A full-duplex satellite communication phased array antenna architecture
By integrating frequency selection surfaces and integrated RF carrier boards in satellite communication phased array antennas, combining metal patches and TR chips, the antenna interference problem in full duplex communication mode is solved, reducing costs and manufacturing difficulty, and improving The heat dissipation performance achieves efficient isolation and heat dissipation effects.
Patent Information
- Application Number
- CN202411305688.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-19
- Publication Date
- 2024-12-24
- Estimated Expiration
- 2044-09-19
AI Technical Summary
In the full duplex communication mode of existing microwave antennas, interference from transmitting antennas to receiving antennas leads to deterioration of signal-to-noise ratio, and the method of introducing filters to improve isolation increases cost and bulkiness, limiting the commercialization of antennas.
Design a full-duplex satellite communication phased array antenna architecture, using fiberglass fiber or PMI foam to integrate the high-pass frequency selection surface on the radome, combined with an integrated radio frequency carrier plate, metal patch and TR chip. The radome is manufactured and grooves are provided on the structural parts to enhance heat dissipation performance.
It effectively reduces interference from the transceiver antenna, reduces manufacturing difficulty and cost, improves the isolation and heat dissipation performance of the antenna, and promotes low-cost, miniaturized and lightweight antenna architecture design.
Smart Images
Figure CN118825618B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of microwave antennas, and in particular to a full-duplex satellite communication phased array antenna architecture. Background Art
[0002] With the rapid construction of high- and low-orbit high-throughput satellite network constellations at home and abroad, the demand for electronically scanned phased array antennas mounted on various platforms such as vehicles, aircraft, and ships is becoming increasingly strong. The current satellite communication system mostly adopts FDD, that is, the full-duplex communication mode, which means that the transmitting antenna and the receiving antenna need to work at the same time. This will lead to a prominent problem, that is, the interference of the transmitting antenna on the receiving antenna, resulting in the deterioration of the signal-to-noise ratio of the receiving antenna link, and even worse, causing the receiving antenna channel to be blocked and completely unable to work.
[0003] To solve this problem, the current engineering practice is to add filters of different frequency bands to each active channel of the receiving and transmitting phased array satellite communication antennas, so as to improve the isolation of the transmitting and receiving antennas.
[0004] However, since satellite communication phased array antennas often have many active channels, the introduction of filters not only leads to a sharp increase in the cost of the entire satellite communication phased array antenna. At the same time, since the size of the filter is often large, it is difficult to integrate it with the current mainstream low-cost, miniaturized, and lightweight satellite communication phased array antenna architecture - the flat-panel phased array antenna architecture, making the satellite communication phased array antenna with the filter become bulky and the cost further increased, which greatly limits the large-scale commercial promotion and application of satellite communication phased array antennas. Summary of the invention
[0005] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a full-duplex satellite communication phased array antenna architecture to solve the problem of isolating the satellite communication phased array transceiver antenna under a low-cost flat-panel architecture so that the receiving antenna is not interfered by the transmitting antenna.
[0006] The objective of the present invention is achieved through the following technical solutions:
[0007] A full-duplex satellite communication phased array antenna architecture includes a structural component and a transmitting phased array antenna module, a receiving phased array antenna module, a first antenna cover and a second antenna cover installed on the structural component, wherein the transmitting phased array antenna module is located in a cavity below the first antenna cover, and the receiving phased array antenna module is located in a cavity below the second antenna cover; a frequency selective surface with high-pass characteristics is integrated on an inner surface of a side of the first antenna cover close to the receiving phased array antenna module, and a frequency selective surface with low-pass characteristics is integrated on an inner surface of a side of the second antenna cover close to the transmitting phased array antenna module.
[0008] Furthermore, the radome is made of glass fiber reinforced plastic or PMI foaming technology.
[0009] Furthermore, the transmitting phased array antenna module and the receiving phased array antenna module have the same structure, both including an integrated RF carrier board, a metal patch and a TR chip;
[0010] The upper surface of the integrated RF carrier is the antenna radiation surface; the metal patch is attached to the antenna radiation surface of the integrated RF carrier by etching or metal sputtering process; the TR chip is located on the lower surface of the integrated RF carrier and is in contact with the structural part, and the TR chip is used to control the amplitude and phase of each RF signal of the phased array antenna.
[0011] Furthermore, the integrated radio frequency carrier board has radio frequency circuits, control circuits and power supply circuits integrated therein.
[0012] Furthermore, the number of the metal patches and TR chips is the same, and they are installed one by one in the same vertical projection area of the integrated RF carrier board.
[0013] Furthermore, the receiving phased array antenna module and the transmitting phased array antenna module also include a low-frequency device, and the low-frequency device is located on the lower surface of the integrated radio frequency carrier and is in contact with the structural component.
[0014] Furthermore, a groove for accommodating a low-frequency device is provided in the middle of the structural member, so that the integrated radio frequency carrier can be parallel to the structural member.
[0015] Furthermore, the low-frequency device includes a power conversion chip and an FPGA.
[0016] The beneficial effects of the present invention are:
[0017] 1) A novel full-duplex satellite phased array antenna phased array architecture provided in an embodiment of the present invention creatively solves the problem of isolating the transceiver antennas of the low-cost flat-panel architecture satellite phased array by installing corresponding radomes with integrated frequency selective surfaces on each of the transceiver antennas of the satellite phased array, while reducing the manufacturing difficulty and cost of the radome; the radome with FSS integrated on one side integrates the frequency selective surface only in the radome area adjacent to the transceiver antennas, thereby reducing the manufacturing difficulty and cost accordingly.
[0018] 2) The structural parts of the phased array antenna also act as a heat sink. The TR chips, low-frequency devices and other active devices in the transmitting phased array antenna module and the receiving phased array antenna module will generate heat during operation. By contacting the structural parts and providing corresponding grooves, the generated heat can be directed to the structural parts of the satellite communication phased array antenna, and then the heat is dissipated through some heat exchange methods, thereby increasing the heat dissipation performance of the antenna architecture of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 A side cross-sectional view of a full-duplex satellite communication phased array antenna architecture provided by an embodiment of the present invention;
[0020] In the figure, 1-first antenna cover, 2-metal patch, 3-integrated RF carrier board, 4-TR chip, 5-structural part, 6-low frequency device, 7-second antenna cover. DETAILED DESCRIPTION
[0021] The technical solution of the present invention will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.
[0022] See also Figure 1 , the present invention provides a technical solution:
[0023] A full-duplex satellite communication phased array antenna architecture, such as Figure 1 As shown, it includes a structural member and a transmitting phased array antenna module, a receiving phased array antenna module, a first antenna cover 1 and a second antenna cover 7 installed on the structural member, the transmitting phased array antenna module is located in the lower cavity of the first antenna cover 1, and the receiving phased array antenna module is located in the lower cavity of the second antenna cover 7; the inner surface of the first antenna cover 1 on one side close to the receiving phased array antenna module is integrated with a frequency selective surface with a high-pass characteristic, and the inner surface of the second antenna cover 7 on one side close to the transmitting phased array antenna module is integrated with a frequency selective surface with a low-pass characteristic.
[0024] In some specific embodiments, the radome is made of glass fiber reinforced plastic or PMI foaming process; Figure 1 The shape of the antenna cover is usually set to a rectangular parallelepiped, so the right side of the first antenna cover 1 is the side close to the receiving phased array antenna module, and its inner surface is the frequency selective surface. Correspondingly, the inner surface of the left side of the second antenna cover 7 is the frequency selective surface.
[0025] For the transmitting phased array antenna module, the frequency selective surface (FSS) integrated in the antenna cover is used to filter out the electromagnetic waves emitted from the transmitting antenna array from this airspace, which can greatly reduce the interference to the receiving antenna. In addition, in order to improve the out-of-band suppression of the FSS and reduce the difficulty of the processing technology, the FSS of this embodiment is designed to have high-pass properties, that is, electromagnetic waves in the high-frequency band can be smoothly transmitted, while electromagnetic waves in the low-frequency band are cut off. Similarly, for the receiving phased array antenna module, the frequency selective surface (FSS) is used to filter out the electromagnetic waves incident from this airspace by the transmitting antenna, greatly reducing the interference to the receiving antenna and reducing the risk of the receiving channel being blocked. Similarly, the FSS corresponding to the receiving array surface is a low-pass design, that is, electromagnetic waves in the low-frequency band can be smoothly transmitted, while electromagnetic waves in the high-frequency band are cut off.
[0026] In some specific embodiments, the transmitting phased array antenna module and the receiving phased array antenna module have the same structure, both including an integrated radio frequency carrier board 3, a metal patch 2 and a TR chip 4;
[0027] The upper surface of the integrated RF carrier 3 is the antenna radiation surface; the metal patch 2 is attached to the antenna radiation surface of the integrated RF carrier 3 by etching or metal sputtering process; the TR chip 4 is located on the lower surface of the integrated RF carrier 3 and is in contact with the structural component 5, and the TR chip 4 is used to control the amplitude and phase of each RF signal of the phased array antenna.
[0028] Furthermore, the integrated radio frequency carrier board 3 has radio frequency circuits, control circuits and power supply circuits integrated therein. The integrated radio frequency carrier board 3 is usually manufactured by high-density PCB technology, LTCC, HTCC and other processes.
[0029] The difference between the receiving phased array antenna module and the transmitting phased array antenna module is that the relevant parameters of the antenna radiation surface and the RF circuit integrated in the integrated RF carrier board of the receiving phased array antenna module are set within the receiving frequency band of the receiving phased array antenna module.
[0030] The number of metal patches 2 and TR chips 4 in the receiving phased array antenna module and the transmitting phased array antenna module is the same, and they are installed one by one in the same vertical projection area of the integrated RF carrier board 3.
[0031] In some specific embodiments, the receiving phased array antenna module and the transmitting phased array antenna module further include a low-frequency device 6, which is located on the lower surface of the integrated RF carrier 3 and contacts the structural member 5. Specifically, the low-frequency device includes a power conversion chip and an FPGA.
[0032] Furthermore, a groove for accommodating the low-frequency device 6 is provided in the middle of the structural member 5 , so that the integrated RF carrier 3 can be parallel to the structural member 5 .
[0033] Active devices such as TR chips and low-frequency devices in the transmitting phased array antenna module and the receiving phased array antenna module will generate heat during operation. By contacting the structural parts and setting grooves, the generated heat can be directed to the structural part 5 of the satellite communication phased array antenna, and then the heat can be dissipated through some heat exchange methods. Therefore, the structural part 5 of the full-duplex satellite communication phased array antenna also acts as a heat sink.
[0034] A novel full-duplex satellite phased array antenna phased array architecture provided by an embodiment of the present invention creatively solves the problem of isolating the transceiver antennas of a low-cost flat-panel architecture satellite phased array by installing corresponding antenna covers with integrated frequency selective surfaces on each of the satellite phased array transceiver antennas, while reducing the difficulty and cost of manufacturing the antenna covers. The antenna cover with FSS integrated on one side integrates the frequency selective surface only in the antenna cover area adjacent to the transceiver antennas, and the manufacturing difficulty and cost are reduced accordingly.
[0035] The above is only a preferred embodiment of the present invention. It should be understood that the present invention is not limited to the form disclosed herein, and should not be regarded as excluding other embodiments, but can be used in various other combinations, modifications and environments, and can be modified within the scope of the concept described herein through the above teachings or the technology or knowledge of the relevant field. The changes and modifications made by those skilled in the art shall not deviate from the spirit and scope of the present invention, and shall be within the scope of protection of the claims attached to the present invention.
Claims
1. A full-duplex satellite communication phased array antenna architecture, characterized by: The invention comprises a structural member and a transmitting phased array antenna module, a receiving phased array antenna module, a first radome and a second radome installed on the structural member, wherein the transmitting phased array antenna module is located in a cavity below the first radome, and the receiving phased array antenna module is located in a cavity below the second radome; a frequency selective surface with high-pass characteristics is integrated on an inner surface of one side of the first radome close to the receiving phased array antenna module, and a frequency selective surface with low-pass characteristics is integrated on an inner surface of one side of the second radome close to the transmitting phased array antenna module; The transmitting phased array antenna module and the receiving phased array antenna module have the same structure, both including an integrated RF carrier board, a metal patch and a TR chip; The upper surface of the integrated radio frequency carrier is the antenna radiation surface; The metal patch is attached to the antenna radiation surface of the integrated RF carrier through etching or metal sputtering process; The TR chip is located on the lower surface of the integrated RF carrier board and is in contact with the structural component. The TR chip is used to control the amplitude and phase of each RF signal of the phased array antenna.
2. The full-duplex satellite communication phased array antenna architecture according to claim 1, characterized in that: The radome is made of glass fiber reinforced plastics or PMI foaming technology.
3. The full-duplex satellite communication phased array antenna architecture according to claim 1, characterized in that: The integrated radio frequency carrier board has radio frequency circuits, control circuits and power supply circuits integrated therein.
4. The full-duplex satellite communication phased array antenna architecture according to claim 1, characterized in that: The number of the metal patches and TR chips is the same, and they are installed one by one in the same vertical projection area of the integrated RF carrier board.
5. The full-duplex satellite communication phased array antenna architecture according to claim 1, characterized in that: The receiving phased array antenna module and the transmitting phased array antenna module further include a low-frequency device, and the low-frequency device is located on the lower surface of the integrated radio frequency carrier and is in contact with the structural component.
6. The full-duplex satellite communication phased array antenna architecture according to claim 5, characterized in that: A groove for accommodating a low-frequency device is arranged in the middle of the structural member, so that the integrated radio frequency carrier can be parallel to the structural member.
7. The full-duplex satellite communication phased array antenna architecture according to claim 5, characterized in that: The low-frequency devices include a power conversion chip and an FPGA.