A method for manufacturing a high-shielding flexible circuit board similar to a wiring harness

Abstract

The present invention discloses a method for manufacturing a wire harness-like high-shielding flexible circuit board, comprising the steps of: setting a laminated winding area and a flattening area on the flexible board, dividing the laminated winding area into a plurality of split boards distributed in parallel, adding an expansion area in the splitting direction, manufacturing a circuit pattern including an impedance line, forming a flexible core board, manufacturing a shielding line, corresponding to the impedance line distribution, stacking the flexible core board, the adhesive layer, and the shielding layer core board in sequence, and performing a first pressing, taking a shielding film, attaching it to one side of the shielding layer core board of the pressed board, and performing a second pressing, and splitting to form a plurality of split sub-boards distributed in parallel, and winding them with acetate tape to form a wire harness-like high-shielding flexible circuit board; the technical solution of the present invention effectively improves the impedance accuracy between the laminated boards by setting a shielding line and a graphic shielding film, and can form a wire harness-like high-shielding flexible circuit board with high shielding and high reliability.

Description

Technical Field

[0001] The present invention relates to the field of flexible circuit board manufacturing, and in particular to a method for manufacturing a wire harness-like highly shielded flexible circuit board. Background Art

[0002] With the continuous development of technologies in new energy vehicles, low-altitude aircraft and other fields, higher requirements are placed on the wiring harnesses used in them, and the use of flexible circuit boards to replace traditional wiring harnesses has emerged.

[0003] In a type of design that requires routing in a small space and needs to carry more conductive lines or signal lines, the application of traditional single-sided or double-sided flexible circuit boards will result in a large circuit board area and inconvenient application. If the design is directly changed to a multi-layer flexible circuit board, there will be problems such as greater design and processing difficulty and relatively weak flexibility. Therefore, there is a design of a single-sided or double-sided flexible circuit board, but in an area where stacking is required, the board body in this area is punched into multiple evenly distributed sub-boards, and then the sub-boards are stacked and wound to form a locally wound stack to form a multi-layer flexible board, while the connection ends or welding ends at both ends are still single-sided or double-sided flexible boards. This harness-like flexible circuit board can effectively improve the space saving, multi-conductivity and flexibility of the flexible circuit board.

[0004] When the processing accuracy requirements for this type of flexible circuit board are high, and there is an impedance line design with high impedance requirements, the local winding stacking makes the layers fit together, and the impedance lines distributed in each layer will have mutual influence problems, resulting in impedance values ​​exceeding the standard and reducing the high-precision performance and signal performance of the entire board.

[0005] However, when the circuit pattern of this type of flexible circuit board is a thick copper circuit pattern, there may be a problem of insufficient bonding strength of the covering film layer to fill the line gaps of the thick copper circuit pattern when the covering film is attached, which is prone to delamination, blistering, or even falling off of the covering film layer. Since the attachment of the covering film layer also has a certain impact on the impedance value, this type of problem further affects the impedance value of the impedance line, resulting in a large error and affecting the quality of the entire board.

[0006] Therefore, in order to solve the problems raised by the above background technology, it is necessary to provide a method for manufacturing a wire harness-like highly shielded flexible circuit board. Summary of the Invention

[0007] The present invention aims to solve the problems of the existing partially wound laminated wire harness-like flexible circuit boards during processing, such as the mutual influence of the impedance lines of the laminated layers, and the insufficient gaps between the cover film and the filling lines of the thick copper circuit patterns, resulting in excessive impedance values ​​and reduced quality of the entire board. A method for manufacturing a wire harness-like high-shielding flexible circuit board is proposed, which includes the following steps:

[0008] S10: Design graphic data of the flexible board: set a laminated winding area and flat areas at both ends of the laminated winding area for the flexible board; divide the laminated winding area into a plurality of partition plates distributed in parallel, and add an extension area to the area in the partition direction of the partition plate; distribute and route the wiring pattern according to the space of the partition plate, and the extension area is a non-wiring area; form the graphic data of the flexible board.

[0009] S20: Take a first single-sided flexible copper-clad laminate, and make a circuit pattern according to the graphic data of the flexible laminate to form a flexible core board, wherein the circuit pattern includes an impedance circuit.

[0010] S30: Take the second single-sided flexible copper clad laminate, make a shielding circuit, and form a shielding layer core board, wherein the shielding circuit is distributed in the laminated winding area and corresponds to the impedance circuit distribution, and the coverage area is larger than the impedance circuit.

[0011] S40: taking the adhesive layer, stacking the flexible core board, the adhesive layer, and the shielding layer core board in sequence, and performing a first pressing to form a pressed board.

[0012] S50: taking a shielding film, making a graphic shielding film, attaching the graphic shielding film to one side of the shielding layer core board of the laminated board, and performing a second lamination to form a laminated shielding board.

[0013] S60: dividing the pressed shielding plate in the extended area of ​​the laminated winding area along the arrangement direction of the impedance lines to form a plurality of divided sub-plates distributed in parallel.

[0014] S70: stacking the divided sub-boards and wrapping them with acetate tape to form the harness-like high-shielding flexible circuit board.

[0015] Furthermore, the shielding circuit includes multiple sub-shielding circuits, each of the sub-shielding circuits corresponds to the impedance circuit of the dividing plate distributed in each of the laminated winding areas; the coverage area of ​​each of the sub-shielding circuits is respectively larger than that of each distributed impedance circuit.

[0016] Furthermore, the shielding layer core board includes an auxiliary circuit having a thickness greater than that of the shielding circuit, and the auxiliary circuit corresponds to the line gap setting of the circuit pattern. The formation of the shielding layer core board includes: taking the second single-sided flexible copper clad board, sticking a first dry film, exposing and developing in sequence according to the graphic distribution of the auxiliary circuit, etching the copper layer of the second single-sided flexible copper clad board, and the thickness of the copper layer remaining after etching is the thickness of the shielding circuit; sticking the dry film again, and exposing, developing and etching the copper layer that needs to be completely etched in sequence to form the shielding layer core board.

[0017] Furthermore, the graphic shielding film is a plurality of separate sub-shielding films made from the shielding film; each of the sub-shielding films is attached to the area of ​​the dividing plate in the laminated winding area, and the size of a single graphic shielding film is smaller than the size of the dividing plate located in the laminated winding area.

[0018] Furthermore, the manufacturing method further includes: taking acetate tape to form patterned acetate tape; and attaching the patterned acetate tape to the patterned shielding film of the laminated shielding plate.

[0019] Furthermore, the acetate tape is cut to form a plurality of patterned acetate tapes; the acetate tape is attached by correspondingly attaching the plurality of patterned acetate tapes to the plurality of patterned shielding films; the size of a single acetate tape is equal to the size of the dividing plate located in the laminated winding area.

[0020] Furthermore, the sequential stacking includes stacking the shielding circuits of the shielding layer core board away from the adhesive layer.

[0021] Furthermore, the segmentation is performed by punching or milling the pressed shielding plate.

[0022] Furthermore, the circuit pattern is a thick copper circuit pattern, and the thickness of the thick copper circuit pattern is 105 μm to 420 μm.

[0023] Furthermore, the thickness of the shielding line is 5 μm to 20 μm.

[0024] The technical solution of the present invention, by adding an expansion area, plays a role in setting up sufficient circuit pattern distribution space for each divided sub-board in advance, as well as the design and production space for shielding lines and graphic shielding films, and adopts a shielding layer core board to replace the original covering film layer on one side, so as to form a shielding line to block the impedance line, so that the impedance lines of each layer after the stacking and winding are physically isolated from each other and the copper layer is shielded and isolated, and further affixed and pressed graphic shielding films to form further shielding isolation, effectively reducing the mutual interference between the impedance lines, and effectively improving the impedance value accuracy (the error can reach within ±3%); optionally, for thick copper line patterns, further affixed graphic acetate tape, and set the area size of the shielding layer and the graphic acetate tape, so as to form a role in further increasing the distance between each stacking layer by using the acetate tape, and protecting the graphic shielding film by using the graphic acetate tape, and the acetate tape is made of the same material as the acetate tape used in subsequent winding, which can improve the winding bonding strength and the service life of the harness-like high-shielding flexible circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0026] Figure 1 A schematic diagram of the cross-sectional structure of a planar stack of wire harness-like flexible circuit boards in the prior art;

[0027] Figure 2 This is a process flow chart of a method for manufacturing a wire harness-like high-shielding flexible circuit board according to an embodiment of the present invention;

[0028] Figure 3 This is a schematic diagram of the planar structure of a flexible core board formed in accordance with an embodiment of the present invention;

[0029] Figure 4 A schematic cross-sectional view of a stacked structure formed in accordance with an embodiment of the present invention;

[0030] Figure 5 A schematic diagram of the cross-sectional structure of an auxiliary circuit core board formed in an embodiment of the present invention;

[0031] Figure 6 A schematic cross-sectional view of a shielding layer core board forming an auxiliary circuit according to an embodiment of the present invention;

[0032] Figure 7 A schematic diagram of the cross-sectional structure of a press plate formed in an embodiment of the present invention;

[0033] Figure 8 A schematic diagram of a cross-sectional structure of a pressed shielding plate formed in an embodiment of the present invention;

[0034] Figure 9 A schematic diagram of a planar structure of a graphic partitioning plate formed in an embodiment of the present invention;

[0035] Figure 10 Implementation of the present invention Figure 9 Schematic diagram of the cross-sectional structure at the BB position;

[0036] Figure 11 A schematic diagram of the planar structure of a wire harness-like high-shielding flexible circuit board formed in an embodiment of the present invention;

[0037] Figure 12 Implementation of the present invention Figure 11 Schematic diagram of the cross-sectional structure at the CC position;

[0038] Figure 13Schematic diagram of the cross-sectional structure of a patterned partition plate formed of acetate tape according to an embodiment of the present invention.

[0039] Description of Figure Numbers:

[0040] Label name Label name 60X Prior art single-layer flexible board 30A Shielding core board for auxiliary lines 610X Existing technology dividing line 320 Auxiliary lines 140X Prior art impedance line 330 Inner insulating dielectric layer 10 Flexible core board 40 Pressed board 110 Laminated winding area 50 Press-fit shielding plate 120 Leveling area 510 Graphic shielding film 130 Expansion Area 60 Graphic splitter 140 Impedance line 610 dividing line 20 stacked structure 620 Split daughter board 210 adhesive layer 70 Wire harness-like high-shield flexible circuit board 30 Shielding core board 710 Acetate tape 310 Shielded lines 60A Acetate tape graphic divider / / 610A Acetate tape

[0041] The purpose, features and advantages of the present invention will be further described with reference to the accompanying drawings and in conjunction with the embodiments. DETAILED DESCRIPTION

[0042] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0043] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, inside, outside, etc.) are only used to explain the relative position relationship and movement status between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0044] In addition, the terms "first," "second," and so on, used in this disclosure are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referenced. Thus, a feature specified as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of this disclosure, "plurality" means at least two, such as two or three, unless otherwise specifically defined.

[0045] In addition, the technical solutions between the various embodiments of the present invention can be combined with each other, but it must be based on the fact that ordinary technicians in this field can implement it. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0046] See also Figure 1 , Figure 1 A schematic diagram of the cross-sectional structure of a planar stack of wire harness-like flexible circuit boards in the prior art;

[0047] The prior art wire harness flexible circuit board is first made into a prior art single-layer flexible board 60X (such as Figure 1As shown) or a double-layer flexible board structure, the prior art dividing line 610X is made to partially divide it into multiple parallel sub-boards, and then the sub-boards are stacked and wound to form the prior art harness-like flexible circuit board; after stacking and winding, the prior art impedance lines 140X will cause mutual interference, affecting the impedance value, or the copper thickness of the prior art impedance line 140X is relatively thick, resulting in poor filling, which affects the impedance value.

[0048] See also Figure 2 , Figure 2 The present invention is a process flow chart of the method for manufacturing a highly shielded flexible circuit board of the wiring harness type.

[0049] The manufacturing method of the wire harness-like high shielding flexible circuit board 70 of this embodiment includes the following steps: Figure 2 The key process flow shown and the specific implementation methods are described as follows.

[0050] See also Figure 3 and Figure 4 ; Figure 3 This is a schematic diagram of a planar structure of an expansion area according to an embodiment of the present invention; Figure 4 Schematic diagram of the cross-sectional structure of a stacked structure formed in an embodiment of the present invention.

[0051] Step S10:

[0052] Design graphic data for a flexible board: the flexible board includes a laminated winding area 110 and flattened areas 120 located at both ends of the laminated winding area; the laminated winding area 110 is divided into a plurality of parallel partitions, and an expansion area 130 is added to the area in the partitioning direction of the partition; the wiring pattern is distributed and wired according to the space of the partitioning board, and the expansion area 130 is a non-wiring area; thus, the graphic data for the flexible board is formed.

[0053] In this embodiment, the design data of the flexible board is first modified to form new design data, and the flexible board is divided into a flat area 120 and a laminated winding area 110 in the horizontal direction. The laminated winding area 110 will be processed to form a laminated winding structure laterally. The flat area 120 plays a role in supporting the plugging with other electronic modules or welding of components. The expansion area 130 is added longitudinally. On the one hand, the layout space of each divided board is larger, the layout is more independent and clear, and on the other hand, it is convenient to set the shielding line 310 and the graphic shielding film 510 later, so that the distribution space of each layer of graphics or film is more sufficient, and sufficient space for processing the dividing line is formed.

[0054] Step S20:

[0055] See also Figure 3 and Figure 4, take a first single-sided flexible copper-clad laminate, make a circuit pattern according to the graphic data of the flexible laminate, and form a flexible core board 10, wherein the circuit pattern includes an impedance line 140; in this embodiment, the circuit pattern is a thick copper circuit pattern, and the thickness of the thick copper circuit pattern is 105μm to 420μm.

[0056] This embodiment can be used for thick copper circuit patterns with a relatively thick thickness. It is worth noting that the distribution of the circuit patterns is redistributed according to the pattern data of the flexible board after the expansion area 130 is set as described above to prevent the circuit patterns from entering the expansion area 130.

[0057] Step S30:

[0058] See also Figure 4 , take a second single-sided flexible copper clad laminate, make a shielding line 310, and form a shielding layer core board 30. The shielding line is distributed in the laminated winding area 110 and corresponds to the impedance line 140, and the coverage area is larger than the impedance line 140; the thickness of the shielding line 310 is 5μm to 20μm.

[0059] The shielding circuit 310 is also a copper layer circuit, which uses the shielding performance of the copper layer to shield the impedance circuit 140. The thickness does not need to be set too thick. While it can play a shielding role, it can avoid the increase in processing costs due to excessive thickness and the excessive thickness of the board.

[0060] In this embodiment, the shielding circuit 310 includes multiple sub-shielding circuits 310, and each of the sub-shielding circuits 310 corresponds to the impedance circuit 140 of the split sub-board 620 distributed in each of the laminated winding areas 110; the coverage area of ​​each of the sub-shielding circuits 310 is respectively larger than that of each distributed impedance circuit 140.

[0061] The shielding circuit 310 can be set as a circuit graphic layer that is individually set corresponding to each subsequently formed split sub-board 620. The individual setting can play a targeted shielding role for the impedance circuit 140, and at the same time, it can play a covering effect of increasing size layer by layer for the subsequent production of the graphic shielding film 510, thereby forming an effect of increasing shielding performance layer by layer, further avoiding the problem that the shielding circuit 310 is produced to the extension area 130, resulting in the circuit being difficult to be completely covered by the surface covering film produced subsequently, and also avoiding the problem that the copper layer of the shielding circuit 310 exists in the extension area 130 during the splitting process, thereby increasing the processing difficulty.

[0062] See also Figure 5 and Figure 6 ; Figure 5 A schematic diagram of the cross-sectional structure of an auxiliary circuit core board formed in an embodiment of the present invention; Figure 6This is a schematic cross-sectional structural diagram of a shielding layer core board forming an auxiliary circuit according to an embodiment of the present invention.

[0063] In this embodiment, the shielding layer core board 30A includes an auxiliary circuit 320 having a thickness greater than that of the shielding circuit, and the auxiliary circuit 320 corresponds to the line gap setting of the circuit pattern. The shielding layer core board 30A for forming the auxiliary circuit includes: taking the second single-sided flexible copper clad board, including the inner insulating dielectric layer 330, and pasting a first dry film, exposing and developing in sequence according to the graphic distribution of the auxiliary circuit 320, and etching the copper layer of the second single-sided flexible copper clad board. The thickness of the copper layer remaining after etching is the thickness of the shielding circuit 310; pasting the dry film again, and exposing, developing and etching the copper layer that needs to be completely etched in sequence to form the shielding layer core board 30A for the auxiliary circuit.

[0064] When the circuit pattern is a thick copper circuit pattern, during the subsequent layout and lamination, the set glue layer 210 is difficult to fill the line gaps of the thick copper circuit pattern, resulting in delamination and bubbles between layers, affecting the impedance value of the impedance line and also affecting the quality of the flexible circuit board. Here, an auxiliary circuit 320 is set. The line gaps of the auxiliary circuit 320 circuit pattern are set, and the thickness is greater than the shielding circuit 310. During the subsequent lamination, the auxiliary circuit 320 can effectively increase the longitudinal lamination depth and strength, and provide effective lamination assistance for the glue layer 210 to fill the line gaps of the thick copper circuit pattern. It is worth noting that under normal circumstances, the line gaps of the thick copper circuit pattern are larger, so the set auxiliary circuit 320 can correspond to the initial gap setting, and since the auxiliary circuit 320 and the shielding circuit are on the same circuit layer, the thickness of the two during lamination is relative thickness (generally the thickness difference is 15μm to 35μm), that is, the thickness of the auxiliary circuit 320 is greater than that of the shielding circuit, which can play a role in assisting lamination and filling.

[0065] Please continue reading Figure 4 , and please see Figure 7 ; Figure 7 Schematic diagram of the cross-sectional structure of a pressed plate formed according to an embodiment of the present invention.

[0066] Step S40:

[0067] Take the adhesive layer 210 , stack the flexible core board 10 , the adhesive layer 210 , and the shielding layer core board 30 in sequence to form a stacked structure 20 , and perform a first pressing to form a pressed board 40 .

[0068] In this embodiment, the sequential stacking includes stacking the shielding circuits of the shielding layer core board 30 away from the adhesive layer 210 .

[0069] After the flexible core board 10 and the shielding layer core board 30 are formed according to the above steps, they are pressed together according to the production process of the flexible circuit board to form a pressed board 40; the shielding line 310 is stacked away from the adhesive layer 210, which can ensure that the original flexible circuit board stacking structure is not changed, and the shielding line 310 is located outside the original flexible circuit board structure to form a shielding effect, which does not affect the pressing processing and application of the original circuit pattern.

[0070] See also Figure 8 ; Figure 8 It is a schematic cross-sectional structure diagram of forming a pressed shielding plate according to an embodiment of the present invention.

[0071] Step S50:

[0072] A shielding film is taken to form a graphic shielding film 510 , which is attached to one side of the shielding layer core board 30 of the laminated board 40 , and laminated for a second time to form a laminated shielding board 50 .

[0073] The graphic shielding film 510 can further play a shielding and isolating role, thereby enhancing the shielding effect.

[0074] See also Figure 9 and Figure 10 ; Figure 9 A schematic diagram of a planar structure of a graphic partitioning plate formed in an embodiment of the present invention; Figure 10 Implementation of the present invention Figure 6 Schematic diagram of the cross-sectional structure of the BB position.

[0075] Step S60:

[0076] Along the arrangement direction of the impedance line 140, the pressed shielding plate 50 is divided in the expansion area 130 of the laminated winding area 110 to form a dividing line 610, forming a plurality of divided sub-plates 620 distributed in parallel, and forming a graphic dividing plate 60 as a whole; the division is punching or milling of the pressed shielding plate 50.

[0077] In this embodiment, since the above steps set up the expansion area 130, the shielding plate is divided in the expansion area 130 to ensure the divided space and the divided processing effect, and prevent the circuit and the original effective board area from being damaged. After the division is completed, the individual divided sub-boards 620 are stacked.

[0078] See also Figure 11 and Figure 12 ; Figure 11 A schematic diagram of the planar structure of a wire harness-like high-shielding flexible circuit board formed in an embodiment of the present invention; Figure 12 Implementation of the present invention Figure 11 Schematic diagram of the cross-sectional structure at the CC position.

[0079] Step S70:

[0080] The divided sub-boards 620 are stacked and wrapped with acetate tape 710 to form the wiring harness-like high-shielding flexible circuit board 70 .

[0081] Please refer again Figure 5 and Figure 6 ; and see Figure 13 , Figure 13 Schematic diagram of the cross-sectional structure of a patterned partition plate formed of acetate tape according to an embodiment of the present invention.

[0082] In one embodiment, the graphic shielding film 510 is a plurality of separate sub-shielding films made from the shielding film; each of the sub-shielding films is attached to the area of ​​the dividing plate in the laminated winding area, and the size of a single graphic shielding film 510 is smaller than the size of the dividing plate located in the laminated winding area 110.

[0083] The shielding film is made into an independent graphic shielding film 510 that matches each partition plate and is smaller in size than the partition plate. That is, each independent graphic shielding film 510 is attached within the range of each partition sub-plate 620 to form a targeted shielding area set for the impedance line 140 and the shielding line 310, thereby increasing the layer-by-layer shielding performance effect and avoiding the graphic shielding film covering the expansion area 130, causing the graphic shielding film to be cut, pulled, and deformed during subsequent partitioning.

[0084] In one embodiment, the method for manufacturing the wiring harness-like high-shielding flexible circuit board 70 further includes: taking acetate tape to form a patterned acetate tape 610A; and attaching the patterned acetate tape 610A to the patterned shielding film 510 of the laminated shielding plate 50.

[0085] Furthermore, the acetate tape 610A is cut to form a plurality of patterned acetate tapes 610A; the acetate tape 610A is attached to the plurality of patterned acetate tapes 610A correspondingly on the plurality of patterned shielding films; the size of a single acetate tape 610A is equal to the size of the dividing plate located in the laminated winding area 110.

[0086] For harness-type high-shielding flexible circuit boards with extremely high impedance accuracy requirements, on the basis of shielding, the distance between the layers of the laminate can be further increased by increasing the interlayer thickness distance between the laminates, thereby increasing the physical isolation distance between the layers. The acetate tape 610A can be directly attached, and after being divided from the same board surface, the size formed is larger than the size of the graphic shielding film 510 or the shielding line 310, thereby playing an effective protective role. Furthermore, the material of the acetate tape 610A is the same as that of the acetate tape 710 used for winding, which can improve the adaptability between materials and improve the winding effect and product service life.

[0087] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made by using the contents of the present invention description and drawings under the inventive concept of the present invention, or direct / indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A method for manufacturing a wire harness-like highly shielded flexible circuit board, characterized in that: The production method comprises the following steps: S10: Graphical data for designing flexible boards: The flexible board is provided with a laminated winding area and flattened areas at both ends of the laminated winding area; Dividing the laminated winding area into a plurality of dividing plates arranged in parallel, and adding an expansion area in the dividing direction of the dividing plates; Allocate and route the wiring pattern according to the space of the partition board, and the expansion area is a non-wiring area; forming graphic data of the flexible board; S20: Take a first single-sided flexible copper-clad laminate, and produce a circuit pattern according to the graphic data of the flexible laminate to form a flexible core board, wherein the circuit pattern includes an impedance circuit; S30: Take the second single-sided flexible copper clad laminate and make a shielding circuit to form a shielding layer core board, wherein the shielding circuit is distributed in the laminated winding area and corresponds to the impedance circuit distribution, and the coverage area is larger than the impedance circuit; S40: taking the adhesive layer, stacking the flexible core board, the adhesive layer, and the shielding layer core board in sequence, and performing a first pressing to form a pressed board; S50: taking a shielding film, making a patterned shielding film, attaching the patterned shielding film to one side of the shielding layer core board of the laminated board, and performing a second lamination to form a laminated shielding board; S60: dividing the pressed shielding plate in the extended area of ​​the laminated winding area along the arrangement direction of the impedance line to form a plurality of divided sub-plates distributed in parallel; S70: stacking the divided sub-boards and wrapping them with acetate tape to form the harness-like high-shielding flexible circuit board.

2. The method for manufacturing a wire harness-like high-shielding flexible circuit board according to claim 1, characterized in that: The shielding circuit includes a plurality of sub-shielding circuits, each of the sub-shielding circuits corresponding to the impedance circuit of the dividing plate distributed in each of the laminated winding areas; The coverage area of ​​each of the sub-shielding lines is larger than that of each of the distributed impedance lines.

3. The method for manufacturing a wiring harness-like high-shielding flexible circuit board according to claim 1 or 2, characterized in that: The shielding layer core board includes an auxiliary circuit having a thickness greater than that of the shielding circuit, and the auxiliary circuit is arranged corresponding to the line gap of the circuit pattern. The shielding layer core board includes: Taking the second single-sided flexible copper-clad laminate, applying the first dry film thereto, sequentially performing exposure and development according to the pattern distribution of the auxiliary circuit, etching the copper layer of the second single-sided flexible copper-clad laminate, wherein the thickness of the copper layer remaining after etching is the thickness of the shielding circuit; The dry film is applied again, and the copper layer that needs to be completely etched is exposed, developed and etched in sequence to form the shielding layer core board.

4. The method for manufacturing a wire harness-like high-shielding flexible circuit board according to claim 1, wherein: The graphic shielding film is a plurality of separate sub-shielding films made from the shielding film; Each of the sub-shielding films is attached to the region of the dividing plate in the laminated winding area, and the size of a single graphic shielding film is smaller than the size of the dividing plate in the laminated winding area.

5. The method for manufacturing a wire harness-like high-shielding flexible circuit board according to claim 1 or 4, characterized in that: The production method further comprises: Take acetate tape and make patterned acetate tape; The patterned acetate tape is attached to the patterned shielding film of the laminated shielding plate.

6. The method for manufacturing a wire harness-like high-shielding flexible circuit board according to claim 5, characterized in that: Cutting the acetate tape into a plurality of patterned acetate tapes; Attaching the acetate tapes is to attach a plurality of the patterned acetate tapes to a plurality of the patterned shielding films respectively; The size of a single acetate tape is equal to the size of the dividing plate located in the laminated winding area.

7. The method for manufacturing a wire harness-like high-shielding flexible circuit board according to claim 1, wherein: The sequential stacking includes stacking the shielding circuits of the shielding layer core board away from the adhesive layer.

8. The method for manufacturing a wire harness-like high-shielding flexible circuit board according to claim 1, characterized in that: The segmentation is performed by punching or milling the pressed shielding plate.

9. The method for manufacturing a wire harness-like high-shielding flexible circuit board according to claim 1, wherein: The circuit pattern is a thick copper circuit pattern, and the thickness of the thick copper circuit pattern is 105 μm to 420 μm.

10. The method for manufacturing a wire harness-like high-shielding flexible circuit board according to claim 1, wherein: The thickness of the shielding line is 5 μm to 20 μm.

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