A scattered laser collection debugging system, a debugging method, a device and a storage medium

Abstract

The present application relates to the technical field of semiconductor front-end detection, and especially relates to a scattered laser collection debugging system, a debugging method, a device and a storage medium. A mapping relationship between a mirror optical axis and a point light source position is established, then the point light source position is used to represent the system optical axis, and then a camera is used to collect images in real time, and the preliminary adjustment of the fixed position of the sensor is realized based on the expression of the features in the images. Based on real-time image processing, the debugging data is fed back in real time, the debugging process is rapid and accurate, and the position accuracy of the debugging is high.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor front-end detection, in particular to a scattered laser collection debugging system, a debugging method, equipment and a storage medium. BACKGROUND

[0002] The laser scattering wafer detection equipment is an equipment for detecting the scattering light signal of the wafer surface defects based on the scattering principle of light, using a photoelectric detector to realize the detection of the micro defects of hundreds of nanometers or even tens of nanometers on the wafer surface. Since the scattering light signal is very weak, some photoelectric detectors with signal amplification function are usually used. PMT, i.e. photomultiplier tube, is a commonly used photoelectric detector with high sensitivity and high gain, which has the advantages of low noise, ultrafast response speed, simple readout circuit and the like. The detection surface diameter of the commonly used PMT has several specifications such as φ8 and φ25, and the tolerance of the outer dimension may be ±0.2mm or ±0.5mm. For some applications, this tolerance is acceptable, but for the precision detection equipment such as the laser scattering wafer detection equipment, the PMT needs to be installed and debugged more accurately, so that the detection center of the PMT and the optical axis of the light path coincide as much as possible, and the distance between the detection surface and the image plane of the optical system needs to be quantified. Since the commonly used PMT is a single-point photoelectric detector, it receives the light signal in a light spot range at a time, and cannot directly locate the center position of the detection surface and the relative position of the light spot through the output signal characteristics, so there is a lack of quantitative reference in the optical system installation and debugging process, and it is also difficult to intuitively feedback the debugging effect, and the debugging process is complicated. SUMMARY

[0003] Therefore, in order to solve the above technical problems, the purpose of the present application is to provide a scattered laser collection debugging system, a debugging method, equipment and a storage medium, which can be adjusted with high precision.

[0004] In a first aspect, an embodiment of the present application provides a scattered laser collection debugging system applied to a scattered laser collection system, the scattered laser collection system comprising a photomultiplier tube, the debugging system being sequentially provided with a backlight module, an elliptical mirror and a sensor placement position along a main optical axis, the backlight module being configured with a calibration pattern and being used for generating a point light source, the elliptical mirror being used for reflecting the point light source to form reflected light, the sensor placement position being used for selectively placing an image acquisition device or the photomultiplier tube, and adjusting the pitch angle and the real-time height of the image acquisition device, the image acquisition device being used for receiving the reflected light to image and acquire a real-time image, and a controller being connected with the sensor placement position, and adjusting the pitch angle and the distance of the sensor placement position relative to the backlight module, and the position of the backlight module based on the image features of a plurality of mark points in the real-time image.

[0005] In some embodiments, the image acquisition device comprises a first device consisting of a camera and a lens, and a second device consisting of only a camera.

[0006] In some embodiments, the field of view of the first device covers the calibration pattern and the bottom of the ellipsoidal mirror, and the field of view of the second device does not cover the bottom of the ellipsoidal mirror; the first device receives the reflected light and acquires a first real-time image containing the calibration pattern and the outline of the bottom of the ellipsoidal mirror, and the second device receives the reflected light and acquires a second real-time image containing part of the calibration pattern.

[0007] In some embodiments, the controller adjusts the pitch angle of the sensor placement position and the position of the backlight module based on the image features of the plurality of marker points in the first real-time image acquired by the first device, and adjusts the distance of the sensor placement position relative to the backlight module based on the image features of the plurality of marker points in the second real-time image acquired by the second device.

[0008] In some embodiments, the controller is further connected to the backlight module and adjusts the movement of the backlight module in the vertical direction so that the distance of the backlight module relative to the ellipsoidal mirror reaches a target distance.

[0009] In some embodiments, the system further comprises a distance limiting block arranged on the light emitting surface of the backlight module, and the controller adjusts the movement of the backlight module in the vertical direction so that the distance limiting block contacts the bottom of the ellipsoidal mirror.

[0010] In some embodiments, the distance limiting block is removed when the distance of the backlight module relative to the ellipsoidal mirror reaches the target distance.

[0011] In some embodiments, the calibration pattern comprises a base plate pattern, a plurality of calibration circle outlines with a circular hole at the center of the base plate pattern, and a plurality of calibration points arranged outside the outermost calibration circle outline.

[0012] In some embodiments, the plurality of calibration points are symmetrically arranged based on the center hole of the calibration pattern.

[0013] In some embodiments, the system further comprises a processor configured to receive the first real-time image and acquire the image features of the plurality of marker points in the first real-time image.

[0014] In some embodiments, the image features comprise the imaging clarity of the plurality of calibration points, and the difference in the center coordinates of the outline center of the ellipsoidal mirror and the center of the calibration circle.

[0015] In some embodiments, the controller adjusts the pitch angle of the sensor placement position based on the imaging sharpness difference of the plurality of calibration points to make the imaging sharpness of the plurality of calibration points consistent; and adjusts the position of the backlight module based on the center coordinate difference to make the center coordinate difference within a standard coordinate difference range.

[0016] In some embodiments, the controller adjusts the height of the sensor placement position based on the sharpness of the center point of the bottom plate pattern in the second real-time image.

[0017] In a second aspect, a scattered laser collection debugging method is provided, which is applied to the scattered laser collection debugging system in any of the above aspects. The method comprises: collecting real-time images based on the image collection device; obtaining image features of a plurality of mark points in the real-time images; adjusting the pitch angle of the sensor placement position, the position of the backlight module, and the distance between the sensor placement position and the backlight module in sequence based on the expression of the image features; and replacing the image collection device with a photomultiplier after the adjustment is completed.

[0018] In some embodiments, the adjustment of the pitch angle of the sensor placement position, the position of the backlight module, and the distance between the sensor placement position and the backlight module in sequence comprises: collecting a first real-time image based on the first device, and adjusting the pitch angle of the sensor placement position and the position of the backlight module based on the image features of a plurality of mark points in the first real-time image; adjusting the first device to a second device, collecting a second real-time image based on the second device, and adjusting the distance between the sensor placement position and the backlight module based on the image features of the mark points in the second real-time image.

[0019] In some embodiments, the adjustment of the pitch angle of the sensor placement position based on the image features of a plurality of mark points in the first real-time image comprises: obtaining imaging sharpness difference between a plurality of calibration points in the first real-time image, and adjusting the pitch angle of the sensor placement position based on the imaging sharpness difference to make the imaging sharpness difference 0.

[0020] In some embodiments, the adjustment based on the image features of a plurality of mark points in the first real-time image comprises: obtaining a center coordinate difference between the center of the bottom profile of the elliptical mirror and the center of the calibration circle in the first real-time image, and adjusting the position of the backlight module based on the center coordinate difference to make the center coordinate difference within a standard coordinate difference range.

[0021] In some embodiments, the adjustment of the distance between the sensor placement position and the backlight module based on the image features of the mark points in the second real-time image comprises: obtaining the sharpness of the center point of the bottom plate pattern in the second real-time image, and adjusting the height of the sensor placement position based on the sharpness.

[0022] In some specific implementations, before collecting the real-time image, the relative distance between the backlight module and the elliptical mirror is adjusted, specifically including: controlling the backlight module to move upward so that the bottom of the elliptical mirror is in contact with the distance limiting block arranged on the light emitting surface of the backlight module.

[0023] In a third aspect, an electronic device is provided, including a processor and a memory, the memory storing computer executable instructions capable of being executed by the processor, and the processor executes the computer executable instructions to implement the scattering laser collection debugging method of any one of the above aspects.

[0024] In a fourth aspect, a computer readable storage medium is provided, the computer readable storage medium storing computer executable instructions, and when the computer executable instructions are called and executed by a processor, the computer executable instructions cause the processor to implement the scattering laser collection debugging method of any one of the above aspects.

[0025] The embodiments of the present application bring the following beneficial effects:

[0026] The embodiments of the present application provide a scattering laser collection debugging system, a debugging method, an equipment and a storage medium, a mapping relationship between a mirror optical axis and a point light source position is established, then the point light source position is used to represent a system optical axis, and then a camera is used to collect images in real time, and the preliminary adjustment of a sensor fixed position is realized based on the expression of features in the images. Based on real-time image processing, debugging data is fed back in real time, the debugging process is rapid and accurate, and the position accuracy of the debugging is high.

[0027] Other features and advantages of the present disclosure will be described in the following description, or some features and advantages can be inferred or determined without doubt from the description, or can be known by implementing the above-mentioned technologies of the present disclosure.

[0028] In order to make the above-mentioned purposes, features and advantages of the present disclosure more obvious and easy to understand, the following preferred embodiments are specifically described, and the accompanying drawings are described in detail as follows. BRIEF DESCRIPTION OF DRAWINGS

[0029] In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the following will briefly introduce the drawings needed to be used in the specific embodiments or the prior art description. Obviously, the drawings in the following description are some embodiments of the present application, and those skilled in the art can also obtain other drawings according to these drawings without creative labor.

[0030] Figure 1 The system first state structure schematic diagram provided by the embodiments of the present application is shown in the following figure:

[0031] Figure 2A second state structure schematic diagram of a system provided by the embodiment of the present application;

[0032] Figure 3 A third state structure schematic diagram of a system provided by the embodiment of the present application;

[0033] Figure 4 A sensor placement structure schematic diagram provided by the embodiment of the present application;

[0034] Figure 5 A backlight module structure schematic diagram provided by the embodiment of the present application;

[0035] Figure 6 A calibration pattern schematic diagram provided by the embodiment of the present application;

[0036] Figure 7 A first real-time image first state schematic diagram provided by the embodiment of the present application;

[0037] Figure 8 A first real-time image second state schematic diagram provided by the embodiment of the present application;

[0038] Figure 9 A center pattern schematic diagram of the calibration pattern provided by the embodiment of the present application;

[0039] Figure 10 A debugging control method flow schematic diagram provided by the embodiment of the present application;

[0040] Figure 11 A debugging control method sub-flow schematic diagram provided by the embodiment of the present application;

[0041] Figure 12 A system schematic diagram after debugging completion provided by the embodiment of the present application;

[0042] Figure 13 An electronic device structure schematic diagram provided by the embodiment of the present application.

[0043] Icon: 100-scattered laser collection debugging system;

[0044] 110-backlight module; 120-elliptical mirror; 130-sensor placement site; 140-first device; 150-second device; 160-distance limiting block; 170-photomultiplier tube;

[0045] 111-point light source; 112-calibration pattern; 113-bottom plate pattern; 114-calibration circle contour; 115-calibration point; 116-elliptical mirror bottom contour; 117-calibration circle center;

[0046] 141-camera; 142-lens. DETAILED DESCRIPTION

[0047] In order to make the purposes, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions of the present application will be described clearly and completely below with reference to the drawings. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0048] The debugging system and the debugging method provided by the embodiments of the present application are applied to a laser scattering detection scene, and are used for debugging, i.e. calibrating, key components in the scene, so as to ensure the accuracy of the detection process. The laser scattering detection scene is mainly wafer laser scattering detection, i.e. a laser beam is incident on a wafer surface at a certain angle. If there is a defect on the wafer surface, the incident laser will be scattered. The scattered light signal is collected and detected by the key components. Based on the strength and scattering field distribution state of the received scattered light signal, the size range and defect type of the defect on the wafer surface are determined, and the wafer surface defect is detected.

[0049] In the present embodiment, the "wafer" generally refers to a substrate formed of a semiconductor or non-semiconductor material. Examples include, but are not limited to, monocrystalline silicon, gallium arsenide, gallium nitride, and indium phosphide. Such substrates are typically found and / or processed in semiconductor manufacturing facilities. In some cases, a wafer can include only a substrate (i.e., a bare wafer). Alternatively, a wafer can include one or more layers of different materials formed on a substrate. One or more layers formed on a wafer can be "patterned" or "unpatterned". For example, a wafer can include a plurality of dies having repeatable pattern features.

[0050] In the present embodiment, the "wafer" generally refers to a substrate formed of a semiconductor or non-semiconductor material. Examples include, but are not limited to, monocrystalline silicon, gallium arsenide, gallium nitride, and indium phosphide. Such substrates are typically found and / or processed in semiconductor manufacturing facilities. In some cases, a wafer can include only a substrate (i.e., a bare wafer). Alternatively, a wafer can include one or more layers of different materials formed on a substrate. One or more layers formed on a wafer can be "patterned" or "unpatterned". For example, a wafer can include a plurality of dies having repeatable pattern features.

[0051] The debugging and calibration of the key components of the embodiments of the present application are the debugging and calibration of the photomultiplier tube. The purpose is to ensure that the center of the photomultiplier tube is coaxial with the main optical axis of the light signal collection system, i.e. the scattered light collected by the elliptical mirror will not be not received or incompletely received due to the placement problem of the photomultiplier tube. For the debugging of the photomultiplier tube, the initial placement position of the photomultiplier tube needs to be debugged first, and then the height and plane position of the photomultiplier tube are debugged based on the scattered light signal strength received by the photomultiplier tube at the initial placement position.

[0052] For the technical solution of the embodiment, refer to Figure 1 Based on the technical purpose, the embodiment of the application provides a scattered laser collection debugging system for debugging the initial placement position of a photomultiplier tube. The system acquires the optical state of scattered light by using a sensor, adjusts the initial position of the photomultiplier tube based on the optical state, and takes the position corresponding to the optimal optical state as the initial position of the photomultiplier tube. The system includes a backlight module, an elliptical mirror, and a sensor placement position. The backlight module and the elliptical mirror are optical units for generating incident light. The sensor placement position is used to fix the sensor. The sensor receives the incident light generated by the backlight module and the elliptical mirror. The sensor placement position has multiple adjustment degrees. The position of the sensor placement position in space corresponding to the optimal optical state is taken as the initial position of the photomultiplier tube. The photomultiplier tube is placed in the sensor placement position to realize the initial adjustment of the photomultiplier tube. In this process, the placement position of the backlight module also affects the optical imaging effect. Therefore, in the above adjustment process, not only the pitch angle of the sensor placement position and the distance between the sensor placement position and the backlight module need to be adjusted, but also the position of the backlight module needs to be adjusted. That is, the position of the backlight module has an error before adjustment, which needs to be adjusted. The hardware structure of the sensor placement position can be referred to as shown in Figure 4 The hollow channel is a space for placing the sensor. The sensor is placed in the space, and is fixed by the connecting piece in the hardware structure. The multiple adjustment structures in the sensor placement position realize the multi-degree-of-freedom adjustment of the placement space, thereby realizing the multi-degree-of-freedom adjustment of the sensor placed in the space.

[0053] To realize the above process, in addition to the hardware structure, the system also has a controller connected with the sensor placement position, which controls the sensor placement position to change the multiple adjustment degrees.

[0054] Specifically, the multiple adjustment degrees of the embodiment of the application mainly include the pitch angle and the real-time height, that is, the adjustment degree configuration of the sensor placement position should at least be able to realize the change of the pitch angle and the real-time height.

[0055] In this embodiment, the sensor is an image acquisition device used to receive incident light and obtain an image based on the received incident light. The acquired image is a calibration plate image; that is, in this embodiment, a calibration plate is configured on the backlight module, and the scattered light carries the calibration plate image. By determining the imaging state of each calibration point in the acquired calibration plate image, the sensor placement position is adjusted, thereby changing the spatial position of the image acquisition device. Different calibration plate images are acquired based on different spatial positions. Based on the image features of multiple marker points in multiple calibration plate images, the controller adjusts the pitch angle of the sensor placement position, the distance relative to the backlight module, and the position of the backlight module to achieve initial adjustment of the sensor placement position. The image acquisition device in the adjusted sensor placement position is then replaced with a photomultiplier tube, thereby achieving initial adjustment of the photomultiplier tube.

[0056] In summary, the working principle of the scattered laser collection and debugging system provided in this embodiment is as follows: a real-time image containing the calibration board image is acquired through an image acquisition device, and the image features of multiple marker points in the real-time image are determined. Based on the image features, the pitch angle of the sensor placement position, the distance relative to the backlight module, and the position of the backlight module are adjusted to achieve the adjustment of the backlight module and the sensor placement position. The image acquisition device in the adjusted sensor placement position is replaced with a photomultiplier tube to achieve the initial adjustment of the photomultiplier tube.

[0057] Specifically, the backlight module, elliptical mirror, and sensor placement position are arranged sequentially along the main optical axis of the reflection-converging optical system.

[0058] For details regarding the structure of the backlight module, please refer to [link / reference needed]. Figure 5 As shown, the backlight module includes a light source and a calibration plate disposed at the light-emitting surface of the light source. The calibration plate is a glass plate on which calibration patterns are drawn. Furthermore, in this embodiment, the light source is configured as multiple point light sources.

[0059] The elliptical mirror is placed above the light source module to reflect the illumination beam carrying the calibration pattern generated by the backlight module, and then image it through an image acquisition device placed at the sensor placement position.

[0060] In the embodiments of this application, the image acquisition device has different structures for different detection tasks. Specifically, the image acquisition device includes two structural configurations, see [link to relevant documentation]. Figure 1 The image acquisition device in the image is the first device equipped with a camera and lens, see reference. Figure 2The image acquisition device in the first device is a second device equipped with a camera. The difference between the first device and the second device is only whether an optical lens is added, wherein the purpose of adding the optical lens in the first device is to enable the camera to acquire a larger field of view at a limited object distance, that is, the image features contained in the imaging result of the first device are larger than those of the second device.

[0061] Specifically, the field of view range of the first device covers the calibration pattern and the bottom contour of the elliptical mirror, while the bottom contour of the elliptical mirror cannot be covered by the second device. Therefore, during the debugging process of the assembly structure of the first device, the bottom contour of the elliptical mirror needs to be processed as an image feature to achieve adjustment. The reason for such a setting of the first device is that more image features are introduced to adjust the pitch angle and the horizontal position of the camera, and the position of the backlight module is adjusted according to the positional relationship between the bottom contour of the elliptical mirror and the calibration pattern image, and then the x-axis and y-axis of the sensor placement position are adjusted to make the center of the calibration pattern coincide with the center of the camera field of view, so as to realize the "three-center coincidence" of the center of the calibration pattern, the center of the elliptical mirror and the center of the camera field of view. Therefore, in the embodiment of the present application, the image acquisition device first uses the first device. That is, during debugging, the first device is used to acquire a first real-time image containing the calibration pattern and the bottom contour of the elliptical mirror, and the pitch angle and the horizontal position of the camera and the relative position of the backlight module are adjusted according to the expression degree of the target image feature in the first real-time image and the positional relationship between the bottom contour of the elliptical mirror and the calibration image.

[0062] Specifically, the calibration pattern can refer to the structure shown in Figure 6 The calibration pattern includes a bottom plate pattern and a plurality of calibration circle contours with a circular hole at the center of the bottom plate pattern, wherein the calibration points are symmetrically arranged based on the center of the calibration circle. In the embodiment of the present application, the number of calibration points is preferably 4, which are arranged at the four corners of the outermost calibration circle contour. In other embodiments, the shape of the calibration point can be other shapes.

[0063] The first real-time image is an acquisition image containing the calibration pattern, which can refer to Figure 7 The calibration image in Figure 6 And the bottom contour of the reflector, as shown in Figure 7 It can be seen that the bottom contour of the reflector is a circle around the four calibration points, and in other embodiments, the shape of the bottom contour of the reflector can be other circular shapes, such as an ellipse, but the structure is arranged around the outside of the calibration point. Figure 7

[0064] And, Figure 7 The positional relationship between the bottom contour of the reflector and the calibration pattern shown in Figure 7 ​It can be seen that the center of the mirror bottom profile is not coincident with the center of the calibration pattern.

[0065] For different calibration feature images in the first real-time image in the embodiment, i.e., four calibration point images, the center of the mirror bottom profile, and the center of the calibration pattern, different adjustment tasks are correspondingly performed in the adjustment process.

[0066] The center of the calibration pattern and the center of the mirror bottom profile are used to adjust the lens of the first device, and the objects of adjustment are the focusing ring and the aperture of the lens, so that the clarity of the calibration pattern and the mirror bottom profile in the first real-time image captured by the camera reaches the target clarity.

[0067] The four calibration points are used to adjust the pitch angle of the sensor placement position. The adjustment principle is to obtain the imaging clarity difference of the four calibration points, and adjust the pitch angle of the sensor placement position based on the difference, so that the imaging clarity of the four calibration points is consistent, i.e., the camera entrance plane is relatively parallel to the surface of the backlight module.

[0068] The center of the calibration pattern and the center of the mirror bottom profile are used to adjust the pitch angle of the sensor placement position. The adjustment principle is to obtain the imaging clarity difference of the four calibration points, and adjust the pitch angle of the sensor placement position based on the difference, so that the imaging clarity of the four calibration points is consistent, i.e., the camera entrance plane is relatively parallel to the surface of the backlight module. Figure 8 For the image representation of the first real-time image after the adjustment of the plane position of the backlight module, the following is performed: Figure 8 It can be seen that the center of the mirror bottom profile is coincident with the center of the calibration pattern. In the embodiment, the calculation of the center coordinate difference is based on the pixel coordinate algorithm in the existing image processing technology, which will not be described in detail in the embodiment. Through the above processing, the "three centers" of the backlight pattern center, the mirror center, and the camera field of view center are coincident, which ensures the coordination of the camera, the backlight module, and the elliptical mirror in the plane direction.

[0069] The above adjustment process is based on the adjustment of the first device fixed in the sensor placement position. After the adjustment of the first device, the adjustment of the sensor placement position and the backlight module in the plane direction is realized, and the adjustment of the sensor placement position and the backlight module in the axial direction is realized based on the image processing of the second device.

[0070] Specifically, when the captured image meets the standard shown in FIG. 8, the first device is replaced by the second device. Referring to FIG. 8, the standard is that the center of the mirror bottom profile is coincident with the center of the calibration pattern. Figure 2The system structure schematic diagram for installing the second device. The second device includes a camera, and the second device only includes the camera relative to the first device. Because the second device does not set up a lens, the field of view of the image acquisition of the second device is smaller than that of the first device, the bottom contour of the elliptical mirror is not included in the field of view of the second device, only the image information of the calibration pattern is included, and the calibration pattern is also not a complete calibration pattern, but at least the image of the center circular hole of the calibration pattern is included in the second real-time image acquired by the second device.

[0071] The pattern of the center circular hole of the calibration pattern can be referred to Figure 9 As shown, the calibration center is not a point image, and rich texture expression is included in the calibration center. For the logic based on the second device for adjustment, the second real-time image acquired by the second device at least includes the pattern of the center circular hole of the calibration plate, the clarity of the pattern of the center circular hole of the calibration plate in the second real-time image is obtained, the height of the sensor placement position is adjusted to make the clarity be at the highest value, and at this time, the corresponding sensor placement position height is the target height.

[0072] In the above system provided by the embodiment of the application, the plurality of images acquired by the first device and the second device realize the adjustment of the plurality of poses of the sensor placement position.

[0073] It is worth noting that in the above system, the adjustment object is the adjustment of the relative position of the sensor placement position and the backlight module, but the position setting of the elliptical mirror is not adjusted, which indicates that the placement position of the elliptical mirror is a fixed position in the above system. Moreover, the relative distance between the backlight module and the elliptical mirror is the optimal position, and the adjustment is not performed in the above adjustment.

[0074] But in the actual adjustment scene, because the above three components are the mechanical units configured on the detection machine, the backlight module and the elliptical mirror are configuration tools for simulating the real detection scene for calibration and adjustment. Therefore, the position settings of the above two components also need to be adjusted before the adjustment of the sensor placement position. Among them, an important adjustment item of the adjustment is to adjust the relative distance between the backlight module and the elliptical mirror, so that the relative distance between the backlight module and the elliptical mirror conforms to the optimal distance represented by Figure 1 and Figure 2 .

[0075] Therefore, in the embodiment of the present application, the system further comprises an adjusting component for the elliptical mirror and the backlight module. A motor is arranged in the backlight module. The Z-axis of the motor in the backlight module is adjusted by a controller to move the backlight module along the optical axis direction, so that the distance between the backlight module and the mirror reaches a target distance. The target distance is controlled by arranging an infrared distance sensor on the surface of the backlight module. The sensor emits infrared laser to collect the distance between the bottom of the mirror and the backlight module to obtain the real-time distance, thereby achieving adjustment.

[0076] In another real-time manner, refer to Figure 3 A distance limiting block conforming to the target distance can be placed on the backlight module. The distance limiting block is brought into contact with the bottom of the elliptical mirror by moving the backlight module along the axial direction. When the contact is made, the movement of the backlight module is stopped, and the distance limiting block is removed and kept in this position. This method has a lower cost, and since the distance limiting block can be removed, it will not cause the generation of additional image features in the subsequent image acquisition process. In the embodiment, this method is preferred.

[0077] Figure 10 A flowchart illustrating a method of performing debugging control on a controller is described. In one non-limiting example, refer to Figures 1-9 The system 100 described is configured to implement the method. However, in general, the implementation of the method can be implemented by any of the described subsystems and systems, and furthermore is not limited by the specific embodiments described herein.

[0078] The method comprises the following specific steps:

[0079] Step S10. Acquire real-time images based on the image acquisition device.

[0080] Step S20. Obtain image features of a plurality of landmark points in the real-time images, and sequentially adjust the pitch angle of the sensor placement position, the position of the backlight module, and the distance of the sensor placement position relative to the backlight module based on the expression of the image features.

[0081] Step S30. After the adjustment is completed, replace the image acquisition device with a photomultiplier tube.

[0082] The step S20 is a specific adjustment process, refer to Figure 11 , comprising the following processing steps:

[0083] Step S21. Acquire first real-time images based on the first device, and adjust the pitch angle of the sensor placement position and the position of the backlight module based on the image features of a plurality of landmark points in the first real-time images.

[0084] Step S22. Adjusting the first device to a second device, collecting a second real-time image based on the second device, and adjusting the distance between the sensor placement position and the backlight module based on the image features of the landmark points in the second real-time image.

[0085] In the embodiments of the present application, the system structure corresponding to the first device is shown in Figure 1 , and the system structure corresponding to the second device is shown in Figure 2 . Among them, the first real-time image contains a calibration image and an elliptical mirror bottom contour, and the second real-time image does not contain the elliptical mirror bottom contour.

[0086] Specifically, adjusting the pitch angle of the sensor placement position based on the image features of the plurality of landmark points in the first real-time image includes: obtaining the imaging clarity difference between the plurality of landmark points in the first real-time image, and adjusting the pitch angle of the sensor placement position based on the imaging clarity difference to make the imaging clarity difference 0. Adjusting based on the image features of the plurality of landmark points in the first real-time image includes: obtaining the center coordinate difference between the center of the elliptical mirror bottom contour and the center of the calibration circle in the first real-time image, adjusting the position of the backlight module based on the center coordinate difference to make the center coordinate difference within a required range, specifically within ±0.25 pixels. Adjusting the distance between the sensor placement position and the backlight module based on the image features of the landmark points in the second real-time image includes: obtaining the clarity of the center point of the bottom plate pattern in the second real-time image, and adjusting the height of the sensor placement position based on the clarity.

[0087] In addition to the above adjustment control process, before performing step S21, a preliminary adjustment control process is further included, which is to control the backlight module to move upward to make the elliptical mirror bottom contact with the distance limiting block, and the distance limiting block is arranged on the light emitting surface of the backlight module.

[0088] The results processed by the above process can be referred to Figure 12 .

[0089] The embodiments of the present application further provide an electronic device for running the above-mentioned scattered laser collection debugging method; referring to Figure 13 , a structural schematic diagram of an electronic device is shown, the electronic device includes a memory 100 and a processor 101, wherein the memory 100 is used to store one or more computer instructions, and the one or more computer instructions are executed by the processor 101 to realize the above-mentioned scattered laser collection debugging method.

[0090] Further, Figure 13 , the electronic device shown further includes a bus 102 and a communication interface 103, and the processor 101, the communication interface 103 and the memory 100 are connected through the bus 102.

[0091] The memory 100 can include a high-speed random access memory (RAM), and can also include a non-volatile memory, such as at least one disk memory. The communication connection between the system network element and at least one other network element is realized through at least one communication interface 103 (which can be wired or wireless), and the Internet, a wide area network, a local network, a metropolitan area network, etc. can be used. The bus 102 can be an ISA bus, a PCI bus, or an EISA bus, etc. The bus can be divided into an address bus, a data bus, a control bus, etc. For ease of representation, Figure 13 Figure 13 Only one bidirectional arrow is used to represent the system network element and at least one other network element, but it does not mean that there is only one bus or one type of bus.

[0092] The processor 101 can be an integrated circuit chip with signal processing capability. In the implementation process, each step of the above method can be completed by the integrated logic circuit of the hardware in the processor 101 or the instructions in the form of software. The processor 101 described above can be a general-purpose processor, including a central processing unit (CPU), a network processor (NP), etc.; it can also be a digital signal processor (DSP), an application specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable logic devices, discrete gates or transistor logic devices, discrete hardware components. Each method, step and logic block disclosed in the embodiment of the present application can be implemented or executed. The general-purpose processor can be a microprocessor or the processor can also be any conventional processor. The steps of the method disclosed in combination with the embodiment of the present application can be directly embodied as a hardware code processor for execution, or a combination of hardware and software modules in the code processor for execution. The software module can be located in a random access memory, a flash memory, a read-only memory, a programmable read-only memory, an electrically erasable programmable memory, a register, etc. The storage medium in the art. The storage medium is located in the memory 100, and the processor 101 reads the information in the memory 100, and combines the hardware to complete the steps of the method of the above embodiment.

[0093] The embodiment of the present application further provides a computer readable storage medium, which stores computer executable instructions, and the computer executable instructions cause the processor to implement the above-mentioned laser scattering collection system debugging control method when the computer executable instructions are called and executed by the processor. For details, refer to the method embodiment, which will not be repeated here.

[0094] The laser scattering collection debugging system, the debugging method, the equipment and the computer program product of the storage medium provided by the embodiment of the present application include a computer readable storage medium storing program codes, and the instructions included in the program codes can be used to execute the method in the foregoing method embodiment. For details, refer to the method embodiment, which will not be repeated here.

[0095] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working process of the above-mentioned system and / or device can refer to the corresponding process in the foregoing method embodiment, which will not be repeated here.

[0096] In addition, in the description of the embodiment of the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connection" and "connection" should be understood in a broad sense, for example, can be fixedly connected, can be detachably connected, or integrally connected; can be mechanically connected, or electrically connected; can be directly connected, or indirectly connected through an intermediate medium; can be the communication inside two elements. For those skilled in the art, the specific meaning of the above-mentioned terms in the present application can be understood according to the specific circumstances.

[0097] If the function is realized in the form of a software function unit and sold or used as an independent product, it can be stored in a computer readable storage medium. Based on such understanding, the technical solutions of the present application or the part of the technical solutions which essentially contribute to the prior art or the part of the technical solutions can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes a plurality of instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the method of each embodiment of the present application. The foregoing storage medium includes: a U disk, a mobile hard disk, a read-only memory (ROM, Read-Only Memory), a random access memory (RAM, Random Access Memory), a magnetic disk or an optical disk and various program code storage media.

[0098] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third" are only for the purpose of description, and cannot be understood as indicating or implying relative importance.

[0099] Finally, it should be noted that the above-described embodiments are only specific embodiments of the present application, which are used to illustrate the technical solutions of the present application, and are not limiting. The protection scope of the present application is not limited thereto. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that any person skilled in the art can make modifications or easily think of changes to the technical solutions recorded in the foregoing embodiments within the technical range disclosed by the present application, or make equivalent replacements to some technical features; and these modifications, changes or replacements do not cause the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A scattered laser collection and adjustment system, applied to a scattered laser collection system, wherein the scattered laser collection system includes a photomultiplier tube, characterized in that, The debugging system is arranged sequentially along the main optical axis as follows: The backlight module is equipped with a calibration pattern and a point light source for generating a point light source; An elliptical mirror is used to reflect the point light source to form reflected light; A sensor placement position is provided for selectively placing an image acquisition device or the photomultiplier tube, and for adjusting the pitch angle and real-time altitude of the image acquisition device. The image acquisition device is used to receive the reflected light to acquire a real-time image. The image acquisition device includes a first device consisting of a camera and a lens, and a second device consisting only of a camera. The field of view of the first device covers the calibration pattern and the bottom of the elliptical mirror, while the field of view of the second device does not cover the bottom of the elliptical mirror. The first device receives the reflected light and acquires a first real-time image containing the calibration pattern and the outline of the bottom of the elliptical mirror, while the second device receives the reflected light and acquires a second real-time image containing a portion of the calibration pattern. The controller, connected to the sensor placement position, adjusts the pitch angle and distance of the sensor placement position relative to the backlight module, as well as the position of the backlight module, based on the image features of multiple marker points in the real-time image. The controller adjusts the pitch angle of the sensor placement position and the position of the backlight module based on the image features of multiple marker points in the first real-time image acquired by the first device. Based on the image features of multiple marker points in the second real-time image acquired by the second device, the distance between the sensor placement position and the backlight module is adjusted.

2. The scattered laser collection and debugging system according to claim 1, characterized in that, The controller is also connected to the backlight module and adjusts the vertical movement of the backlight module so that the distance between the backlight module and the elliptical mirror reaches the target distance.

3. The scattered laser collection and debugging system according to claim 2, characterized in that, The system also includes a distance limiting block disposed on the light-emitting surface of the backlight module, and the controller adjusts the vertical movement of the backlight module so that the distance limiting block contacts the bottom of the elliptical mirror.

4. The scattered laser collection and adjustment system according to claim 3, characterized in that, When the distance between the backlight module and the elliptical mirror reaches the target distance, the distance limiting block is removed.

5. The scattered laser collection and debugging system according to claim 1, characterized in that, The calibration pattern includes a base plate pattern, multiple calibration circle outlines with a small circular hole at the center of the base plate pattern, and multiple calibration points set outside the outermost calibration circle outline.

6. The scattered laser collection and debugging system according to claim 5, characterized in that, The multiple calibration points are symmetrically arranged based on the central circular hole of the calibration pattern.

7. The scattered laser collection and debugging system according to claim 6, characterized in that, The system further includes a processor, which is used to receive the first real-time image and acquire image features of multiple marker points in the first real-time image.

8. The scattered laser collection and debugging system according to claim 7, characterized in that, The image features include the imaging sharpness of multiple calibration points, and the center coordinate difference between the center of the bottom contour of the elliptical mirror and the center of the calibration circle.

9. The scattered laser collection and debugging system according to claim 8, characterized in that, The controller adjusts the pitch angle of the sensor placement position based on the difference in image sharpness among the multiple calibration points to make the image sharpness of the multiple calibration points consistent. The controller adjusts the position of the backlight module based on the center coordinate difference, so that the center coordinate difference is within the standard coordinate difference range.

10. The scattered laser collection and debugging system according to claim 5, characterized in that, The controller adjusts the height of the sensor placement position based on the clarity of the center point of the base plate pattern in the second real-time image.

11. A method for collecting and adjusting scattered laser light, characterized in that, The method, applied to the scattered laser collection and adjustment system according to any one of claims 1-10, comprises: Real-time images are acquired using an image acquisition device; The image features of multiple marker points in the real-time image are obtained, and the pitch angle of the sensor placement position, the position of the backlight module, and the distance of the sensor placement position relative to the backlight module are adjusted sequentially based on the expression of the image features. After adjustment, the image acquisition device is replaced with a photomultiplier tube.

12. The scattered laser collection and adjustment method according to claim 11, characterized in that, The sequential adjustment of the tilt angle of the sensor placement position, the position of the backlight module, and the distance between the sensor placement position and the backlight module includes: The first real-time image is acquired based on the first device, and the pitch angle of the sensor placement position and the position of the backlight module are adjusted based on the image features of multiple marker points in the first real-time image. The first device is adjusted to a second device, a second real-time image is acquired based on the second device, and the distance between the sensor placement position and the backlight module is adjusted based on the image features of the marker points in the second real-time image.

13. The scattered laser collection and adjustment method according to claim 12, characterized in that, The step of adjusting the pitch angle of the sensor placement position based on the image features of multiple marker points in the first real-time image includes: obtaining the image sharpness difference between multiple calibration points in the first real-time image, and adjusting the pitch angle of the sensor placement position based on the image sharpness difference to make the image sharpness difference 0.

14. The scattered laser collection and adjustment method according to claim 13, characterized in that, The image feature adjustment based on multiple marker points in the first real-time image includes: obtaining the center coordinate difference between the center of the bottom contour circle of the elliptical mirror and the center of the calibration circle in the first real-time image, and adjusting the position of the backlight module based on the center coordinate difference so that the center coordinate difference is within the range of standard coordinate difference.

15. The scattered laser collection and adjustment method according to claim 12, characterized in that, The step of adjusting the distance between the sensor placement position and the backlight module based on the image features of the marker points in the second real-time image includes: obtaining the clarity of the center point of the base plate pattern in the second real-time image, and adjusting the height of the sensor placement position based on the clarity.

16. The scattered laser collection and adjustment method according to claim 12, characterized in that, Before acquiring real-time images, the relative distance between the backlight module and the elliptical mirror is adjusted. Specifically, the backlight module is controlled to move upward so that the bottom of the elliptical mirror contacts the distance limiting block, which is set on the light-emitting surface of the backlight module.

17. An electronic device, characterized in that, The method includes a processor and a memory, the memory storing computer-executable instructions that can be executed by the processor, the processor executing the computer-executable instructions to implement the scattered laser collection and debugging method according to any one of claims 11 to 16.

18. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer-executable instructions, which, when invoked and executed by a processor, cause the processor to implement the scattered laser collection and debugging method according to any one of claims 11 to 16.

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