Silicon carbide wafer film bonding equipment

Abstract

The present invention provides a silicon carbide wafer film pasting device, which belongs to the field of semiconductor processing, and includes a base, a flap, a reel and a cutting mechanism. The base is provided with a carrier for placing a wafer, the flap is rotatably mounted on the base, and is used to expose or cover the carrier. The reel is provided on the base, and a UV film for attaching the wafer is wound on the reel. The cutting mechanism includes a power member, a driving shaft, a plurality of driven shafts, a first cutter and a plurality of second cutters. The power member is connected to the driving shaft by transmission, and the driving shaft is connected to the plurality of driven shafts by transmission members at the same time. The first cutter is used to be detachably connected to the driving shaft, and the plurality of second cutters are used to be detachably connected to the plurality of driven shafts in a one-to-one correspondence. The cutting diameter of the first cutter is greater than the cutting diameter of the second cutter. The present silicon carbide wafer pasting device can be adapted to wafers of different sizes by providing cutters with different cutting diameters, and has the characteristics of wide application range and strong practicality.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor processing, and in particular to a silicon carbide wafer film attaching device. Background Art

[0002] Existing silicon carbide wafers need to be coated before polishing. For example, if the carbon surface of the silicon carbide wafer is to be polished, the silicon surface of the silicon carbide wafer needs to be coated first, and vice versa.

[0003] However, the film laminating machine used for laminating silicon carbide wafers in the prior art can only laminat silicon carbide wafers of one size, and wafers of different sizes require film laminating machines of different specifications to process, that is, there is a problem of narrow application range. Summary of the invention

[0004] The object of the present invention is to provide a silicon carbide wafer film bonding device, which can bond films to wafers of different sizes and has the characteristics of a wide range of applications.

[0005] The embodiment of the present invention is achieved as follows:

[0006] The present invention provides a silicon carbide wafer film attaching device, comprising:

[0007] A base, wherein the base is provided with a carrier for placing a wafer;

[0008] A flip cover is rotatably mounted on the base to expose or cover the carrier;

[0009] A reel, which is arranged on a base and on which a UV film for attaching wafers is wound;

[0010] The cutting mechanism comprises a power member, a driving shaft, a plurality of driven shafts, a first cutter and a plurality of second cutters, the power member is fixedly mounted on the flip cover, the driving shaft and the plurality of driven shafts are rotatably mounted on the flip cover, the power member is transmission-connected to the driving shaft, the driving shaft is transmission-connected to the plurality of driven shafts at the same time through the transmission member, the first cutter is used to be detachably connected to the driving shaft, the plurality of second cutters are used to be detachably connected to the plurality of driven shafts in a one-to-one correspondence, and the cutting diameter of the first cutter is greater than the cutting diameter of the second cutter;

[0011] When the first tool is connected to the driving shaft, the multiple second tools are not connected to the multiple driven shafts; when the multiple second tools are connected to the multiple driven shafts one by one, the first tool is not connected to the driving shaft.

[0012] In an optional embodiment, the transmission member is a double-sided synchronous belt, and the double-sided synchronous belt is simultaneously sleeved on the driving shaft and multiple driven shafts.

[0013] In an optional embodiment, the driving shaft contacts the outer wall of the double-sided synchronous belt, and the plurality of driven shafts contact the inner walls of the double-sided synchronous belt respectively.

[0014] In an optional embodiment, a plurality of driven shafts are evenly spaced and arranged around the driving shaft.

[0015] In an optional embodiment, the first tool and the second tool each include a connecting head, a rotating rod and a cutting knife. The connecting head of the first tool is used for detachable connection with the driving shaft, and the connecting head of the second tool is used for detachable connection with the driven shaft. The rotating rod is fixedly connected to the connecting head and the extension direction is perpendicular to the axis of the connecting head. The cutting knife is fixedly connected to the end of the rotating rod. The driving shaft can rotate under the drive of the power part, thereby driving multiple driven shafts to rotate, and then driving the first tool or multiple second tools to cut the UV film attached to the wafer. The length of the rotating rod of the first tool is greater than the length of the rotating rod of the second tool, so that the cutting diameter of the first tool is greater than the cutting diameter of the second tool.

[0016] In an optional embodiment, the connector is connected to the midpoint of the rotating rod, and there are two cutting knives which are respectively connected to the two ends of the rotating rod.

[0017] In an optional embodiment, the power component is a motor, and the output shaft of the motor is fixedly connected to the driving shaft.

[0018] In an optional embodiment, a detection member for detecting the position of the flip cover is provided on the base, the detection member is electrically connected to a controller, the controller is connected to the motor, and the controller is used to control the motor to be unable to operate when the flip cover is exposed from the carrier.

[0019] In an optional embodiment, the power member is a hand wheel, and the rotating shaft of the hand wheel is fixedly connected to the driving shaft.

[0020] In an optional embodiment, the silicon carbide wafer film pasting device also includes a first iron ring and a second iron ring, the first iron ring is provided with a first accommodating groove, the second iron ring is provided with a second accommodating groove, the first accommodating groove and the second accommodating groove are respectively used to accommodate wafers of different sizes, and the carrier is provided with a positioning groove for selectively installing the first iron ring or the second iron ring, when the first iron ring is installed in the positioning groove and the flip cover covers the carrier, the axis of the driving shaft coincides with the axis of the first accommodating groove, when the second iron ring is installed in the positioning groove and the flip cover covers the carrier, the axis of the driven shaft coincides with the axis of the second accommodating groove.

[0021] The beneficial effects of the embodiments of the present invention include:

[0022] The silicon carbide wafer film pasting device includes a base, a flap, a reel and a cutting mechanism. The base is provided with a carrier for placing the wafer. The flap is rotatably mounted on the base to expose or cover the carrier. The reel is arranged on the base, and a UV film for attaching the wafer is wound on the reel. The cutting mechanism includes a power member, a driving shaft, a plurality of driven shafts, a first cutter and a plurality of second cutters. The power member is connected to the driving shaft by transmission. The driving shaft is connected to the plurality of driven shafts by transmission members at the same time. The first cutter is used to be detachably connected to the driving shaft. The plurality of second cutters are used to be detachably connected to the plurality of driven shafts in a one-to-one correspondence. The cutting diameter of the first cutter is greater than the cutting diameter of the second cutter. The silicon carbide wafer pasting device is provided with cutters of different cutting diameters, so that the user can selectively install the first cutter or the second cutter according to the size of the wafer. The first cutter is for cutting films of large-sized wafers, and the second cutter is for cutting films of small-sized wafers, that is, it can be adapted to wafers of different sizes, and has the characteristics of wide application range and strong practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0024] Figure 1 A schematic diagram of the structure of a silicon carbide wafer film attaching device provided by an embodiment of the present invention;

[0025] Figure 2 A transmission schematic diagram of a driving shaft and a plurality of driven shafts when a first tool is installed provided in an embodiment of the present invention;

[0026] Figure 3 A transmission schematic diagram of a driving shaft and a plurality of driven shafts when a second tool is installed provided in an embodiment of the present invention;

[0027] Figure 4 A schematic diagram of a large-size wafer after film bonding provided by an embodiment of the present invention;

[0028] Figure 5 This is a schematic diagram of a small-sized wafer after film bonding provided by an embodiment of the present invention.

[0029] Icons: 100-base; 110-flip cover; 120-reel; 130-uv film; 140-carrier; 142-positioning slot; 150-detection piece; 200-cutting mechanism; 210-power piece; 220-driving shaft; 230-first tool; 232-connector; 234-rotating rod; 236-cutting knife; 240-driven shaft; 250-transmission piece; 260-second tool; 300-first iron ring; 310-first receiving slot; 400-second iron ring; 410-second receiving slot; 500-wafer. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0031] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0033] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the product of the invention is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0034] In addition, the terms "horizontal", "vertical" and the like do not mean that the components are required to be absolutely horizontal or suspended, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0035] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0036] The existing silicon carbide wafer needs to be placed in the receiving groove of the iron ring before polishing and film-laminated together. For example, if the carbon surface of the silicon carbide wafer needs to be polished, the silicon surface of the silicon carbide wafer needs to be film-laminated, and vice versa. However, the film laminating machine in the prior art can only realize the film laminating of a specific size of wafer, such as only 4-inch wafers, only 6-inch wafers, or only 8-inch wafers, etc., which has a narrow scope of application and is not very practical.

[0037] In view of the above situation, the present invention provides a silicon carbide wafer film laminating device, which provides two cutting tools with different cutting diameters. When in use, the user can choose to install different cutting tools according to the size of the wafer, thereby realizing film cutting and laminating for wafers of different sizes. It has the characteristics of wide application range and strong practicality.

[0038] The basic structure, working principle and technical effects of the silicon carbide wafer laminating device are described in detail below through embodiments and drawings.

[0039] Please refer to Figure 1 , Figure 2 and Figure 3The silicon carbide wafer film attaching device provided by the embodiment of the present invention includes a base 100, a flap 110, a reel 120 and a cutting mechanism 200. The base 100 is provided with a carrier 140 for placing a wafer 500, and the flap 110 is rotatably mounted on the base 100 to expose or cover the carrier 140. The reel 120 is provided on the base 100, and a UV film 130 for attaching the wafer 500 is wound on the reel 120. The cutting mechanism 200 includes a power member 210, a driving shaft 220, multiple driven shafts 240, a first tool 230 and multiple second tools 260. The power member 210 is fixedly installed on the flip cover 110. The driving shaft 220 and the multiple driven shafts 240 can be rotatably installed on the flip cover 110. The power member 210 is transmission-connected to the driving shaft 220. The driving shaft 220 is simultaneously transmission-connected to the multiple driven shafts 240 through a transmission member 250. The first tool 230 is used to be detachably connected to the driving shaft 220. The multiple second tools 260 are used to be detachably connected to the multiple driven shafts 240 in a one-to-one correspondence. The cutting diameter of the first tool 230 is greater than the cutting diameter of the second tool 260. When the first cutter 230 is connected to the driving shaft 220, the multiple second cutters 260 are not connected to the multiple driven shafts 240; when the multiple second cutters 260 are connected to the multiple driven shafts 240 one by one, the first cutter 230 is not connected to the driving shaft 220, that is, when the device is actually running, the first cutter 230 and the second cutter 260 are selectively installed according to the size of the wafer to be filmed, and will not be installed and used at the same time.

[0040] Among them, the power member 210 can adopt different structures as needed. In this embodiment, the power member 210 is a motor, and the output shaft of the motor is fixedly connected to the driving shaft 220 to realize the automatic operation of the cutting mechanism 200. In order to ensure the user's operation safety, in this embodiment, a detection member 150 for detecting the position of the flip cover 110 is provided on the carrier 140, and the detection member 150 is located on the side of the reel 120 away from the carrier 140. The detection member 150 is electrically connected to a controller, and the controller is connected to the motor. The controller is used to control the motor to be unable to operate when the flip cover 110 is exposed from the carrier 140, that is, the cutting mechanism 200 cannot operate when the flip cover 110 does not cover the carrier 140, so that the user can effectively avoid the safety hazard caused by the wrong operation of starting the motor.

[0041] The detection member 150 can adopt different structures as needed. In the present embodiment, the detection member 150 can be a micro switch. When the flip cover 110 covers the carrier 140, it is pressed against by the flip cover 110 to trigger a first signal so that the controller cannot control the motor to run. When the flip cover 110 exposes the carrier 140, it is released by the flip cover 110 to trigger a second signal, and the motor can start to run at this time.

[0042] It should be noted that, in other embodiments, the detection member 150 may also be a photoelectric sensor, which determines the position of the flip cover 110 by detecting the distance from the flip cover 110. In addition, in other embodiments, the power member 210 is a hand wheel, and the rotating shaft of the hand wheel is fixedly connected to the driving shaft 220. In this case, the hand wheel needs to be manually rotated to drive the driving shaft 220 to rotate, thereby driving the cutting mechanism 200 to operate.

[0043] The multiple driven shafts 240 can be arranged in different ways as needed. In this embodiment, in order to improve the utilization of the space inside the flip cover 110, the multiple driven shafts 240 are evenly spaced around the driving shaft 220. In detail, the number of the driven shafts 240 is 3, and the three driven shafts 240 are evenly spaced around the driving shaft 220, and the angle between any two driven shafts 240 is 120°.

[0044] The transmission member 250 can adopt different structural forms as needed. In this embodiment, in order to simplify the structure and ensure the stability of the transmission, the transmission member 250 is a double-sided synchronous belt, which is sleeved on the driving shaft 220 and the multiple driven shafts 240 at the same time. In detail, the driving shaft 220 and the multiple driven shafts 240 are sleeved with synchronous wheels, and the double-sided synchronous belt is sequentially wound around the synchronous wheels on the driving shaft 220 and the multiple driven shafts 240 to establish a transmission relationship between the driving shaft 220 and the multiple driven shafts 240.

[0045] In order to ensure the connection stability between the transmission member 250 and the driving shaft 220 and the multiple driven shafts 240, and to ensure that the power of the power member 210 can be stably transmitted to the multiple driven shafts 240 through the driving shaft 220, in this embodiment, the driving shaft 220 contacts the outer wall of the double-sided synchronous belt, and the multiple driven shafts 240 contact the inner wall of the double-sided synchronous belt respectively. That is, the outer wall of the double-sided synchronous belt meshes with the synchronous wheel on the driving shaft 220, and the inner wall of the double-sided synchronous belt meshes with the synchronous wheels of the multiple driven shafts 240. Such a setting can improve the installation stability of the transmission member 250 and ensure the transmission reliability of the cutting structure.

[0046] The first cutter 230 and the second cutter 260 can both adopt different structures as needed. In this embodiment, the first cutter 230 and the second cutter 260 both include a connector 232, a rotating rod 234, and a cutting knife 236. The connector 232 of the first cutter 230 is used to be detachably connected to the driving shaft 220, and the connector 232 of the second cutter 260 is used to be detachably connected to the driven shaft 240. There are many ways of detachable connection. In this embodiment, the detachable connection method includes but is not limited to screw connection or clamping.

[0047] The rotating rod 234 is fixedly connected to the connector 232 and its extension direction is perpendicular to the axis of the connector 232. The cutting knife 236 is fixedly connected to the end of the rotating rod 234. In this embodiment, the connector 232 is connected to the midpoint of the rotating rod 234, and there are two cutting knives 236, which are respectively connected to the two ends of the rotating rod 234. The driving shaft 220 can rotate under the drive of the power part 210, thereby driving the multiple driven shafts 240 to rotate, and then driving the first cutter 230 or the multiple second cutters 260 to cut the UV film 130 attached to the wafer 500. The two cutting knives 236 can be set so that the rotating rod 234 can rotate 180° to complete 360° cutting, thereby improving the cutting efficiency.

[0048] In other embodiments, the connector 232 can also be connected to one end of the rotating rod 234, and there is only one cutting knife 236 fixed to the other end of the rotating rod 234. In this way, the structure of the cutting mechanism 200 is relatively simpler, but the rotating rod 234 needs to rotate 360° to complete the cutting.

[0049] The length of the rotating rod 234 of the first tool 230 is greater than the length of the rotating rod 234 of the second tool 260, so that the cutting diameter of the first tool 230 is greater than the cutting diameter of the second tool 260, thereby adapting to the cutting of wafers 500 of different sizes. That is, in this embodiment, the basic structure of the first tool 230 and the second tool 260 is the same, but the length of the rotating rod 234 of the two is different, so the cutting diameter is different.

[0050] Furthermore, the silicon carbide wafer film bonding device also includes a first iron ring 300 and a second iron ring 400. The first iron ring 300 is provided with a first receiving groove 310, and the second iron ring 400 is provided with a second receiving groove 410. The first receiving groove 310 and the second receiving groove 410 are respectively used to accommodate wafers 500 of different sizes.

[0051] The carrier 140 is provided with a positioning groove 142 for selectively mounting the first iron ring 300 or the second iron ring 400. When the first iron ring 300 is mounted in the positioning groove 142 and the flip cover 110 covers the carrier 140, the axis of the driving shaft 220 coincides with the axis of the first receiving groove 310. When the second iron ring 400 is mounted in the positioning groove 142 and the flip cover 110 covers the carrier 140, the axis of the driven shaft 240 coincides with the axis of the second receiving groove 410. In this embodiment, the number of the second receiving grooves 410 is 3, and the axes of the three second receiving grooves 410 coincide with the axes of the three driven shafts 240 in a one-to-one correspondence.

[0052] The working principle and process of this silicon carbide wafer film bonding device are as follows:

[0053] The user may selectively install the first cutter 230 or the second cutter 260 according to the size of the wafer 500 to be laminated.

[0054] When a large-sized wafer 500 needs to be filmed, the flip cover 110 is opened to expose the carrier 140, and the first tool 230 is detachably mounted on the driving shaft 220 (see Figure 2 ), then install the first iron ring 300 in the positioning groove 142, and install the large-sized wafer 500 in the first receiving groove 310, then pull the UV film 130 on the reel 120 to adhere to the first iron ring 300 and the upper surface of the wafer 500 therein, then close the flip cover 110 to cover the carrier 140, and then start the motor, the motor drives the active shaft 220 to rotate, the active shaft 220 drives the connecting head 232 and the rotating rod 234 of the first tool 230 to rotate more than 180°, and then cut a circular UV film 130, the circular UV film 130 is attached to the large-sized wafer 500 and the upper surface of the matching first iron ring 300 (the diameter of the circular UV film 130 is generally slightly larger than the diameter of the first receiving groove 310, so as to completely cover the surface of the wafer 500, see Figure 4 Finally, the flip cover 110 is opened to expose the carrier 140, and the large-sized wafer 500 after film bonding and the matching first iron ring 300 are taken out to polish the wafer 500.

[0055] When a small-sized wafer 500 needs to be filmed, the flip cover 110 is opened to expose the carrier 140, and the three second cutters 260 are detachably mounted on the three driven shafts 240 (see Figure 3 ), then install the second iron ring 400 in the positioning groove 142, and install the three small-sized wafers 500 in the three second receiving grooves 410, then pull the UV film 130 on the reel 120 to adhere to the second iron ring 400 and the upper surface of the three wafers 500 therein, then close the flip cover 110 to cover the carrier 140, and then start the motor, the motor drives the active shaft 220 to rotate, the active shaft 220 drives the three driven shafts 240 to rotate, the driven shaft 240 drives the connecting head 232 and the rotating rod 234 of the second tool 260 to rotate more than 180°, and then three circular UV films 130 can be cut off, and the three circular UV films 130 are attached to the upper surfaces of the three wafers 500 and the matching second iron ring 400 (the diameter of each circular UV film 130 is generally slightly larger than the diameter of the second receiving groove 410 to completely cover the surface of the wafer 500, see Figure 5 ). Finally, the flip cover 110 is opened to expose the carrier 140, and the three small-sized wafers 500 after film bonding and the matching second iron ring 400 are taken out to polish the wafers 500.

[0056] The silicon carbide wafer laminating device is provided with tools with different cutting diameters, so that the user can selectively install the first tool 230 or the second tool 260 according to the size of the wafer 500. The first tool 230 is used to cut films for large-sized wafers 500, and the second tool 260 is used to cut films for small-sized wafers 500. That is, it can adapt to wafers 500 of different sizes, and has the characteristics of wide application range and strong practicality.

[0057] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A silicon carbide wafer film bonding device, characterized in that: include: A base (100), wherein the base (100) is provided with a carrier (140) for placing a wafer (500); A flip cover (110), the flip cover (110) being rotatably mounted on the base (100) and used to expose or cover the carrier (140); A reel (120), the reel (120) being arranged on the base (100), and a UV film (130) for attaching the wafer (500) being wound on the reel (120); A cutting mechanism (200), the cutting mechanism (200) comprising a power member (210), a driving shaft (220), a plurality of driven shafts (240), a first cutter (230) and a plurality of second cutters (260), the power member (210) being fixedly mounted on the flip cover (110), the driving shaft (220) and the plurality of driven shafts (240) being rotatably mounted on the flip cover (110), the power member (210) being transmission-connected to the driving shaft (220), the driving shaft (220) being transmission-connected to the plurality of driven shafts (240) at the same time via a transmission member (250), the first cutter (230) being used for being detachably connected to the driving shaft (220), the plurality of second cutters (260) being used for being detachably connected to the plurality of driven shafts (240) in a one-to-one correspondence, and the cutting diameter of the first cutter (230) being greater than the cutting diameter of the second cutter (260); When the first tool (230) is connected to the driving shaft (220), the multiple second tools (260) are not connected to the multiple driven shafts (240); when the multiple second tools (260) are connected to the multiple driven shafts (240) one by one, the first tool (230) is not connected to the driving shaft (220).

2. The silicon carbide wafer film attaching device according to claim 1, characterized in that: The transmission member (250) is a double-sided synchronous belt, and the double-sided synchronous belt is simultaneously sleeved on the driving shaft (220) and the plurality of driven shafts (240).

3. The silicon carbide wafer film attaching device according to claim 2, characterized in that: The driving shaft (220) contacts the outer wall of the double-sided synchronous belt, and the plurality of driven shafts (240) contact the inner walls of the double-sided synchronous belt respectively.

4. The silicon carbide wafer film attaching device according to claim 1, characterized in that: The plurality of driven shafts (240) are evenly spaced and arranged around the driving shaft (220).

5. The silicon carbide wafer film attaching device according to claim 1, characterized in that: The first tool (230) and the second tool (260) both comprise a connecting head (232), a rotating rod (234) and a cutting knife (236); the connecting head (232) of the first tool (230) is used to be detachably connected to the driving shaft (220); the connecting head (232) of the second tool (260) is used to be detachably connected to the driven shaft (240); the rotating rod (234) is fixedly connected to the connecting head (232) and its extension direction is perpendicular to the axis of the connecting head (232); the cutting knife (236) is connected to the rotating rod (234) and the cutting knife (236) is connected to the rotating rod (234). 4), the driving shaft (220) can rotate under the drive of the power member (210), thereby driving the multiple driven shafts (240) to rotate, and then driving the first tool (230) or the multiple second tools (260) to cut the UV film (130) attached to the wafer (500), and the length of the rotating rod (234) of the first tool (230) is greater than the length of the rotating rod (234) of the second tool (260), so that the cutting diameter of the first tool (230) is greater than the cutting diameter of the second tool (260).

6. The silicon carbide wafer film attaching device according to claim 5, characterized in that: The connecting head (232) is connected to the midpoint of the rotating rod (234), and there are two cutting knives (236) which are respectively connected to the two ends of the rotating rod (234).

7. The silicon carbide wafer film attaching device according to claim 1, characterized in that: The power component (210) is a motor, and the output shaft of the motor is fixedly connected to the driving shaft (220).

8. The silicon carbide wafer film attaching device according to claim 7, characterized in that: The base (100) is provided with a detection member (150) for detecting the position of the flip cover (110), the detection member (150) is electrically connected to a controller, the controller is connected to the motor, and the controller is used to control the motor to be unable to operate when the flip cover (110) is exposed from the carrier (140).

9. The silicon carbide wafer film attaching device according to claim 1, characterized in that: The power member (210) is a hand wheel, and the rotating shaft of the hand wheel is fixedly connected to the driving shaft (220).

10. The silicon carbide wafer film attaching device according to claim 1, characterized in that: The invention also comprises a first iron ring (300) and a second iron ring (400), wherein the first iron ring (300) is provided with a first receiving groove (310), and the second iron ring (400) is provided with a second receiving groove (410), wherein the first receiving groove (310) and the second receiving groove (410) are respectively used to receive wafers (500) of different sizes, and the carrier (140) is provided with a positioning groove for selectively installing the first iron ring (300) or the second iron ring (400). (142), when the first iron ring (300) is installed in the positioning groove (142) and the flap (110) covers the carrier (140), the axis of the active shaft (220) coincides with the axis of the first receiving groove (310); when the second iron ring (400) is installed in the positioning groove (142) and the flap (110) covers the carrier (140), the axis of the driven shaft (240) coincides with the axis of the second receiving groove (410).

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