Laser slag removal method and laser processing equipment

Abstract

The present invention discloses a laser slag removal method and laser processing equipment, including adjusting the incident angle of the target laser incident on the target focusing mirror based on a preset oscillation frequency after completing the laser drilling of the target single hole, so that the spot landing point of the target laser emitted through the target focusing mirror performs linear oscillation or circular oscillation to obtain a slag removal laser; based on the slag removal laser, laser slag removal is performed on the target single hole, and the focal length of the target laser remains unchanged during the drilling and slag removal process. After completing the laser drilling of the target single hole, there is no need to change the focal length through the focusing mirror. By adjusting the incident angle of the target laser incident on the target focusing mirror, the focus of the target laser is offset and oscillates within a certain range, so that the spot landing point moves at a high speed within a certain range on the surface of the workpiece, and the beam energy per unit area becomes smaller, which can be used for laser slag removal. In this way, the single hole can be deslaged after the single hole processing is completed, which is beneficial to improving the processing efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of automation equipment, and in particular to a laser slag removal method and laser processing equipment. Background Art

[0002] In the process of laser processing micro-holes in copper-clad laminates, due to the high energy of laser focus, some debris and other debris will be left on the edge during the drilling process, which needs to be removed by secondary laser processing. However, if the focused spot (positive focus) during the primary processing is used for cleaning in the secondary processing, the energy density will be too high and the surface of the workpiece will be damaged. The existing method is to adjust the focusing mirror for defocusing after processing all the holes. At this time, the spot covers a larger area and has a lower energy density, which can be used to remove the debris. However, the process of positive focus processing and defocusing removal requires all holes to be traversed by the laser beam twice, that is, the focusing mirror mechanism needs to move twice according to the set trajectory, resulting in very low efficiency. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a laser slag removal method and laser processing equipment, which can remove slag from a single hole after completing single hole processing, which is beneficial to improving processing efficiency.

[0004] On the one hand, an embodiment of the present invention provides a laser slag removal method, comprising:

[0005] After completing the laser drilling of the target single hole, adjusting the incident angle of the target laser to the target focusing mirror based on the preset oscillation frequency, so that the spot of the target laser emitted through the target focusing mirror oscillates linearly or circularly to obtain a slag removal laser;

[0006] Based on the slag removal laser, laser slag removal is performed on the target single hole, wherein the focal length of the target laser remains unchanged during the laser drilling and the laser slag removal.

[0007] According to some embodiments of the present invention, the oscillation frequency is ≥ 20 MHz / μs.

[0008] According to some embodiments of the present invention, the maximum length of the linear oscillation of the light spot landing point is 30 μm.

[0009] According to some embodiments of the present invention, the length of the linear oscillation of the light spot landing point is 20 μm.

[0010] According to some embodiments of the present invention, adjusting the incident angle of the target laser incident on the target focusing mirror based on a preset oscillation frequency so that the spot of the target laser emitted through the target focusing mirror oscillates linearly or circularly to obtain a slag removal laser includes:

[0011] The incident angle of the target laser incident on the target focusing mirror is adjusted based on the preset oscillation frequency, so that the spot of the target laser emitted through the target focusing mirror oscillates linearly along the normal direction of the arc segment of the target single hole to obtain a slag removal laser.

[0012] According to some embodiments of the present invention, the laser slag removal is performed on the target single hole based on the slag removal laser, including:

[0013] The slag removal laser is controlled to overlap with the edge of the target single hole, and laser slag removal is performed on the target single hole.

[0014] According to some embodiments of the present invention, the laser slag removal is performed on the target single hole based on the slag removal laser, including:

[0015] The slag removal laser is controlled to perform laser slag removal on the target single hole according to a preset movement trajectory.

[0016] According to some embodiments of the present invention, the laser slag removal is performed on the target single hole based on the slag removal laser, and then further includes:

[0017] Adjusting the incident angle of the target laser to the target focusing mirror so that the spot of the target laser emitted through the target focusing mirror is in a positive focus mode to obtain a drilling laser;

[0018] Based on the drilling laser, the next single hole is laser-drilled.

[0019] On the other hand, an embodiment of the present invention provides a laser processing equipment, including a laser generator, a laser deflector, a reflector, a focusing mirror and a controller, wherein the laser generator, the laser deflector, the reflector and the focusing mirror are all located on the same optical path, and the controller is electrically connected to the laser generator and the laser deflector respectively, and the controller is used to execute the above-mentioned laser slag removal method.

[0020] According to some embodiments of the present invention, the laser deflector adopts an acousto-optic deflector or an electro-optic deflector.

[0021] The embodiments of the present invention have at least the following beneficial effects:

[0022] After completing the laser drilling of the target single hole, there is no need to change the focal length through the focusing lens. By adjusting the incident angle of the target laser to the target focusing lens, the focus of the target laser is offset and oscillates within a certain range, so that the light spot moves at high speed within a certain range on the workpiece surface. The beam energy per unit area becomes smaller and can be used for laser slag removal. In this way, the slag of the single hole can be removed after the single hole processing is completed, which is beneficial to improve the processing efficiency.

[0023] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0025] Figure 1 A schematic diagram of a laser focus mode of a laser drilling method according to an embodiment of the present invention;

[0026] Figure 2 A schematic diagram of a laser focus mode of a laser slag removal method in the related art;

[0027] Figure 3 A flowchart of the steps of the laser slag removal method according to an embodiment of the present invention;

[0028] Figure 4 A schematic diagram of a laser focus mode of a laser slag removal method according to an embodiment of the present invention;

[0029] Figure 5 This is a schematic diagram of an oscillation mode of the light spot landing point of the laser slag removal method according to an embodiment of the present invention;

[0030] Figure 6 The second schematic diagram of the oscillation mode of the light spot landing point of the laser slag removal method according to an embodiment of the present invention;

[0031] Figure 7 A schematic diagram of a laser slag removal method according to an embodiment of the present invention;

[0032] Figure 8 This is a principle block diagram of the laser processing equipment according to an embodiment of the present invention.

[0033] Reference numerals:

[0034] Workpiece 10 , light spot landing point 20 , laser generator 100 , laser deflector 200 , reflecting mirror 300 , focusing mirror 400 , controller 500 . DETAILED DESCRIPTION

[0035] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0036] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0037] In the description of the present invention, "several" means one or more, "multiple" means more than two, greater than, less than, and exceeding are understood as not including the number itself, and "above", "below", and "within" are understood as including the number itself. If there is a description of "first", "second", etc., it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0038] In the description of the present invention, unless otherwise clearly defined, words such as “setting”, “installation” and “connection” should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above words in the present invention in combination with the specific content of the technical solution.

[0039] The main principle of laser drilling technology is to use the high energy density of the laser beam to rapidly heat up the surface of the workpiece and melt or vaporize it, thereby forming holes. Laser drilling technology has the advantages of high efficiency, precision, flexibility and environmental protection, and is widely used in many materials and fields, such as micro-hole processing of copper-clad laminates in the circuit board field.

[0040] In laser drilling technology, the focal position of the laser is crucial to ensure the quality and efficiency of drilling. The choice of focal position not only affects the accuracy of drilling, but also the surface quality and internal structure of the hole. The commonly used laser energy distribution is symmetrical about the focus. The spot at the focus is the smallest and the unit energy is the highest. The greater the defocus, the more dispersed the laser energy and the larger the spot. When the focus is located on the surface of the workpiece or slightly below the surface of the workpiece, the laser energy can act more concentratedly on the material, thereby improving the speed and accuracy of drilling. In addition, this focal position is also conducive to controlling the heat-affected zone during the drilling process and reducing thermal damage to the surrounding materials of the workpiece.

[0041] Please refer to Figure 1 In the micro-hole processing technology of copper-clad laminate, the incident laser is focused by the focusing mirror 400, so that the laser emitted from the focusing mirror 400 is focused at the focal position. Therefore, the focal position of the laser can be adjusted by adjusting the position of the focusing mirror 400 in the Z direction (that is, the up and down direction). When laser drilling is performed, the focal position of the laser is at the first position in the Z direction (such as Figure 1As shown by the mark A in the figure, the focused laser used in the drilling process has high energy, which leaves residues at the edge of the hole. Laser secondary processing is required. However, the energy density of the laser used for drilling is large and is not suitable for secondary processing. Therefore, the focus position of the laser (i.e., the defocus amount or laser focal length) needs to be adjusted to reduce the energy density of the laser acting on the workpiece. Please refer to Figure 2 The related technology is to adjust the Z direction distance between the focusing mirror 400 and the workpiece after all the holes are processed, so that the focusing mirror 400 works out of focus, that is, the focal position of the laser is at the second position in the Z direction (such as Figure 2 As shown in the mark A1 in the figure), the spot coverage area is large and the energy density is low, which can be used to remove residues. However, this method requires two passes through all the holes. The first pass is to laser drill all the holes, and the second pass is to remove residues from all the holes. In addition, the laser focus position needs to be positioned between the first pass and the second pass. In the processing of copper-clad laminates (workpieces), the number of holes to be processed may be hundreds or even tens of thousands. The time required for two passes and the adjustment time of the focus position are long, resulting in low processing efficiency. For this reason, there is an urgent need for a highly efficient laser slag removal method and laser processing equipment.

[0042] Please refer to Figure 3 This embodiment discloses a laser slag removal method, including steps S100 to S200. It should be noted that the steps in this embodiment are numbered only for the convenience of review and understanding, and do not limit the execution order of the steps. The contents of each step are described in detail below:

[0043] S100, after completing the laser drilling of the target single hole, adjusting the incident angle of the target laser to the target focusing mirror based on the preset oscillation frequency, so that the spot landing point 20 of the target laser emitted through the target focusing mirror performs linear oscillation or circular oscillation to obtain a slag removal laser;

[0044] S200, based on the slag removal laser, laser slag removal is performed on the target single hole, wherein the focal length of the target laser remains unchanged during the laser drilling and laser slag removal processes.

[0045] For example, in a copper clad laminate, laser drilling is usually performed on each hole one by one. In this embodiment, a single hole is referred to as a single hole, and the single hole to be processed is referred to as a target single hole. The target laser is the laser beam used for processing. In this embodiment, after completing the laser drilling of the target single hole, the target single hole is immediately laser deslagging (also known as clearing glue) without having to traverse all the holes once before deslagging. As mentioned above, the energy density of the laser used for drilling is relatively high and is not suitable for laser deslagging. For this reason, please refer to Figure 4 and Figure 5In this embodiment, the light spot landing point 20 oscillates within a certain range, so that the focused positive focus light spot moves at high speed within a certain range on the surface of the workpiece 10, and the laser energy per unit area becomes smaller, which is suitable for laser slag removal without adjusting parameters such as defocus amount of the target laser.

[0046] It is worth mentioning that the laser light converged by the focusing mirror 400 usually appears as a small dot on the surface of the workpiece 10. When the incident angle of the laser light to the focusing mirror 400 is changed, since the distance of the focusing mirror 400 relative to the workpiece 10 does not change, the focal position of the laser light does not change in the Z direction, that is, the focal length of the target laser light does not change, but the focal point of the laser light will shift in the XY plane, so that the light spot 20 will shift on the surface of the workpiece 10. For example, please refer to Figure 4 and Figure 5 , at the initial incident angle, the light spot 20 is at position A, and when the incident angle changes (such as Figure 4 ), the light spot landing point 20 is offset to position B along a certain direction (such as the X direction), and if the incident angle changes rapidly and continuously according to a certain rule, the light spot landing point 20 can be quickly offset between multiple positions along a certain direction. Further, if the incident angle changes periodically, the light spot landing point 20 can be quickly offset back and forth or sequentially between multiple positions to achieve oscillation. For a single laser, when other parameters remain unchanged (such as the pulse energy and pulse interval of the laser), the light spot landing point 20 oscillates between multiple positions, which can disperse the pulse energy of the laser to each position, thereby reducing the laser energy per unit area. Among them, the offset position of the light spot landing point 20 can be distributed along a straight line (such as Figure 5 As shown by the straight line L1, the light spot landing point 20 can be shifted back and forth between multiple positions distributed in a straight line, thereby achieving linear oscillation; or, the shifted position of the light spot landing point 20 can be distributed in a circle (as shown by the straight line L1). Figure 6 The laser focal length refers to the distance from the focusing plane to the material surface when the laser is focused on the material surface. In the related field, the laser focal length is also used to refer to the distance between the focusing lens 400 and the workpiece 10.

[0047] After completing the laser drilling of the target single hole, there is no need to change the focal length through the focusing lens 400. By adjusting the incident angle of the target laser to the target focusing lens, the focus of the target laser is offset and oscillates within a certain range, so that the light spot landing point 20 moves at high speed within a certain range on the surface of the workpiece 10, and the beam energy per unit area becomes smaller, which can be used for laser slag removal. In this way, the slag of the single hole can be removed after the single hole processing is completed, which is beneficial to improve the processing efficiency.

[0048] This embodiment disperses the pulse energy of the laser by oscillating the light spot landing point 20 between different positions, wherein the oscillation frequency and the oscillation offset distance during the oscillation process have a great influence on the beam energy per unit area.

[0049] For example, the higher the oscillation frequency of the light spot 20, the faster the displacement speed of the light spot 20 between different positions, and the smaller the laser energy applied to each position. In the experiment, it was found that the oscillation frequency ≥ 20MHz / μs (megahertz per microsecond) can effectively reduce the beam energy per unit area to meet the requirements of removing residues. For example, the oscillation frequency is 20MHz / μs, 25MHz / μs or 30MHz / μs or above.

[0050] In the related art, the laser used for slag removal is usually a single-point laser, that is, the laser appears as a single round dot on the slag removal surface of the workpiece 10, while in this embodiment, the slag removal surface of the workpiece 10 appears as a surface, such as a rectangular surface (such as Figure 5 as shown) or a rounded face (as Figure 6 As shown), that is, surface laser processing is adopted. In the case of linear oscillation, the maximum length of the linear oscillation of the spot landing point 20 is 30μm (micrometer), wherein the length of the linear oscillation affects the laser energy per unit area. If the length of the linear oscillation is too long, the laser energy per unit area will be excessively reduced, resulting in failure to meet the energy requirements for slag removal. In addition, the number of offset positions of the spot landing point 20 during the oscillation process can be determined according to the maximum length of the linear oscillation, the size of each spot landing point 20 on the degumming surface of the workpiece 10, and the distance of each offset.

[0051] Exemplarily, the length of the linear oscillation of the light spot landing point 20 can be 15μm, 18μm or 25μm, etc. Generally speaking, the length of the linear oscillation of the light spot landing point 20 is 20μm, that is, the length of the linear oscillation of the light spot landing point 20 is 20μm, which can meet the laser energy density requirement for slag removal.

[0052] In the field of circuit boards, microvias usually refer to holes with a diameter of less than 6 mil or about 150 μm. For the linear oscillation mode of the spot point 20, the length of the linear oscillation of the spot point 20 is usually smaller than the size of the target single hole. During the slag removal process, the surface laser obtained by linear oscillation can be controlled to move around the center of the target single hole, thereby removing slag from the edge of the target single hole. Please refer to Figure 7 In this process, the linear oscillation direction of the light spot landing point 20 is the normal direction of the arc segment of the target single hole (such as Figure 7The normal of an arc is a line segment that passes through a point on the arc and is perpendicular to the arc. In geometry, a normal is usually used to describe the tangent of a curve or surface. The direction it points to at that point is perpendicular to the tangent of the curve or surface and intersects the outward tangent plane at that point at a right angle.

[0053] Based on this, in step S100, the incident angle of the target laser incident on the target focusing mirror is adjusted based on the preset oscillation frequency, so that the spot landing point 20 of the target laser emitted through the target focusing mirror performs linear oscillation or circular oscillation to obtain the slag removal laser, including:

[0054] The incident angle of the target laser incident on the target focusing mirror is adjusted based on the preset oscillation frequency, so that the spot landing point 20 of the target laser emitted through the target focusing mirror oscillates linearly along the normal direction of the arc segment of the target single hole to obtain a slag removal laser.

[0055] Exemplarily, the incident angle of the target laser incident on the target focusing mirror is adjusted based on an oscillation frequency of ≥20MHz / μs, so that the spot landing point 20 of the target laser emitted through the target focusing mirror oscillates linearly within a range of a maximum length of 30μm along the normal direction of the arc segment of the target single hole, thereby obtaining a slag removal laser.

[0056] Step S200, based on the slag removal laser, laser slag removal is performed on the target single hole, including: controlling the slag removal laser to overlap with the edge of the target single hole, and performing laser slag removal on the target single hole.

[0057] For example, please refer to Figure 7 , the residue usually exists at the edge of the target single hole, and the single spot landing point 20 is a dot. In order to better cover and remove the residue, the spot landing point 20 of the slag removal laser is close to the edge of the target single hole (such as Figure 7 That is, when viewed from the top view of the target single hole, a portion of the light spot landing point 20 is located outside the edge of the target single hole (as shown by the mark K). Figure 7 As shown by the mark D1, another part of the light spot landing point 20 is located inside the edge of the target single hole (as shown in FIG. Figure 7 As shown by the mark D2, the light spot landing point 20 can be covered on the edge of the target single hole, and because the energy per unit area of ​​the light spot landing point 20 decreases after linear oscillation, only the residue of the target single hole will be cleaned without damaging the surface of the workpiece 10 around the target single hole. The outer side of the edge of the target single hole refers to the side of the edge of the target single hole away from the center of the target single hole, and the inner side of the edge of the target single hole refers to the side of the edge of the target single hole close to the center of the target single hole.

[0058] Step S200, based on the slag removal laser, laser slag removal is performed on the target single hole, including: controlling the slag removal laser to perform laser slag removal on the target single hole according to a preset moving trajectory.

[0059] For example, please refer to Figure 7 , the moving trajectory of the slag removal laser is a circular trajectory concentric with the target single hole (such as Figure 7 As shown by the mark L3, generally speaking, the length formed by the linear oscillation of the slag removal laser is smaller than the diameter of the target single hole. The movement of the slag removal laser can form a circular scanning surface at the target single hole, and the edge of the scanning surface covers the edge of the target single hole, thereby removing the edge residue of the target single hole.

[0060] Step S200, based on the slag removal laser, laser slag removal is performed on the target single hole, and then further includes:

[0061] Adjust the incident angle of the target laser to the target focusing mirror so that the spot landing point 20 of the target laser emitted through the target focusing mirror is in a positive focus mode to obtain a drilling laser;

[0062] Based on the drilling laser, the next single hole is laser drilled.

[0063] For example, as described above, during laser drilling, the focus is placed on the surface of the workpiece 10 or slightly below the surface of the workpiece 10 according to the process requirements, so that the spot landing point 20 of the target laser is in the positive focus mode. At this time, the spot landing point 20 is a single dot, and is not in an oscillating state. The energy of the spot landing point 20 is relatively high, and laser drilling can be performed. In this embodiment, after laser drilling and laser slag removal of the target single hole, the next single hole is laser drilled. In this way, all holes only need to be traversed once, and there is no need to adjust the distance of the focusing lens 400 relative to the workpiece 10 (i.e., the focal length of the target laser) for slag removal, which is conducive to saving processing time and improving processing efficiency.

[0064] Please refer to Figure 8 This embodiment provides a laser processing device, including a laser generator 100, a laser deflector 200, a reflector 300, a focusing mirror 400 and a controller 500. The laser generator 100, the laser deflector 200, the reflector 300 and the focusing mirror 400 are all located on the same optical path. The controller 500 is electrically connected to the laser generator 100 and the laser deflector 200 respectively. The controller 500 is used to execute the above-mentioned laser slag removal method.

[0065] After completing the laser drilling of the target single hole, there is no need to change the focal length through the focusing mirror 400. By adjusting the incident angle of the target laser to the target focusing mirror, the focus of the target laser is offset and oscillates within a certain range, so that the light spot 20 moves at high speed within a certain range on the surface of the workpiece 10, and the beam energy per unit area becomes smaller, which can be used for laser slag removal. In this way, the slag can be removed from the single hole after the single hole processing is completed, which is beneficial to improve the processing efficiency. It is worth mentioning that the reflector 300 is only used to change the direction of the light path and guide the target laser to the direction of the workpiece 10, and no action control is required during the laser slag removal process of the target single hole.

[0066] Among them, the laser deflector 200 adopts an acousto-optic deflector or an electro-optic deflector. The laser deflector 200 (or laser scanner) is a device used to change the propagation direction of the laser beam in space, and is widely used in laser processing, laser radar and other fields. The acousto-optic deflector (AOD) and the electro-optic deflector (EOD) are both applications of laser deflection technology. Compared with conventional mechanical deflectors, the acousto-optic deflector and the electro-optic deflector have the advantages of no mechanical rotation, fast scanning speed and high scanning accuracy. They can realize the rapid change of the incident angle of the target laser incident on the target focusing mirror, which is impossible for mechanical deflectors (such as galvanometers).

[0067] The acousto-optic deflector is a device based on the acousto-optic effect. The principle is that sound waves propagate in transparent optical materials (such as SiO2, TeO2 or PbMoO4), causing the refractive index of the optical material to change periodically, thereby forming a "grating". When the laser beam passes through the optical material, diffraction deflection will occur. When the laser diffracts and deflects, the deflection angle of the laser can be precisely modulated by controlling the frequency of the RF drive, and the response time is within a hundred nanoseconds. The electro-optic deflector is a device based on the electro-optic effect. The principle is that under the action of an external electric field, the isotropic crystal medium becomes anisotropic, thereby producing a phenomenon of refractive index change. The electro-optic deflector relies on the refractive index change of the optical material under the action of the electric field to cause the laser beam to diffract and deflect. In this way, the acousto-optic deflector or electro-optic deflector can be used to achieve a high-speed change in the incident angle of the target laser incident on the target focusing mirror.

[0068] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. A laser slag removal method, characterized in that: include: After completing the laser drilling of the target single hole, adjusting the incident angle of the target laser to the target focusing mirror based on the preset oscillation frequency, so that the spot landing point of the target laser emitted through the target focusing mirror performs circular oscillation or linear oscillation along the normal direction of the arc segment of the target single hole, thereby obtaining a slag removal laser; Based on the slag removal laser, laser slag removal is performed on the target single hole, wherein the focal length of the target laser remains unchanged during the laser drilling and the laser slag removal. Based on the slag removal laser, laser slag removal is performed on the target single hole, comprising: controlling the slag removal laser to overlap with the edge of the target single hole, and performing laser slag removal on the target single hole.

2. The laser slag removal method according to claim 1, characterized in that: The oscillation frequency is ≥20 MHz / μs.

3. The laser slag removal method according to claim 1, characterized in that: The maximum length of the linear oscillation of the light spot landing point is 30 μm.

4. The laser slag removal method according to claim 3, characterized in that: The length of the linear oscillation of the light spot landing point is 20 μm.

5. The laser slag removal method according to any one of claims 1 to 4, characterized in that: The laser slag removal is performed on the target single hole based on the slag removal laser, comprising: The slag removal laser is controlled to perform laser slag removal on the target single hole according to a preset movement trajectory.

6. The laser slag removal method according to any one of claims 1 to 4, characterized in that: Based on the slag removal laser, laser slag removal is performed on the target single hole, and then the following steps are further included: Adjusting the incident angle of the target laser to the target focusing mirror so that the spot of the target laser emitted through the target focusing mirror is in a positive focus mode to obtain a drilling laser; Based on the drilling laser, the next single hole is laser-drilled.

7. A laser processing device, comprising a laser generator, a laser deflector, a reflector, a focusing mirror and a controller, wherein the laser generator, the laser deflector, the reflector and the focusing mirror are all located on the same optical path, and the controller is electrically connected to the laser generator and the laser deflector respectively, characterized in that: The controller is used to execute the laser slag removal method according to any one of claims 1 to 6.

8. The laser processing equipment according to claim 7, characterized in that: The laser deflector is an acousto-optic deflector or an electro-optic deflector.

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