Air and liquid mixed heat dissipation device and server

Abstract

This application provides a hybrid liquid-air cooling device and server. The device includes a liquid cooling plate, a mounting frame, a coolant inlet, a coolant outlet, and N air-cooling fins. One side of the liquid cooling plate is fixed to the mounting frame, and the other side contacts the component being cooled. The liquid cooling plate has a coolant channel within its cavity, and both ends of the coolant channel are connected to a cooling pump via a coolant inlet, a coolant outlet, and pipes, providing liquid cooling for the component. The mounting frame is equipped with air-cooling fins. The component being cooled transfers heat to the air-cooling fins, and the air-cooling fins then exchange heat with the airflow generated by a fan, thus dissipating heat from the component. By utilizing both liquid and air cooling methods to cool the component, the cooling requirements are met, and the performance requirements of the cooling pump used to deliver the coolant are reduced.

Description

Technical Field

[0001] This specification relates to the field of heat sink technology, and in particular to a wind-liquid hybrid heat sink device and server. Background Technology

[0002] As server performance continues to improve, the heat dissipation requirements for high-power components (such as CPUs and GPUs) are also increasing. Currently, liquid cooling plates are commonly used at these components, where the flowing coolant exchanges heat with the components to reduce their temperature. However, with the increasing power consumption of these components, commonly used liquid cooling plates are no longer sufficient to meet their heat dissipation needs. Summary of the Invention

[0003] To overcome the problems existing in related technologies, this specification provides a wind-liquid hybrid heat dissipation device and a server.

[0004] This application provides a wind-liquid hybrid heat dissipation device, which includes a liquid cooling plate, a fixed frame, a coolant inlet, a coolant outlet, and N air-cooling fins, where N is greater than or equal to 1.

[0005] One side of the liquid cooling plate is fixed to the mounting bracket, and the other side of the liquid cooling plate is in contact with the heat dissipation component.

[0006] The liquid cooling plate includes a cavity, and a coolant channel is provided in the cavity; the two ends of the coolant channel are respectively connected to the coolant inlet and the coolant outlet; the coolant inlet is connected to the cooling pump through a first pipe, and the coolant outlet is connected to the cooling pump through a second pipe;

[0007] The N air-cooled fins, the coolant inlet, and the coolant outlet are all fixed on the mounting frame.

[0008] Optionally, the mounting bracket is provided with a first liquid collection tank and a second liquid collection tank, the first liquid collection tank being located below the connection between the coolant inlet and the first pipeline, and the second liquid collection tank being located below the connection between the coolant outlet and the second pipeline.

[0009] Optionally, the fixing frame is also provided with a groove for connecting the first liquid collection tank and the second liquid collection tank.

[0010] Optionally, the mounting bracket includes a first through hole, a first heat exchange plate is mounted on the mounting bracket at the first through hole, and the N air-cooled fins are fixed to the first heat exchange plate of the mounting bracket;

[0011] The liquid cooling plate includes a second through hole, and a second heat exchange plate is installed at the second through hole.

[0012] Optionally, the cavity is formed by a substrate and a cover plate, and the coolant channel extends along the substrate.

[0013] Optionally, both the coolant inlet and the coolant outlet are welded to the mounting bracket.

[0014] Optionally, a first liquid absorption layer is provided in the first liquid collection tank to absorb the coolant leaking from the coolant inlet;

[0015] The second liquid collection tank is provided with a second liquid absorption layer to absorb the coolant leaking from the coolant outlet.

[0016] Optionally, leakage detection ropes are placed in the first and second liquid collection tanks;

[0017] Both ends of the leak detection rope are connected to a deployed leak alarm device so that the leak alarm device can issue a warning when it detects coolant leakage based on the resistance value of the leak detection rope.

[0018] Optionally, when the number of air-cooled fins is greater than 1, the coolant inlet is clamped between two different air-cooled fins, and the coolant outlet is clamped between two different air-cooled fins.

[0019] This application embodiment also provides a server, which includes a server housing and a fan; the server housing is provided with any of the above-mentioned air-liquid mixed heat dissipation devices.

[0020] The fan is installed in a designated location so that after the heat-dissipating element conducts heat to the air-cooling fins, the airflow generated by the fan exchanges heat with the air-cooling fins, thereby dissipating heat from the heat-dissipating element.

[0021] The beneficial effect of this application lies in providing a hybrid liquid-air cooling device and server. The device includes a liquid cooling plate, a mounting frame, a coolant inlet, a coolant outlet, and N air-cooling fins. One side of the liquid cooling plate is fixed to the mounting frame, and the other side contacts the component being cooled. The cavity of the liquid cooling plate contains coolant channels, and both ends of the coolant channels are connected to a cooling pump via coolant inlet, coolant outlet, and pipes to provide liquid cooling for the component. Air-cooling fins are installed on the mounting frame. The component being cooled transfers heat to the air-cooling fins, and then the air-cooling fins exchange heat with the airflow generated by the fan, thus dissipating heat from the component. By utilizing both liquid and air cooling methods to dissipate heat from the component, the cooling requirements are met, and the performance requirements of the cooling pump used to deliver the coolant are reduced. Attached Figure Description

[0022] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this specification and, together with the description, serve to explain the principles of this specification.

[0023] Figure 1 This is a first structural schematic diagram of a wind-liquid hybrid heat dissipation device provided in this application;

[0024] Figure 2 This is a second structural schematic diagram of a wind-liquid mixing heat dissipation device provided in this application;

[0025] Figure 3 This application provides a third structural schematic diagram of a wind-liquid hybrid heat dissipation device;

[0026] Figure 4 This is a fourth structural schematic diagram of a wind-liquid hybrid heat dissipation device provided in this application. Detailed Implementation

[0027] To enable those skilled in the art to better understand the technical solutions provided in the embodiments of this application, and to make the above-mentioned objectives, features and advantages of the embodiments of this application more apparent and understandable, the technical solutions in the embodiments of this application will be further described in detail below with reference to the accompanying drawings.

[0028] Please refer to Figure 1 , Figure 1 This is a first structural schematic diagram of a hybrid air-liquid heat dissipation device provided in this application. The hybrid air-liquid heat dissipation device includes a liquid cooling plate 1, a fixing frame 2, a coolant inlet 3, a coolant outlet, and N air-cooled fins 4, where N is greater than or equal to 1. One side of the liquid cooling plate 1 is fixed to the fixing frame 2, and the other side of the liquid cooling plate 1 is in contact with the heat dissipation component. The liquid cooling plate 1 includes a cavity, and a coolant channel is provided in the cavity. The two ends of the coolant channel are respectively connected to the coolant inlet 3 and the coolant outlet. The coolant inlet 3 is connected to the cooling pump through a first pipe, and the coolant outlet is connected to the cooling pump through a second pipe. The N air-cooled fins 4, the coolant inlet 3, and the coolant outlet are all mounted on the fixing frame 2.

[0029] To meet the heat dissipation requirements of high-power components, this application provides a hybrid air-liquid cooling device that uses both air cooling and liquid cooling to dissipate heat from the components. The hybrid air-liquid cooling device includes a liquid cooling plate 1, a mounting frame 2, a coolant inlet 3, a coolant outlet, and N air-cooling fins 4. The coolant inlet 3, coolant outlet, and N air-cooling fins 4 are all mounted on the mounting frame 2, which is mounted on the liquid cooling plate 1. When the liquid cooling plate 1 is placed above the component to be cooled, the coolant channels in the liquid cooling plate 1 and the air-cooling fins 4 on the mounting frame 2 dissipate heat from the component, i.e., a hybrid air-liquid cooling method is used to dissipate heat from the component.

[0030] Specifically, the liquid cooling plate 1 includes a cavity, and a coolant channel is provided in the cavity. The first end of the coolant channel is connected to the coolant inlet 3, and the second end of the coolant channel is connected to the coolant outlet. The coolant inlet 3 is connected to the cooling pump through a first pipe, and the coolant outlet is connected to the cooling pump through a second pipe, so that the cooling pump delivers coolant into the coolant channel and allows the coolant to flow in the coolant channel. Figure 1 Taking a cavity formed by a substrate and a cover plate as an example, a coolant channel extends along the substrate. When the liquid cooling plate 1 is placed above the heat-dissipating component, the heat-dissipating component exchanges heat with the coolant flowing in the coolant channel of the liquid cooling plate 1, thereby dissipating heat for the heat-dissipating component.

[0031] Specifically, the mounting bracket 2 is equipped with N air-cooled fins 4. When the liquid cooling plate 1 is placed above the heat-dissipating component, some of the heat generated by the heat-dissipating component is transferred to the air-cooled fins 4 through heat conduction. The air-cooled fins 4 then exchange heat with the high-speed airflow generated by the fan, thereby dissipating heat for the heat-dissipating component. This application does not impose a specific limit on the number of air-cooled fins 4 on the mounting bracket 2; the more air-cooled fins 4 there are, the better the heat dissipation effect. Considering space limitations, when the number of air-cooled fins 4 is greater than one, there may be gaps between the positions of the various air-cooled fins 4. The coolant inlet 3 can be clamped between two different air-cooled fins 4, and the coolant outlet can be clamped between two different air-cooled fins 4, thereby reducing the area occupied by the heat dissipation device and facilitating deployment.

[0032] In summary, the air-liquid hybrid cooling device provided in this application includes a liquid cooling plate, a mounting frame, a coolant inlet, a coolant outlet, and N air-cooling fins. One side of the liquid cooling plate is fixed to the mounting frame, and the other side contacts the component being cooled. The cavity of the liquid cooling plate contains coolant channels, and both ends of the coolant channels are connected to a cooling pump via coolant inlet, coolant outlet, and pipes, providing liquid cooling for the component being cooled. Air-cooling fins are installed on the mounting frame. The component being cooled transfers heat to the air-cooling fins, and then the air-cooling fins exchange heat with the airflow generated by the fan, thus dissipating heat from the component. By utilizing both liquid and air cooling methods to cool the component, the cooling requirements are met, reducing the performance requirements of the cooling pump used to deliver the coolant. The air-liquid hybrid cooling device provided in this application combines liquid and air cooling methods, improving the efficiency of cooling the component. When the power consumption of the component being cooled increases, it is not necessary to significantly increase the coolant flow rate to meet the cooling requirements, thereby reducing the requirements of the cooling pump and reducing energy consumption.

[0033] Based on the above embodiments:

[0034] As an optional embodiment, the mounting bracket 2 is provided with a first liquid collection tank 5 and a second liquid collection tank. The first liquid collection tank 5 is located below the connection between the coolant inlet 3 and the first pipeline, and the second liquid collection tank is located below the connection between the coolant outlet and the second pipeline.

[0035] This application further considers that the connection points between different components in a heat dissipation device are often the most likely places for coolant leakage. Coolant leakage may cause coolant to come into contact with the heat-dissipating components, leading to malfunction of the heat-dissipating components. For example, coolant inlet 3 is connected to the first pipe via a pagoda and clamp, and coolant outlet is connected to the second pipe via a pagoda and clamp. Leakage may occur at both the connection points between coolant inlet 3 and the first pipe, and between coolant outlet and the second pipe. To address this, this application provides a first and second coolant collection tank 5 on the mounting bracket 2 in the air-coolant mixing heat dissipation device. The first coolant collection tank 5 is located below the connection point between coolant inlet 3 and the first pipe. When leakage occurs at the connection point between coolant inlet 3 and the first pipe, the leaked coolant is collected in the first coolant collection tank 5, preventing the leaked coolant from overflowing onto the heat-dissipating components and improving the overall safety and reliability of the equipment. The second coolant collection tank is located below the connection between the coolant outlet and the second pipeline. In the event of a leak at this connection, the leaked coolant is collected in the second collection tank, preventing it from overflowing onto the heat-dissipating components and improving the overall safety and reliability of the equipment. The first and second collection tanks also facilitate the collection and cleaning of coolant by maintenance personnel.

[0036] Furthermore, this application also provides a groove on the mounting bracket for connecting the first liquid collection tank 5 and the second liquid collection tank, thereby increasing the leakage capacity. The groove can be arranged around the periphery of the N air-cooling fins 4, for example, in... Figure 1 The air-liquid mixing heat dissipation device shown has grooves on the periphery of the two air-cooled fins 4 that can connect the first liquid collection tank 5 and the second liquid collection tank.

[0037] Based on the above embodiments:

[0038] As an optional embodiment, the mounting bracket 2 includes a first through hole, at which a first heat exchange plate is installed, and N air-cooled fins 4 are fixed on the first heat exchange plate of the mounting bracket 2; the liquid-cooled plate 1 includes a second through hole, at which a second heat exchange plate is installed.

[0039] In the air-liquid hybrid cooling device provided in this application, air cooling is achieved based on the heat exchange between the air-cooled fins 4 and the element being cooled. To improve the heat conduction efficiency between the air-cooled fins 4 and the element being cooled, in this embodiment, the mounting bracket 2 includes a first through hole, and the liquid-cooled plate 1 includes a second through hole. A first heat exchange plate is installed at the first through hole, and a second heat exchange plate is installed at the second through hole. When the liquid-cooled plate 1 is placed above the element being cooled, the element being cooled first exchanges heat with the second heat exchange plate, and then the second heat exchange plate exchanges heat with the air-cooled fins 4. Finally, the heat from the air-cooled fins 4 is carried away by the high-speed airflow generated by the fan, achieving efficient heat dissipation for the element being cooled. This application does not specifically limit the material of the heat exchange plate, as long as the heat conduction efficiency of the heat exchange plate is higher than that of the liquid-cooled plate 1 and the substrate. The specific material can be selected according to the actual situation.

[0040] In addition, when the first through hole on the fixing frame 2 and the second through hole on the liquid cooling plate 1 are in the same position and size, an integrated heat exchange plate can be used to replace the first heat exchange plate and the second heat exchange plate. The integrated heat exchange plate can be placed directly in the first through hole on the fixing frame 2 and the second through hole on the liquid cooling plate 1.

[0041] As an optional embodiment, the mounting bracket 2 is made of the same material as the liquid cooling plate 1, and the mounting bracket 2 is welded to the liquid cooling plate 1.

[0042] In the air-liquid hybrid cooling device provided in this application, the coolant inlet 3, coolant outlet, and air-cooled fins 4 are mounted on a fixed frame 2, which is mounted on a liquid cooling plate 1. The coolant inlet 3 and outlet on the fixed frame 2 supply coolant to the coolant channels in the liquid cooling plate 1, while the air-cooled fins 4 on the fixed frame 2 facilitate heat exchange with the components being cooled. The material of the fixed frame 2 can be the same as that of the liquid cooling plate 1, and the liquid cooling plate 1 and the fixed frame 2 are connected by welding, thereby improving the overall stability and reliability of the cooling device. Furthermore, the coolant inlet 3 and the coolant outlet can also be welded onto the fixed frame 2, reducing leakage at the connection points and further improving the overall reliability of the cooling device.

[0043] As an optional embodiment, the material of the mounting bracket 2 is different from that of the liquid cooling plate 1; both the mounting bracket 2 and the liquid cooling plate 1 are provided with mounting holes, and the mounting bracket 2 is mounted on the liquid cooling plate 1 by setting mounting components in the mounting holes of the mounting bracket 2 and the mounting holes of the liquid cooling plate 1.

[0044] In this embodiment, the material of the mounting bracket 2 is different from that of the liquid cooling plate 1. For example, the liquid cooling plate 1 is made of copper, while the mounting bracket 2 is made of a lower-cost material, reducing the overall cost of the heat dissipation device. In this case, the mounting bracket 2 and the liquid cooling plate 1 can be connected through mounting holes and mounting components. Mounting holes are provided on both the mounting bracket 2 and the liquid cooling plate 1. The mounting bracket 2 is mounted on the liquid cooling plate 1 by setting mounting components in the mounting holes of the mounting bracket 2 and the liquid cooling plate 1. For example, mounting pins are set in the mounting holes of the mounting bracket 2 and the liquid cooling plate 1. This ensures the structural reliability of the heat dissipation device while reducing costs.

[0045] As an optional embodiment, a first liquid-absorbing layer is provided in the first liquid collection tank 5 to absorb the coolant leaking from the coolant inlet 3; a second liquid-absorbing layer is provided in the second liquid collection tank to absorb the coolant leaking from the coolant outlet.

[0046] In this embodiment, a first liquid-absorbing layer is provided in the first liquid collection tank 5, and a second liquid-absorbing layer is provided in the second liquid collection tank. Taking the first liquid-absorbing layer as an example, when leakage occurs at the connection between the coolant inlet 3 and the first pipeline, the leaked coolant drips onto the first liquid-absorbing layer. On the one hand, this prevents the leaked coolant from overflowing from the first liquid collection tank 5, thereby preventing the coolant from contacting the heat-dissipating components and ensuring their safety; on the other hand, it also collects the coolant leaking from the connection between the coolant inlet 3 and the first pipeline, so that personnel can collect and handle the leak. The second liquid-absorbing layer has a similar function to the first liquid-absorbing layer, and will not be described in detail here.

[0047] As an optional embodiment, a leakage detection rope 6 is placed in the first liquid collection tank 5 and the second liquid collection tank;

[0048] Both ends of the leak detection rope 6 are connected to the deployed leak alarm device so that the leak alarm device can issue a warning when it detects coolant leakage based on the resistance value of the leak detection rope 6.

[0049] Please refer to Figure 2 , Figure 2 This is a second structural schematic diagram of a cooling device using a combination of air and liquid cooling provided in this application. In this embodiment, a leak detection rope 6 is placed in both the first and second liquid collection tanks. The leak detection rope 6 is a leak detection device based on the principle of liquid conductivity. When the leak detection rope 6 is wetted by coolant, the two signal lines in the leak detection rope 6 short-circuit, and the resistance of the leak detection rope 6 decreases significantly. Taking the leak detection rope 6 in the first liquid collection tank 5 as an example, when a leak occurs at the connection between the coolant inlet 3 and the first pipeline, the leak detection rope 6 becomes wetted by coolant, causing a change in its resistance. When the leak alarm device detects the change in resistance of the leak detection rope 6, it issues a warning to prompt personnel to promptly address the component at the location of the leak and prevent further damage to the heat-dissipating components by the coolant.

[0050] In addition, please refer to Figure 3 , Figure 3 This is a third structural diagram of a hybrid air-liquid cooling device provided in this application. The leakage alarm device is located inside the server and can reuse the server's original processor as the leakage alarm device. Please refer to... Figure 4 , Figure 4 This is a fourth structural diagram of a wind-liquid hybrid heat dissipation device provided in this application. The leakage alarm device can also be additionally located outside the server. This application does not impose any particular limitation on this.

[0051] This application also provides a server, including a server housing and a fan; the server housing is provided with any of the above-mentioned air-liquid cooling devices.

[0052] The fan is installed in a designated location so that the heat from the heat-dissipating component can be transferred to the air-cooling fins 4. The airflow generated by the fan then exchanges heat with the air-cooling fins 4, thereby dissipating heat from the heat-dissipating component.

[0053] The server provided in this application includes a server housing and a fan. The server housing is provided with the air-liquid hybrid heat dissipation device described in the above embodiment. The fan is installed at a designated position on the server. When the fan is installed near the air-cooled fins 4 in the air-liquid hybrid heat dissipation device, the fan has a better heat dissipation effect on the air-cooled fins 4, thereby improving the efficiency of the air-cooled fins 4 in dissipating heat for the heat-dissipated components.

[0054] In this specification, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0055] The above description of the disclosed embodiments enables those skilled in the art to make or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A hybrid air-liquid cooling device, characterized by, The device includes a liquid cooling plate, a fixed frame, a coolant inlet, a coolant outlet, and N air-cooled fins, where N is greater than or equal to 1. One side of the liquid cooling plate is fixed to the mounting bracket, and the other side of the liquid cooling plate is in contact with the heat dissipation component. The liquid cooling plate includes a cavity, and a coolant channel is provided in the cavity; the two ends of the coolant channel are respectively connected to the coolant inlet and the coolant outlet; the coolant inlet is connected to the cooling pump through a first pipe, and the coolant outlet is connected to the cooling pump through a second pipe; The N air-cooled fins, the coolant inlet, and the coolant outlet are all fixed on the mounting frame; The mounting bracket includes a first through hole, and the liquid cooling plate includes a second through hole. An integral heat exchange plate is placed in the first through hole on the mounting bracket and the second through hole on the liquid cooling plate. The N air-cooled fins are fixed to the heat exchange plate of the mounting bracket. The heat transfer efficiency of the heat exchange plate is higher than that of the liquid cooling plate. When the mounting bracket and the liquid cooling plate are made of the same material, the mounting bracket is welded to the liquid cooling plate. When the mounting bracket and the liquid cooling plate are made of different materials, mounting holes are provided on both the mounting bracket and the liquid cooling plate. The mounting bracket is mounted on the liquid cooling plate by installing mounting components in the mounting holes of the mounting bracket and the mounting holes of the liquid cooling plate. When the number of air-cooled fins is greater than 1, the coolant inlet is clamped between two different air-cooled fins, and the coolant outlet is clamped between two different air-cooled fins.

2. The air-liquid mixing heat dissipation device according to claim 1, characterized in that, The mounting bracket is provided with a first liquid collection tank and a second liquid collection tank. The first liquid collection tank is located below the connection between the coolant inlet and the first pipeline, and the second liquid collection tank is located below the connection between the coolant outlet and the second pipeline.

3. The air-liquid mixing heat dissipation device according to claim 2, characterized in that, The mounting bracket is also provided with a groove for connecting the first liquid collection tank and the second liquid collection tank.

4. The air-liquid mixing heat dissipation device according to claim 1, characterized in that, The cavity is formed by a substrate and a cover plate, and the coolant channel extends along the substrate.

5. The air-liquid mixing heat dissipation device according to claim 1, characterized in that, Both the coolant inlet and the coolant outlet are welded to the mounting bracket.

6. The air-liquid mixing heat dissipation device according to claim 2, characterized in that, The first liquid collection tank is provided with a first liquid absorption layer to absorb the coolant leaking from the coolant inlet; The second liquid collection tank is provided with a second liquid absorption layer to absorb the coolant leaking from the coolant outlet.

7. The air-liquid mixing heat dissipation device according to claim 2, characterized in that, Leakage detection ropes are placed inside the first and second liquid collection tanks; Both ends of the leak detection rope are connected to a deployed leak alarm device so that the leak alarm device can issue a warning when it detects coolant leakage based on the resistance value of the leak detection rope.

8. A server, characterized in that, Includes a server housing and a fan; the server housing is provided with a cooling device as described in any one of claims 1 to 7; The fan is installed in a designated location so that after the heat-dissipating element conducts heat to the air-cooling fins, the airflow generated by the fan exchanges heat with the air-cooling fins, thereby dissipating heat from the heat-dissipating element.

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