Handling device, semiconductor device and loading method, unloading method

Abstract

The application provides a loading and unloading device, a semiconductor device and a loading method and an unloading method, relates to the technical field of crystal manufacturing, and is designed to solve the problem of excessively high height of the semiconductor device. The loading and unloading device comprises a mounting part, a first transfer mechanism capable of moving to a first set position to support a to-be-loaded object on a lower cover, at this time, the to-be-loaded object is partially located in a cavity body, and the first transfer mechanism can move away from the first set position, and a second transfer mechanism capable of carrying the to-be-loaded object to move back and forth in and out of a loading and unloading space, and supporting the to-be-loaded object for the lower cover when the to-be-loaded object is carried and moved to a second set position, and supporting the to-be-loaded object when the lower cover is moved to the second set position. The loading and unloading device provided by the application reduces the overall height of the crystal growth furnace and reduces the requirement for the height of the factory building.

Description

Loading and unloading devices, semiconductor equipment and loading and unloading methods Technical Field

[0001]

[0002] This invention relates to the field of crystal manufacturing technology, and more specifically, to a loading and unloading device, a semiconductor device, and a loading and unloading method. Background Technology

[0003]

[0004] Physical vapor transport (PVT) is one of the mainstream methods for preparing silicon carbide (SiC) crystals. In PVT, a SiC crystal is typically placed as a seed crystal at the top of a graphite thermal field, while Si and C powders are placed at the bottom. An induction coil is used for heating, reaching approximately 2300°C, and the growth temperature gradient is controlled. Argon gas is introduced to control the pressure in the growth chamber. During crystal growth, the seed crystal adheres to the upper part at a lower temperature, while the SiC powder source is at a higher temperature, creating a temperature gradient between them. During crystal growth, the powder sublimates and crystallizes on the cold-end seed crystal, thus obtaining a bulk SiC single crystal.

[0005] In the SiC single crystal growth process, the loading and unloading of the hot zone is a crucial step. With industry development, SiC single crystal growth technology is moving towards larger crystal sizes, requiring increasingly larger crucibles and hot zones. This necessitates continuously increasing equipment height to accommodate the hot zone loading, which is difficult to achieve in typical equipment workshops. Therefore, finding a convenient and safe way to load and unload the hot zone while minimizing equipment height is of paramount importance for large-size SiC crystal growth furnaces. Summary of the Invention

[0006]

[0007] The first objective of this invention is to provide a loading and unloading device to solve the technical problem of excessive height in existing semiconductor equipment.

[0008] The present invention provides a loading and unloading device, comprising: the loading and unloading device being applied to the semiconductor device; wherein the semiconductor device includes a chamber body and a lifting mechanism, the chamber body having a detachable lower cover, and a loading and unloading space below the chamber body; the lower cover being used to carry the object to be loaded and unloaded, and the lifting mechanism being located in the loading and unloading space for driving the lower cover of the chamber body to move up and down; the loading and unloading device includes:

[0009] Installation Department;

[0010] A first transfer mechanism, movably mounted on the mounting portion, is capable of moving to a first predetermined position in the loading / unloading space to support the object to be loaded on the lower cover, and is capable of moving away from the first predetermined position to be lifted and lowered by the lifting mechanism; wherein, when the object to be loaded is supported by the first transfer mechanism, a portion of the object to be loaded is located within the chamber body; and...

[0011] The second transfer mechanism is movably installed in the mounting part and is capable of carrying the object to be loaded to move back and forth in and out of the loading and unloading space; and when carrying the object to be loaded to the second set position of the loading and unloading space, the lower cover supports the object to be loaded.

[0012] The beneficial effects of the loading and unloading device of the present invention are:

[0013] By setting up a first transfer mechanism, during the process of the lifting mechanism raising the hot zone, the first transfer mechanism first supports the hot zone. After the lifting mechanism descends, the support column can be placed on the lifting mechanism, which then raises the support column, lifting the hot zone upwards and separating it from the first transfer mechanism. The first transfer mechanism then leaves the operating area of ​​the hot zone and the lifting mechanism. This eliminates the need for a support column on the lifting mechanism when placing the hot zone, thereby reducing the height of the loading and unloading space below the chamber body, thus reducing the overall height of the crystal growth furnace and lowering the requirements for plant height. After the lifting mechanism lifts the hot zone upwards and separates it from the first transfer mechanism via the support column, the first transfer mechanism leaves the operating area of ​​the hot zone and the lifting mechanism, so that the first transfer mechanism no longer affects the raising and lowering of the hot zone and the lifting mechanism. A second transfer mechanism can be set up to place the hot zone on external equipment such as overhead cranes, stackers, or forklifts, and then the second transfer mechanism can transport the hot zone into or out of the loading and unloading space. The operator does not need to manually move the hot zone to the lifting mechanism, which significantly reduces the workload of the operator and also significantly improves the safety of operation compared to manual loading and unloading.

[0014] In a preferred embodiment, the first transfer mechanism includes:

[0015] A first support member, configured to support the object to be loaded, has a first opening for a pallet to pass through vertically, the pallet being mounted on the lower cover; and...

[0016] A first transmission member is rotatably mounted on the mounting portion and connected to the first support member. The first transmission member is configured to drive the first support member to move to or away from the first set position.

[0017] In a preferred embodiment, the first support member includes a first C-shaped ring, the upper end of which has a first support surface, the first support surface being configured to vertically support the object to be loaded; the first C-shaped ring has a first limiting portion protruding from the first support surface, the first limiting portion being located at the edge of the first support surface, the first limiting portion being configured to restrict the lateral movement of the object to be loaded.

[0018] In a preferred embodiment, the first transmission member includes a first connecting arm, one end of which is rotatably connected to the mounting portion, and the first support member is fixedly connected to the other end of the first connecting arm.

[0019] In a preferred embodiment, the first transfer mechanism further includes a first transfer sensor, which is used to detect whether the first transmission component is located at a first predetermined position.

[0020] In a preferred embodiment, the loading and unloading device further includes a first controller and an upper loading position sensor electrically connected to the first controller; the upper loading position sensor is used to detect whether the lifting mechanism has moved to the upper loading position; the first controller is used to control the lifting mechanism to stop running when the upper loading position sensor detects that the lifting mechanism has moved to the upper loading position, and to control the first transfer mechanism to move to the first set position or leave from the first set position, so that the object to be loaded can be transferred between the lower cover or the first transfer mechanism.

[0021] In a preferred embodiment, the loading and unloading device further includes a lower loading position sensor electrically connected to the first controller; the lower loading position sensor is used to detect whether the lifting mechanism has moved to the lower loading position; the first controller is also used to control the lifting mechanism to stop operating when the lower loading position sensor detects that the lifting mechanism has moved to the lower loading position; wherein, the distance between the upper loading position and the lower limit position is greater than the height of the support column, and the support column is used to be placed on the lower cover so that the lower cover carries the object to be loaded through the support column.

[0022] In a preferred embodiment, the second transfer mechanism includes:

[0023] A second support member, configured to support the object to be loaded, has a second opening for a pallet to pass through vertically, the pallet being mounted on the lower cover; and...

[0024] The second transmission component is installed in the mounting portion and connected to the second support component. The second transmission component is configured to drive the second support component to move to or away from the second set position.

[0025] In a preferred embodiment, the second support member includes a second C-shaped ring, the upper end of which has a second support surface, the second support surface being configured to vertically support the object to be loaded; the second C-shaped ring has a second limiting portion protruding from the second support surface, the second limiting portion being located at the edge of the second support surface, the second limiting portion being configured to restrict the lateral movement of the object to be loaded.

[0026] In a preferred embodiment, the second transmission component includes a second connecting arm, one end of which is rotatably connected to the mounting portion, and the second support component is fixedly connected to the other end of the second connecting arm.

[0027] In a preferred embodiment, the second transfer mechanism further includes a second transfer sensor, which is used to detect whether the second transmission component is in a second set position. The second set position is located in the loading and unloading space and is located below the first set position.

[0028] In a preferred embodiment, the loading and unloading device further includes a second controller and an upper limit sensor electrically connected to the second controller; the upper limit sensor is used to detect whether the lifting mechanism has moved to the upper limit position; the second controller is used to control the lifting mechanism to stop rising when the upper limit sensor detects that the lifting mechanism has reached the upper limit position, so that the lower cover closes the chamber body.

[0029] In a preferred embodiment, the loading and unloading device further includes a lower limit sensor electrically connected to the second controller; the lower limit sensor is used to detect whether the lifting mechanism has moved to the lower limit; the second controller is also used to control the lifting mechanism to stop descending when the lower limit sensor detects that the lifting mechanism has reached the lower limit, wherein the lower limit is the lowest position at which the lifting mechanism is allowed to descend.

[0030] In a preferred embodiment, the semiconductor equipment is a crystal growth furnace, and the object to be loaded / unloaded is a thermal field.

[0031] The second objective of this invention is to provide a semiconductor device to solve the technical problem of excessively high crystal growth furnace height.

[0032] The semiconductor device provided by the present invention includes a chamber body, a lifting mechanism, and a loading / unloading device of any of the above. The loading / unloading space is formed below the chamber body, and the lifting mechanism is used to drive the lower cover to move up and down in the loading / unloading space.

[0033] By incorporating the aforementioned loading and unloading device into the semiconductor equipment, the semiconductor equipment thereby possesses all the advantages of the aforementioned loading and unloading device, which will not be elaborated upon here.

[0034] The third objective of this invention is to provide a loading method to solve the technical problem of excessively high crystal growth furnace height.

[0035] The loading method provided by the present invention is used to load an object to be loaded into the semiconductor device described above, the loading method comprising:

[0036] The object to be loaded is placed on the second transfer mechanism, and the second transfer mechanism is controlled to move to the second set position;

[0037] The lifting mechanism is controlled to drive the lower cover to support the object to be loaded;

[0038] Control the second transfer mechanism to leave the loading and unloading space;

[0039] The lifting mechanism is controlled to lift the lower cover to support the object to be loaded a set distance, so that the first transfer mechanism can support the object to be loaded when it moves to the first set position.

[0040] Control the first transfer mechanism to move to the first set position and support the object to be loaded;

[0041] Control the lifting mechanism to descend until the distance between the tray on the lower cover and the object to be loaded is greater than the height of the support column;

[0042] Place the support column on the tray;

[0043] The lifting mechanism is controlled to rise to the support column to support the object to be loaded; the first transfer mechanism is controlled to leave the first set position.

[0044] Control the lifting mechanism to rise until the lower cover closes the chamber body.

[0045] By adopting the above loading method, on the one hand, the second transfer mechanism can be used to move the object to be loaded into the loading and unloading space, thus eliminating the need for operators to perform such laborious and dangerous work, improving labor efficiency, and reducing the workload and danger for operators. On the other hand, during the process of the lifting mechanism carrying the object to be loaded into the chamber body, the object to be loaded can be moved to a certain height first, and then supported by the first transfer mechanism, allowing the lifting mechanism to descend to the lower loading position to place the support column. Therefore, it is not necessary to place the support column before placing the object to be loaded, reducing the height of the loading and unloading space, thereby reducing the overall height of the semiconductor equipment and lowering the requirements for the height of the factory building.

[0046] The fourth objective of this invention is to provide an unloading method to solve the technical problem of excessive height of semiconductor devices.

[0047] The unloading method provided by this invention is used to unload a load from the aforementioned semiconductor device.

[0048] The uninstallation method includes:

[0049] The lifting mechanism is controlled to lower the lower cover, supporting the object to be loaded, to a position where the first transfer mechanism can support the object when it moves to the first set position.

[0050] Control the first transfer mechanism to move to the first set position and support the object to be loaded;

[0051] Control the lifting mechanism to descend until the distance between the tray on the lower cover and the object to be loaded is greater than the height of the support column;

[0052] Remove the support column from the tray;

[0053] Control the lifting mechanism to rise until the lower cover supports the object to be loaded;

[0054] Control the first transfer mechanism to leave the first predetermined position;

[0055] The lifting mechanism is controlled to descend to a position where it can support the object to be loaded when the second transfer mechanism moves to the second set position.

[0056] The second transfer mechanism is controlled to move into the second predetermined position and support the object to be loaded;

[0057] Control the lifting mechanism to descend;

[0058] Control the second transfer mechanism to move it outside the loading space.

[0059] By employing the above method to control the loading and unloading of semiconductor equipment, on the one hand, the second transfer mechanism can be used to move the items out of the loading and unloading space, thus eliminating the need for operators to perform such laborious and dangerous work, improving labor efficiency, and reducing the workload and danger for operators. On the other hand, during the unloading process of the lifting mechanism carrying the items from the chamber body, the items can be moved to a certain height first, and then supported by the first transfer mechanism, allowing the lifting mechanism to descend to the lower loading position to remove the support column. Therefore, it is not necessary to remove the items before removing the support column, reducing the height of the loading and unloading space, thereby reducing the overall height of the semiconductor equipment and lowering the requirements for the factory building height. Attached Figure Description

[0060]

[0061] To more clearly illustrate the technical solutions in the embodiments or background art of the present invention, the drawings used in the description of the embodiments or background art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0062] Figure 1 is a schematic diagram of the crystal growth furnace mentioned in the related technology of this invention;

[0063] Figure 2 is a schematic diagram of the loading and unloading device provided in Embodiment 1 of the present invention applied to a crystal growth furnace;

[0064] Figure 3 is a schematic diagram of the structure of the first transfer mechanism in the loading and unloading device provided in Embodiment 1 of the present invention;

[0065] Figure 4 is a top view of the first transfer mechanism in the loading and unloading device provided in Embodiment 1 of the present invention;

[0066] Figure 5 is a schematic diagram of the structure of the second transfer mechanism in the loading and unloading device provided in Embodiment 1 of the present invention;

[0067] Figure 6 is a top view of the second transfer mechanism in the loading and unloading device provided in Embodiment 1 of the present invention;

[0068] Figure 7a is a schematic diagram of the state of the second transfer mechanism supporting the hot field outside the loading and unloading space in step S110 of the loading method provided in Embodiment 3 of the present invention.

[0069] Figure 7b is a schematic diagram of the state when the second transfer mechanism moves the thermal field to the second set position in step S110 of the loading method provided in Embodiment 3 of the present invention.

[0070] Figure 8 is a schematic diagram of the state of the lifting mechanism when it rises to the lower loading position in step S120 of the loading method provided in Embodiment 3 of the present invention;

[0071] Figure 9 is a schematic diagram of the state when the second transfer mechanism moves outside the loading and unloading space in step S130 of the loading method provided in Embodiment 3 of the present invention;

[0072] Figure 10 is a schematic diagram of the state when the lifting mechanism rises to the upper loading position in step S140 of the loading method provided in Embodiment 3 of the present invention;

[0073] Figure 11 is a schematic diagram of the state when the first transfer mechanism moves to the first set position in step S150 of the loading method provided in Embodiment 3 of the present invention;

[0074] Figure 12 is a schematic diagram of the state of the lifting mechanism when it descends to the lower loading position in step S160 of the loading method provided in Embodiment 3 of the present invention;

[0075] Figure 13 is a schematic diagram of the state of the lifting mechanism after the support column is placed in step S170 of the loading method provided in Embodiment 3 of the present invention.

[0076] Figure 14a is a schematic diagram of the state when the lifting mechanism rises to the upper loading position in step S180 of the loading method provided in Embodiment 3 of the present invention;

[0077] Figure 14b is a schematic diagram of the state when the first transfer mechanism moves to the first external preset position in step S180 of the loading method provided in Embodiment 3 of the present invention;

[0078] Figure 15 is a schematic diagram of the state after the execution of step S190 of the loading method provided in Embodiment 3 of the present invention;

[0079] Figure 16a is a schematic diagram of the state when the first transfer mechanism starts to leave the first set position in step S210 of the unloading method provided in Embodiment 4 of the present invention;

[0080] Figure 16b is a schematic diagram of the state of the lifting mechanism when it descends to the upper loading position in step S210 of the unloading method provided in Embodiment 4 of the present invention;

[0081] Figure 17 is a schematic diagram of the state when the first transfer mechanism moves to the first set position in step S220 of the unloading method provided in Embodiment 4 of the present invention;

[0082] Figure 18 is a schematic diagram of the state of the lifting mechanism when it descends to the lower loading position in step S230 of the unloading method provided in Embodiment 4 of the present invention;

[0083] Figure 19 is a schematic diagram of the state of the support column after it is removed from the lifting mechanism in step S240 of the unloading method provided in Embodiment 4 of the present invention.

[0084] Figure 20 is a schematic diagram of the state when the lifting mechanism rises to the upper loading position in step S250 of the unloading method provided in Embodiment 4 of the present invention;

[0085] Figure 21 is a schematic diagram of the state when the first transfer mechanism moves to the first external preset position in step S260 of the unloading method provided in Embodiment 4 of the present invention;

[0086] Figure 22 is a schematic diagram of the state of the lifting mechanism when it descends to the lower loading position in step S270 of the unloading method provided in Embodiment 4 of the present invention;

[0087] Figure 23 is a schematic diagram of the state when the second transfer mechanism moves to the second set position in step S280 of the unloading method provided in Embodiment 4 of the present invention;

[0088] Figure 24 is a schematic diagram of the state of the lifting mechanism when it descends to the lower limit in step S290 of the unloading method provided in Embodiment 4 of the present invention;

[0089] Figure 25 is a schematic diagram of the state of the second transfer mechanism when it moves outside the loading and unloading space in step S300 of the unloading method provided in Embodiment 4 of the present invention.

[0090] Explanation of reference numerals in the attached figures:

[0091] 110-Cavity body; 120-Mounting part; 210-Lifting drive assembly; 220-Lifting assembly; 221-Lower cover; 222-Tray support; 223-Tray; 224-Support column; 230-Upper limit sensor; 240-Lower limit sensor; 250-Upper loading position sensor; 260-Lower loading position sensor; 300-First transfer mechanism; 310-First transmission component; 320-First support component; 321-First opening; 322-Third opening; 323-First support surface; 324-First limiting part; 330-First transfer sensor; 400-Second transfer mechanism; 410-Second transmission component; 420-Second support component; 421-Second opening; 422-Fourth opening; 423-Second support surface; 424-Second limiting part; 430-Second transfer sensor;

[0092] 500 - Warm-up. Detailed Implementation

[0093]

[0094] Figure 1 is a schematic diagram of the crystal growth furnace mentioned in the first related technology of this invention. In the first related technology, the entire loading and unloading of the hot zone 500 is completed entirely by manpower. As shown in Figure 1, during the loading process, two to three operators first need to lift the hot zone 500, which weighs up to 80kg, and move it from the front of the equipment to the lower part of the whole machine. Then, three operators lift the hot zone 500 upwards from the lower part of the whole machine. The lifting height must ensure that the distance between the bottom of the hot zone 500 and the tray 223 is greater than the height of the support column 224. At this time, it is necessary to judge and ensure that the hot zone 500 is approximately concentric with the quartz cavity, and maintain the stability of the hot zone 500 at this height. At the same time, another operator needs to place the quartz support column 224 on the tray 223. Then, the three operators who lifted the hot zone 500 slowly and vertically lowered the hot zone 500 onto the support column 224. Then, they manually judged and adjusted the position of the hot zone 500 to ensure that the hot zone 500 is concentric with the cavity body 110. Finally, the lifting mechanism is started to complete the loading work.

[0095] The disadvantages of the related technology are as follows:

[0096] 1. When loading, the hot zone 500 must be completely located below the chamber body 110. Since the hot zone 500 itself is very tall, the height of the equipment needs to be designed to be very high in order to meet the loading requirements. It is difficult for general equipment workshops to meet the loading requirements.

[0097] 2. The entire loading process requires at least 3 to 5 operators to complete, resulting in low labor efficiency and high labor costs.

[0098] 3. Loading is entirely manual, requiring operators to lift the 80kg-heavy heating element 500 within a confined space and manually align it with the chamber. This operation is extremely inconvenient and demands a high level of physical strength and coordination from the operators. Slight mishandling can easily cause the heating element 500 or support column 224 to tilt, leading to unnecessary losses or even personal injury.

[0099] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0100] Example 1:

[0101] Figure 2 is a schematic diagram of the loading and unloading device provided in Embodiment 1 of the present invention applied to a crystal growth furnace; as shown in Figure 2, the loading and unloading device provided in this embodiment of the present invention is applied to a semiconductor device; the semiconductor device includes a chamber body 110 and a lifting mechanism, the chamber body 110 has a detachable lower cover 221, and there is a loading and unloading space below the chamber body 110; the lower cover 221 is used to carry the object to be loaded and unloaded, and the lifting mechanism is located in the loading and unloading space and is used to drive the lower cover 221 of the chamber body 110 to move up and down;

[0102] The loading and unloading equipment includes:

[0103] Installation Unit 120;

[0104] The first transfer mechanism 300 is movably mounted on the mounting section 120. It is capable of moving to a first predetermined position in the loading and unloading space to support the object to be loaded on the lower cover 221, and is capable of moving away from the first predetermined position for lifting by the lifting mechanism. When the object to be loaded is supported by the first transfer mechanism 300, a portion of the object 500 is located within the chamber body 110.

[0105] The second transfer mechanism 400 is movably installed in the installation part 120 and can carry the object to be loaded to move back and forth inside and outside the loading and unloading space; and when the object to be loaded is carried to the second set position of the loading and unloading space, the lower cover 221 supports the object to be loaded.

[0106] Specifically, in this embodiment, the semiconductor equipment can be a crystal growth furnace, and the object to be loaded can be the thermal zone 500. In this embodiment, the mounting part 120 can be a column at the bottom of the crystal growth furnace for supporting the chamber body 110.

[0107] In this embodiment, the lifting mechanism includes a lifting assembly 220, which includes a lifting arm. One end of the lifting arm is equipped with a lower cover 221 and a tray 223. The tray 223 is located above the lower cover 221. The lower cover 221 is connected to the tray 223 through a tray support 222. The lower cover 221 is the lower cover 221 of the chamber body 110 of the crystal growth furnace. The tray 223 is provided with a support column 224, which can directly support the hot zone 500. The lifting drive assembly 210 can use a ball screw, screw nut, or electric push rod to achieve lifting. The lifting arm is installed at the power output end of the lifting drive assembly 210.

[0108] The loading and unloading device provided in this embodiment is used in a crystal growth furnace. The space below the chamber body 110 of the crystal growth furnace is the loading and unloading space. The hot zone 500 is sent into this loading and unloading space from the outside and is then lifted by the lifting mechanism. The lifting mechanism lifts the lower cover 221, tray 223, support column 224, and hot zone 500 together upwards, thereby sending the hot zone 500 into the chamber body 110 of the crystal growth furnace. When the lifting assembly 220 rises to the highest position, the lifting assembly 220 drives the lower cover 221 to close the opening at the lower end of the chamber body 110. After the material in the hot zone 500 has been processed, the lifting mechanism descends, thereby causing the hot zone 500 to detach from the chamber body 110. After the lifting mechanism finally descends to its final position, the hot zone 500 is removed from the loading and unloading space.

[0109] Specifically, the first designated position is one where the first transfer mechanism 300 can support the heat field 500 and allows the tray 223 (described later) to pass through the first opening 321. The first transfer mechanism 300 being outside the loading / unloading space does not require it to be in a precisely defined position. As long as it is outside the loading / unloading space and does not affect the movement of the heat field 500 by the second transfer mechanism 400 (described later), nor does it affect the placement or removal of the heat field 500 from the second transfer mechanism 400, it can be considered that the first transfer mechanism 300 is outside the loading / unloading space. Furthermore, leaving the first designated position does not absolutely mean that the first transfer mechanism 300 is outside the loading / unloading space, nor does it mean that the first transfer mechanism 300 is merely 1 mm or 2 mm away from supporting the heat field to be considered to have left the first designated position. In this application, the departure of the first transfer mechanism 300 from or from the first predetermined position means that the first transfer mechanism 300 moves to a certain position where it does not affect the lifting mechanism carrying the heat field 500, and the first transfer mechanism 300 does not interfere with the movement of the lifting mechanism, the heat field 500, and the lower cover 221. Furthermore, the first transfer mechanism 300 does not interfere with the movement of the second transfer mechanism 400 carrying the heat field 500. At this time, the first transfer mechanism 300 can be inside or outside the loading and unloading space.

[0110] Specifically, the second designated position is one in which the second transfer mechanism 400 can support the hot zone 500 and allows the pallet 223 (described later) to pass through the second opening 421. The second transfer mechanism 400 being outside the loading and unloading space can be considered to be outside the loading and unloading space if operators can easily place the hot zone 500 into or remove it from the second transfer mechanism 400 using external equipment such as overhead cranes, stackers, or forklifts.

[0111] By setting up a first transfer mechanism 300, during the process of the lifting mechanism raising the hot zone 500, the first transfer mechanism 300 first supports the hot zone 500. After the lifting mechanism descends, the support column 224 can be placed on the lifting mechanism, which then raises the support column 224, lifting the hot zone 500 upwards and separating it from the first transfer mechanism 300. The first transfer mechanism 300 then leaves the area where the hot zone 500 and the lifting mechanism operate. This eliminates the need for a support column 224 on the lifting mechanism when placing the hot zone 500, thereby reducing the height of the loading and unloading space below the chamber body 110, reducing the overall height of the crystal growth furnace, and ultimately lowering the requirements for factory height. Furthermore, once the lifting mechanism lifts the hot zone 500 upwards and separates it from the first transfer mechanism 300 via the support column 224, the first transfer mechanism 300 leaves the area where the hot zone 500 and the lifting mechanism operate, ensuring that the first transfer mechanism 300 no longer affects the raising and lowering of the hot zone 500 and the lifting mechanism. By setting up a second transfer mechanism 400, the hot zone 500 can be placed on the second transfer mechanism 400 by external equipment such as overhead cranes, stackers, or forklifts. Then, the second transfer mechanism 400 can move the hot zone 500 into the loading and unloading space, or move the hot zone 500 from the loading and unloading space to the outside of the loading and unloading space. This eliminates the need for operators to manually move the hot zone 500 to the lifting mechanism, significantly reducing the workload of operators and also significantly improving operational safety compared to manual loading and unloading.

[0112] Optionally, in this application, when the first transfer mechanism 300 moves from outside the loading and unloading space to inside the loading and unloading space, it can only move to a first set position at most, so that the position of the first transfer mechanism 300 in the loading and unloading space can be located, avoiding the need to add additional positioning devices.

[0113] Similarly, optionally, in this application, when the second transfer mechanism 400 moves from outside the loading and unloading space to inside the loading and unloading space, it can only move to the second set position at most, so that the position of the second transfer mechanism 400 in the loading and unloading space can be positioned, avoiding the need to add additional positioning devices.

[0114] Figure 3 is a structural schematic diagram of the first transfer mechanism in the loading and unloading device provided in Embodiment 1 of the present invention; Figure 4 is a top view of the first transfer mechanism in the loading and unloading device provided in Embodiment 1 of the present invention; As shown in Figures 3 and 4, preferably, the first transfer mechanism 300 includes: a first support member 320, configured to support the heat field 500, the first support member 320 having a first opening 321, the first opening 321 being for the pallet 223 to pass through in a vertical direction, the pallet 223 being mounted on the lower cover 221; and a first transmission member 310, mounted on the mounting part 120 and connected to the first support member 320, the first transmission member 310 being configured to drive the first support member 320 to or away from a first set position or a first external preset position.

[0115] The first opening 321 refers to the area in the middle of the first support member 320 that is hollowed out vertically. This area is roughly circular, and the diameter of the circle is larger than the diameter of the tray 223.

[0116] By setting the opening size of the first opening 321 to be larger than that of the tray 223, interference between the tray 223 and the first support member 320 can be prevented during lifting and lowering movements, i.e., when the tray 223 is moving away from or near the hot zone 500. This improves the smoothness of the movement, allowing the tray 223 to descend a greater distance to allow the support column 224 to be inserted. Furthermore, the first transmission member 310 allows the first support member 320 to have a larger range of motion, avoiding interference with the lifting and lowering of the hot zone 500 and the translation of the hot zone by the second transfer mechanism 500.

[0117] In addition to the implementation described later, in another implementation, the first support member 320 can also be angled. As long as the center of gravity of the heat field 500 is ensured to be within the triangular area enclosed by the solid part of the angled first support member 320 and the third opening 322, then only one first support member 320 is needed to support the heat field 500. Alternatively, two first support members 320 can be provided, each angled, and the two first support members 320 move from opposite sides of the heat field 500 to support it. In this case, it is not necessary to ensure that the center of gravity of the heat field 500 is within the triangular area of ​​each first support member 320.

[0118] As shown in Figures 3 and 4, preferably, the first support member 320 includes a first C-shaped ring, the upper end of the first C-shaped ring having a first support surface 323, the first support surface 323 being configured to support the heat field 500 in the vertical direction; the first C-shaped ring has a first limiting portion 324 protruding from the first support surface 323, the first limiting portion 324 being located at the edge of the first support surface 323, the first limiting portion 324 being configured to restrict the lateral movement of the heat field 500.

[0119] Specifically, the area between the two free ends of the first C-shaped ring solid portion is the third opening 322. Since the first support member 320 needs to leave when the support column 224 supports the thermal field 500, the opening size of the third opening 322 is larger than the lateral size of the support column 224.

[0120] Specifically, in this embodiment, the first limiting part 324 can be a continuous limiting wall provided on the upper surface of the edge of the first supporting surface 323. Of course, the two ends of the limiting wall in the circumferential length direction are consistent with the two ends of the first C-shaped ring along its outer edge circumferential length, so as to ensure that there is no interference with the support column 224.

[0121] By setting the first C-shaped ring, the hot zone 500 can be supported over a large range, ensuring that the center of gravity of the hot zone 500 is within the support range of the first C-shaped ring, thus improving the stability of the support for the hot zone 500. Furthermore, the first limiting part 324 prevents the hot zone 500 from deviating from its original position during the support process, ensuring the coaxiality of the hot zone 500 relative to the chamber body 110 of the crystal growth furnace.

[0122] In another implementation, the first limiting part 324 does not use a limiting wall. For example, multiple limiting posts can be used. When the hot field 500 abuts against at least two of the limiting posts, the concentricity of the hot field 500 can be determined to meet the requirements. Alternatively, the first limiting part 324 can be omitted, because the first support member 320 only supports the hot field 500 and does not drive the hot field 500 to move horizontally. Under normal circumstances, when the hot field 500 is supported by the first support member 320, it will only be subjected to or lose upward support from the lower support post 224 or tray 223, and will not be subjected to horizontal forces. The horizontal position of the hot field 500 will not change, so there is actually no need for the first support member 320 to limit the hot field 500.

[0123] As shown in Figures 2 and 3, preferably, the first transmission member 310 includes a first connecting arm, one end of which is rotatably connected to the mounting part 120, and the first support member 320 is fixedly connected to the other end of the first connecting arm.

[0124] Specifically, one end of the first connecting arm is pivotally connected to a pivot seat provided in the mounting part 120. The first connecting arm can be driven by a first drive motor (not shown) to rotate. When the lifting mechanism needs to move the hot zone 500 up or down, the first transmission member 310 needs to move the first support member 320 out of the loading and unloading space. Furthermore, when the second transfer mechanism 400 (described later) needs to move into or out of the hot zone 500, and the bottom surface of the first transfer mechanism 300 cannot be higher than the top of the hot zone 500, the first transmission member 310 also needs to move the first support member 320 out of the loading and unloading space.

[0125] The first transmission component 310 is set by a rotating connection, which eliminates the need for a long guide rail, thereby reducing the manufacturing difficulty and cost of the equipment.

[0126] In another implementation, the first transmission member 310 can also drive the first support member 320 to move by translation. If the first transfer mechanism 300 includes a first transmission member 310 and a first support member 320, with the direction shown in Figure 2 as a reference, the first transmission member 310 can move in a direction perpendicular to the plane of the drawing. That is, when moving towards the observer, the first transmission member 310 and the first support member 320 move away from the heat field 500; when moving away from the observer, the first transmission member 310 and the first support member 320 move closer to the heat field 500. Alternatively, when the first transfer mechanism 300 includes two sets of first transmission members 310 and first support members 320, each set can move closer to or further away from each other in a direction perpendicular to the plane of the drawing, thereby supporting the heat field 500 and making room for the operation of the heat field 500 and the lifting mechanism.

[0127] As shown in Figure 2, preferably, the first transfer mechanism 300 further includes a first transfer sensor 330, which is used to detect whether the first transmission member 310 is located at a first set position.

[0128] Specifically, the first transfer sensor 330 can be mounted on the mounting part 120, located below the first transmission member 310 when the first support member 320 supports the thermal field 500. Specifically, the first transfer sensor 330 can be a proximity switch or a reflective photoelectric sensor, etc.

[0129] By setting the first transfer sensor 330, it is possible to detect whether the first support 320 is located in the first set position. If the first support 320 is located in the first set position, the first transfer sensor 330 detects the first support 320, and prevents the lifting mechanism from lifting or lowering in a way that would cause a collision with the first support 320, or prevents the hot zone 500 from being sent into the loading and unloading space and causing interference, thereby avoiding damage to the crystal growth furnace or the hot zone 500.

[0130] As shown in Figures 2, 10, and 11, preferably, the loading and unloading device further includes a first controller and an upper loading position sensor 250 electrically connected to the first controller; the upper loading position sensor 250 is used to detect whether the lifting mechanism has moved to the upper loading position. The first controller is used to control the lifting mechanism to stop operating when the upper loading position sensor 250 detects that the lifting mechanism has moved to the upper loading position, and to control the first transfer mechanism 300 to move to or leave the first set position, so that the object to be loaded can be transferred between the lower cover 221 and the first transfer mechanism 300.

[0131] Specifically, the loading position sensor 250 can be mounted on the mounting part 120 or on a fixed part of the lifting drive assembly 210. Furthermore, the loading position sensor 250 can be a proximity switch, a through-beam type, or a reflective photoelectric sensor. When the lifting mechanism reaches the loading position, the bottom surface of the thermal field 500 is higher than the upper surface of the first limiting part 324 of the first support member 320.

[0132] In practical implementation, when the lifting mechanism rises from the lower loading position (described later) and causes the lower cover 221 supporting the hot zone 500 to rise to the upper loading position, the lifting mechanism stops. At this time, the first transfer mechanism 300 can move to below the hot zone 500. Then the lifting mechanism descends, the first support 320 can support the hot zone 500, and the tray 223 disengages from the hot zone 500, thereby realizing the transfer of the hot zone 500 from the lower cover 221 to the first transfer mechanism 300.

[0133] When the lifting mechanism carries the heat field 500 down from the chamber body 110, it descends to the upper loading position and stops operating. At this time, the first transfer mechanism 300 moves to below the heat field 500. As the lifting mechanism continues to descend, the first support member 320 can support the heat field 500, and the tray 223 detaches from the heat field 500, thereby realizing the transfer of the heat field 500 from the lower cover 221 to the first transfer mechanism 300.

[0134] When the first transfer mechanism 300 supports the heat field 500 at the first set position, the lifting mechanism drives the lower cover 221 and the support column 224 to rise to the upper loading position, and then the lifting mechanism stops. The first transfer mechanism 300 moves out from under the heat field 500, and the support column 224 can support the heat field 500, thereby realizing the transfer of the heat field 500 from the first transfer mechanism 300 to the lower cover 221.

[0135] Furthermore, the upper loading position can be selected such that when the lifting mechanism operates to the upper loading position, the upper surface of the first limiting part 324 of the first support member 320 is lower than the bottom surface of the hot zone 500. It can even be made so that the upper surface of the first limiting part 324 is lower than the bottom surface of the tray 223, so that the two ends of the first limiting part 324 can be aligned with the two ends of the outer edge of the first C-shaped ring in the circumferential direction, so as to wrap the hot zone 500 with a larger central angle, thereby improving the stability of the operation of the hot zone 500.

[0136] By setting the upper loading position sensor 250 to detect the lifting mechanism, it is possible to: when loading the hot zone 500, the support column 224 is placed in later; when removing the hot zone 500, the support column 224 is removed first. In order to reduce the overall height of the crystal growth furnace, the lifting mechanism can stop in time when it reaches the upper loading position and proceed to the next action. This not only improves the control accuracy, but also reduces the travel of the lifting mechanism in order to move out the space for the support column 224 to be placed in and removed, thus reducing time consumption and improving operating efficiency.

[0137] As shown in Figures 2, 12, and 13, preferably, it also includes a lower loading position sensor 260 electrically connected to the first controller. The lower loading position sensor 260 is used to detect whether the lifting mechanism has moved to the lower loading position. The first controller is also used to control the lifting mechanism to stop when the lower loading position sensor 260 detects that the lifting mechanism has moved to the lower loading position. The distance between the upper loading position and the lower limit position is greater than the height of the support column 224. The support column 224 is used to be placed on the lower cover 221 so that the lower cover 221 carries the object to be loaded through the support column 224.

[0138] Specifically, the lower loading position sensor 260 can be mounted on the mounting part 120 or on a fixed part of the lifting drive assembly 210. Furthermore, the lower loading position sensor 260 can be a proximity switch, a through-beam type, or a reflective photoelectric sensor. When the lifting mechanism is in the lower loading position, preferably, the upper surface of the support column 224 is lower than the lowest position of the first transfer mechanism 300 when the support column 224 is placed on the tray 223. This facilitates the removal or placement of the support column 224, and reduces the impact of the first transfer mechanism 300 on the operator when placing or removing the support column 224.

[0139] Furthermore, the lower loading position can be selected such that when the lifting mechanism moves to the lower loading position, the upper surface of the second limiting part 424 of the second support member 420 is lower than the bottom surface of the hot zone 500. It can even be made so that the upper surface of the second limiting part 424 is lower than the bottom surface of the tray 223, so that the two ends of the second limiting part 424 can be aligned with the two ends of the outer edge of the second C-shaped ring in the circumferential direction, so as to wrap the hot zone 500 with a larger central angle, thereby improving the stability of the operation of the hot zone 500.

[0140] By setting the loading position sensor 260, the lifting mechanism can move to the appropriate position after leaving the hot zone 500 so that the support column 224 can be put in or taken out. At the same time, it can avoid the lifting mechanism from having to make a large reciprocating motion to move out for the support column 224 to be put in or taken out, thus reducing time consumption and improving operating efficiency.

[0141] Figure 5 is a structural schematic diagram of the second transfer mechanism in the loading and unloading device provided in Embodiment 1 of the present invention; Figure 6 is a top view of the second transfer mechanism in the loading and unloading device provided in Embodiment 1 of the present invention; as shown in Figures 5 and 6, preferably, the second transfer mechanism 400 includes:

[0142] The second support member 420 is configured to support the hot zone 500. The second support member 420 has a second opening 421 for a tray 223 to pass through vertically. The tray 223 is mounted on the lower cover 221.

[0143] The second transmission member 410 is installed in the mounting part 120 and connected to the second support member 420. The second transmission member 410 is configured to drive the second support member 420 to or away from the second set position.

[0144] The second opening 421 refers to the area in the middle of the second support member 420 that is hollowed out vertically. This area is roughly circular, and the diameter of the circle is larger than the diameter of the tray 223.

[0145] By setting the opening size of the second opening 421 to be larger than that of the tray 223, interference between the tray 223 and the second support member 420 can be prevented during lifting and lowering movements, i.e., when the tray 223 is moving away from or near the hot zone 500. This improves the smoothness of the movement, allowing the tray 223 to pass from bottom to top through the middle of the second support member 420 to lift the hot zone 500, or to pass from bottom to top through the second support member 420, so that the hot zone 500 is supported by the second support member 420 and separated from the tray 223. Furthermore, the second transmission member 410 allows the second support member 420 to have a larger range of motion, avoiding interference with the lifting and lowering of the hot zone 500.

[0146] In addition to the implementation method described later, in another implementation method, the second support member 420 can also be folded. As long as the center of gravity of the hot field 500 is ensured to be within the triangular area enclosed by the solid part of the folded second support member 420 and the fourth opening 422, then only one second support member 420 is needed to support the hot field 500.

[0147] As shown in Figures 5 and 6, preferably, the second support member 420 includes a second C-shaped ring, the upper end of which has a second support surface 423, the second support surface 423 being configured to support the heat field 500 in the vertical direction; the second C-shaped ring has a second limiting portion 424 protruding from the second support surface 423, the second limiting portion 424 being located at the edge of the second support surface 423, the second limiting portion 424 being configured to restrict the lateral movement of the heat field 500.

[0148] Specifically, the area between the two free ends of the second C-shaped ring is the fourth opening 422. Since the first support 320 needs to leave when the pallet support 222 supports the pallet 223, the opening size of the fourth opening 422 is larger than the lateral size of the pallet support 222.

[0149] Specifically, in this embodiment, the second limiting part 424 can be a continuous limiting wall provided on the upper surface of the edge of the second supporting surface 423. Of course, the two ends of the limiting wall in the circumferential length direction are consistent with the two ends of the second C-shaped ring along its outer edge circumferential length, so as to ensure that there is no interference with the support column 224.

[0150] By setting the second C-shaped ring, support can be provided for the hot zone 500 over a larger range, ensuring that the center of gravity of the hot zone 500 is within the support range of the second C-shape, thus improving the stability of the support for the hot zone 500. Furthermore, the second limiting part 424 prevents the hot zone 500 from deviating from its original position during the support process, ensuring the coaxiality of the hot zone 500 relative to the chamber body 110 of the crystal growth furnace.

[0151] In another implementation, the second limiting part 424 does not use a limiting wall. For example, multiple limiting posts can be used. When the hot field 500 abuts against at least two of the limiting posts, it can be determined that the concentricity of the hot field 500 meets the requirements.

[0152] As shown in Figures 2, 5 and 6, preferably, the second transmission member 410 includes a second connecting arm, one end of which is rotatably connected to the mounting part 120, and the second support member 420 is fixedly connected to the other end of the second connecting arm.

[0153] Specifically, one end of the second connecting arm is pivotally connected to a pivot seat provided in the mounting part 120. The second connecting arm can be driven by a second drive motor (not shown) to rotate. When the lifting mechanism is required to lift the hot zone 500, the second transmission member 410 needs to move the second support member 420 outside the loading and unloading space.

[0154] The second transmission component 410 is set by a rotating connection, which eliminates the need for a long guide rail, thereby reducing the manufacturing difficulty and cost of the equipment.

[0155] In another implementation, the second transmission member 410 can also drive the second support member 420 to move by translation. If the first transfer mechanism 300 includes a second transmission member 410 and a second support member 420, and the C-shaped opening of the second support member 420 is set with the direction shown in Figure 2 as a reference, the second transmission member 410 can move in the left-right direction in Figure 2, and the opening of the second C-shaped ring of the second support member 420 faces the right side in Figure 2. Alternatively, when the first transfer mechanism 300 includes two sets of second transmission members 410 and second support members 420, each set can be made to move closer to or further away from each other along a direction perpendicular to the plane of the figure, thereby supporting the heat field 500 and making room for the operation of the heat field 500 and the lifting mechanism.

[0156] As shown in Figures 2, 7b, and 8, preferably, the second transfer mechanism further includes a second transfer sensor 430, which is used to detect whether the second transmission member 410 is in a second set position. The second set position is located in the loading and unloading space and is located below the first set position.

[0157] Specifically, the second transfer sensor 430 can be mounted on the mounting part 120, located below the second transmission member 410 when the second support member 420 supports the thermal field 500. Specifically, the second transfer sensor 430 can be a proximity switch or a reflective photoelectric sensor, etc.

[0158] By setting a second transfer sensor 430, it is possible to detect whether the second support 420 is located in a second preset position. If the second support 420 is located in the second preset position, the lifting mechanism is prevented from lifting and lowering in a way that would cause collision with the second support 420, thereby avoiding damage to the crystal growth furnace or the hot zone 500.

[0159] As shown in Figure 2, preferably, the loading and unloading device further includes a second controller and an upper limit sensor 230 electrically connected to the second controller; the upper limit sensor 230 is used to detect whether the lifting mechanism has moved to the upper limit position; the second controller is used to control the lifting mechanism to stop rising when the upper limit sensor 230 detects that the lifting mechanism has reached the upper limit position, so that the lower cover 221 closes the chamber body 110.

[0160] The upper limit position is the highest position of the lifting mechanism. When it is in this position, the lower cover 221 of the lifting mechanism covers the lower opening of the chamber body 110.

[0161] In practice, the first controller and the second controller can be the same controller, and this is not a limitation.

[0162] By setting the upper limit sensor 230, the lifting mechanism can stop rising when it reaches the upper limit, preventing damage to the motor of the lifting drive component 210. At the same time, it can also ensure that the lower cover 221 can tightly cover the opening at the lower end of the chamber body 110.

[0163] As shown in Figure 2, preferably, it also includes a lower limit sensor 240 electrically connected to the second controller; the second controller is also used to control the lifting mechanism to stop descending when the lower limit sensor 240 detects that the lifting mechanism has reached the lower limit, wherein the lower limit is the lowest position at which the lifting mechanism is allowed to descend.

[0164] Specifically, in this embodiment, the lower limit sensor 240 is lower than the aforementioned lower loading position sensor 260. When the lifting mechanism moves to the lower limit, the highest points of the lower cover 221 and the tray 223 are both lower than the lowest point of the second support member 420.

[0165] By setting the lower limit sensor 240, the lowest position of the lifting mechanism can be controlled so that the heat field 500 can be placed on the second support 420 during the descent.

[0166] Example 2:

[0167] As shown in Figure 2, the semiconductor device provided in Embodiment 2 of the present invention includes a chamber body 110, a lifting mechanism, and a loading and unloading device of any of the above. A loading and unloading space is formed below the chamber body 110, and the lifting mechanism is used to drive the lower cover 221 to move up and down in the loading and unloading space.

[0168] By incorporating the aforementioned loading and unloading device into the semiconductor equipment, the semiconductor equipment thereby possesses all the advantages of the aforementioned loading and unloading device, which will not be elaborated upon here.

[0169] In this embodiment, the semiconductor device is a crystal growth furnace, which also includes a mounting section 120. In this embodiment, the mounting section 120 can be a column at the bottom of the crystal growth furnace used to support the chamber body 110. The first transmission member 310 and the second transmission member 410 are rotatably mounted on the mounting section 120, with the first transmission member 310 located above the second transmission member 410. The first transfer sensor 330 and the second transfer sensor 430 can also be mounted on the mounting section 120, specifically below the positions of the first transmission member 310 and the second transmission member 410 when the first support member 320 and the second support member 420 support the thermal field 500.

[0170] Example 3:

[0171] The loading method provided in Embodiment 3 of the present invention is used to load a workpiece into the aforementioned semiconductor device. In this embodiment, the semiconductor device can be a crystal growth furnace, and the workpiece can be a thermal zone 500. The loading method provided in this application will be described below using the example of a crystal growth furnace as the semiconductor device and a thermal zone 500 as the workpiece.

[0172] The loading method may include the following steps:

[0173] S110. Place the heat field 500 on the second transfer mechanism 400, and control the second transfer mechanism 400 to move to the second set position:

[0174] The starting state of the above steps is shown in Figure 7a, and the ending state is shown in Figure 7b. Specifically, when the heat field 500 is placed on the second transfer mechanism 400, the first transfer mechanism 300 and the second transfer mechanism 400 are offset in the vertical projection.

[0175] In practice, before step S110, the lifting mechanism, the first transfer mechanism 300, and the second transfer mechanism 400 generally need to be reset. That is, both the first transfer mechanism 300 and the second transfer mechanism 400 are located outside the loading / unloading space, while the lifting mechanism is located at the lower limit position. Specifically, the first transfer mechanism 300 leaving the first set position is confirmed by the first transfer sensor 330 not detecting the first transmission component 310; while the lifting mechanism being at the lower limit position is confirmed by the lower limit sensor 240 detecting the lifting mechanism. Before the second transfer mechanism 400 moves the heat field 500 to the second set position, the lifting mechanism is at the lower limit position, and the lower surface of the second support component 420 is higher than the upper surface of the tray 223 to avoid interference. The second transfer mechanism 400 moving to the second set position is confirmed by the second transfer sensor 430 detecting the second transmission component 410.

[0176] S120, Control the lifting mechanism to drive the upper cover 221 to support the heated area 500:

[0177] The state of the lifting mechanism when it stops at the lower loading position is shown in Figure 8; the lifting mechanism's movement to the lower loading position is confirmed by the lower loading position sensor 260. Specifically, the upper cover 221 supports the heat field 500, which can be achieved by the upper cover 221 supporting the heat field 500 through the tray 223 on it, rather than by the upper cover 221 directly contacting the bottom surface of the heat field 500.

[0178] Furthermore, when the lifting mechanism rises to the lower loading position, the upper surface of the pallet 223 is higher than the second support surface 423, so that the pallet 223 can lift the hot zone 500 and the lifting mechanism can bear the weight of the hot zone 500, and the second support surface 423 is separated from the bottom surface of the hot zone 500. At this time, the second support 420 is located within the height range of the pallet support 222.

[0179] S130, Control the second transfer mechanism to leave the loading / unloading space:

[0180] The completed state of this step is shown in Figure 9.

[0181] S140, Control the lifting mechanism to drive the lower cover 221 to rise a set distance to support the heat field 500, so that when the first transfer mechanism 300 moves to the first set position, it can support the heat field 500:

[0182] The completion status of this step is shown in Figure 10. Before this step is executed, it is necessary to confirm that the second transfer mechanism 400 has left the second preset position and the first transfer mechanism 300 has left the first preset position.

[0183] In this application, the second transfer mechanism 400 leaving or departing from the second predetermined position means that the second transfer mechanism 400 moves to a certain position where it does not affect the lifting mechanism's self-lifting and lowering or the lifting of the carrying heat field 500, and the second transfer mechanism 400 does not interfere with the movement of the lifting mechanism, the heat field 500, and the lower cover 221. At this time, the second transfer mechanism 400 can be inside or outside the loading and unloading space.

[0184] Since the lower cover 221 is used to seal the opening at the lower end of the chamber body 110, and the opening at the lower end of the chamber body 110 can accommodate the heat field 500, the opening at the lower end of the chamber body 110 is larger than the heat field 500. The second support member 420 is used to support the heat field 500, and the second opening 421 is smaller than the heat field 500. Therefore, the lower cover 221 must be larger than the second opening 421 of the second support member 420. To avoid interference between the lower cover 221 and the second support member 420, before continuing to raise the lifting mechanism, it is necessary to confirm that the second transfer mechanism 400 has left the second set position. This can be confirmed by the second transfer sensor 430 not detecting the second transmission member 410.

[0185] Specifically, after the lifting mechanism drives the lower cover 221 to rise a set distance supporting the hot zone 500, it moves to the lower loading position. The lifting mechanism's movement to the lower loading position is detected and confirmed by the lower loading position sensor 260.

[0186] S150: Control the first transfer mechanism 300 to move to the first set position and support the hot zone 500.

[0187] The completed state of this step is shown in Figure 11. When the first transfer mechanism 300 moves to the first set position, the first limiting part 324 of the first transfer mechanism 300 is lower than the lower surface of the pallet 223, that is, the first supporting part 320 of the first transfer mechanism 300 is located within the height range of the pallet support 222 of the lifting mechanism.

[0188] Furthermore, in this embodiment, the rotation of the second transfer mechanism 400 can be performed on the side of the plane containing the image in Figure 2 away from the observer, while the rotation of the first transfer mechanism 300 can be performed on the side of the image closer to the observer. That is, the rotation of the first transfer mechanism 300 and the rotation of the second transfer mechanism 400 do not occur within the same semi-ring, so as to avoid interference between the first transfer mechanism 300 and the thermal field 500.

[0189] S160, Control the lifting mechanism to descend until the distance between the tray 223 on the lower cover 221 and the heat field 500 is greater than the height of the support column 224:

[0190] The completed state of this step is shown in Figure 12. In this step, the lifting mechanism stops at the lower loading position when the distance between the tray 223 and the heat field 500 is greater than the height of the support column 224. Before this step is executed, it is necessary to confirm that the first transfer mechanism 300 is in the first set position and the second transfer mechanism 400 has left the second set position. The first transfer mechanism 300 being in the first set position is confirmed by the first transfer sensor 330 detecting the first transmission component 310; while the second transfer mechanism 400 leaving the second set position is confirmed by the second transfer sensor 430 not detecting the second transmission component 410.

[0191] When the lifting mechanism descends, the bottom surface of the heating zone 500 contacts the first support surface 323, and the weight of the heating zone 500 is borne by the first support component 320, separating the pallet 223 from the heating zone 500. Then the lifting mechanism continues to descend to the lower loading position and stops. When the lifting mechanism is in the lower loading position, the support column 224 placed on the pallet 223 still has a large space between it and the first transfer mechanism 300, so as to facilitate the placement of the support column 224 on the pallet 223.

[0192] S170. Place the support column 224 on the tray 223:

[0193] The completed state of this step is shown in Figure 13.

[0194] S180: Control the lifting mechanism to rise until the support column 224 can support the heat field 500; control the first transfer mechanism 300 to leave the first set position:

[0195] The final state of the lifting mechanism rising to the point where the support column 224 can support the heat field 500 is shown in Figure 14a. The final state of the first transfer mechanism 300 leaving the first set position is shown in Figure 14b. When the lifting mechanism rises to the point where the support column 224 can support the heat field 500, the lifting mechanism is in the upper loading position.

[0196] After the support column 224 is in place, the lifting mechanism rises. The lifting mechanism moves to the upper loading position, based on the detection of the upper loading position sensor 250. The pallet 223 lifts the heat field 500 via the support column 224, and the lifting mechanism bears the weight of the heat field 500. The first supporting surface 323 separates from the bottom surface of the heat field 500, and the first supporting member 320 is located within the height range of the pallet support column 222. Then, since the lower cover 221 is larger than the first opening 321 of the first supporting member 320, in order to avoid interference between the first supporting member 320 and the lower cover 221, the first transfer mechanism 300 moves away from the first set position.

[0197] S190, Control the lifting mechanism to rise until the lower cover 221 closes the chamber body 110:

[0198] The completed state of this step is shown in Figure 15. Before this step is executed, it is necessary to confirm that the first transfer mechanism 300 has left the first set position. When the lifting mechanism rises to the upper limit position, it not only sends the heat field 500 into place, but also sends the lower cover 221 to the opening at the lower end of the chamber body 110 and covers the opening to seal the chamber body 110. This completes the loading of the heat field 500. Specifically, the lifting mechanism is located at the upper limit position, based on the detection of the lifting mechanism by the upper limit sensor 230.

[0199] By adopting the above loading method, on the one hand, the second transfer mechanism 400 can be used to move the object to be loaded into the loading and unloading space, thus eliminating the need for operators to perform such laborious and dangerous work, improving labor efficiency, and reducing the workload and danger for operators. On the other hand, during the process of the lifting mechanism carrying the object to be loaded into the chamber body 110, the object to be loaded can be moved to a certain height first, and the first transfer mechanism 300 can support the object to be loaded, thereby allowing the lifting mechanism to descend to the lower loading position to place the support column 224. Therefore, it is not necessary to place the support column 224 before placing the object to be loaded, reducing the height of the loading and unloading space, thereby reducing the overall height of the semiconductor equipment and reducing the requirements for the height of the factory building.

[0200] Example 4:

[0201] The unloading method provided in Embodiment 4 of this invention is used to unload a load from the aforementioned semiconductor device. In this embodiment, the semiconductor device can be a crystal growth furnace, and the load can be a thermal zone 500. The unloading method provided in this application will be described below using the example of a crystal growth furnace as the semiconductor device and a thermal zone 500 as the load.

[0202] Uninstallation methods may include the following steps:

[0203] S210, the control lifting mechanism drives the lower cover 221 to descend to the position where the heat field 500 can be supported when the first transfer mechanism 300 moves to the first set position:

[0204] The start state of this step is shown in Figure 16a, and the end state is shown in Figure 16b. In practice, before starting step S210, the first transfer mechanism 300 generally needs to be reset, meaning the first transfer mechanism 300 is located outside the loading / unloading space. Furthermore, the second transfer mechanism 400 can also be reset, meaning the second transfer mechanism 400 is located outside the loading / unloading space.

[0205] S220: Control the first transfer mechanism 300 to move to the first set position and support the hot zone 500:

[0206] The completed state of this step is shown in Figure 17. When the lifting mechanism descends to the upper loading position, the bottom surface of the pallet 223 is higher than the top of the first limiting part 324 of the first support member 320. Therefore, when the first transfer mechanism 300 moves to the first set position, it enters from below the pallet 223 and above the lower cover 221, and will not interfere with the lifting mechanism.

[0207] S230, Control the lifting mechanism to descend until the distance between the tray 223 on the lower cover 221 and the heat field 500 is greater than the height of the support column 224:

[0208] The completed state of this step is shown in Figure 18. Before this step is executed, it is necessary to confirm that the first transfer mechanism 300 is in the first set position and the second transfer mechanism 400 has left the second set position, and then control the lifting mechanism to descend to the lower loading position and stop.

[0209] When the lifting mechanism descends, the bottom surface of the heating zone 500 contacts the first supporting surface 323, and the weight of the heating zone 500 is borne by the first supporting component 320, separating the pallet 223 from the heating zone 500. Then the lifting mechanism continues to descend to the lower loading position and stops. Since there is still a height difference between the upper surface of the support column 224 and the first transfer mechanism 300 when the lifting mechanism descends to the lower loading position, it is easy for the support column 224 to be removed.

[0210] S240, Remove the support column 224 from the tray 223:

[0211] The completed state of this step is shown in Figure 19.

[0212] S250, control the lifting mechanism to rise until the lower cover 221 supports the heat field 500:

[0213] The completed state of this step is shown in Figure 20. Before this step is executed, it is necessary to confirm that the first transfer mechanism 300 is in the first set position and the second transfer mechanism 400 is outside the loading and unloading space.

[0214] After the support column 224 is removed from the pallet 223, the lifting mechanism is controlled to rise to the upper loading position. The pallet 223 directly contacts the hot zone 500. When the upper surface of the pallet 223 is higher than the first support surface 323, the bottom surface of the hot zone 500 separates from the first support surface 323. The pallet 223 bears the weight of the hot zone 500, and then the first transfer mechanism 300 can be controlled to move to the first external preset position.

[0215] S260, Control the first transfer mechanism 300 to leave the first preset position:

[0216] The completed state of this step is shown in Figure 21.

[0217] S270, When the lifting mechanism descends to the position where the second transfer mechanism 400 moves to the second set position, it can support the position of the heat field 500:

[0218] The completed state of this step is shown in Figure 22. Before this step is executed, it is necessary to confirm that the first transfer mechanism 300 has left the first set position and the second transfer mechanism 400 has left the second set position. When the lifting mechanism is in the lower loading position, the second transfer mechanism 400 can support the heat field 500 when it moves to the second set position.

[0219] S280: Control the second transfer mechanism 400 to move into the second set position and support the heat field 500.

[0220] The completed state of this step is shown in Figure 23. At this point, the bottom surface of the thermal field 500 is still higher than the second support surface 423.

[0221] S290, Control the lifting mechanism to descend:

[0222] The completion status of this step is shown in Figure 24. Before this step is executed, it is necessary to confirm that the first transfer mechanism 300 has left the first set position and the second transfer mechanism 400 is in the second set position.

[0223] As the lifting mechanism continues to descend, the bottom surface of the hot zone 500 begins to contact the second transfer mechanism 400, and the weight of the hot zone 500 is gradually borne by the second transfer mechanism 400 until the lifting mechanism descends to the lower limit. When the upper surface of the pallet 223 is lower than the lowest point of the second transfer mechanism 400, the second transfer mechanism 400 can move the hot zone 500 outside the loading and unloading space.

[0224] S300: Control the second transfer mechanism 400 to move outside the loading space:

[0225] The completed state of this step is shown in Figure 25. Then, the hot zone 500 is removed from the second transfer mechanism 400; the unloading of the hot zone 500 is completed.

[0226] By employing the above method for unloading the crystal growth furnace, on the one hand, the second transfer mechanism 400 can be used to move the hot zone 500 out of the loading and unloading space, thus eliminating the need for operators to perform such laborious and dangerous work, improving labor efficiency, and reducing the workload and danger for operators. On the other hand, during the unloading process of the hot zone 500 from the chamber body 110 by the lifting mechanism, the hot zone 500 can be moved to a certain height first, and the first transfer mechanism 300 can support the hot zone 500, thereby allowing the lifting mechanism to descend to the lower loading position to remove the support column 224. Therefore, it is not necessary to remove the hot zone 500 before removing the support column 224, reducing the height of the loading and unloading space, thereby reducing the overall height of the crystal growth furnace and lowering the requirements for the height of the plant.

[0227] The technical solution provided in this application detects the positions of the lifting mechanism, the first transfer mechanism, and the second transfer mechanism, and controls the operation and stopping of the lifting mechanism structure based on the detection results. Furthermore, the host computer can display prompts based on the detection results, thereby ensuring the safety and convenience of the loading and unloading processes.

[0228] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

[0229] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the term "comprising" or any other variations thereof is intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes the element.

[0230] In the above embodiments, descriptions of directions such as "up" and "down" are based on the accompanying drawings.

[0231] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention.

[0232] Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A loading and unloading device, characterized in that, The loading and unloading device is applied to a semiconductor device; the semiconductor device includes a chamber body (110) and a lifting mechanism, the chamber body (110) has a detachable lower cover (221), and a loading and unloading space is located below the chamber body (110); the lower cover (221) is used to carry the object to be loaded, and the lifting mechanism is located in the loading and unloading space to drive the lower cover (221) of the chamber body (110) to move up and down; the loading and unloading device includes: a mounting part (120); a first transfer mechanism (300), movably mounted on the mounting part (120), capable of moving to a first set position in the loading and unloading space to support the lower cover (221). The object to be loaded is able to leave from the first set position for the lifting mechanism to lift; wherein, when the object to be loaded is supported by the first transfer mechanism (300), a portion of the object to be loaded is located within the chamber body (110); and, the second transfer mechanism (400) is movably installed on the mounting part (120) and is able to carry the object to be loaded to move back and forth inside and outside the loading and unloading space; and when carrying the object to be loaded to the second set position of the loading and unloading space, the lower cover (221) supports the object to be loaded, and the lower cover (221) supports the object to be loaded when carrying the object to the second set position of the loading and unloading space.

2. The loading and unloading device according to claim 1, characterized in that, The first transfer mechanism (300) includes: a first support member (320) configured to support the object to be loaded, the first support member (320) having a first opening (321) for a pallet (223) to pass through vertically, the pallet (223) being mounted on the lower cover (221); and a first transmission member (310) rotatably mounted on the mounting portion (120) and connected to the first support member (320), the first transmission member (310) being configured to drive the first support member (320) to move to or away from the first set position.

3. The loading and unloading device according to claim 2, characterized in that, The first support member (320) includes a first C-shaped ring, the upper end of the first C-shaped ring having a first support surface (323), the first support surface (323) being configured to support the object to be loaded in a vertical direction; the first C-shaped ring has a first limiting portion (324) protruding from the first support surface (323), the first limiting portion (324) being located at the edge of the first support surface (323), the first limiting portion (324) being configured to restrict the lateral movement of the object to be loaded.

4. The loading and unloading device according to claim 2, characterized in that, The first transmission member (310) includes a first connecting arm, one end of which is rotatably connected to the mounting part (120), and the first support member (320) is fixedly connected to the other end of the first connecting arm.

5. The loading and unloading device according to claim 2, characterized in that, The first transfer mechanism (300) further includes a first transfer sensor (330), which is used to detect whether the first transmission member (310) is located at a first set position.

6. The loading and unloading device according to claim 1, characterized in that, It also includes a first controller and an upper loading position sensor (250) electrically connected to the first controller; the upper loading position sensor (250) is used to detect whether the lifting mechanism has moved to the upper loading position; the first controller is used to control the lifting mechanism to stop running when the upper loading position sensor (250) detects that the lifting mechanism has moved to the upper loading position, and to control the first transfer mechanism (300) to move to the first set position or leave from the first set position, so that the object to be loaded can be transferred between the lower cover (221) and the first transfer mechanism (300).

7. The loading and unloading device according to claim 6, characterized in that, It also includes a lower loading position sensor (260) electrically connected to the first controller; the lower loading position sensor (260) is used to detect whether the lifting mechanism has moved to the lower loading position; the first controller is also used to control the lifting mechanism to stop running when the lower loading position sensor (260) detects that the lifting mechanism has moved to the lower loading position; wherein, the distance between the upper loading position and the lower limit position is greater than the height of the support column (224), and the support column (224) is used to be placed on the lower cover (221) so that the lower cover (221) carries the object to be loaded through the support column (224).

8. The loading and unloading device according to any one of claims 1-7, characterized in that, The second transfer mechanism (400) includes: a second support member (420) configured to support the object to be loaded, the second support member (420) having a second opening (421) for a pallet (223) to pass through vertically, the pallet (223) being mounted on the lower cover (221); and a second transmission member (410) mounted on the mounting portion (120) and connected to the second support member (420), the second transmission member (410) being configured to drive the second support member (420) to move to or away from the second set position.

9. The loading and unloading device according to claim 8, characterized in that, The second support member (420) includes a second C-shaped ring, the upper end of which has a second support surface (423), the second support surface (423) being configured to support the object to be loaded in a vertical direction; the second C-shaped ring has a second limiting portion (424) protruding from the second support surface (423), the second limiting portion (424) being located at the edge of the second support surface (423), the second limiting portion (424) being configured to restrict the lateral movement of the object to be loaded.

10. The loading and unloading device according to claim 8, characterized in that, The second transmission member (410) includes a second connecting arm, one end of which is rotatably connected to the mounting part (120), and the second support member (420) is fixedly connected to the other end of the second connecting arm.

11. The loading and unloading device according to claim 8, characterized in that, The second transfer mechanism (400) further includes a second transfer sensor (430), which is used to detect whether the second transmission member (410) is in the second set position; the second set position is located in the loading and unloading space and is located below the first set position.

12. The loading and unloading device according to claim 1, characterized in that, It also includes a second controller and an upper limit sensor (230) electrically connected to the second controller; the upper limit sensor (230) is used to detect whether the lifting mechanism has moved to the upper limit position; the second controller is used to control the lifting mechanism to stop rising when the upper limit sensor (230) detects that the lifting mechanism has reached the upper limit position, so that the lower cover (221) covers the chamber body (110).

13. The loading and unloading device according to claim 12, characterized in that, It also includes a lower limit sensor (240) electrically connected to the second controller; the lower limit sensor (240) is used to detect whether the lifting mechanism has moved to the lower limit position; the second controller is also used to control the lifting mechanism to stop descending when the lower limit sensor (240) detects that the lifting mechanism has reached the lower limit position, wherein the lower limit position is the lowest position at which the lifting mechanism is allowed to descend.

14. The loading and unloading device according to claim 1, characterized in that, The semiconductor equipment is a crystal growth furnace, and the object to be loaded is a thermal field.

15. A semiconductor device, characterized in that, The device includes a chamber body (110), a lifting mechanism, and a loading and unloading device according to any one of claims 1-14, wherein the loading and unloading space is formed below the chamber body (110), and the lifting mechanism is used to drive the lower cover (221) to move up and down in the loading and unloading space.

16. A loading method for loading an object to be loaded into the semiconductor device of claim 15, characterized in that, The loading method includes: placing the object to be loaded on the second transfer mechanism (400) and controlling the second transfer mechanism (400) to move to the second set position; controlling the lifting mechanism to drive the lower cover (221) to support the object to be loaded; controlling the second transfer mechanism (400) to leave the loading and unloading space; controlling the lifting mechanism to drive the lower cover (221) to lift the object to be loaded a set distance, so that the first transfer mechanism (300) can support the object to be loaded when it moves to the first set position; controlling the first transfer mechanism (300) to lift the object to be loaded to move to the second set position. Move to the first set position and support the object to be loaded; control the lifting mechanism to descend until the distance between the tray (223) on the lower cover (221) and the object to be loaded is greater than the height of the support column (224); place the support column (224) on the tray (223); control the lifting mechanism to rise until the support column (224) can support the object to be loaded; control the first transfer mechanism (300) to leave the first set position; control the lifting mechanism to rise until the lower cover (221) covers the chamber body (110).

17. An unloading method for unloading an object to be loaded from the semiconductor device of claim 15, characterized in that, The unloading method includes: controlling the lifting mechanism to lower the lower cover (221) to support the object to be loaded to a position where the first transfer mechanism (300) can support the object when it moves to the first set position; controlling the first transfer mechanism (300) to move to the first set position and support the object to be loaded; controlling the lifting mechanism to lower until the distance between the tray (223) on the lower cover (221) and the object to be loaded is greater than the height of the support column (224); removing the support column (224) from the tray (223); controlling the lifting mechanism to rise until the lower cover (221) supports the object to be loaded; controlling the first transfer mechanism (300) to leave the first set position; controlling the lifting mechanism to lower to a position where the second transfer mechanism (400) can support the object when it moves to the second set position; controlling the second transfer mechanism (400) to move into the second set position and support the object to be loaded; controlling the lifting mechanism to lower; controlling the second transfer mechanism (400) to move outside the loading space.

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