A semiconductor electric heating film quality detection device and method

Abstract

The present invention discloses a semiconductor electric heating film quality detection device and method, wherein a semiconductor electric heating film quality detection device comprises: a frame, on which a brake motor and a rotating frame are arranged, the rotating frame is connected to the frame for rotation, the brake motor is connected to the rotating frame for transmission, and the rotating frame is driven to rotate around a horizontal axis by the brake motor; a plurality of Y-axis translation devices are arranged on both sides of the rotating frame, and each Y-axis translation device is provided with an X-axis translation device. Beneficial effect: The semiconductor electric heating film quality detection device of the present application extrude and bend the semiconductor electric heating film from multiple directions, with many creases, the crease directions are not unique, and the creases cover the entire area of ​​the semiconductor electric heating film, which truly reproduces the actual bending of the semiconductor electric heating film in the clothes affected by body movement, so the detection result can truly characterize the actual quality of the semiconductor electric heating film.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor electric heating films, and in particular to a semiconductor electric heating film quality detection device and method. Background Art

[0002] Semiconductor electric heating film is a new type of heating material with high efficiency and energy saving. It is soft in texture and has excellent deformation ability, making it very suitable for implantation in clothing.

[0003] Currently, after a new semiconductor heating film is developed, it needs to undergo quality inspection to check its deformation stability. Only semiconductor heating films that remain intact after multiple bending and deformation can be mass-produced and sold.

[0004] The traditional quality inspection method is to manually hold the semiconductor heating film and bend it multiple times, and then power it on to detect whether it can heat up normally. If it can, it proves that the semiconductor heating film is not damaged, otherwise it is damaged.

[0005] Due to the slow speed, low efficiency and high labor cost of manual bending, technical personnel in the industry have designed a semiconductor electric heating film quality detection device to replace manual hand-held semiconductor electric heating film for multiple bending. The common semiconductor electric heating film quality detection device is shown in the patent with publication number CN118090461B. However, this semiconductor electric heating film quality detection device still has some problems in actual use. For example, the semiconductor electric heating film quality detection device can only repeatedly bend a certain area on the semiconductor electric heating film, and there is only one crease. In fact, the semiconductor electric heating film in the clothes is affected by body movement and is bent in a disorderly manner. Correspondingly, there are many creases, and they are not concentrated in one place. Therefore, the detection method of the semiconductor electric heating film quality detection device cannot truly reflect the bending condition of the semiconductor electric heating film during actual use, and its detection results cannot characterize the actual quality of the semiconductor electric heating film. Summary of the invention

[0006] The main purpose of the present invention is to provide a semiconductor electric heating film quality detection device and method, aiming to solve the problem that the existing semiconductor electric heating film quality detection device cannot truly detect the actual quality of the semiconductor electric heating film.

[0007] In order to solve the above problems, the present invention proposes a semiconductor electric heating film quality detection device, comprising:

[0008] A frame, on which a brake motor and a rotating frame are arranged, the rotating frame is connected to the frame for rotation, the brake motor is connected to the rotating frame for transmission, and the rotating frame is driven to rotate around a horizontal axis by the brake motor;

[0009] A plurality of Y-axis translation devices are arranged on both sides of the rotating frame, each Y-axis translation device is provided with an X-axis translation device, and the X-axis translation device is driven to translate along the Y-axis by the Y-axis translation device, and a clamp is arranged on the X-axis translation device, and the clamp is driven to translate along the X-axis by the X-axis translation device, and the clamp is used to clamp the semiconductor electric heating film;

[0010] The second X-axis translation device is arranged below the rotating frame, the second X-axis translation device is provided with the second Y-axis translation device, and the second X-axis translation device drives the second Y-axis translation device to translate along the X-axis, the second Y-axis translation device is provided with the second Z-axis lifting device, and the second Y-axis translation device drives the Z-axis lifting device to translate along the Y-axis, the upper end of the Z-axis lifting device is elastically connected to the first motor, the upper end of the first motor is connected to the lever, and the lever rotates around the vertical axis driven by the first motor;

[0011] The rotating frame does not contact the second X-axis translation device, the second Y-axis translation device, or the shifting rod during the rotation process.

[0012] In one embodiment, the Y-axis translation device 1 comprises:

[0013] A sliding sleeve, the sliding sleeve is on the long side of the rotating frame, and the X-axis translation device 1 is connected to the sliding sleeve;

[0014] The lead screw is extended along the long side of the rotating frame and is screwed to the sliding sleeve;

[0015] Motor 2 is connected with the screw drive.

[0016] In one embodiment, the fixture comprises:

[0017] The lower clamping arm is arranged horizontally, and a slide is fixedly mounted thereon;

[0018] The upper clamping arm is arranged parallel to and directly above the lower clamping arm, and is connected to the slide frame for sliding up and down movement;

[0019] A guide post is vertically fixedly installed in the slide frame, the upper clamp arm is vertically slidably connected to the guide post, and a spring 1 is sleeved on the guide post;

[0020] An armature, fixedly connected to the upper clamping arm;

[0021] The electromagnet is fixedly connected with the lower clamping arm. When the electromagnet is energized, the armature is attracted to approach, and the upper clamping arm is driven to move downward to squeeze the spring 1 and contact the lower clamping arm.

[0022] In one embodiment, the upper end of the Z-axis lifting device is connected to an extension arm, and a slide cylinder is vertically fixedly installed on the extension end of the extension arm. A pressure sensor, a slide plate, and spring 2 are arranged in the slide cylinder from bottom to top. The pressure sensor is fixedly connected to the slide cylinder, and the lower end of the slide plate is crimped to the pressure sensor. The upper end of the slide plate is connected to the lower end of spring 2, and the upper end of spring 2 is connected to a slide column. The lower end of the slide column is vertically slid into the slide cylinder, and the upper end of the slide column is connected to motor 1.

[0023] In addition, the present invention also proposes a semiconductor electric heating film quality detection method, using any of the above semiconductor electric heating film quality detection devices to perform the following steps:

[0024] S1. Clamp the semiconductor electric heating film around with multiple clamps;

[0025] S2, controlling any two fixtures to translate so that the semiconductor electric heating film is partially bent;

[0026] S3, controlling the X-axis translation device 2, the Y-axis translation device 2, the Z-axis lifting device, and the motor 1 to move, driving the lever to press the semiconductor electric heating film upward, and rotating and moving along the lower surface of the semiconductor electric heating film to change the fold direction;

[0027] S4, control the brake motor to drive the rotating frame to rotate 180 degrees, and then repeat S2 and S3;

[0028] S5. Loosen the clamp, remove the semiconductor heating film, and power on to test its status.

[0029] In one embodiment, the semiconductor electric heating film is rectangular, and there are four clamps, which respectively clamp the four corners of the semiconductor electric heating film, the long side of the semiconductor electric heating film extends along the Y-axis direction, and the short side of the semiconductor electric heating film extends along the X-axis direction;

[0030] The step S2, controlling any two fixtures to translate so as to partially bend the semiconductor electric heating film, comprises:

[0031] S21, controlling the clamps at both ends of the long side of the semiconductor electric heating film to translate along the X-axis to extrude and bend the semiconductor electric heating film;

[0032] S22, controlling the clamps at both ends of the short side of the semiconductor electric heating film to translate along the Y axis to extrude and bend the semiconductor electric heating film;

[0033] S23, controlling two clamps at one of the corners of the semiconductor electric heating film to translate along the X / Y axis to extrude and bend the semiconductor electric heating film;

[0034] S24, controlling the two fixtures at the other diagonal corners of the semiconductor electric heating film to translate along the X / Y axis to extrude and bend the semiconductor electric heating film;

[0035] S25, controlling the clamps at both ends of one of the long sides of the semiconductor electric heating film to translate along the Y axis to approach each other to extrude and bend the semiconductor electric heating film;

[0036] S26, controlling the clamps at both ends of the other long side of the semiconductor electric heating film to translate along the Y axis so as to approach each other and extrude and bend the semiconductor electric heating film;

[0037] S27, controlling the clamps at both ends of one short side of the semiconductor electric heating film to translate along the X-axis to approach each other to extrude and bend the semiconductor electric heating film;

[0038] S28, controlling the clamps at both ends of the other short side of the semiconductor electric heating film to translate along the X-axis so as to approach each other and extrude and bend the semiconductor electric heating film;

[0039] In S21-S28, after the extrusion and bending of the semiconductor electric heating film is completed in each step, S3 is performed first, and after S3 is completed, the next step of extrusion and bending of the semiconductor electric heating film is performed.

[0040] In one embodiment, in S23 and S24, the clamp that starts to translate releases the clamping of the semiconductor electric heating film, and resumes the clamping of the semiconductor electric heating film after the clamp translates to the right position.

[0041] In one embodiment, in S3, the pressing force of the lever on the semiconductor electric heating film is detected in real time by a pressure sensor;

[0042] When it is detected that the tightening force of the lever on the semiconductor electric heating film increases, the Z-axis lifting device is controlled to drive the slide cylinder to descend, so that the tightening force drops to the set value;

[0043] When it is detected that the pressing force of the lever on the semiconductor electric heating film is reduced, the Z-axis lifting device is controlled to drive the slide cylinder to rise, so that the pressing force is increased to a set value.

[0044] In one embodiment, the trajectory of the lever rotating and moving along the lower surface of the semiconductor electric heating film in S3 covers the entire lower surface of the semiconductor electric heating film.

[0045] In one embodiment, before controlling the brake motor to drive the rotating frame to rotate 180 degrees in S4, the second X-axis translation device, the second Y-axis translation device, and the Z-axis lifting device are first controlled to move the lever to a position that does not affect the rotation of the rotating frame.

[0046] Beneficial effect: The semiconductor electric heating film quality detection device of the present application extrude and bend the semiconductor electric heating film from multiple directions, with many creases, the crease directions are not unique, and the creases cover the entire area of ​​the semiconductor electric heating film, truly reproducing the actual bending situation of the semiconductor electric heating film in the clothes affected by body movement, so the detection result can truly characterize the actual quality of the semiconductor electric heating film. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0048] Figure 1 It is a front view of a semiconductor electric heating film quality detection device of the present invention;

[0049] Figure 2 It is a top view of a semiconductor electric heating film quality detection device of the present invention;

[0050] Figure 3 It is the internal structure diagram of the slide cylinder of the present invention;

[0051] Figure 4 is a top view of the clamp of the present invention;

[0052] Figure 5 It is a right side view of the clamp of the present invention;

[0053] Figure 6 yes Figure 5 AA section view in.

[0054] The following are the descriptions of the reference numerals:

[0055] 1. Frame; 2. Brake motor; 3. Rotating frame; 4. Sliding sleeve; 5. X-axis translation device 1;

[0056] 6. Clamp; 61. Lower clamp arm; 62. Slide; 63. Upper clamp arm; 64. Guide post; 65. Spring 1; 66. Armature; 67. Electromagnet;

[0057] 7. X-axis translation device 2; 8. Y-axis translation device 2; 9. Z-axis lifting device; 10. Extension arm; 11. Slide; 12. Pressure sensor; 13. Slide plate; 14. Spring 2; 15. Slide column; 16. Motor 1; 17. Lever; 18. Semiconductor electric heating film; 19. Screw; 20. Motor 2. DETAILED DESCRIPTION

[0058] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0059] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0060] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0061] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the full text includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in the field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0062] The present invention proposes a semiconductor electric heating film quality detection device, which extrude and bend the semiconductor electric heating film 18 from multiple directions, with many creases, the crease directions are not unique, and the creases cover the entire area of ​​the semiconductor electric heating film 18, truly reproducing the actual bending situation of the semiconductor electric heating film 18 in the clothes affected by body movement, so the detection result can truly characterize the actual quality of the semiconductor electric heating film 18.

[0063] Specifically, in one embodiment of the invention, Figure 1 and Figure 2 As shown, the semiconductor electric heating film quality detection device includes a frame 1, multiple Y-axis translation devices 1, and an X-axis translation device 2 7. The frame 1 is provided with a brake motor 2 and a rotating frame 3. The rotating frame 3 is rotationally connected to the frame 1, and the brake motor 2 is transmission-connected to the rotating frame 3. The brake motor 2 drives the rotating frame 3 to rotate around the horizontal axis.

[0064] In this embodiment, if Figure 1 and Figure 2 As shown, a plurality of Y-axis translation devices are arranged on both sides of the rotating frame 3, and an X-axis translation device 5 is arranged on each Y-axis translation device. The X-axis translation device 5 is driven by the Y-axis translation device 1 to translate along the Y-axis. Preferably, the Y-axis translation device 1 is a screw rod 19, a motor 20 and a sleeve 4, as shown in FIG. Figure 1 and Figure 2 As shown, the sleeve 4 is slidably mounted on the long side of the rotating frame 3, and the X-axis translation device 1 5 is fixedly connected to the sleeve 4; the screw rod 19 is extended along the long side of the rotating frame 3 and is screwed to the sleeve 4; the motor 20 is transmission-connected to the screw rod 19, and the motor 20 drives the screw rod 19 to rotate after starting, and the screw rod 19 rotates to drive the sleeve 4 to slide along the long side of the rotating frame 3, that is, translate along the Y-axis.

[0065] In this embodiment, if Figure 1 and Figure 2 As shown, a clamp 6 is provided on the X-axis translation device 5, and the clamp 6 is driven to translate along the X-axis by the X-axis translation device 5. The clamp 6 is used to clamp the semiconductor electric heating film 18. Preferably, the X-axis translation device 5 is a push rod motor.

[0066] Specifically, Figure 4-Figure 6 As shown, the clamp 6 comprises: a lower clamp arm 61, an upper clamp arm 63, a guide post 64, an armature 66 and an electromagnet 67. The lower clamp arm 61 is horizontally arranged, and a slide 62 is fixedly mounted thereon; the upper clamp arm 63 is arranged parallel to and directly above the lower clamp arm 61, and is connected to the slide 62 for vertical sliding; the guide post 64 is vertically fixedly installed in the slide 62, and the upper clamp arm 63 is connected to the guide post 64 for vertical sliding, and a spring 65 is sleeved on the guide post 64; The armature 66 is fixedly connected to the upper clamping arm 63; the electromagnet 67 is fixedly connected to the lower clamping arm 61 and the X-axis translation device 5. When the electromagnet 67 is energized, it attracts the armature 66 to move closer, drives the upper clamping arm 63 to move downward to squeeze the spring 65, and contacts with the lower clamping arm 61, thereby clamping the semiconductor electric heating film 18. After the electromagnet 67 is powered off, the compressed spring 65 pushes the upper clamping arm 63 to move upward and separate from the lower clamping arm 61 to release the clamping of the semiconductor electric heating film 18.

[0067] In this embodiment, if Figure 1 and Figure 2As shown, the X-axis translation device 27 is arranged below the rotating frame 3, and the Y-axis translation device 28 is arranged on the X-axis translation device 27, and the Y-axis translation device 28 is driven to translate along the X-axis by the X-axis translation device 27, and the Z-axis lifting device 9 is arranged on the Y-axis translation device 28, and the Z-axis lifting device 9 is driven to translate along the Y-axis by the Y-axis translation device 28, and the upper end of the Z-axis lifting device 9 is elastically connected to the motor 16, and the upper end of the motor 16 is connected to the lever 17, and the lever 17 rotates around the vertical axis driven by the motor 16; during the rotation of the rotating frame 3, the X-axis translation device 27, the Y-axis translation device 28, and the lever 17 are not in contact, thereby preventing the X-axis translation device 27, the Y-axis translation device 28, and the lever 17 from affecting the rotation of the rotating frame 3.

[0068] Specifically, Figure 3 As shown, the upper end of the Z-axis lifting device 9 is connected to the extension arm 10, and a slide cylinder 11 is vertically fixedly installed at the extension end of the extension arm 10. A pressure sensor 12, a slide plate 13, and a spring 14 are sequentially arranged in the slide cylinder 11 from bottom to top. The pressure sensor 12 is fixedly connected to the slide cylinder 11, and the lower end of the slide plate 13 is crimped with the pressure sensor 12. The upper end of the slide plate 13 is connected to the lower end of the spring 14, and the slide plate 13 slides up and down in the slide cylinder 11. The upper end of the spring 14 is connected to the slide column 15, and the lower end of the slide column 15 is vertically slidable in the slide cylinder 11. The upper end of the slide column 15 is connected to the motor 16. When the Z-axis lifting device 9 lifts the lever 17 and presses the lower surface of the semiconductor electric heating film 18, a plurality of folds appear on the semiconductor electric heating film 18 in the area lifted by the lever 17. At this time, the motor 16 drives the lever 17 to rotate and changes the number, position and bending direction of the folds. The upper end of the Z-axis lifting device 9 is elastically connected The design of the motor 16 can protect the semiconductor electric heating film 18 and prevent the semiconductor electric heating film 18 from being broken by the lever 17. When the extrusion force between the lever 17 and the semiconductor electric heating film 18 exceeds the set value, the slide column 15 descends to squeeze the spring 2 14, reducing the extrusion force between the lever 17 and the semiconductor electric heating film 18, protecting the semiconductor electric heating film 18 and preventing the semiconductor electric heating film 18 from being broken by the lever 17. The setting of the pressure sensor 12 can detect the pressing force of the lever 17 on the semiconductor electric heating film 18 in real time. When it is detected that the pressing force of the lever 17 on the semiconductor electric heating film 18 increases, the Z-axis lifting device 9 is controlled to drive the slide 11 to descend, so that the pressing force decreases to the set value; when it is detected that the pressing force of the lever 17 on the semiconductor electric heating film 18 decreases, the Z-axis lifting device 9 is controlled to drive the slide 11 to rise, so that the pressing force increases to the set value, thereby ensuring that the contact pressure between the lever 17 and the lower surface of the semiconductor electric heating film 18 is constant, which is conducive to the safe detection of the quality of the semiconductor electric heating film 18.

[0069] The semiconductor electric heating film quality detection device of this embodiment squeezes the semiconductor electric heating film 18 through the clamp 6 to make it bend and appear creases, and then lifts the lever 17 to lift the semiconductor electric heating film 18, so that the semiconductor electric heating film 18 has multiple creases, and the motor 16 drives the lever 17 to rotate and the X-axis translation device 2 7, the Y-axis translation device 2 8, and the Z-axis lifting device 9 drive the lever 17 to move along the lower surface of the semiconductor electric heating film 18 to achieve multiple creases. Constantly change the position and orientation, and the entire area of ​​the semiconductor electric heating film 18 has creases, there are many creases, the crease directions are not unique, and the creases cover the entire area of ​​the semiconductor electric heating film 18, which truly reproduces the actual bending of the semiconductor electric heating film 18 in the clothes under the influence of body movement. Therefore, the detection result can truly represent the actual quality of the semiconductor electric heating film 18.

[0070] In addition, the present invention also proposes a semiconductor electric heating film quality detection method, using any of the above semiconductor electric heating film quality detection devices to perform the following steps:

[0071] S1, use multiple clamps 6 to clamp the semiconductor electric heating film 18 around, such as Figure 2 As shown;

[0072] S2, controlling any two clamps 6 to translate so that the semiconductor electric heating film 18 is partially bent and creases appear;

[0073] S3, control the X-axis translation device 2 7, the Y-axis translation device 2 8, the Z-axis lifting device 9, and the motor 16 to move, drive the lever 17 to press the semiconductor electric heating film 18 upward to make multiple creases appear on the semiconductor electric heating film 18, and rotate and move along the lower surface of the semiconductor electric heating film 18 to change the orientation of the creases. The trajectory of the lever 17 rotating along the lower surface of the semiconductor electric heating film 18 covers the entire lower surface of the semiconductor electric heating film 18. With this design, creases appear in all areas of the semiconductor electric heating film 18, there are many creases, the crease directions are not unique, and the creases cover the entire area of ​​the semiconductor electric heating film 18, which truly reproduces the actual bending of the semiconductor electric heating film 18 in the clothes under the influence of body movement. Therefore, the detection result can truly represent the actual quality of the semiconductor electric heating film 18;

[0074] S4, control the brake motor 2 to drive the rotating frame 3 to rotate 180 degrees, and then repeat S2 and S3. This design changes the bending direction of the semiconductor electric heating film 18 partially bent by controlling any two clamps 6 to translate in S2, so that the bending of the semiconductor electric heating film 18 is closer to the actual bending of the semiconductor electric heating film 18 in the clothes affected by body movement;

[0075] S5. After the bending is completed, the clamp 6 is released, the semiconductor electric heating film 18 is removed, and its state is tested by powering on.

[0076] In this embodiment, if Figure 2As shown, the semiconductor electric heating film 18 is rectangular, there are four clamps 6, which clamp the four corners of the semiconductor electric heating film 18 respectively, the long side of the semiconductor electric heating film 18 extends along the Y-axis direction, and the short side of the semiconductor electric heating film 18 extends along the X-axis direction. At this time, S2, controlling any two clamps 6 to translate to partially bend the semiconductor electric heating film 18, includes:

[0077] S21, controlling the clamps 6 at both ends of the long side of the semiconductor electric heating film 18 to translate along the X-axis to extrude and bend the semiconductor electric heating film 18;

[0078] S22, controlling the clamps 6 at both ends of the short sides of the semiconductor electric heating film 18 to translate along the Y axis to extrude and bend the semiconductor electric heating film 18;

[0079] S23, controlling two clamps 6 at one of the corners of the semiconductor electric heating film 18 to translate along the X / Y axis to extrude and bend the semiconductor electric heating film 18;

[0080] S24, controlling the two clamps 6 at the other diagonal corners of the semiconductor electric heating film 18 to translate along the X / Y axis to extrude and bend the semiconductor electric heating film 18;

[0081] S25, controlling the clamps 6 at both ends of one of the long sides of the semiconductor electric heating film 18 to translate along the Y axis to approach each other to extrude and bend the semiconductor electric heating film 18;

[0082] S26, controlling the clamps 6 at the two ends of the other long side of the semiconductor electric heating film 18 to translate along the Y axis toward each other to extrude and bend the semiconductor electric heating film 18;

[0083] S27, controlling the clamps 6 at both ends of one short side of the semiconductor electric heating film 18 to translate along the X-axis to approach each other to extrude and bend the semiconductor electric heating film 18;

[0084] S28, controlling the clamps 6 at both ends of the other short side of the semiconductor electric heating film 18 to translate along the X-axis toward each other to extrude and bend the semiconductor electric heating film 18;

[0085] In S21-S28, after each step of extruding and bending the semiconductor electric heating film 18 is completed, S3 is performed first, and the next step of extruding and bending the semiconductor electric heating film 18 is performed after S3 is completed, that is, S3 is performed after S21 is completed, S22 is performed after S3 is completed, and S3 is performed again after S22 is completed, and so on, until S3 is performed after S28 is completed, and S4 is performed after S3 is completed. This design allows the semiconductor electric heating film 18 to undergo a large amount of bending training that is close to the actual bending situation of the semiconductor electric heating film 18 in the clothes affected by body movement, so that the actual quality of the semiconductor electric heating film 18 can be more accurately detected. In addition, the number of creases is large, the crease distribution is comprehensive and disorderly, the crease direction is not unique, and the crease covers the entire area of ​​the semiconductor electric heating film 18, thereby truly reproducing the actual bending situation of the semiconductor electric heating film 18 in the clothes affected by body movement, so the detection result can truly characterize the actual quality of the semiconductor electric heating film 18.

[0086] In this embodiment, in S23 and S24, the clamp 6 that starts to translate loosens its grip on the semiconductor electric heating film 18, and resumes its grip on the semiconductor electric heating film 18 after the clamp 6 translates into place. This design prevents the clamp 6 from translating and pulling the semiconductor electric heating film 18 in 23 and S24, causing the semiconductor electric heating film 18 to tear.

[0087] In this embodiment, before the brake motor 2 is controlled in S4 to drive the rotating frame 3 to rotate 180 degrees, the X-axis translation device 2 7, the Y-axis translation device 2 8, and the Z-axis lifting device 9 are first controlled to move the lever 17 to a position that does not affect the rotation of the rotating frame 3. After the rotating frame 3 rotates 180 degrees, the X-axis translation device 2 7, the Y-axis translation device 2 8, and the Z-axis lifting device 9 are controlled to reset the lever 17, continue to press the semiconductor electric heating film 18, and rotate and move along the lower surface of the semiconductor electric heating film 18 to change the number, position, length and direction of the creases, which fully reproduces the actual bending situation of the semiconductor electric heating film 18 in the clothes affected by body movement, so the detection result can truly represent the actual quality of the semiconductor electric heating film 18.

[0088] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A semiconductor electric heating film quality detection device, characterized in that: include: A frame, on which a brake motor and a rotating frame are arranged, the rotating frame is connected to the frame for rotation, the brake motor is connected to the rotating frame for transmission, and the rotating frame is driven to rotate around a horizontal axis by the brake motor; A plurality of Y-axis translation devices are arranged on both sides of the rotating frame, each of which is provided with an X-axis translation device, and the X-axis translation device is driven to translate along the Y-axis by the Y-axis translation device, and a clamp is arranged on each of which, and the clamp is driven to translate along the X-axis by the X-axis translation device, and the clamp is used to clamp the semiconductor electric heating film, and the semiconductor electric heating film is clamped around by a plurality of clamps, and then any two clamps are controlled to translate to make the semiconductor electric heating film partially bend; The second X-axis translation device is arranged below the rotating frame, the second X-axis translation device is provided with the second Y-axis translation device, and the second X-axis translation device drives the second Y-axis translation device to translate along the X-axis, the second Y-axis translation device is provided with the second Z-axis lifting device, and the second Y-axis translation device drives the Z-axis lifting device to translate along the Y-axis, the upper end of the Z-axis lifting device is elastically connected to the first motor, the upper end of the first motor is connected to the lever, and the lever rotates around the vertical axis driven by the first motor; The rotating frame does not contact the second X-axis translation device, the second Y-axis translation device and the shifting rod during the rotation process.

2. A semiconductor electric heating film quality detection device as claimed in claim 1, characterized in that: The Y-axis translation device 1 comprises: A sliding sleeve, the sliding sleeve is on the long side of the rotating frame, and the X-axis translation device 1 is connected to the sliding sleeve; The lead screw is extended along the long side of the rotating frame and is screwed to the sliding sleeve; Motor 2 is connected with the screw drive.

3. A semiconductor electric heating film quality detection device as claimed in claim 1, characterized in that: The fixture comprises: The lower clamping arm is arranged horizontally, and a slide is fixedly mounted thereon; The upper clamping arm is arranged parallel to and directly above the lower clamping arm, and is connected to the slide frame for sliding up and down movement; A guide post is vertically fixedly installed in the slide frame, the upper clamp arm is vertically slidably connected to the guide post, and a spring 1 is sleeved on the guide post; An armature, fixedly connected to the upper clamping arm; The electromagnet is fixedly connected with the lower clamping arm. When the electromagnet is energized, the armature is attracted to approach, and the upper clamping arm is driven to move downward to squeeze the spring 1 and contact the lower clamping arm.

4. A semiconductor electric heating film quality detection device as claimed in claim 1, characterized in that: The upper end of the Z-axis lifting device is connected to an extension arm, and a slide cylinder is vertically fixedly installed on the extension end of the extension arm. A pressure sensor, a slide plate, and a second spring are arranged in the slide cylinder from bottom to top. The pressure sensor is fixedly connected to the slide cylinder, and the lower end of the slide plate is crimped with the pressure sensor. The upper end of the slide plate is connected to the lower end of the second spring, and the upper end of the second spring is connected to a slide column. The lower end of the slide column is vertically slid into the slide cylinder, and the upper end of the slide column is connected to motor one.

5. A method for detecting the quality of a semiconductor electric heating film, characterized in that: The semiconductor electric heating film quality detection device according to any one of claims 1 to 4 is used to perform the following steps: S1. Clamp the semiconductor electric heating film around with multiple clamps; S2, controlling any two fixtures to translate so that the semiconductor electric heating film is partially bent; S3, controlling the X-axis translation device 2, the Y-axis translation device 2, the Z-axis lifting device and the motor 1 to move, driving the lever to press the semiconductor electric heating film upward, and rotating and moving along the lower surface of the semiconductor electric heating film to change the fold direction; S4, control the brake motor to drive the rotating frame to rotate 180 degrees, and then repeat S2 and S3; S5. Loosen the clamp, remove the semiconductor heating film, and power on to test its status.

6. A semiconductor electric heating film quality detection method as claimed in claim 5, characterized in that: The semiconductor electric heating film is rectangular, and there are four clamps, which respectively clamp the four corners of the semiconductor electric heating film, the long side of the semiconductor electric heating film extends along the Y-axis direction, and the short side of the semiconductor electric heating film extends along the X-axis direction; The step S2, controlling any two fixtures to translate so as to partially bend the semiconductor electric heating film, comprises: S21, controlling the clamps at both ends of the long side of the semiconductor electric heating film to translate along the X-axis to extrude and bend the semiconductor electric heating film; S22, controlling the clamps at both ends of the short side of the semiconductor electric heating film to translate along the Y axis to extrude and bend the semiconductor electric heating film; S23, controlling two clamps at one of the corners of the semiconductor electric heating film to translate along the X / Y axis to extrude and bend the semiconductor electric heating film; S24, controlling the two fixtures at the other diagonal corners of the semiconductor electric heating film to translate along the X / Y axis to extrude and bend the semiconductor electric heating film; S25, controlling the clamps at both ends of one of the long sides of the semiconductor electric heating film to translate along the Y axis to approach each other to extrude and bend the semiconductor electric heating film; S26, controlling the clamps at both ends of the other long side of the semiconductor electric heating film to translate along the Y axis so as to approach each other and extrude and bend the semiconductor electric heating film; S27, controlling the clamps at both ends of one short side of the semiconductor electric heating film to translate along the X-axis to approach each other to extrude and bend the semiconductor electric heating film; S28, controlling the clamps at both ends of the other short side of the semiconductor electric heating film to translate along the X-axis so as to approach each other and extrude and bend the semiconductor electric heating film; In S21-S28, after the extrusion and bending of the semiconductor electric heating film is completed in each step, S3 is performed first, and after S3 is completed, the next step of extrusion and bending of the semiconductor electric heating film is performed.

7. A semiconductor electric heating film quality detection method as claimed in claim 6, characterized in that: In S23 and S24, the clamp that starts to translate releases the clamping of the semiconductor electric heating film, and resumes the clamping of the semiconductor electric heating film after the clamp translates into place.

8. A semiconductor electric heating film quality detection method as claimed in claim 5, characterized in that: In S3, the pressure sensor is used to detect the tightening force of the lever on the semiconductor electric heating film in real time; When it is detected that the tightening force of the lever on the semiconductor electric heating film increases, the Z-axis lifting device is controlled to drive the slide cylinder to descend, so that the tightening force drops to the set value; When it is detected that the pressing force of the lever on the semiconductor electric heating film is reduced, the Z-axis lifting device is controlled to drive the slide cylinder to rise, so that the pressing force is increased to a set value.

9. A semiconductor electric heating film quality detection method as claimed in claim 5, characterized in that: In S3, the trajectory of the lever rotating and moving along the lower surface of the semiconductor electric heating film covers the entire lower surface of the semiconductor electric heating film.

10. A semiconductor electric heating film quality detection method as claimed in claim 5, characterized in that: Before controlling the brake motor to drive the rotating frame to rotate 180 degrees in S4, first control the X-axis translation device 2, the Y-axis translation device 2 and the Z-axis lifting device to move the lever to a position that does not affect the rotation of the rotating frame.

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