An intelligent power module, a manufacturing method thereof, a controller and a household appliance

Abstract

The application discloses an intelligent power module and a manufacturing method, a controller and a household appliance thereof, and relates to the technical field of semiconductors.The application comprises a ceramic substrate, a copper frame and a power chip, wherein the ceramic substrate is provided with a mounting cavity, and the copper frame is embedded in the mounting cavity.The power chip is mounted on the copper frame, and the heat generated by the power chip is transferred to the ceramic substrate through the copper frame and then dissipated outward through the ceramic substrate.Therefore, the ceramic substrate increases the heat transfer of the chip to the copper frame, and the heat transfer is not only along the bottom of the copper frame but also along the four sides of the copper frame, so that the heat dissipation efficiency of the intelligent power module is improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and in particular to an intelligent power module, its manufacturing method, controller, and home appliance. Background Technology

[0002] An intelligent power module (IPM) is a power switching device that integrates an IGBT (Insulated Gate Bipolar Transistor) module. It is widely used in controlling and driving high-power electronic devices, including but not limited to AC motor drivers, frequency converters, and inverters.

[0003] IPM modules operate with extremely high switching frequencies, causing them to heat up rapidly. Only by controlling the IPM module's operating temperature within a reasonable range can its normal operation and stable performance be guaranteed.

[0004] Currently, IPM modules typically employ a combination structure of a copper frame and molding compound. The copper frame is encapsulated in the molding compound for electrical insulation, and the heat generated by the IPM module's chip is transferred outwards through the copper frame and then to the molding compound. However, since the molding compound is often made of epoxy resin, which has low thermal conductivity, this limits the heat dissipation performance of the power module. Summary of the Invention

[0005] In view of the above problems, the present invention is proposed to provide an intelligent power module, a method for manufacturing the same, a controller, and a home appliance that overcomes or at least partially solves the above problems.

[0006] Based on a first aspect of the present invention, a smart power module is provided, the smart power module comprising:

[0007] A ceramic substrate, wherein a mounting cavity is formed on the ceramic substrate;

[0008] A copper frame, which is embedded within the mounting cavity;

[0009] A power chip is mounted on the copper frame. The heat generated by the power chip is transferred to the ceramic substrate through the copper frame and then dissipated outward through the ceramic substrate.

[0010] In one optional embodiment, the ceramic substrate is further provided with a plurality of connection holes, the connection holes communicating with the mounting cavity and extending through the ceramic substrate, so that a portion of the copper frame extends through the ceramic substrate to form a plurality of connection ports.

[0011] In one optional embodiment, the intelligent power module further includes a molding compound that covers the ceramic substrate and encapsulates the copper frame and the power chip, wherein the heat generated by the power chip is dissipated outward through the molding compound.

[0012] In one optional embodiment, the ceramic substrate has an extension portion, wherein the extension portion is embedded within the encapsulation body.

[0013] Based on a second aspect of the present invention, a method for manufacturing a smart power module is also provided, the method comprising:

[0014] A ceramic substrate is provided, wherein a mounting cavity is formed on the ceramic substrate, a copper foil is placed in the mounting cavity and heated to melt the copper foil and fill the mounting cavity to form a copper frame;

[0015] At least one power chip is provided, the power chip is mounted on the copper frame, and the power chip is wired to obtain the module body, so that the heat generated by the power chip is transferred to the ceramic substrate through the copper frame and then dissipated outward through the ceramic substrate.

[0016] The module body is injection molded using molding compound to form a molding compound covering the ceramic substrate, resulting in a smart power module. The molding compound encapsulates the copper frame and the power chip, and the heat generated by the power chip is dissipated outward through the molding compound.

[0017] In an optional embodiment, the manufacturing method further includes a substrate fabrication step for the ceramic substrate, the substrate fabrication step comprising:

[0018] A ceramic slurry is provided and coated onto a selectively transparent film platform. The sample stage is then pressed down to expose the ceramic slurry, so that the cured ceramic slurry adheres to the sample stage, thereby obtaining a substrate green body.

[0019] The ceramic slurry is repeatedly coated onto the selective light-transmitting film platform, and the sample stage is pressed down to expose the ceramic slurry after each coating, so that the cured ceramic slurry adheres to the cured substrate green body on the sample stage to obtain a multilayer substrate green body.

[0020] The multilayer substrate green blank is calcined, and the calcined multilayer substrate green blank is sintered to obtain the ceramic substrate.

[0021] In one optional embodiment, the substrate fabrication steps further include:

[0022] Anhydrous ethanol, alumina ceramic powder, and photosensitive resin are mixed to obtain the ceramic slurry.

[0023] An optional embodiment of the invention, wherein calcining the multilayer substrate green and sintering the calcined multilayer substrate green to obtain the ceramic substrate comprises:

[0024] According to the first temperature control strategy, the multilayer substrate green blank is subjected to low-temperature calcination to remove the photosensitive resin in the multilayer substrate green blank, wherein the low-temperature calcination temperature does not exceed 650°C.

[0025] According to the second temperature control strategy, the multilayer substrate green body after calcination is subjected to high-temperature sintering to obtain the ceramic substrate, wherein the high-temperature sintering temperature is not lower than 800°C.

[0026] An optional aspect of the invention, wherein the low-temperature calcination of the multilayer substrate green blank according to a first temperature control strategy includes:

[0027] The multilayer substrate green blank is heated to a first temperature range at a first heating rate and held at that temperature for a first duration.

[0028] The multilayer substrate green blank, which has been held for a first time, is heated to a second temperature range according to a first heating rate and held for a second time.

[0029] The multilayer substrate green blank, which has been held for a second time according to the first heating rate, is heated to the third temperature range and held for the third time.

[0030] The multilayer substrate green blank, which has been held for a third time, is cooled to the second temperature range according to the first cooling rate.

[0031] An optional aspect of the invention, wherein the high-temperature sintering of the calcined multilayer substrate green blank according to a second temperature control strategy includes:

[0032] The calcined multilayer substrate green blank is heated to the fourth temperature range according to the second heating rate.

[0033] The multilayer substrate green blank, heated to the fourth temperature range according to the third heating rate, is then heated to the fifth temperature range and held for the fourth duration.

[0034] The multilayer substrate green blank, which has been held for a fourth time, is cooled to the fourth temperature range according to the second cooling rate.

[0035] In one optional embodiment, after placing the copper foil into the mounting cavity and heating it, the manufacturing method further includes:

[0036] The heated copper foil is cooled and then polished to obtain a copper frame flush with the ceramic substrate.

[0037] Based on a third aspect of the present invention, a controller is also provided, the controller comprising the intelligent power module as described in the above-described invention.

[0038] Based on a fourth aspect of the present invention, a household appliance is also provided, the household appliance including the controller as described in the above-described invention.

[0039] Compared with existing technologies, this invention includes a ceramic substrate, a copper frame, and a power chip. The ceramic substrate has a mounting cavity, and the copper frame is embedded within the mounting cavity. The power chip is mounted on the copper frame. The heat generated by the power chip is transferred to the ceramic substrate through the copper frame, and then dissipated outwards through the ceramic substrate. Therefore, the addition of the ceramic substrate allows heat transfer to the copper frame not only along the bottom of the copper frame but also along all four sides of the copper frame, thereby improving the heat dissipation efficiency of the intelligent power module.

[0040] The above description is merely an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention and to implement it in accordance with the contents of the specification, and in order to make the above and other objects, features and advantages of the present invention more apparent and understandable, specific embodiments of the present invention are described below. Attached Figure Description

[0041] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the invention. Furthermore, the same reference numerals denote the same parts throughout the drawings.

[0042] In the attached diagram:

[0043] Figure 1 This is a partial structural schematic diagram of an intelligent power module provided in an embodiment of the present invention;

[0044] Figure 2 This is a three-dimensional structural diagram of a ceramic substrate provided in an embodiment of the present invention;

[0045] Figure 3 This is a schematic diagram of a structure in which a copper frame is embedded in a ceramic substrate, according to an embodiment of the present invention.

[0046] Figure 4 This is a top view structural diagram of a module body provided in an embodiment of the present invention;

[0047] Figure 5 This is a bottom view structural diagram of an intelligent power module provided in an embodiment of the present invention;

[0048] Figure 6 This is a top view structural diagram of an intelligent power module provided in an embodiment of the present invention;

[0049] Figure 7 This is a schematic flowchart of a manufacturing method for an intelligent power module provided in an embodiment of the present invention;

[0050] Figure 8 This is a schematic diagram of the structure of a photocuring machine provided in an embodiment of the present invention;

[0051] Reference numerals: 1. Ceramic substrate; 11. Extension; 101. Mounting cavity; 102. Connecting hole; 2. Copper frame; 3. Power chip; 4. Connecting port; 5. Molded body; 6. Connecting wire; 7. Sample stage; 8. Selective light-transmitting film platform; 9. Multilayer substrate green body; 10. Reflector. Detailed Implementation

[0052] Exemplary embodiments of the invention will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the invention are shown in the drawings, it should be understood that the invention may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this invention will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0053] An intelligent power module (IPM) is an advanced power switching device that integrates an IGBT (Insulated Gate Bipolar Transistor) module. It is widely used in scenarios where high-power electronic devices are controlled and driven, such as AC motor drivers, frequency converters, and inverters.

[0054] IPM modules control the switching of their transistors at extremely high frequency during operation, resulting in rapid temperature increases. Only by controlling the IPM module's operating temperature within a reasonable range can its normal operation be guaranteed.

[0055] Currently, IPM modules typically employ a combination structure of a copper frame and molding compound, where the copper frame is insulated by the molding compound. Heat generated by the IPM module's chip is transferred outwards through the copper frame and then to the molding compound. Since the molding compound is often made of epoxy resin, which has low thermal conductivity, this limits the power module's heat dissipation performance.

[0056] To address the aforementioned technical problems, this invention proposes an embodiment that may include a ceramic substrate 1, a copper frame 2, and a power chip 3. The ceramic substrate 1 has a mounting cavity 101, and the copper frame 2 is embedded within the mounting cavity 101. The power chip 3 is mounted on the copper frame 2. The heat generated by the power chip 3 is transferred to the ceramic substrate 1 through the copper frame 2, and then dissipated outwards through the ceramic substrate 1. Therefore, the addition of the ceramic substrate 1 allows the heat transferred to the copper frame 2 not only along its bottom but also along its four sides, thereby improving the heat dissipation efficiency of the intelligent power module.

[0057] Reference Figure 1-6 This invention provides an intelligent power module, which may include a ceramic substrate 1, a copper frame 2, and a power chip 3, wherein:

[0058] The ceramic substrate 1 has a mounting cavity 101, and the copper frame 2 is embedded in the mounting cavity 101. The power chip 3 is mounted on the copper frame 2. The heat generated by the power chip 3 is transferred to the ceramic substrate 1 through the copper frame 2, and then dissipated outward through the ceramic substrate 1.

[0059] In this embodiment of the invention, the intelligent power module may include a ceramic substrate 1, a copper frame 2, and a power chip 3. A mounting cavity 101 is pre-formed on the ceramic substrate 1 to accommodate the copper frame 2. The surface of the copper frame 2 is flush with the surface of the ceramic substrate 1, and the copper frame 2 is welded and fixed to the ceramic substrate 1. The power chip 3 refers to an integrated circuit chip capable of processing high-power signals. It is a key component of the intelligent power module and the main component that generates a large amount of heat during operation. The power chip 3 can be fixed to the copper frame 2 by welding or bonding.

[0060] The heat generated by the power chip 3 can be transferred to the copper frame 2. The heat on the copper frame 2 is then transferred to the ceramic substrate 1 via both the vertical and horizontal directions, and dissipated outwards through the ceramic substrate 1. This significantly improves the heat dissipation effect of the intelligent power module, which is beneficial for its miniaturization design and product iteration.

[0061] An optional embodiment of the invention, referring to... Figure 1 , Figure 4 as well as Figure 5As shown, the intelligent power module may include a ceramic substrate 1, a copper frame 2, and a power chip 3. The ceramic substrate 1 has a mounting cavity 101, and the copper frame 2 is embedded within the mounting cavity 101. The power chip 3 is mounted on the copper frame 2. The heat generated by the power chip 3 is transferred to the ceramic substrate 1 through the copper frame 2, and then dissipated outwards through the ceramic substrate 1. The ceramic substrate 1 also has multiple connection holes 102, which communicate with the mounting cavity 101 and penetrate the ceramic substrate 1, allowing a portion of the copper frame 2 to pass through the ceramic substrate 1, forming multiple connection ports 4.

[0062] In this embodiment of the invention, the intelligent power module may include a ceramic substrate 1, a copper frame 2, and a power chip 3. A mounting cavity 101 is pre-formed on the ceramic substrate 1 to accommodate the copper frame 2. The surface of the copper frame 2 is flush with the surface of the ceramic substrate 1, and the copper frame 2 is welded and fixed to the ceramic substrate 1. The power chip 3 refers to an integrated circuit chip capable of processing high-power signals. It is a key component of the intelligent power module and the main component that generates a large amount of heat during operation. The power chip 3 can be fixed to the copper frame 2 by welding or bonding.

[0063] The heat generated by the power chip 3 can be transferred to the copper frame 2. The heat from the copper frame 2 is transferred to the ceramic substrate 1 via both vertical and horizontal directions, and then dissipated outwards through the ceramic substrate 1. The ceramic substrate 1 also has multiple connection holes 102, which communicate with the mounting cavity 101, and these connection holes 102 can be vertical through-holes. This allows the copper frame 2 to vertically penetrate the ceramic substrate 1. The copper frame 2 extends from one end face of the ceramic substrate 1 through the connection holes 102 to the other end face of the ceramic substrate 1, forming multiple connection ports 4. These connection ports 4 are used for electrical connection between the intelligent power module and an external circuit board.

[0064] Furthermore, existing smart power modules mostly use dual in-line packages. To avoid damage to the injection molded body due to excessively high electric field strength between the pins, strict requirements are placed on the electrical clearance of the smart power module. Therefore, the electrical clearance requirements between the pins of the smart power module limit the miniaturization of the module. In this embodiment of the invention, the ceramic substrate 1 is used as the substrate, and the copper frame 2 is embedded in the mounting groove on the ceramic substrate 1. A portion of the copper frame 2 passes through the ceramic substrate 1 through the connection hole 102 to form a connection port 4. This avoids the pins of the smart power module extending outwards, and the ceramic substrate 1 also ensures electrical insulation between the two connection ports 4, thereby reducing the electrical clearance between the two connection ports 4. That is, the pinless design meets the miniaturization requirements of the smart power module. Moreover, the heat generated by the power chip 3 can be transferred to the copper frame 2. The heat on the copper frame 2 is transferred to the ceramic substrate 1 in the vertical and horizontal directions, respectively, and then dissipated outwards through the ceramic substrate 1. This can greatly improve the heat dissipation effect of the intelligent power module, further facilitate the miniaturization design of the intelligent power module, and promote product iteration of the intelligent power module.

[0065] An optional embodiment of the invention, referring to... Figure 1-6 As shown, the intelligent power module may include a ceramic substrate 1, a copper frame 2, a power chip 3, and a molding compound 5. The ceramic substrate 1 has a mounting cavity 101, and the copper frame 2 is embedded within the mounting cavity 101. The power chip 3 is mounted on the copper frame 2. The heat generated by the power chip 3 is transferred to the ceramic substrate 1 through the copper frame 2 and then dissipated outwards through the ceramic substrate 1. The ceramic substrate 1 also has multiple connection holes 102, which communicate with the mounting cavity 101 and penetrate the ceramic substrate 1, allowing a portion of the copper frame 2 to pass through the ceramic substrate 1, forming multiple connection ports 4. The molding compound 5 covers the ceramic substrate 1 and encapsulates the copper frame 2 and the power chip 3. The heat generated by the power chip 3 is dissipated outwards through the molding compound 5.

[0066] In this embodiment of the invention, the intelligent power module may include a ceramic substrate 1, a copper frame 2, and a power chip 3. A mounting cavity 101 is pre-formed on the ceramic substrate 1 to accommodate the copper frame 2. The surface of the copper frame 2 is flush with the surface of the ceramic substrate 1, and the copper frame 2 is welded and fixed to the ceramic substrate 1. The power chip 3 refers to an integrated circuit chip capable of processing high-power signals. It is a key component of the intelligent power module and the main component that generates a large amount of heat during operation. The power chip 3 can be fixed to the copper frame 2 by welding or bonding.

[0067] The heat generated by the power chip 3 can be transferred to the copper frame 2. The heat from the copper frame 2 is transferred to the ceramic substrate 1 via both vertical and horizontal directions, and then dissipated outwards through the ceramic substrate 1. The ceramic substrate 1 also has multiple connection holes 102, which communicate with the mounting cavity 101, and these connection holes 102 can be vertical through-holes. This allows the copper frame 2 to vertically penetrate the ceramic substrate 1. The copper frame 2 extends from one end face of the ceramic substrate 1 through the connection holes 102 to the other end face of the ceramic substrate 1, forming multiple connection ports 4. These connection ports 4 are used for electrical connection between the intelligent power module and an external circuit board.

[0068] In this embodiment of the invention, the ceramic substrate 1 is used as the substrate, and the copper frame 2 is embedded in the mounting groove on the ceramic substrate 1. A portion of the copper frame 2 penetrates the ceramic substrate 1 through the connection hole 102 to form a connection port 4. This avoids the need for pin extension of the smart power module and ensures electrical insulation between the two connection ports 4 through the ceramic substrate 1, thereby reducing the electrical gap between the two connection ports 4. In other words, the pinless design meets the miniaturization requirements of the smart power module. Furthermore, the heat generated by the power chip 3 can be transferred to the copper frame 2, and the heat on the copper frame 2 is transferred to the ceramic substrate 1 through the vertical and horizontal directions, respectively, and dissipated outwards through the ceramic substrate 1. This greatly improves the heat dissipation effect of the smart power module, further facilitating its miniaturization design and product iteration.

[0069] The molding compound 5 covers the top of the ceramic substrate 1 and encapsulates the copper frame 2 and the power chip 3, achieving electrical insulation between them. The heat generated by the power chip 3 is dissipated outwards through the molding compound 5. In other words, the heat dissipation path of the power chip 3 can include a top heat dissipation path and a bottom heat dissipation path. The top heat dissipation path can be: the power chip 3 transfers heat to the molding compound 5, and then dissipates heat outwards through the molding compound 5. The bottom heat dissipation path can be: the power chip 3 transfers heat to the copper frame 2, then the copper frame 2 transfers heat to the ceramic substrate 1, and finally dissipates heat outwards through the ceramic substrate 1. This significantly improves the heat dissipation effect of the intelligent power module.

[0070] An optional embodiment of the invention, referring to... Figure 1-5 As shown, the intelligent power module may include a ceramic substrate 1, a copper frame 2, a power chip 3, a molding compound 5, and an extension 11. The ceramic substrate 1 has a mounting cavity 101, and the copper frame 2 is embedded within the mounting cavity 101. The power chip 3 is mounted on the copper frame 2. The heat generated by the power chip 3 is transferred to the ceramic substrate 1 through the copper frame 2 and then dissipated outwards through the ceramic substrate 1. The ceramic substrate 1 also has multiple connection holes 102, which communicate with the mounting cavity 101 and penetrate the ceramic substrate 1, allowing a portion of the copper frame 2 to pass through the ceramic substrate 1, forming multiple connection ports 4. The molding compound 5 covers the ceramic substrate 1 and encapsulates the copper frame 2 and the power chip 3. The heat generated by the power chip 3 is dissipated outwards through the molding compound 5. The extension 11 is located on the ceramic substrate 1 and is embedded within the molding compound 5.

[0071] The intelligent power module may include a ceramic substrate 1, a copper frame 2, and a power chip 3. A mounting cavity 101 is pre-formed on the ceramic substrate 1 to accommodate the copper frame 2. The surface of the copper frame 2 is flush with the surface of the ceramic substrate 1, and the copper frame 2 is welded to the ceramic substrate 1. The power chip 3 refers to an integrated circuit chip capable of processing high-power signals. It is a key component of the intelligent power module and the main component that generates a large amount of heat during operation. The power chip 3 can be fixed to the copper frame 2 by welding or bonding.

[0072] The heat generated by the power chip 3 can be transferred to the copper frame 2. The heat from the copper frame 2 is transferred to the ceramic substrate 1 via both vertical and horizontal directions, and then dissipated outwards through the ceramic substrate 1. The ceramic substrate 1 also has multiple connection holes 102, which communicate with the mounting cavity 101, and these connection holes 102 can be vertical through-holes. This allows the copper frame 2 to vertically penetrate the ceramic substrate 1. The copper frame 2 extends from one end face of the ceramic substrate 1 through the connection holes 102 to the other end face of the ceramic substrate 1, forming multiple connection ports 4. These connection ports 4 are used for electrical connection between the intelligent power module and an external circuit board.

[0073] In this embodiment of the invention, the ceramic substrate 1 is used as the substrate, and the copper frame 2 is embedded in the mounting groove on the ceramic substrate 1. A portion of the copper frame 2 penetrates the ceramic substrate 1 through the connection hole 102 to form a connection port 4. This avoids the need for pin extension of the smart power module and ensures electrical insulation between the two connection ports 4 through the ceramic substrate 1, thereby reducing the electrical gap between the two connection ports 4. In other words, the pinless design meets the miniaturization requirements of the smart power module. Furthermore, the heat generated by the power chip 3 can be transferred to the copper frame 2, and the heat on the copper frame 2 is transferred to the ceramic substrate 1 through the vertical and horizontal directions, respectively, and dissipated outwards through the ceramic substrate 1. This greatly improves the heat dissipation effect of the smart power module, further facilitating its miniaturization design and product iteration.

[0074] The encapsulation body 5 can cover the top of the ceramic substrate 1 and encapsulate the copper frame 2 and the power chip 3, achieving electrical insulation between the copper frame 2 and the power chip 3. The extension 11 is located on the ceramic substrate 1. For example, the extension 11 and the ceramic substrate 1 can be an integral design. The extension 11 is embedded within the encapsulation body 5. That is, after encapsulating the top of the ceramic substrate 1 with injection molding, the extension 11 is embedded within the encapsulation body 5, thereby preventing separation between the encapsulation body 5 and the ceramic substrate 1, further improving the connection stability between the encapsulation body 5 and the ceramic substrate 1, and ensuring electrical insulation between the power chip 3 and the copper frame 2.

[0075] A portion of the heat generated by the power chip 3 can also be dissipated outwards through the molding compound 5. In other words, the heat dissipation path of the power chip 3 can include a top heat dissipation path and a bottom heat dissipation path. The top heat dissipation path can be: the power chip 3 transfers heat to the molding compound 5, and then dissipates heat outwards through the molding compound 5. The bottom heat dissipation path can be: the power chip 3 transfers heat to the copper frame 2, and then the copper frame 2 transfers heat to the ceramic substrate 1, finally dissipating heat outwards through the ceramic substrate 1. This significantly improves the heat dissipation effect of the intelligent power module.

[0076] In summary, this invention discloses an intelligent power module, which may include a ceramic substrate 1, a copper frame 2, and a power chip 3. The ceramic substrate 1 has a mounting cavity 101, and the copper frame 2 is embedded within the mounting cavity 101. The power chip 3 is mounted on the copper frame 2. The heat generated by the power chip 3 is transferred to the ceramic substrate 1 through the copper frame 2, and then dissipated outwards through the ceramic substrate 1. Therefore, the addition of the ceramic substrate 1 allows the heat transferred to the copper frame 2 not only along the bottom of the copper frame 2, but also along all four sides of the copper frame 2, thereby improving the heat dissipation efficiency of the intelligent power module.

[0077] Reference Figure 7 This invention discloses a method for manufacturing a smart power module, the method comprising:

[0078] S701. A ceramic substrate 1 is provided, wherein a mounting cavity 101 is formed on the ceramic substrate 1, and a copper foil is placed in the mounting cavity 101 and heated so that the copper foil melts and fills the mounting cavity 101 to form a copper frame 2.

[0079] In this embodiment of the invention, a mounting cavity 101 is pre-formed on the ceramic substrate 1, and the mounting cavity 101 is used to accommodate the copper frame 2. The copper frame 2 can be formed by placing an appropriate amount of copper foil in the mounting cavity 101 and heating it. Those skilled in the art can determine the specific number of mounting cavities 101 based on the actual design shape of the copper frame 2, and no further limitations are imposed here.

[0080] During the heating process of the copper foil, the ceramic substrate 1 can be placed in a vacuum sintering furnace for heating. For example, the temperature can be raised to 1100°C at a heating rate of 10°C / min and then held for 0.5 hours to melt the copper foil and fill the mounting cavity 101 of the ceramic substrate 1.

[0081] S702. Provide at least one power chip 3, mount the power chip 3 on the copper frame 2, and wire bond the power chip 3 to obtain the module body, so that the heat generated by the power chip 3 is transferred to the ceramic substrate 1 through the copper frame 2 and then dissipated outward through the ceramic substrate 1.

[0082] In this embodiment of the invention, the power chip 3 refers to a type of integrated circuit chip capable of processing high-power signals. It is a key component in the intelligent power module and also the main component that generates a large amount of heat during the operation of the intelligent power module. The power chip 3 can be fixed to the copper frame 2 by means of welding or bonding.

[0083] The wire bonding of the power chips 3 can be understood as using connecting wires 6 to achieve an electrical connection between two power chips 3, or to achieve an electrical connection between the power chip 3 and the copper frame 2. The connecting wires 6 can include aluminum wires, copper wires, and gold wires, etc. The connecting wires 6 can be bonded. After wire bonding, the module body is obtained. The heat generated by the power chips 3 can be transferred to the copper frame 2, and the heat on the copper frame 2 can be transferred to the ceramic substrate 1 in both the vertical and horizontal directions, and then dissipated outwards through the ceramic substrate 1. This greatly improves the heat dissipation effect of the intelligent power module, which is beneficial for the miniaturization design of the intelligent power module and for product iteration.

[0084] S703. The module body is injection molded using molding compound to form a molding compound 5 covering the ceramic substrate 1, thereby obtaining a smart power module. The molding compound 5 encapsulates the copper frame 2 and the power chip 3, and the heat generated by the power chip 3 is dissipated to the outside through the molding compound 5.

[0085] In this embodiment of the invention, a molding compound can be used to injection mold the module body. The molding compound may include epoxy resin or similar materials. After the molding compound cures, a molding compound 5 is formed covering the top of the ceramic substrate 1. The molding compound 5 encapsulates the copper frame 2, the power chip 3, and the connecting wires 6, achieving electrical insulation of the module body, thereby obtaining the manufactured intelligent power module. Therefore, the heat dissipation path of the power chip 3 can include a top heat dissipation path and a bottom heat dissipation path. The top heat dissipation path can be: the power chip 3 transfers heat to the molding compound 5, and then dissipates heat outward through the molding compound 5. The bottom heat dissipation path can be: the power chip 3 transfers heat to the copper frame 2, and then the copper frame 2 transfers heat to the ceramic substrate 1, finally dissipating heat outward through the ceramic substrate 1. This significantly improves the heat dissipation effect of the intelligent power module.

[0086] In an optional embodiment of the invention, the manufacturing method further includes a substrate fabrication step for the ceramic substrate 1, the substrate fabrication step including:

[0087] A ceramic slurry is provided and coated onto a selectively transparent thin film platform 8. The sample stage 7 is then pressed down to expose the ceramic slurry, so that the cured ceramic slurry adheres to the sample stage 7, resulting in a substrate green body.

[0088] In this embodiment of the invention, the ceramic slurry refers to a mixed slurry comprising at least alumina ceramic powder, anhydrous ethanol, and photosensitive resin. Thus, the anhydrous ethanol, alumina ceramic powder, and photosensitive resin can be mixed in a certain proportion to obtain the ceramic slurry. The photosensitive resin is mainly used to cure the ceramic slurry in the subsequent photocuring process. The anhydrous ethanol serves as a dispersion medium, allowing for thorough mixing of the alumina ceramic powder and photosensitive resin during the mixing process, thereby obtaining the ceramic slurry. The alumina content in the alumina ceramic powder is 99.99% or higher.

[0089] In some alternative embodiments, to reduce the sintering problems of the subsequent multilayer substrate green body 9, the ceramic slurry may also include sintering aids, etc., thereby ensuring that the thermal conductivity of the final ceramic substrate 1 is not less than 25 W / (m·K).

[0090] Reference Figure 8 As shown, the photopolymerization molding machine may include a selectively transparent film platform 8, an ultraviolet lamp, a reflector 10, and a sample stage 7. The selectively transparent film platform 8 refers to a worktable equipped with a selectively transparent film, which can utilize selective area light transmission technology. The ultraviolet lamp emits a light source, which is reflected by the reflector 10 and projected vertically onto the selectively transparent film platform 8, causing the photosensitive resin to react with the ultraviolet light and curing the ceramic slurry on the selectively transparent film platform 8.

[0091] The sample stage 7 is pressed down to contact the ceramic slurry, thereby allowing the cured ceramic slurry to adhere to the sample stage 7 during exposure (light source irradiation), resulting in a substrate green body. This substrate green body can be raised along with the sample stage 7. During the manufacturing of the next substrate green body, the ceramic slurry is repeatedly coated onto the selectively transparent film platform 8. After each coating of ceramic slurry, the sample stage 7 is repeatedly pressed down to expose the ceramic slurry, allowing the cured ceramic slurry to adhere to the substrate green body on the sample stage 7, either on one, two, or multiple substrate green bodies 9. After curing, a multi-layer substrate green body 9 is obtained.

[0092] Before manufacturing the ceramic substrate 1, the three-dimensional model of the ceramic substrate 1 can be sliced, that is, divided into multiple layers in the thickness direction, to obtain a photocurable model. The photocurable model is then imported into a photocurable molding machine. The preset exposure intensity and preset exposure time of a single-layer substrate green body can be preset, and layer-by-layer curing is performed according to the preset exposure intensity and preset exposure time. The preset exposure intensity refers to the operating power of the ultraviolet lamp. The preset exposure time refers to the duration of light emission from the ultraviolet lamp. For example, the preset exposure intensity can be between 5 mW / cm³ and 6 mW / cm³, the preset exposure time can be between 1.5 microseconds and 3 microseconds, and the curing time after exposure stops can be between 2 microseconds and 3 microseconds. After obtaining the multi-layer substrate green body 9 corresponding to the complete ceramic substrate 1, the multi-layer substrate green body 9 is calcined, and the calcined multi-layer substrate green body 9 is sintered to obtain the ceramic substrate 1.

[0093] Therefore, by using the ceramic substrate 1 as a substrate, the copper frame 2 is embedded in the mounting groove on the ceramic substrate 1, and a portion of the copper frame 2 penetrates the ceramic substrate 1 through the connection hole 102 to form a connection port 4. This avoids the need for pin extension of the smart power module and ensures electrical insulation between the two connection ports 4 through the ceramic substrate 1, thereby reducing the electrical gap between the two connection ports 4. In other words, the pinless design meets the miniaturization requirements of the smart power module. Furthermore, the heat generated by the power chip 3 can be transferred to the copper frame 2, and the heat on the copper frame 2 is transferred to the ceramic substrate 1 through both the vertical and horizontal directions, and then dissipated outwards through the ceramic substrate 1. This greatly improves the heat dissipation effect of the smart power module, further facilitating its miniaturization design and product iteration.

[0094] In one optional embodiment of the invention, the step of calcining the multilayer substrate green blank 9 and sintering the calcined multilayer substrate green blank 9 to obtain the ceramic substrate 1 includes:

[0095] According to the first temperature control strategy, the multilayer substrate green blank 9 is subjected to low-temperature calcination to remove the photosensitive resin in the multilayer substrate green blank 9.

[0096] According to the second temperature control strategy, the multilayer substrate green blank 9 after calcination is subjected to high-temperature sintering to obtain the ceramic substrate 1, wherein the high-temperature sintering temperature is not lower than 800°C.

[0097] In this embodiment of the invention, the first temperature control strategy refers to a pre-set temperature control strategy for low-temperature calcination of the multilayer substrate green blank 9. The second temperature control strategy refers to a pre-set temperature control strategy for high-temperature sintering of the multilayer substrate green blank 9. The temperature control strategy may include strategies such as heating, cooling, and heat preservation. Thus, by ensuring the structural stability of the multilayer substrate green blank 9 through low-temperature calcination, the photosensitive resin in the multilayer substrate green blank 9 is melted and separated from the multilayer substrate green blank 9, thereby removing the photosensitive resin from the multilayer substrate green blank 9. The low-temperature calcination temperature does not exceed 650°C. That is, the upper limit temperature for heating the multilayer substrate green blank 9 during the low-temperature calcination process is 650°C. Then, according to the second temperature control strategy, the calcined multilayer substrate green blank 9 is subjected to high-temperature sintering. The main function of high-temperature sintering is to improve the structural density and strength of the multilayer substrate green blank 9. This results in a structurally robust ceramic substrate 1 and ensures the electrical insulation performance of the ceramic substrate 1 to the two connection ports 4. The high-temperature sintering temperature is not lower than 800°C. That is, during the high-temperature sintering process, the lower limit temperature for heating the multilayer substrate green blank 9 is 800°C.

[0098] In one optional embodiment of the invention, the low-temperature calcination of the multilayer substrate green blank 9 according to a first temperature control strategy includes:

[0099] First, the multilayer substrate green blank 9 is heated to a first temperature range at a first heating rate and held at that temperature for a first duration. Then, the multilayer substrate green blank 9, after being held at that temperature for the first duration, is heated to a second temperature range at the first heating rate and held at that temperature for the second duration. Next, the multilayer substrate green blank 9, after being held at that temperature for the second duration, is heated to a third temperature range at the first heating rate and held at that temperature for the third duration. Finally, the multilayer substrate green blank 9, after being held at that temperature for the third duration, is cooled back to the second temperature range at a first cooling rate.

[0100] In this embodiment of the invention, a multilayer substrate green blank 9 can be placed in a vacuum degreasing furnace for low-temperature calcination. The first heating rate refers to a preset heating rate for raising the temperature of the multilayer substrate green blank 9 during the low-temperature calcination process. For example, the first heating rate can be between 1-5°C / min, meaning the temperature of the multilayer substrate green blank 9 increases by 1-5°C per minute. The first cooling rate refers to a preset cooling rate for lowering the temperature of the multilayer substrate green blank 9 during the low-temperature calcination process. For example, the first cooling rate can be between 5-10°C / min, meaning the temperature of the multilayer substrate green blank 9 decreases by 5-10°C per minute. When a higher calcination temperature is desired, the heating stage can be divided into multiple stages, and a holding stage for the multilayer substrate green blank 9 can be added between adjacent heating stages.

[0101] In some embodiments, the first temperature range can be 120-150℃; the second temperature range can be 300-350℃; and the third temperature range can be 600-650℃. The first duration can be between 1-2 hours, the second duration can be between 1-2 hours, and the third duration can be between 10-15 hours. Those skilled in the art can select the above parameter values ​​based on actual test results, and no further limitations are made here. After cooling to the second temperature range, the substrate can be cooled to room temperature along with the furnace before high-temperature sintering of the multilayer substrate green blank 9 is performed.

[0102] In one optional embodiment of the invention, the high-temperature sintering of the calcined multilayer substrate green blank 9 according to the second temperature control strategy includes:

[0103] First, the calcined multilayer substrate green blank 9 is heated to the fourth temperature range at the second heating rate. Then, the multilayer substrate green blank 9, heated to the fourth temperature range, is further heated to the fifth temperature range at the third heating rate and held at that temperature for the fourth duration. Finally, the multilayer substrate green blank 9, after being held at that temperature for the fourth duration, is cooled back to the fourth temperature range at the second cooling rate.

[0104] In this embodiment of the invention, a multilayer substrate green blank 9 can be placed in a muffle furnace for high-temperature sintering. Both the second and third heating rates can be understood as preset heating rates for raising the temperature of the multilayer substrate green blank 9 during the high-temperature sintering process. For example, the second heating rate can be between 10-20°C / min, meaning the temperature of the multilayer substrate green blank 9 increases by 10°C-20°C per minute. As another example, the third heating rate can be between 5-10°C / min, meaning the temperature of the multilayer substrate green blank 9 increases by 5°C-10°C per minute.

[0105] The second cooling rate refers to the preset cooling rate for cooling the multilayer substrate green blank 9 during the high-temperature sintering process. For example, the second cooling rate can be between 5 and 10°C / min, that is, the temperature of the multilayer substrate green blank 9 decreases by 5°C-10°C per minute. When the desired sintering temperature is high, the heating stage can be divided into multiple stages, and a holding stage of the multilayer substrate green blank 9 can be added between two adjacent heating stages.

[0106] In some embodiments, the fourth temperature range can be 800-850°C; the fifth temperature range can be 1400-1550°C; and the fourth duration can be between 2 and 4 hours. Those skilled in the art can select the above parameter values ​​based on actual test results, and no further limitations are imposed here. After cooling to the fourth temperature range, the ceramic substrate 1 can be cooled to room temperature along with the furnace, thereby obtaining the manufactured ceramic substrate 1.

[0107] In one optional embodiment of the invention, after placing the copper foil in the mounting cavity 101 and heating it, the manufacturing method may further include cooling the heated copper foil and polishing the cooled copper foil to obtain a copper frame 2 that is flush with the ceramic substrate 1.

[0108] In this embodiment of the invention, the copper foil in the mounting groove is polished, thereby improving the surface flatness between the ceramic substrate 1 and the copper frame 2.

[0109] This invention also discloses a controller, which may include the intelligent power module as described in the above embodiments.

[0110] In this embodiment of the invention, the controller may include a circuit board and an intelligent power module as described in any of the above embodiments, wherein the intelligent power module is electrically connected to the circuit board.

[0111] This invention also discloses a household appliance, which may include the controller described in the above embodiments.

[0112] In this embodiment of the invention, the household appliances may include, but are not limited to, air conditioners, air purifiers, washing machines, refrigerators, fans, and vacuum cleaners.

[0113] In summary, this invention discloses an intelligent power module, its manufacturing method, controller, and a household appliance. The invention may include a ceramic substrate 1, a copper frame 2, and a power chip 3. The ceramic substrate 1 has a mounting cavity 101, and the copper frame 2 is embedded within the mounting cavity 101. The power chip 3 is mounted on the copper frame 2. The heat generated by the power chip 3 is transferred to the ceramic substrate 1 through the copper frame 2, and then dissipated outwards through the ceramic substrate 1. Therefore, the addition of the ceramic substrate 1 allows the heat transferred to the copper frame 2 not only along the bottom of the copper frame 2, but also along all four sides of the copper frame 2, thereby improving the heat dissipation efficiency of the intelligent power module.

[0114] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0115] It will be readily apparent to those skilled in the art that any combination of the above embodiments is feasible, and therefore any combination of the above embodiments is an implementation scheme of the present invention. However, due to space limitations, this specification will not describe them in detail here.

[0116] Numerous specific details are set forth in the specification provided herein. However, it will be understood that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures, and techniques have not been shown in detail so as not to obscure the understanding of this specification.

[0117] Similarly, it should be understood that, in order to simplify the invention and aid in understanding one or more of the various aspects of the invention, in the description of exemplary embodiments of the invention above, various features of the invention are sometimes grouped together in a single embodiment, figure, or description thereof.

[0118] Furthermore, those skilled in the art will understand that although some embodiments described herein include certain features included in other embodiments but not others, combinations of features from different embodiments are intended to be within the scope of the invention and form different embodiments. For example, in the claims, any of the claimed embodiments can be used in any combination.

Claims

1. A smart power module, characterized in that, The intelligent power module includes: A ceramic substrate (1) is provided with a mounting cavity (101); A copper frame (2) is embedded in the mounting cavity (101); The power chip (3) is mounted on the copper frame (2). The heat generated by the power chip (3) is transferred to the ceramic substrate (1) through the copper frame (2) and then dissipated outward through the ceramic substrate (1).

2. The intelligent power module according to claim 1, characterized in that, The ceramic substrate (1) is also provided with a plurality of connection holes (102), which are connected to the mounting cavity (101) and are disposed through the ceramic substrate (1) so that a portion of the copper frame (2) passes through the ceramic substrate (1) to form a plurality of connection ports (4).

3. The intelligent power module according to claim 1, characterized in that, The intelligent power module also includes a molding compound (5), which covers the ceramic substrate (1) and encapsulates the copper frame (2) and the power chip (3). The heat generated by the power chip (3) is dissipated outward through the molding compound (5).

4. The intelligent power module according to claim 3, characterized in that, An extension (11) is provided on the ceramic substrate (1), wherein the extension (11) is embedded in the encapsulation body (5).

5. A method for manufacturing an intelligent power module, characterized in that, The manufacturing method includes: A ceramic substrate (1) is provided, and an installation cavity (101) is formed on the ceramic substrate (1). A copper foil is placed in the installation cavity (101) and heated so that the copper foil melts and fills the installation cavity (101) to form a copper frame (2). At least one power chip (3) is provided, the power chip (3) is mounted on the copper frame (2), and the power chip (3) is wired to obtain the module body, so that the heat generated by the power chip (3) is transferred to the ceramic substrate (1) through the copper frame (2) and then dissipated outward through the ceramic substrate (1); The module body is injection molded with molding compound to form a molding compound (5) covering the ceramic substrate (1) and a smart power module is obtained. The molding compound (5) encapsulates the copper frame (2) and the power chip (3), and the heat generated by the power chip (3) is dissipated to the outside through the molding compound (5).

6. The method for manufacturing the intelligent power module according to claim 5, characterized in that, The manufacturing method further includes a substrate fabrication step for the ceramic substrate (1), the substrate fabrication step including: A ceramic slurry is provided and coated onto a selectively transparent film platform (8). The sample stage (7) is pressed down to expose the ceramic slurry so that the cured ceramic slurry adheres to the sample stage (7) to obtain a substrate green body. The ceramic slurry is repeatedly coated onto the selective light-transmitting film platform (8), and the sample stage (7) is pressed down to expose the ceramic slurry after each coating, so that the cured ceramic slurry adheres to the cured substrate green body on the sample stage (7) to obtain a multilayer substrate green body (9). The multilayer substrate green blank (9) is calcined and then sintered to obtain the ceramic substrate (1).

7. The method for manufacturing the intelligent power module according to claim 6, characterized in that, The substrate fabrication steps also include: Anhydrous ethanol, alumina ceramic powder, and photosensitive resin are mixed to obtain the ceramic slurry.

8. The method for manufacturing the intelligent power module according to claim 7, characterized in that, The process of calcining the multilayer substrate green blank (9) and sintering the calcined multilayer substrate green blank (9) to obtain the ceramic substrate (1) includes: According to the first temperature control strategy, the multilayer substrate green blank (9) is subjected to low-temperature calcination to remove the photosensitive resin in the multilayer substrate green blank (9), wherein the low-temperature calcination temperature does not exceed 650°C; According to the second temperature control strategy, the multilayer substrate green blank (9) after calcination is subjected to high-temperature sintering to obtain the ceramic substrate (1), wherein the high-temperature sintering temperature is not lower than 800°C.

9. The method for manufacturing the intelligent power module according to claim 8, characterized in that, The step of performing low-temperature calcination on the multilayer substrate green blank (9) according to the first temperature control strategy includes: The multilayer substrate green blank (9) is heated to a first temperature range at a first heating rate and held at that temperature for a first duration. The multilayer substrate green blank (9) with a holding time of the first duration is heated to the second temperature range according to the first heating rate and held for the second duration. The multilayer substrate green blank (9) with a holding time of the second duration is heated to the third temperature range according to the first heating rate and held for the third duration. The multilayer substrate green blank (9) with a holding time of three hours is cooled to the second temperature range according to the first cooling rate.

10. The method for manufacturing the intelligent power module according to claim 8, characterized in that, The high-temperature sintering of the calcined multilayer substrate green blank (9) according to the second temperature control strategy includes: The calcined multilayer substrate green blank (9) is heated to the fourth temperature range according to the second heating rate; The multilayer substrate green blank, heated to the fourth temperature range according to the third heating rate, is then heated to the fifth temperature range and held for the fourth duration. The multilayer substrate green blank (9) with a holding time of the fourth duration is cooled to the fourth temperature range according to the second cooling rate.

11. The method for manufacturing the intelligent power module according to claim 5, characterized in that, After placing the copper foil into the mounting cavity (101) and heating it, the manufacturing method further includes: The heated copper foil is cooled and polished to obtain a copper frame (2) that is flush with the ceramic substrate (1).

12. A controller, characterized in that, The controller includes the intelligent power module as described in any one of claims 1-4.

13. A household appliance, characterized in that, The household appliance includes the controller as described in claim 12.

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