LED device die bonding method and LED device

Abstract

The present invention discloses a method for bonding LED devices and an LED device, wherein the bonding method includes the following steps: S100, providing a substrate and an LED chip, forming a solder pad on the substrate, the solder pad being used to place the LED chip; S200, selecting a dispensing head according to the size of the LED chip, the dispensing head being provided with dispensing needles arranged in a matrix of n rows and m columns; after the dispensing head is glued, dispensing glue on the solder pad to form a conductive glue group; S300, locating one diagonal of the conductive glue group, using this diagonal as a set straight line, using the first conductive glue portion of the conductive glue group on the diagonal as a positioning point, and dispensing glue along the extension direction of the set straight line at a position offset from the positioning point by a set distance as a starting point to form another conductive glue group; S400, when the number of conductive glue groups is greater than 2, repeating S300 until all conductive glue groups are bonded along the set straight line at intervals to form a bonding piece; S500, placing the LED chip on the bonding piece for curing. The present invention provides a highly stable bonding method for LED devices and can effectively prevent excessive slurry creep.

Description

Technical Field

[0001] The present invention relates to the technical field of LEDs, and in particular to a method for solidifying a LED device, and an LED device manufactured using the method. Background Art

[0002] LED (Light Emitting Diode) devices are key to modern lighting and display technology. With their high efficiency, energy efficiency, and long lifespan, they are widely used in various fields, including indicator lighting, plant lighting, general lighting, automotive lighting, and display screens. Currently, these LED devices require ever-larger LED chips, requiring a larger coverage area for the silver paste layer that secures the LED chips. This silver paste layer is typically applied using a matrix dispensing method on the solder pads of the LED device's substrate. After the LED chip is secured to the silver paste layer, the die is solidified through curing. However, the existing matrix-type dispensing method has the following defects: 1. If the silver paste layer covering a large area is to be dispensed in order to reduce the subsequent creeping height of the silver paste layer, the spacing between the dispensing needles will generally be increased, so that the spacing between the silver paste points after dispensing becomes larger, and the silver paste layer is prone to have a problem of too large internal void area after solidification, affecting the stability of solidification; 2. If the spacing between the dispensing needles is made smaller, and the spacing between the silver paste points after dispensing is reduced, although the problem of voids in the silver paste layer after solidification can be solved, the amount of the silver paste layer is too large, so that after the LED chip is solidified, the silver paste layer is prone to creeping to the side of the LED chip or even through the side of the LED chip to the top surface of the LED chip (that is, the creeping height is too high), which can easily form an erroneous electrical connection circuit. Summary of the Invention

[0003] An object of the present invention is to provide a method for bonding a LED device, which can effectively improve the bonding stability and avoid excessive slurry creep.

[0004] Another object of the present invention is to provide an LED device with high stability in die bonding quality and less prone to excessive slurry creep.

[0005] To achieve this object, the present invention adopts the following technical solutions:

[0006] In a first aspect, a method for bonding an LED device is provided, comprising the following steps:

[0007] Step S100: providing a substrate and an LED chip, and forming a solder pad on the substrate, wherein the solder pad is used to place the LED chip;

[0008] Step S200: Select a dispensing head according to the size of the LED chip, wherein the dispensing head is provided with dispensing needles arranged in n rows and m columns in a matrix; after the dispensing head is glued, it first dispenses glue on the solder pad to form a conductive glue group, wherein the conductive glue group includes conductive glue parts arranged in n rows and m columns in a matrix;

[0009] Step S300: Locate one of the diagonals of the conductive adhesive group, use the diagonal as a set straight line, and use the first conductive adhesive portion of the conductive adhesive group on the diagonal as a positioning point. Then, dispense glue from a position offset by a set distance from the positioning point along the extension direction of the set straight line to form another conductive adhesive group, with the distance between the center of the conductive adhesive group dispensed later and the center of the conductive adhesive group dispensed earlier along the extension direction of the set straight line being the set distance.

[0010] Step S400: When the number of the conductive adhesive groups is greater than 2, repeat step S300 until all the conductive adhesive groups are dispensed and formed at intervals along the set straight line to form a die-bonding component;

[0011] Step S500: placing the LED chip on the die-bonding component and curing the die-bonding component.

[0012] As an optional solution of the LED device die-bonding method, in step S300, the conductive adhesive group dispensed first is used as the starting point to dispense another conductive adhesive group at the inner edge of the first conductive adhesive portion on the diagonal line.

[0013] As an optional solution for the LED device die bonding method, the cross-section of the dispensing needle is square, and the spacing between two adjacent dispensing needles in a horizontal row is smaller than the side length of a single dispensing needle, and the spacing between two adjacent dispensing needles in a vertical column is smaller than the side length of a single dispensing needle.

[0014] As an optional solution to the LED device die bonding method, the coverage area of ​​the dispensing head is equal each time; or, the coverage area of ​​the dispensing head that dispenses glue first in the dispensing sequence is larger than the coverage area of ​​the dispensing head that dispenses glue later.

[0015] As an optional solution to the LED device die-bonding method, adjacent conductive adhesive groups at least partially overlap.

[0016] As an optional solution to the LED device die bonding method, the center distance between adjacent conductive adhesive groups along the extension direction of the set straight line is a, and the size of a single conductive adhesive portion along the direction of the set straight line is b, b>a.

[0017] As an optional solution to the LED device die bonding method, the conductive adhesive portions of adjacent conductive adhesive groups overlap along the set straight line direction, the area of ​​the overlapping region of the conductive adhesive portions is S1, the area of ​​a single conductive adhesive portion is S2, and S1<S2.

[0018] As an optional solution to the LED device die bonding method, the die bonding part has a central area and an edge area surrounding the central area, and the total amount of the conductive adhesive part in the central area is greater than the total amount of the conductive adhesive part in the edge area.

[0019] As an optional solution to the LED device die-bonding method, the total area of ​​the die-bonding component is larger than the area of ​​a side surface of the LED chip facing the solder pad.

[0020] As an optional solution to the LED device die-bonding method, the die-bonding component includes two groups of the conductive adhesive groups;

[0021] The number of the conductive glue parts of the two groups of conductive glue groups is equal; or, the number of the conductive glue parts of the conductive glue group dispensed first is greater than the number of the conductive glue parts of the conductive glue group dispensed later, so that the conductive glue group dispensed later is located inside the conductive glue group dispensed first.

[0022] As an optional solution to the LED device die bonding method, the conductive adhesive group dispensed first includes n rows and m columns of conductive adhesive portions, where n and m are both positive integers greater than or equal to 2;

[0023] The spacing between two adjacent conductive adhesive portions along the horizontal row direction of the conductive adhesive group dispensed first is d1, the size of a single conductive adhesive portion along the horizontal row direction of the conductive adhesive group dispensed first is D1, the spacing between two adjacent conductive adhesive portions along the vertical column direction of the conductive adhesive group dispensed first is d2, and the size of a single conductive adhesive portion along the vertical column direction of the conductive adhesive group dispensed first is D2, wherein d1<D1, d2<D2, d1=d2, and D1=D2;

[0024] The arrangement spacing of the conductive adhesive portions of the conductive adhesive group dispensed later is the same as that of the conductive adhesive portions of the conductive adhesive group dispensed earlier.

[0025] As an optional solution for the LED device die bonding method, there are two conductive adhesive groups, each of which has the same number of conductive adhesive portions. The conductive adhesive group includes n rows and m columns of conductive adhesive portions, where n=m=5.

[0026] In a second aspect, an LED device is provided, wherein the LED device is manufactured and formed using the LED device die bonding method.

[0027] As an optional solution for the LED device, the edge of at least one side of the die-bonding component is wavy.

[0028] The beneficial effects of the present invention are as follows: multiple conductive glue groups are formed by dispensing glue on the soldering pad multiple times, and the conductive glue groups are dispensed and formed in sequence along the diagonal direction of the conductive glue group (i.e., the extension direction of the set straight line), so that the conductive glue group dispensed later can fill the local blank area of ​​the conductive glue group dispensed earlier (i.e., the gap between the conductive glue parts), thereby reducing the internal voids in the solid crystal component after solidifying the LED chip, so that the LED chip solid crystal effect is good and the stability is high, and the starting point of the conductive glue group dispensed later is the position after the first conductive glue part of the conductive glue group dispensed earlier on the diagonal is offset by a set distance, so the conductive glue group dispensed earlier will not be filled by the conductive glue group dispensed later at the local outer edge position, and the amount of glue in the conductive glue part at this local outer edge position is small, which can effectively avoid the solid crystal component overflowing after solidifying the LED chip and causing the slurry climbing height to be too high. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The present invention will be described in further detail below with reference to the accompanying drawings and examples.

[0030] Figure 1 Schematic cross-sectional view of an LED device according to an embodiment of the present invention.

[0031] Figure 2 This is a structural diagram of the first conductive adhesive assembly on the solder pad according to an embodiment of the present invention (with the position of the LED chip indicated).

[0032] Figure 3 Schematic diagram of the structure of the solder pad when the conductive adhesive is applied for the second time according to an embodiment of the present invention (the position of the LED chip is indicated).

[0033] Figure 4 Schematic diagram of the position of the conductive adhesive group when the conductive adhesive group is applied to the solder pad for the second time according to an embodiment of the present invention (the position of the LED chip is indicated).

[0034] Figure 5 Schematic diagram of the structure of a dispensing head according to an embodiment of the present invention.

[0035] Figure 6 Schematic diagram of the position of the dispensing head during two dispensing operations according to an embodiment of the present invention.

[0036] Figure 7 Schematic top view of an LED device according to an embodiment of the present invention.

[0037] In the picture:

[0038] 100, dispensing head; 110, dispensing needle;

[0039] 1. Substrate; 2. Solder pad; 3. LED chip; 4. Die-bonding component; 41. Conductive adhesive group; 411. Conductive adhesive portion; 42. Set straight line; 5. Packaging layer. DETAILED DESCRIPTION

[0040] To make the technical problems solved, the technical solutions adopted, and the technical effects achieved by the present invention more clearly understood, the technical solutions of the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings. It is apparent that the described embodiments are only some of the embodiments of the present invention, not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort shall fall within the scope of protection of the present invention.

[0041] In the description of the present invention, unless otherwise expressly specified or limited, the terms "connected," "connected," and "fixed" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention in specific circumstances.

[0042] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Furthermore, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0043] Reference Figures 1 to 6 As shown, an embodiment of the present invention provides a method for bonding LED devices, which is used to form LED devices. The LED device includes a substrate 1, a soldering pad 2, and an LED chip 3. The soldering pad 2 is provided on the substrate 1. The substrate 1 may be provided with one or more soldering pads 2 as needed. The embodiment of the present invention does not specifically limit the number of soldering pads 2. The LED chip 3 is fixed to the soldering pad 2 by a die-bonding member 4. If there are multiple soldering pads 2, one LED chip 3 is fixed to each soldering pad 2. After the LED chip 3 is fixed, the LED chip 3 is encapsulated by an encapsulation layer 5 so that the LED chip 3 is sealed within the encapsulation layer 5.

[0044] Furthermore, the LED device die bonding method includes the following steps:

[0045] Step S100: providing a substrate 1 and an LED chip 3, forming a solder pad 2 on the substrate 1, the solder pad 2 being used to place the LED chip 3;

[0046] Step S200: Select a dispensing head 100 according to the size of the LED chip 3. The dispensing head 100 is provided with dispensing needles 110 arranged in a matrix of n rows and m columns. After the dispensing head 100 is glued, it first dispenses glue on the pad 2 to form a conductive glue group 41. The conductive glue group 41 formed by dispensing includes conductive glue portions 411 arranged in a matrix of n rows and m columns.

[0047] Step S300: Locate one of the diagonals of the conductive adhesive group 41 dispensed first, use this diagonal as the set line 42, and use the first conductive adhesive portion 411 of the conductive adhesive group 41 dispensed first on the diagonal as the positioning point. Then, dispense glue starting from a position offset by a set distance from the positioning point along the extension direction of the set line 42 to form another conductive adhesive group 41 (i.e., the conductive adhesive group 41 dispensed later). The distance between the center of the conductive adhesive group 41 dispensed later and the center of the conductive adhesive group 41 dispensed first along the extension direction of the set line 42 is the set distance.

[0048] Step S400 , when the number of conductive adhesive groups 41 is greater than 2, repeat step S300 until all conductive adhesive groups 41 are dispensed and formed at intervals along the set straight line 42 to form a die-bonding member 4 ;

[0049] Step S500 : placing the LED chip 3 on the die-bonding component 4 , and curing the die-bonding component 4 .

[0050] The die bonding method of the embodiment of the present invention forms multiple conductive glue groups 41 by dispensing glue on the pad 2 multiple times, and dispensing the conductive glue groups 41 in sequence along the diagonal direction of the conductive glue group 41 (i.e., the extension direction of the set straight line 42), so that the conductive glue group 41 dispensed later can fill the local blank area of ​​the conductive glue group 41 dispensed earlier (i.e., the gap between the conductive glue part 411 and the conductive glue part 411), thereby reducing the internal voids in the die bonding component 4 after the LED chip 3 is bonded, so that the LED chip 3 has a good die bonding effect and high stability, and the starting point of the conductive glue group 41 dispensed later is the position after the first conductive glue part 411 of the conductive glue group 41 dispensed earlier on the diagonal is offset by a set distance, so the conductive glue group 41 dispensed earlier will not be filled by the conductive glue group 41 dispensed later at the local outer edge position, and the amount of glue in the conductive glue part 411 at this local outer edge position is small, which can effectively prevent the die bonding component 4 from overflowing after the LED chip is bonded and causing the slurry climbing height to be too high.

[0051] In this embodiment, adjacent conductive adhesive groups 41 are spaced apart from each other along the extension direction of the set straight line 42 , and adjacent conductive adhesive groups 41 at least partially overlap. One diagonal line of all conductive adhesive groups 41 coincides with the set straight line 42 . By spacing the centers of adjacent conductive adhesive groups 41 at a certain distance along this diagonal line, it is ensured that at least part of the adjacent conductive adhesive groups 41 overlap, and the conductive adhesive portions 411 in the matrix-type conductive adhesive group 41 formed by the later glue-dispensing can fill the blank areas between the conductive adhesive portions 411 of the matrix-type conductive adhesive group 41 formed by the earlier glue-dispensing, effectively reducing the occurrence of internal voids in the solid crystal component 4 after solidifying the LED chip 3, so that the solid crystal of the LED chip 3 has a good solid crystal effect and high stability. Moreover, since the conductive adhesive group 41 formed by the later glue-dispensing is glue-dispensed at a certain distance along the diagonal direction of the conductive adhesive group 41 formed by the earlier glue-dispensing, the amount of glue at the local edge position of the conductive adhesive group 41 formed by the earlier glue-dispensing will not increase, that is, the amount of glue at the local edge position of the entire solid crystal component 4 will be relatively small, which can effectively prevent the solid crystal component 4 from overflowing after solidifying the LED chip 3 and causing the slurry to climb too high.

[0052] In this embodiment, the die-bonding component 4 has a central region and an edge region surrounding the central region. The total amount of the conductive adhesive portion 411 in the central region is greater than the total amount of the conductive adhesive portion 411 in the edge region. By setting the total amount of adhesive in the central region of the die-bonding component 4 to be relatively high and the total amount of adhesive in the edge region to be relatively low, after the LED chip 3 is fixed to the die-bonding component 4, the conductive adhesive portion 411 in the central region forms a better die-bonding effect on the LED chip 3, with fewer voids and higher die-bonding stability. The number of conductive adhesive portions 411 in the edge region is smaller than that in the central region. During the die-bonding process, the edge region can absorb the amount of adhesive overflowing from the central region, and the amount of adhesive in the edge region slowly accumulates. Moreover, since the amount of adhesive in the edge region is relatively low, even if the adhesive in the central region is absorbed, the die-bonding component 4 can still effectively prevent the LED chip 3 from overflowing after die-bonding, thereby preventing the slurry from climbing too high.

[0053] Optionally, the die-bonding component 4 includes two conductive adhesive groups 41. In this embodiment, the number of conductive adhesive portions 411 in the conductive adhesive group 41 dispensed first is equal to the number of conductive adhesive portions 411 in the conductive adhesive group 41 dispensed later. This design allows the dispensing heads 100 used to dispense the two conductive adhesive groups 41 to use the same structure, reducing the frequency of dispensing head 100 replacement and increasing manufacturing speed.

[0054] In this embodiment, the center-to-center distance between two conductive adhesive groups 41 along the extension direction of the set straight line 42 is a, and the dimension of a single conductive adhesive portion 411 along the set straight line 42 is b, where a < b. This arrangement allows the later-dispensed conductive adhesive group 41 formed by offset dispensing by the dispensing head 100 to fill as much of the empty space between the earlier-dispensed conductive adhesive groups 41 as possible, thereby increasing the number of conductive adhesive portions 411 in the central region of the die-bonder 4.

[0055] Furthermore, the conductive adhesive portions 411 of the two conductive adhesive groups 41 overlap along the predetermined straight line 42 , and the area of ​​the overlapping conductive adhesive portions 411 is S1 , while the area of ​​a single conductive adhesive portion 411 is S2 , where S1 < S2 . During adhesive dispensing, the partially dispensed conductive adhesive portions 411 of the later dispensed conductive adhesive group 41 overlap with the partially dispensed conductive adhesive portions 411 of the earlier dispensed conductive adhesive group 41 , and the overlapping area is no greater than the area of ​​a single conductive adhesive portion 411 . This allows the later dispensed conductive adhesive group 41 to not only fill the empty areas of the earlier dispensed conductive adhesive group 41 , but also to overlap the partially dispensed conductive adhesive portions 411 of the earlier dispensed conductive adhesive group 41 , thereby increasing the total adhesive content of the conductive adhesive portions 411 in the central region of the entire die-bonding component 4 .

[0056] In specific operation, the starting point of the conductive glue group 41 to be dispensed later can be set at the inner edge of the first conductive glue portion 411 of the conductive glue group 41 dispensed earlier. Since the number of the conductive glue portions 411 of the conductive glue group 41 dispensed earlier is the same as the number of the conductive glue portions 411 of the conductive glue group 41 dispensed later, and the arrangement form and arrangement spacing of the conductive glue portions 411 of the conductive glue group 41 dispensed earlier are also set to be the same as the arrangement form and arrangement spacing of the conductive glue portions 411 of the conductive glue group 41 dispensed later (i.e., using one dispensing head 10 0 dispenses two conductive adhesive groups 41 in sequence), then after the dispensing of the conductive adhesive group 41 dispensed later is completed, the blank area between the conductive adhesive portions 411 of the first horizontal row and the first vertical column of the conductive adhesive group 41 dispensed earlier, which is adjacent to the starting point, is not filled by the conductive adhesive portions 411 of the conductive adhesive group 41 dispensed later, thereby forming a situation in which the number of conductive adhesive portions 411 in the edge area of ​​the die-bonding component 4 is small, while the number of conductive adhesive portions 411 in the middle area is large, that is, the total amount of conductive adhesive portions 411 in the middle area is greater than the total amount of conductive adhesive portions 411 in the edge area.

[0057] Of course, the total amount of the conductive glue portion 411 in the edge area of ​​the solid crystal part 4 can also be further reduced, that is, the conductive glue group 41 that is glued first can be in the blank area between the first horizontal row, the last horizontal row, and the first vertical column and the last vertical column. It can be filled with the conductive glue portion 411 of the conductive glue group 41 that is glued later, that is, the entire outer circle of the conductive glue group 41 that is glued first is not filled with the conductive glue portion 411 of the conductive glue group 41 that is glued later. At this time, the number of the conductive glue portions 411 of the conductive glue group 41 that is glued first can be set to be greater than the number of the conductive glue portions 411 of the conductive glue group 41 that is glued later, so that the conductive glue group 41 that is glued later is located inside the conductive glue group 41 that is glued first. In specific operations, different points are used. The glue head 100 dispenses glue to form two groups of conductive glue groups 41 respectively, and the starting point of the conductive glue group 41 dispensed later is still set at the inner edge of the first conductive glue part 411 of the diagonal line of the conductive glue group 41 dispensed earlier. In this way, after the dispensing is completed, the number of conductive glue parts 411 of the conductive glue group 41 dispensed later is less than the number of conductive glue parts 411 of the conductive glue group 41 dispensed earlier. Finally, a structural form can be formed in which the blank areas between the first horizontal row and the last horizontal row and the first vertical column of the conductive glue group 41 dispensed earlier are not filled by the conductive glue parts 411 of the conductive glue group 41 dispensed later, so that the total glue amount at the edge of the solid crystal component 4 is further reduced, thereby reducing the slurry climbing height of the solid crystal component 4 after the LED chip 3 is solidified.

[0058] Optionally, the conductive glue group 41 that is glued first includes n rows and m columns of conductive glue parts 411, where n and m are both positive integers greater than or equal to 2; the spacing between two adjacent conductive glue parts 411 along the horizontal direction of the conductive glue group 41 that is glued first is d1, the size of a single conductive glue part 411 along the horizontal direction of the conductive glue group 41 that is glued first is D1, the spacing between two adjacent conductive glue parts 411 along the vertical direction of the conductive glue group 41 that is glued first is d2, and the size of a single conductive glue part 411 along the vertical direction of the conductive glue group 41 that is glued first is D2, wherein d1<D1, d2<D2, d1=d2, D1=D2; the arrangement spacing of the conductive glue parts 411 of the conductive glue group 41 that is glued later is the same as that of the conductive glue parts 411 of the conductive glue group 41 that is glued first. By setting the horizontal row spacing and vertical column spacing of the conductive adhesive portions 411 of the two conductive adhesive groups 41 to be smaller than the size of a single conductive adhesive portion 411, after the two groups of conductive adhesive groups 41 are sequentially dispensed and formed, no matter how the center distance a of the two groups of conductive adhesive groups 41 along the extension direction of the set straight line 42 is adjusted, it can be ensured that the two groups of conductive adhesive groups 41 have some overlapping conductive adhesive portions 411 in the middle area of ​​the solid crystal component 4, so as to increase the total amount of the conductive adhesive portions 411 in the middle area of ​​the solid crystal component 4, thereby reducing the voids in the middle area of ​​the LED chip 3 after solid crystal bonding, and improving the stability of the LED chip 3 after solid crystal bonding.

[0059] In a specific embodiment of the present invention, the LED chip 3 is a square chip with a side length of 3 mm. There are two sets of conductive adhesive groups 41, each with the same number of conductive adhesive portions 411. The conductive adhesive groups 41 include n rows and m columns of conductive adhesive portions 411, where n = m = 5. Selecting an appropriate number of conductive adhesive portions 411 arranged in a matrix based on the side length of the LED chip 3 ensures stable mounting of the LED chip 3 and reduces slurry creep.

[0060] In this embodiment, if Figure 5 and Figure 6 As shown, the dispensing head 100 of the conductive adhesive portion 411 formed by adhesive dispensing includes 5 rows and 5 columns of dispensing needles 110. The cross section of each dispensing needle 110 is square. The side length of the dispensing needle 110 is 300 μm. The spacing between adjacent dispensing needles 110 in the horizontal row direction is 260 μm. The spacing between adjacent dispensing needles 110 in the column direction is also 260 μm. After the dispensing head 100 is glued, it dispenses glue on the pad 2 for the first time to form a group of conductive adhesive groups 41, and then dispenses glue on the pad 2 for the second time to form another group of conductive adhesive groups 41 ( Figure 6 The solid line portion is the position of the dispensing head 100 for the first dispensing, and the dotted line portion is the position of the dispensing head 100 for the second dispensing). The conductive glue portion 411 of the two conductive glue groups 41 is formed into a circular or elliptical or circular-like structure. The size design of this dispensing needle 110 and the appropriate spacing can also effectively prevent the dispensing needles 110 from sticking together. In other embodiments, it is not limited to using a dispensing needle 110 with a square cross-section. Dispensing needles 110 with other cross-sectional forms can also be used, such as circular, rectangular, polygonal, etc., and the shape of the conductive glue portion 411 after dispensing will also change according to the shape of the dispensing needle 110. The shapes of the dispensing needle 110 and the conductive glue portion 411 are not described in detail in this embodiment.

[0061] In one embodiment, the total area of ​​the die-bonding component 4 is larger than the area of ​​the side of the LED chip 3 facing the solder pad 2. By setting the total area of ​​the die-bonding component 4 larger than the area of ​​the side of the LED chip 3 to be bonded and fixed, it is possible to effectively prevent the formation of bonding voids in the LED chip 3 and improve the stability of the LED chip 3 after die-bonding.

[0062] In an optional embodiment of the present invention, in step S300, the conductive adhesive group 41 dispensed first is dispensed starting from the inner edge of the first conductive adhesive portion 411 on the diagonal line to form another conductive adhesive group 41. This design allows the conductive adhesive group 41 dispensed later to completely fill at least the blank area in the center of the first conductive adhesive group 41 dispensed first.

[0063] In this embodiment, two groups of conductive glue groups 41 are provided, and the same dispensing head 100 is used to dispense and form the two groups of conductive glue groups 41, that is, the number of horizontal rows and columns of the two groups of conductive glue groups 41 is consistent, and is the same as the number of horizontal rows and columns of the dispensing needles 110 of the dispensing head 100. During the specific operation, after the conductive glue group 41 that is dispensed first is formed, the conductive glue group 41 that is dispensed later is dispensed and formed with the inner edge of the first conductive glue portion 411 of the conductive glue group 41 that is dispensed first on the diagonal as the starting point. The finally formed solid crystal component 4 has spaced conductive glue portions 411 in the outermost circle and closely arranged conductive glue portions 411 inside, forming a solid crystal component 4 in which the total glue amount of the conductive glue portions 411 in the middle area is greater than the total glue amount of the conductive glue portions 411 in the edge area. At this time, the overall area of ​​the solid crystal component 4 is greater than the overall area of ​​a single conductive glue group 41.

[0064] In other embodiments, different dispensing heads 100 can also be used to dispense and form the two groups of conductive glue groups 41, that is, the conductive glue group 41 dispensed first has a larger number of conductive glue portions 411 arranged in a matrix, while the conductive glue group 41 dispensed later has a smaller number of conductive glue portions 411 arranged in a matrix, that is, the coverage area of ​​the dispensing head 100 dispensed first along the dispensing sequence direction is greater than the coverage area of ​​the dispensing head 100 dispensed later, so that the conductive glue group 41 dispensed later still dispenses glue from the inner edge of the first conductive glue portion 411 of the conductive glue group 41 dispensed first on the diagonal as the starting point, and after dispensing, a solid crystal component 4 can be formed in which the total amount of the conductive glue portion 411 in the middle area is greater than the total amount of the conductive glue portion 411 in the edge area, and at this time, the overall area of ​​the solid crystal component 4 is equal to the overall area of ​​the conductive glue group 41 dispensed first.

[0065] To further increase the amount of glue in the central area of ​​the die-bonder 4, the dispensing needles 110 of the dispensing head 100 have a square cross-section. The spacing between adjacent dispensing needles 110 in a horizontal row is less than the side length of a single dispensing needle 110, and the spacing between adjacent dispensing needles 110 in a vertical column is less than the side length of a single dispensing needle 110. This design allows the conductive adhesive portion 411 of the later-dispensed conductive adhesive group 41 to not only fill the empty space in the first-dispensed conductive adhesive group 41 but also partially overlap with the conductive adhesive portion 411 of the first-dispensed conductive adhesive group 41, thereby increasing the amount of glue in the central area of ​​the die-bonder 4 and further reducing the occurrence of voids in the die-bonder 4.

[0066] Optionally, 0.6*the side length of the LED chip 3 ≤ the side length of the cross section of the dispensing head 100 ≤ 1*the side length of the LED chip 3. For example, the side length of the cross section of the dispensing head 100 can be the side length of 0.6LED chip 3, the side length of 0.65LED chip 3, the side length of 0.7LED chip 3, the side length of 0.75LED chip 3, the side length of 0.8LED chip 3, the side length of 0.85LED chip 3, the side length of 0.9LED chip 3, the side length of 0.95LED chip 3 or the side length of LED chip 3.

[0067] Optionally, 0.5 the side length of a single dispensing needle 110 ≤ the spacing between adjacent dispensing needles 110 (i.e., the spacing between adjacent dispensing needles 110 in the horizontal row or column direction) ≤ 0.9 the side length of a single dispensing needle 110. For example, the spacing between adjacent dispensing needles 110 can be 0.5 the side length of a single dispensing needle 110, 0.55 the side length of a single dispensing needle 110, 0.6 the side length of a single dispensing needle 110, 0.65 the side length of a single dispensing needle 110, 0.7 the side length of a single dispensing needle 110, 0.75 the side length of a single dispensing needle 110, 0.8 the side length of a single dispensing needle 110, 0.85 the side length of a single dispensing needle 110 or 0.9 the side length of a single dispensing needle 110.

[0068] It is not limited to dispensing glue twice on the soldering pad 2 to form two groups of conductive glue groups 41. Three or more dispensing glue can also be set according to the area of ​​the soldering pad 2 and the LED chip 3 and the coverage area of ​​the dispensing head 100. The operation steps are similar to the two dispensing glue described above and will not be repeated here.

[0069] like Figures 1 to 4 As shown, an embodiment of the present invention further provides an LED device, which is manufactured and formed using the LED device die bonding method of any of the above embodiments.

[0070] like Figure 7 As shown, in this embodiment, the edge of at least one side of the die-bonding component 4 is wavy. During the LED device manufacturing process, after the die-bonding component 4 is dispensed and formed, all conductive adhesive portions 411 are circular or quasi-circular in structure. After the LED chip 3 is fixed, the die-bonding component 4 is squeezed. After the die-bonding component 4 solidifies, the conductive adhesive portions 411 on its outer edges may be partially or fully connected. At this time, due to the circular or quasi-circular shape of the conductive adhesive portions 411, the edge of at least one side of the solidified die-bonding component 4 may be wavy. Of course, if the squeezing force is uniform, the edges of all four sides of the die-bonding component 4 may be wavy.

[0071] In this specification, reference to terms such as "one embodiment" or "example" means that a specific feature, structure, material, or characteristic described in conjunction with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example.

[0072] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

[0073] The technical principles of the present invention have been described above with reference to specific embodiments. These descriptions are intended solely to illustrate the principles of the present invention and are not to be construed in any way as limiting the scope of protection of the present invention. Based on the explanations herein, those skilled in the art will readily conceive of other specific embodiments of the present invention without inventive effort, and such embodiments will fall within the scope of protection of the present invention.

Claims

1. A method for bonding LED devices, characterized in that: The following steps are involved: Step S100: providing a substrate and an LED chip, and forming a solder pad on the substrate, wherein the solder pad is used to place the LED chip; Step S200: Select a dispensing head according to the size of the LED chip, wherein the dispensing head is provided with dispensing needles arranged in n rows and m columns in a matrix; after the dispensing head is glued, it first dispenses glue on the solder pad to form a conductive glue group, wherein the conductive glue group includes conductive glue parts arranged in n rows and m columns in a matrix; Step S300: Locate one of the diagonals of the conductive adhesive group, use the diagonal as a set straight line, and use the first conductive adhesive portion of the conductive adhesive group on the diagonal as a positioning point. Then, dispense glue from a position offset by a set distance from the positioning point along the extension direction of the set straight line to form another conductive adhesive group, with the distance between the center of the conductive adhesive group dispensed later and the center of the conductive adhesive group dispensed earlier along the extension direction of the set straight line being the set distance. Step S400: When the number of the conductive adhesive groups is greater than 2, repeat step S300 until all the conductive adhesive groups are dispensed and formed at intervals along the set straight line to form a die-bonding component; Step S500: placing the LED chip on the die-bonding component and curing the die-bonding component.

2. The LED device die bonding method according to claim 1, wherein: In step S300 , the conductive adhesive group dispensed first is used as the starting point to dispense adhesive at the inner edge of the first conductive adhesive portion on the diagonal line to form another conductive adhesive group.

3. The LED device die bonding method according to claim 1, wherein: The cross section of the dispensing needle is square, the spacing between two adjacent dispensing needles in a horizontal row is smaller than the side length of a single dispensing needle, and the spacing between two adjacent dispensing needles in a vertical column is smaller than the side length of a single dispensing needle.

4. The LED device die bonding method according to claim 1, wherein: The coverage area of ​​the dispensing head for each dispensing is equal; or, along the dispensing sequence, the coverage area of ​​the dispensing head that dispenses glue first is larger than the coverage area of ​​the dispensing head that dispenses glue later.

5. The LED device die bonding method according to any one of claims 1 to 4, characterized in that: Adjacent conductive adhesive groups at least partially overlap.

6. The LED device die bonding method according to claim 5, characterized in that: The center distance between adjacent conductive adhesive groups along the extending direction of the set straight line is a, and the size of a single conductive adhesive portion along the direction of the set straight line is b, where b>a.

7. The LED device die bonding method according to claim 6, characterized in that: The conductive adhesive portions of adjacent conductive adhesive groups along the set straight line overlap, the area of ​​the overlapping region of the conductive adhesive portions is S1, the area of ​​a single conductive adhesive portion is S2, and S1<S2.

8. The LED device die bonding method according to claim 5, characterized in that: The die-bonding component has a central region and an edge region surrounding the central region. The total amount of the conductive adhesive portion in the central region is greater than the total amount of the conductive adhesive portion in the edge region.

9. The LED device die bonding method according to claim 5, characterized in that: The total area of ​​the die-bonding component is larger than the area of ​​a side surface of the LED chip facing the solder pad.

10. The LED device die bonding method according to claim 5, characterized in that: The die-bonding component includes two groups of conductive adhesives; The number of the conductive glue parts of the two groups of conductive glue groups is equal; or, the number of the conductive glue parts of the conductive glue group dispensed first is greater than the number of the conductive glue parts of the conductive glue group dispensed later, so that the conductive glue group dispensed later is located inside the conductive glue group dispensed first.

11. The LED device die bonding method according to claim 10, characterized in that: The conductive adhesive group dispensed first includes n rows and m columns of conductive adhesive portions, where n and m are both positive integers greater than or equal to 2; The spacing between two adjacent conductive adhesive portions along the horizontal row direction of the conductive adhesive group dispensed first is d1, the size of a single conductive adhesive portion along the horizontal row direction of the conductive adhesive group dispensed first is D1, the spacing between two adjacent conductive adhesive portions along the vertical column direction of the conductive adhesive group dispensed first is d2, and the size of a single conductive adhesive portion along the vertical column direction of the conductive adhesive group dispensed first is D2, wherein d1<D1, d2<D2, d1=d2, and D1=D2; The arrangement spacing of the conductive adhesive portions of the conductive adhesive group dispensed later is the same as that of the conductive adhesive portions of the conductive adhesive group dispensed earlier.

12. The LED device die bonding method according to claim 5, characterized in that: There are two conductive adhesive groups, and each conductive adhesive group has the same number of conductive adhesive portions. The conductive adhesive group includes n rows and m columns of conductive adhesive portions, where n=m=5.

13. An LED device, characterized in that: The LED device is manufactured and formed by the LED device die bonding method according to any one of claims 1 to 12.

14. The LED device according to claim 13, characterized in that The edge of at least one side surface of the die-bonding component is wavy.

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