Light emitting element transfer plate, repair method and display panel

Abstract

The application provides a light emitting element transfer plate, a repairing method and a display panel, and is characterized in that the light emitting element transfer plate comprises a light emitting element area and a non-light emitting element area, and the light emitting element transfer plate comprises a carrier plate, a packaging layer arranged on one side of the carrier plate, a light emitting element arranged on a side of the packaging layer away from the carrier plate, the light emitting element being located in the light emitting element area, a light waveguide medium, a projection of the light waveguide medium in a vertical direction at least partially overlapping a projection of the light emitting element in the vertical direction, a laser addressing structure arranged in the non-light emitting element area, and a light waveguide extension structure for connecting the laser addressing structure and the light waveguide medium to form a light waveguide channel. The light emitting element transfer plate provided by the application helps to solve the process time loss problem caused by long-distance laser movement and reduces the risk of camera misrecognition.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a light emitting element transfer plate, a repairing method and a display panel. BACKGROUND

[0002] In recent years, in addition to high color saturation, fast response speed and high contrast, micro light emitting diode display also has lower energy consumption, longer material service life and other advantages compared with organic light emitting diode display, so it attracts many market investments.

[0003] However, when the micro light emitting diode is subjected to front laser action in the chip on carrier (COC) structure, the defective chip cannot be normally removed, and splashing pollution will affect the bonding of other chips, and through the film layer, the camera is more difficult to identify the blurred chip edge. SUMMARY

[0004] Therefore, the present application provides a light emitting element transfer plate, a repairing method and a display panel, which can help to solve the process time loss problem caused by long-distance laser movement and reduce the risk of camera misidentification.

[0005] In a first aspect, the present application provides a light emitting element transfer plate, the light emitting element transfer plate comprising a light emitting element region and a non-light emitting element region, and the light emitting element transfer plate comprising:

[0006] a carrier plate; a packaging layer arranged on one side of the carrier plate, the packaging layer being provided with a light emitting element away from one side of the carrier plate, the light emitting element being located in the light emitting element region; an optical waveguide medium, a projection of the optical waveguide medium in a vertical direction at least partially overlapping a projection of the light emitting element in the vertical direction; a laser addressing structure arranged in the non-light emitting element region; and an optical waveguide extension structure for connecting the laser addressing structure and the optical waveguide medium to form an optical waveguide channel.

[0007] In one possible implementation, the projection range of the light emitting element in the vertical direction is within the projection range of the optical waveguide medium in the vertical direction.

[0008] In one possible implementation, the projection range of the optical waveguide medium in the vertical direction is within the projection range of the light emitting element in the vertical direction.

[0009] In one possible implementation, the light emitting element and the optical waveguide medium are arranged one-to-one, the optical waveguide medium and the optical waveguide extension structure are arranged one-to-one, and the optical waveguide extension structure and the laser addressing structure are arranged one-to-one.

[0010] In one possible implementation, the optical waveguide medium is arranged in the same layer.

[0011] In one possible implementation, the optical waveguide medium comprises at least a first optical waveguide medium, a second optical waveguide medium and a third optical waveguide medium; the first optical waveguide medium, the second optical waveguide medium and the third optical waveguide medium are arranged in different layers.

[0012] In one possible implementation, the light emitting element comprises a first red light emitting element, a second green light emitting element and a third blue light emitting element, wherein the first optical waveguide medium is arranged in correspondence with the first red light emitting element, the second optical waveguide medium is arranged in correspondence with the second green light emitting element and the third optical waveguide medium is arranged in correspondence with the third blue light emitting element.

[0013] In one possible implementation, the light emitting element further comprises a metal layer, which is arranged on the side of the light emitting element away from the carrier plate.

[0014] In one possible implementation, the encapsulation layer is provided with a bonding layer on the side away from the carrier plate, and the bonding layer is used to bond the light emitting element.

[0015] In one possible implementation, the bonding layer is a bonding glue.

[0016] In a second aspect, the present application provides a repairing method of the light emitting element transfer plate according to any one of the first aspect, comprising:

[0017] acquiring a target laser addressing structure corresponding to a target light emitting element, emitting laser based on the laser addressing structure, and removing the target light emitting element using the laser.

[0018] In a third aspect, the present application provides a display panel comprising the light emitting element according to the first aspect.

[0019] As described above, the light emitting element transfer plate, the repairing method and the display panel provided by the present application have at least the following beneficial technical effects:

[0020] The application provides a light emitting element transfer plate, a repairing method and a display panel. The light emitting element transfer plate comprises a light emitting element area and a non-light emitting element area. The light emitting element transfer plate comprises a carrier plate, a packaging layer arranged on one side of the carrier plate, a light emitting element arranged on a side of the packaging layer away from the carrier plate, the light emitting element being located in the light emitting element area, a light waveguide medium, a projection of the light waveguide medium in a vertical direction at least partially overlapping a projection of the light emitting element in the vertical direction, a laser addressing structure arranged in the non-light emitting element area, and a light waveguide extension structure for connecting the laser addressing structure and the light waveguide medium to form a light waveguide channel. The light emitting element transfer plate provided by the application can help solve the problem of process time loss caused by long-distance laser movement and reduce the risk of camera misrecognition. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 A structural schematic diagram of a light emitting element transfer plate provided by an embodiment of the application is provided.

[0022] Figure 2 A structural schematic diagram of another light emitting element transfer plate provided by an embodiment of the application is provided.

[0023] Figure 3 A sectional structural schematic diagram of a light emitting element transfer plate provided by an embodiment of the application is provided.

[0024] Figure 4 A flowchart of a repairing method of a light emitting element transfer plate provided by an embodiment of the application is provided.

[0025] Figure 5 A structural schematic diagram of a display panel provided by an embodiment of the application is provided.

[0026] ILLUSTRATIONS:

[0027] 101, light emitting element area; 102, non-light emitting element area; 110, carrier plate; 120, packaging layer; 130, light emitting element; 210, light waveguide medium; 220, light waveguide extension structure; and 230, laser addressing structure. DETAILED DESCRIPTION

[0028] In the embodiments of the application, unless otherwise specified, the character " / " represents a relationship of one or the other between the associated objects. For example, A / B can represent A or B. The "and / or" describes the relationship between the associated objects, which means that there can be three relationships. For example, A and / or B can represent three cases of A existing alone, A and B existing together, and B existing alone.

[0029] It should be noted that the terms "first", "second", etc. involved in the embodiments of the present application are only used for distinguishing purposes of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features, nor can be understood as indicating or implying the order.

[0030] In the embodiments of the present application, "at least one" means one or more, and "multiple" means two or more. In addition, "at least one of the following" or the like means any combination of the items, which can include any combination of single item or multiple items. For example, at least one of A, B or C can mean A, B, C, A and B, A and C, B and C, or A, B and C. Each of A, B and C can be an element or a set containing one or more elements.

[0031] In the embodiments of the present application, "example", "in some embodiments", "in another embodiment" and the like are used to represent as an example, illustration or description. Any embodiment or design scheme described as "example" in the present application should not be interpreted as more preferred or more advantageous than other embodiments or design schemes. Rather, the word "example" is intended to present the concept in a specific manner.

[0032] In the embodiments of the present application, "of", "corresponding" and "corresponding" can be used interchangeably at times. It should be noted that when the distinction is not emphasized, the meanings expressed are consistent. In the embodiments of the present application, communication and transmission can be used interchangeably at times. It should be noted that when the distinction is not emphasized, the meanings expressed are consistent. For example, transmission can include sending and / or receiving, and can be a noun or a verb.

[0033] In the embodiments of the present application, "equal to" can be used with "greater than" and is applicable to the technical solutions adopted when greater than is used. "Equal to" can also be used with "less than" and is applicable to the technical solutions adopted when less than is used. It should be noted that when "equal to" is used with "greater than", it cannot be used with "less than". When "equal to" is used with "less than", it cannot be used with "greater than".

[0034] The display panel in the present application can be a micro organic light emitting diode (Micro-OLED) panel. Of course, it can also be other types of display panels.

[0035] Now, the present application will be described in detail with reference to the accompanying drawings. Figures 1-3 The light emitting element transfer plate provided by the embodiments of the present application will be described.

[0036] Embodiment One

[0037] Figure 1 A structure schematic diagram of a light emitting element 130 transfer plate provided by an embodiment of the present application is shown. As shown in the figure, the light emitting element transfer plate includes a light emitting element region 101 and a non-light emitting element region 102. The light emitting element transfer plate further includes a carrier plate 110, an encapsulation layer 120 disposed on one side of the carrier plate 110, the encapsulation layer 120 having a side away from the carrier plate 110 on which a light emitting element 130 is disposed, the light emitting element 130 being located in the light emitting element region 101, an optical waveguide medium 210, a projection of the optical waveguide medium 210 in a vertical direction at least partially overlapping a projection of the light emitting element 130 in the vertical direction, a laser addressing mechanism 230 disposed in the non-light emitting element region 130, and an optical waveguide extension structure 220 for connecting the laser addressing mechanism 230 and the optical waveguide medium 210 to form an optical waveguide channel. Figure 1

[0038] In the present application, the light emitting element 130 can include a red LED (Light Emitting Diode), a blue LED, a green LED, and various color LEDs. Embodiments of the present application take the red LED, the blue LED, and the green LED as examples for detailed description.

[0039] In the present application, the carrier plate 110 can be a COC structure carrier plate 110, i.e., the light emitting element is attached to the carrier plate 110 only through the encapsulation layer 120. The encapsulation layer 120 is disposed on any side of the carrier plate 110, the light emitting element is disposed on a side of the encapsulation layer 120 away from the carrier plate 110, the optical waveguide medium 210 is disposed on a side of the carrier plate 110 close to the light emitting element, a projection of the optical waveguide medium 210 in a vertical direction at least partially overlaps a projection of the light emitting element in the vertical direction, the laser addressing mechanism 230 is disposed in the non-light emitting element region 102, and the laser addressing mechanism 230 is used to indicate a region on which laser acts. The optical waveguide extension structure 220 is disposed on the carrier plate 110 and is used to connect the optical waveguide medium 210 structure and the laser addressing mechanism 230. The optical waveguide medium 210, the optical waveguide extension structure 220, and the laser addressing mechanism 230 form an optical waveguide channel. When laser acts on the laser addressing mechanism 230, the laser can guide a repair laser to a defective light emitting element position through the optical waveguide channel, and the defective element can be removed. Compared with the traditional technology in which laser directly acts on the light emitting element, in the present application, the laser is guided by the optical waveguide medium 210, the optical waveguide extension structure 220, and the laser addressing mechanism 230, so that the laser does not directly act on the light emitting element, and therefore no debris or other impurities are left around the light emitting element.

[0040] ​Optionally, the embodiments of the present application propose that the projection range of the light emitting element in the vertical direction is within the projection range of the optical waveguide medium 210 in the vertical direction. Optionally, the projection range of the optical waveguide medium 210 in the vertical direction is within the projection range of the light emitting element in the vertical direction. That is, the projection of the optical waveguide medium 210 in the vertical direction and the projection of the light emitting element in the vertical direction are at least partially overlapped, and the optical waveguide medium 210 and the light emitting element are arranged in a one-to-one correspondence.

[0041] Further, the embodiments of the present application propose that the light emitting element and the optical waveguide medium 210 are arranged in a one-to-one correspondence, the optical waveguide medium 210 and the optical waveguide extension structure 220 are arranged in a one-to-one correspondence, and the optical waveguide extension structure 220 and the laser addressing mechanism 230 are arranged in a one-to-one correspondence. It can be understood that the laser intensity required for removing or repairing different colors of light emitting elements is different, and therefore the optical waveguide medium 210, the optical waveguide extension structure 220 and the laser addressing mechanism 230 corresponding to different colors of light emitting elements are also different. That is, the first red light emitting element is arranged corresponding to the first optical waveguide medium, the first optical waveguide extension structure and the first laser addressing structure; the second green light emitting element is arranged corresponding to the second optical waveguide medium, the second optical waveguide extension structure and the second laser addressing structure; and the third blue light emitting element is arranged corresponding to the third optical waveguide medium, the third optical waveguide extension structure and the third laser addressing structure. Correspondingly, through the arrangement of the first laser addressing structure, the second laser addressing structure and the third laser addressing structure, the optical waveguide extension structure, the optical waveguide medium and the light emitting element of different colors corresponding to the arrangement can be found. The laser acts on the first laser addressing structure, the second laser addressing structure and the third laser addressing structure, and through the formed optical waveguide channel, the laser of different energies is directly transmitted to the first red light emitting element, the second green light emitting element and the third blue light emitting element. Through the laser acting on the first laser addressing structure, the second laser addressing structure and the third laser addressing structure, the repair laser is guided to the positions of the defective red light emitting element, the defective green light emitting element and the defective blue light emitting element, and the defective red light emitting element, the defective green light emitting element and the defective blue light emitting element are removed, solving the problem of process time loss caused by long-distance movement of the laser.

[0042] Optionally, the embodiments in the present application propose that the optical waveguide media are arranged in the same layer. It can be understood that the first optical waveguide medium, the second optical waveguide medium, and the third optical waveguide medium are arranged in the same layer, and the first optical waveguide extension structure, the second optical waveguide extension structure, and the third optical waveguide extension structure corresponding to the first optical waveguide medium, the second optical waveguide medium, and the third optical waveguide medium are arranged in the same layer. The embodiments in the present application adopt the arrangement of the optical waveguide media in the same layer, so that the light-emitting element transfer board has the advantages of high integration, high coupling efficiency, simple manufacturing process, low cost, flexible design, effective thermal management, optimized optical performance, easy testing, and high compatibility.

[0043] Specifically, the arrangement of the optical waveguide media in the same layer allows more optical waveguide media to be integrated in a limited space, which helps to improve the integration of the overall light-emitting element transfer board and makes the photonic device more compact. When the optical waveguide media are in the same layer, the coupling between them can be more direct and efficient because the coupling path is shorter, reducing alignment errors and transmission losses. The arrangement of the optical waveguide media in the same layer allows all optical waveguide media to be formed in the same manufacturing step, reducing the need for alignment between different layers. Due to the simplification of the manufacturing process and the improvement of the integration, the optical waveguide media in the same layer design have lower production costs. Arranging the optical waveguide media on the same layer provides greater design flexibility, making it easier to implement complex optical path layouts. Arranging the optical waveguide media in the same layer helps to achieve more effective thermal management, allowing heat to be distributed more evenly in the same plane. Arranging the optical waveguide media in the same layer allows the optical performance to be optimized, and the mode coupling effect can be controlled by adjusting the spacing of the optical waveguide media. Since all optical waveguide media are in the same layer, testing and maintenance work can be more conveniently performed. Arranging the optical waveguide media in the same layer facilitates integration with other types of photonic devices or electronic devices, improving the compatibility of the light-emitting element transfer board.

[0044] Optionally, the embodiments in the present application propose that the light-emitting element 130 further includes an inorganic epitaxial layer and a metal layer. The metal layer is arranged on the side of the light-emitting element away from the carrier board 110. The metal layer can also include a metalized contact point or pad for electrical connection. Arranging the metal layer on the side of the light-emitting element away from the carrier board 110 avoids the situation where, when laser light acts on the light-emitting element, the laser light first contacts the metal layer, causing metal fragments to splash when the light-emitting element is removed.

[0045] Optionally, the embodiments in the present application further propose that an adhesive layer is arranged on the side of the packaging layer 120 away from the carrier board 110, and the adhesive layer is used to adhere the light-emitting element. The adhesive layer can include bonding glue, conductive glue, double-sided tape, etc.

[0046] Embodiment Two

[0047] AsFigure 2 Fig. 7 shows another structure of the light emitting element transfer plate provided by the embodiments of the present application, which specifically includes the following structure:

[0048] The light emitting element transfer plate includes a carrier plate 110 including a light emitting element region 101 and a non-light emitting element region 102, and further includes: the carrier plate 110; a packaging layer 120 arranged on one side of the carrier plate 110, wherein the packaging layer 120 is provided with a light emitting element on a side away from the carrier plate 110, and the light emitting element is located in the light emitting element region 101; a light waveguide medium 210 arranged in a different layer, wherein a projection of the light waveguide medium 210 in a vertical direction at least partially overlaps a projection of the light emitting element in the vertical direction; a laser addressing mechanism 230 arranged in the non-light emitting element region 102; and a light waveguide extension structure 220 for connecting the laser addressing mechanism 230 and the light waveguide medium 210 to form a light waveguide channel.

[0049] The carrier plate 110 provided by the embodiments of the present application can be a COC structure carrier plate 110, that is, the light emitting element is only attached to the carrier plate 110 through the packaging layer 120. The packaging layer 120 is arranged on any one side of the carrier plate 110, the light emitting element is arranged on a side of the packaging layer 120 away from the carrier plate 110, the light waveguide medium 210 is arranged on a side of the carrier plate 110 close to the light emitting element, a projection of the light waveguide medium 210 in a vertical direction at least partially overlaps a projection of the light emitting element in the vertical direction, the laser addressing mechanism 230 is arranged in the non-light emitting element region 102, and the laser addressing mechanism 230 is used for indicating a region of laser action; the light waveguide extension structure 220 is arranged on the carrier plate 110 and is used for connecting the light waveguide medium 210 structure and the laser addressing mechanism 230, and the light waveguide medium 210, the light waveguide extension structure 220 and the laser addressing mechanism 230 form a light waveguide channel. When the laser acts on the laser addressing mechanism 230, the laser can guide the repair laser to the position of the defective light emitting element through the light waveguide channel, and the defective element is removed. Compared with the traditional technology in which the laser directly acts on the light emitting element, in the present application, the laser is guided by the light waveguide medium 210, the light waveguide extension structure 220 and the laser addressing mechanism 230, so that the laser does not directly act on the light emitting element, and therefore no debris or other impurities are generated around the light emitting element.

[0050] Optionally, the embodiments of the present application propose that the projection range of the light emitting element in the vertical direction is within the projection range of the light waveguide medium 210 in the vertical direction. Optionally, the projection range of the light waveguide medium 210 in the vertical direction is within the projection range of the light emitting element in the vertical direction. That is, the projection of the light waveguide medium 210 in the vertical direction and the projection of the light emitting element in the vertical direction are at least partially overlapped, and the light waveguide medium 210 and the light emitting element are arranged in a one-to-one correspondence.

[0051] Further, the embodiments of the present application propose that the light emitting element and the light waveguide medium 210 are arranged in a one-to-one correspondence, the light waveguide medium 210 and the light waveguide extension structure 220 are arranged in a one-to-one correspondence, and the light waveguide extension structure 220 and the laser addressing mechanism 230 are arranged in a one-to-one correspondence. It can be understood that the laser intensity required for removing or repairing different colors of light emitting elements is different, and therefore the light waveguide medium 210, the light waveguide extension structure 220 and the laser addressing mechanism 230 corresponding to different colors of light emitting elements are also different. That is, the first red light emitting element is arranged corresponding to the first light waveguide medium, the first light waveguide extension structure and the first laser addressing structure; the second green light emitting element is arranged corresponding to the second light waveguide medium, the second light waveguide extension structure and the second laser addressing structure; and the third blue light emitting element is arranged corresponding to the third light waveguide medium, the third light waveguide extension structure and the third laser addressing structure. Correspondingly, through the arrangement of the first laser addressing structure, the second laser addressing structure and the third laser addressing structure, the light waveguide extension structure, the light waveguide medium and the light emitting element of different colors can be found. The laser acts on the first laser addressing structure, the second laser addressing structure and the third laser addressing structure, and through the formed light waveguide channel, the laser of different energies is directly transmitted to the first red light emitting element, the second green light emitting element and the third blue light emitting element. Through the laser acting on the first laser addressing structure, the second laser addressing structure and the third laser addressing structure, the repair laser is guided to the positions of the defective red light emitting element, the defective green light emitting element and the defective blue light emitting element, and the defective red light emitting element, the defective green light emitting element and the defective blue light emitting element are removed, solving the problem of process time loss caused by long-distance movement of the laser.

[0052] Optionally, the embodiment of the present application proposes that the optical waveguide medium is arranged in different layers. It can be understood that the first optical waveguide medium, the second optical waveguide medium and the third optical waveguide medium, etc. are arranged in different layers, wherein the first optical waveguide medium and the second optical waveguide medium are arranged in different layers, the second optical waveguide medium and the third optical waveguide medium are arranged in different layers, and the first optical waveguide medium and the third optical waveguide medium are arranged in different layers. Correspondingly, the first optical waveguide extension structure, the second optical waveguide extension structure and the third optical waveguide extension structure, etc. corresponding to the first optical waveguide medium, the second optical waveguide medium and the third optical waveguide medium, etc. are arranged in different layers, wherein the first optical waveguide extension structure and the second optical waveguide extension structure are arranged in different layers, the second optical waveguide extension structure and the third optical waveguide extension structure are arranged in different layers, and the first optical waveguide extension structure and the third optical waveguide extension structure are arranged in different layers. The embodiment of the present application adopts the arrangement of the optical waveguide medium in different layers, so that different optical waveguide media and optical waveguide extension structures do not interfere with each other, improve the reliability of the laser acting in the optical waveguide channel, make the structure design of the light emitting element transfer plate more flexible, realize the complex optical waveguide channel design in a smaller size, and make the integration of the optical waveguide medium higher.

[0053] Optionally, the embodiment of the present application also proposes that the adhesion layer is arranged on the side of the packaging layer 120 away from the carrier plate 110, and the adhesion layer is used for adhering the light emitting element. The adhesion layer can include bonding glue, conductive glue, double-sided adhesive tape, etc.

[0054] For example, the light emitting element transfer plate is used for transferring the light emitting element to the carrier plate 110. Figure 3 The structure of the light emitting element transfer plate provided by the embodiment of the present application is further described, Figure 3 The cross-sectional view of the light emitting element transfer plate provided by the embodiment of the present application is shown in detail.

[0055] Specifically, the cross-sectional view of the light emitting element transfer plate proposed by the embodiment of the present application includes: the laser addressing structure arranged in the non-light emitting area, the light emitting element arranged in the light emitting element area 101, the optical waveguide medium and the optical waveguide extension structure connecting the laser addressing structure and the optical waveguide medium. For example, Figure 3 The optical waveguide medium and the optical waveguide extension structure in the embodiment of the present application are arranged in different layers. It can be understood that the optical waveguide medium and the optical waveguide extension structure can also be arranged in the same layer.

[0056] Embodiment three

[0057] For reference Figure 4As shown, the embodiment of the present application improves a repairing method of a light emitting element transfer plate, which comprises: step S410, acquiring a target laser addressing structure corresponding to a target light emitting element, emitting laser based on the laser addressing structure, and removing the target light emitting element by using the laser, wherein the target light emitting element can include a defective light emitting element or a light emitting element to be repaired; emitting laser based on the laser addressing structure, forming an optical waveguide channel through an optical waveguide extension structure and an optical waveguide medium arranged corresponding to the laser addressing structure, and removing the target light emitting element by using the laser.

[0058] Optionally, after the target light emitting element is removed by using the laser, the light emitting element needs to be bonded to the display backplane. After the light emitting element is bonded to the display backplane, the light emitting element transfer plate needs to be recycled, and the carrier plate is separated from the light emitting element, wherein the optical waveguide medium and the carrier plate can be an integrated structure. The embodiment of the present application proposes that the bonding glue on the light emitting element transfer plate can be removed by using a wet chemical method or a soaking solution method, and the carrier plate is separated from the light emitting element. The embodiment of the present application does not make specific limitation on this.

[0059] Figure 5 FIG. 1 is a structural schematic diagram of a display panel provided by an embodiment of the present application.

[0060] Based on the same inventive concept, the present application further provides a display panel, which comprises a plurality of light emitting elements provided by any of the preceding embodiments.

[0061] The specific structure of the display panel 100 has been described in detail in the above embodiments, and will not be described here again. Of course, Figure 5 The display panel 100 shown is only for illustrative purposes. The display panel 100 can be any electronic device with a display function, such as a mobile phone, a tablet computer, a notebook computer, an e-paper, or a television.

[0062] The above description is only the preferred embodiments of the present application and is not intended to limit the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

[0063] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the above embodiments, or make equivalent replacement to some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A light emitting element transfer board characterized by comprising: The light emitting element transfer plate comprises a light emitting element region and a non-light emitting element region, and comprises: a carrier plate; a packaging layer arranged on one side of the carrier plate, the packaging layer being arranged with a light emitting element away from one side of the carrier plate, the light emitting element being located in the light emitting element region; an optical waveguide medium, a projection of the optical waveguide medium in a vertical direction at least partially overlapping a projection of the light emitting element in the vertical direction; a laser addressing structure arranged in the non-light emitting element region; an optical waveguide extension structure for connecting the laser addressing structure and the optical waveguide medium to form an optical waveguide channel through which laser is guided to a defective light emitting element position to remove the defective light emitting element; the optical waveguide medium comprises at least a first optical waveguide medium, a second optical waveguide medium and a third optical waveguide medium; the first optical waveguide medium, the second optical waveguide medium and the third optical waveguide medium are arranged in different layers; the light emitting element comprises a first red light emitting element, a second green light emitting element and a third blue light emitting element, wherein the first optical waveguide medium is arranged corresponding to the first red light emitting element, the second optical waveguide medium is arranged corresponding to the second green light emitting element, and the third optical waveguide medium is arranged corresponding to the third blue light emitting element.

2. The light emitting element transfer plate of claim 1, wherein a projection range of the light emitting element in a vertical direction is within a projection range of the optical waveguide medium in the vertical direction.

3. The light emitting element transfer plate of claim 1, wherein a projection range of the optical waveguide medium in a vertical direction is within a projection range of the light emitting element in the vertical direction.

4. The light emitting element transfer plate of claim 1, wherein the light emitting element and the optical waveguide medium are arranged one-to-one, the optical waveguide medium and the optical waveguide extension structure are arranged one-to-one, and the optical waveguide extension structure and the laser addressing structure are arranged one-to-one.

5. The light emitting element transfer plate of claim 1, wherein the light emitting element further comprises a metal layer arranged on a side of the light emitting element away from the carrier plate.

6. The light emitting element transfer plate of claim 1, wherein the packaging layer is arranged with an adhesion layer away from one side of the carrier plate, the adhesion layer being used to adhere the light emitting element.

7. The light emitting element transfer plate of claim 6, wherein the adhesion layer is a bonding glue.

8. A repairing method of a light emitting element transfer board according to any one of claims 1 to 7, characterized by, comprising: acquiring a target laser addressing structure corresponding to a target light emitting element, emitting laser based on the laser addressing structure, and removing the target light emitting element using the laser.

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