A wafer testing device and a testing method

Abstract

The present invention discloses a wafer testing device and a testing method, belonging to the technical field of wafer testing. A wafer testing device includes a bracket, and further includes: an outer cover with an open bottom, fixedly connected to the bracket, wherein a lifting device is fixedly installed at the inner top of the outer cover, and a cylindrical inner cover is fixedly installed at the telescopic end of the lifting device, and the opening of the inner cover is arranged downward; a plurality of detection plates circumferentially distributed inside the inner cover, wherein probes are installed on the detection plates, and the probes of one of the detection plates are arranged downward, and an adjusting part for driving the plurality of probes to revolve around the axis of the inner cover is arranged on the inner cover. When the inner cover moves upward to the limit position; the present invention can automatically replace the probes and the detection plates, prevent obvious heating and wear caused by repeated use of the same group of detection plates and probes, on the one hand, it can improve the service life of the detection plates and probes, and on the other hand, it can improve the testing accuracy.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer testing, and particularly to a wafer testing device and a testing method. Background Art

[0002] A wafer is a core concept in the semiconductor industry and plays a crucial role particularly in the manufacturing process of integrated circuits. A wafer mainly refers to a silicon wafer used for fabricating silicon-based semiconductor devices. Since they are usually circular, they are called "wafers". In the production of wafers, in order to ensure the use stability and quality of wafers, it is necessary to perform inspection and testing on the wafers.

[0003] Currently, the inspection of wafers is mainly completed by an inspection board with probes. During testing, the probes on the inspection board are directly contacted with the test points of the wafer to complete the testing work. However, due to the large production quantity of wafers, the frequent work of the inspection board and the probes is likely to cause serious heating and wear, thereby affecting the service life of the inspection board and the probes. Summary of the Invention

[0004] The purpose of the present invention is to solve the problem in the prior art that the inspection board and the probes are prone to heating and wear under frequent work, and to propose a wafer testing device and a testing method.

[0005] To achieve the above purpose, the present invention adopts the following technical solutions:

[0006] A wafer testing device includes a bracket, and further includes: an outer cover with an open bottom, fixedly connected to the bracket. Among them, a lifting device is fixedly installed on the inner top of the outer cover, and a cylindrical inner cover is fixedly installed at the telescopic end of the lifting device, and the opening of the inner cover is arranged downward; a plurality of inspection boards circumferentially distributed inside the inner cover, among which probes are installed on the inspection boards, and the probes of one of the inspection boards are arranged downward. An adjusting part for driving a plurality of probes to revolve around the axis of the inner cover is provided on the inner cover. When the inner cover moves upward to the limit position, a plurality of the inspection boards synchronously rotate by a fixed angle around the axis of the inner cover.

[0007] To prevent the same set of inspection boards and probes from being reused and causing heating and wear, preferably, the adjusting part includes a rotating shaft rotatably connected to the inner wall of the inner cover. A turntable is fixedly installed on the rotating shaft, and a plurality of the inspection boards are installed on the circumferential outer wall of the turntable. Among them, a worm gear is fixedly installed at one end of the rotating shaft, and a worm meshingly connected with the worm gear is rotatably installed on the outer wall of the inner cover, and a linkage part for driving the worm to rotate is provided on the inner wall of the outer cover.

[0008] In order to automatically replace the detection board and the probe, further, the linkage part includes a rack fixedly installed on the inner wall of the outer cover, and a driven gear is installed at the shaft end of the worm through a one-way bearing. When the inner cover moves upward to the limit position, the driven gear meshes with the rack.

[0009] In order to dissipate heat from and clean the detection board and the probe, further, air blowing covers and exhaust pipes are respectively fixedly connected to both sides of the upper end of the inner cover. The air blowing covers and the exhaust pipes are both communicated with the inner cover, and the exhaust ends of the air blowing covers and the input ends of the exhaust pipes are both directed towards the detection board at the top of the inner cover.

[0010] In order to automatically blow air into the built-in air blowing cover, further, a telescopic airbag is installed between the top of the inner cover and the inner top of the outer cover. An air suction pipe and an exhaust pipe communicated with it are fixedly connected to the telescopic airbag. One-way valves are fixedly installed in both the air suction pipe and the exhaust pipe, and the exhaust end of the exhaust pipe extends into the air blowing cover.

[0011] In order to enable the probe to complete the test work more stably, further, sliding holes are provided on the outer wall of the turntable. A sliding column is slidably connected in the sliding holes. The detection board is fixedly installed on the sliding column, and the sliding column is elastically connected to the inner wall of the sliding hole through a first spring.

[0012] In order to improve the heat dissipation effect of the probe and the detection board, further, the outer cover is provided with a plurality of equally spaced strip-shaped grooves. The end of the exhaust pipe is attached to the inner wall of the outer cover. When the inner cover moves up and down, the exhaust pipe will slide over a plurality of strip-shaped grooves in sequence. A triangular block is fixedly connected to the detection board, and the two inclined surfaces of the triangular block are respectively directed towards the exhaust pipe and the air blowing cover.

[0013] In order to facilitate the loading and unloading of wafers, further, a conveyor belt is fixedly installed on the bracket. A cover plate is fixedly connected to the conveyor belt. A through groove is formed between the cover plate, the side plates of the conveyor belt and the belt. Air suction pipes and air suction covers are respectively fixedly connected to both sides of the conveyor belt. Among them, the air suction pipes and the air suction covers are both communicated with the through groove. The end of the air suction pipe extends into the air suction cover, and filter elements are fixedly installed in both the air suction cover and the air suction pipe.

[0014] In order to clean the wafers to be tested, further, installation grooves are provided on both sides of the upper end of the cover plate. Vertical plates are longitudinally slidably installed in the two installation grooves. The upper ends of the two vertical plates are fixedly connected with a pressing plate. A second spring is installed between the pressing plate and the cover plate. When the inner cover moves downward to the limit position, the two vertical plates will respectively block the two ports of the through groove.

[0015] The operating steps of a wafer testing method are as follows:

[0016] Step 1: Place the wafer to be tested below the inner cover;

[0017] Step 2: Move the inner cover downward until the downward-facing probe touches the wafer below;

[0018] Step 3: After the test is completed, move the inner cover upward and replace the wafer;

[0019] Step 4: When the inner cover moves upward to the limit position, replace another set of probes and set them downward;

[0020] Step 5: Repeat Steps 2 to 4 to complete the testing of all wafers.

[0021] Compared with the prior art, the present invention provides a wafer testing device, which has the following beneficial effects:

[0022] 1. In this wafer testing device, when the lifting device drives the inner cover to move upward and reset, the turntable will set another set of detection plates and probes downward, so that the probes and detection plates can be automatically replaced, preventing obvious heating and wear caused by the repeated use of the same set of detection plates and probes. On the one hand, it can improve the service life of the detection plates and probes, and on the other hand, it can improve the testing accuracy.

[0023] 2. In this wafer testing device, when the inner cover squeezes the telescopic airbag, the air blowing cover will blow air flow towards the exhaust duct, thereby dissipating heat from the detection plates and probes on the inner top, and blowing off the possible floating dust and debris generated by friction adhering to the probes. On the one hand, it improves the operating stability of the detection plates and probes, and on the other hand, it reduces the influence of floating dust on the test.

[0024] 3. In this wafer testing device, when the suction pipe sucks air from the suction hood, the suction hood will suck air from the through slots at the lower end of the cover plate, and the through slots will suck air through the openings at both ends. The air flow passing through the through slots can take away the possible floating dust on the wafer, preventing the influence of floating dust on the test, and also dissipating heat from the wafer to prevent the remaining heat from affecting the testing accuracy.

[0025] 4. In this wafer testing device, when the inner cover presses against the pressing plate, the two vertical plates abut against the belt of the conveyor belt, thereby automatically blocking both sides of the through slot. Thus, when the suction hood sucks air, the air flow can flow more comprehensively over the surface of the wafer to improve the effect of cleaning and dissipating heat from the wafer.

[0026] 5. In this wafer testing device, when the inner cover drives the exhaust duct to sweep over multiple strip-shaped slots in sequence, the suddenly increasing and decreasing wind speed inside the inner cover will cause the detection plates and probes to vibrate up and down, thereby improving the effect of cleaning dust on the detection plates and probes. Description of the Drawings

[0027] Figure 1Schematic diagram of the first perspective axonometric structure of a wafer testing device proposed by the present invention;

[0028] Figure 2 Schematic diagram of the second perspective axonometric structure of a wafer testing device proposed by the present invention;

[0029] Figure 3 Schematic diagram of the partial axonometric structure of a wafer testing device proposed by the present invention Figure 1 ;

[0030] Figure 4 Schematic diagram of the partial axonometric structure of a wafer testing device proposed by the present invention Figure 2 ;

[0031] Figure 5 Schematic diagram of the inner cover axonometric structure of a wafer testing device proposed by the present invention;

[0032] Figure 6 Schematic diagram of the turntable axonometric structure of a wafer testing device proposed by the present invention;

[0033] Figure 7 Schematic diagram of the detection board axonometric structure of a wafer testing device proposed by the present invention;

[0034] Figure 8 Schematic diagram of a part of a wafer testing device proposed by the present invention Figure 3 Structure diagram of part A;

[0035] Figure 9 Schematic diagram of the top plate axonometric structure of a wafer testing device proposed by the present invention.

[0036] In the figure: 1. Bracket; 2. Outer cover; 3. Inner cover; 4. Turntable; 5. Detection board; 6. Probe; 7. Rotating shaft; 8. Worm gear; 9. Worm; 10. Driven gear; 11. Rack; 12. Lifting device; 13. Blowing hood; 14. Exhaust pipe; 15. Exhaust duct; 16. Strip-shaped groove; 17. Suction pipe; 18. Slide hole; 19. Slide column; 20. First spring; 21. Triangular block; 22. Telescopic airbag; 23. Cover plate; 24. Suction hood; 25. Suction duct; 26. Filter element; 27. Pressure plate; 28. Second spring; 29. Vertical plate; 30. Installation groove; 31. Conveyor belt; 32. Placing hole. Detailed implementation manners

[0037] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments.

[0038] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0039] Embodiment 1:

[0040] Referring to Figures 1-9 , a wafer testing device includes a bracket 1 and further includes: a rectangular outer cover 2 with an open bottom, fixedly connected to the bracket 1. Among them, a lifting device 12 is fixedly installed on the inner top of the outer cover 2. The lifting device 12 is an electric telescopic rod, and a cylindrical inner cover 3 is fixedly installed at the telescopic end of the lifting device 12. The opening of the inner cover 3 is arranged downward; a plurality of detection plates 5 circumferentially distributed inside the inner cover 3, the number of detection plates 5 is 2 to 8, and the preferred number in this application is 6. Among them, probes 6 for testing wafers are installed on the detection plates 5. The probes 6 of one of the detection plates 5 are arranged downward. An adjusting part for driving the plurality of probes 6 to revolve around the axis of the inner cover 3 is provided on the inner cover 3. When the inner cover 3 moves upward to the limit position, the plurality of detection plates 5 rotate a fixed angle synchronously around the axis of the inner cover 3. When the number of detection plates 5 is 6, the rotation angle is 60°.

[0041] Specifically, during use, the wafer to be tested is placed below the inner cover 3, and then the lifting device 12 drives the inner cover 3 to move downward. The inner cover 3 will drive the turntable 4 to move downward synchronously. The turntable 4 will drive the detection plate 5 and the probe 6 arranged downward to move downward. The probe 6 will finally contact the wafer below, and the wafer testing work can be completed. After the test is completed, the lifting device 12 drives the inner cover 3 to move upward to reset. When the inner cover 3 moves upward to the limit position, the adjusting part will drive the plurality of detection plates 5 to rotate a fixed angle synchronously around the axis of the inner cover 3, that is, another set of detection plates 5 and probes 6 are arranged downward, so that the probes 6 and the detection plates 5 can be automatically replaced, preventing obvious heating and wear due to the repeated use of the same set of detection plates 5 and probes 6. On the one hand, the service life of the detection plates 5 and the probes 6 can be improved, and on the other hand, the testing accuracy can be improved.

[0042] The outer wall of the above turntable 4 is provided with sliding holes 18. The number of groups of sliding holes 18 is the same as the number of detection plates 5. A sliding column 19 is slidably connected in the sliding hole 18. The detection plate 5 is fixedly installed on the sliding column 19. The sliding column 19 is elastically connected to the inner wall of the sliding hole 18 through a first spring 20.

[0043] Specifically, when the probe 6 presses downward, the reaction force exerted by the wafer on the probe 6 causes the sliding column 19 to slide into the sliding hole 18 and compress the first spring 20. The first spring 20 can elastically press the probe 6 against the wafer to improve the test stability of the probe 6.

[0044] Embodiment 2:

[0045] Referring to Figures 3-6 and Figure 8 , which is basically the same as Embodiment 1. Furthermore, the specific implementation of the adjusting part is specifically disclosed.

[0046] The adjusting part in this wafer testing device includes a rotating shaft 7 rotatably connected to the inner wall of the inner cover 3. A turntable 4 is fixedly installed on the rotating shaft 7. A plurality of detection plates 5 are installed on the circumferential outer wall of the turntable 4. Among them, one end of the rotating shaft 7 is fixedly installed with a worm gear 8. A worm 9 meshing with the worm gear 8 is rotatably installed on the outer wall of the inner cover 3. A linkage part for driving the worm 9 to rotate is provided on the inner wall of the outer cover 2. The linkage part includes a rack 11 fixedly installed on the inner wall of the outer cover 2. A driven gear 10 is installed at the shaft end of the worm 9 through a one-way bearing. When the inner cover 3 moves upward to the limit position, the driven gear 10 meshes with the rack 11.

[0047] Specifically, when the inner cover 3 moves upward to the limit position, the moving inner cover 3 drives the driven gear 10 to roll over the rack 11. The driven gear 10 drives the worm 9 to rotate. The worm 9 drives the rotating shaft 7 and the turntable 4 to rotate by a fixed angle through the worm gear 8. The turntable 4 sets another group of detection plates 5 and the probe 6 downward, so that the probe 6 and the detection plates 5 can be automatically replaced, preventing obvious heating and wear due to the repeated use of the same group of detection plates 5 and the probe 6. On the one hand, the service life of the detection plates 5 and the probe 6 can be improved, and on the other hand, the test accuracy can be improved. When the inner cover 3 drives the driven gear 10 to move downward and roll over the rack 11, the driven gear 10 will reverse. Since the driven gear 10 is installed on the rotating shaft 7 through a one-way bearing, the driven gear 10 will only rotate idly instead of driving the rotating shaft 7 to reverse.

[0048] Embodiment 3:

[0049] Referring to Figures 2-5 and Figures 7-8 , which is basically the same as Embodiment 2. Furthermore, the specific implementation of dissipating heat and cleaning the detection plates 5 and the probe 6 is specifically added.

[0050] The upper ends of the inner cover 3 are fixedly connected with a blowing hood 13 and an exhaust pipe 15 on both sides, the blowing hood 13 is used to blow air into the inner cover 3, the blowing hood 13 and the exhaust pipe 15 are both connected to the inner cover 3, and the exhaust end of the blowing hood 13 and the input end of the exhaust pipe 15 are both facing the detection plate 5 at the top of the inner cover 3; a telescopic airbag 22 is installed between the top of the inner cover 3 and the inner top of the outer cover 2, the telescopic airbag 22 is fixedly connected with an intake pipe 17 and an exhaust pipe 14 connected thereto, and a one-way valve is fixedly installed in the intake pipe 17 and the exhaust pipe 14, and the exhaust end of the exhaust pipe 14 extends into the blowing hood 13.

[0051] Specifically, when the inner cover 3 moves upward to reset, the inner cover 3 will squeeze the telescopic airbag 22, and the telescopic airbag 22 will blow air to the blowing cover 13 through the exhaust pipe 14, and the blowing cover 13 will blow the airflow to the exhaust pipe 15. During this period, the airflow will pass through the inner top of the inner cover 3, so as to dissipate the heat of the detection plate 5 and the probe 6 on the inner top, and blow off the dust and debris generated by friction that may adhere to the probe 6. On the one hand, the operating stability of the detection plate 5 and the probe 6 is improved, and on the other hand, the influence of dust on the test is reduced. When the inner cover 3 moves downward, the inner cover 3 will stretch the telescopic airbag 22, and the telescopic airbag 22 will absorb air through the suction pipe 17.

[0052] The above-mentioned outer cover 2 is provided with a plurality of strip grooves 16 arranged at equal intervals, and the end of the exhaust pipe 15 is fitted on the inner wall of the outer cover 2. When the inner cover 3 moves up and down, the exhaust pipe 15 will slide through the plurality of strip grooves 16 in sequence. A triangular block 21 is fixedly connected to the detection plate 5. The cross-section of the triangular block 21 is an isosceles triangle or a right triangle. The two inclined surfaces of the triangular block 21 are respectively facing the exhaust pipe 15 and the blowing hood 13. When the cross-section of the triangular block 21 is a right triangle, the only inclined surface will face the blowing hood 13.

[0053] Specifically, when the inner cover 3 slides downward and upward, the inner cover 3 will drive the exhaust pipe 15 to sweep through multiple strip grooves 16 in sequence. When the exhaust pipe 15 is completely aligned with the strip grooves 16, the wind resistance in the exhaust pipe 15 is minimal. When the exhaust pipe 15 is not aligned with the strip grooves 16, the wind resistance of the exhaust pipe 15 will increase. The fluctuating wind resistance will cause the wind speed to fluctuate. When the wind speed is high, the inclined surface of the triangular block 21 will cause the detection plate 5 to move away from the inclined surface, that is, the detection plate 5 will drive the probe 6 to move upward. When the wind speed is low, the first spring 20 will drive the detection plate 5 and the probe 6 to move in the opposite direction and reset. Therefore, the fluctuating wind speed will cause the detection plate 5 and the probe 6 to shake up and down, thereby improving the effect of cleaning the dust on the detection plate 5 and the probe 6.

[0054] Embodiment 4:

[0055] Reference Figures 1-5 as well as Figure 9, which is basically the same as Embodiment 3. Furthermore, a specific implementation plan for loading and unloading wafers is specifically added.

[0056] A conveyor belt 31 is fixedly installed on the above-mentioned bracket 1. The conveyor belt 31 mainly includes a belt, a mounting frame with two side plates, and pulleys for driving the belt to move. The belt of the conveyor belt 31 is provided with placement holes 32 arranged at equal intervals for placing wafers. A cover plate 23 is fixedly connected to the conveyor belt 31. A through groove is formed between the cover plate 23, the side plates of the conveyor belt 31, and the belt. The through groove is not labeled in the figure and is shaped like a pipe with a rectangular cross-section. The wafer can pass under the cover plate 23 under the action of the belt. Suction pipes 25 and suction hoods 24 are respectively fixedly connected to both sides of the conveyor belt 31. Among them, both the suction pipes 25 and the suction hoods 24 are communicated with the through groove. The end of the suction pipe 17 extends into the suction hood 24, and filter elements 26 are fixedly installed in both the suction hood 24 and the suction pipes 25.

[0057] Specifically, in actual use, the produced wafers can be sequentially placed on the belt of the conveyor belt 31. The conveyor belt 31 can move the wafers to the lower part of the inner cover 3 through the belt, so as to facilitate the testing work of the wafers. When the suction pipe 17 sucks air, the suction pipe 17 will suck air from the suction hood 24, the suction hood 24 will suck air from the through groove at the lower end of the cover plate 23, and the through groove will suck air through the openings at both ends. When the wafer is located at the lower end of the cover plate 23, the airflow passing through the through groove can take away the possible residual floating dust on the wafer, prevent the influence of floating dust on the test, and can also dissipate heat from the wafer to prevent the remaining heat from affecting the test accuracy.

[0058] Installation grooves 30 are provided on both sides of the upper end of the above-mentioned cover plate 23. Vertical plates 29 are longitudinally slidably installed in the two installation grooves 30. The upper ends of the two vertical plates 29 are fixedly connected with a pressing plate 27. A second spring 28 is installed between the pressing plate 27 and the cover plate 23. When the inner cover 3 moves downward to the limit position, the two vertical plates 29 will respectively block the two ports of the through groove.

[0059] Specifically, when the inner cover 3 moves downward to the limit position, the inner cover 3 will also press the pressing plate 27, and the pressing plate 27 will drive the two vertical plates 29 to move downward. The two vertical plates 29 will finally abut against the belt of the conveyor belt 31, thereby automatically blocking both sides of the through groove. So when the suction hood 24 sucks air, the through groove at the lower end of the cover plate 23 can only suck air through the suction pipe 25, so that the airflow can flow more comprehensively over the surface of the wafer to improve the effect of cleaning and dissipating heat from the wafer. And the filter elements 26 in the suction pipes 25 and the suction hoods 24 can also filter out dust to prevent the dust from contaminating the telescopic airbag 22. When the inner cover 3 resets upward, the second spring 28 will drive the pressing plate 27 and the vertical plates 29 to move upward and reset.

[0060] The operation steps of a wafer testing method are as follows:

[0061] Step 1: Place the wafer to be tested below the inner cover 3;

[0062] Step 2: Move the inner cover 3 downward until the downward-facing probe 6 touches the wafer below;

[0063] Step 3: After the test is completed, move the inner cover 3 upward and replace the wafer;

[0064] Step 4: When the inner cover 3 moves upward to the limit position, replace another set of probes 6 and set them downward;

[0065] Step 5: Repeat Steps 2 to 4 to complete the testing of all wafers.

[0066] In this wafer testing device, when in use, place the wafer to be tested below the inner cover 3, and then drive the inner cover 3 downward through the lifting device 12. The inner cover 3 will drive the turntable 4 to move downward synchronously. The turntable 4 will drive the downward-facing detection plate 5 and the probe 6 to move downward, and the probe 6 will finally touch the wafer below, thus completing the wafer testing work. After the test is completed, drive the inner cover 3 to move upward and reset through the lifting device 12. When the inner cover 3 moves upward to the limit position, the moving inner cover 3 will drive the driven gear 10 to roll over the rack 11. The driven gear 10 will drive the worm 9 to rotate, and the worm 9 will drive the rotating shaft 7 and the turntable 4 to rotate a fixed angle through the worm gear 8. The turntable 4 will set another set of detection plates 5 and probes 6 downward, thus automatically replacing the probes 6 and the detection plates 5, preventing obvious heating and wear due to the repeated use of the same set of detection plates 5 and probes 6. On the one hand, it can improve the service life of the detection plates 5 and the probes 6, and on the other hand, it can improve the testing accuracy. When the inner cover 3 drives the driven gear 10 to move downward and roll over the rack 11, the driven gear 10 will reverse. Since the driven gear 10 is installed on the rotating shaft 7 through a one-way bearing, the driven gear 10 will only rotate idly instead of driving the rotating shaft 7 to reverse.

[0067] When the inner cover 3 moves upward and resets, the inner cover 3 will squeeze the expansion airbag 22. The expansion airbag 22 will blow air into the air blowing cover 13 through the exhaust pipe 14, and the air blowing cover 13 will blow the air flow toward the exhaust pipe 15. During this period, the air flow will pass through the inner top of the inner cover 3, thereby dissipating heat from the detection plates 5 and the probes 6 on the inner top, and blowing off the floating dust and debris generated by friction that may adhere to the probes 6. On the one hand, it improves the operating stability of the detection plates 5 and the probes 6, and on the other hand, it can reduce the influence of floating dust on the test. When the inner cover 3 moves downward, the inner cover 3 will stretch the expansion airbag 22, and the expansion airbag 22 will suck air through the air suction pipe 17.

[0068] In actual use, the produced wafers can be sequentially placed on the belt of the conveyor belt 31, and the conveyor belt 31 can move the wafers to the lower part of the inner cover 3 through the belt, so as to facilitate the testing work of the wafers. When the suction pipe 17 sucks air, the suction pipe 17 sucks air from the suction hood 24, and the suction hood 24 sucks air from the through groove at the lower end of the cover plate 23. The through groove sucks air through the openings at both ends. When the wafer is located at the lower end of the cover plate 23, the airflow passing through the through groove can carry away the floating dust that may remain on the wafer, prevent the floating dust from affecting the test, and can also dissipate heat from the wafer to prevent the remaining heat from affecting the test accuracy.

[0069] When the inner cover 3 moves downward to the limit position, the inner cover 3 will also press against the pressure plate 27, and the pressure plate 27 will drive the two vertical plates 29 to move downward. The two vertical plates 29 will finally abut against the belt of the conveyor belt 31, thereby automatically blocking both sides of the through groove. Therefore, when the suction hood 24 sucks air, the through groove at the lower end of the cover plate 23 can only suck air through the suction pipe 25, so that the airflow can flow more comprehensively over the surface of the wafer, so as to improve the cleaning and heat dissipation effects on the wafer. Moreover, the suction pipe 25 and the filter element 26 in the suction hood 24 can also filter out dust to prevent the dust from contaminating the expansion airbag 22. When the inner cover 3 resets upward, the second spring 28 will drive the pressure plate 27 and the vertical plate 29 to move upward and reset.

[0070] The above is only a preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution and inventive concept of the present invention, makes equivalent substitutions or changes, and should be covered by the protection scope of the present invention.

Claims

1. A wafer testing device, comprising a bracket (1), characterized in that, Further included are: An outer cover (2) with an open bottom, fixedly connected to the bracket (1), wherein, a lifting device (12) is fixedly installed on the inner top of the outer cover (2), a cylindrical inner cover (3) is fixedly installed at the telescopic end of the lifting device (12), and the opening of the inner cover (3) faces downward; A plurality of detection plates (5) circumferentially distributed inside the inner cover (3), wherein, a probe (6) is installed on the detection plate (5), the probe (6) of one of the detection plates (5) faces downward, and an adjusting part for driving a plurality of probes (6) to revolve around the axis of the inner cover (3) is provided on the inner cover (3). When the inner cover (3) moves upward to the limit position, a plurality of the detection plates (5) synchronously rotate by a fixed angle around the axis of the inner cover (3); The adjusting part includes a rotating shaft (7) rotatably connected to the inner wall of the inner cover (3), a turntable (4) is fixedly installed on the rotating shaft (7), and a plurality of the detection plates (5) are installed on the circumferential outer wall of the turntable (4), wherein, a worm gear (8) is fixedly installed at one end of the rotating shaft (7), a worm (9) meshingly connected to the worm gear (8) is rotatably installed on the outer wall of the inner cover (3), and a linkage part for driving the worm (9) to rotate is provided on the inner wall of the outer cover (2); The linkage part includes a rack (11) fixedly installed on the inner wall of the outer cover (2), a driven gear (10) is installed at the shaft end of the worm (9) through a one-way bearing. When the inner cover (3) moves upward to the limit position, the driven gear (10) meshes with the rack (11).

2. The wafer testing device according to claim 1, wherein Two sides of the upper end of the inner cover (3) are respectively fixedly connected with a blowing hood (13) and an exhaust pipe (15). The blowing hood (13) and the exhaust pipe (15) are both communicated with the inner cover (3), and the exhaust end of the blowing hood (13) and the input end of the exhaust pipe (15) both face the detection plate (5) at the top of the inner cover (3).

3. The wafer testing device according to claim 2, characterized in that, A telescopic airbag (22) is installed between the top of the inner cover (3) and the inner top of the outer cover (2). An air suction pipe (17) and an exhaust pipe (14) communicated with the telescopic airbag (22) are fixedly connected to the telescopic airbag (22). One-way valves are fixedly installed in both the air suction pipe (17) and the exhaust pipe (14), and the exhaust end of the exhaust pipe (14) extends into the blowing hood (13).

4. A wafer testing device according to claim 2, wherein A sliding hole (18) is provided on the outer wall of the turntable (4), a sliding column (19) is slidably connected in the sliding hole (18), the detection plate (5) is fixedly installed on the sliding column (19), and the sliding column (19) is elastically connected to the inner wall of the sliding hole (18) through a first spring (20).

5. A wafer testing device according to claim 4, wherein The outer cover (2) is provided with a plurality of equally spaced strip-shaped grooves (16). The end of the exhaust pipe (15) is attached to the inner wall of the outer cover (2). When the inner cover (3) moves up and down, the exhaust pipe (15) will sequentially slide over a plurality of strip-shaped grooves (16). A triangular block (21) is fixedly connected to the detection plate (5), and the two inclined surfaces of the triangular block (21) respectively face the exhaust pipe (15) and the blowing hood (13).

6. The wafer testing device according to claim 3, characterized in that, A conveyor belt (31) is fixedly installed on the bracket (1), a cover plate (23) is fixedly connected to the conveyor belt (31), a through groove is formed between the cover plate (23), the side plates of the conveyor belt (31), and the belt, and an air suction pipe (25) and an air suction hood (24) are respectively fixedly connected to both sides of the conveyor belt (31). Among them, both the air suction pipe (25) and the air suction hood (24) are communicated with the through groove, the end of the air suction pipe (17) extends into the air suction hood (24), and filter elements (26) are fixedly installed in both the air suction hood (24) and the air suction pipe (25).

7. A wafer testing device according to claim 6, characterized in that, Installation grooves (30) are provided on both sides of the upper end of the cover plate (23), vertical plates (29) are longitudinally slidably installed in the two installation grooves (30), a pressing plate (27) is fixedly connected to the upper ends of the two vertical plates (29), a second spring (28) is installed between the pressing plate (27) and the cover plate (23), and when the inner cover (3) moves downward to the limit position, the two vertical plates (29) will respectively block the two ports of the through groove.

8. A wafer testing method using the wafer testing device according to any one of claims 1-7, characterized in that, The operation steps are as follows: Step 1: Place the wafer to be tested below the inner cover (3). Step 2: Move the inner cover (3) downward until the downward-facing probe (6) touches the wafer below. Step 3: After the test is completed, move the inner cover (3) upward and replace the wafer. Step 4: When the inner cover (3) moves upward to the limit position, replace another set of probes (6) and set them downward. Step 5: Repeat Steps 2 to 4 to complete the testing of all wafers.

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