influence of the electric heating pipe from causing excessive temperature in a local area on the metal bottom plate.

[0010] Preferably, the feeder includes an external fixed frame, the outer edge surface of the external fixed frame is fixed to the top inner wall of the packaging frame, both ends of the external fixed frame are fixedly installed with sealing plates, and the sealing plates are provided with moving parts. The external fixed frame and the sealing plates are used to constitute an external frame for the moving parts to transport semiconductor components.

[0011] Preferably, the moving part includes a servo motor, which provides a transmission driving force. The servo motor is fixedly mounted on the outer surface of one of the sealing plates, and the output shaft of the servo motor passes through the sealing plate and rotates with the inner wall of the sealing plate. The end of the output shaft of the servo motor is fixedly connected with a screw rod, and the two ends of the screw rod respectively rotate with the inner surfaces of the two sealing plates. A moving seat is transmission-connected on the outer edge surface of the screw rod, and the outer edge surface of the moving seat slides with the inner edge surface of the outer fixed frame. Specifically, the moving seat is threadedly sleeved on the outer edge surface of the screw rod, and the servo motor, the screw rod and the moving seat constitute a transmission system to realize the moving and conveying of the ceramic substrate of the semiconductor component, and the clamp is arranged on the top of the moving seat and is symmetrically arranged about the center line of the moving seat.

[0012] Preferably, the clamp includes a driving clamping member, which is installed on the top of both sides of the movable seat, and an auxiliary alignment member is provided at the output end of the driving clamping member. The bottom surface of the auxiliary alignment member slides with the top of the movable seat, and an adjusting member connected to the auxiliary alignment member is installed at the output end of the driving clamping member.

[0013] Preferably, the driving clamping member includes a cylinder, which provides a driving force for clamping. The cylinder is fixedly mounted on the top side of the moving seat. A clamping push plate is fixedly mounted on the end of the output shaft of the cylinder. The clamping push plate is used to clamp the ceramic substrate of the semiconductor component under the driving force of the cylinder. A bonding plate is fixedly mounted on the middle part of the surface of the side of the clamping push plate away from the cylinder. The bonding plate plays a role in assisting the side alignment of the ceramic substrate during the contact with the ceramic substrate. The bottom surfaces of the clamping push plate and the bonding plate slide with the top of the moving seat. Installation grooves are provided on the two end surfaces of the clamping push plate. The auxiliary alignment member is installed at the end position of the clamping push plate, and the adjusting member is installed on the inner wall of the installation groove.

[0014] Preferably, the auxiliary alignment member includes an alignment plate frame, which is used to assist in completing the alignment operation. The end of the alignment plate frame close to the clamping push plate is hinged to the end of the clamping push plate, and the end of the alignment plate frame away from the clamping push plate is provided with a wheel groove, and the inner wall of the wheel groove is provided with a straightening roller. The straightening roller assists in position adjustment and guiding the ceramic substrate, and the top and bottom of the straightening roller rotate with the inner wall of the wheel groove. The alignment plate frame supports the straightening roller and cooperates with the straightening roller to assist in the alignment of the ceramic substrate.

[0015] Preferably, the adjusting member includes a sleeve shell, the outer edge surface of the sleeve shell is fixed to the inner wall of the mounting groove, a sliding block is arranged on the inner edge surface of the sleeve shell, the outer edge surface of the sliding block slides with the inner edge surface of the sleeve shell, one end of the sliding block extends to the outside of the sleeve shell and is hinged with a bent push rod, the end of the sliding block sliding on the inner edge surface of the sleeve shell is fixedly connected with a spring, the sleeve shell serves to accommodate the protective spring and provide a sliding extrusion spring path for the sliding block, and the end of the spring away from the sliding block is fixed to the inner wall of the sleeve shell, The end of the bending push rod away from the sliding block is provided with a slide groove seat, and the slide groove seat is fixedly installed on the outer edge surface of the alignment plate frame, and the limiting shaft rod is fixedly connected to the surface of the end of the bending push rod close to the slide groove seat, and the spring provides elastic pulling force to facilitate the swing back of the alignment plate frame and the straightening roller to increase the alignment force on the side of the ceramic substrate, and the outer edge surfaces of the bending push rod and the limiting shaft rod both slide with the inner wall of the slide groove seat, and the slide groove seat is used to limit the bending push rod and the limiting shaft rod to ensure the pulling effect exerted by the bending push rod on the alignment plate frame.

[0016] The present invention provides a packaging device for processing precision semiconductor components. It has the following beneficial effects:

[0017] 1. The packaging equipment for processing precision semiconductor components, through the cooperation of the feeder and the clamper, supports and clamps the ceramic substrate of the semiconductor components to be packaged, and then sends it to the bottom of the hot pressing aligner to cooperate with the setting of the pre-pressurizer, so that the hot pressing aligner moves down to pre-fix the ceramic substrate, and in the pre-fixing process, the ceramic substrate is aligned to ensure the alignment effect of the substrate. In the process of hot pressing pre-fixing, the resin quickly softens and begins to solidify after being heated, fixes the position of the substrate, prevents displacement in subsequent operations, and thus ensures the accuracy of packaging alignment.

[0018] 2. The packaging equipment for processing precision semiconductor components generates heat through electric heating elements to increase the temperature on the heat-conducting hot pressing elements, uses heat-conducting strips to increase the temperature of the metal base plate, and cooperates with heat-conducting grooves to increase the contact area between the heat-conducting strips and the surrounding air, thereby improving the heat exchange efficiency, so that heat can be transferred from the heat-conducting strips to the metal base plate more quickly. The setting of the heat-conducting grooves can promote the flow of air on the heat-conducting strips, enhance forced convection, and accelerate heat transfer. Furthermore, the pressure applied by the pre-pressurizer can be used to evenly distribute the resin between the two layers of the substrate, share the pressure, reduce stress concentration during the hot pressing process, and improve the bonding strength of the resin after curing, thereby ensuring the packaging quality.

[0019] 3. The packaging equipment for processing precision semiconductor components moves the upper substrate by moving the metal bottom plate downward and coordinating the contact between the bonding alignment plate and the outer side of the substrate, forcing the substrates to align. The resilience of the heat-resistant elastic plate and the hinge of the bonding alignment plate on the hinge seat are used to adjust the alignment range to avoid damage to the substrate caused by excessive downward pressure, significantly improve the alignment accuracy of the two-layer substrate, ensure precise alignment between the substrates, and reduce the risk of poor alignment.

[0020] Fourth, the packaging equipment for processing precision semiconductor components drives the clamping push plate and the bonding plate to move through the cylinder, utilizes the contact between the bonding plate and the side of the substrate to bond with the substrate for rapid positioning, and cooperates with the contact between the straightening roller and the substrate to pull the adjusting part so that the straightening roller has a thrust toward the substrate, assisting the substrate in position adjustment and guiding alignment, thereby further ensuring the packaging quality of semiconductor components.

[0021] 5. The packaging equipment for processing precision semiconductor components, through the contact between the straightening roller and the side of the substrate, causes the alignment plate frame to rotate on the clamping push plate due to the thrust of the contact, pulls the bent push rod to slide in the slide slot seat, and uses the bent push rod to pull the sliding block to slide in the shell, so that the spring is deformed to generate an elastic pulling force, which cooperates with the elastic pulling force of the spring to force the shell and the sliding block to rotate toward the substrate, thereby further ensuring the alignment effect between the substrates, cooperating with the alignment effect of the alignment piece, and improving the alignment accuracy and the quality of semiconductor component packaging. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A schematic diagram of the external structure of a packaging device for processing precision semiconductor components of the present invention;

[0023] Figure 2 It is a schematic diagram of the three-dimensional structure of the present invention;

[0024] Figure 3 It is a schematic diagram of the three-dimensional structure of the pre-pressing device and the hot pressing aligning device of the present invention;

[0025] Figure 4 It is a schematic diagram of the three-dimensional structure of the hot pressing aligner of the present invention;

[0026] Figure 5 It is a schematic diagram of the partial cross-sectional structure of the hot pressing aligner of the present invention;

[0027] Figure 6 It is a three-dimensional structural schematic diagram of the alignment piece of the present invention;

[0028] Figure 7 It is a schematic diagram of the cross-sectional structure of the hot pressing aligner of the present invention;

[0029] Figure 8 It is a schematic diagram of the three-dimensional structure of the feeder and the clamper of the present invention;

[0030] Fig. 9 It is a schematic diagram of the three-dimensional structure of the clamp of the present invention;

[0031] Fig.10 It is a schematic diagram of the cross-sectional structure of the clamp of the present invention;

[0032] Fig.11 It is a schematic diagram of the three-dimensional structure of the adjusting member of the present invention.

[0033] In the figure: 1. Packaging frame; 2. Pre-pressor; 21. Vertical plate; 22. Lifting cylinder; 23. Mounting plate; 24. Lifting plate; 25. Limiting slot plate; 3. Hot pressing aligner; 31. Electric heating element; 311. Electric heating box; 312. Mounting frame shell; 313. Electric heating pipe; 32. Heat-conducting hot pressing element; 321. Heat-insulating carrier plate; 322. Metal bottom plate; 323. Heat-conducting strip; 324. Heat-conducting slot; 325. Insulating plate; 33. Alignment element; 331. Outer baffle; 332. Alignment plate; 333. Articulated seat; 334. Thermoelastic plate; 4, feeder; 41, outer fixing frame; 42, sealing plate; 43, moving part; 431, servo motor; 432, lead screw; 433, moving seat; 5, clamp; 51, driving clamp; 511, cylinder; 512, clamping push plate; 513, laminating plate; 514, mounting groove; 52, auxiliary alignment part; 521, alignment plate frame; 522, straightening roller; 53, adjusting part; 531, sleeve; 532, sliding block; 533, bending push rod; 534, slide seat; 535, spring; 536, limit shaft. DETAILED DESCRIPTION

[0034] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. The embodiments of the present invention are provided for the purpose of illustration and description, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present invention, and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses.

[0035] The first embodiment, as Figure 1 , Figure 2 , Figure 3 , Figure 6As shown, the present invention provides a technical solution: a packaging device for processing precision semiconductor components, including a packaging rack 1, a pre-press 2 is arranged on the top of the packaging rack 1, a hot pressing aligner 3 is installed at the output end of the pre-press 2, a feeder 4 is arranged in the middle of the upper surface of the packaging rack 1, and the feeder 4 is located directly below the hot pressing aligner 3, a clamp 5 is installed on the top of the feeder 4, and the ceramic substrate of the semiconductor component to be packaged is supported and clamped by the cooperation of the feeder 4 and the clamp 5, and then sent to the bottom of the hot pressing aligner 3, the pre-press 2 includes a vertical plate 21, the vertical plate 21 is fixedly installed on the top of the packaging rack 1, a mounting plate 23 is fixedly installed on the outer edge surface of the vertical plate 21, and a lifting air is fixedly installed on the top of the mounting plate 23 Cylinder 22, the output shaft of the lifting cylinder 22 passes through the mounting plate 23 and slides with the inner wall of the mounting plate 23, the end of the output shaft of the lifting cylinder 22 is fixedly connected with the lifting plate 24, the outer edge surface of the vertical plate 21 is fixedly installed with a limiting slot plate 25 arranged below the mounting plate 23, the inner wall of the lifting plate 24 slides with the outer edge surface of the limiting slot plate 25, the output shaft of the lifting cylinder 22 is extended and retracted to drive the lifting plate 24 to move under the limiting guide of the limiting slot plate 25, and drive the hot pressing aligner 3 to move downward, the ceramic substrate is pre-fixed, and in the pre-fixing process, the ceramic substrate is aligned, and in the process of hot pressing pre-fixing, the resin is quickly softened and begins to solidify after being heated, the position of the substrate is fixed, and the displacement in the subsequent operation is prevented;

[0036] The hot pressing aligner 3 includes an electric heating element 31, which is installed on the output end of the prepressor 2. A heat-conducting hot pressing element 32 is installed on the output end of the electric heating element 31. An aligning element 33 is arranged on the outer edge surface of the heat-conducting hot pressing element 32. The temperature of the heat-conducting hot pressing element 32 is increased by heating by the electric heating element 31, and the side of the ceramic substrate is aligningly operated with the assistance of the aligning element 33.

[0037] The alignment member 33 includes an outer baffle plate 331, which is arranged on the outer edge surface of the heat-conducting hot pressing member 32, and a hinge seat 333 is fixedly installed on the bottom end of the inner edge surface of the outer baffle plate 331, and a fitting alignment plate 332 is hingedly connected to the outer edge surface of the hinge seat 333, and a heat-resistant elastic plate 334 is fixedly connected to the surface of the fitting alignment plate 332 on one side close to the outer baffle plate 331, one side of the heat-resistant elastic plate 334 is fixed to the inner edge surface of the outer baffle plate 331, and the heat-resistant elastic plate 334 is located above the hinge seat 333, and the heat-conducting hot pressing member 32 is moved downward, so that the fitting alignment plate 332 contacts the outer side of the substrate, pushing the upper substrate to move, forcing the substrates to align, and utilizing the resilience of the heat-resistant elastic plate 334 and the hinge of the fitting alignment plate 332 on the hinge seat 333 to adjust the alignment amplitude, ensure accurate alignment between the substrates, and reduce the risk of poor alignment.

[0038] During operation, the staff places the ceramic substrate of the semiconductor device on the feeder 4, clamps the ceramic substrate with the clamper 5, and then transports it to the bottom of the hot pressing aligner 3, and then uses the output shaft of the lifting cylinder 22 to drive the lifting plate 24 to move under the limiting guide of the limiting slot plate 25, and drives the hot pressing aligner 3 to move downward, and uses the electric heating element 31 to heat and increase the temperature on the heat-conducting hot pressing element 32, and cooperates with the downward movement of the heat-conducting hot pressing element 32 to make the bonding alignment plate 332 contact with the outer side of the substrate, push the upper substrate to move, force the substrates to align, and use the resilience of the heat-resistant elastic plate 334 and the hinge of the bonding alignment plate 332 on the hinge seat 333 to adjust the alignment amplitude, ensure the precise alignment between the substrates, reduce the risk of poor alignment, and then use the heat-conducting hot pressing element 32 to increase the temperature. In the process of hot pressing pre-fixation, the resin is quickly softened and begins to solidify after being heated, and the position of the substrate is fixed to prevent displacement in subsequent operations.

[0039] The second embodiment is based on the first embodiment. Figures 3 to 7 As shown, the electric heating element 31 includes an electric heating box 311, which is fixedly mounted on the outer edge surface of the lifting plate 24, and a mounting frame shell 312 is fixedly mounted on the bottom of the electric heating box 311. The mounting frame shell 312 is set through, and an electric heating pipe 313 is fixedly mounted on the inner edge surface of the mounting frame shell 312. The terminal of the electric heating pipe 313 is electrically connected to the output end of the electric heating box 311. The electric heating box 311 and the electric heating pipe 313 cooperate to heat, increase the temperature of the heat-conducting hot pressing piece 32, and assist in the hot pressing pre-fixing operation;

[0040] The heat-conducting hot pressing member 32 includes a heat-insulating carrier plate 321, which is fixedly mounted on the bottom of the mounting frame shell 312, and an outer baffle plate 331 is fixedly mounted on the outer edge surface of the heat-insulating carrier plate 321. A heat-conducting strip 323 is fixedly connected to the bottom of the heat-insulating carrier plate 321. A plurality of heat-conducting strips 323 are provided, and the plurality of heat-conducting strips 323 are evenly spaced and distributed on the bottom surface of the heat-insulating carrier plate 321. A heat-conducting groove 324 is provided on the bottom surface of the heat-conducting strip 323. A metal bottom plate 322 is fixedly mounted on the bottom surface of the heat-conducting strip 323. A through groove is provided in the middle of the bottom surface of the metal bottom plate 322, and a heat-insulating plate 325 is fixedly mounted on the inner wall of the through groove. The heat-conducting strip 323 is affected by the heat generated by the electric heating pipe 313, and the temperature of the metal bottom plate 322 is increased under the effect of heat conduction. The heat-conducting groove 324 is used to increase the contact area between the heat-conducting strip 323 and the surrounding air, thereby improving the heat exchange efficiency, so that the heat can be transferred from the heat-conducting strip 323 to the metal bottom plate 322 more quickly. The heat-conducting groove 324 promotes the flow of air on the heat-conducting strip 323, enhances forced convection, and accelerates heat transfer. The pressure applied by the pre-press 2 is used to evenly distribute the resin between the two substrates, share the pressure, reduce stress concentration during the hot pressing process, and improve the bonding strength of the resin after curing.

[0041] During operation, the electric heating box 311 and the electric heating pipe 313 cooperate to generate heat, thereby increasing the temperature of the heat-conducting hot pressing part 32. The heat-conducting strip 323 is affected by the heat generated by the electric heating pipe 313, and the temperature of the metal bottom plate 322 is increased under the effect of heat conduction. The heat-conducting groove 324 is used to increase the contact area between the heat-conducting strip 323 and the surrounding air, thereby improving the heat exchange efficiency, so that heat can be transferred from the heat-conducting strip 323 to the metal bottom plate 322 more quickly. The heat-conducting groove 324 is used to promote the flow of air on the heat-conducting strip 323, thereby enhancing forced convection and accelerating heat transfer. The pressure applied by the pre-press 2 is used to evenly distribute the resin between the two layers of the substrate, share the pressure, reduce stress concentration during the hot pressing process, and improve the bonding strength of the resin after curing, thereby assisting the hot pressing pre-fixing operation.

[0042] The third embodiment is based on the first and second embodiments. Figures 8 to 11 As shown, the feeder 4 includes an outer fixed frame 41, the outer edge surface of the outer fixed frame 41 is fixed to the top inner wall of the packaging frame 1, and both ends of the outer fixed frame 41 are fixedly installed with a sealing plate 42, and a moving part 43 is arranged on the sealing plate 42. The moving part 43 includes a servo motor 431, and the servo motor 431 is fixedly installed on the outer surface of a sealing plate 42, and the output shaft of the servo motor 431 passes through the sealing plate 42 and rotates with the inner wall of the sealing plate 42, and the end of the output shaft of the servo motor 431 is fixedly connected to the screw rod 4 32, the two ends of the screw rod 432 rotate with the inner surface of the two sealing plates 42 respectively, the outer edge surface of the screw rod 432 is connected with the moving seat 433 in a transmission manner, the outer edge surface of the moving seat 433 slides with the inner edge surface of the outer fixed frame 41, the clamp 5 is arranged on the top of the moving seat 433 and is symmetrically arranged about the center line of the moving seat 433, the output shaft of the servo motor 431 rotates to drive the screw rod 432 to rotate, and the moving seat 433 moves to drive the clamp 5 and the ceramic substrate clamped by the clamp 5 to move;

[0043] The clamp 5 includes a driving clamp 51, which is mounted on the top of both sides of the moving seat 433. The output end of the driving clamp 51 is provided with an auxiliary alignment member 52, the bottom surface of the auxiliary alignment member 52 slides with the top of the moving seat 433, and the output end of the driving clamp 51 is provided with an adjusting member 53 connected to the auxiliary alignment member 52. The driving clamp 51 includes a cylinder 511, which is fixedly mounted on the top of the side of the moving seat 433. The output shaft end of the cylinder 511 is fixedly mounted with a clamping push plate 512, and the clamping push plate 512 is away from the cylinder 5 A bonding plate 513 is fixedly installed in the middle of one side surface of 11, and the bottom surfaces of the clamping push plate 512 and the bonding plate 513 are slid with the top of the moving seat 433. The two end surfaces of the clamping push plate 512 are provided with mounting grooves 514. The auxiliary alignment member 52 is installed at the end position of the clamping push plate 512, and the adjustment member 53 is installed on the inner wall of the mounting groove 514. The clamping push plate 512 and the bonding plate 513 are driven to move by the output shaft of the cylinder 511. The bonding plate 513 is in contact with the side of the substrate to bond with the substrate for rapid positioning, and to assist in the side alignment of the substrate;

[0044] The auxiliary alignment member 52 includes an alignment plate frame 521, one end of the alignment plate frame 521 close to the clamping push plate 512 is hinged to the end of the clamping push plate 512, and a wheel groove is provided at one end of the alignment plate frame 521 away from the clamping push plate 512, and an alignment roller 522 is provided on the inner wall of the wheel groove, and the top and bottom of the alignment roller 522 are both rotated with the inner wall of the wheel groove. By utilizing the contact between the alignment roller 522 and the substrate and the pulling of the adjusting member 53, the alignment roller 522 has a thrust toward the substrate, thereby assisting the substrate in position adjustment and guiding alignment;

[0045] The adjusting member 53 includes a sleeve 531, the outer edge surface of the sleeve 531 is fixed to the inner wall of the mounting groove 514, a sliding block 532 is arranged on the inner edge surface of the sleeve 531, the outer edge surface of the sliding block 532 slides with the inner edge surface of the sleeve 531, one end of the sliding block 532 extends to the outside of the sleeve 531 and is hinged with a bent push rod 533, the end of the sliding block 532 sliding on the inner edge surface of the sleeve 531 is fixedly connected with a spring 535, the end of the spring 535 away from the sliding block 532 is fixed to the inner wall of the sleeve 531, the end of the bent push rod 533 away from the sliding block 532 is provided with a slide groove seat 534, the slide groove seat 534 is fixedly installed on the outer edge surface of the alignment plate frame 521, and the bent push rod 533 is close to the slide groove seat 5 The limiting shaft rod 536 is fixedly connected to the surface of one end of 34, and the outer edge surfaces of the bending push rod 533 and the limiting shaft rod 536 slide with the inner wall of the slide groove seat 534. Through the contact between the straightening roller 522 and the side of the substrate, the thrust of the contact causes the alignment plate frame 521 to rotate on the clamping push plate 512, pulling the bending push rod 533 to slide in the slide groove seat 534, and the bending push rod 533 is used to pull the sliding block 532 to slide in the shell 531, so that the spring 535 is deformed to generate an elastic pulling force, which cooperates with the elastic pulling force of the spring 535 to force the shell 531 and the sliding block 532 to rotate toward the substrate, cooperate with the alignment piece 33, strengthen the effect of the alignment process, and thereby improve the accuracy of alignment and the quality of semiconductor component packaging.

[0046] During operation, the output shaft of the servo motor 431 rotates to drive the screw rod 432 to rotate, and the output shaft of the cylinder 511 is extended and retracted to drive the clamping push plate 512 and the bonding plate 513 to move. The bonding plate 513 is in contact with the side of the substrate to bond with the substrate for rapid positioning, and to assist in the side alignment of the substrate. The straightening roller 522 is in contact with the substrate and pulled by the adjusting member 53, so that the straightening roller 522 has a thrust toward the substrate, assisting in the position adjustment and guide alignment of the substrate, and then the straightening roller 522 is used to adjust the position of the substrate. 22 is in contact with the side of the substrate, and the contact thrust causes the alignment plate frame 521 to rotate on the clamping push plate 512, pulling the bent push rod 533 to slide in the slide slot seat 534, and the bent push rod 533 is used to pull the sliding block 532 to slide in the shell 531, so that the spring 535 is deformed to generate an elastic pulling force, and the elastic pulling force of the spring 535 is combined to force the shell 531 and the sliding block 532 to rotate toward the substrate, and the moving seat 433 is used to move to drive the clamper 5 and the ceramic substrate clamped by the clamper 5 to move.

[0047] The following is a detailed description of the working principle of the packaging equipment for precision semiconductor components processing.

[0048] When in use, the staff places the ceramic substrate of the semiconductor device on the moving seat 433, and drives the screw 432 to rotate by rotating the output shaft of the servo motor 431, and drives the clamping push plate 512 and the bonding plate 513 to move by telescoping the output shaft of the cylinder 511, and utilizes the contact between the bonding plate 513 and the side of the substrate to bond with the substrate for rapid positioning, and assists in aligning the side of the substrate, and utilizes the contact between the straightening roller 522 and the substrate, and cooperates with the pulling of the adjusting member 53, so that the straightening roller 522 has a thrust toward the substrate, and assists in adjusting the position of the substrate and guiding it for alignment, and then through the contact between the straightening roller 522 and the side of the substrate, the contact thrust causes the alignment plate frame 52 The movable seat 433 is used to move the clamp 5 and the ceramic substrate clamped by the clamp 5, and then the clamp 5 and the ceramic substrate clamped by the clamp 5 are moved to the bottom of the hot press aligner 3. Then, the lifting plate 24 is moved under the limit guide of the limit slot plate 25 by the output shaft of the lifting cylinder 22, and the hot press aligner 3 is driven downward to move through the electric heating box 311 and the electric heating tube 31. 3, heating is performed to increase the temperature of the heat-conducting hot pressing piece 32, and the heat generated by the electric heating pipe 313 is used to affect the heat-conducting strip 323, so that the temperature of the metal bottom plate 322 rises under the effect of heat conduction, and the contact area between the heat-conducting strip 323 and the surrounding air is increased in cooperation with the heat-conducting groove 324, so as to improve the heat exchange efficiency, so that the heat can be transferred from the heat-conducting strip 323 to the metal bottom plate 322 more quickly, and the heat-conducting groove 324 is used to promote the flow of air on the heat-conducting strip 323, enhance forced convection, and accelerate the transfer of heat, and the pressure applied by the pre-pressing device 2 and the contact between the metal bottom plate 322 and the upper ceramic substrate are cooperated to make the resin evenly distributed between the two substrates, and the pressure is shared to reduce the heat The stress is concentrated during the pressing process, and the bonding strength of the resin after curing is improved to assist the hot pressing pre-fixing operation, and the downward movement of the heat-conducting hot pressing component 32 is coordinated to make the bonding plate 332 contact with the outer side of the substrate, push the upper substrate to move, force the substrates to align, and use the resilience of the heat-resistant elastic plate 334 and the hinge of the bonding plate 332 on the hinge seat 333 to adjust the alignment amplitude to ensure precise alignment between the substrates and reduce the risk of poor alignment. The heat-conducting hot pressing component 32 is then used to increase the temperature. During the hot pressing pre-fixing process, the resin is quickly softened and begins to solidify after being heated, fixing the position of the substrate. After the ceramic substrate is pre-fixed, it can be removed for subsequent processing.

[0049] Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field and related fields without creative work should fall within the scope of protection of the present invention. The structures, devices and operating methods not specifically described and explained in the present invention are implemented according to the conventional means in the field unless otherwise specified and limited.

Claims

1. A packaging device for precision semiconductor components processing, characterized in that: The packaging frame (1) comprises a pre-pressing device (2) disposed on the top of the packaging frame (1), a hot pressing aligner (3) being installed at the output end of the pre-pressing device (2), a feeder (4) being disposed in the middle of the upper surface of the packaging frame (1), and the feeder (4) being located directly below the hot pressing aligner (3), and a clamp (5) being installed on the top of the feeder (4); The hot pressing aligner (3) comprises an electric heating element (31), the electric heating element (31) is mounted on the output end of the prepressor (2), a heat-conducting hot pressing element (32) is mounted on the output end of the electric heating element (31), and an aligning element (33) is arranged on the outer edge surface of the heat-conducting hot pressing element (32); The alignment member (33) comprises an outer baffle (331), wherein the outer baffle (331) is arranged on the outer edge surface of the heat-conducting hot pressing member (32), a hinge seat (333) is fixedly installed on the bottom end of the inner edge surface of the outer baffle (331), a fitting alignment plate (332) is hingedly connected to the outer edge surface of the hinge seat (333), a heat-resistant elastic plate (334) is fixedly connected to the surface of the fitting alignment plate (332) on one side close to the outer baffle (331), one side of the heat-resistant elastic plate (334) is fixed to the inner edge surface of the outer baffle (331), and the heat-resistant elastic plate (334) is located above the hinge seat (333).

2. The packaging equipment for precision semiconductor components processing according to claim 1, characterized in that: The pre-pressurizer (2) comprises a vertical plate (21), the vertical plate (21) being fixedly mounted on the top of the packaging frame (1), a mounting plate (23) being fixedly mounted on the outer edge surface of the vertical plate (21), a lifting cylinder (22) being fixedly mounted on the top of the mounting plate (23), an output shaft of the lifting cylinder (22) passing through the mounting plate (23) and sliding with the inner wall of the mounting plate (23), a lifting plate (24) being fixedly connected to the end of the output shaft of the lifting cylinder (22), a limiting slot plate (25) arranged below the mounting plate (23) being fixedly mounted on the outer edge surface of the vertical plate (21), and the inner wall of the lifting plate (24) sliding with the outer edge surface of the limiting slot plate (25).

3. The packaging equipment for precision semiconductor components processing according to claim 2, characterized in that: The electric heating element (31) comprises an electric heating box (311), the electric heating box (311) is fixedly mounted on the outer edge surface of the lifting plate (24), a mounting frame shell (312) is fixedly mounted on the bottom of the electric heating box (311), the mounting frame shell (312) is arranged through, an electric heating pipe (313) is fixedly mounted on the inner edge surface of the mounting frame shell (312), and the connection terminal of the electric heating pipe (313) is electrically connected to the output end of the electric heating box (311).

4. The packaging equipment for precision semiconductor component processing according to claim 3, characterized in that: The heat-conducting hot-pressing component (32) comprises a heat-insulating carrier plate (321), the heat-insulating carrier plate (321) is fixedly mounted on the bottom of the mounting frame shell (312), the outer baffle plate (331) is fixedly mounted on the outer edge surface of the heat-insulating carrier plate (321), the bottom of the heat-insulating carrier plate (321) is fixedly connected with a heat-conducting strip (323), a plurality of the heat-conducting strips (323) are provided, and the plurality of the heat-conducting strips (323) are evenly spaced and distributed on the bottom surface of the heat-insulating carrier plate (321), and the heat-conducting strips (323) are fixedly connected to the bottom of the heat-insulating carrier plate (321). A heat conducting groove (324) is provided on the bottom surface of the heat conducting strip (323), the heat conducting strip (323) and the heat conducting groove (324) enhance the heat conduction efficiency and make the heat evenly distributed, a metal bottom plate (322) is fixedly installed on the bottom surface of the heat conducting strip (323), a through groove is provided in the middle of the bottom surface of the metal bottom plate (322), and a heat insulating plate (325) is fixedly installed on the inner wall of the through groove, and the provision of the heat insulating plate (325) prevents the influence of the electric heating pipe (313) from causing the temperature of a local area on the metal bottom plate (322) to be too high.

5. The packaging equipment for precision semiconductor component processing according to claim 1, characterized in that: The feeder (4) comprises an outer fixing frame (41), the outer edge surface of the outer fixing frame (41) is fixed to the top inner wall of the packaging frame (1), and sealing plates (42) are fixedly mounted on both ends of the outer fixing frame (41), and a moving part (43) is provided on the sealing plate (42).

6. The packaging equipment for precision semiconductor component processing according to claim 5, characterized in that: The moving member (43) comprises a servo motor (431), the servo motor (431) is fixedly mounted on the outer surface of one of the sealing plates (42), and the output shaft of the servo motor (431) passes through the sealing plate (42) and rotates with the inner wall of the sealing plate (42), the end of the output shaft of the servo motor (431) is fixedly connected with a screw rod (432), the two ends of the screw rod (432) respectively rotate with the inner surfaces of the two sealing plates (42), the outer edge surface of the screw rod (432) is drivingly connected with a moving seat (433), the outer edge surface of the moving seat (433) slides with the inner edge surface of the outer fixed frame (41), and the clamp (5) is arranged on the top of the moving seat (433) and is symmetrically arranged about the center line of the moving seat (433).

7. The packaging equipment for precision semiconductor components processing according to claim 6, characterized in that: The clamp (5) comprises a driving clamp (51), the driving clamp (51) being mounted on the top ends of both sides of the movable seat (433), an auxiliary alignment member (52) being arranged at the output end of the driving clamp (51), the bottom surface of the auxiliary alignment member (52) slidingly engaging with the top of the movable seat (433), and an adjusting member (53) connected to the auxiliary alignment member (52) being mounted at the output end of the driving clamp (51).

8. The packaging equipment for precision semiconductor component processing according to claim 7, characterized in that: The driving clamping member (51) comprises a cylinder (511), wherein the cylinder (511) is fixedly mounted on the top end of the side of the moving seat (433), a clamping push plate (512) is fixedly mounted on the end of the output shaft of the cylinder (511), a bonding plate (513) is fixedly mounted on the middle of the surface of the side of the clamping push plate (512) away from the cylinder (511), the bottom surfaces of the clamping push plate (512) and the bonding plate (513) are slidable with the top of the moving seat (433), mounting grooves (514) are provided on the surfaces of both ends of the clamping push plate (512), the auxiliary alignment member (52) is mounted on the end position of the clamping push plate (512), and the adjusting member (53) is mounted on the inner wall of the mounting groove (514).

9. The packaging equipment for precision semiconductor component processing according to claim 8, characterized in that: The auxiliary alignment member (52) comprises an alignment plate frame (521), one end of the alignment plate frame (521) close to the clamping push plate (512) is hinged to the end of the clamping push plate (512), and one end of the alignment plate frame (521) away from the clamping push plate (512) is provided with a wheel groove, and an alignment roller (522) is provided on the inner wall of the wheel groove, and the top and bottom of the alignment roller (522) are both rotatable with the inner wall of the wheel groove.

10. The packaging equipment for precision semiconductor component processing according to claim 9, characterized in that: The adjusting member (53) comprises a casing (531), the outer edge surface of the casing (531) being fixed to the inner wall of the mounting groove (514), a sliding block (532) being arranged on the inner edge surface of the casing (531), the outer edge surface of the sliding block (532) sliding on the inner edge surface of the casing (531), one end of the sliding block (532) extending to the outside of the casing (531) and being hinged to a bent push rod (533), and the end of the sliding block (532) sliding on the inner edge surface of the casing (531) being fixedly connected to a spring (535) The end of the spring (535) away from the sliding block (532) is fixed to the inner wall of the sleeve (531), and the end of the bent push rod (533) away from the sliding block (532) is provided with a slide groove seat (534), and the slide groove seat (534) is fixedly installed on the outer edge surface of the alignment plate frame (521), and the end surface of the bent push rod (533) close to the slide groove seat (534) is fixedly connected to a limiting shaft rod (536), and the outer edge surfaces of the bent push rod (533) and the limiting shaft rod (536) are both slidable with the inner wall of the slide groove seat (534).

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