Manufacturing method of gold finger structure

Abstract

The present invention discloses a method for manufacturing a gold finger structure, comprising a pre-processing step: providing a board and a circuit layer, the circuit layer comprising a metal circuit having a main circuit segment and a terminal circuit segment; a first vacuum lamination step: vacuum laminating a first masking film on the terminal circuit segment, so that the terminal circuit segment comprises a first terminal circuit portion and a second terminal circuit portion, with the second terminal circuit portion being covered by the first masking film; a gold plating step: plating a gold plating film on the outer surfaces of the main circuit segment and the first terminal circuit portion; a first removal step: removing the first masking film; a second vacuum lamination step: vacuum laminating a second masking film on the metal circuit segment, so that a portion of the second terminal circuit portion is exposed by the second masking film; and an etching step: removing a portion of the second terminal circuit portion. Thus, the method for manufacturing the gold finger structure can completely eliminate the need for a wet film process, thereby shortening the process, saving production time, and ultimately reducing production costs.

Description

Technical Field

[0001] The present invention relates to a method for manufacturing a gold finger structure, and in particular to a method for manufacturing a gold finger structure capable of effectively shortening the manufacturing process. Background Art

[0002] Conventional methods for manufacturing gold finger structures require repeated wet and dry film steps to form the gold finger structure. However, this repeated wet and dry film process takes a long time, resulting in low production efficiency and high production costs. Therefore, finding a method that can shorten the process, save production time, and thus reduce production costs, thereby improving the shortcomings of existing gold finger manufacturing methods has become a key issue in the industry.

[0003] Therefore, the inventors believe that the above defects can be improved, and have devoted themselves to research and applied scientific principles to finally propose the present invention which has a reasonable design and effectively improves the above defects. Summary of the Invention

[0004] The embodiment of the present invention provides a method for manufacturing a gold finger structure, which can effectively improve the defects that may occur in the existing gold finger structure.

[0005] The embodiment of the present invention discloses a method for manufacturing a gold finger structure, which includes: a pre-step: providing a board and a circuit layer formed on the board; wherein the circuit layer includes: a plurality of metal circuits, each metal circuit including a main circuit segment and an end circuit segment connected to the main circuit segment; a first vacuum lamination step: vacuum laminating a first shielding film on the end circuit segment of each metal circuit, so that the end circuit segment of each metal circuit includes a first end circuit portion connected to the main circuit segment and a second end circuit portion connected to the first end circuit portion; wherein the second end circuit portion is covered by the first shielding film. film covering; a gold plating step: plating a gold plating film on the outer surface of the main line segment of each metal line and the outer surface of the first end line portion of the end line segment; a first removing step: removing the first masking film to expose the second end line portion to the gold plating film; a second vacuum lamination step: vacuum laminating a second masking film on the main line segment and part of the end line segment of each metal line to expose part of the second end line portion of the end line segment of each metal line to the second masking film; and an etching step: removing the part of the second end line portion exposed by the second masking film to form a gold finger structure.

[0006] Preferably, in the preceding step, each metal circuit further includes a connecting circuit segment; and in the first vacuum lamination step, a first shielding film is further vacuum-laminated to cover a portion of the connecting circuit segment of each metal circuit, so that the connecting circuit segment of each metal circuit includes a first connecting circuit portion connected to the main circuit segment and a second connecting circuit portion connected to the first connecting circuit portion; wherein the second connecting circuit portion is covered by the first shielding film.

[0007] Preferably, in the gold plating step, a gold plating film is further plated on the outer surface of the first connecting line portion of the connecting line segment of each metal line.

[0008] Preferably, in the first removing step, the first masking film is removed to expose the second connecting circuit portion and the second terminal circuit portion to the gold plating film.

[0009] Preferably, in the second vacuum lamination step, a second masking film is further vacuum laminated to cover the connecting line section of each metal line.

[0010] Preferably, a second removing step is included after the etching step to remove the second masking film.

[0011] Preferably, in the preceding step, an insulating outer layer covering the local circuit layer is further provided; wherein each of the plurality of metal circuits includes an inner circuit buried in the insulating outer layer, and the inner circuit is electrically coupled to the connecting circuit segment.

[0012] Preferably, after the etching step, an end section of each metal circuit is spaced from an edge of the board along a longitudinal direction.

[0013] Preferably, after the etching step, a length of the end line segment in a longitudinal direction is 0.1 mm to 0.15 mm.

[0014] Preferably, in the first vacuum lamination step, the first masking film is vacuum-laminated at the end line segment of each metal line at a lamination temperature of 60 to 70 degrees, a pressurizing time of 15 to 20 seconds, and a vacuuming time of 10 to 30 seconds.

[0015] Preferably, in the second vacuum lamination step, the second masking film is vacuum-laminated on the main line segment and the end line segment of each metal line at a lamination temperature of 60 to 70 degrees, a pressurizing time of 15 to 20 seconds, and a vacuuming time of 10 to 30 seconds.

[0016] In summary, the manufacturing method of the gold finger structure disclosed in the embodiment of the present invention is improved compared to the existing manufacturing method of the gold finger structure by a first vacuum lamination step and a second vacuum lamination step, completely eliminating the execution of the wet film step, thereby providing a manufacturing method of the gold finger structure that can shorten the process and save production time, thereby reducing production costs.

[0017] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, such description and drawings are only used to illustrate the present invention and are not intended to limit the scope of protection of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 Schematic top view of the gold finger structure according to an embodiment of the present invention.

[0019] Figure 2 for Figure 1 Schematic cross-section along section line II-II.

[0020] Figure 3 Flowchart of a method for manufacturing a gold finger structure according to an embodiment of the present invention.

[0021] Figure 4 Schematic diagram of the preparatory steps of the method for manufacturing a gold finger structure according to an embodiment of the present invention.

[0022] Figure 5 Schematic diagram of the first vacuum lamination step of the method for manufacturing a gold finger structure according to an embodiment of the present invention.

[0023] Figure 6 Schematic diagram of the gold plating steps of the gold finger structure manufacturing method according to an embodiment of the present invention.

[0024] Figure 7 Schematic diagram of the first removal step of the gold finger structure manufacturing method according to an embodiment of the present invention.

[0025] Figure 8 Schematic diagram of the second vacuum lamination step of the method for manufacturing the gold finger structure according to an embodiment of the present invention.

[0026] Figure 9 Schematic diagram of etching steps in a method for manufacturing a gold finger structure according to an embodiment of the present invention.

[0027] Figure 10 Schematic diagram of the second removal step of the gold finger structure manufacturing method according to an embodiment of the present invention. DETAILED DESCRIPTION

[0028] The following is an explanation of the implementation method of the "method for manufacturing a gold finger structure" disclosed in the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual dimensions. It is stated in advance. The following embodiments will further explain the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of protection of the present invention.

[0029] It should be understood that although terms such as "first," "second," and "third" may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. In addition, the term "or" as used herein may include any one or more combinations of the associated listed items, as appropriate.

[0030] See also Figures 1 to 10 It should be noted that the numbers and shapes mentioned in the accompanying drawings are only used to illustrate the implementation of the present invention in detail to facilitate understanding of the content of the present invention, and are not intended to limit the scope of protection of the present invention.

[0031] This embodiment discloses a method S100 for manufacturing a gold finger structure, which forms a gold finger structure 100. The gold finger structure 100 includes a board 1, an insulating outer layer 2 formed on the board 1, a circuit layer 3 formed on the board 1, and a plurality of gold-plated films 4 covering portions of the circuit layer 3.

[0032] See also Figure 1 and Figure 2 As shown, in this embodiment, the board body 1 is a multi-layer circuit board, but the present invention is not limited thereto. The board body 1 is, for example, a rectangle, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the board body 1 may also be a square, etc. The edge of the board body 1 includes two first short sides A1 facing each other and two first long sides B1 facing each other. For the sake of convenience, the gold finger structure 100 is defined as a transverse direction W parallel to the two first short sides A1 and a longitudinal direction L parallel to the two first long sides B1. In actual application, the main function of the board body 1 is to support the insulating outer layer 2, the circuit layer 3 and other components, etc. Therefore, the shape, size, material and other related properties of the board body 1 can be changed according to needs and are not limited in this embodiment.

[0033] In addition, the plate 1 is close to Figure 1 The lower end is defined as a free end 1a. In practical applications, the free end 1a of the plate 1 can be used to connect to a mating component, a slot, or other related components. It should be noted that the gold finger structure 100 disclosed in this embodiment can also be used in conjunction with related components, and relevant personnel can also adjust the related components of the gold finger structure 100 accordingly. In other words, the gold finger structure 100 of this embodiment does not limit its use with related components or structural adjustments.

[0034] like Figure 1 and Figure 2 As shown, the insulating outer layer 2 is formed on the plate body 1. In this embodiment, the insulating outer layer 2 is, for example, a rectangle, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the insulating outer layer 2 may also be a square, etc. The insulating outer layer 2 includes two second short sides A2 facing each other and two second long sides B2 facing each other. In addition, the two second short sides A2 of the insulating outer layer 2 are parallel to the longitudinal direction L and the two second long sides B2 of the insulating outer layer 2 are parallel to the transverse direction W. In detail, in this embodiment, the insulating outer layer 2 is formed on the plate body 1 and adjacent to Figure 1 Above.

[0035] Furthermore, the shape, size, quantity, material, location on the board 1, and other properties of the insulating outer layer 2 can be varied according to design requirements. For example, the insulating outer layer 2 can be made of a resin material such as polyimide, polyester, polyethylene glycol, polytetrafluoroethylene, epoxy resin, or aramid.

[0036] The circuit layer 3 is formed on the board 1. In this embodiment, the material of the circuit layer 3 can be a conductive material, such as copper or silver, but the present invention is not limited thereto. For example, the material of the circuit layer 3 can be changed according to actual design requirements.

[0037] Furthermore, the circuit layer 3 includes a plurality of metal circuits 31 arranged along the transverse direction W. Specifically, the plurality of metal circuits 31 are generally parallel to the longitudinal direction L. However, the plurality of metal circuits 31 are not limited to being parallel to the longitudinal direction L, and the arrangement direction of the plurality of metal circuits 31 can be varied based on actual design requirements and is not limited to this embodiment. Furthermore, the plurality of metal circuits 31 are arranged spaced apart from each other along the transverse direction W, and the distance between any two adjacent metal circuits 31 can be varied based on design requirements.

[0038] Furthermore, in this embodiment, each of the metal traces 31 is rectangular in shape, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the shape of each of the metal traces 31 can be square, trapezoidal, or other shapes that vary according to actual design requirements.

[0039] In this embodiment, the circuit layer 3 may also include multiple internal circuits 32. These multiple internal circuits 32 are embedded within the insulating outer layer 2. In the drawings of this embodiment, these multiple internal circuits 32 are spaced apart and electrically connected to the multiple metal circuits 31. The multiple internal circuits 32 are generally parallel to the longitudinal direction L, but the present invention is not limited to this. For example, in other embodiments not shown, the multiple internal circuits 32 can each be tilted 45 degrees to electrically connect to other components within the board 1. Specifically, the multiple internal circuits 32 can be varied based on actual design requirements.

[0040] In this embodiment, the circuit layer 3 may also include a transverse circuit 33. In the figures of this embodiment, the transverse circuit 33 is generally parallel to the transverse direction W and embedded in the insulating outer layer 2. However, the transverse circuit 33 is not limited to being parallel to the transverse direction W, and the direction of the transverse circuit 33 can be varied according to needs and is not limited to this embodiment. Furthermore, the transverse circuit 33 connects the plurality of metal circuits 31 arranged at intervals along the transverse direction W. Specifically, the transverse circuit 33 electrically connects the plurality of inner circuits 32 arranged at intervals along the transverse direction W, and the plurality of inner circuits 32 are each electrically connected to the plurality of metal circuits 31.

[0041] Please refer back to Figure 1 and Figure 2 Each of the metal lines 31 includes a connecting line segment 311 , a main line segment 312 electrically connected to the connecting line segment 311 , and an end line segment 313 electrically connected to the main line segment 312 .

[0042] The connecting line segment 311 is electrically connected to the inner line 32. Specifically, the connecting line segment 311 is electrically connected to the inner line 32 along the longitudinal direction L. In this embodiment, the connecting line segment 311 is rectangular in shape, but the present invention is not limited thereto. For example, in other embodiments not shown, the shape of the connecting line segment 311 may also be square or may be modified based on actual design requirements.

[0043] In this embodiment, the connecting line segment 311 includes a first connecting line portion 3111 and a second connecting line portion 3112 electrically connected to the first connecting line portion 3111. The first connecting line portion 3111 is embedded within the gold-plated film 4. In other words, the second connecting line portion 3112 is covered by the gold-plated film 4. The second connecting line portion 3112 is electrically connected to the inner circuit 32 and is exposed between the insulating outer layer 2 and the gold-plated film 4.

[0044] like Figure 1 and Figure 2 As shown, in this embodiment, the main line segment 312 is electrically connected to the first connecting line portion 3111 of the connecting line segment 311 on the side adjacent to the insulating outer layer 2. The main line segment 312 is rectangular in shape, but the present invention is not limited thereto. For example, in other embodiments not shown, the shape of the main line segment 312 can also be square, or can be modified based on actual design needs. The main line segment 312 is embedded in the gold-plated film 4. In other words, the main line segment 312 is covered by the gold-plated film 4.

[0045] In this embodiment, the terminal line segment 313 is electrically connected to the main line segment 312. Specifically, the terminal line segment 313 is electrically connected to the main line segment 312 along the longitudinal direction L. In this embodiment, the terminal line segment 313 is rectangular in shape, but the present invention is not limited to this. For example, in other embodiments not shown, the shape of the terminal line segment 313 may also be square or may be varied based on actual design requirements.

[0046] Specifically, the terminal circuit segment 313 includes a first terminal circuit portion 3131 and a second terminal circuit portion 3132 electrically connected to the first terminal circuit portion 3131. The first terminal circuit portion 3131 is electrically connected to the main circuit segment 312 and is embedded within the gold-plated film 4. In other words, the first terminal circuit portion 3131 is covered by the gold-plated film 4. The second terminal circuit portion 3132 is exposed from the gold-plated film 4.

[0047] like Figure 1 and Figure 2As shown, the plurality of gold-plated films 4 are respectively plated on the outer surfaces of the first connecting line portion 3111, the main line segment 312, and the first terminal line portion 3131 of the plurality of metal lines 31. In this embodiment, the plurality of gold-plated films 4 are separated from each other, and the surface dimensions of any one of the gold-plated films 4 can be equal to the outer surface dimensions of the first connecting line portion 3111, the main line segment 312, and the first terminal line portion 3131 on which it is plated. Furthermore, the number of the plurality of gold-plated films 4 is equal to the number of the plurality of metal lines. However, the size and number of the plurality of gold-plated films 4 can be adjusted based on actual design requirements and are not limited to this embodiment.

[0048] See also Figures 3 to 10 As shown, this embodiment discloses a method S100 for manufacturing a gold finger structure. The method S100 includes a pre-processing step S110, a first vacuum lamination step S120, a gold plating step S130, a first removal step S140, a second vacuum lamination step S150, an etching step S160, and a second removal step S170. While the gold finger structure 100 of this embodiment can be manufactured using the aforementioned manufacturing method, the present invention is not limited thereto. Furthermore, the present invention is not limited to the content and order of the aforementioned steps when implementing the gold finger structure manufacturing method S100.

[0049] The following will describe the various steps of the gold finger structure manufacturing method S100 of this embodiment. For the structure of each part of the gold finger structure 100 or other related features, please refer to the relevant introduction of the first embodiment and will not be repeated here.

[0050] It should be noted that, to facilitate understanding of this embodiment, the accompanying drawings only show a single gold finger structure in the gold finger structure 100, so as to clearly present the various steps in the gold finger structure manufacturing method. However, the present invention is not limited to the accompanying drawings. The following will separately introduce the various steps of the gold finger structure manufacturing method S100.

[0051] like Figure 3 and Figure 4 As shown, the pre-step S110 provides the board 1 and the circuit layer 3 (such as Figure 2 ). The circuit layer 3 includes a plurality of metal circuits 31. Each metal circuit 31 includes a connecting circuit segment 311, a main circuit segment 312 connected to the connecting circuit segment 311, and an end circuit segment 313 connected to the main circuit segment 312.

[0052] It should be noted that the preceding step S110 further provides the insulating outer layer 2 covering a portion of the circuit layer 3 . Each of the metal circuits 31 includes an inner circuit 32 embedded in the insulating outer layer 2 , and the inner circuit 32 is electrically coupled to the connecting circuit segment 311 .

[0053] like Figure 3 and Figure 5 As shown, the first vacuum lamination step ( S120 ) involves vacuum laminating a first masking film 5a over a portion of the connecting line segment 311 and a portion of the terminal line segment 313 of each metal line 31. Specifically, the connecting line segment 311 is vacuum-laminated with the first masking film 5a, so that the connecting line segment 311 of each metal line 31 includes a first connecting line portion 3111 connected to the main line segment 312 and a second connecting line portion 3112 connected to the first connecting line portion 3111. The second connecting line portion 3112 is covered by the first masking film 5a. The terminal line segment 313 is vacuum-laminated with the first masking film 5a, so that the terminal line segment 313 of each metal line 31 includes a first terminal line portion 3131 connected to the main line segment 312 and a second terminal line portion 3132 connected to the first terminal line portion 3131. The second terminal line portion 3132 is covered by the first masking film 5a.

[0054] It should be noted that in the first vacuum lamination step S120, a laminator (not shown) is used to apply vacuum heat to the first masking film 5a and pressurize the second connecting line portion 3112 and the second terminal line portion 3132 of the metal line 31. The laminator operates at a lamination temperature between 60°C and 70°C, a pressurization time between 15 seconds and 20 seconds, and a vacuuming time between 10 seconds and 30 seconds during the vacuum lamination process. This optimizes the lamination effect and prevents gold seepage during the subsequent gold plating step S130.

[0055] Furthermore, in the first vacuum lamination step S120, this embodiment is not limited to vacuum laminating the first masking film 5a on the second connecting line portion 3112 of the metal line 31. In other words, vacuum lamination of the first masking film 5a on the second connecting line portion 3112 of the metal line 31 is optional depending on design requirements.

[0056] like Figure 3 and Figure 6As shown, in the gold plating step S130, the gold plating film 4 is plated on the outer surface of the first connecting line portion 3111 of the connecting line segment 311 of each of the metal lines 31, the outer surface of the main line segment 312, and the outer surface of the first end line portion 3131 of the end line segment 313.

[0057] like Figure 3 and Figure 7 As shown, the first removal step S140 removes the first masking film 5a, exposing the second terminal circuit portion 3132 to the gold-plated film 4. It should be noted that in order for the gold-plating step S130 to plate the gold-plated film 4 at predetermined locations on the metal circuit 31, the first masking film 5a is used to cover locations on the metal circuit 31 where gold plating is not required, thereby preventing the locations from being plated with the gold-plated film 4. For this reason, the first removal step S140 is necessary to remove the first masking film 5a after the gold-plating step S130.

[0058] like Figure 3 and Figure 8 As shown, the second vacuum lamination step S150 is to vacuum laminate a second masking film 5b on the connecting line segment 311, the main line segment 312 and the end line segment 313 of each of the metal lines 31, so that the second end line portion 3132 of the end line segment 313 of each of the metal lines 31 is exposed to the second masking film 5b.

[0059] Specifically, the second shielding film 5b covers the second end line portion 3132 of the end line segment 313 of each of the metal lines 31, so that the portion of the second end line portion 3132 exposed by the second shielding film 5b is defined as a sacrificial portion 3132' for removal in the subsequent etching step S160.

[0060] It should be noted that in the second vacuum lamination step S150, a laminator is used to apply vacuum heat to the second masking film 5b on the connecting line segment 311, the main line segment 312, and the terminal line segment 313 of the metal line 31. The laminator operates at a lamination temperature of 60 to 70 degrees Celsius, a pressurization time of 15 to 20 seconds, and a vacuum extraction time of 10 to 30 seconds during the vacuum lamination process. This optimizes the lamination effect and prevents gold seepage during the subsequent gold plating step S130.

[0061] like Figure 3 and Figure 9As shown, the etching step S160 removes the portion of the second terminal line portion 3132 exposed from the second masking film 5b. In other words, the etching step S160 removes the sacrificial portion 3132' of the second terminal line portion 3132. It should be noted that after the etching step S160, the length of the terminal line segment 313 in the longitudinal direction L is 0.1 mm to 0.15 mm, but the present invention is not limited to this.

[0062] In addition, in this embodiment, after the etching step S160 , a distance is maintained along the longitudinal direction L between the end line segment 313 of each metal line 31 and the edge of the board 1 (ie, the free end 1 a ).

[0063] like Figure 3 and Figure 10 As shown, the second removing step S170 removes the second masking film 5 b to form the gold finger structure 100 .

[0064] [Technical Effects of the Embodiments of the Invention]

[0065] In summary, the manufacturing method of the gold finger structure disclosed in the embodiment of the present invention is improved compared to the existing manufacturing method of the gold finger structure by a first vacuum lamination step and a second vacuum lamination step. The wet film step can be completely omitted, thereby providing a manufacturing method of the gold finger structure that can shorten the process and save production time, thereby reducing production costs.

[0066] The contents disclosed above are only preferred feasible embodiments of the present invention and do not limit the patent scope of the present invention. Therefore, any equivalent technical changes made using the contents of the description and drawings of the present invention are included in the patent scope of the present invention.

Claims

1. A method for manufacturing a gold finger structure, characterized in that: The manufacturing method of the gold finger structure comprises: A preparatory step includes providing a board and a circuit layer formed on the board; wherein the circuit layer includes: a plurality of metal circuits, each of the metal circuits including a main circuit segment and an end circuit segment connected to the main circuit segment; a first vacuum lamination step of vacuum laminating a first masking film on the end line segment of each metal line, so that the end line segment of each metal line includes a first end line portion connected to the main line segment and a second end line portion connected to the first end line portion; wherein the second end line portion is covered by the first masking film; a gold plating step of plating a gold film on the outer surface of the main line segment of each metal line and the outer surface of the first end line portion of the end line segment; a first removing step: removing the first shielding film to expose the second terminal circuit portion to the gold-plated film; a second vacuum lamination step of vacuum laminating a second masking film on the main line segment and the end line segment of each metal line, so that the second end line portion of the end line segment of each metal line is exposed to the second masking film; and An etching step is performed to remove the portion of the second end circuit portion exposed from the second shielding film to form a gold finger structure.

2. The method for manufacturing a gold finger structure according to claim 1, wherein: In the preceding step, each of the metal circuits further includes a connecting circuit segment; and in the first vacuum lamination step, the first shielding film is also vacuum-laminated to cover a portion of the connecting circuit segment of each of the metal circuits, so that the connecting circuit segment of each of the metal circuits includes a first connecting circuit portion connected to the main circuit segment and a second connecting circuit portion connected to the first connecting circuit portion; wherein the second connecting circuit portion is covered by the first shielding film.

3. The method for manufacturing a gold finger structure according to claim 2, wherein: In the gold plating step, the gold plating film is further plated on the outer surface of the first connecting line portion of the connecting line segment of each of the metal lines.

4. The method for manufacturing a gold finger structure according to claim 3, wherein: In the first removing step, the first masking film is removed to expose the second connecting circuit portion and the second terminal circuit portion to the gold plating film.

5. The method for manufacturing a gold finger structure according to claim 4, characterized in that: In the second vacuum lamination step, the second masking film is further vacuum-laminated to cover the connecting line segment of each of the metal lines.

6. The method for manufacturing a gold finger structure according to claim 1, wherein: A second removing step is further included after the etching step, wherein the second removing step removes the second shielding film.

7. The method for manufacturing a gold finger structure according to claim 2, wherein: In the preceding step, an insulating outer layer covering a portion of the circuit layer is further provided; wherein each of the plurality of metal circuits includes an inner circuit buried in the insulating outer layer, and the inner circuit is electrically coupled to the connecting circuit segment.

8. The method for manufacturing a gold finger structure according to claim 1, wherein: After the etching step, the end line segment of each metal line is spaced from the edge of the board along a longitudinal direction.

9. The method for manufacturing a gold finger structure according to claim 1, wherein: After the etching step, the length of the end line segment in a longitudinal direction is 0.1 mm to 0.15 mm.

10. The method for manufacturing a gold finger structure according to claim 1, wherein: In the first vacuum lamination step, the first masking film is vacuum-laminated at a lamination temperature of 60 to 70 degrees Celsius, a pressurization time of 15 to 20 seconds, and a vacuuming time of 10 to 30 seconds at the end line segment of each metal line.

11. The method for manufacturing a gold finger structure according to claim 1, wherein: In the second vacuum lamination step, the second masking film is vacuum laminated on the main line segment and the end line segment of each metal line at a lamination temperature of 60 to 70 degrees, a pressurizing time of 15 to 20 seconds, and a vacuuming time of 10 to 30 seconds.

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