In-situ test method, device, computer equipment and medium for tensile strength of blind holes

Abstract

This application relates to the technical field of PCB board performance detection, and particularly to a method, device, computer equipment, computer-readable storage medium and computer program product for in-situ testing of the tensile strength of blind vias. The method includes: sampling to obtain a test board with at least three electroplated blind via structures; performing surface roughness treatment on the electroplated blind via structures and the pulling probe; controlling the pulling probe to align with the electroplated blind via structures, and performing room-temperature bonding between the surface of the pulling probe and the surface of the electroplated blind via structures; performing in-situ pulling on the pulling probe at a preset speed until a preset change phenomenon occurs on the test board, and recording the tensile strength value of the electroplated blind via structures. Using this method can directly reflect the actual state of the electroplated blind via structures and improve the accuracy of the tensile strength.

Description

Technical Field

[0001] The present application relates to the technical field of PCB board performance detection, and particularly to a method and device for in-situ testing of the tensile strength of blind vias, a computer device, a computer-readable storage medium, and a computer program product. Background Art

[0002] A blind via is a special groove structure that only extends to one surface of a printed circuit board and is a via hole that realizes interlayer interconnection without penetrating the entire board. With the development of electronic products towards being short, thin, light, small, and high-performance, the wiring density and via density of the interconnection circuit board carrying electronic devices are getting higher and higher, the manufacturing process is getting more and more complex, and the reliability requirements are getting higher and higher. In order to meet the requirements of multi-functional and high-reliability applications, the industry mainly adopts the electroplated blind via structure process to achieve multi-layer interconnection and high-density interconnection at present.

[0003] Currently, for the method of measuring the tensile strength and elongation of the internal organizational structure of the electroplated copper layer metal, it is necessary to prepare standard specimens on the substrate according to the set electroplating process conditions, and then perform tensile measurement on the specimens to indirectly obtain the mechanical property evaluation results of the metal structure. This method cannot directly reflect the actual state of the electroplated blind via structure in terms of electroplating process, size / structural morphology, internal microscopic composition, etc. The measurement conditions vary greatly, and the accuracy of the measurement results is insufficient. Summary of the Invention

[0004] Based on this, in view of the above technical problems, it is necessary to provide a method and device for in-situ testing of the tensile strength of blind vias, a computer device, a computer-readable storage medium, and a computer program product that can directly reflect the actual state of the electroplated blind via structure and improve the accuracy of tensile strength.

[0005] In a first aspect, the present application provides a method for in-situ testing of the tensile strength of blind vias, including:

[0006] Sampling to obtain a test board having at least three electroplated blind via structures;

[0007] Performing surface roughness treatment on the electroplated blind via structure and the pulling probe;

[0008] Controlling the pulling probe to align with the electroplated blind via structure, and performing room-temperature bonding on the surface of the pulling probe and the surface of the electroplated blind via structure;

[0009] Performing in-situ pulling on the pulling probe at a preset speed until a preset change phenomenon occurs on the test board, and recording the tensile strength value of the electroplated blind via structure.

[0010] In one embodiment, performing surface roughness treatment on the electroplated blind via structure includes:

[0011] According to the requirements of microtomy sample preparation, the surface of the electroplated blind hole structure is preliminarily ground and polished.

[0012] Using a fast atom beam source or plasma source technology, the surface of the electroplated blind hole structure is activated under vacuum conditions.

[0013] In one embodiment, the method further includes:

[0014] Using a fast atom beam source or plasma source technology, the surface of the drawing probe is activated under vacuum conditions.

[0015] In one embodiment, the surface roughness treatment of the drawing probe includes:

[0016] When the surface roughness of the electroplated blind hole structure reaches the atomic level, the corresponding activation treatment is ended.

[0017] When the surface roughness of the drawing probe reaches the atomic level, the corresponding activation treatment is ended.

[0018] In one embodiment, the drawing probe includes a head bonding layer and a support; wherein, the head bonding layer is used to bond the electroplated blind hole structure, and the connection manner between the head bonding layer and the support includes a welding manner.

[0019] In one embodiment, after recording the tensile strength value of the electroplated blind hole structure, it further includes:

[0020] Obtain the average value of the tensile strength values of at least three electroplated blind hole structures and use it as the target blind hole tensile strength value of the test board.

[0021] In a second aspect, the present application also provides an in-situ test device for blind hole tensile strength, including:

[0022] A sampling module for sampling to obtain a test board with at least three electroplated blind hole structures;

[0023] A processing module for performing surface roughness treatment on the electroplated blind hole structure and the drawing probe;

[0024] A bonding module for controlling the drawing probe to align with the electroplated blind hole structure and performing room-temperature bonding between the surface of the drawing probe and the surface of the electroplated blind hole structure;

[0025] A moving module for in-situ drawing of the drawing probe at a preset speed until a preset change phenomenon occurs in the test board;

[0026] A calculation module for recording the tensile strength value of the electroplated blind hole structure.

[0027] In a third aspect, the present application also provides a computer device, including a memory and a processor. The memory stores a computer program, and when the processor executes the computer program, the following steps are implemented:

[0028] Sampling to obtain a test board with at least three electroplated blind via structures;

[0029] Performing surface roughness treatment on the electroplated blind via structures and the pulling probe;

[0030] Controlling the pulling probe to align with the electroplated blind via structures, and performing room-temperature bonding between the surface of the pulling probe and the surface of the electroplated blind via structures;

[0031] Pulling the pulling probe in-situ at a preset speed until a preset change phenomenon occurs on the test board, and recording the tensile strength value of the electroplated blind via structures.

[0032] In a fourth aspect, the present application also provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the following steps are implemented:

[0033] Sampling to obtain a test board with at least three electroplated blind via structures;

[0034] Performing surface roughness treatment on the electroplated blind via structures and the pulling probe;

[0035] Controlling the pulling probe to align with the electroplated blind via structures, and performing room-temperature bonding between the surface of the pulling probe and the surface of the electroplated blind via structures;

[0036] Pulling the pulling probe in-situ at a preset speed until a preset change phenomenon occurs on the test board, and recording the tensile strength value of the electroplated blind via structures.

[0037] In a fifth aspect, the present application also provides a computer program product, including a computer program. When the computer program is executed by a processor, the following steps are implemented:

[0038] Sampling to obtain a test board with at least three electroplated blind via structures;

[0039] Performing surface roughness treatment on the electroplated blind via structures and the pulling probe;

[0040] Controlling the pulling probe to align with the electroplated blind via structures, and performing room-temperature bonding between the surface of the pulling probe and the surface of the electroplated blind via structures;

[0041] Pulling the pulling probe in-situ at a preset speed until a preset change phenomenon occurs on the test board, and recording the tensile strength value of the electroplated blind via structures.

[0042] The above in-situ testing method, device, computer equipment, computer-readable storage medium and computer program product for the tensile strength of blind holes can directly test on the electroplated blind hole structure, avoiding the complex process of preparing standard specimens in the traditional method, thus more directly reflecting the actual state of the blind holes. Through in-situ testing, that is, tensile measurement on the actual electroplated blind hole structure, the errors caused by differences in specimen preparation and measurement conditions can be reduced, and the accuracy of the measurement results can be improved. This method simplifies the testing process, reduces the time for specimen preparation and measurement, and thus improves the testing efficiency. This method is applicable to electroplated blind hole structures of different sizes and structures, with good versatility. Through surface roughness treatment and room-temperature bonding technology, the connection stability during the testing process can be ensured, the testing errors caused by poor connection can be reduced, and the reliability of the testing results can be improved. This method can more accurately evaluate the mechanical properties of the internal organizational structure of metals, helping to understand the influence of the microscopic composition of electroplated blind hole structures on their performance. The data obtained through this testing method can help optimize the electroplating process and improve the quality and performance of blind holes. Description of the Drawings

[0043] In order to more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the following will briefly introduce the drawings required for use in the description of the embodiments of the present application or related technologies. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.

[0044] Figure 1 It is an application environment diagram of the in-situ testing method for the tensile strength of blind holes in an embodiment;

[0045] Figure 2 It is a schematic flowchart of the in-situ testing method for the tensile strength of blind holes in an embodiment;

[0046] Figure 3 It is a schematic diagram of the testing process of the steps of the in-situ testing method for the tensile strength of blind holes in an embodiment;

[0047] Figure 4 It is a schematic flowchart of the in-situ testing method for the tensile strength of blind holes in another embodiment;

[0048] Figure 5 It is a structural block diagram of the in-situ testing device for the tensile strength of blind holes in an embodiment;

[0049] Figure 6 It is an internal structure diagram of a computer device in an embodiment. Detailed Embodiments

[0050] In order to make the objectives, technical solutions, and advantages of this application clearer and more understandable, the following further elaborates on this application in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely used to explain this application and are not used to limit this application.

[0051] The in-situ test method for the tensile strength of blind holes provided by the embodiments of this application can be applied to an application environment as Figure 1 shown. Among them, the terminal 102 communicates with the server 104 through a network. The data storage system can store the data that the server 104 needs to process. The data storage system can be integrated on the server 104, or placed in the cloud or other network servers.

[0052] The server 104 samples a test board with at least three electroplated blind hole structures; performs surface roughness treatment on the electroplated blind hole structures; controls the drawing probe to align with the electroplated blind hole structures, and bonds the surface of the drawing probe with the surface of the electroplated blind hole structures at room temperature; performs in-situ drawing on the drawing probe at a preset speed until a preset change phenomenon occurs on the test board, and records the tensile strength value of the electroplated blind hole structures.

[0053] Among them, the terminal 102 can be, but is not limited to, various personal computers, laptop computers, smartphones, and tablet computers. The server 104 can be an independent physical server, or a server cluster or distributed system composed of multiple physical servers, or a cloud server providing cloud computing services.

[0054] In an exemplary embodiment, as Figure 2 shown, a method for in-situ testing the tensile strength of blind holes is provided. Taking the server in Figure 1 as an example for illustration, it includes the following steps S202 to step S208. Among them:

[0055] Step S202: Sample a test board with at least three electroplated blind hole structures.

[0056] Specifically, it refers to selecting a part of the samples from the production batch. These samples should be able to represent the characteristics and quality of the entire batch. It refers to the printed circuit board (PCB) used for testing. In this case, the test board is the object of the experiment and is used to evaluate the performance of the electroplated blind via structure. It means that the selected test board should contain at least three blind vias, which are formed by the electroplating process and have specific structural characteristics. A blind via is a special type of via hole that only extends to one surface of the PCB and is used to achieve interlayer electrical connection. Here it refers to a surface treatment process where a metal layer (usually copper) is deposited on the inner wall of the blind via by an electrochemical method to achieve the required electrical conductivity and connectivity. The purpose of sampling is to obtain a sufficiently representative sample to ensure that the test results can accurately reflect the performance of the electroplated blind via structure of the entire production batch.

[0057] Step S204, perform surface roughness treatment on the electroplated blind via structure and the pulling probe.

[0058] Specifically, surface roughness refers to the microscopic geometric shape characteristics of an object's surface, such as unevenness, texture, etc. In the electroplated blind via structure and the pulling probe, surface roughness will affect the contact quality with the test equipment, and thus affect the accuracy of the test results. Through surface roughness treatment, the surface conditions of the electroplated blind via structure and the pulling probe can be improved, reducing test errors caused by surface defects or non-uniformities, and improving the reliability of the test results. Surface roughness treatment includes methods such as mechanical grinding, chemical polishing, and electrolytic polishing, depending specifically on the materials, shapes, and required surface quality of the electroplated blind via structure and the pulling probe. The treated surface should meet certain quality standards, such as smoothness, cleanliness, etc., to ensure connection stability and data accuracy during the test. Surface roughness treatment is a necessary preparatory step before the test, creating good conditions for the subsequent pulling test. In in-situ testing, the pulling probe needs to form a stable connection with the blind via surface. Surface roughness treatment helps to improve the stability of this connection and reduce test errors caused by poor contact.

[0059] Step S206, control the pulling probe to align with the electroplated blind via structure and perform room-temperature bonding between the surface of the pulling probe and the surface of the electroplated blind via structure.

[0060] Specifically, the pulling probe refers to the equipment component used to apply tensile force, which will directly contact and connect with the electroplated blind via structure. Ensure that the pulling probe is precisely aligned with the center or predetermined position of the blind via, which is to ensure that the tensile force is evenly applied along the desired direction and avoid test result deviations caused by eccentric forces.

[0061] The electroplated blind via structure refers to a non-penetrating via hole formed on the PCB by the electroplating process for interlayer interconnection.

[0062] Before bonding, the surface of the blind hole has undergone a specific surface roughness treatment to ensure a smooth and clean contact surface with the pulling probe, thereby improving the quality of bonding and the accuracy of testing. It refers to achieving the connection between the probe and the surface of the blind hole through physical or chemical methods at room temperature without the aid of additional heat energy or pressure. Bonding at room temperature can avoid the interference of temperature factors on the test results. The purpose of bonding is to ensure a stable connection between the pulling probe and the blind hole during the pulling test, and prevent test failures or inaccurate data caused by unstable connections. Precise alignment and stable bonding are crucial for obtaining accurate test data and can avoid errors caused by improper operation or connection problems.

[0063] Exemplarily, as Figure 3 shown, the test temperature for room temperature bonding is at (25°C ± 2°C) or lower temperature conditions, and the pressure in the ultra-high vacuum environment can be (10 -3 Pa to 10 -9 Pa) or lower pressure conditions. Align the pulling probe with the electroplated blind hole structure, and control the central axis alignment accuracy within 5 nm - 10 nm. The surface coverage area of the two interfaces accounts for 60% - 100% of the surface of the electroplated blind hole structure. Apply an appropriate pressure to the pulling probe, and the surface of the pulling probe contacts the surface of the electroplated blind hole structure to generate strong adhesion force to achieve bonding.

[0064] Step S208, perform in-situ pulling on the pulling probe at a preset speed until a preset change phenomenon appears on the test board, and record the tensile strength value of the electroplated blind hole structure.

[0065] Specifically, the preset speed refers to the speed at which the pulling probe moves in the pulling test, which is set in advance. In this application, the preset speed can be 0.005 mm / min - 0.500 mm / min; perform slow pulling within this moving speed, and this speed needs to ensure the stability of the test and the accuracy of the data.

[0066] In-situ means that the test is carried out at the original position of the sample without the need to move the sample from its normal position. Pulling means that the probe applies an outward pulling force to the sample.

[0067] The preset change phenomena include the destruction of the blind hole structure, the fracture of the material, the failure of the connection, etc. These change phenomena will be defined in advance in the test as the judgment criteria for the end of the test.

[0068] During the test, the force and displacement applied by the pulling probe will be continuously monitored and recorded until the preset change phenomenon is reached. At this time, the maximum value of the recorded force is the tensile strength value of the electroplated blind hole structure. The purpose of the test is to evaluate the mechanical properties of the electroplated blind hole structure when subjected to a pulling force, especially its maximum bearing force, that is, the tensile strength.

[0069] In the above in-situ tensile strength testing method for blind holes, it is possible to directly perform tests on the electroplated blind hole structure, avoiding the complex process of preparing standard specimens in traditional methods, and thus more directly reflecting the actual state of the blind holes. Through in-situ testing, that is, tensile measurement on the actual electroplated blind hole structure, errors caused by differences in specimen preparation and measurement conditions can be reduced, and the accuracy of the measurement results can be improved. This method simplifies the testing process, reduces the time for specimen preparation and measurement, and thus improves the testing efficiency. This method is applicable to electroplated blind hole structures of different sizes and structures, and has good versatility. Through surface roughness treatment and room temperature bonding technology, the connection stability during the testing process can be ensured, test errors caused by poor connection can be reduced, and the reliability of the test results can be improved. This method can more accurately evaluate the mechanical properties of the internal tissue structure of metals, and helps to understand the influence of the microscopic composition of the electroplated blind hole structure on its performance. The data obtained through this testing method can help optimize the electroplating process and improve the quality and performance of the blind holes.

[0070] In an exemplary embodiment, as Figure 4 shown, the surface roughness treatment of the electroplated blind hole structure includes:

[0071] Step S402, according to the requirements of microtomy sample preparation, perform preliminary grinding and polishing on the surface of the electroplated blind hole structure;

[0072] Moreover, in order to further reduce the surface roughness of the electroplated blind hole structure, obtain a blind hole structure surface with uniform surface height, and improve the subsequent bonding effect, further fine grinding and polishing can be carried out, and the process means include but are not limited to mechanical methods, chemical-mechanical methods, etc.;

[0073] Step S404, use a fast atom beam source or plasma source technology to perform activation treatment on the surface of the electroplated blind hole structure under vacuum conditions.

[0074] Specifically, the requirements of microtomy sample preparation are a sample preparation process, aiming to prepare samples for microscopic examination or further surface analysis. Grinding is to use sandpaper or other grinding tools to remove the rough parts on the material surface and reduce the surface roughness. Polishing is to further smooth the surface, usually using polishing paste and polishing cloth to obtain a smoother and more reflective surface. For example, according to the requirements of microtomy sample preparation, grind and polish the surface of the electroplated blind hole structure, and observe the ground surface with a 100X - 200X metallurgical microscope until it is flat and bright, and the surface roughness of the ground and polished sample is between 1μm and 5μm. These steps help to remove defects generated during the electroplating process, such as burrs, uneven coatings, etc.

[0075] The fast atom beam source or plasma source technology is a surface treatment technology used to improve the physical and chemical properties of the material surface. A fast atom beam source (such as ion implantation) can introduce new atoms or molecules into the material surface, changing the composition and structure of the surface layer. Plasma source technology uses reactive particles in the plasma (such as ions, free radicals, etc.) to react with the material surface to clean or modify the surface. A vacuum environment can reduce the interference of air on the treatment process, such as the effects of oxidation and other pollutants.

[0076] Exemplarily, the ion source includes but is not limited to Ar+, He+, etc., the activation cavity voltage is between 500V - 5000V. To avoid re-oxidation of the surface of the electroplated blind hole structure after activation, the bombardment activation process must be carried out under ultra-vacuum protection, and the vacuum degree is set to 10 -3 Pa ~ 10 -9 Pa or lower. Adjust the ion source bombardment parameters to reduce the average surface roughness of the electroplated blind hole structure after bombardment. The purpose of the activation treatment is to improve the surface activity of the electroplated blind hole structure, for example, by cleaning the organic pollutants on the surface of the electroplated blind hole structure, increasing the surface energy, etc. This treatment can enhance the subsequent bonding force with the surface of the drawing probe.

[0077] In this embodiment, by performing different roughness treatments on the surface of the electroplated blind hole structure, the purpose is to improve the surface quality of the electroplated blind hole structure, provide better surface conditions for subsequent tests or applications. The surface treatment can ensure the accuracy of the test and avoid errors caused by surface defects.

[0078] In an exemplary embodiment, the surface roughness treatment of the drawing probe includes:

[0079] Using the fast atom beam source or plasma source technology, the surface of the drawing probe is activated under vacuum conditions.

[0080] Specifically, exemplarily, the ion source includes but is not limited to Ar+, He+, etc., the activation cavity voltage is between 500V - 5000V. To avoid re-oxidation of the surface of the drawing probe after activation, the bombardment activation process must be carried out under ultra-vacuum protection, and the vacuum degree is set to 10 -3 Pa ~ 10 -9 Pa or lower. Adjust the ion source bombardment parameters to reduce the average surface roughness of the drawing probe after bombardment. The purpose of the activation treatment is to improve the surface activity of the drawing probe, for example, by cleaning the organic pollutants on the surface of the drawing probe, increasing the surface energy, etc. This treatment can enhance the subsequent bonding force with the surface of the electroplated blind hole structure.

[0081] In this embodiment, by performing different roughness treatments on the surface of the drawing probe, the purpose is to improve the surface quality of the drawing probe, provide better surface conditions for subsequent tests or applications, and the surface treatment can ensure the accuracy of the test and avoid errors caused by surface defects.

[0082] In an exemplary embodiment, when the surface roughness of the electroplated blind hole structure reaches the atomic level, the corresponding activation treatment is terminated; when the surface roughness of the drawing probe reaches the atomic level, the corresponding activation treatment is terminated.

[0083] Specifically, atomic-level surface roughness means that the smoothness of the surface is very high, approaching the flatness at the atomic scale. When the surface roughness of the electroplated blind hole structure and the drawing probe reaches the atomic level, it is considered that the activation treatment is sufficient and this step can be terminated, which usually requires a high-precision surface roughness measurement device (such as an atomic force microscope (AFM), a scanning electron microscope (SEM), etc.) to determine.

[0084] In this embodiment, by precisely controlling the activation treatment process, extremely high requirements for surface roughness are achieved.

[0085] In an exemplary embodiment, the drawing probe includes a head bonding layer and a support body; wherein, the head bonding layer is used to bond the electroplated blind hole structure, and the connection method between the head bonding layer and the support body includes a welding method.

[0086] Specifically, the head bonding layer is a part of the drawing probe, and its main function is to form a stable connection with the electroplated blind hole structure. This layer needs to have good adhesion or bonding ability to ensure that the connection with the blind hole structure will not break during the drawing process. The support body is another part of the drawing probe, providing necessary support and stability for the head bonding layer. The design of the support body needs to consider strength and rigidity to withstand the forces generated during the drawing process. The materials of the head bonding layer include but are not limited to Cu, Al, Ni, SiO 2 、Al 2 O 3 etc. The diameter range of the probe bonding layer can be 30μm - 2mm.

[0087] The connection method between the head bonding layer and the support body determines the overall stability and reliability of the drawing probe. The connection method needs to be able to withstand the forces generated during the drawing process and ensure the durability of the connection; in addition to welding, the connection method can also be mechanical connection and bonding, etc.

[0088] Welding is a common joining method. By heating two materials to a molten state and mixing them, a strong connection is formed during the cooling process. In a pull probe, welding can provide a very stable connection because it can form a metallurgical bond between the head bonding layer and the support body.

[0089] In this embodiment, by connecting the head bonding layer and the support body by welding, a sealed connection can be formed to prevent the penetration of liquid or gas.

[0090] In an exemplary embodiment, after recording the tensile strength values of the electroplated blind via structures, it further includes:

[0091] Obtain the average value of the tensile strength values of at least three electroplated blind via structures and use it as the target blind via tensile strength value of the test board.

[0092] Specifically, in the pull test, each test will obtain a tensile strength value of an electroplated blind via structure, which is the maximum tensile force that the material can withstand. By repeating the test multiple times, multiple tensile strength values can be collected. Calculate the average value of these values to reduce the influence of random errors or outliers in individual tests on the results. The average value is used to represent the overall tensile strength characteristics of the electroplated blind vias on the test board. It can be used as an important indicator to evaluate the quality of the electroplated blind via structure.

[0093] In addition to calculating the average value, other statistical analyses can also be performed, such as calculating the standard deviation, coefficient of variation, etc., to evaluate the degree of dispersion of the data.

[0094] In this embodiment, by obtaining the average value of the tensile strength values of at least three electroplated blind via structures, in order to obtain a reliable value that can represent the target blind via tensile strength of the test board, this value helps to scientifically evaluate the performance of the material and serves as a basis for quality control and process improvement.

[0095] It should be understood that although the various steps in the flowcharts involved in the above-described embodiments are shown in sequence according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless there is a clear indication in this article, the execution of these steps has no strict order limit, and these steps can be executed in other orders. Moreover, at least a part of the steps in the flowcharts involved in the above-described embodiments may include multiple steps or multiple stages, and these steps or stages are not necessarily executed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily sequential, but can be executed alternately or alternately with at least a part of other steps or steps or stages in other steps.

[0096] Based on the same inventive concept, an embodiment of the present application further provides a blind hole tensile strength in-situ testing device for implementing the blind hole tensile strength in-situ testing method involved above. The solution provided by this device to solve the problem is similar to the solution described in the above method. Therefore, the specific limitations in one or more embodiments of the blind hole tensile strength in-situ testing device provided below can refer to the limitations on the blind hole tensile strength in-situ testing method in the above text, and will not be repeated here.

[0097] In an exemplary embodiment, as Figure 5 shown, a blind hole tensile strength in-situ testing device is provided, including: a sampling module 502, configured to sample and obtain a test board having at least three electroplated blind hole structures;

[0098] a processing module 504, configured to perform surface roughness treatment on the electroplated blind hole structure and the pulling probe;

[0099] a bonding module 506, configured to control the pulling probe to align with the electroplated blind hole structure and perform room-temperature bonding on the surface of the pulling probe and the surface of the electroplated blind hole structure;

[0100] a moving module 508, configured to perform in-situ pulling on the pulling probe at a preset speed until a preset change phenomenon occurs on the test board;

[0101] a calculation module 510, configured to record the tensile strength value of the electroplated blind hole structure.

[0102] In an exemplary embodiment, the processing module 504 is further configured to perform preliminary grinding and polishing treatment on the surface of the electroplated blind hole structure according to the requirements of microtomy sample preparation; and perform activation treatment on the surface of the electroplated blind hole structure under vacuum conditions by using a fast atom beam source or plasma source technology.

[0103] In an exemplary embodiment, the processing module 504 is further configured to perform activation treatment on the surface of the pulling probe under vacuum conditions by using a fast atom beam source or plasma source technology.

[0104] In an exemplary embodiment, the processing module 504 is further configured to end the corresponding activation treatment when the surface roughness of the electroplated blind hole structure reaches the atomic level; and end the corresponding activation treatment when the surface roughness of the pulling probe reaches the atomic level.

[0105] In an exemplary embodiment, the pulling probe includes a head bonding layer and a support body; wherein, the head bonding layer is used to bond the electroplated blind hole structure, and the connection manner between the head bonding layer and the support body includes a welding manner.

[0106] In an exemplary embodiment, the calculation module 510 is further configured to obtain an average value of the tensile strength values of at least three electroplated blind via structures, and use it as the target blind via tensile strength value of the test board.

[0107] Each module in the above blind via tensile strength in-situ testing device can be implemented in whole or in part by software, hardware, and their combination. Each of the above modules can be embedded in or independent of the processor in the computer device in the form of hardware, or stored in the memory of the computer device in the form of software, so that the processor can call and execute the operations corresponding to each of the above modules.

[0108] In an exemplary embodiment, a computer device is provided. The computer device can be a server, and its internal structure diagram can be as Figure 6 shown. The computer device includes a processor, a memory, an input / output interface (Input / Output, abbreviated as I / O), and a communication interface. Among them, the processor, the memory, and the input / output interface are connected through a system bus, and the communication interface is connected to the system bus through the input / output interface. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program, and a database. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The database of the computer device is used to store tensile strength value data. The input / output interface of the computer device is used to exchange information between the processor and external devices. The communication interface of the computer device is used to communicate with external terminals through a network connection. When the computer program is executed by the processor, it implements a blind via tensile strength in-situ testing method.

[0109] Those skilled in the art can understand that Figure 6 the structure shown in

[0110] is only a block diagram of some structures related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than those shown in the figure, or combine some components, or have a different component layout.

[0110] In an exemplary embodiment, a computer device is provided, including a memory and a processor. A computer program is stored in the memory. When the processor executes the computer program, the following steps are implemented:

[0111] Sampling to obtain a test board with at least three electroplated blind via structures;

[0112] Performing surface roughness treatment on the electroplated blind via structure and the pulling probe;

[0113] Control the drawing probe to align with the electroplated blind hole structure, and bond the surface of the drawing probe with the surface of the electroplated blind hole structure at room temperature;

[0114] Pull the drawing probe in situ at a preset speed until a preset change phenomenon appears on the test board, and record the tensile strength value of the electroplated blind hole structure.

[0115] In one embodiment, when the processor executes the computer program, the following steps are also implemented:

[0116] According to the requirements of microtomy sample preparation, perform preliminary grinding and polishing on the surface of the electroplated blind hole structure;

[0117] Use a fast atom beam source or plasma source technology to activate the surface of the electroplated blind hole structure under vacuum conditions.

[0118] In one embodiment, when the processor executes the computer program, the following steps are also implemented:

[0119] Use a fast atom beam source or plasma source technology to activate the surface of the drawing probe under vacuum conditions.

[0120] In one embodiment, when the processor executes the computer program, the following steps are also implemented:

[0121] When the surface roughness of the electroplated blind hole structure reaches the atomic level, end the corresponding activation treatment;

[0122] When the surface roughness of the drawing probe reaches the atomic level, end the corresponding activation treatment.

[0123] In one embodiment, when the processor executes the computer program, the following steps are also implemented:

[0124] The drawing probe includes a head bonding layer and a support; wherein, the head bonding layer is used to bond the electroplated blind hole structure, and the connection method between the head bonding layer and the support includes a welding method.

[0125] In one embodiment, when the processor executes the computer program, the following steps are also implemented:

[0126] Obtain the average value of the tensile strength values of at least three electroplated blind hole structures and use it as the target blind hole tensile strength value of the test board.

[0127] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the following steps are implemented:

[0128] Sample to obtain a test board with at least three electroplated blind hole structures;

[0129] Perform surface roughness treatment on the electroplated blind hole structure and the pulling probe;

[0130] Control the pulling probe to align with the electroplated blind hole structure, and perform room-temperature bonding on the surface of the pulling probe and the surface of the electroplated blind hole structure;

[0131] Pull the pulling probe in-situ at a preset speed until a preset change phenomenon appears on the test board, and record the tensile strength value of the electroplated blind hole structure.

[0132] In one embodiment, when the computer program is executed by a processor, the following steps are further implemented:

[0133] Perform preliminary grinding and polishing treatment on the surface of the electroplated blind hole structure according to the requirements of microtomy sample preparation;

[0134] Adopt a fast atom beam source or plasma source technology to perform activation treatment on the surface of the electroplated blind hole structure under vacuum conditions.

[0135] In one embodiment, when the computer program is executed by a processor, the following steps are further implemented:

[0136] Adopt a fast atom beam source or plasma source technology to perform activation treatment on the surface of the pulling probe under vacuum conditions.

[0137] In one embodiment, when the computer program is executed by a processor, the following steps are further implemented:

[0138] When the surface roughness of the electroplated blind hole structure reaches the atomic level, end the corresponding activation treatment;

[0139] When the surface roughness of the pulling probe reaches the atomic level, end the corresponding activation treatment.

[0140] In one embodiment, when the computer program is executed by a processor, the following steps are further implemented:

[0141] The pulling probe includes a head bonding layer and a support; wherein, the head bonding layer is used to bond the electroplated blind hole structure, and the connection method between the head bonding layer and the support includes a welding method.

[0142] In one embodiment, when the computer program is executed by a processor, the following steps are further implemented:

[0143] Obtain the average value of the tensile strength values of at least three electroplated blind hole structures, and use it as the target blind hole tensile strength value of the test board.

[0144] In one embodiment, a computer program product is provided, including a computer program, and when the computer program is executed by a processor, the following steps are implemented:

[0145] Sample a test board with at least three electroplated blind via structures;

[0146] Perform surface roughness treatment on the electroplated blind via structures and the pulling probe;

[0147] Control the pulling probe to align with the electroplated blind via structures, and perform room-temperature bonding between the surface of the pulling probe and the surface of the electroplated blind via structures;

[0148] Pull the pulling probe in-situ at a preset speed until a preset change phenomenon occurs on the test board, and record the tensile strength value of the electroplated blind via structures.

[0149] In one embodiment, when the computer program is executed by the processor, the following steps are further implemented:

[0150] According to the requirements of microtomy sample preparation, perform preliminary grinding and polishing treatment on the surface of the electroplated blind via structures;

[0151] Adopt a fast atom beam source or plasma source technology to perform activation treatment on the surface of the electroplated blind via structures under vacuum conditions.

[0152] In one embodiment, when the computer program is executed by the processor, the following steps are further implemented:

[0153] Adopt a fast atom beam source or plasma source technology to perform activation treatment on the surface of the pulling probe under vacuum conditions.

[0154] In one embodiment, when the computer program is executed by the processor, the following steps are further implemented:

[0155] When the surface roughness of the electroplated blind via structures reaches the atomic level, end the corresponding activation treatment;

[0156] When the surface roughness of the pulling probe reaches the atomic level, end the corresponding activation treatment.

[0157] In one embodiment, when the computer program is executed by the processor, the following steps are further implemented:

[0158] The pulling probe includes a head bonding layer and a support body; wherein, the head bonding layer is used to bond the electroplated blind via structures, and the connection method between the head bonding layer and the support body includes a welding method.

[0159] In one embodiment, when the computer program is executed by the processor, the following steps are further implemented:

[0160] Obtain the average value of the tensile strength values of at least three electroplated blind via structures, and use it as the target blind via tensile strength value of the test board.

[0161] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data for analysis, stored data, displayed data, etc.) involved in this application are all information and data that have been authorized by the user or fully authorized by all parties, and the collection, use, and processing of relevant data need to comply with relevant regulations.

[0162] Those of ordinary skill in the art can understand that all or part of the processes in the methods of the above embodiments can be completed by instructing relevant hardware through a computer program. The computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above methods. Among them, any reference to a memory, database, or other medium used in the embodiments provided in this application can include at least one of non-volatile memory and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetoresistive random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM), etc. The databases involved in the embodiments provided in this application can include at least one of relational databases and non-relational databases. Non-relational databases can include distributed databases based on blockchain, etc., without limitation. The processors involved in the embodiments provided in this application can be general-purpose processors, central processing units, graphics processing units, digital signal processors, programmable logic devices, data processing logics based on quantum computing, artificial intelligence (AI) processors, etc., without limitation.

[0163] The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity of description, not all combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope recorded in this application.

[0164] The above-described embodiments merely represent several implementation manners of this application. The description thereof is relatively specific and detailed, but it should not be construed as a limitation on the patent scope of this application. It should be noted that for those of ordinary skill in the art, without departing from the concept of this application, several modifications and improvements can still be made, and these all belong to the protection scope of this application. Therefore, the protection scope of this application shall be subject to the appended claims.

Claims

1. A method for in-situ testing of tensile strength of blind holes, characterized in that: The method comprises: Sampling and obtaining a test board having at least three electroplated blind hole structures; Performing surface roughness treatment on the electroplated blind hole structure and the pulling probe; The surface roughness treatment of the electroplated blind hole structure includes: preliminary grinding and polishing of the surface of the electroplated blind hole structure according to the micro-sectioning sample preparation requirements; activation treatment of the surface of the electroplated blind hole structure under vacuum conditions by using fast atomic beam source or plasma source technology; surface roughness treatment of the pulling probe includes: activation treatment of the surface of the pulling probe under vacuum conditions by using fast atomic beam source or plasma source technology; Controlling the pulling probe to align with the electroplated blind hole structure, and bonding the surface of the pulling probe to the surface of the electroplated blind hole structure at room temperature; The pulling probe is pulled in situ at a preset speed until a preset change phenomenon occurs on the test plate, and the tensile strength value of the electroplated blind hole structure is recorded.

2. The method according to claim 1, characterized in that The method further comprises: When the surface roughness of the electroplated blind hole structure reaches the atomic level, the corresponding activation treatment is terminated; When the surface roughness of the pulling probe reaches the atomic level, the corresponding activation treatment is ended.

3. The method according to claim 1, characterized in that The pulling probe comprises a head bonding layer and a support body; wherein the head bonding layer is used to bond the electroplated blind hole structure, and the connection method of the head bonding layer and the support body comprises welding.

4. The method according to claim 1, characterized in that: After recording the tensile strength value of the electroplated blind hole structure, the method further includes: An average value of the tensile strength values ​​of at least three electroplated blind hole structures is obtained and used as the target blind hole tensile strength value of the test board.

5. A blind hole tensile strength in-situ testing device, characterized in that: The device comprises: A sampling module, used for sampling and obtaining a test board having at least three electroplated blind hole structures; A processing module is used to perform surface roughness treatment on the electroplated blind hole structure and the pulling probe; wherein the surface roughness treatment on the electroplated blind hole structure includes: performing preliminary grinding and polishing treatment on the surface of the electroplated blind hole structure according to the micro-sectioning sample preparation requirements; using a fast atomic beam source or a plasma source technology to activate the surface of the electroplated blind hole structure under vacuum conditions; performing surface roughness treatment on the pulling probe includes: using a fast atomic beam source or a plasma source technology to activate the surface of the pulling probe under vacuum conditions; A bonding module, used for controlling the pulling probe to align with the electroplated blind hole structure, and bonding the surface of the pulling probe to the surface of the electroplated blind hole structure at room temperature; A moving module, used for in-situ drawing of the drawing probe at a preset speed until a preset change phenomenon occurs on the test plate; The calculation module is used to record the tensile strength value of the electroplated blind hole structure.

6. The device according to claim 5, characterized in that The processing module is also used to end the corresponding activation treatment when the surface roughness of the electroplated blind hole structure reaches the atomic level; and end the corresponding activation treatment when the surface roughness of the pulling probe reaches the atomic level.

7. The device according to claim 5, characterized in that The pulling probe comprises a head bonding layer and a support body; wherein the head bonding layer is used to bond the electroplated blind hole structure, and the connection method of the head bonding layer and the support body comprises welding.

8. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 4 are implemented.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 4 are implemented.

10. A computer program product, comprising a computer program, characterized in that When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 4 are implemented.

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