Liquid cooling devices and electronic equipment

Abstract

The present invention provides a liquid cooling device and electronic equipment, the liquid cooling device including a housing, a medium outlet, a medium inlet, and a medium flow channel provided on the housing, a plurality of heat dissipation fins being arranged at intervals along the inner side of the medium flow channel; a confluence region is formed in the space between the medium outlet and the heat dissipation fins in the medium flow channel, a confluence structure is provided in the confluence region, the confluence structure including a first confluence plate and a second confluence plate that are opposite and spaced apart in the width direction, the distance between the first confluence plate and the second confluence plate in the width direction increasing along the direction from the medium outlet to the heat dissipation fins; the confluence structure and the heat dissipation fins are spaced apart in the extension direction, and the distance between each heat dissipation fin and the medium outlet increases from the middle to both sides in the width direction. The present invention can increase the flow velocity and temperature uniformity of the medium in the width direction of the flow channel, thereby improving the temperature consistency of the heat-generating chips at various locations and improving the temperature uniformity of the heat-generating chips on the entire circuit board.

Description

Technical Field

[0001] The present invention relates to the field of liquid cooling technology, and in particular to a liquid cooling device and electronic equipment. Background Art

[0002] With the development of science and technology, more and more electronic devices are using liquid cooling to solve their heat dissipation problems. For example, electronic devices used for large computing loads have a large number of heat-generating chips. These heat-generating chips generate a lot of heat during operation. If this heat is not transferred out in time, it will affect the performance and service life of each chip, and even cause the device to freeze or the system to crash. In the prior art, although some have adopted liquid cooling plates to dissipate heat from the heat-generating chips, and even added heat dissipating fins in the flow channel of the liquid cooling plate, such as the prior art CN115443053A, the temperature difference between the heat-generating chips in the width direction of the same flow channel is still relatively large, which still cannot meet the high requirements of large computing load electronic devices for temperature consistency of each heat-generating chip. Summary of the Invention

[0003] Based on the above situation, the main purpose of the present invention is to provide a liquid cooling device and electronic equipment, which can increase the flow rate and temperature uniformity of the medium in the width direction of the flow channel, thereby improving the consistency of the temperature of the heating chips at various locations and reducing the temperature of each heating chip on the entire circuit board.

[0004] To achieve the above object, the technical solution adopted by the present invention is as follows:

[0005] A first aspect of the present invention provides a liquid cooling device for an electronic device, the electronic device comprising a circuit board and the liquid cooling device, the liquid cooling device comprising a housing, the housing being provided with a medium inlet, a medium outlet and a medium flow channel, the medium flow channel being connected to the medium inlet and the medium outlet respectively, a plurality of heat dissipation fins being arranged at intervals in the medium flow channel along the width direction of the medium flow channel, the heat dissipation fins extending along the extension direction of the medium flow channel; the circuit board comprising a plurality of heat-generating chips, the plurality of heat-generating chips being arranged into a plurality of columns of chip groups arranged along the width direction, each of the chip groups comprising a plurality of heat-generating chips spaced apart along the extension direction, the circuit board being mounted on at least one outer surface of the housing facing away from the medium flow channel, and each of the heat-generating chips being in contact with an area corresponding to the medium flow channel;

[0006] A confluence region is formed in the medium flow channel between the medium outlet and the heat dissipation fins. A confluence structure is provided in the confluence region. The confluence structure includes a first confluence plate and a second confluence plate that are opposite to and spaced apart from each other in the width direction. The distance between the first confluence plate and the second confluence plate increases along the direction from the medium outlet to the heat dissipation fins.

[0007] The confluence structure and the heat dissipation fins are spaced apart in the extending direction, and the distance between each heat dissipation fin and the medium outlet increases from the middle to both sides in the width direction.

[0008] Optionally, ends of the heat dissipating fins located on the same side of the center plane of the medium flow channel are connected to form a connecting surface, and each connecting surface is parallel to at least a portion of the busbar on the same side.

[0009] Optionally, among the plurality of heat dissipating fins, a spacing area is formed between two adjacent heat dissipating fins located at the edge of the medium flow channel in the width direction; and one end of each of the first and second busbars close to the heat dissipating fins is respectively opposite to the spacing area on its side.

[0010] Optionally, ends of the first and second busbars close to the medium outlet are directly opposite to the inside of the medium outlet, and ends close to the heat dissipation fins are located outside both sides of the medium outlet.

[0011] Optionally, the first and second busbars each include a first plate segment and a second plate segment connected in a bent manner, the first plate segment being inclined relative to the extension direction and closer to the medium outlet; the second plate segment being parallel to the extension direction.

[0012] Optionally, a flow equalizing area is formed in the space between the medium inlet and the heat dissipating fins in the medium flow channel, and a flow equalizing structure is arranged in the flow equalizing area. The flow equalizing structure includes a first flow equalizing plate and a second flow equalizing plate arranged opposite to each other in the width direction, and the distance between the first flow equalizing plate and the second flow equalizing plate in the width direction increases along the direction from the medium inlet to the heat dissipating fins.

[0013] Optionally, one end of the heat dissipating fin close to the current balancing structure is flush with the other end, and a gap is left between the heat dissipating fin and the current balancing structure.

[0014] Optionally, the medium flow channel includes a plurality of sub-sections connected in series by bends, each of the sub-sections is provided with a plurality of heat dissipation groups along the extension direction, and each of the heat dissipation groups includes a plurality of heat dissipation fins spaced apart in the width direction;

[0015] In the sub-section where the current balancing structure is located, the first distance between the two heat dissipation groups close to the current balancing structure is larger than the second distance between the other two adjacent heat dissipation groups, and the length of the two heat dissipation groups closest to the current balancing structure is smaller than the length of the other heat dissipation groups.

[0016] Optionally, the medium flow channel includes a flow channel side wall and a flow channel end wall, the flow channel end wall includes a plane area and a slope area, the plane area is connected to the flow channel side wall via the slope area, and one end of the slope area connected to the flow channel side wall is inclined farther away from the plane area than the other end;

[0017] The medium inlet and the medium outlet are respectively arranged on the corresponding plane areas of the flow channel end wall.

[0018] Optionally, the medium flow channel includes a plurality of sub-sections connected in sequence, and the plurality of sub-sections are arranged side by side in the width direction;

[0019] The outer side surface of the shell corresponding to each sub-section is protrudingly provided with a heat-conducting strip, and the heat-conducting strip is used to fit with the heat-generating chip; the end of the confluence structure close to the heat dissipation fin extends into the area corresponding to the heat-conducting strip in the medium flow channel.

[0020] The second aspect of the present invention provides an electronic device comprising a circuit board and a liquid cooling device as described above, wherein the circuit board comprises a plurality of heat-generating chips, and the plurality of heat-generating chips are arranged into a plurality of columns of chip groups arranged along the width direction, and each of the chips groups comprises a plurality of the heat-generating chips spaced apart along the extension direction, and the circuit board is mounted on at least one outer surface of the shell that is away from the medium flow channel, and each of the heat-generating chips is in contact with an area corresponding to the medium flow channel.

[0021] Optionally, the medium flow channel includes a plurality of subsections arranged side by side along the width direction;

[0022] The areas where the sub-sections are set on the shell correspond to multiple rows of the chipsets, and the end of the confluence structure close to the medium outlet extends out of the area corresponding to the chipset in the medium flow channel, and the end close to the heat dissipation fin extends into the area corresponding to the chipset in the medium flow channel.

[0023] The liquid cooling device of the present invention provides a confluence structure between the medium outlet and the heat sink, and increases the distance between the two confluence plates of the confluence structure along the direction from the medium outlet to the heat sink, that is, decreases along the flow direction of the medium, and increases the distance between each heat sink and the medium outlet from the middle to both sides, that is, the change in the distance between the two confluence plates in the present invention is consistent with the size change from each heat sink to the medium outlet, so that each medium sub-flow divided by the heat sink can basically contact the confluence structure at the same time, avoiding a large difference in the flow rate reduction of each medium sub-flow due to the different spacing areas between the heat sink and the confluence structure, that is, the flow rate of each medium sub-flow can remain basically consistent when reaching the confluence structure, ensuring that the flow rate and temperature of the entire medium flow channel in the width direction are as consistent as possible, so that the heat dissipation effect of each heating chip in the width direction of the medium flow channel is as similar as possible, avoiding the problem that the temperature of the heating chip in the middle is higher than the temperature of the heating chips on both sides, improving the consistency of the temperature of each heating chip in the width direction, reducing the temperature of each heating chip, improving the performance of the entire circuit board, and extending its service life.

[0024] Other beneficial effects of the present invention will be explained through the introduction of specific technical features and technical solutions in the specific implementation methods. Those skilled in the art should be able to understand the beneficial technical effects brought about by the introduction of these technical features and technical solutions. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

[0026] Figure 1 A schematic structural diagram of a preferred embodiment of the liquid cooling device provided by the present invention from one perspective;

[0027] Figure 2 for Figure 1 A schematic structural diagram of the embodiment shown in another perspective;

[0028] Figure 3 An exploded view of a preferred embodiment of the liquid cooling device provided by the present invention;

[0029] Figure 4 A schematic structural diagram of a preferred embodiment of a base plate in the liquid cooling device provided by the present invention;

[0030] Figure 5 for Figure 4 A partial front view of a preferred embodiment of the bottom plate at the medium outlet;

[0031] Figure 6 for Figure 4 A partial front view of a preferred embodiment of the bottom plate at the medium inlet;

[0032] Figure 7 A schematic structural diagram of a preferred embodiment of the electronic device provided by the present invention;

[0033] Figure 8 An exploded view of a preferred embodiment of the electronic device provided by the present invention;

[0034] Figure 9 for Figure 8 A partial enlarged view of point I in the middle;

[0035] Figure 10 A partial cross-sectional view of a preferred embodiment of the electronic device provided by the present invention;

[0036] Figure 11 、 Figure 12 The diagram in half is a schematic diagram of the temperature detection of the heating chip at the medium inlet and the medium outlet in a preferred embodiment of the electronic device provided by the present invention.

[0037] In the picture:

[0038] 10. Liquid cooling device; 11. Housing; 111. Bottom plate; 1111. Separator strip; 1112. Housing wall; 1113. Positioning post; 112. Cover plate; 1121. Heat transfer strip; 1122. Positioning hole; 12. Medium outlet; 13. Medium inlet; 14. Medium flow channel; 141. Flow channel end wall; 1411. Plane area; 1412. Inclined area; 142. Flow channel side wall; 143. Flow channel bottom wall; 144 , sub-section; 145, connecting section; 15, heat dissipation fin; 151, first connecting surface; 152, second connecting surface; 153, first spacing area; 154, second spacing area; 155, heat dissipation group; 16, bus structure; 161, first bus plate; 1611, first plate section; 1612, second plate section; 162, second bus plate; 17, current balancing structure; 171, first current balancing plate; 172, second current balancing plate;

[0039] 20. Circuit board; 21. Base plate; 211. Second mounting hole; 22. Heat generating chip;

[0040] 30. Spring screw. DETAILED DESCRIPTION

[0041] The present invention is described below based on the following embodiments, but the present invention is not limited to these embodiments. In the following detailed description of the present invention, some specific details are described in detail. In order to avoid obscuring the essence of the present invention, well-known methods, processes, procedures, and components are not described in detail.

[0042] Furthermore, persons of ordinary skill in the art will appreciate that the figures provided herein are for illustration purposes only and are not necessarily drawn to scale.

[0043] Unless the context clearly requires otherwise, throughout the specification and claims, the words "include," "comprising," and similar words should be construed in an inclusive sense rather than an exclusive or exhaustive sense; that is, in the sense of "including but not limited to."

[0044] In the description of the present invention, it should be understood that the terms "first", "second", etc. are used for descriptive purposes only and should not be understood to indicate or imply relative importance. In addition, in the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0045] For the convenience of description, a rectangular coordinate system is established with the extension direction X, width direction Y, and depth direction Z of the medium flow channel in the liquid cooling device. It should be noted that the extension direction X and width direction Y of the medium flow channel described in this article refer to the extension direction of the medium flow channel at the described position. Figure 1 Only the extension direction X and width direction Y of sub-segment 144 are shown. The extension direction of the connecting segment is curved, and the width direction Y is the radial direction of the connecting segment 145. This coordinate system is provided for ease of description only and does not specifically limit the operating state of the liquid cooling device. During use or placement, the corresponding direction can be determined based on the state of the liquid cooling device.

[0046] The present invention provides a liquid cooling device 10 that can be used to dissipate heat from heat-generating components of electronic devices, such as heat-generating chips. Specifically, when used in electronic devices with large computing loads, it can dissipate heat from heat-generating components on their circuit boards. The electronic device includes a liquid cooling device 10 and a circuit board 20. The liquid cooling device 10 includes a housing 11, and a medium flow channel is provided in the housing 11. The circuit board includes a plurality of heat-generating chips 22, and the plurality of heat-generating chips 22 are arranged into a plurality of rows of chipsets arranged along the width direction of the medium flow channel. Each chipset includes a plurality of heat-generating chips 22 spaced apart along the extension direction of the medium flow channel. The circuit board is mounted on at least one outer surface of the housing 11 facing away from the medium flow channel, and each heat-generating chip is in contact with an area corresponding to the medium flow channel.

[0047] refer to Figures 1-6 The liquid cooling device 10 includes a housing 11, which is provided with a medium outlet 12, a medium inlet 13 and a medium flow channel 14. The medium flow channel 14 is connected to the medium outlet 12 and the medium inlet 13 respectively. A plurality of heat dissipation fins 15 are arranged at intervals along the width direction Y of the medium flow channel 14. That is, two, three or more heat dissipation fins are arranged in the width direction Y. Each heat dissipation fin 15 extends along the extension direction X of the medium flow channel 14, dividing the medium flow channel into a plurality of side-by-side sub-flow channels. When the medium flow flows through, a plurality of medium sub-flows are formed. That is, part of the medium flow flowing through the sub-flow channel forms a medium sub-flow.

[0048] Among them, the space between the medium outlet 12 and the heat dissipation fins 15 in the medium flow channel 14 forms a confluence area, that is, the medium flow channel 14 is in an area close to the medium outlet 12, and the medium outlet 12, the confluence area, and the heat dissipation fins 15 are arranged in sequence along the medium flow channel extension direction X. The heat dissipation fins 15 and the medium outlet 12 are not close to each other, but leave a space, which is the confluence area. A confluence structure 16 is provided in the confluence area, and the confluence structure 16 includes a first confluence plate 161 and a second confluence plate 162 that are opposite and spaced apart in the width direction Y. The distance between the first confluence plate 161 and the second confluence plate 162 in the width direction Y increases along the direction from the medium outlet 12 to the heat dissipation fins, that is, decreases along the medium flow direction, as shown in FIG. Figure 3-Figure 5 As shown, the first and second busbars 161, 162 are spaced apart at all points in the width direction Y, forming a trumpet-like structure. The opening of this trumpet-like structure is smaller at the first end of the busbar structure 16, near the medium outlet 12, than at the second end, near the heat sink 15. That is, at the first end, the distance between the first and second busbars 161, 162 is smaller, and they do not intersect on the side near the medium outlet 12, leaving this smaller distance. At the second end, the distance between the first and second busbars 161, 162 is larger. Furthermore, in the extension direction X, the busbar structure 16 is spaced apart from the heat sink 15. Neither the first nor the second busbar 161, 162 is directly adjacent to the heat sink 15. Projected in the width direction Y, the busbar structure 16 does not overlap with the projections of the multiple heat sinks 15 (referring to the multiple heat sinks 15 that are adjacent in the extension direction X), and a certain distance exists between the closest ends of the two projections. The distance between each heat sink 15 and the medium outlet 12 increases from the middle to both sides in the width direction Y. A distance is left between the confluence structure 16 and the heat sink 15. The ends of each heat sink 15 near the medium outlet 12 are not flush. The distances from each end near the medium outlet 12 to the second end of the confluence structure 16 (i.e., the end away from the medium outlet 12) are not equal. The distance is smallest for the heat sink located in the middle of the width direction Y, increases from the middle to both sides, and is largest at the two outermost heat sinks.

[0049] The liquid cooling device 10 of the present invention provides a confluence structure 16 between the medium outlet 12 and the heat dissipation fins 15, and increases the distance between the two confluence plates (i.e., the first confluence plate and the second confluence plate) of the confluence structure 16 along the direction from the medium outlet 12 to the heat dissipation fins 15. The distance between each heat dissipation fin 15 and the medium outlet 12 increases from the middle to both sides, so that the medium sub-flow flowing through the sub-flow channel formed by the heat dissipation fin 15 can still ensure that the flow velocity and temperature of the medium flow at various locations in the width direction Y of the medium flow channel 14 are as consistent as possible near the medium outlet 12 under the action of the confluence structure 16, so that the heat dissipation effect of each heat-generating chip located at the same location in the width direction Y in the medium flow channel 14 is as consistent as possible, thereby improving the temperature consistency of each heat-generating chip in the width direction Y. Figure 7-10 ) After installation, it can improve the performance of the entire circuit board and extend its service life.

[0050] In some embodiments, although a confluence structure 16 is also provided at the medium outlet 12, the heat dissipating fins 15 there are flush at one end close to the medium outlet 12. This structure causes the ends of the heat dissipating fins to have unequal distances from the confluence structure. When the medium sub-flows flow out from the sub-channels formed by the heat dissipating fins 15, the flow velocities of the medium sub-flows decrease significantly when they reach the confluence structure 16. As a result, after the liquid cooling device 10 and the circuit board 20 are installed, the heat-generating chips at the same position of the corresponding medium channel on the circuit board 20 in the width direction have a problem in which the middle temperature is significantly higher than the temperatures on both sides. In the present invention, the change in the distance between the two busbars is consistent with the change in the size of each heat dissipation fin 15 to the medium outlet 12, so that each medium sub-flow separated by the heat dissipation fin 15 can basically contact the confluence structure 16 at the same time, avoiding a large difference in the reduction of the flow rate of each medium sub-flow due to the different spacing areas between the heat dissipation fin 15 and the confluence structure 16, that is, the flow rate of each medium sub-flow can remain basically consistent when reaching the confluence structure 16. Therefore, the interaction between the confluence structure 16 and the heat dissipation fins close to the confluence structure can better improve the temperature consistency of each heat-generating chip in the width direction Y of the medium flow channel 14, especially when multiple rows of chip groups are arranged in the width direction at the same position of the medium flow channel 14. This effect is particularly prominent, and the junction temperature gain of the heat-generating chip at the medium outlet reaches 1°C~2°C, so that the temperature of each heat-generating chip is reduced as much as possible, and the overall temperature uniformity of the heat-generating chip on the entire circuit board can be improved by 40%. Furthermore, by setting the uneven end of the heat dissipation fin at the medium outlet, the junction temperature of the heat-generating chip at the medium outlet is further reduced by more than 0.9°C.

[0051] Continue to refer Figure 1-Figure 5As shown, the shell 11 includes a base plate 111 and a cover plate 112 that cover each other. The side of the base plate 111 facing the cover plate 112 (i.e., the side facing the cover plate 112) is recessed inward to form a recessed area. The cover plate 112 covers the open end of the recessed area. The recessed area and the corresponding part on the cover plate 112 together form a medium flow channel 14. The outermost edge wall of the medium flow channel 14 (i.e., the shell wall described below) is protruded relative to the recessed area. When the medium flow channel 14 includes a plurality of sub-segments formed side by side (described in detail below), a partition bar 1111 is formed between two adjacent sub-segments 144. The partition bar 1111 is also protruded relative to the recessed area, that is, the partition bar 1111 divides the medium flow channel 14 into a plurality of sub-segments. Specifically, the medium flow channel 14 includes an interconnected flow channel end wall 141 and flow channel side walls 142. The flow channel side walls 142 are parallel to the extension direction X, while the flow channel end wall 141 is perpendicular to the extension direction and connected to the flow channel side walls 142. It is understood that the medium flow channel 14 also includes a flow channel bottom wall 143 and a flow channel top wall (not shown). The flow channel top wall and the flow channel bottom wall 143 are arranged opposite each other in the vertical direction. The flow channel end wall 141 and the flow channel side walls 142 are connected to the flow channel bottom wall 143 along the edge of the flow channel bottom wall 143 and are also connected to the flow channel top wall along the edge of the flow channel top wall. The flow conduit structure 16 (including the first and second conduit plates 161 and 162) and the heat dissipation fins 15 can be connected to the flow channel bottom wall 143. They can be in contact with the flow channel top wall or have a gap between them. The heat dissipation fins 15 can also be directly disposed on the bottom wall 143 of the flow channel and aligned with the top wall of the flow channel, or with a gap between them. The top wall of the flow channel can be located on the cover plate 112, while the bottom wall 143 of the flow channel is located on the base plate 111, i.e., the bottom wall of the recessed area. The end wall 141 and the side wall 142 of the flow channel can be located entirely on the base plate 111, i.e., the side walls of the recessed area. Alternatively, they can be located partially on the base plate 111 and partially on the cover plate 112. In this embodiment, the side of the cover plate 112 facing the base plate 111 is also recessed inward, forming a recessed area. The cover plate 112 and the base plate 111 can be connected by welding (brazing). After welding, the cover plate and the bottom shell form an integral structure. At the same time, the solder fills the gap between the cover plate 112 and the base plate 111, ensuring that liquid does not leak, thereby enhancing the sealing between the cover plate 112 and the base plate 111 at various locations in the medium flow channel 14.

[0052] The flow channel end wall 141 may be a planar structure, smoothly connected to the flow channel side wall 142. In a preferred embodiment, Figure 5As shown, the flow channel end wall 141 includes a flat region 1411 and a sloped region 1412. The flat region 1411 is connected to the flow channel side wall 142 via the sloped region 1412. The sloped region 1412 is tilted at one end, where it connects to the flow channel side wall 142, away from the flat region 1411. In other words, the middle portion of the flow channel end wall 141 in the width direction Y of the medium flow channel 14 is the flat region 1411, while the edge portion is the sloped region 1412. In this embodiment, the medium outlet 12 and the medium inlet 13 are respectively disposed on the flat region 1411 of the corresponding flow channel end wall 141. The addition of the sloped region 1412 can provide a certain flow guidance effect on the medium flow, further enhancing the convergence effect of the medium flow at the medium outlet 12 and improving the flow uniformity of the medium flow at the medium inlet 13.

[0053] The medium flow channel 14 may include multiple sub-segments 144. Each sub-segment may be arranged side by side in the width direction Y and connected sequentially, that is, the sub-segments 144 are connected in series, with the outlet of one sub-segment corresponding to the inlet of another adjacent sub-segment. The ends of the first and last sub-segments 144 form the flow channel end wall 141. The multiple sub-segments 144 may also be connected at both ends, that is, connected in parallel, with the inlet of each sub-segment located on the same side, connected to the medium inlet 13, and the outlet of each sub-segment located on the same side, connected to the medium outlet 12. The former is preferred, that is, the sub-segments 144 are connected in series. This ensures consistent flow rates within each sub-segment 144 and improves the consistency of heat dissipation performance at all locations. The multiple sub-segments 144 may be arranged in parallel. In this embodiment, each sub-segment 144 may correspond to multiple rows of chipsets (described in detail below), thereby simultaneously dissipating heat for multiple rows of chipsets.

[0054] A gap is left between the medium outlet 12 and the first end of the confluence structure 16 near the medium outlet 12, forming a buffer zone. Specifically, the confluence structure 16 does not contact the flow channel end wall 141 of the medium flow channel 14. After the medium flows out of the confluence structure 16, it first passes through the buffer zone before reaching the medium outlet 12. This minimizes the impact force between the medium flow and the confluence structure 16, which could cause turbulence and affect the heat dissipation effect, especially at high flow rates. Similarly, the gap between the second end of the confluence structure 16, farther from the medium outlet 12, and the heat dissipation fins 15 also minimizes turbulence that could affect the heat dissipation effect.

[0055] The first and second manifolds 161 and 162 are located on either side of the center plane of the medium flow channel 14, symmetrically arranged about the center plane, forming a trumpet-like structure. The center plane of the medium flow channel 14 is a plane parallel to the extension direction X at its location and passing through the centerline of the width direction Y of the medium flow channel 14.

[0056] In one embodiment, the first and second busbars 161 and 162 each include a first plate segment 1611 and a second plate segment 1612 that are bent and connected. The first plate segment 1611 is tilted relative to the extension direction X, that is, the end of the first plate segment 1611 close to the medium outlet 12 is closer to the center plane of the medium flow channel 14 than the other end, and the first plate segment 1611 is closer to the medium outlet 12 than the second plate segment 1612. The distance between the two first plate segments 1611 gradually increases along the extension direction X, so that the two first plate segments 1611 are formed with a smaller opening at one end close to the medium outlet 12 and a larger opening at the end away from the medium outlet 12. The structure is large, the two second plate segments 1612 are located at a position with a larger opening, and the distance between the two second plate segments 1612 remains unchanged in the extension direction X, that is, the two second plate segments 1612 are arranged in parallel. Furthermore, the two second plate segments 1612 are parallel to the extension direction X. In this way, the medium sub-flow flowing through the heat dissipation fins 15 can first pass through the second plate segment 1612 to guide the medium flow more smoothly to the confluence structure 16, and then pass through the two first plate segments 1611 to further increase the confluence effect, thereby reducing the resistance to the medium flow as much as possible, avoiding turbulence as much as possible, and further improving the consistency of the temperature of each heat-generating chip in the width direction Y. Preferably, the first plate segment 1611 and the second plate segment 1612 have a smooth transition. In one embodiment, the length of the first plate segment 1611 is greater than that of the second plate segment 1612, so as to play a role in converging the medium flow with a sufficient path and achieve a better flow equalization effect. Of course, the first convergence plate 161 and the second convergence plate 162 can also only include the first plate segment 1611.

[0057] Regardless of which of the above-mentioned embodiments is adopted for the first and second busbars 161, 162, the first and second busbar segments 1611, 1612 can each be a flat plate or a curved plate. In embodiments where the first and second busbars 161, 162 include only the first busbar segment 1611, if the first busbar segment 1611 is a flat plate, each busbar is a flat plate as a whole; if the first busbar segment 1611 is a curved plate, each busbar is a curved plate as a whole. The second busbar segment 1612 is a flat plate. In embodiments where both the first and second busbars 161, 162 include the second busbar segment 1612, if the first busbar segment 1611 is a flat plate, each busbar is a plate-like structure formed by bending two flat plates; if the first busbar segment 1611 is a curved plate, each busbar is a plate-like structure combining a curved plate and a flat plate. In the embodiment where the first plate segment 1611 is a curved plate, the two curved plates of the first and second busbars 161 and 162 preferably protrude in directions away from each other, thereby reducing resistance to medium flow and improving heat dissipation.

[0058] When the first plate segment 1611 is a flat plate, the angle between the two flat plates is 45° to 75°, such as angle A of 45°, 50°, 55°, 60°, 65°, 70°, or 75°. Preferably, angle A is 60°. This ensures that the converging structure 16 can smoothly guide the various medium sub-flows to the converging structure 16 while minimizing collisions with the flow channel end wall 141, thereby avoiding turbulence caused by flow channel changes at the converging structure 16. When the flow balancing structure 17 (described in detail below) is configured at this angle, the medium flow will not be excessively dispersed during diversion, and bubbles may be generated due to excessive impact between some medium flows and the flow channel sidewalls 142. This allows the medium flow to be better diverted and enter the sub-flow channels formed by the heat dissipating fins 15. This further reduces resistance to the medium flow rate and improves the heat dissipation effect of the entire liquid cooling device.

[0059] In one embodiment, the first and second convergence plates 161, 162 each include a first plate segment 1611 and a second plate segment 1612. The first plate segment 1611 is a planar plate, that is, the first plate segment 1611 is tilted relative to the extension direction X, and the end thereof near the medium outlet 12 is closer to the center plane of the medium flow channel 14 than the other end. This convergence structure 16 allows the medium flow to achieve a better convergence effect when it first contacts the convergence structure 16, while further reducing resistance to the flow of the medium. This improves the consistency of heat dissipation for each heat-generating chip by increasing the flow rate and converging the effect.

[0060] Among them, the first convergence plate 161 and the second convergence plate 162 are each provided with a rounded corner on the end face close to the medium outlet 12, and the end face of each of the first convergence plate 161 and the second convergence plate 162 is smoothly transitioned to the two opposite side faces, that is, the end face of the first convergence plate 161 and its two guide surfaces are smoothly transitioned, and the end face of the second convergence plate 162 and its two guide surfaces are smoothly transitioned, so that the resistance to the flow of the medium can be further reduced.

[0061] In each of the above embodiments, the ends of the first and second busbars 161 and 162 near the medium outlet 12 face the interior of the medium outlet 12, and their ends near the heat dissipation fins 15 are located outside of the medium outlet 12 on both sides. That is, projected along the extension direction X, in the width direction Y, the projection of the first end of the busbar structure 16 near the medium outlet 12 is at least partially located within the projection of the medium outlet 12, while the projection of the second end near the heat dissipation fins 15 is entirely located outside the projection of the medium outlet 12. That is, the projections of the ends of the first and second busbars 161 and 162 near the medium outlet 12 are at least partially located within the projection of the medium outlet 12, while the projections of the ends of the first and second busbars 161 and 162 away from the medium outlet 12 are at least located outside the projection of the medium outlet 12. For example, when the medium outlet 12 is a circular opening, the projection of the first end of the busbar structure 16 near the medium outlet 12 is partially located within the projection of the medium outlet 12. For another example, when the medium outlet is a square opening, the projection of the first end of the busbar structure 16 near the medium outlet 12 may be entirely located within the projection of the medium outlet 12. In this way, the resistance to the flow of the medium can be reduced, so that the medium can flow more smoothly between the first convergence plate 161 and the second convergence plate 162, between the first convergence plate 161 and the flow channel side wall 142 on its side, and between the second convergence plate 162 and the flow channel side wall 142 on its side at the second end of the convergence structure 16. At the first end of the convergence structure 16, the medium flow can be well guided to enter the medium outlet 12, so that the medium between the edge heat dissipation fins 15 and the flow channel side wall 142 will not be insufficient due to the large distance between the edge heat dissipation fins 15 and the medium outlet 12, thereby affecting the heat dissipation effect at the edge of the edge medium flow channel 14.

[0062] Furthermore, on the side of the confluence structure 16 close to the medium outlet, the distance between the first confluence plate 161 and the second confluence plate 162 is 1 / 3 to 1 / 2 of the maximum width of the medium outlet 12, that is, the minimum distance between the first confluence plate 161 and the second confluence plate 162 is 1 / 3 to 1 / 2 of the maximum width of the medium outlet 12, such as 0.33 times, 0.34 times, 0.36 times, 0.38 times, 0.4 times, 0.43 times, 0.45 times, 0.48 times, or 0.5 times the maximum width of the medium outlet 12, to further improve the confluence effect of the confluence structure 16. The width of the medium outlet 12 refers to its dimension in the width direction Y of the medium flow channel. For example, if the medium outlet 12 is a circular hole, its maximum width is the diameter of the circular hole.

[0063] Continue to refer Figure 4 and Figure 5The ends of the multiple heat dissipation fins 15 near the medium outlet 12 can be arranged regularly or irregularly. In a regular arrangement, the ends of the heat dissipation fins 15 located on the same side of the center plane of the medium flow channel 14 can be connected to form a plane or a curved surface, that is, the connection surface formed by the connection of the ends is a plane or a curved surface; in an irregular arrangement, the connection surface formed by the ends of the heat dissipation fins 15 located on the same side of the center plane of the medium flow channel 14 is a bent surface, that is, a bent surface is formed after the ends are connected, and a bent surface refers to a non-smooth curved surface or a non-planar surface.

[0064] In a preferred embodiment, the ends of the heat dissipating fins 15 located on the same side of the center plane of the medium flow channel 14 and close to the medium outlet 12 are connected to form a connecting surface (such as a first connecting surface 151 and a second connecting surface 152), and each connecting surface is parallel to at least a portion of the busbar on the same side thereof. The connecting surface formed by connecting the ends of the heat dissipating fins 15 located on the same side of the center plane as the first busbar 161 is recorded as the first connecting surface 151, and the connecting surface formed by connecting the ends of the heat dissipating fins 15 located on the same side of the center plane as the second busbar 162 is recorded as the second connecting surface 152. Then, the first connecting surface 151 is parallel to at least a portion of the first busbar 161, and the second connecting surface 152 is parallel to at least a portion of the second busbar 162. For example, if the first busbar 161 and the second busbar 162 only include the first plate segment 1 In the embodiment of 611, the first connecting surface 151 and the second connecting surface 152 are parallel to the entire first busbar 161 and the entire second busbar 162 respectively. In the embodiment in which the first busbar 161 and the second busbar 162 simultaneously include the first plate segment 1611 and the second plate segment 1612, the first connecting surface 151 and the second connecting surface 152 are parallel to the first plate segment 1611 of the first busbar 161 and the second plate segment 1612 of the second busbar 162 respectively. In this way, the medium sub-flows flowing out of each sub-channel formed by the heat dissipation fins 15 can reach the busbar structure 16 by basically flowing the same distance, that is, they basically reach the busbar structure 16 at the same time, thereby further improving the flow balancing effect of the entire medium flow in the width direction Y, and increasing the heat dissipation consistency of the liquid cooling device in the width direction Y of the medium flow channel 14.

[0065] Multiple heat dissipation fins 15 extend toward the medium outlet 12, and some of them can intersect with the first busbar 161 or the second busbar 162. When projected along the extension direction X, the projections of these heat dissipation fins 15 are located within the projections of the first busbar 161 or the second busbar 162, that is, they have overlapping areas with the projections of the first busbar 161 or the second busbar 162. It is also possible that some heat dissipation fins 15 will neither intersect with the first busbar 161 nor the second busbar 162 after extension. When projected along the extension direction X, the projections of these heat dissipation fins 15 have no overlapping areas with the projections of the first busbar 161 and the second busbar 162. For example, some heat dissipation fins 15 may pass through the small end openings of the first busbar 161 and the second busbar 162 near the medium outlet 12, and some heat dissipation fins 15 may pass directly from the outside of the first busbar 161 and the second busbar 162.

[0066] The ends of the multiple heat sinks 15 near the medium outlet 12 are not flush, and their distances from the second end of the confluence structure 16 are unequal. However, for those heat sinks 15 that can intersect with the first confluence plate 161 or the second confluence plate 162 by extension, the extension dimensions to the corresponding intersection are substantially the same, that is, the difference between the extension dimensions is minimal. In other words, after these heat sinks 15 extend toward the medium outlet 12 by the corresponding extension dimensions, they intersect with the first confluence plate 161 or the second confluence plate 162. This further increases the consistency of the flow velocity of each medium sub-flow flowing out of the heat sink 15 and reaching the confluence structure 16, thereby further improving the flow uniformity of the entire medium flow in the width direction Y.

[0067] Among the multiple heat dissipating fins 15, a spacer (such as the first spacer 153 and the second spacer 154) is formed between two adjacent heat dissipating fins 15 at the edge of the medium flow channel 14 in the width direction Y; the first and second busbars 161 and 162 are each located at one end close to the heat dissipating fin 15 and opposite to the spacer on the side thereof. Figure 5As shown, a first busbar 161 is disposed on one side of the center plane of the medium flow channel 14, located between two adjacent heat fins 15 at their edges, forming a first spacer 153. A second busbar 162 is disposed on one side of the center plane of the medium flow channel 14, located between two adjacent heat fins 15 at their edges, forming a second spacer 154. The end of the first busbar 161 proximal to the heat fin 15 faces the first spacer 153, while the end of the second busbar 162 proximal to the heat fin 15 faces the second spacer 154. Projected along the extension direction X, the end of the first busbar 161 proximal to the heat fin 15 lies within the projection of the first spacer 153, while the end of the second busbar 162 proximal to the heat fin 15 lies within the projection of the second spacer 154. This arrangement of the busbars and heat fins 15 allows the medium flow to be better converged to the medium outlet 12, further improving heat dissipation consistency in the width direction Y.

[0068] refer to Figure 3 、 Figure 4 、 Figure 6 , the space between the medium inlet 13 and the heat dissipation fins 15 in the medium flow channel 14 forms a flow-equalizing region, and a flow-equalizing structure 17 is provided in the flow-equalizing region. The flow-equalizing structure 17 includes a first flow-equalizing plate 171 and a second flow-equalizing plate 172 arranged opposite to each other in the width direction Y. The distance between the first flow-equalizing plate 171 and the second flow-equalizing plate 172 in the width direction Y increases along the extending direction from the medium inlet 13 to the heat dissipation fins 15. That is, at the medium inlet 13, the heat dissipation fins 15 and the medium inlet 13 are not close to each other, but a space is left. This space is the flow-equalizing region, that is, along the extending direction X of the medium flow channel 14, in the region near the medium inlet 13, the medium inlet 13, the flow-equalizing region, and the heat dissipation fins 15 are arranged in sequence, and the flow-equalizing structure 17 is provided in the flow-equalizing region, as shown in FIG. Figure 6 As shown, the first flow equalizing plate 171 and the second flow equalizing plate 172 of the flow equalizing structure 17 are spaced apart at all locations in the width direction Y, and the two form a trumpet-like structure. The opening of the flow equalizing structure 17 is smaller at the first end near the medium inlet 13 than the second end near the heat dissipating fins 15. In this way, when the medium flow enters the medium flow channel 14, it first flows through the flow equalizing structure 17 for diversion, and then further flows through the heat dissipating fins 15 to further divert the medium flow. As a result, the flow velocity and temperature of the medium flow at all locations in the width direction Y of the medium flow channel can be basically consistent from the medium inlet 13, thereby ensuring that the flow velocity and temperature at all locations in the width direction are as equal as possible, making the medium flow smoother and better ensuring that the heat dissipation performance at all locations in the width direction Y in the medium flow channel 14 is basically consistent.

[0069] The flow-sharing structure 17 can specifically adopt the structure of any of the above-mentioned embodiments of the flow-sharing structure 16, except that the flow-sharing structure 16 and the flow-sharing structure 17 have exactly opposite shapes along the flow direction of the medium, that is, the first end of the flow-sharing structure 16 close to the medium outlet 12 serves as the end of the flow-sharing structure 17 close to the medium inlet 13 (i.e., the first end of the flow-sharing structure), and the second end of the flow-sharing structure 16 close to the heat sink 15 serves as the end of the flow-sharing structure 17 close to the heat sink 15 (i.e., the second end of the flow-sharing structure). Naturally, the structure of the first flow-sharing plate 171 and the second flow-sharing plate 172 in the flow-sharing structure 17 can also adopt the structure of the first flow-sharing plate 161 and the second flow-sharing plate 162 in any of the above-mentioned embodiments of the flow-sharing structure 16. Therefore, the specific structure of the flow-sharing structure 17 itself will not be repeated here.

[0070] On the side close to the medium inlet 13, there is a gap between the medium inlet 13 and the flow balancing structure 17, that is, the flow balancing structure 17 does not contact the flow channel end wall 141 of the medium flow channel 14, and there is a gap between the flow balancing structure 17 and the heat dissipation fins 15. These two gaps form a buffer zone. When the medium flow enters the medium flow channel 14 from the medium inlet 13, it first passes through the buffer zone next to the medium inlet 13, and then enters the flow balancing structure 17. After the flow balancing of the flow balancing structure 17, it first passes through the buffer zone next to the heat dissipation fins 15, and then flows through each heat dissipation fin 15. In this way, the turbulence problem caused by the change of the flow channel structure of the medium flow can be avoided as much as possible, so that the medium flow can smoothly enter the flow balancing structure 17, thereby improving the speed of the entire medium flow and improving the heat dissipation performance of the entire liquid cooling device.

[0071] In the extension direction X, the plurality of heat dissipating fins 15 can form a heat dissipating group 155, or can be spaced apart to form a plurality of heat dissipating groups 155, each heat dissipating group 155 including a plurality of heat dissipating fins 15 spaced apart along the width direction Y. In the embodiment in which only one heat dissipating group 155 is formed, each heat dissipating fin 15 in the heat dissipating group extends from a position close to the converging structure 16 to a position close to the flow balancing structure 17, and is basically arranged along the entire medium flow channel 14. In the embodiment in which multiple heat dissipating groups 155 are formed, as shown in FIG. Figure 5 、 Figure 6As shown, each dotted box represents a heat sink group 155. Multiple heat sink groups 155 are spaced apart along the extension direction X. Each heat sink group 155 includes multiple heat sink fins 15 spaced apart along the width direction Y. Each heat sink fin 15 in each heat sink group is arranged only along a portion of the medium flow channel 14. When the medium flow channel 14 includes multiple sub-sections 144 connected by bends, multiple heat sink groups 155 can also be provided in each sub-section 144. These multiple heat sink groups 155 spaced apart can reduce the likelihood of turbulence in the medium flow, thereby preventing bubbles caused by turbulence from affecting the heat transfer performance of the medium flow, thereby improving the heat dissipation performance of the entire liquid cooling device. Furthermore, in each sub-section, the lengths of the heat sink groups 155 can be equal or unequal, and the distance between any two adjacent heat sink groups can be equal or unequal.

[0072] In an embodiment in which a plurality of sub-sections 144 are provided, the plurality of sub-sections 144 can be arranged in parallel, and the medium flow channel 14 also includes a connecting section 145 connecting two adjacent sub-sections 144. In an embodiment in which a group of heat dissipation groups is provided, each heat dissipation fin 15 is still extended and connected at the connecting section 145; in an embodiment in which a plurality of heat dissipation groups are provided, a heat dissipation group 155 can also be provided at the connecting section 145. For example, if only one, two or more groups are provided, the number and length of the heat dissipation fins 15 of the heat dissipation group 155 located at the connecting section 145 and the heat dissipation group 155 located on the sub-section 144 may not be equal. Of course, the heat dissipation group 155 may also not be provided at the connecting section 145.

[0073] It should be noted that when multiple heat dissipation groups are provided, the heat dissipation fins 15 on the side of the medium outlet 12 described above and below specifically refer to the heat dissipation fins 15 in the heat dissipation group closest to the medium outlet 12. For example, the distance between the heat dissipation fins 15 and the medium outlet 12 specifically refers to the distance between the heat dissipation fins 15 in the heat dissipation group closest to the medium outlet 12 and the medium outlet 12. Similarly, the heat dissipation fins 15 on the side of the medium inlet 13 specifically refer to the heat dissipation fins 15 in the heat dissipation group closest to the medium inlet 13. For example, the distance between the heat dissipation fins 15 and the medium inlet 13 specifically refers to the distance between the heat dissipation fins 15 in the heat dissipation group closest to the medium inlet 13 and the medium inlet 13.

[0074] Among them, the ends of the multiple heat sinks 15 close to the flow balancing structure 17 are flush, that is, the structures of the ends of the multiple heat sinks 15 close to the flow balancing structure 17 are different from those close to the medium outlet 12 or the confluence structure 16. Regardless of whether only one heat sink group 155 is provided or multiple heat sink groups 155 are provided, on the side close to the flow balancing structure 17, the distances from each heat sink 15 to the medium inlet 13 are equal, so that the medium flowing through the flow balancing structure 17 can be better diverted at the heat sink 15, thereby better improving the flow balancing effect.

[0075] In an embodiment in which the medium flow channel 14 includes a plurality of sub-sections 144 connected in a series of bends, and each sub-section 144 is provided with a plurality of heat dissipation groups 155 along the extension direction X, in the sub-section 144 where the flow balancing structure 17 is located, the first distance d1 between the two heat dissipation groups 155 close to the flow balancing structure 17 is greater than the second distance d2 between the other two adjacent heat dissipation groups 155, and the lengths of the two heat dissipation groups 155 closest to the flow balancing structure 17 are less than the lengths of the other heat dissipation groups 155. In this way, the turbulence of the medium flow near the heat dissipation fins 15 near the medium inlet 13 can be reduced, and by setting the first distance d1 and the second distance d2, and reducing the length of the heat dissipation group 155 at this location, the flow balancing effect can be further enhanced, thereby increasing the flow rate of the entire medium flow.

[0076] Furthermore, in the subsection 144 where the current balancing structure 17 is located, the first length of the heat dissipation group 155 closest to the current balancing structure 17 is less than the second length of the heat dissipation group 155 second closest to the current balancing structure 17, and the second length is less than or equal to the third length of the other heat dissipation groups 155. The heat dissipation group 155 closest to the current balancing structure 17 can be referred to as the first heat dissipation group, the heat dissipation group 155 second closest to the current balancing structure 17 is referred to as the second heat dissipation group, and the other heat dissipation groups located in the subsection 144 where the current balancing structure 17 is located are referred to as the third heat dissipation group. Then, the length of the first heat dissipation group is the first length, the length of the second heat dissipation group is the second length, and the length of the third heat dissipation group is the third length. The first length is less than the second length, and the second length is less than or equal to the third length. That is, the lengths of the first heat dissipation group, the second heat dissipation group, and the third heat dissipation group increase in sequence. The above-mentioned lengths refer to the dimensions in the extension direction X.

[0077] In the embodiment where each sub-section 144 is provided with multiple heat dissipation groups, in the sub-sections 144 other than the sub-sections 144 where the current equalizing structure 17 and the converging structure 16 are located, the lengths of the heat dissipation groups 155 may be equal or unequal.

[0078] The present invention adopts the above-mentioned arrangement, from the perspective of the arrangement of the entire medium flow channel 14, by arranging the converging structure 16 and the adjacent heat dissipation fins at the medium outlet 12, and arranging the flow balancing structure 17 and the heat dissipation fins at the medium inlet 13, it is possible to better improve the flow velocity of the entire medium flow and increase the flow balancing effect of the medium flow in the width direction Y, such as Figure 11 、 12 As shown, Figure 11 and Figure 12The temperature detection conditions of the heat-generating chip at the medium inlet 13 and the medium outlet 12 are respectively shown, wherein the temperature detection conditions of the first embodiment, the second embodiment and the third embodiment are respectively shown from left to right in each figure. In the first embodiment, only heat dissipation fins 15 are arranged in the medium flow channel, and the ends of the heat dissipation fins close to the medium inlet 13 and the medium outlet 12 are aligned; the second embodiment is based on the first embodiment and a flow equalization structure and a confluence structure are simultaneously arranged in the medium flow channel; the third embodiment is based on the second embodiment and the heat dissipation fins at the medium outlet are arranged according to the structure of this application. As can be seen from the figure, by setting the confluence structure 16 and the flow equalization structure 17, the junction temperature of the heating chip 22 located near the medium outlet 12 and the medium inlet 13 in the width direction of the medium flow channel can be increased by 1~2°C compared to the liquid cooling device with only heat dissipation fins, thereby improving the heat dissipation capacity, and improving the flow uniformity of each sub-channel. The temperature uniformity performance of the heating chip 22 of the entire circuit board is improved by 40%. Further, through the arrangement of the heat dissipation fins 15 at the medium outlet 12, the junction temperature of the heating chip 22 at the medium outlet 12 can be further increased by 0.9°C in the width direction of the medium flow channel. Therefore, the present application can improve the consistency of the heat dissipation effect of the entire liquid cooling device in the width direction of the medium flow channel. When the liquid cooling device 10 and the circuit board 20 are assembled together, the temperature consistency of the corresponding heating chip in the width direction of the medium flow channel 14 is better guaranteed, the temperature difference between the heating chips on the circuit board is reduced, and the heat dissipation capacity can be improved, thereby improving the performance of the entire circuit board and extending its life.

[0079] Continue to refer Figure 1-Figure 3 A heat-conducting strip 1121 is protrudingly provided on the outer side surface of each sub-section 144 of the housing 11, and the heat-conducting strip 1121 extends along the extension direction X. The end of the converging structure 16 near the heat dissipating fin 15 extends into the area corresponding to the heat-conducting strip 1121 in the medium flow channel 14. The end of the converging structure 16 near the medium outlet 12 is located on the side of the heat-conducting strip 1121 near the medium outlet 12. When projected in the depth direction Z, the projection of the heat-conducting strip 1121 and the projection of the converging structure 16 have an overlapping area. In this way, the medium flow can basically be opposite to the heat-conducting strip 1121 at a position where the temperature is more uniform. Therefore, when the liquid cooling device 10 and the circuit board 20 are installed together, the heat-conducting strip 1121 is bonded to the heat-generating chip, which can be bonded directly or through a heat-conducting material (such as thermal grease, thermal gel, or thermal pad). Therefore, the temperature consistency of the heat-generating chip on the circuit board 20 can be improved.

[0080] The heat conducting strip 1121 may be provided on only one outer side surface of the housing 11, or on both outer sides of the housing 11, to increase the heat dissipation area of ​​the liquid cooling device 10 and improve the overall heat dissipation efficiency. In embodiments where the housing 11 includes a base plate 111 and a cover plate 112, the heat conducting strip 1121 may be provided on the outer surface of the base plate 111 away from the cover plate 112, or on the outer surface of the cover plate 112 away from the base plate 111, or on both outer surfaces.

[0081] The present invention also provides an electronic device, such as Figure 7-10 As shown, the electronic device is used to process data, information, etc., and can be an electronic device with a large amount of computing power, such as a supercomputer server, or other data information processing equipment. The electronic device includes a circuit board 20 and a liquid cooling device 10. The circuit board 20 includes a plurality of heat-generating chips 22. The liquid cooling device 10 can be the liquid cooling device 10 described in any of the above embodiments. The circuit board 20 is installed on at least one outer surface of the housing 11 that is away from the medium flow channel 14. For example, the circuit board 20 is installed only on the side of the cover plate 112 away from the bottom plate 111, or the circuit board 20 is installed only on the side of the bottom plate 111 away from the cover plate 112. The circuit boards 20 can also be installed on both surfaces at the same time, that is, two circuit boards 20 are installed, such as Figure 7 As shown, the two circuit boards 20 and the liquid cooling device 10 form a sandwich structure. In this way, the liquid cooling device 10 can dissipate heat for the circuit board 20, thereby making the temperature of each heating chip 22 on the circuit board 20 as consistent as possible, thereby improving the working performance of the entire circuit board 20.

[0082] Furthermore, each heating chip 22 is bonded to the shell 11 (including direct bonding and indirect bonding), and corresponds to the area where the medium flow channel 14 is set on the shell 11, that is, the medium flow channel 14 and the heating chip 22 are respectively located on both sides of the shell in the depth direction Z of the medium flow channel 14 of the shell 11. In this way, the thermal conductivity of the medium flow to the heating chip 22 can be further increased.

[0083] The circuit board 20 also includes a substrate 21, and the heating chips 22 are arranged on the same surface of the substrate 21. The multiple heating chips 22 are arranged into multiple columns of chip groups along the width direction Y. Each chip group includes multiple heating chips 22 spaced apart along the extension direction X. Each column of chip groups is bonded to the area of ​​the housing 11 where the medium flow channel 14 is provided. When the medium flow channel 14 is provided with multiple sub-sections 144, the areas of the housing 11 where the sub-sections 144 are provided correspond to the multiple columns of chip groups. At this time, each chip group can be bonded to the area of ​​the housing 11 where the sub-sections 144 are provided. One sub-section 144 corresponds to multiple columns of chip groups at the same time. In this way, each sub-section 144 can simultaneously conduct heat to the multiple columns of chip groups, thereby improving the heat dissipation efficiency while also ensuring that the temperatures of the chip groups corresponding to the same sub-section 144 in the width direction are kept as consistent as possible.

[0084] It can be understood that the circuit board 20 also includes a power supply interface 23 and a signal interface 24. Multiple computing power chips 22 are arranged on the same surface of the substrate 32 and are attached to the liquid cooling device 10; the power supply interface 23 and the signal interface 24 are arranged at the same edge of the substrate 21 and are both electrically connected to the computing power chip 22 for supplying power to the computing power chip 22 and transmitting signals.

[0085] Each chipset is spaced apart from the media outlet 12 and the media inlet 13. Furthermore, the end of the converging structure 16 (i.e., the first end) near the media outlet 12 extends beyond the area within the media channel 14 corresponding to the chipset, while the end of the converging structure 16 (i.e., the second end) near the heat sink 15 extends into the area within the media channel 14 corresponding to the chipset. That is, projected along the thickness of the housing 11, i.e., the depth direction Z of the media channel 14, the projection of the converging structure 16 overlaps with the projection of the chipset. The projection of the first end of the converging structure 16 lies outside the projection of the chipset, specifically, outside the chipset near the media outlet 12. This structure avoids uneven heat conduction to the heat generating chip 22 caused by uneven flow in the width direction Y at the media outlet 12. The heat generating chip 22 is then gradually brought into direct contact with the heat generating chip 22 once the media flow has filled the entire width direction Y of the media channel 14. This further improves the temperature consistency of each heat generating chip 22 within the same sub-segment 144 along the width direction.

[0086] When both the first busbar 161 and the second busbar 162 include the second plate segment 1612, preferably, each chip group only extends into the portion of the first plate segment 1611 adjacent to the second plate segment 1612. Preferably, the portion of the chip group extending into the busbar structure 16 is opposite to the second plate segment 1612. This arrangement can further improve the temperature uniformity of each heat-generating chip 22 at the medium outlet 12.

[0087] At the medium inlet 13, the end of the flow balancing structure 17 near the medium inlet 13 extends out of the area corresponding to the chipset in the medium flow channel 14, and the end of the flow balancing structure 17 near the heat sink 15 extends into the area corresponding to the chipset in the medium flow channel 14. That is, along the depth direction Z of the medium flow channel 14, the projection of the flow balancing structure 17 and the projection of the chipset have an overlapping area, and the projection of the end of the flow balancing structure 17 near the medium inlet 13 is located outside the projection of the chipset, specifically, located on the outside of the chipset near the medium inlet 13. This structure can avoid inconsistent heat conduction to the heat-generating chip 22 caused by unevenness in the width direction Y at the medium inlet 13, and directly mates with the heat-generating chip 22 at the position in the width direction Y where the medium flow can fill the entire medium flow channel 14. Therefore, the temperature consistency of each heat-generating chip 22 in the width direction of the same sub-section 144 can be further improved.

[0088] Furthermore, when both the first current balancing plate 171 and the second current balancing plate 172 include the second plate segment 1612, each chip group at most extends into the portion of the first plate segment 1611 adjacent to the second plate segment 1612. Preferably, the portion of the chip group extending into the current balancing structure 17 is opposite to the second plate segment 1612. This arrangement can further improve the temperature uniformity of each heat-generating chip 22 at the medium inlet 13.

[0089] In the embodiment where the housing 11 is provided with a thermally conductive strip 1121, multiple rows of chipsets are correspondingly bonded to the multiple thermally conductive strips 1121, that is, each heating chip 22 is bonded to the housing 11 via the thermally conductive strip 1121. Of course, a thermally conductive material, such as thermal grease, thermally conductive gel, or thermally conductive pad, can also be provided between the heating chip 22 and the thermally conductive strip 1121 to further improve the thermal conductivity and thermal conductivity performance of the liquid cooling device 10 to the circuit board. Specifically, on the side near the medium outlet 12, the thermally conductive strip 1121 can be flush with the end face of the chipset, or the thermally conductive strip 1121 can extend beyond the chipset, that is, the thermally conductive strip 1121 is closer to the medium outlet 12 than the chipset.

[0090] The circuit board 20 and the liquid cooling device 10 can be locked by screws, and the two can also be positioned by a positioning structure. In the embodiment where the circuit board 20 is installed on the side of the cover plate 112 away from the bottom plate 111, preferably, the circuit board 20, the cover plate 112 and the bottom plate 111 are locked by spring screws 30. While the cover plate 112 and the bottom plate 111 are connected by welding, they can also be further connected by spring screws 30. The spring screw 30 includes a spring, a screw head and a screw rod that are connected to each other, and the spring is sleeved outside the screw rod. Specifically, as Figure 3 、 Figure 4 and Figures 8-10As shown, the separator bar 1111 and the two shell walls 1112 in the width direction of the housing 11 are respectively provided with multiple positioning posts 1113 along the extension direction X, and each positioning post 1113 is provided with a first mounting hole. The cover plate 112 is provided with positioning holes 1122 corresponding to the positioning posts 1113. The substrate 21 of the circuit board 20 is provided with second mounting holes 211 corresponding to the first mounting holes. The cover plate 112 is covered with the bottom plate 111, and the corresponding positioning posts 1113 are positioned and matched with the positioning holes 1122. The substrate 21 is locked to the bottom plate 111 by spring screws 30 passing through the second mounting holes 211 and matching the corresponding first mounting holes. That is, the multiple positioning posts 113, the multiple positioning holes 1122, the multiple first mounting holes, and the multiple second mounting holes 211 correspond one to one. The two ends of the spring of the spring screw 30 respectively abut the screw head and the substrate 21. In this embodiment, when the circuit board and the liquid cooling device 10 are installed, the pressing force of the spring screws can be adjusted to not only make each heating chip 22 fit tightly with the housing 11, thereby improving the heat dissipation effect, but also avoid damage to the heating chip 22 caused by excessive pressing force between the circuit board 20 and the housing 11 without adding an additional limiting structure between the housing 11 and the substrate 21. Specifically, a plurality of spring screws 30 are respectively provided on each partition bar 1111 and each housing wall 1112 to better ensure that each heating chip 22 can fit tightly with the housing 11, thereby improving the heat dissipation performance of the electronic device.

[0091] The height of the positioning post 113 is less than or equal to the thickness of the cover plate 112. Thus, the positioning post 113 does not extend beyond the side of the cover plate 112 away from the base plate 111. Consequently, the circuit board 20 is not affected by the positioning post 113 during installation, thereby enhancing the flexibility of the circuit board 20 installation. In this embodiment, the opening of the second mounting hole 211 on the circuit board 20 can be configured to be smaller than the opening of the positioning hole 1122. Thus, the positioning of the circuit board 20 and the housing 11 is achieved through the cooperation of the second mounting hole 211, the screw of the spring screw 30, and the first mounting hole. In another embodiment, the opening of the second mounting hole 211 can also be configured to be the same as or larger than the opening of the positioning hole 1122. The screw of the spring screw 30 can be configured as a stepped shaft, with the large section of the stepped shaft located between the small section and the screw head. The large section is inserted into the second mounting hole 211, and the spring is sleeved outside the large section.

[0092] Of course, the height of the positioning column 113 can also be greater than the thickness of the cover 112. In this way, the positioning column 113 extends out of the cover 112, and the second mounting hole 211 on the circuit board 20 can be inserted into the positioning column 113 to simultaneously position the cover 112 and the circuit board 20 through the same positioning column 113.

[0093] In the embodiment where the circuit board 20 is mounted on the side of the base plate 111 away from the cover plate 112, the circuit board 20 and the housing 11 can also be fastened using a spring screw 30. In this embodiment, the base plate 21 is directly fastened to the first mounting hole in the base plate 111 by passing through the second mounting hole 211 therein, with the ends of the spring of the spring screw 30 respectively abutting against the screw head and the base plate 21. In the embodiment where the circuit board 20 is mounted on both sides of the housing 11, the first mounting hole in the base plate 111 can be a through hole. Of course, in other embodiments, the first mounting hole can also be configured as a through hole.

[0094] Those skilled in the art will appreciate that, provided there is no conflict, the above preferred solutions can be freely combined and superimposed.

[0095] It should be understood that the above-mentioned embodiments are merely illustrative and non-restrictive. Without departing from the basic principles of the present invention, various obvious or equivalent modifications or substitutions that can be made by those skilled in the art to the above-mentioned details will be included in the scope of the claims of the present invention.

Claims

1. A liquid cooling device for an electronic device, the electronic device comprising a circuit board and the liquid cooling device, the liquid cooling device comprising a shell, the shell being provided with a medium inlet, a medium outlet and a medium flow channel, the medium flow channel being connected to the medium inlet and the medium outlet respectively, a plurality of heat dissipation fins being arranged at intervals in the medium flow channel along the width direction of the medium flow channel, the heat dissipation fins extending along the extension direction of the medium flow channel; the circuit board comprising a plurality of heat-generating chips, the plurality of heat-generating chips being arranged into a plurality of rows of chip groups arranged along the width direction, each of the chip groups comprising a plurality of heat-generating chips spaced apart along the extension direction, the circuit board being mounted on at least one outer surface of the shell facing away from the medium flow channel, and each of the heat-generating chips being in contact with an area corresponding to the medium flow channel; characterized in that A confluence region is formed in the medium flow channel between the medium outlet and the heat dissipation fins. A confluence structure is provided in the confluence region. The confluence structure includes a first confluence plate and a second confluence plate that are opposite to and spaced apart from each other in the width direction. The distance between the first confluence plate and the second confluence plate increases along the direction from the medium outlet to the heat dissipation fins. The confluence structure and the heat dissipation fins are spaced apart in the extending direction, and the distance between each heat dissipation fin and the medium outlet increases from the middle to both sides in the width direction.

2. The liquid cooling device according to claim 1, characterized in that Ends of the heat dissipating fins located on the same side of the center plane of the medium flow channel are connected to form a connecting surface, and each connecting surface is parallel to at least a portion of the busbar on the same side.

3. The liquid cooling device according to claim 1, wherein: Among the plurality of heat dissipating fins, a spacing area is formed between two adjacent heat dissipating fins located at the edge of the medium flow channel in the width direction; one end of each of the first and second busbars close to the heat dissipating fins is respectively opposite to the spacing area on its side.

4. The liquid cooling device according to claim 1, wherein: Ends of the first and second busbars close to the medium outlet are directly opposite to the inside of the medium outlet, and ends close to the heat dissipation fins are located outside both sides of the medium outlet.

5. The liquid cooling device according to claim 1, wherein: The first and second busbars each include a first and second plate segments connected in a bent manner. The first plate segment is tilted relative to the extension direction and closer to the medium outlet. The second plate segment is parallel to the extension direction.

6. The liquid cooling device according to claim 1, wherein: A flow equalizing area is formed in the space between the medium inlet and the heat dissipating fins in the medium flow channel, and a flow equalizing structure is arranged in the flow equalizing area. The flow equalizing structure includes a first flow equalizing plate and a second flow equalizing plate arranged opposite to each other in the width direction. The distance between the first flow equalizing plate and the second flow equalizing plate in the width direction increases along the direction from the medium inlet to the heat dissipating fins.

7. The liquid cooling device according to claim 6, characterized in that One end of the heat dissipation fin close to the current balancing structure is flush with the current balancing structure and a gap is left between the heat dissipation fin and the current balancing structure.

8. The liquid cooling device according to claim 7, characterized in that: The medium flow channel includes a plurality of sub-sections connected in series by bends, each of the sub-sections is provided with a plurality of heat dissipation groups along the extension direction, and each heat dissipation group includes a plurality of heat dissipation fins spaced apart in the width direction; In the sub-section where the current balancing structure is located, the first distance between the two heat dissipation groups close to the current balancing structure is larger than the second distance between the other two adjacent heat dissipation groups, and the length of the two heat dissipation groups closest to the current balancing structure is smaller than the length of the other heat dissipation groups.

9. The liquid cooling device according to claim 1, wherein: The medium flow channel includes a flow channel side wall and a flow channel end wall, the flow channel end wall includes a plane area and a slope area, the plane area is connected to the flow channel side wall through the slope area, and one end of the slope area connected to the flow channel side wall is inclined farther away from the plane area than the other end; The medium inlet and the medium outlet are respectively arranged on the corresponding plane areas of the flow channel end wall.

10. The liquid cooling device according to any one of claims 1 to 9, characterized in that: The medium flow channel includes a plurality of sub-sections connected in sequence, and the plurality of sub-sections are arranged side by side in the width direction; The outer side surface of the shell corresponding to each sub-section is protrudingly provided with a heat-conducting strip, and the heat-conducting strip is used to fit with the heat-generating chip; the end of the confluence structure close to the heat dissipation fin extends into the area corresponding to the heat-conducting strip in the medium flow channel.

11. An electronic device, characterized in that: It comprises a circuit board and the liquid cooling device according to any one of claims 1 to 10, the circuit board comprising a plurality of heat-generating chips, the plurality of heat-generating chips being arranged into a plurality of columns of chip groups arranged along the width direction, each of the chip groups comprising a plurality of the heat-generating chips spaced apart along the extension direction, the circuit board being mounted on at least one outer surface of the shell facing away from the medium flow channel, and each of the heat-generating chips being fitted into an area corresponding to the medium flow channel.

12. The electronic device according to claim 11, wherein: The medium flow channel includes a plurality of subsections arranged side by side along the width direction; The areas where the sub-sections are set on the shell correspond to multiple rows of the chipsets, and the end of the confluence structure close to the medium outlet extends out of the area corresponding to the chipset in the medium flow channel, and the end close to the heat dissipation fin extends into the area corresponding to the chipset in the medium flow channel.

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