Multi-chip integrated circuit packaging device

Abstract

The present invention discloses a multi-chip integrated circuit packaging device, including an integrated circuit packaging device body, a group of frame PADs are fixed around the bottom of the integrated circuit packaging device body, three groups of pins extend from the bottom of the integrated circuit packaging device body; a group of IC chips are connected to the internal position of the frame PAD, a group of ceramic substrates are arranged at the bottom of the IC chip, and a group of special-shaped copper substrates are covered on the outer side of the ceramic substrate; a group of heat sinks for heat dissipation are arranged on the left and right sides of the frame PAD. The multi-chip integrated circuit packaging device increases a silver-plated area at a fixed position while keeping the traditional packaging size unchanged, designs a special structure inside the frame, and seals the IC chip and the MOS chip at different positions. The MOS chip is interconnected with the silver-plated area through wirebond technology, the pins are silver-plated, and two solder joints are connected to the external pins, and the product function is realized according to the internal circuit connection method.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuit packaging devices, in particular to a multi-chip integrated circuit packaging device. Background Art

[0002] With the improvement of modern living standards, all walks of life have higher and higher requirements for energy conservation and emission reduction, and the corresponding functional integration and application scope of various electrical equipment have also put forward higher requirements. Traditional electronic components have single functions, and their size and energy consumption are relatively high, which do not meet the current market demand for low power consumption and multiple applications. Through redesign, more circuits and chips can be integrated without changing the original package, so that the product can be more flexible and have a wider application field. This is a technical problem that technicians in the semiconductor field need to solve urgently:

[0003] The DFN integrated circuit packaging device disclosed by publication number CN208923107U has a sink matching the chip in the middle of the heat dissipation pad, so that when mounting the chip, the staff can put the silver paste in the sink and install the corresponding chip into the sink; at this time, the lower part of the chip is embedded in the sink, not only the bottom of the chip can be bonded to the bottom of the sink through the formed silver paste layer, but also the side wall of the lower part of the chip can be bonded to the inner wall of the cofferdam part outside the sink through the silver paste layer, not only the contact area between the chip and the silver paste layer is increased, but also the contact area between the silver paste layer and the heat dissipation pad is increased, so that more heat is conducted between the chip and the silver paste layer and between the silver paste layer and the heat dissipation pad per unit time, thereby improving the heat dissipation effect of the DFN packaged semiconductor device; when the integrated circuit packaging device is in use, the integration level of its internal module chip is low, more functions are realized, and more space cannot be used.

[0004] Another example is a cover plate for integrated circuit packaging and an integrated circuit packaging device disclosed in publication number CN209216947U. The cover plate for the integrated circuit packaging includes a box body, a chip module is arranged in the box body, and a cover plate is packaged at the opening of the box body. The cover plate is a cover plate for integrated circuit packaging in any of the aforementioned implementation methods. The solder layer is melted and welded to the periphery of the opening. The packaging process is performed through the set cover plate. At this time, the pins are exposed after packaging, which makes it easy for the pins to collide outside, resulting in deformation of the pins.

[0005] Therefore, we propose a multi-chip integrated circuit packaging device to solve the above problems. Summary of the invention

[0006] The purpose of the present invention is to provide a multi-chip integrated circuit packaging device to solve the problem raised by the above-mentioned background technology that the integrated circuit packaging devices currently on the market have a low degree of integration of internal module chips when in use, cannot realize more functions, cannot use more space, and the pins are exposed after packaging, which makes the pins easy to collide after being exposed, causing the pins to deform.

[0007] To achieve the above-mentioned object, the present invention provides the following technical solutions: a multi-chip integrated circuit packaging device, comprising an integrated circuit packaging device body, a group of frame PADs are fixed around the bottom of the integrated circuit packaging device body, and three groups of pins extend from the bottom of the integrated circuit packaging device body;

[0008] A group of IC chips are connected to the inner position of the frame PAD, a group of ceramic substrates are arranged at the bottom position of the IC chip, a group of special-shaped copper substrates are covered on the outer position of the ceramic substrate, a group of copper substrates are connected to the inner position of the ceramic substrate, a MOS chip is arranged in the inner position of the copper substrate, and a group of resistors are installed on one side of the copper substrate close to the MOS chip;

[0009] A group of protective mechanisms are arranged at the bottom of the integrated circuit packaging device body, and the cooperation of the protective mechanisms realizes the protection treatment of the outer side of the pins. A group of heat sinks are arranged on the left and right sides of the frame PAD for heat dissipation treatment.

[0010] Preferably, the inner wall position at the top of the frame PAD is silver-plated by electroplating process, and the thickness of the coating is 2-5um. The top and bottom of the IC chip, the upper inner side of the copper substrate arranged on the inner side of the ceramic substrate, and the outer upper end of the pin are also silver-plated by electroplating process. The outer side of the frame PAD is fixed to the top position of the ceramic substrate by soldering agent.

[0011] Preferably, the special-shaped copper substrate covering the outside of the ceramic substrate is used as a conductive medium to connect different functional areas, and waterproof grooves are added around the frame PAD and the periphery of the pins to increase the adhesion after packaging and block the entry of water vapor, thereby improving the reliability level.

[0012] Preferably, the MOS chip is rotated 45° and mounted using silver paste to reduce the risk of wire collision, shorten the wire length, reduce costs, and facilitate welding. The IC chip and the MOS chip are connected using copper wire BSOB and BBOS welding processes.

[0013] Preferably, the silver-plated position on the inner wall of the top of the frame PAD is connected to the silver-plated position on the upper end of the IC chip through a welding wire, the silver-plated position on the lower end of the IC chip is connected to the silver-plated position on the upper inner side of the copper substrate arranged on the inner side of the ceramic substrate through a welding wire, one side of the bottom of the MOS chip is connected to a group of pins through a welding wire, and one side of the MOS chip is connected to another group of pins through a group of welding wires.

[0014] Preferably, a group of reinforcing ribs are welded to the inner position of the pin, and the protective mechanism includes a sliding connection base arranged at the bottom of the integrated circuit packaging device body, a group of sliding frames are fixed to the corners around the top of the connection base, and a group of empty grooves are formed between the sliding frames and adjacent sliding frames, and a group of connecting guide rods are fixed to the outer position of the sliding frame, and the outer side of the connecting guide rods is slidingly arranged at the inner position of the frame PAD, and the inner position of the frame PAD is provided with a guide groove that is convenient for the sliding processing of the sliding frame, so that the pins can be protected.

[0015] Preferably, the length of the sliding frame is greater than the length of the pin, a limiting groove is provided on the outer side of the connecting guide rod, a group of embedding strips are slidably arranged inside the limiting groove, and the embedding strips form a snap-fit ​​structure with the inside of the connecting guide rod through the limiting groove, so that the embedding strips can be snapped into the internal position of the limiting groove.

[0016] Preferably, a group of oblique bars are fixed on the inner side of the sliding frame, the outer side of the oblique bars is fitted to one side of the docking block, one end of the docking block is fixed to one side of the heat sink, a connecting guide plate is fixed to the rear side of the heat sink, the other end of the connecting guide plate is fixed to the outer side of the heat conducting plate, the outer side of the heat conducting plate slides into the inner position of the frame PAD, and the inner side of the heat sink is fixed to the inner position of the frame PAD by a rubber column, so that the range of the heat sink can be adjusted.

[0017] Preferably, the side of the docking block in contact with the bevel bar is set as a bevel, the heat sink, connecting guide plate and heat conducting plate are integrated, and the heat sink forms an elastic sliding structure with the inside of the frame PAD through the rubber column, which can enable the heat sink to slide stably.

[0018] Compared with the prior art, the beneficial effects of the present invention are as follows: the multi-chip integrated circuit packaging device increases the silver-plated area at a fixed position while keeping the traditional packaging size unchanged, designs a special structure inside the frame, and seals the IC chip and the MOS chip at different positions. The MOS chip is interconnected with the silver-plated area through the wirebond technology, the pins are silver-plated, and the two solder joints are connected to the external pins. The product functions are realized according to the internal circuit connection method. The specific contents are as follows:

[0019] 1. Using the latest process design packaging technology, we can achieve the integration of multiple circuits without changing the packaging space, which is more flexible and has a wider application field;

[0020] Furthermore, waterproof grooves are added around the frame PAD and the periphery of the pins to increase the adhesive force after packaging and block the entry of water vapor, thereby improving the reliability level;

[0021] Furthermore, the MOS chip is rotated 45 degrees and mounted with silver paste, which reduces the risk of wire collision, shortens the wire length, reduces costs, and facilitates welding connection processing;

[0022] 2. A protection component is provided, which includes a connecting base, a sliding frame provided at the top of the connecting base, and the sliding frame sliding inside the guide groove to realize the sliding of the connecting base, and the connecting base and the sliding frame are matched to protect the pins provided inside;

[0023] Furthermore, a reinforcing rib is provided, and the reinforcing rib is welded inside the tube pin, so that the tube pin has better anti-deformation ability;

[0024] 3. A heat sink is provided. By moving the oblique strip, the outer side of the oblique strip can squeeze one side of the docking block, so that the heat sink, the connecting guide plate and the heat conducting plate are arranged to extend and move through the rubber column, thereby expanding the heat dissipation range of the docking block. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the main structure of the present invention;

[0026] Figure 2 This is a schematic diagram of the main cross-sectional structure of the ceramic plate of the present invention;

[0027] Figure 3 This is a schematic diagram of IC chip connection of the present invention;

[0028] Figure 4 This is a schematic diagram of the state after the connecting base of the present invention is extended;

[0029] Figure 5 This is a schematic diagram of the main cross-sectional structure after the present invention is extended;

[0030] Figure 6 This is a schematic diagram of the main structure of the connecting guide rod of the present invention;

[0031] Figure 7 It is a schematic diagram of the local structure of the sliding frame of the present invention;

[0032] Figure 8 This is a schematic diagram of the main structure of the heat sink of the present invention;

[0033] Fig. 9For the present invention Figure 8 Enlarged structural diagram at A in the middle.

[0034] In the figure: 1. Integrated circuit package device body; 2. frame PAD; 3. IC chip; 4. ceramic substrate; 5. copper substrate; 6. MOS chip; 7. resistor; 8. pin; 9. reinforcing rib; 10. connecting base; 11. sliding frame; 12. connecting guide rod; 13. empty slot; 14. limiting slot; 15. embedding strip; 16. guide slot; 17. oblique strip; 18. docking block; 19. heat sink; 20. connecting guide plate; 21. heat conducting plate; 22. rubber column. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0036] See also Figure 1-Figure 9 , the present invention provides the following technical solutions:

[0037] Embodiment 1: In order to solve the problem that the integrated circuit packaging device on the market currently has a low integration level of its internal module chip when in use and cannot realize more functions, please refer to the attached Figure 1 -Attached Figure 3, including an integrated circuit package device body 1, a group of frames PAD2 are fixed around the bottom of the integrated circuit package device body 1, and three groups of pins 8 extend from the bottom of the integrated circuit package device body 1; a group of IC chips 3 are connected to the internal position of the frame PAD2, a group of ceramic substrates 4 are arranged at the bottom of the IC chip 3, the outer position of the ceramic substrate 4 is covered with a group of special-shaped copper substrates 5, the inner position of the ceramic substrate 4 is connected to a group of copper substrates 5, a MOS chip 6 is arranged in the inner position of the copper substrate 5, and a group of resistors 7 are installed on the side of the copper substrate 5 close to the MOS chip 6; the inner wall position of the top of the frame PAD2 is silver-plated by electroplating process, and the thickness of the plating layer is 2-5um, the top and bottom of the IC chip 3, the upper inner side of the copper substrate 5 arranged on the inner side of the ceramic substrate 4, and the outer side of the upper end of the pin 8 are also silver-plated by electroplating process, and the outer position of the frame PAD2 is fixed to the top position of the ceramic substrate 4 by solder. The special-shaped copper substrate 5 covered on the outside of the ceramic substrate 4 is used as a conductive medium to connect different functional areas. Waterproof grooves are added around the frame PAD2 and the periphery of the pins 8 to increase the bonding force after packaging and prevent the entry of water vapor, thereby improving the reliability level. The MOS chip 6 is rotated 45° and bonded with silver paste to reduce the risk of wire collision, shorten the wire length and reduce costs, and facilitate welding. The connection method between the IC chip 3 and the MOS chip 6 is copper wire BSOB and BBOS welding. The silver-plated position on the top inner wall of the frame PAD2 is connected to the upper silver-plated position of the IC chip 3 through a welding wire, and the lower silver-plated position of the IC chip 3 is connected to the silver-plated position on the upper inner side of the copper substrate 5 set on the inner side of the ceramic substrate 4 through a welding wire. The bottom side of the MOS chip 6 is connected to a group of pins 8 through a welding wire, and one side of the MOS chip 6 is connected to another group of pins 8 through a group of welding wires. Since the IC chip 3 has EDS protection and the MOS chip 6 is integrated as a power module of the driving element, the integration of multiple circuits is realized without changing the packaging space, which has a more flexible and broader application field. By adding a silver-plated area at a fixed position without changing the traditional packaging size, a special structure is designed inside the frame, and the IC chip 3 and the MOS chip 6 are sealed at different positions. The MOS chip 6 is interconnected through wirebond technology and the silver-plated area, the pin 8 is silver-plated, and two solder joints are connected to the external pin 8. In addition, the hole opened on the top of the integrated circuit packaging device body 1 is used to facilitate docking and fixing processing, and the product function is realized according to the internal circuit connection method, the integration level of the module chip is improved, more functions are realized, and it is adapted to richer application scenarios.

[0038] Embodiment 2: In order to provide protection for the pins 8 extending from the bottom of the integrated circuit package device body 1, please refer to the attached Figure 4 -Attached Figure 7A group of protective mechanisms are arranged at the bottom of the integrated circuit package device body 1. The protective mechanisms are arranged in coordination to protect the outer side of the pin 8. A group of heat sinks 19 for heat dissipation are arranged at the left and right sides of the frame PAD2. A group of reinforcing ribs 9 are welded at the inner position of the pin 8. The protective mechanism includes a sliding connection base 10 arranged at the bottom of the integrated circuit package device body 1. A group of sliding frames 11 are fixed at the corner positions of the top of the connection base 10. A group of empty grooves 13 are formed between the sliding frames 11 and the adjacent sliding frames 11. A group of connecting guide rods 12 are fixed at the outer position of the sliding frame 11. The outer side of the connecting guide rod 12 is slidingly arranged at the inner position of the frame PAD2. A guide groove 16 for sliding the sliding frame 11 is provided at the inner position of the frame PAD2. The length of the sliding frame 11 is greater than the length of the pin 8. A limiting groove 14 is arranged at the outer side of the connecting guide rod 12. A group of embedded strips 15 are slidingly arranged inside the limiting groove 14. The embedded strips 15 form a snap-fit ​​structure with the inner part of the connecting guide rod 12 through the limiting groove 14. When protecting the pin 8, the connecting base 10 is moved downward so that the sliding frame 11 fixed on the top of the connecting base 10 moves inside the guide groove 16. When the sliding frame 11 moves to the maximum range at the bottom of the frame PAD2, the inner position of the four groups of sliding frames 11 will protect the pin 8, and the four groups of embedded strips 15 are moved inside the frame PAD2 so that the outer side of the embedded strips 15 will extend into the limiting groove 14 opened on the surface of the connecting guide rod 12, so that the connecting guide rod 12 and the sliding frame 11 can be limited. The inner pin 8 is protected by the connecting base 10, the sliding frame 11 and the connecting guide rod 12, thereby solving the problem that the pins are exposed after packaging, which makes the pins easy to collide outside.

[0039] Embodiment 3: This embodiment is different from Embodiment 2 in that the heat dissipation effect of the nuclear device is increased based on the technology of Embodiment 1. A group of inclined bars 17 are fixed to the inner side of the sliding frame 11. The outer side of the inclined bars 17 is attached to one side of the docking block 18. One end of the docking block 18 is fixed to one side of the heat sink 19. A connecting guide plate 20 is fixed to the rear side of the heat sink 19. The other end of the connecting guide plate 20 is fixed to the outer side of the heat conducting plate 21. The outer side of the heat conducting plate 21 slides and extends into the inner position of the frame PAD2. The inner side of the heat sink 19 is fixed to the inner position of the frame PAD2 through a rubber column 22. The side of the docking block 18 that contacts the inclined bars 17 is an inclined surface. The heat sink 19, the connecting guide plate 20 and the heat conducting plate 21 are integrated. The heat sink 19 forms an elastic sliding structure with the inside of the frame PAD2 through the rubber column 22. When the sliding frame 11 slides stably, the bevel bar 17 arranged at the inner side of the sliding frame 11 will also move, so that the docking block 18 arranged at the outer side of the bevel bar 17 will also move. Since the docking block 18 and the heat sink 19 are integrated, the heat sink 19 will move through the extrusion between the docking block 18 and the bevel bar 17, and the rubber column 22 on one side of the heat sink 19 slides stably inside the integrated circuit packaging device body 1, so that the end of the heat sink 19 extending out of the outside of the frame PAD2 is extended, and the heat generated by the module designed inside the frame PAD2 will be transferred through the heat conducting plate 21 and the connecting guide plate 20, and the heat is dissipated through the heat sink 19. Through the coordinated setting of the docking block 18, the area of ​​the heat sink 19 on the outside of the frame PAD2 will become larger, thereby increasing the heat dissipation effect of the device.

[0040] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

[0041] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed", "provided with", etc. should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

Claims

1. A multi-chip integrated circuit package device, comprising an integrated circuit package device body (1), a group of frame PADs (2) being fixed around the bottom of the integrated circuit package device body (1), and three groups of pins (8) extending from the bottom of the integrated circuit package device body (1); Features: A group of IC chips (3) are connected to the inner position of the frame PAD (2); a group of ceramic substrates (4) are arranged at the bottom position of the IC chip (3); a group of special-shaped copper substrates (5) are covered on the outer position of the ceramic substrate (4); a group of copper substrates (5) are connected to the inner position of the ceramic substrate (4); a MOS chip (6) is arranged inside the copper substrate (5); and a group of resistors (7) are installed on one side of the copper substrate (5) close to the MOS chip (6); A group of protective mechanisms are arranged at the bottom of the integrated circuit package device body (1), and the protective mechanisms are arranged in coordination to protect the outer sides of the pins (8). A group of heat sinks (19) are arranged on the left and right sides of the frame PAD (2) to facilitate heat dissipation. A group of reinforcing ribs (9) are welded to the inner position of the pin (8); the protective mechanism comprises a sliding connection base (10) arranged at the bottom of the integrated circuit packaging device body (1); a group of sliding frames (11) are fixed to the corner positions around the top of the connection base (10); a group of empty grooves (13) are formed between the sliding frames (11) and adjacent sliding frames (11); a group of connecting guide rods (12) are fixed to the outer position of the sliding frame (11); the outer side of the connecting guide rods (12) are slidingly arranged at the inner position of the frame PAD (2); and a guide groove (16) is provided at the inner position of the frame PAD (2) to facilitate the sliding processing of the sliding frame (11); The length of the sliding frame (11) is greater than the length of the pin (8); a limiting groove (14) is provided on the outer side of the connecting guide rod (12); a group of embedding strips (15) are slidably arranged inside the limiting groove (14); the embedding strips (15) form a snap-fit ​​structure with the inside of the connecting guide rod (12) through the limiting groove (14); A group of inclined strips (17) are fixed to the inner side of the sliding frame (11), the outer side of the inclined strips (17) is fitted to one side of the docking block (18), one end of the docking block (18) is fixed to one side of the heat sink (19), a connecting guide plate (20) is fixed to the rear side of the heat sink (19), the other end of the connecting guide plate (20) is fixed to the outer side of the heat conduction plate (21), the outer side of the heat conduction plate (21) slides and extends into the inner side of the frame PAD (2), and the inner side of the heat sink (19) is fixed to the inner side of the frame PAD (2) via a rubber column (22).

2. The multi-chip integrated circuit package device according to claim 1, characterized in that: The inner wall position of the top of the frame PAD (2) is plated with silver by electroplating, and the thickness of the plated layer is 2-5 um. The top and bottom of the IC chip (3), the upper inner side of the copper substrate (5) arranged on the inner side of the ceramic substrate (4), and the outer upper end of the pin (8) are also plated with silver by electroplating. The outer side of the frame PAD (2) is fixed to the top of the ceramic substrate (4) by soldering agent.

3. The multi-chip integrated circuit package device according to claim 1, characterized in that: The special-shaped copper substrate (5) covered on the outside of the ceramic substrate (4) is used as a conductive medium to connect different functional areas. Waterproof grooves are added around the frame PAD (2) and the periphery of the pins (8) to increase the adhesive force after packaging and block the entry of water vapor to improve the reliability level.

4. The multi-chip integrated circuit package device according to claim 1, characterized in that: The MOS chip (6) is rotated 45 degrees and mounted by silver paste bonding, thereby reducing the risk of wire collision, shortening the wire length, reducing costs, and facilitating welding. The IC chip (3) and the MOS chip (6) are connected by copper wire BSOB and BBOS welding processes.

5. The multi-chip integrated circuit package device according to claim 1, characterized in that: The silver-plated position on the inner wall of the top of the frame PAD (2) is connected to the silver-plated position on the upper end of the IC chip (3) via a welding wire, the silver-plated position on the lower end of the IC chip (3) is connected to the silver-plated position on the upper inner side of the copper substrate (5) arranged on the inner side of the ceramic substrate (4) via a welding wire, the bottom side of the MOS chip (6) is connected to a group of pins (8) via a welding wire, and one side of the MOS chip (6) is connected to another group of pins (8) via a group of welding wires.

6. The multi-chip integrated circuit package device according to claim 1, characterized in that: The side of the docking block (18) that contacts the oblique strip (17) is arranged as an inclined surface, the heat sink (19), the connecting guide plate (20) and the heat conducting plate (21) are arranged as an integrated whole, and the heat sink (19) forms an elastic sliding structure with the inside of the frame PAD (2) via the rubber column (22).

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