A wafer automated production control system and method

Abstract

The invention discloses a wafer automated production control system and method, and relates to the technical field of wafer production. By storing an influencing factor acquisition module and a performance parameter acquisition module, the system can intelligently collect and analyze storage parameters and performance parameters of photoresist in wafer production equipment, and realize intelligent management of the production process, thereby improving production efficiency, optimizing product quality, reducing production costs, and enhancing production safety. In addition, a processing scheme analysis module can accurately analyze corresponding aging processing schemes according to the performance evaluation coefficient of the photoresist, such as replacing the photoresist or optimizing process parameters, thereby effectively solving the photoresist aging problem, timely judging the aging condition of the photoresist and taking processing measures, thereby reducing equipment maintenance costs, extending equipment life, and improving the stability and reliability of the production line.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer production, and in particular to a wafer automated production control system and method. Background Art

[0002] Wafer automation production control system is a key technology system used in the semiconductor industry to control and manage the wafer production process. Wafer production is an important part of the semiconductor process, involving multiple processes such as photolithography, corrosion, cleaning, and ion implantation. In the wafer production process, the performance of photoresist has an important impact on the quality and performance of semiconductor devices. Therefore, a wafer automation production control system and method is needed.

[0003] Prior art, such as the invention patent application with announcement number CN102496586A, discloses a method for detecting photoresist defects, comprising: providing a semiconductor wafer and coating it with photoresist; performing a pre-test on the photoresist, counting the number of defects, and obtaining a pre-value; baking the semiconductor wafer coated with photoresist according to reference time and reference temperature parameters; performing a post-test on the photoresist, counting the number of defects, and obtaining a post-value; comparing the pre-value and the post-value to determine whether the photoresist is qualified. The reference time and reference temperature are determined by a parameter determination experiment. The method for detecting photoresist defects of the present invention is fast and effective, saves time, and greatly saves the entire process cost and shortens the process cycle.

[0004] In view of the above scheme, the applicant of the present invention has found that the above technology has at least the following technical problems: 1. The above technology needs to carry out baking experiments at reference time and reference temperature. The operation depends on the setting and adjustment of experimental parameters, and it is impossible to realize automated production control and automated adjustment of wafers. There is a lack of a special system to monitor the performance parameters of the photoresist in real time, and it is impossible to analyze and judge the aging situation in time, which easily leads to the occurrence of aged photoresist in the production process and cannot be dealt with immediately. It only targets photoresist defects, and the judgment is not accurate and reliable enough. The treatment plan for aged photoresist is not clear and scientific enough, and it is impossible to effectively delay or avoid the aging problem of photoresist.

[0005] 2. The above technology mainly judges whether the photoresist is qualified based on the comparison of the measurement data before and after. It lacks intelligent analysis and optimization capabilities, and cannot perform intelligent processing and optimization adjustments for different situations. It lacks the ability to provide timely early warnings for photoresist aging, resulting in an increased risk of production abnormalities or shutdowns, affecting production plans and efficiency. For aged photoresists that require optimization of process parameters, it lacks systematic analysis and adjustment capabilities and cannot effectively optimize and adjust process parameters. At the same time, the lack of intelligent photoresist aging monitoring and processing systems will reduce the level of production automation, increase labor management costs, and affect production efficiency and management efficiency. Summary of the invention

[0006] In view of the above-mentioned technical deficiencies, the object of the present invention is to provide a wafer automation production control system and method.

[0007] In order to solve the above technical problems, the present invention adopts the following technical solutions: In a first aspect, the present invention provides a wafer automation production control system, comprising:

[0008] Storage influence factor acquisition module: used to set several collection time points in the target enterprise's wafer production process, and collect the storage parameters corresponding to the photoresist in each wafer production equipment at each collection time point. The storage parameters include temperature, light intensity and humidity, and analyze and obtain the storage influence factors corresponding to the photoresist in each wafer production equipment at each collection time point;

[0009] Performance parameter acquisition module: used to collect the performance parameters corresponding to the photoresist in each wafer production equipment at each collection time point. The performance parameters include solubility, curing speed and swelling rate, and then analyze and obtain the performance evaluation coefficient corresponding to the photoresist in each wafer production equipment at each collection time point;

[0010] Aging condition judgment module: used to judge whether the photoresist in each wafer production equipment at each acquisition time point is aged according to the performance evaluation coefficient corresponding to the photoresist in each wafer production equipment at each acquisition time point, and record the photoresist in each wafer production equipment at each acquisition time point that is judged to be aged as each photoresist to be processed;

[0011] Processing scheme analysis module: used to analyze the aging treatment scheme corresponding to each photoresist to be processed according to the performance evaluation coefficient corresponding to each photoresist to be processed. The aging treatment scheme includes replacing the photoresist and optimizing the process parameters. When the aging treatment scheme corresponding to a photoresist to be processed is the optimized process parameters, the optimized process parameters corresponding to the photoresist to be processed are analyzed;

[0012] Early warning display module: used to display early warning when the photoresist in a wafer production equipment ages at a certain acquisition time point, and to display the optimized process parameters corresponding to each photoresist to be processed.

[0013] Preferably, the specific judging process of judging whether the photoresist in each wafer production equipment is aged at each acquisition time point is as follows:

[0014] The performance evaluation coefficient corresponding to the photoresist in each wafer production equipment at each collection time point is compared with the performance evaluation coefficient corresponding to the photoresist in the set standard wafer production equipment. If the performance evaluation coefficient corresponding to the photoresist in a wafer production equipment at a certain collection time point is less than the performance evaluation coefficient corresponding to the photoresist in the set standard wafer production equipment, it is determined that the photoresist in the wafer production equipment at the collection time point is aged. If the performance evaluation coefficient corresponding to the photoresist in a wafer production equipment at a certain collection time point is greater than or equal to the performance evaluation coefficient corresponding to the photoresist in the set standard wafer production equipment, it is determined that the photoresist in the wafer production equipment at the collection time point is not aged. In this way, it is determined whether the photoresist in each wafer production equipment at each collection time point is aged.

[0015] Preferably, the aging treatment scheme corresponding to each photoresist to be treated is analyzed, and the specific analysis process is as follows:

[0016] The performance evaluation coefficient corresponding to each photoresist to be processed is compared with the performance evaluation coefficient corresponding to the set standard aging treatment. If the performance evaluation coefficient corresponding to a photoresist to be processed is smaller than the performance evaluation coefficient corresponding to the set standard aging treatment, the aging treatment scheme corresponding to the photoresist to be processed is determined to be replacing the photoresist. If the performance evaluation coefficient corresponding to a photoresist to be processed is greater than or equal to the performance evaluation coefficient corresponding to the set standard aging treatment, the aging treatment scheme corresponding to the photoresist to be processed is determined to be optimizing process parameters. In this way, the aging treatment schemes corresponding to each photoresist to be processed are analyzed.

[0017] Preferably, the optimized process parameters corresponding to the photoresist to be processed are analyzed, and the specific analysis process is as follows:

[0018] The performance evaluation coefficient corresponding to the photoresist to be processed is compared with the performance evaluation coefficients corresponding to each optimized process parameter in the database. If the performance evaluation coefficient corresponding to the photoresist to be processed is the same as the performance evaluation coefficient corresponding to a certain optimized process parameter, the optimized process parameter in the database will be used as the optimized process parameter corresponding to the photoresist to be processed.

[0019] In a second aspect, the present invention provides a wafer automation production control method, comprising: step 1, obtaining a preservation influencing factor: setting a number of collection time points in the wafer production process of the target enterprise, and collecting the preservation parameters corresponding to the photoresist in each wafer production equipment at each collection time point, the preservation parameters including temperature, light intensity and humidity, and analyzing to obtain the preservation influencing factor corresponding to the photoresist in each wafer production equipment at each collection time point;

[0020] Step 2, obtaining performance parameters: collecting performance parameters corresponding to the photoresist in each wafer production equipment at each collection time point, the performance parameters including solubility, curing speed and swelling rate, and then analyzing to obtain the performance evaluation coefficient corresponding to the photoresist in each wafer production equipment at each collection time point;

[0021] Step 3, judging the aging condition: judging whether the photoresist in each wafer production equipment at each acquisition time point is aged according to the performance evaluation coefficient corresponding to the photoresist in each wafer production equipment at each acquisition time point, and recording the photoresist in each wafer production equipment at each acquisition time point that is judged to be aged as each photoresist to be processed;

[0022] Step 4, analysis of treatment schemes: according to the performance evaluation coefficients corresponding to the photoresists to be treated, the aging treatment schemes corresponding to the photoresists to be treated are analyzed. The aging treatment schemes include replacing the photoresists and optimizing the process parameters. When the aging treatment scheme corresponding to a photoresist to be treated is an optimized process parameter, the optimized process parameters corresponding to the photoresist to be treated are analyzed;

[0023] Step 5, early warning display: When the photoresist in a wafer production equipment ages at a certain collection time point, an early warning display is performed, and the optimized process parameters corresponding to each photoresist to be processed are also displayed.

[0024] The beneficial effects of the present invention are: 1. The present invention provides a wafer automation production control system and method. By saving an influencing factor acquisition module and a performance parameter acquisition module, the system can intelligently collect and analyze the storage parameters and performance parameters of the photoresist in the wafer production equipment, and realize intelligent management of the production process, thereby improving production efficiency, optimizing product quality, reducing production costs, and enhancing production safety. In addition, the processing solution analysis module can accurately analyze the corresponding aging treatment solution according to the performance evaluation coefficient of the photoresist, such as replacing the photoresist or optimizing the process parameters, thereby effectively solving the photoresist aging problem, timely judging the aging condition of the photoresist and taking treatment measures, which can reduce equipment maintenance costs, extend equipment life, and improve the stability and reliability of the production line.

[0025] 2. In the embodiment of the present invention, by preserving the influencing factor acquisition module and the performance parameter acquisition module, the system can comprehensively collect and analyze the storage conditions and performance parameters of the photoresist, help enterprises understand the key factors in the production process, judge whether the photoresist is aged according to the performance evaluation coefficient, and issue early warnings in time to help enterprises take necessary measures before the photoresist ages, avoid production interruptions and quality problems, help control production costs, avoid production quality problems caused by aging photoresist, and improve product quality and production efficiency.

[0026] 3. In the embodiment of the present invention, through the aging condition judgment module, the system can determine the aged photoresist and mark the photoresist to be processed, and then analyze the aging treatment plan, including replacing the photoresist and optimizing the process parameters, and provide intelligent processing options. Timely replacement of aged photoresist can reduce damage or corrosion to production equipment, extend the service life of equipment, reduce maintenance and repair costs, avoid increased product scrap rate due to photoresist aging, improve production efficiency, save production costs, and adopt targeted aging treatment plans to help enterprises more accurately deal with the problem of aged photoresist, improve production efficiency, and reduce production line downtime. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0028] Figure 1 It is a schematic diagram of the connection of the system modules of the present invention.

[0029] Figure 2 It is a flow chart of the steps for implementing the method of the present invention; DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] Embodiments of the present invention Figure 1 As shown, a wafer automation production control system includes: a storage influencing factor acquisition module, a performance parameter acquisition module, an aging condition judgment module, a processing solution analysis module, an early warning display module and a database.

[0032] The performance parameter acquisition module is connected to the storage influencing factor acquisition module and the aging condition judgment module respectively, the processing scheme analysis module is connected to the aging condition judgment module and the early warning display module respectively, the early warning display module is also connected to the aging condition judgment module, and the database is connected to the processing scheme analysis module.

[0033] Preservation influencing factor acquisition module: used to set several collection time points in the target enterprise's wafer production process, and collect the preservation parameters corresponding to the photoresist in each wafer production equipment at each collection time point. The preservation parameters include temperature, light intensity and humidity. The preservation influencing factors corresponding to the photoresist in each wafer production equipment at each collection time point are analyzed.

[0034] It should be noted that temperature sensors, light intensity sensors and humidity sensors are installed in the photoresist holding area corresponding to the target enterprise's wafer production equipment, and the temperature, light intensity and humidity corresponding to the photoresist in each wafer production equipment are collected through the temperature sensors, light intensity sensors and humidity sensors.

[0035] In a specific embodiment, the analysis obtains the preservation impact factor corresponding to the photoresist in each wafer production equipment at each acquisition time point, and the specific analysis process is as follows:

[0036] The temperature, light intensity and humidity corresponding to the photoresist in each wafer production equipment at each acquisition time point are recorded as and Among them, g represents the number corresponding to each acquisition time point, g = 1, 2...m, m is any integer greater than 2, h represents the number corresponding to each wafer production equipment, h = 1, 2...n, n is any integer greater than 2, substitute into the calculation formula

[0037]

[0038] The preservation impact factor corresponding to the photoresist in the h-th wafer production equipment at the g-th acquisition time point is obtained Among them, Q′, W′, and E′ are respectively the standard temperature, standard light intensity, and standard humidity corresponding to the photoresist in the set wafer production equipment, μ1, μ2, and μ3 are respectively the weight factors corresponding to the photoresist temperature, the weight factors corresponding to the light intensity, and the weight factors corresponding to the humidity in the set wafer production equipment, and ΔQ, ΔW, and ΔE are respectively the photoresist temperature difference, the photoresist light intensity difference, and the photoresist humidity difference in the set licensed wafer production equipment.

[0039] It should be noted that μ1, μ2, and μ3 are all greater than 0 and less than 1.

[0040] It should also be noted that through the summary of a large amount of research data and experimental data, the standard temperature, standard light intensity, and standard humidity corresponding to the photoresist in the wafer production equipment are set according to professional institutions and research institutions, based on the professional knowledge and research basis of experts in the field, and discussed and confirmed with industry organizations or professional institutions. Experts set the weight factors corresponding to the temperature of the photoresist in the wafer production equipment, the weight factors corresponding to the light intensity, and the weight factors corresponding to the humidity based on their own experience and knowledge, and set the temperature difference of the photoresist in the licensed wafer production equipment, the light intensity difference of the photoresist in the licensed wafer production equipment, and the humidity difference of the photoresist in the licensed wafer production equipment.

[0041] Performance parameter acquisition module: used to collect the performance parameters corresponding to the photoresist in each wafer production equipment at each collection time point. The performance parameters include solubility, curing speed and swelling rate, and then analyze to obtain the performance evaluation coefficient corresponding to the photoresist in each wafer production equipment at each collection time point.

[0042] In a specific embodiment, the performance parameters corresponding to the photoresist in each wafer production equipment are collected at each collection time point, and the specific collection process is as follows:

[0043] A1. Install sensors in the target company's wafer production equipment, including solubility meters, curing speed testers and swelling rate testers;

[0044] A2. By installing solubility meters, curing speed testers and swelling rate detectors on the target company's wafer production equipment, the solubility, curing speed and swelling rate of the photoresist in each wafer production equipment are collected at each collection time point.

[0045] In another specific embodiment, the analysis obtains the performance evaluation coefficient corresponding to the photoresist in each wafer production equipment at each acquisition time point, and the specific analysis process is as follows:

[0046] The solubility, curing speed and swelling rate of the photoresist in each wafer production equipment at each acquisition time point are recorded as and Substitute into the calculation formula The performance evaluation coefficient corresponding to the photoresist in the h-th wafer production equipment at the k-th acquisition time point is obtained. Among them, R′, T′, and Y′ are the standard solubility, standard curing speed, and standard swelling rate of the photoresist in the set wafer production equipment, respectively; υ1, υ2, and υ3 are the weight factors corresponding to the solubility of the photoresist, the weight factors corresponding to the curing speed, and the weight factors corresponding to the swelling rate in the set wafer production equipment, respectively; and e is naturally a constant.

[0047] It should be noted that υ1, υ2, and υ3 are all greater than 0 and less than 1.

[0048] It should also be noted that through the summary of a large amount of research data and experimental data, the standard solubility, standard curing speed, and standard swelling rate corresponding to the photoresist in the wafer production equipment are set according to professional institutions and research institutions, based on the professional knowledge and research basis of experts in the field, and discussed and confirmed with industry organizations or professional institutions. The weight factors corresponding to the solubility of the photoresist in the wafer production equipment, the weight factors corresponding to the curing speed, and the weight factors corresponding to the swelling rate are set by experts based on their own experience and knowledge.

[0049] Aging condition judgment module: It is used to judge whether the photoresist in each wafer production equipment at each collection time point is aged according to the performance evaluation coefficient corresponding to the photoresist in each wafer production equipment at each collection time point, and record the photoresist in each wafer production equipment at each collection time point that is judged to be aged as each photoresist to be processed.

[0050] In a specific embodiment, the determination of whether the photoresist in each wafer production device is aged at each acquisition time point is performed in the following specific determination process:

[0051] The performance evaluation coefficient corresponding to the photoresist in each wafer production equipment at each collection time point is compared with the performance evaluation coefficient corresponding to the photoresist in the set standard wafer production equipment. If the performance evaluation coefficient corresponding to the photoresist in a wafer production equipment at a certain collection time point is less than the performance evaluation coefficient corresponding to the photoresist in the set standard wafer production equipment, it is determined that the photoresist in the wafer production equipment at the collection time point is aged. If the performance evaluation coefficient corresponding to the photoresist in a wafer production equipment at a certain collection time point is greater than or equal to the performance evaluation coefficient corresponding to the photoresist in the set standard wafer production equipment, it is determined that the photoresist in the wafer production equipment at the collection time point is not aged. In this way, it is determined whether the photoresist in each wafer production equipment at each collection time point is aged.

[0052] According to the embodiment of the present invention, by preserving the influencing factor acquisition module and the performance parameter acquisition module, the system can comprehensively collect and analyze the storage conditions and performance parameters of the photoresist, help enterprises understand the key factors in the production process, judge whether the photoresist is aged according to the performance evaluation coefficient, and issue early warnings in time to help enterprises take necessary measures before the photoresist ages, avoid production interruptions and quality problems, help control production costs, avoid production quality problems caused by aged photoresist, and improve product quality and production efficiency.

[0053] Processing scheme analysis module: used to analyze the aging treatment scheme corresponding to each photoresist to be processed according to the performance evaluation coefficient corresponding to each photoresist to be processed. The aging treatment scheme includes replacing the photoresist and optimizing the process parameters. When the aging treatment scheme corresponding to a photoresist to be processed is the optimized process parameters, the optimized process parameters corresponding to the photoresist to be processed are analyzed.

[0054] It should be noted that optimizing process parameters includes optimizing and adjusting parameters such as development time, exposure energy, temperature and humidity.

[0055] In a specific embodiment, the aging treatment scheme corresponding to each photoresist to be treated is analyzed, and the specific analysis process is as follows:

[0056] The performance evaluation coefficient corresponding to each photoresist to be processed is compared with the performance evaluation coefficient corresponding to the set standard aging treatment. If the performance evaluation coefficient corresponding to a photoresist to be processed is smaller than the performance evaluation coefficient corresponding to the set standard aging treatment, the aging treatment scheme corresponding to the photoresist to be processed is determined to be replacing the photoresist. If the performance evaluation coefficient corresponding to a photoresist to be processed is greater than or equal to the performance evaluation coefficient corresponding to the set standard aging treatment, the aging treatment scheme corresponding to the photoresist to be processed is determined to be optimizing process parameters. In this way, the aging treatment schemes corresponding to each photoresist to be processed are analyzed.

[0057] In another specific embodiment, the optimized process parameters corresponding to the photoresist to be processed are analyzed, and the specific analysis process is as follows:

[0058] The performance evaluation coefficient corresponding to the photoresist to be processed is compared with the performance evaluation coefficients corresponding to each optimized process parameter in the database. If the performance evaluation coefficient corresponding to the photoresist to be processed is the same as the performance evaluation coefficient corresponding to a certain optimized process parameter, the optimized process parameter in the database will be used as the optimized process parameter corresponding to the photoresist to be processed.

[0059] In the embodiment of the present invention, through the aging condition judgment module, the system can determine the aged photoresist and mark the photoresist to be processed, and then analyze the aging treatment plan, including replacing the photoresist and optimizing the process parameters, and provide intelligent treatment options. Timely replacement of aged photoresist can reduce damage or corrosion to production equipment, extend the service life of equipment, reduce maintenance and repair costs, avoid increased product scrap rate due to photoresist aging, improve production efficiency, save production costs, and adopt targeted aging treatment plans to help enterprises more accurately deal with the problem of aged photoresist, improve production efficiency, and reduce production line downtime.

[0060] Early warning display module: used to display early warning when the photoresist in a wafer production equipment ages at a certain acquisition time point, and to display the optimized process parameters corresponding to each photoresist to be processed.

[0061] In a specific embodiment, the database is used to store the performance evaluation coefficient corresponding to each optimized process parameter.

[0062] Embodiments of the present invention Figure 2As shown, a wafer automation production control method includes:

[0063] Step 1: Acquisition of preservation influencing factors: several collection time points are set in the target enterprise's wafer production process, and the preservation parameters corresponding to the photoresist in each wafer production equipment are collected at each collection time point. The preservation parameters include temperature, light intensity and humidity, and the preservation influencing factors corresponding to the photoresist in each wafer production equipment at each collection time point are obtained by analysis;

[0064] Step 2, obtaining performance parameters: collecting performance parameters corresponding to the photoresist in each wafer production equipment at each collection time point, the performance parameters including solubility, curing speed and swelling rate, and then analyzing to obtain the performance evaluation coefficient corresponding to the photoresist in each wafer production equipment at each collection time point;

[0065] Step 3, judging the aging condition: judging whether the photoresist in each wafer production equipment at each acquisition time point is aged according to the performance evaluation coefficient corresponding to the photoresist in each wafer production equipment at each acquisition time point, and recording the photoresist in each wafer production equipment at each acquisition time point that is judged to be aged as each photoresist to be processed;

[0066] Step 4, analysis of treatment schemes: according to the performance evaluation coefficients corresponding to the photoresists to be treated, the aging treatment schemes corresponding to the photoresists to be treated are analyzed. The aging treatment schemes include replacing the photoresists and optimizing the process parameters. When the aging treatment scheme corresponding to a photoresist to be treated is an optimized process parameter, the optimized process parameters corresponding to the photoresist to be treated are analyzed;

[0067] Step 5, early warning display: When the photoresist in a wafer production equipment ages at a certain collection time point, an early warning display is performed, and the optimized process parameters corresponding to each photoresist to be processed are also displayed.

[0068] The present invention provides a wafer automated production control system and method. By storing an influencing factor acquisition module and a performance parameter acquisition module, the system can intelligently collect and analyze storage parameters and performance parameters of photoresists in wafer production equipment, realize intelligent management of the production process, and thereby improve production efficiency, optimize product quality, reduce production costs, and enhance production safety. Furthermore, through a processing solution analysis module, a corresponding aging processing solution can be accurately analyzed according to the performance evaluation coefficient of the photoresist, such as replacing the photoresist or optimizing the process parameters, thereby effectively solving the photoresist aging problem, timely judging the aging condition of the photoresist and taking processing measures, which can reduce equipment maintenance costs, extend equipment life, and improve the stability and reliability of the production line.

[0069] The above contents are merely examples and explanations of the concept of the present invention. Those skilled in the art may make various modifications or additions to the specific embodiments described or replace them in a similar manner. As long as they do not deviate from the concept of the invention or exceed the scope defined in this specification, they shall all fall within the protection scope of the present invention.

Claims

1. A wafer automation production control system, characterized in that: include: Storage influence factor acquisition module: used to set several collection time points in the target enterprise's wafer production process, and collect the storage parameters corresponding to the photoresist in each wafer production equipment at each collection time point. The storage parameters include temperature, light intensity and humidity, and analyze and obtain the storage influence factors corresponding to the photoresist in each wafer production equipment at each collection time point; Performance parameter acquisition module: used to collect the performance parameters corresponding to the photoresist in each wafer production equipment at each collection time point. The performance parameters include solubility, curing speed and swelling rate, and then analyze and obtain the performance evaluation coefficient corresponding to the photoresist in each wafer production equipment at each collection time point; Aging condition judgment module: used to judge whether the photoresist in each wafer production equipment at each acquisition time point is aged according to the performance evaluation coefficient corresponding to the photoresist in each wafer production equipment at each acquisition time point, and record the photoresist in each wafer production equipment at each acquisition time point that is judged to be aged as each photoresist to be processed; Processing scheme analysis module: used to analyze the aging treatment scheme corresponding to each photoresist to be processed according to the performance evaluation coefficient corresponding to each photoresist to be processed. The aging treatment scheme includes replacing the photoresist and optimizing the process parameters. When the aging treatment scheme corresponding to a photoresist to be processed is the optimized process parameters, the optimized process parameters corresponding to the photoresist to be processed are analyzed; Early warning display module: used to display early warning when the photoresist in a wafer production equipment ages at a certain acquisition time point, and to display the optimized process parameters corresponding to each photoresist to be processed; The analysis obtains the preservation impact factor corresponding to the photoresist in each wafer production equipment at each acquisition time point. The specific analysis process is as follows: The temperature, light intensity and humidity corresponding to the photoresist in each wafer production equipment at each acquisition time point are recorded as and Among them, g represents the number corresponding to each acquisition time point, g = 1, 2...m, m is any integer greater than 2, h represents the number corresponding to each wafer production equipment, h = 1, 2...n, n is any integer greater than 2, substitute into the calculation formula The preservation impact factor corresponding to the photoresist in the h-th wafer production equipment at the g-th acquisition time point is obtained Among them, Q′, W′, and E′ are respectively the standard temperature, standard light intensity, and standard humidity corresponding to the photoresist in the set wafer production equipment, μ1, μ2, and μ3 are respectively the weight factors corresponding to the photoresist temperature, the weight factors corresponding to the light intensity, and the weight factors corresponding to the humidity in the set wafer production equipment, and ΔQ, ΔW, and ΔE are respectively the photoresist temperature difference, the photoresist light intensity difference, and the photoresist humidity difference in the set licensed wafer production equipment.

2. A wafer automation production control system as claimed in claim 1, characterized in that: The performance parameters corresponding to the photoresist in each wafer production equipment are collected at each collection time point, and the specific collection process is as follows: A1. Install sensors in the target company's wafer production equipment, including solubility meters, curing speed testers and swelling rate testers; A2. By installing solubility meters, curing speed testers and swelling rate detectors on the target company's wafer production equipment, the solubility, curing speed and swelling rate of the photoresist in each wafer production equipment are collected at each collection time point.

3. A wafer automation production control system as claimed in claim 2, characterized in that: The analysis obtains the performance evaluation coefficient corresponding to the photoresist in each wafer production equipment at each acquisition time point. The specific analysis process is as follows: The solubility, curing speed and swelling rate of the photoresist in each wafer production equipment at each acquisition time point are recorded as and Substitute into the calculation formula The performance evaluation coefficient corresponding to the photoresist in the h-th wafer production equipment at the k-th acquisition time point is obtained. Among them, R′, T′, and Y′ are the standard solubility, standard curing speed, and standard swelling rate of the photoresist in the set wafer production equipment, respectively; υ1, υ2, and υ3 are the weight factors corresponding to the solubility of the photoresist, the weight factors corresponding to the curing speed, and the weight factors corresponding to the swelling rate in the set wafer production equipment, respectively; and e is naturally a constant.

4. A wafer automation production control system as claimed in claim 3, characterized in that: The specific judgment process of judging whether the photoresist in each wafer production equipment is aged at each acquisition time point is as follows: The performance evaluation coefficient corresponding to the photoresist in each wafer production equipment at each collection time point is compared with the performance evaluation coefficient corresponding to the photoresist in the set standard wafer production equipment. If the performance evaluation coefficient corresponding to the photoresist in a wafer production equipment at a certain collection time point is less than the performance evaluation coefficient corresponding to the photoresist in the set standard wafer production equipment, it is determined that the photoresist in the wafer production equipment at the collection time point is aged. If the performance evaluation coefficient corresponding to the photoresist in a wafer production equipment at a certain collection time point is greater than or equal to the performance evaluation coefficient corresponding to the photoresist in the set standard wafer production equipment, it is determined that the photoresist in the wafer production equipment at the collection time point is not aged. In this way, it is determined whether the photoresist in each wafer production equipment at each collection time point is aged.

5. A wafer automation production control system as claimed in claim 4, characterized in that: The aging treatment scheme corresponding to each photoresist to be treated is analyzed, and the specific analysis process is as follows: The performance evaluation coefficient corresponding to each photoresist to be processed is compared with the performance evaluation coefficient corresponding to the set standard aging treatment. If the performance evaluation coefficient corresponding to a photoresist to be processed is smaller than the performance evaluation coefficient corresponding to the set standard aging treatment, the aging treatment scheme corresponding to the photoresist to be processed is determined to be replacing the photoresist. If the performance evaluation coefficient corresponding to a photoresist to be processed is greater than or equal to the performance evaluation coefficient corresponding to the set standard aging treatment, the aging treatment scheme corresponding to the photoresist to be processed is determined to be optimizing process parameters. In this way, the aging treatment schemes corresponding to each photoresist to be processed are analyzed.

6. A wafer automation production control system as claimed in claim 5, characterized in that: The optimized process parameters corresponding to the photoresist to be processed are analyzed, and the specific analysis process is as follows: The performance evaluation coefficient corresponding to the photoresist to be processed is compared with the performance evaluation coefficients corresponding to each optimized process parameter in the database. If the performance evaluation coefficient corresponding to the photoresist to be processed is the same as the performance evaluation coefficient corresponding to a certain optimized process parameter, the optimized process parameter in the database will be used as the optimized process parameter corresponding to the photoresist to be processed.

7. A wafer automation production control system as claimed in claim 1, characterized in that: It also includes a database, which is used to store the performance evaluation coefficients corresponding to each optimized process parameter.

8. A wafer automation production control method for executing the wafer automation production control system according to any one of claims 1 to 7, characterized in that: include: Step 1: Acquisition of preservation influencing factors: several collection time points are set in the target enterprise's wafer production process, and the preservation parameters corresponding to the photoresist in each wafer production equipment are collected at each collection time point. The preservation parameters include temperature, light intensity and humidity, and the preservation influencing factors corresponding to the photoresist in each wafer production equipment at each collection time point are obtained by analysis; Step 2, obtaining performance parameters: collecting performance parameters corresponding to the photoresist in each wafer production equipment at each collection time point, the performance parameters including solubility, curing speed and swelling rate, and then analyzing to obtain the performance evaluation coefficient corresponding to the photoresist in each wafer production equipment at each collection time point; Step 3, judging the aging condition: judging whether the photoresist in each wafer production equipment at each acquisition time point is aged according to the performance evaluation coefficient corresponding to the photoresist in each wafer production equipment at each acquisition time point, and recording the photoresist in each wafer production equipment at each acquisition time point that is judged to be aged as each photoresist to be processed; Step 4, analysis of treatment schemes: according to the performance evaluation coefficients corresponding to the photoresists to be treated, the aging treatment schemes corresponding to the photoresists to be treated are analyzed. The aging treatment schemes include replacing the photoresists and optimizing the process parameters. When the aging treatment scheme corresponding to a photoresist to be treated is an optimized process parameter, the optimized process parameters corresponding to the photoresist to be treated are analyzed; Step 5, early warning display: When the photoresist in a wafer production equipment ages at a certain collection time point, an early warning display is performed, and the optimized process parameters corresponding to each photoresist to be processed are also displayed.

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