Jig system for semiconductor device testing

Abstract

The application discloses a kind of semiconductor device test tool system, including tool seat (1), tool (2), driving device (3), electrical interface (4) and tool seat probe (5), the side top end of tool seat (1) is equipped with tool seat electrical interface (4), driving device (3) is respectively arranged on the upper panel of tool seat (1), and the driving head of driving device (3) is fixedly connected with the lower panel of tool seat (1), tool seat probe (5) is fixedly arranged below the upper panel of tool seat (1), tool seat probe (5) is electrically connected tool seat electrical interface (4), the lower panel of tool seat (1) is above two sides respectively fixedly set up one sliding groove (12), sliding groove (12) is matched with the two sides of tool (2), the lower panel of tool seat (1) middle part is equipped with hole, jacking tool (2) makes tool seat probe (5) be compressed to the upper surface of the PCB (21) of tool (2).The application provides a kind of fast tool and the mode of being measured (3) of replacement, can avoid in measured piece or tool in the repeated installation, disassembly process leading to cable fatigue.

Description

TECHNICAL FIELD

[0001] The present application relates to a semiconductor test system, in particular to a test fixture of a power module. BACKGROUND

[0002] With the development of technology, the application of power semiconductor IGBT, MOSFET module is gradually popularized. In the process of device research and development, manufacturing and application, its reliability needs to be evaluated. Before electrical evaluation, the measured piece needs to be electrically connected with the test equipment through a fast and non-permanent connection mode.

[0003] At present, for the test equipment of a module with multiple independent and semi-independent functional units, a special fixture system is generally designed. The fixture system is an electrical connection that connects specific signals on the module with related interfaces of the test machine. In this way, different test fixtures can be used to cope with power modules of different shapes and specifications while ensuring that the test machine interface remains unchanged.

[0004] In the current fixture system, cable connection is widely used in the connection between the fixture and the test machine, and the installation method is relatively complex. In a moving environment, the service life of the cable will also decrease rapidly.

[0005] Chinese patent CN216209637U discloses an IGBT module test device, which is provided with a probe mounting plate capable of moving in the vertical direction on the mounting platform, and the lower surface of the probe mounting plate is provided with multiple probes; the mounting platform is also provided with multiple movable blocks above the PCB circuit board and capable of adjusting the position in the vertical direction, and the lower side of the movable block is provided with a reed. When the probe and the reed are in contact with the PCB circuit board, the PCB circuit board is powered on. This scheme controls the contact between the probe and the reed and the PCB circuit board through the probe mounting plate and the movable block moving in the vertical direction, thereby realizing the conduction of the PCB circuit board, and no complex power lines are needed. However, the IGBT under test and the PCB circuit board still need to be electrically connected through wires, and there is still the problem of complex connection and low reliability due to the decline in the service life of the cable. Moreover, in this technical solution, the probe above the fixture moves downward and contacts the fixture, and the PCB is a force receiving component, which needs to be stacked with multiple PCBs to meet the force requirement when the probe pressure is large. The design requirement for the PCB is high, the design is complex and the cost is high, and the design efficiency and success rate are low. SUMMARY

[0006] The technical problem to be solved by the present application is how to improve the ease of use and reliability of the fixture.

[0007] The application solves the above technical problems by the following technical means: a kind of semiconductor device test fixture system, including fixture seat (1), fixture (2), driving device (3), electrical interface (4) and fixture seat probe (5), fixture seat (1) is equipped with the fixture bin of being able to put into fixture (2), the side top of fixture seat (1) is equipped with fixture seat electrical interface (4), the upper portion of fixture seat (1) is provided with upper panel, lower panel, driving device (3) is respectively arranged on the upper panel of fixture seat (1), and the driving head of driving device (3) is fixedly connected to the lower panel of fixture seat (1), fixture seat probe (5) is fixedly arranged below the upper panel of fixture seat (1), fixture seat probe (5) is electrically connected to fixture seat electrical interface (4), one sliding groove (12) is respectively fixedly arranged on the upper panel of fixture seat (1) two sides, the two sides of fixture (2) are matched with sliding groove (12), the middle part of the lower panel of fixture seat (1) is provided with hole, and the fixture (2) is lifted to make fixture seat probe (5) be compressed to the upper surface of the PCB (21) of fixture (2).

[0008] Further, the fixture seat probe (5) is distributed in U shape, and the opening faces outward.

[0009] Further, at least one side of the sliding groove (12) is provided with a top bead (14) capable of elastic expansion for rough positioning, and the side edge of the fixture (2) is provided with a positioning groove (28) matched with the top bead (14).

[0010] Further, the fixture (2) comprises a PCB (21), a fixture frame (22) and a probe (25), the PCB (21) is fixed on the fixture frame (22), and the PCB (21) is provided with at least one set of probes (25) penetrating through the PCB.

[0011] Further, the fixture (2) further comprises a support column (23), and the two sides below the fixture frame (22) are provided with the support column (23), so that a space is formed between the fixture frame (22) and the table surface on which the fixture (2) is placed.

[0012] Further, the fixture (2) further comprises a top column (24), and one top column (24) is arranged on each side of each set of probes (25), and the top end of the top column (24) is higher than the top end of the probe (25).

[0013] Further, the fixture (2) further comprises a probe cushion block (26), and the probe cushion block (26) is fixed below the PCB (21), the probe (25) below the PCB (21) penetrates through the probe cushion block (26), and the probe (25) and the probe cushion block (26) are connected in structure by tight fit.

[0014] Further, the probe cushion block (26) is made of non-metal insulating material.

[0015] Further, the jig (2) further comprises a positioning hole (27), at least one positioning hole (27) is arranged on the jig frame (22), and a positioning column (16) in a guiding role is arranged below the upper panel of the jig seat (1) at a position corresponding to the positioning hole (27), and the positioning column (16) can enter the positioning hole (27).

[0016] Further, the operation process of the semiconductor device test jig system is as follows:

[0017] The jig (2) is pushed into the jig seat (1) along the sliding groove (12) to perform coarse positioning;

[0018] The jig (2) is lifted upward by using the driving device (3) to perform fine positioning on the jig (2);

[0019] The jig (2) is continuously lifted upward until the jig seat probe (5) is correctly compressed to the upper surface of the PCB (21) to form a reliable electrical connection;

[0020] The measured piece (6) is lifted upward by using the measured piece lifting device, so that the probe (25) of the jig (2) is in contact with the measured piece (6) and is compressed to form a reliable electrical connection.

[0021] The advantages of the present application are:

[0022] 1. The structure of the present application provides a quick dismounting and replacing mode of the jig and the measured piece (3);

[0023] 2. The structure of the present application can avoid the fatigue of the cable caused by repeated installation and dismounting of the measured piece or the jig;

[0024] 3. The structure of the present application can effectively reduce the number of cable connections during jig installation, reduce the working hours, and reduce the risk of potential electrical signal connection errors;

[0025] 4. The structure of the present application can complete the design of the product under the condition of only one PCB, the number of PCBs is reduced from the original 3-4 to 1, the work of new jig development is reduced, and the cost and manufacturing complexity of the product are effectively reduced;

[0026] 5. The structure of the present application can ensure that the jig and the jig seat have relatively accurate positioning, and avoid problems such as that the probe fails to form a reliable connection or the relative position of the measured piece and the jig is skewed due to positioning errors

[0027] 6. The jig frame uses a standardized design, and no longer needs to be revised according to the measured piece, thereby reducing the workload of jig development;

[0028] 7. The support point of the probe under test has been changed from the PCB to the top post, which reduces the stress on the PCB, reduces the requirements on the PCB, reduces the design complexity and cost, improves design efficiency and success rate, and also improves the fatigue life of the PCB.

[0029] 8. All assemblies are equipped with pins for positioning, which improves the overall assembly accuracy. Attached Figure Description

[0030] Figure 1 This is a front view of a semiconductor device testing fixture system (without fixture) according to an embodiment of the present invention;

[0031] Figure 2 This is a perspective view of a semiconductor device testing fixture system (without fixture) according to an embodiment of the present invention;

[0032] Figure 3 This is a perspective view of a semiconductor device testing fixture system (with fixture) according to an embodiment of the present invention;

[0033] Figure 4 This is a side view of a semiconductor device testing fixture system (with fixture) according to an embodiment of the present invention;

[0034] Figure 5 This is a front view of the static fixture for the semiconductor power module according to an embodiment of the present invention;

[0035] Figure 6 This is a perspective view of the static fixture for the semiconductor power module in an embodiment of the present invention;

[0036] Figure 7 This is a perspective view of the static fixture and the device under test of the semiconductor power module in an embodiment of the present invention.

[0037] Figure 8 This is a top perspective view of the static fixture of the semiconductor power module in an embodiment of the present invention. Detailed Implementation

[0038] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0039] It should be noted that the following embodiments and features in the embodiments can be combined with each other in the case of no conflict. The drawings provided in the following embodiments only schematically illustrate the basic concepts of the present application, and only show the components related to the present application in the drawings, not drawn according to the number, shape and size of the components in actual implementation. The actual implementation of each component type, number and proportion can be a random change, and the component layout type can be more complex.

[0040] Meanwhile referring to Figures 1 to 4 The semiconductor device test fixture system of the embodiment of the present application comprises a fixture base 1, a fixture 2, a driving device 3, an electrical interface 4 and a fixture base probe 5. The fixture base 1 is provided with a fixture bin capable of accommodating the fixture 2.

[0041] The upper part of the fixture base 1 is provided with an upper panel and a lower panel. The driving device 3 is arranged on the upper panel of the fixture base 1, and the driving head of the driving device 3 is fixedly connected to the lower panel of the fixture base 1.

[0042] The side top end of the fixture base 1 is provided with a fixture base electrical interface 4. The electrical signal of the test machine is connected to the fixture base electrical interface 4 through a cable.

[0043] The fixture base probe 5 is fixedly arranged below the upper panel of the fixture base 1. The fixture base probe 5 is distributed in a U shape with the opening facing outward. The probe on the side of the fixture base probe 5 is electrically connected to the fixture base electrical interface 4.

[0044] Two slide grooves 12 are fixedly arranged on the upper panel of the fixture base 1. The slide grooves 12 are matched with the two side edges of the fixture 2, so that the two side edges of the fixture 2 can be pushed into the fixture bin after being accommodated in the slide grooves 12. At least one inner side of the slide groove 12 is provided with a top bead 14 capable of elastic expansion and contraction for rough positioning. The side edge of the fixture 2 is provided with a positioning groove 28 matched with the top bead 14.

[0045] A hole is formed in the middle of the lower panel of the fixture base 1 for the measured piece 6 to pass through.

[0046] Continuing to refer to Figures 5 to 8 The fixture 2 of the embodiment of the present application comprises a PCB 21, a fixture frame 22, a support column 23, a top column 24, a probe 25, a probe pad 26, a positioning hole 27 and a positioning groove 28.

[0047] The PCB 21 is fixed on the fixture frame 22. In the present embodiment, the fixture frame 22 and the PCB 21 are positioned by using a pin through the mounting holes on both sides, so as to ensure the relative position degree.

[0048] PCB 21 is provided with at least one set of probes 25 penetrating through the PCB, and the PCB 21 is welded with the probes 25. At least one top post 24 is provided on the periphery of the probes 25 on the upper part of the PCB 21, and the top end of the top post 24 is higher than the top end of the probes 25. In the embodiment, two sets of probes 25 are oppositely arranged on the PCB 21, and one top post 24 is arranged on each side of each set of probes 25. A probe pad 26 is fixed below the PCB 21, and the probes 25 below the PCB 21 penetrate through the probe pad 26. The probes 25 and the probe pad 26 are structurally connected through tight fitting, and the PCB 21 will bear the torsional force generated by the gravity of the probes 25 and the probe pad 26. In the embodiment, the relative position degree is ensured through the positioning between the PCB 21 and the probe pad 26 by means of a pin. The probe pad 26 is made of non-metal insulating material, including but not limited to epoxy resin plate, polyformaldehyde resin, PEEK, etc.

[0049] As a further optimized technical solution, support posts 23 are arranged on the lower sides of the jig frame 22, so that a space is formed between the lower side of the jig frame 22 and the table surface on which the jig 2 is placed, avoiding the contact between the probes 25 and the table surface on which the jig 2 is placed when the jig 2 is stored, and reducing the risk of damage to the probes 25.

[0050] At least one positioning hole 27 is arranged on the jig frame 22. In the embodiment, one positioning hole 27 is arranged on each side of the jig frame 22. The positioning hole 27 provides a high-precision positioning interface on the jig 2, which can avoid problems such as jig skewing during the installation of the jig 2. Positioning posts 16 are arranged below the upper panel of the jig seat 1 and correspond to the positions of the positioning holes 27. The positioning posts 16 can enter the positioning holes 27.

[0051] Positioning grooves 28 are arranged on the two side edges of the jig frame 22 and correspond to the positions of the top beads 14 on the side edges of the jig 2. In the embodiment, two top beads are arranged on one side of the sliding groove 12, and four positioning grooves 28 are arranged.

[0052] The operation process of the semiconductor device testing jig system is as follows:

[0053] 1. Push the jig 2 into the jig seat 1 along the sliding groove 12, and when the coarse positioning top bead 14 falls into the coarse positioning groove 28, a clear step feeling can be felt, indicating that the coarse positioning is completed;

[0054] 2. Use the driving device 3 to lift the jig 2 upward, so that the positioning post 16 enters the positioning hole 27, and the jig 2 is further precisely positioned through the cooperation of the shaft and the hole;

[0055] 3. After the positioning pin 16 is fully inserted into the positioning hole 27, the fixture 2 is continuously lifted upwards. The lower panel of the fixture seat 1 contacts the bottom of the fixture frame 22 until the fixture seat probe 5 is correctly compressed onto the upper surface of the PCB 21, forming a reliable electrical connection. The spring pressure of the fixture seat probe 5 is transmitted downwards through the PCB 21 to the fixture frame 22, and then to the lower panel of the fixture seat 1, forming a nearly vertical force direction. This avoids the PCB 21 or the fixture frame 22 from bearing torsional force, thereby reducing the strength requirements of these two parts.

[0056] 4. Use the test piece lifting device (not shown) to lift the test piece 6 upwards, so that the probe 25 contacts and compresses the test piece 6 to form a reliable electrical connection. When the test piece 6 is lifted onto the probe 25, the top of the top post 24 contacts the upper panel of the fixture seat 1. The lifting force is transmitted to the upper panel of the fixture seat 1 through the probe 25, the probe pad 26, and the top post 24. The pressure generated when the bottom of the probe 25 is compressed is transmitted to the fixture seat 1 outside the fixture through the probe pad 26 and the top post 24, thus avoiding the force generated when the test piece 6 is lifted on the PCB 21.

[0057] The electrical connection relationships during measurement are as follows:

[0058] A. The electrical signal of the tester is connected to the electrical interface 4 of the fixture seat through a cable, thereby connecting the fixture seat probe 5. The fixture seat probe 5 of the fixture seat 1 contacts the upper surface of the PCB 21 to form an electrical connection.

[0059] B. The electrical signal of the fixture seat 1 is connected to the probe 25 through the fixture seat probe 5, the copper wire on the PCB 21, or the flying wire;

[0060] C. The electrical signal on probe 25 is connected to the device under test 6 to form a complete electrical connection.

[0061] The electrical signals of the testing machine are connected to the electrical interface 4 of the fixture seat via a cable, and then to the fixture seat probe 5. The electrical signals are then connected to the probe 25 via the fixture seat probe 5, and finally to the workpiece 6 under test. The fixture 2 is pushed into the fixture chamber through the slide groove 12, and coarse positioning is formed by the top ball 14 and the positioning groove 28. The user is given feedback on the completion of coarse positioning through the tactile feedback when sliding in. The positioning pin 16 and the positioning hole 27 form a more precise positioning relationship between the fixture 2 and the fixture seat 1, thereby ensuring the reliability of the electrical connection.

[0062] In this embodiment, the drive device 3 uses a motion cylinder, but other methods can also be used to drive the movement of the fixture seat 5, such as a linear motor, worm gear, etc.

[0063] The above examples are only used to illustrate the technical solutions of the present application, and are not intended to limit the present application; although the present application has been described in detail with reference to the foregoing examples, those skilled in the art should understand that the technical solutions recorded in the foregoing examples can be modified, or some technical features can be replaced by equivalent features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A kind of semiconductor device test with fixture system, including fixture seat (1), fixture (2), driving device (3), electrical interface (4) and fixture seat probe (5), fixture seat (1) is set up with the fixture bin that can be put into fixture (2), the side top of fixture seat (1) is set up with fixture seat electrical interface (4), it is characterized by: The upper part of the jig seat (1) is provided with an upper panel and a lower panel, the driving device (3) is arranged on the upper panel of the jig seat (1) respectively, and the driving head of the driving device (3) is fixedly connected to the lower panel of the jig seat (1), the jig seat probe (5) is fixedly arranged below the upper panel of the jig seat (1), the jig seat probe (5) is electrically connected to the jig seat electrical interface (4), one sliding groove (12) is fixedly arranged on the upper panel of the jig seat (1) on each side, the sliding groove (12) is matched with the two side edges of the jig (2), a hole is formed in the middle of the lower panel of the jig seat (1), and the jig (2) is jacked up so that the jig seat probe (5) is compressed to the upper surface of the PCB (21) of the jig (2); The jig (2) comprises a PCB (21), a jig frame (22), a support column (23), a jacking column (24) and a probe (25), the PCB (21) is fixed on the jig frame (22), at least one set of probes (25) penetrating through the PCB are arranged on the PCB (21), support columns (23) are arranged on the two sides below the jig frame (22), the support columns (23) form a space between the lower side of the jig frame (22) and a table surface on which the jig (2) is placed, and a jacking column (24) is arranged on each side of each set of probes (25).

2. The handler system for testing semiconductor devices as recited in claim 1, wherein: The jig seat probe (5) is in U-shaped distribution, and the opening faces outward.

3. The handler system for testing semiconductor devices as recited in claim 1, wherein: At least one side of the sliding groove (12) is provided with a top bead (14) capable of being elastically stretched and retracted and used for rough positioning, and a positioning groove (28) matched with the top bead (14) is formed in the side edge of the jig (2).

4. The handler system for testing semiconductor devices as recited in claim 1, wherein: The jig (2) further comprises a probe cushion block (26), the probe cushion block (26) is fixed below the PCB (21), the probe (25) below the PCB (21) penetrates through the probe cushion block (26), and the probe (25) and the probe cushion block (26) are connected in structure through tight fit.

5. The handler system for testing semiconductor devices as recited in claim 4, wherein: The probe cushion block (26) is made of non-metal insulating material.

6. The handler system for testing semiconductor devices as recited in claim 1, wherein: The jig (2) further comprises a positioning hole (27), at least one positioning hole (27) is arranged on the jig frame (22), positioning columns (16) capable of guiding are arranged below the upper panel of the jig seat (1) at positions corresponding to the positioning holes (27), and the positioning columns (16) can enter the positioning holes (27).

7. The handler system for testing semiconductor devices as recited in claim 1, wherein: The operation process of the jig system for testing the semiconductor device is as follows: The jig (2) is pushed into the jig seat (1) along the sliding groove (12) to perform rough positioning; The jig (2) is jacked up by using the driving device (3) to perform fine positioning; The jig (2) is continuously jacked up until the jig seat probe (5) is correctly compressed to the upper surface of the PCB (21) to form reliable electrical connection; The measured piece (6) is jacked up by using the measured piece jacking device, so that the probe (25) of the jig (2) is in contact with the measured piece (6) and is compressed to form reliable electrical connection.

Images