A laminated filter capacitor chip packaging structure

Abstract

The invention discloses a stacked filter capacitor chip packaging structure, which relates to the technical field of chip packaging, comprising a frame body, and also comprising a sliding pin, which penetrates through and is slidably installed on the bottom of the frame body, a connecting rod is fixedly installed on the top of the sliding pin, an elastic element is arranged between the top of the sliding pin and the inner side wall of the bottom of the frame body, a first chip is placed on the top of the sliding pin, a partition is placed on the top of the first chip, a silicone hole is fixedly installed on the partition, and a second chip is placed on the top of the partition, by providing sliding pins and cover plates, the elastic force of the elastic element is used to ensure good contact, which is convenient for staff to install and disassemble, and simplifies the operation, and at the same time, a partition is provided to effectively reduce heat conduction between chips, improve the reliability and performance stability of the equipment, and at the same time, a positioning mechanism is provided to provide a good positioning effect, and a heat dissipation mechanism is provided to achieve the effect of first gathering heat and then dissipating heat, thereby improving the overall heat dissipation efficiency.

Description

Technical Field

[0001] The invention relates to the technical field of chip packaging, and in particular to a stacked filter capacitor chip packaging structure. Background Art

[0002] The packaging of the filter refers to the installation of the filter circuit components or elements in a physical package for easy integration into a larger electronic system. The filter can be a circuit composed of capacitors, inductors, and resistors, which is used for the selective transmission or blocking of specific frequency components. Stacked filters usually use stacked chip technology. This technology allows multiple filters, usually filters with different frequency bandwidths, to be integrated into one physical package to achieve a more efficient and compact circuit design. Stacked chips can reduce space usage in the system and improve the efficiency and performance of signal processing.

[0003] In the prior art, during the packaging process of stacked chips, the connections between chips are mostly fixed. After long-term use, especially in some high-frequency applications or electromagnetic environment systems, the close connection between chips can easily lead to high thermal conductivity between chips. High thermal conductivity can easily cause electromagnetic interference (EMI) problems, thereby affecting the performance stability of the equipment. Summary of the invention

[0004] The present invention aims to provide a stacked filter capacitor chip packaging structure to solve the problem of high heat conduction between chips in some high-frequency applications or electromagnetic environment systems.

[0005] The present invention is achieved through the following technical solutions:

[0006] A laminated filter capacitor chip packaging structure includes a frame body and further includes:

[0007] A sliding pin passes through and is slidably installed at the bottom of the frame, a connecting rod is fixedly installed on the top of the sliding pin, an elastic element is provided between the top of the sliding pin and the inner wall of the bottom of the frame, a first chip is placed on the top of the sliding pin, a partition is placed on the top of the first chip, a silicone hole is fixedly installed on the partition, a second chip is placed on the top of the partition, the partition is composed of a middle supporting plate and support rods extending outward on the left and right sides, the silicone holes are provided on the support rods of the partition, and a partition is provided to effectively reduce heat conduction between chips and improve the reliability and performance stability of the equipment.

[0008] Furthermore, a cover plate is detachably connected to the top of the frame by bolts, a limiting column is fixedly installed on the bottom of the cover plate, and the bottom of the limiting column is configured to be semicircular, so that the triangular shape allows the direction of pressure provided by the limiting column to be stable.

[0009] Furthermore, there are three limiting columns, and the three limiting columns are distributed in a triangular shape.

[0010] Furthermore, a positioning mechanism is also provided in the frame, and the positioning mechanism includes a positioning plate. The positioning plate is fixedly installed on the inner wall of the frame, a groove hole is provided on the positioning plate, a slide groove is provided in the middle supporting plate of the partition, and a card plate is slidably installed on the slide groove, and the positioning plate provides a good positioning effect.

[0011] Furthermore, the positioning plate is composed of smooth curved ends at the top and bottom and a smooth straight plate in the middle section, and the card plate is composed of a slide plate and control plates extending on the left and right sides. An elastic element is provided between the card plate and the inner wall of the slide groove. The position of the partition can be fixed by utilizing the clamping effect of the card plate and the groove hole to prevent sliding due to external movement.

[0012] Furthermore, a heat dissipation mechanism is also provided in the frame, and the heat dissipation mechanism includes a heat collecting cover. The heat collecting cover is fixedly installed in the frame, and a heat dissipation plate is fixedly installed on the outer wall of the heat collecting cover to effectively dissipate heat to the outside and improve the overall heat dissipation efficiency.

[0013] Furthermore, the heat collecting cover is arranged on the left and right sides of the frame, the heat dissipation plate penetrates through and is fixedly installed on the frame, and the heat collecting cover is arranged on the left and right edges of the first chip and the second chip.

[0014] Furthermore, an arc plate is fixedly mounted on the inner side wall of the heat collecting cover, an arc rod is penetrated and slidably mounted on the arc plate, a limit rod is fixedly mounted on the arc rod, and the arc plate generates vibration to shake off the dust attached to itself.

[0015] Furthermore, a bending plate is rotatably mounted on the top of the heat collecting cover, an elastic element is arranged between the bending plate and the inner wall of the heat collecting cover, and the height of the heat collecting cover is greater than the height after the second chip is installed.

[0016] Furthermore, an elastic rod is fixedly installed at the bottom of the bending plate, and the bottom of the elastic rod is fixedly installed at the top of the arc rod. The outside of the limiting rod is arranged close to the outside of the arc plate to shake off dust and other impurities attached to the inner and outer surfaces of the heat collecting cover, thereby avoiding the adhesion of dust and affecting the accumulation and transfer of heat, thereby ensuring the heat transfer efficiency.

[0017] Compared with the prior art, the present invention has the following advantages and beneficial effects:

[0018] 1. The present invention is provided with a sliding pin and a partition, and the top of the sliding pin is in close contact with the bottom of the first chip by elastic force, so as to ensure good contact. It is also very convenient to disassemble and repair the first chip and the second chip. The partition can form a gap between the first chip and the second chip. This gap can effectively reduce the heat conduction between the chips, thereby improving the overall thermal management effect, improving the reliability and performance stability of the device, and can reduce the direct contact between the chips due to mechanical stress or vibration, thereby reducing the risk of accidental short circuit or damage. It is also suitable for mobile devices or devices working in a vibration environment, which helps to improve the simplicity and stability of packaging;

[0019] 2. The present invention provides a positioning mechanism, and the positioning plate provides a good positioning effect for the placement of the first chip and the second chip. During installation, the position of the partition can be fixed by the clamping effect of the clamping plate and the groove hole, thereby preventing sliding due to external movement, avoiding affecting the contact between the first chip and the second chip, and improving safety.

[0020] 3. The present invention is provided with a heat dissipation mechanism. When in use, the inner and outer surfaces of the heat collection cover are respectively designed as heat collection and heat dissipation structures, which can effectively dissipate heat to the outside while ensuring internal heat collection, thereby improving the overall heat dissipation efficiency. The curved plate can increase the surface area of ​​the surface, thereby enhancing the heat exchange capacity with the air, improving the thermal resistance, and helping to effectively concentrate the heat in the central area during the heat collection process on the inner surface of the heat collection cover, so that the hot spot of the heat collection is as close as possible to the location of the heat dissipation plate, thereby improving the heat dissipation efficiency.

[0021] 4. In the present invention, during installation, the first chip and the second chip squeeze the bending plate downward, causing the bending plate to rotate counterclockwise. The bending plate compresses the elastic rod to push the arc rod to slide clockwise. The clockwise sliding of the arc rod will drive the limit rod to follow the movement and impact the arc plate, causing the arc plate to vibrate and shake off the dust attached to itself. At the same time, the vibration will also be transmitted to the heat collecting cover, and the vibration will shake off the dust and other impurities attached to the inner and outer surfaces of the heat collecting cover, thereby preventing the attachment of dust from affecting the accumulation and transfer of heat, thereby ensuring the heat transfer efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The drawings described herein are used to provide a further understanding of the embodiments of the present invention, constitute a part of this application, and do not constitute a limitation of the embodiments of the present invention. In the drawings:

[0023] Figure 1 It is a schematic diagram of the overall external structure of the present invention;

[0024] Figure 2 It is a schematic diagram of the external structure of the cover plate from the bottom;

[0025] Figure 3 It is a schematic diagram of the local structure inside the frame;

[0026] Figure 4 This is a diagram of the external local structure viewed from above by the sliding pin;

[0027] Figure 5 This is a schematic diagram of the external local structure of the partition viewed from above;

[0028] Figure 6 It is a schematic diagram of the external structure of the positioning plate;

[0029] Figure 7 is a schematic diagram of the external structure of the partition;

[0030] Figure 8 It is a schematic diagram of the external structure of the pallet;

[0031] Fig. 9 Schematic diagram of the local structure inside the heat shield.

[0032] The reference numerals represent: 1-frame, 2-sliding pin, 3-connecting rod, 4-first chip, 5-partition, 6-silicone hole, 7-second chip, 8-cover plate, 9-limiting column, 10-positioning plate, 11-groove hole, 12-slide groove, 13-card plate, 14-heat collecting cover, 15-heat dissipation plate, 16-arc plate, 17-arc rod, 18-bending plate, 19-elastic rod, 20-limiting rod. DETAILED DESCRIPTION

[0033] In order to make the purpose, technical scheme and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the embodiments and drawings. The schematic implementation modes and descriptions of the present invention are only used to explain the present invention and are not intended to limit the present invention. It should be noted that the present invention is already in the actual development and use stage.

[0034] like Figures 1 to 9 As shown, the present invention provides a laminated filter capacitor chip packaging structure, including a frame 1, and also including:

[0035] A sliding pin 2 is penetrated and slidably installed at the bottom of the frame 1, a connecting rod 3 is fixedly installed on the top of the sliding pin 2, an elastic element is arranged between the top of the sliding pin 2 and the inner wall of the bottom of the frame 1, and a metal spring is used as the elastic element here, so that the sliding of the sliding pin 2 has elastic restoring force, so that the sliding pin 2 can fit the chip tightly due to the elastic force generated after being pressed during installation and use, a first chip 4 is placed on the top of the sliding pin 2, a partition 5 is placed on the top of the first chip 4, a silicone hole 6 is fixedly installed on the partition 5, a second chip 7 is placed on the top of the partition 5, the partition 5 is composed of a middle support plate and support rods extending outwards on the left and right sides, and the silicone hole 6 is arranged on the support rod of the partition 5;

[0036] A cover plate 8 is detachably connected to the top of the frame 1 by bolts, and a limiting column 9 is fixedly installed at the bottom of the cover plate 8. The bottom of the limiting column 9 is set to a semicircular shape to reduce the contact area and avoid damage to the chip. There are three limiting columns 9, and the three limiting columns 9 are distributed in a triangular shape, so that the triangle shape makes the pressure direction provided by the limiting column 9 stable.

[0037] In the above technical solution, when packaging the first chip 4 and the second chip 7, first open the cover 8, place the first chip 4 on the top of the sliding pin 2 at the bottom of the frame 1, then place the partition 5 on the top of the first chip 4, and the conductive bump at the bottom of the second chip 7 passes through the silicone hole 6 and is electrically connected to the top contact port of the first chip 4. At this time, the chips are placed, and then cover the cover 8. The bottom of the limiting column 9 at the bottom of the cover 8 will contact the top of the second chip 7. Then, tighten the bolts of the cover 8 to make the cover 8 gradually move downward and finally fix it. During the downward movement, the cover plate 8 will drive the limiting column 9 to move downward, and the limiting column 9 will push the second chip 7 downward, and the second chip 7 will push the partition 5 and the first chip 4 downward, and the bottom of the first chip 4 will push the sliding pin 2 to move downward. At the same time, the downward movement of the sliding pin 2 will compress the elastic element to provide an upward elastic force, so that the top of the sliding pin 2 and the bottom of the first chip 4 are in close contact with each other by elastic force to ensure good contact. When the cover plate 8 is fixed, the positions of the first chip 4 and the second chip 7 will also be stable due to the elastic force of the elastic element of the sliding pin 2. The first chip 4 and the second chip 7 are fixed, and it is also very convenient to disassemble and repair the first chip 4 and the second chip 7. It is only necessary to open the cover 8 by bolts. Due to the elastic force of the elastic element of the sliding pin 2, the first chip 4 and the second chip 7 will be partially moved upward, making it easy for the staff to take them and simplifying the disassembly operation. The partition 5 can form a gap between the first chip 4 and the second chip 7. This gap can effectively reduce the heat conduction between the chips, thereby improving the overall thermal management effect. In particular, for chips with higher power consumption, the heat generated during operation can be dissipated more effectively, which helps to reduce the chip temperature and improve the reliability and performance stability of the equipment. In addition, the setting of the partition 5 can reduce the direct contact between the chips due to mechanical stress or vibration, thereby reducing the risk of accidental short circuit or damage. It is also suitable for mobile devices or devices working in a vibration environment, which helps to improve the simplicity and stability of the package. Finally, by providing the sliding pin 2 and the cover 8, the elastic force of the elastic element is used to ensure good contact, which is convenient for the staff to install and disassemble, simplifying the operation, and at the same time, the partition 5 is provided to effectively reduce the heat conduction between the chips and improve the reliability and performance stability of the equipment.

[0038] like Figure 3 , Figure 5 , Figure 6 , Figure 7 and Figure 8 As shown, in the present invention, a positioning mechanism is also provided in the frame 1, and the positioning mechanism includes a positioning plate 10. The positioning plate 10 is fixedly installed on the inner side wall of the frame 1, and the positioning plate 10 is composed of smooth curved ends at the top and bottom and a smooth straight plate in the middle section, which is convenient for positioning operations on the front and rear sides when the chip is installed. A groove hole 11 is provided on the positioning plate 10, and a slide groove 12 is provided in the middle supporting plate of the partition 5. A card plate 13 is slidably installed on the slide groove 12. The card plate 13 is composed of a slide plate and a control plate extending on the left and right sides. An elastic element is provided between the card plate 13 and the inner side wall of the slide groove 12. The elastic element here uses a metal spring, so that the sliding of the card plate 13 has an elastic restoring force. In the absence of external force, the card plate 13 can be restored to its initial position due to the elastic force.

[0039] In the above technical scheme, when the first chip 4 is placed into the frame 1, the first chip 4 can be placed downward along the smooth curved end and the smooth straight plate of the positioning plate 10. The positioning plate 10 can prevent the first chip 4 from directly contacting the inner wall of the frame 1, thereby reducing friction damage and providing a positioning effect. After the first chip 4 is placed in, the partition 5 is placed in. At this time, the card plate 13 is moved and the control board on the moving card plate 13 moves the card plate 13 toward the center position of the partition 5, so that the card plate 13 is moved back to the inside of the middle support plate of the partition 5, and then the partition 5 is placed downward along the positioning plate 10 on the top of the first chip 4, the control board part of the card plate 13 is released, and then the second chip 7 is continued to be placed on top of the partition 5 along the positioning plate 10, and finally the cover plate 8 is covered and the cover plate 8 is moved downward and fixed by bolts. At this time, the cover plate 8 will push the second chip 7 downward through the limiting column 9, and the second chip 7 will push the partition 5 and the first chip 4 downward until the cover plate 8 When the partition 5 moves downward, the partition 5 will drive the card plate 13 to move downward along the positioning plate 10. When the partition 5 moves to the position of the groove hole 11, the position of the cover plate 8 is just fixed by the bolts and stops moving, and the card plate 13 will extend outward due to the elastic force of the elastic element, so that the card plate 13 moves outward and passes through the groove hole 11 and is stuck and cannot move up and down. The card plate 13 will limit the position of the partition 5 to the same horizontal plane of the groove hole 11 on the positioning plate 10 through the groove hole 11, which is convenient for the fixed positioning operation of the partition 5 and prevents the partition 5 from moving between the first chip 4 and the second chip 7 due to external movement. Finally, a good positioning effect is provided by the positioning plate 10, and during installation, the position of the partition 5 can be fixed by utilizing the clamping effect of the card plate 13 and the groove hole 11 to prevent sliding due to external movement, avoid affecting the contact between the first chip 4 and the second chip 7, and improve safety.

[0040] like Figure 3 , Figure 4 , Figure 5 and Fig. 9 As shown, in the present invention, a heat dissipation mechanism is further provided in the frame 1, and the heat dissipation mechanism includes a heat collecting cover 14, a heat collecting cover 14 is fixedly installed in the frame 1, and the heat collecting cover 14 is arranged on the left and right sides of the frame 1, and a heat dissipation plate 15 is fixedly installed on the outer wall of the heat collecting cover 14, and the heat dissipation plate 15 penetrates and is fixedly installed on the frame 1, and the heat collecting cover 14 is arranged at the left and right edges of the first chip 4 and the second chip 7. An arc plate 16 is fixedly installed on the inner wall of the heat collecting cover 14, and an arc rod 17 is penetrated and slidably installed on the arc plate 16, and a limited position is fixedly installed on the arc rod 17 Rod 20, a bending plate 18 is rotatably installed on the top of the heat collecting cover 14, and an elastic element is provided between the bending plate 18 and the inner wall of the heat collecting cover 14. The elastic element here uses a metal spring, so that the rotation of the bending plate 18 has an elastic restoring force. In the absence of external force, the bending plate 18 can be restored to the initial position due to the elastic force. The height of the heat collecting cover 14 is greater than the height after the second chip 7 is installed. An elastic rod 19 is fixedly installed at the bottom of the bending plate 18, and the bottom of the elastic rod 19 is fixedly installed on the top of the arc rod 17. The outside of the limit rod 20 is arranged close to the outside of the arc plate 16.

[0041] In the above technical solution, during use, the first chip 4 and the second chip 7 generate a heat flow channel due to the gap formed by the partition 5, and the heat flows toward the heat collecting cover 14 through the gap formed by the partition 5, and the heat will be gathered and collected in the inner wall of the heat collecting cover 14, and the heat will be concentrated and transferred to the heat collecting cover 14. As the heat collecting cover 14 collects heat, the heat collected on the heat collecting cover 14 can be dissipated through the heat dissipation plate 15. The inner and outer surfaces of the heat collecting cover 14 are respectively designed as heat collecting and heat dissipation structures to achieve more effective thermal energy management. In this way, while ensuring internal heat accumulation, heat can be effectively dissipated to the outside, thereby improving the overall heat dissipation efficiency. In addition, since the arc plate 16 is provided, the arc plate 16 can increase the surface area of ​​the surface, thereby enhancing the heat exchange capacity with the air, improving the thermal resistance, and facilitating the heat collection process on the inner surface of the heat collecting cover. The heat is effectively concentrated in the central area, so that the hot spot of the accumulated heat is as close as possible to the position of the heat sink 15, thereby improving the heat dissipation efficiency. At the same time, during the installation process, when the first chip 4 and the second chip 7 are placed downwardly into the frame 1, the first chip 4 and the second chip 7 will press the bending plate 18 downward, so that the bending plate 18 rotates counterclockwise, and the bending plate 18 will compress the elastic rod 19. The elastic force generated by the compression of the elastic rod 19 will push the arc rod 17 to slide clockwise, and the clockwise sliding of the arc rod 17 will drive the limit rod 20 to follow the movement, and the following movement of the limit rod 20 will impact the arc plate 16, so that the arc plate 16 vibrates to shake off the dust attached to itself, and the vibration will also be transmitted to the heat collecting cover 14, and the vibration will shake off the dust and other impurities attached to the inner and outer surfaces of the heat collecting cover 14, so as to avoid the adhesion of dust affecting the accumulation and transfer of heat, thereby ensuring the heat transfer efficiency.

[0042] To sum up, by providing a sliding pin 2 and a cover plate 8, the elastic force of the elastic element is utilized to ensure good contact, which facilitates installation and disassembly by the staff and simplifies the operation. At the same time, a partition 5 is provided to effectively reduce heat conduction between chips, thereby improving the reliability and performance stability of the equipment. At the same time, a positioning mechanism is provided to provide a good positioning effect, and a heat dissipation mechanism is provided to achieve the effect of first gathering heat and then dissipating heat, thereby improving the overall heat dissipation efficiency.

[0043] The specific implementation methods described above further illustrate the objectives, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above description is only a specific implementation method of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A laminated filter capacitor chip packaging structure, comprising a frame (1), characterized in that: Also includes: A sliding pin (2) passes through and is slidably mounted on the bottom of the frame (1); a connecting rod (3) is fixedly mounted on the top of the sliding pin (2); an elastic element is provided between the top of the sliding pin (2) and the inner side wall of the bottom of the frame (1); a first chip (4) is placed on the top of the sliding pin (2); a partition (5) is placed on the top of the first chip (4); a silicone hole (6) is fixedly mounted on the partition (5); a second chip (7) is placed on the top of the partition (5); the partition (5) is integrally composed of a middle support plate and support rods extending outwards on left and right sides; the silicone hole (6) is provided on the support rod of the partition (5); The frame (1) is also provided with a positioning mechanism, which comprises a positioning plate (10). The positioning plate (10) is fixedly mounted on the inner side wall of the frame (1), and a groove hole (11) is provided on the positioning plate (10). A slide groove (12) is provided in the middle support plate of the partition (5), and a card plate (13) is slidably mounted on the slide groove (12). The positioning plate (10) is composed of smooth curved ends at the top and bottom and a smooth straight plate in the middle section. The card plate (13) is composed of a slide plate and a control plate extending on the left and right sides. An elastic element is provided between the card plate (13) and the inner side wall of the slide groove (12).

2. The laminated filter capacitor chip packaging structure according to claim 1, characterized in that: The top of the frame (1) is detachably connected to a cover plate (8) via bolts, and a limiting column (9) is fixedly mounted on the bottom of the cover plate (8), wherein the bottom of the limiting column (9) is arranged in a semicircular shape.

3. The laminated filter capacitor chip packaging structure according to claim 2, characterized in that: The number of the limiting posts (9) is three, and the three limiting posts (9) are distributed in a triangular shape.

4. The laminated filter capacitor chip packaging structure according to claim 1, characterized in that: A heat dissipation mechanism is also provided in the frame (1), the heat dissipation mechanism comprising a heat collecting cover (14), the heat collecting cover (14) is fixedly mounted in the frame (1), and a heat dissipation plate (15) is fixedly mounted on the outer wall of the heat collecting cover (14).

5. The laminated filter capacitor chip packaging structure according to claim 4, characterized in that: The heat collecting cover (14) is arranged on the left and right sides of the frame (1); the heat dissipation plate (15) penetrates and is fixedly mounted on the frame (1); and the heat collecting cover (14) is arranged on the left and right edges of the first chip (4) and the second chip (7) where they are mounted.

6. The laminated filter capacitor chip packaging structure according to claim 5, characterized in that: An arc-shaped plate (16) is fixedly mounted on the inner side wall of the heat collecting cover (14), an arc-shaped rod (17) passes through and is slidably mounted on the arc-shaped plate (16), and a limit rod (20) is fixedly mounted on the arc-shaped rod (17).

7. The laminated filter capacitor chip packaging structure according to claim 6, characterized in that: A bending plate (18) is rotatably mounted on the top of the heat collecting cover (14), an elastic element is provided between the bending plate (18) and the inner wall of the heat collecting cover (14), and the height of the heat collecting cover (14) is greater than the height of the second chip (7) after installation.

8. The laminated filter capacitor chip packaging structure according to claim 7, characterized in that: An elastic rod (19) is fixedly mounted on the bottom of the bending plate (18), the bottom of the elastic rod (19) is fixedly mounted on the top of the arc-shaped rod (17), and the outside of the limiting rod (20) is arranged close to the outside of the arc-shaped plate (16).

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