Glue coating device for diode production

Abstract

The present invention discloses a glue coating device for diode production, which belongs to the technical field of diode production. The glue coating device for diode production comprises an operating platform, wherein the bottom of the operating platform is fixedly connected to a base frame, a plurality of support plates are topped with a moving mechanism, a glue coating mechanism is installed at the front end of the moving mechanism, wherein a glue coating platform is installed between two support plates, a rotating mechanism is installed inside the glue coating platform, and an adjusting mechanism is installed inside the glue coating platform. The present invention can coat the entire diode with glue by designing a moving mechanism, a glue coating mechanism, a rotating mechanism, and an adjusting mechanism, and can evenly apply glue on the surface of the diode according to its own rotation, and can use the placement of the diode to allow it to tilt and rotate, so that a uniform coating can improve the curing process of the glue, and in addition, after the glue coating is completed, the support roller can be opened to facilitate better collection of the glued diode.

Description

Technical Field

[0001] The invention belongs to the technical field of diode production, and in particular relates to a glue coating device for diode production. Background Art

[0002] A diode is a basic semiconductor device with unidirectional conductivity. It consists of two semiconductor materials (usually silicon or germanium), one of which is a P-type semiconductor and the other is an N-type semiconductor. The two are in contact to form a PN junction, allowing current to flow in only one direction. Diodes are widely used in fields such as rectification, signal modulation, protection circuits, and switching applications. Its most basic function is to allow current to flow in one direction and prevent reverse current, thereby protecting the circuit from damage.

[0003] In order to protect the internal structure of the diode from external interference when it is in use, it is necessary to apply glue before packaging. The existing glue application device for diode production usually adopts manual brushing to apply glue to the diode individually during production, resulting in the glue not being evenly distributed on the diode during glue application and the glue sticking after the glue application is completed. At the same time, the overall size of the diode makes the glue application efficiency low, thereby reducing the use effect of the glue application device. In addition, after the glue application is completed, it is impossible to ensure that the glue is completely attached to the surface of the diode and dry, so it cannot be conveniently collected, which greatly reduces the production efficiency of the diode. Summary of the invention

[0004] The technical problem to be solved by the present invention is to overcome the disadvantages of the above-mentioned prior art and provide a glue coating device for diode production.

[0005] The technical solution adopted to solve the above technical problems is: a glue coating device for diode production, comprising an operating platform, a bottom of the operating platform is fixedly connected to a base frame, a top of the operating platform is fixedly connected to a plurality of support plates, and a moving mechanism is installed on the top of the plurality of support plates;

[0006] A gluing mechanism is installed at the front end of the moving mechanism, wherein a gluing platform is installed between the two support plates, and a rotating mechanism is installed inside the gluing platform;

[0007] An adjusting mechanism is installed inside the gluing platform, a material outlet is provided at the bottom of the gluing platform, and a material box is fixedly connected to the top of the operating platform.

[0008] Furthermore, the moving mechanism includes a support platform fixedly connected to the front end of the top of a plurality of support plates, wherein two of the support plates are fixedly connected to a baffle on one side, one of the baffles is fixedly connected to a first motor on one side, a threaded rod is fixedly connected to an output end of the first motor, a sliding seat is rotatably connected to an outer wall of the threaded rod, a connecting seat is fixedly connected to a rear end of the sliding seat, a fixed plate is fixedly connected to the top of the connecting seat, the other end of the threaded rod is rotatably connected to another baffle, and the top of the support platform is slidably connected to the connecting seat.

[0009] Through the above technical solution, when in use, after the diode is placed in the glue coating device, the surface of the diode can be coated with glue using the moving mechanism to ensure that the surface of the diode can be completely coated with glue. At the same time, after one end is coated with glue, it can perform reciprocating motion to reduce the power consumption of the glue coating production. Specifically, after the operator has placed the diodes one by one, the first motor on one side of the baffle is started to drive the threaded rod to rotate, and then the fixed plate on the top of the connecting seat on the slide is driven to move, so that the entire diode can be completely coated with glue through movement.

[0010] Furthermore, the glue coating mechanism includes a rectangular groove opened on the surface of the fixed plate, two support columns are fixedly connected inside the rectangular groove, and the outer walls of the two support columns are slidably connected to a sliding body, and two springs are fixedly connected to the upper and lower ends of the sliding body, and the front end of the sliding body is fixedly connected to a glue barrel, and the bottom of the glue barrel is fixedly connected to a glue delivery pipe, and the bottom of the glue delivery pipe is fixedly connected to a glue brush, and the two ends of the outer wall of the glue barrel are fixedly connected to support rods, and the bottoms of the two support rods are rotatably connected to hubs, and the top two ends of the glue coating platform are fixedly connected to guide rails, and the other ends of the multiple springs are fixedly connected to the rectangular grooves, and the two hubs are respectively rollingly connected to the corresponding guide rails, and the guide rails are high at the middle end and low at the two ends.

[0011] Through the above technical solution, after the moving mechanism performs reciprocating motion, it drives the glue coating mechanism to move back and forth on the top of the diode as a whole, thereby realizing the glue coating operation of the diode as a whole. The uniform coating can improve the adhesion between the glue and the surface of the diode, ensuring that the glue can provide a stable bonding effect after curing. Specifically, with the movement of the moving mechanism, the hub on the support rod of the glue barrel can roll along the corresponding guide rail. Since the guide rail is high at the middle end and low at the two ends, the middle end and both ends of the diode with different diameters can be smoothly coated with glue. When the hub rolls up and down, it can squeeze multiple springs on the outer walls of the two support columns so that the glue barrel can swing up and down, thereby avoiding a certain amount of squeezing of different diameter parts of the diode, thereby greatly ensuring the production quality of the diode.

[0012] Furthermore, the rotating mechanism includes a second motor fixedly connected to one side of the gluing platform, the output end of the second motor is fixedly connected to a driving shaft, a plurality of rotating shafts are rotatably connected inside the gluing platform, the outer walls of the plurality of rotating shafts are fixedly connected to support rollers, the surfaces of the plurality of support rollers are provided with two right-angle grooves, the outer walls of the plurality of rotating shafts are fixedly connected to a first synchronous wheel, the outer walls of the plurality of first synchronous wheels are rotatably connected to a synchronous belt, a first movable groove is provided inside the gluing platform, the other end of one of the rotating shafts is fixedly connected to the driving shaft, and the diameters of the two ends of the support rollers are higher than the middle end.

[0013] Through the above technical solution, when the glue coating mechanism is coating the diode with glue, the rotating mechanism can be used to drive the diode to rotate. The rotation allows the glue to cover the surface of the diode more comprehensively, including the hard-to-reach areas, ensuring that every corner can be properly coated with glue. The structure of the glue coating mechanism itself can allow the diode to maintain a certain tilt angle. The tilt rotation can help the glue to be evenly distributed on the entire surface of the diode, ensuring the consistency and integrity of the coating, and can quickly air-dry the glue on the surface of the diode, thereby speeding up the production rate. Specifically, the second motor on one side of the glue coating platform is started to drive the support roller on the rotating shaft at one end of the drive shaft to rotate, and the wide diameter part of the diode is placed between two of the support rollers. Between the support rollers, under the connection of the synchronous belt, multiple diodes can rotate between multiple support rollers. As the glue coating mechanism applies glue, it is coated from one end of the diode to the other end. Since the diameter of the two ends of the support roller is higher than the middle end, the diode will not move with the glue brush. When the glue brush is in the middle position, the diode is stable due to the large diameter of the middle end of the diode. When it reaches one end, the glue brush will squeeze the side of the diode with a smaller diameter to tilt it. At this time, the corner position of the diode with a larger diameter will be stuck in the right-angle groove, so as to ensure the stability of the diode rotation. After the glue coating is completed, the diode can rotate in the air, which accelerates the air drying of the diode, and the glue on the surface of the diode can be more uniform, thereby greatly improving the diode gluing effect.

[0014] Furthermore, the adjustment mechanism includes a hydraulic cylinder fixedly connected to the front end of the glue coating platform, the piston end of the hydraulic cylinder is fixedly connected to a bracket, the second synchronous wheel is rotatably connected inside the first movable groove, the third synchronous wheel is rotatably connected inside the first movable groove, and the fourth synchronous wheel is fixedly connected to the front end of the top of the bracket, wherein both ends of the outer walls of the two rotating shafts are rotatably connected to the first connecting rod, and both ends of the outer walls of the rotating shafts are rotatably connected to the second connecting rod, the third movable groove is opened inside the glue coating platform, the second movable groove is opened inside the glue coating platform, and multiple arc grooves are opened inside the third movable groove, the rear end of the top of the bracket is fixedly connected to one of the rotating shafts, every two of the second connecting rods are in a cross shape, the top ends of the multiple second connecting rods are respectively slidably connected to the corresponding arc grooves, and the inside of the second movable groove is slidably connected to the bracket.

[0015] Through the above technical scheme, when the gluing is completed, the adjusting mechanism is opened to allow the diodes after gluing to be better collected. Specifically, the hydraulic cylinder at the front end of the gluing platform is started to push the bracket to the rear end to move in the second movable groove. At this time, the bracket will drive the fourth synchronous wheel thereon to move, so that the synchronous belt has enough length to move forward. At the same time, the rotating shaft connected to the bracket will move toward the rear end in the groove until the crossed first connecting rod and the second connecting rod are stretched open. Then the multiple rotating shafts connected thereto will disperse, so that the support rollers are spread out a certain distance, thereby facilitating the diodes to fall from the dispersed distance and fall into the material box from the discharge port. During the falling process, the surface of the diode will quickly contact with the air, thereby accelerating the drying speed. In addition, when the crossed first connecting rod is recovered, when the top of the first connecting rod is fully in contact with the circular arc groove, it will no longer move, thereby achieving a fixed distance between the circular arc grooves.

[0016] The beneficial effects of the present invention are as follows: (1) The present invention can coat the entire diode with glue by designing a moving mechanism, a gluing mechanism, a rotating mechanism and an adjusting mechanism, and can also evenly apply glue to the surface of the diode according to its own rotation, thereby avoiding glue accumulation in a certain place and ensuring that the thickness of the glue layer is consistent. At the same time, the placement of the diode can be used to allow it to be tilted and rotated, so that the uniform coating can improve the curing process of the glue and ensure that the coating will not be uneven or incompletely cured during the curing process. In addition, after the gluing is completed, the support roller can be opened to facilitate the collection of the glued diode; (2) The present invention can coat the entire diode with glue by designing a moving mechanism, a gluing mechanism and a rotating mechanism, and can evenly apply glue to the surface of the diode according to its own rotation, thereby avoiding glue accumulation in a certain place and ensuring that the thickness of the glue layer is consistent. At the same time, the placement of the diode can be used to allow it to be tilted and rotated, so that the uniform coating can improve the curing process of the glue and ensure that the coating will not be uneven or incompletely cured during the curing process. In addition, after the gluing is completed, the support roller can be opened to facilitate the collection of the glued diode; The rotating mechanism allows the glue brush to move and apply glue while pressing the diode, so that the diode can rotate to ensure that the glue covers all surfaces of the diode, especially in areas with complex shapes or difficult to reach, thereby improving the coverage and adhesion of the glue, and can accelerate the drying of the glue on the diode surface by making it tilt to a certain extent by pressing; (3) The present invention can design an adjustment mechanism to allow the diode to fall from the glue application platform to the operating platform after the glue is applied, and the naturally fallen diode can be better exposed to the air, which is helpful for the drying and curing process of the glue, so that the diode can also be air-dried under conditions that are more convenient to collect. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a schematic diagram of the three-dimensional structure of the present invention from a first viewing angle;

[0018] Figure 2 is a schematic diagram of a three-dimensional structure of the present invention from a second viewing angle;

[0019] Figure 3 yes Figure 1 A partial enlarged view of the middle A;

[0020] Figure 4 yes Figure 2 A partial enlarged view of point B in the middle;

[0021] Figure 5 is a schematic diagram of the three-dimensional structure of the present invention from a third viewing angle;

[0022] Figure 6 It is a front view of the present invention;

[0023] Figure 7 It is a structural schematic diagram of the first viewing angle rotation mechanism of the present invention;

[0024] Figure 8 is a structural schematic diagram of the second viewing angle rotation mechanism of the present invention;

[0025] Fig. 9 is a first thickness cross-sectional view of the glue coating platform of the present invention;

[0026] Fig.10 is a second thickness cross-sectional view of the glue coating platform of the present invention;

[0027] Fig.11 is a third thickness cross-sectional view of the glue coating platform of the present invention;

[0028] Fig.12 It is a schematic diagram of the structure of the rotating mechanism of the present invention;

[0029] Fig.13 It is a schematic diagram of the structure of the regulating mechanism of the present invention.

[0030] Figure numerals: 1, operating platform; 2, chassis; 3, support plate; 4, moving mechanism; 401, support table; 402, baffle; 403, first motor; 404, threaded rod; 405, slide seat; 406, connecting seat; 407, fixed plate; 5, glue coating mechanism; 501, rectangular groove; 502, support column; 503, sliding body; 504, spring; 505, glue barrel; 506, glue delivery hose; 507, glue brush; 508, support rod; 509, wheel hub; 510, guide rail; 6, glue coating platform; 7, rotating mechanism ;701, second motor; 702, drive shaft; 703, rotating shaft; 704, supporting roller; 705, right-angle groove; 706, first synchronous wheel; 707, synchronous belt; 708, first movable groove; 8, adjusting mechanism; 801, hydraulic cylinder; 802, bracket; 803, second synchronous wheel; 804, third synchronous wheel; 805, fourth synchronous wheel; 806, first connecting rod; 807, second connecting rod; 808, third movable groove; 809, second movable groove; 810, arc groove; 9, discharge port; 10, material box. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0032] like Figure 1-Figure 13As shown, a glue coating device for diode production in this embodiment includes an operating platform 1, a bottom of the operating platform 1 is fixedly connected to a base frame 2, a top of the operating platform 1 is fixedly connected to a plurality of support plates 3, a moving mechanism 4 is installed on the top of the plurality of support plates 3, and the moving mechanism 4 includes a support table 401 fixedly connected to the front end of the top of the plurality of support plates 3, wherein two support plates 3 are fixedly connected to baffles 402 on one side, one baffle 402 is fixedly connected to a first motor 403 on one side, a threaded rod 404 is fixedly connected to the output end of the first motor 403, an outer wall of the threaded rod 404 is rotatably connected to a slide seat 405, a rear end of the slide seat 405 is fixedly connected to a connecting seat 406, and the top of the connecting seat 406 is fixedly connected to a fixed plate 4 07. The other end of the threaded rod 404 is rotatably connected to another baffle 402, and the top of the support platform 401 is slidably connected to the connecting seat 406. When in use, after the diode is placed in the gluing device, the moving mechanism 4 can be used to apply glue to the surface of the diode to ensure that the surface of the diode can be completely coated with glue. At the same time, after one end is coated with glue, it can perform reciprocating motion to reduce the power consumption of the gluing production. Specifically, after the operator has placed the diodes one by one, the first motor 403 on one side of one of the baffles 402 is started to drive the threaded rod 404 to rotate, and then the fixed plate 407 on the top of the connecting seat 406 on the slide 405 is driven to move, so that the entire diode can be completely coated with glue through movement.

[0033] like Figure 1-Figure 4As shown, a gluing mechanism 5 is installed at the front end of the moving mechanism 4, and the gluing mechanism 5 includes a rectangular groove 501 opened on the surface of the fixed plate 407, and two supporting columns 502 are fixedly connected inside the rectangular groove 501, and the outer walls of the two supporting columns 502 are slidably connected to sliding bodies 503, and two springs 504 are fixedly connected to the upper and lower ends of the sliding body 503, and a glue barrel 505 is fixedly connected to the front end of the sliding body 503, and the bottom of the glue barrel 505 is fixedly connected to a glue delivery pipe 506, and the bottom of the glue delivery pipe 506 is fixedly connected to a glue brush 507, and the outer walls of the glue barrel 505 are fixedly connected to support rods 508 at both ends, and the bottoms of the two support rods 508 are rotatably connected to wheel hubs 509, and the top two ends of the gluing platform 6 are fixedly connected to guide rails 510, and the other ends of multiple springs 504 are fixedly connected to the rectangular groove 501, and the two wheel hubs 509 are respectively connected to the corresponding guide rails 510 in a rolling manner. The middle end is high and the two ends are low. After the moving mechanism 4 performs reciprocating motion, it drives the glue coating mechanism 5 to move back and forth on the top of the diode as a whole, thereby realizing the gluing operation of the diode as a whole. The uniform coating can improve the adhesion between the glue and the surface of the diode, ensuring that the glue can provide a stable bonding effect after curing. Specifically, with the movement of the moving mechanism 4, the hub 509 on the support rod 508 of the glue barrel 505 can roll along the corresponding guide rail 510. Since the guide rail 510 is high in the middle end and low at the two ends, the middle end and both ends of the diode with different diameters can be smoothly coated with glue. When the hub 509 rolls up and down, it can squeeze the multiple springs 504 on the outer walls of the two support columns 502 so that the glue barrel 505 can swing up and down, thereby avoiding a certain amount of squeezing of different diameter parts of the diode, thereby greatly ensuring the production quality of the diode.

[0034] like Figure 7-10 , Fig.12As shown, a glue coating platform 6 is installed between the two support plates 3, and a rotating mechanism 7 is installed inside the glue coating platform 6. The rotating mechanism 7 includes a second motor 701 fixedly connected to one side of the glue coating platform 6, and the output end of the second motor 701 is fixedly connected to a driving shaft 702. A plurality of rotating shafts 703 are rotatably connected inside the glue coating platform 6, and the outer walls of the plurality of rotating shafts 703 are fixedly connected to support rollers 704, and the surfaces of the plurality of support rollers 704 are each provided with two right-angle grooves 705, and the outer walls of the plurality of rotating shafts 703 are fixedly connected to first synchronous wheels 706, and the outer walls of the plurality of first synchronous wheels 706 are The first movable groove 708 is provided inside the glue coating platform 6, and the other end of one of the rotating shafts 703 is fixedly connected to the driving shaft 702. The diameters of the two ends of the supporting roller 704 are higher than the middle end. When the glue coating mechanism 5 is coating the diode with glue, the rotating mechanism 7 can be used to drive the diode to rotate. The glue can cover the surface of the diode more comprehensively, including the hard-to-reach areas, to ensure that every corner can be properly coated with glue. The structure of the glue coating mechanism 5 itself can keep the diode at a certain tilt angle, and the tilt rotation can help The glue is evenly distributed on the entire surface of the diode to ensure the consistency and integrity of the coating, and the glue on the surface of the diode can be quickly dried to speed up the production rate. Specifically, the second motor 701 on one side of the glue coating platform 6 is started to drive the support roller 704 on the rotating shaft 703 at one end of the driving shaft 702 to rotate, and the wide diameter part of the diode is placed between two of the support rollers 704. Under the connection of the synchronous belt 707, multiple diodes can be rotated between multiple support rollers 704. As the glue coating mechanism 5 coats the glue from one end of the diode to the other end, The diameters of both ends of the support roller 704 are higher than the middle end, so the diode will not move with the glue brush 507. When the glue brush 507 is in the middle position, the diode is stable due to the large diameter of the middle end of the diode. When it reaches one end, the glue brush 507 will squeeze the side of the diode with a smaller diameter, causing it to tilt. At this time, the corner position of the diode with a larger diameter will be stuck on the right-angle groove 705, thereby ensuring the stability of the diode's rotation. After the glue is applied, the diode can rotate in the air, accelerating the drying of the diode, and the glue on the surface of the diode can be more uniform, thereby greatly improving the glue application effect of the diode.

[0035] like Figure 11-13As shown, an adjustment mechanism 8 is installed inside the gluing platform 6, a discharge port 9 is opened at the bottom of the gluing platform 6, a material box 10 is fixedly connected to the top of the operating platform 1, the adjustment mechanism 8 includes a hydraulic cylinder 801 fixedly connected to the front end of the gluing platform 6, a bracket 802 is fixedly connected to the piston end of the hydraulic cylinder 801, a second synchronous wheel 803 is rotatably connected inside the first movable groove 708, a third synchronous wheel 804 is rotatably connected inside the first movable groove 708, and a fourth synchronous wheel 805 is fixedly connected to the front end of the top of the bracket 802, wherein the two rotating shafts 70 The first connecting rods 806 are rotatably connected to both ends of the outer wall of the rotating shaft 703, and the second connecting rods 807 are rotatably connected to both ends of the outer wall of the rotating shaft 703. A third movable groove 808 is provided inside the glue coating platform 6, and a second movable groove 809 is provided inside the glue coating platform 6. A plurality of arc grooves 810 are provided inside the third movable groove 808. The rear end of the top of the bracket 802 is fixedly connected to one of the rotating shafts 703. Every two second connecting rods 807 are in a cross shape. The top ends of the plurality of second connecting rods 807 are respectively slidably connected to the corresponding arc grooves 810. 9 is slidably connected with the bracket 802 inside. When the glue coating is completed, the adjustment mechanism 8 is opened to allow the diodes after the glue coating to be better collected. Specifically, the hydraulic cylinder 801 at the front end of the glue coating platform 6 is started to push the bracket 802 to move in the second movable groove 809. At this time, the bracket 802 will drive the fourth synchronous wheel 805 thereon to move, so that the synchronous belt 707 has enough length to move forward. At the same time, the rotating shaft 703 connected to the bracket 802 will move to the rear end in the groove until the crossed first connecting rod 80 6 and the second connecting rod 807 are stretched out, and then the multiple rotating shafts 703 connected thereto will be dispersed, so that the supporting rollers 704 are spread out a certain distance, thereby facilitating the diode to fall from the dispersed distance and fall from the discharge port 9 into the material box 10. During the falling process, the surface of the diode will quickly contact with the air, thereby accelerating the air drying speed. In addition, when the crossed first connecting rod 806 is recovered, when the top of the first connecting rod 806 is fully in contact with the arc groove 810, it will no longer move, thereby achieving a fixed distance between the arc grooves 810.

[0036] The working principle of this embodiment is as follows. When in use, multiple diodes are placed between multiple support rollers 704 respectively, and the second motor 701 on one side of the glue coating platform 6 is started to drive the support roller 704 on the rotating shaft 703 at one end of the driving shaft 702 to rotate, and the part with a wide diameter of the diode is placed between two of the support rollers 704. Under the connection of the synchronous belt 707, multiple diodes can be rotated between the multiple support rollers 704, and then the first motor 403 on one side of one of the baffles 402 is started to drive the threaded rod 404 to rotate, and then the fixed plate 407 on the top of the connecting seat 406 on the slide seat 405 is driven to move, so that the hub 509 on the support rod 508 of the glue barrel 505 can roll along the corresponding guide rail 510. When the hub 509 rolls up and down, multiple outer walls of the two support columns 502 can be squeezed. The spring 504 enables the glue barrel 505 to swing up and down, and the glue brush 507 applies glue to the diode. When it reaches one end, the glue brush 507 will squeeze the side of the diode with a smaller diameter to make it tilt. At this time, the corner position of the diode with a larger diameter will be stuck in the right-angle groove 705. After the gluing is completed, the hydraulic cylinder 801 at the front end of the gluing platform 6 is started to push the bracket 802 to the rear end to move in the second movable groove 809. At this time, the bracket 802 will drive the fourth synchronous wheel 805 thereon to move, and at the same time, the rotating shaft 703 connected to the bracket 802 will move toward the rear end in the groove until the crossed first connecting rod 806 and second connecting rod 807 are stretched open, and then the multiple rotating shafts 703 connected thereto will be dispersed, so that the diode falls from the dispersed distance and falls from the discharge port 9 into the material box 10, thereby completing the gluing process during diode production.

[0037] The above description is only a preferred embodiment of the present invention and is not intended to limit the protection scope of the present invention.

Claims

1. A glue coating device for diode production, comprising an operating platform (1), characterized in that: The bottom of the operating platform (1) is fixedly connected to a base frame (2), the top of the operating platform (1) is fixedly connected to a plurality of support plates (3), the tops of the plurality of support plates (3) are provided with a moving mechanism (4), the moving mechanism (4) comprising a supporting platform (401) fixedly connected to the front ends of the tops of the plurality of support plates (3), wherein two of the support plates (3) are fixedly connected to baffles (402) on one side, one of the baffles (402) is fixedly connected to a first motor (403) on one side, the output end of the first motor (403) is fixedly connected to a threaded rod (404), the outer wall of the threaded rod (404) is rotatably connected to a sliding seat (405), the rear end of the sliding seat (405) is fixedly connected to a connecting seat (406), and the top of the connecting seat (406) is fixedly connected to a fixing plate (407); A gluing mechanism (5) is installed at the front end of the moving mechanism (4), wherein a gluing platform (6) is installed between the two support plates (3), the gluing mechanism (5) comprises a rectangular groove (501) opened on the surface of the fixed plate (407), two support columns (502) are fixedly connected inside the rectangular groove (501), the outer walls of the two support columns (502) are slidably connected with a sliding body (503), the upper and lower ends of the sliding body (503) are fixedly connected with two springs (504), the front end of the sliding body (503) is fixedly connected with a glue barrel (505), the bottom of the glue barrel (505) is fixedly connected with a glue delivery pipe (506), the bottom of the glue delivery pipe (506) is fixedly connected with a glue brush (507), the two ends of the outer wall of the glue barrel (505) are fixedly connected with support rods (508), the bottoms of the two support rods (508) are rotatably connected with wheel hubs (509), and the top two ends of the gluing platform (6) are fixedly connected with guide rails (510); A rotating mechanism (7) is installed inside the glue coating platform (6), the rotating mechanism (7) comprising a second motor (701) fixedly connected to one side of the glue coating platform (6), the output end of the second motor (701) being fixedly connected to a driving shaft (702), a plurality of rotating shafts (703) being rotatably connected inside the glue coating platform (6), the outer walls of the plurality of rotating shafts (703) being fixedly connected to supporting rollers (704), the surfaces of the plurality of supporting rollers (704) being provided with two right-angle grooves (705), the outer walls of the plurality of rotating shafts (703) being fixedly connected to first synchronous wheels (706), the outer walls of the plurality of first synchronous wheels (706) being rotatably connected to synchronous belts (707), a first movable groove (708) being provided inside the glue coating platform (6), the other end of one of the rotating shafts (703) being fixedly connected to the driving shaft (702), and the diameters of the two ends of the supporting rollers (704) being higher than the middle end; An adjusting mechanism (8) is installed inside the glue coating platform (6), and the adjusting mechanism (8) includes a hydraulic cylinder (801) fixedly connected to the front end of the glue coating platform (6), and the piston end of the hydraulic cylinder (801) is fixedly connected to a bracket (802), the first movable groove (708) is rotatably connected to a second synchronous wheel (803), the first movable groove (708) is rotatably connected to a third synchronous wheel (804), and the top front end of the bracket (802) is fixedly connected to a fourth synchronous wheel (805), wherein both ends of the outer walls of the two rotating shafts (703) are rotatably connected to a first connecting rod (806), and the rotating shafts Both ends of the outer wall (703) are rotatably connected with a second connecting rod (807), a third movable groove (808) is provided inside the glue coating platform (6), a second movable groove (809) is provided inside the glue coating platform (6), a plurality of arc grooves (810) are provided inside the third movable groove (808), the rear end of the top of the bracket (802) is fixedly connected to one of the rotating shafts (703), every two of the second connecting rods (807) are in a cross shape, the top ends of the plurality of second connecting rods (807) are respectively slidably connected to the corresponding arc grooves (810), and the inside of the second movable groove (809) is slidably connected to the bracket (802); A material outlet (9) is provided at the bottom of the glue coating platform (6), and a material box (10) is fixedly connected to the top of the operating platform (1).

2. The glue coating device for diode production according to claim 1, characterized in that: The other end of the threaded rod (404) is rotatably connected to another baffle (402), and the top of the support platform (401) is slidably connected to the connecting seat (406).

3. The glue coating device for diode production according to claim 1, characterized in that: The other ends of the plurality of springs (504) are fixedly connected to the rectangular groove (501), and the two wheel hubs (509) are respectively rollingly connected to corresponding guide rails (510), and the guide rails (510) are in a shape with a high middle end and low ends.

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