A secondary forming processing device for integrated circuit pins

Abstract

The present invention discloses an integrated circuit pin secondary molding processing device, which relates to the field of integrated circuit molding technology, and comprises a support seat, the upper surface of the support seat is fixedly connected with a loading platform, the tail of the loading platform is fixedly connected with a molding platform, and the upper surface side of the molding platform is fixedly connected with an auxiliary frame, a cylinder is arranged at the center of the auxiliary frame, and an extrusion molding plate is fixedly connected to the output end of the cylinder. In the integrated circuit pin secondary molding processing device, when the integrated circuit workpiece slides on the loading platform, the extrusion airbag will be extruded synchronously, and the gas inside the extrusion airbag will be transported to the inside of the gas storage frame through the air supply pipe, and sprayed outward through the air blowing pipe arranged on the inner side of the gas storage frame, so as to further clean the sliding integrated circuit workpiece and reduce the influence of dust on subsequent impact operations.

Description

Technical Field

[0001] The invention relates to the technical field of integrated circuit molding, and in particular to an integrated circuit pin secondary molding processing device. Background Art

[0002] IC pins are the connections between the internal circuit of an IC (chip) and the peripheral circuit. They constitute the interface of the chip and are the basis for circuit connection and signal transmission. IC pins are the bridge for IC to connect and communicate with external circuits. Their functions and connection methods are crucial for circuit design, debugging and maintenance.

[0003] When processing and forming integrated circuits, the stamping force needs to be precisely controlled. If the stamping force is too large, the stamping force will cause damage to the integrated circuit board, thereby increasing the scrap rate of the product.

[0004] In order to overcome the above-mentioned defects, prior art 1 (publication number: CN118283931A, Chinese patent with publication date of 2024.07.02) is an integrated circuit forming device, which belongs to the field of integrated circuit technology, including a base, a gantry plate, an equipment mounting plate, a processing table, a driving assembly and a fixing assembly, wherein the gantry plate is arranged on the base and the two ends of the gantry plate are arranged close to the two sides of the base, the equipment mounting plate is fixedly arranged on the lower wall of the gantry plate, and several groups of punching devices are arranged at equal intervals on the equipment mounting plate, the processing table is arranged on the base, and several groups of positioning plates are arranged on the processing table, and positioning grooves are arranged on the positioning plates of several groups, and two groups of driving assemblies are provided, and the two groups of driving assemblies are respectively arranged close to the two sides of the processing table, and the output ends of the two groups of driving assemblies are connected with two groups of movable push plates, the movable push plates are arranged above the processing table, and the two groups of movable push plates are symmetrically arranged on both sides of the positioning plate, the fixing assembly is symmetrically arranged on the movable push plate and is arranged close to the positioning plate. A cavity is also provided in the processing table, and a push-up assembly and a dust suction assembly are provided in the cavity.

[0005] There is also prior art 2 (publication number: CN208258185U, a Chinese patent with a publication date of December 18, 2018) an integrated circuit board processing device, whose structure includes an azimuth adjuster, a tin feeding mechanism, a support frame, a working plate, a support panel, a support foot, a control button, an adjustment knob, a power transmission line, and a power transmission line. The utility model is an integrated circuit board processing device, which is provided with an azimuth adjuster. First, the power is received through a transmission joint, and the power is transmitted to the upper end of the lifting rod. The lifting rod receives the power to lift and lower, driving the translational working head at the bottom. The translational working head is mutually transmitted by the thread provided on the upper end and the thread of the outer ring of the transmission gear, and is parallel to the left and right. Buffer plates are provided on the left and right sides for buffering and shock absorption, so that the equipment can automatically control the processing, and perform left and right processing and welding, and upper and lower pressure control, thereby improving the processing and production efficiency of the equipment.

[0006] Although the existing technologies 1 and 2 can perform buffering and shock absorption treatment on the stamping, the existing equipment cannot clean the integrated circuit workpiece before stamping. The dust adheres to the surface of the integrated circuit workpiece, which will have a certain impact on the subsequent stamping and forming.

[0007] Therefore, we propose an integrated circuit pin secondary molding processing device to solve the above-mentioned problems. Summary of the invention

[0008] The purpose of the present invention is to provide an integrated circuit pin secondary molding processing device to solve the problem in the current market raised by the above background technology that the integrated circuit workpiece cannot be cleaned before stamping, and dust adheres to the surface of the integrated circuit workpiece, which will have a certain impact on the subsequent stamping and molding.

[0009] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: an integrated circuit pin secondary molding processing device, comprising a support seat, the upper surface of the support seat is fixedly connected to a feeding platform, the tail of the feeding platform is fixedly connected to a molding platform, and the upper surface side of the molding platform is fixedly connected to an auxiliary frame, a cylinder is arranged at the center of the auxiliary frame, and an output end of the cylinder is fixedly connected to an extrusion molding plate;

[0010] A fixed side plate, the fixed side plate is fixedly connected to the side of the loading platform, and the upper surface of the fixed side plate is rotatably connected to a rotating shaft, and the upper end of the rotating shaft is fixedly connected to an air storage frame, and a dust cleaning mechanism is provided between the inner side of the air storage frame and the loading platform to clean the dust on the surface of the integrated circuit being delivered;

[0011] A shock-absorbing pad is fixedly connected to the inner side of the forming platform, and a buffer plate is arranged on the inner side of the forming platform. A protective mechanism is arranged between the inner side of the buffer plate and the shock-absorbing pad to buffer the pins of the integrated circuit board during stamping.

[0012] Preferably, an auxiliary plate is fixedly connected to the side of the upper surface of the loading platform, and a movable groove is opened on the inner side of the auxiliary plate, and an auxiliary wheel is nested and connected inside the movable groove.

[0013] Preferably, the movable groove is opened transversely along the auxiliary plate, the diameter of the auxiliary wheel is larger than the maximum width of the auxiliary plate, and the loading platform is inclined at 45°.

[0014] Preferably, the dust cleaning mechanism includes an extrusion airbag, which is fixedly connected to the upper surface of the auxiliary plate, and an air supply pipe is connected through the upper surface of the extrusion airbag and the upper surface of the air storage frame, and an air blowing pipe is connected through the inner center of the air storage frame;

[0015] A butt joint pipe is connected through the center of the outer side of the extrusion airbag, and a sleeve is nested and connected to the outer side of the butt joint pipe, and a return spring is fixedly connected between the inner side of the sleeve and the outer side of the extrusion airbag, and a push rod is fixedly connected to the outer side of the sleeve;

[0016] A push plate is fixedly connected to the side of the gas storage frame, a torsion spring is fixedly connected between the lower surface of the push plate and the upper surface of the fixed side plate, and the outer end of the push rod is hinged to the inner side of the push plate.

[0017] Preferably, the sleeve forms a sliding structure with the docking tube by squeezing the gas inside the airbag, the sleeve forms an elastic structure with the squeezing airbag through a return spring, the squeezing airbag is connected to the air storage frame through an air supply pipe, and the connecting end of the air supply pipe and the air storage frame is made of flexible material.

[0018] Preferably, the inner end of the push rod forms a rotating structure with the push plate through a sleeve, the air storage frame forms an elastic structure with a torsion spring and a fixed side plate, and two groups of extrusion airbags are symmetrically arranged about the center point of the air storage frame.

[0019] Preferably, the protective mechanism includes a sliding rod, which is nested and connected to the side of the shock-absorbing pad, and the outer end of the sliding rod is hinged with a rotating rod, and the other end of the rotating rod is hinged to the outer side of the buffer plate, and a buffer spring is fixedly connected between the outer side of the buffer plate and the inner side of the shock-absorbing pad.

[0020] Preferably, the buffer plate is disposed symmetrically about the center point of the forming platform, and the buffer plate and the forming platform form an elastic structure through buffer springs, and three groups of buffer springs are transversely disposed outside the buffer plate.

[0021] Preferably, the rotating rod forms a rotating structure through the buffer plate and the sliding rod, and the sliding rod forms a sliding structure through the rotating rod and the shock-absorbing pad, and two groups of sliding rods are symmetrically arranged about the center point of the shock-absorbing pad.

[0022] Compared with the prior art, the present invention has the following beneficial effects:

[0023] The staff can pre-arrange the integrated circuit workpiece on the loading platform. Since the loading platform is designed to be inclined at 45 degrees, gravity is used to realize the unloading of the integrated circuit workpiece. At the same time, when the integrated circuit workpiece slides down under the action of gravity, it will drive the auxiliary wheel to rotate. At this time, the auxiliary wheel will assist in limiting the integrated circuit workpiece, so that the integrated circuit workpiece can move down stably. When the integrated circuit workpiece enters the forming platform, the cylinder can be started at this time, so that the cylinder drives the extrusion forming plate to extrude the integrated circuit workpiece, and completes the pressing and bending operation of the pins on the surface of the circuit board;

[0024] When the integrated circuit workpiece slides on the loading platform, the extrusion airbag will be squeezed synchronously. At this time, the gas inside the extrusion airbag will be transported to the inside of the gas storage frame through the gas supply pipe, and will be ejected outward through the air blowing pipe arranged on the inner side of the gas storage frame, so as to further clean the sliding integrated circuit workpiece and reduce the influence of dust on subsequent impact operations;

[0025] When the integrated circuit workpiece moves, it contacts a single extrusion airbag in turn, so that the two groups of extrusion airbags are indirectly squeezed by the integrated circuit workpiece. When the extrusion airbag is squeezed, the gas inside it will be synchronously transported to the inside of the sleeve through the docking tube. At this time, the sleeve will move outward along the docking tube under the push of the gas. At the same time, when the sleeve moves, it will drive the push rod to move, so that the push rod pushes the push plate to rotate. Due to the flexible contact between the air supply pipe and the air storage frame, the push plate will further drive the air storage frame to rotate, and the air storage frame will synchronously drive the air blowing pipe to rotate, thereby expanding the air blowing range;

[0026] When the extrusion airbag is not squeezed, the sleeve is not stressed and resets under the elastic force of the reset spring, thereby driving the synchronous swing reset of the air storage frame. At this time, the air storage frame can swing back and forth with the movement of the integrated circuit workpiece, further improving the dust cleaning effect;

[0027] When the extrusion forming plate is punching the integrated circuit workpiece, the integrated circuit workpiece will squeeze the buffer plate, and the buffer plate will be forced to move toward the side of the forming platform. At this time, the buffer plate will synchronously squeeze the rotating rod, so that the rotating rod will rotate and drive the sliding rod to slide inside the shock-absorbing pad. Under the limiting action of the sliding rod, the buffer plate can move stably and squeeze the buffer spring. The buffer spring and the shock-absorbing pad cooperate with each other to protect the outside of the pin of the integrated circuit workpiece, avoid damage to the integrated circuit board caused by the stamping force, and protect the integrated circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0029] Figure 2 This is a schematic diagram of the three-dimensional structure of the feeding platform of the present invention;

[0030] Figure 3 It is a schematic diagram of the three-dimensional structure of the extruded airbag of the present invention;

[0031] Figure 4 It is a schematic diagram of the three-dimensional structure of the gas storage frame of the present invention;

[0032] Figure 5 It is a schematic diagram of the three-dimensional cross-sectional structure of the casing of the present invention;

[0033] Figure 6It is a schematic diagram of the three-dimensional structure of the forming platform of the present invention;

[0034] Figure 7 This is a schematic diagram of the three-dimensional structure of the buffer plate of the present invention;

[0035] Figure 8 It is a schematic diagram of the three-dimensional structure of the shock-absorbing pad of the present invention;

[0036] Fig. 9 It is a schematic diagram of the three-dimensional cross-sectional structure of the shock-absorbing pad of the present invention.

[0037] In the figure: 1. support seat; 2. feeding platform; 3. auxiliary plate; 4. auxiliary wheel; 5. forming platform; 6. auxiliary frame; 7. cylinder; 8. extrusion forming plate; 9. extrusion airbag; 10. push plate; 11. fixed side plate; 12. rotating shaft; 13. torsion spring; 14. air storage frame; 15. blowing pipe; 16. docking pipe; 17. sleeve; 18. push rod; 19. air supply pipe; 20. movable groove; 21. reset spring; 22. buffer plate; 23. buffer spring; 24. rotating rod; 25. sliding rod; 26. shock pad. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0039] Embodiment 1: Figure 1 , Figure 2 and Figure 3 The technical solution shown in the figure, the present invention provides the following technical solution: an integrated circuit pin secondary molding processing device, discloses a loading platform 2, the loading platform 2 is inclined to use gravity to realize the discharge of integrated circuit workpieces:

[0040] A support base 1, a feeding platform 2 is fixedly connected to the upper surface of the support base 1, a molding platform 5 is fixedly connected to the tail of the feeding platform 2, an auxiliary frame 6 is fixedly connected to the side of the upper surface of the molding platform 5, a cylinder 7 is arranged at the center of the auxiliary frame 6, and an extrusion molding plate 8 is fixedly connected to the output end of the cylinder 7;

[0041] An auxiliary plate 3 is fixedly connected to the upper surface side of the loading platform 2, and a movable groove 20 is opened on the inner side of the auxiliary plate 3, and an auxiliary wheel 4 is nested and connected inside the movable groove 20. The movable groove 20 is opened horizontally along the auxiliary plate 3, and the diameter of the auxiliary wheel 4 is larger than the maximum width of the auxiliary plate 3. The loading platform 2 is inclined at 45°.

[0042] After the pins of the integrated circuit workpiece are preliminarily processed, the pins of some workpieces need to be subjected to secondary extrusion molding. The staff can pre-arrange the integrated circuit workpiece on the loading platform 2. Since the loading platform 2 is designed to be inclined at 45 degrees, gravity is used to realize the unloading of the integrated circuit workpiece. At the same time, when the integrated circuit workpiece slides down under the action of gravity, it will drive the auxiliary wheel 4 to rotate. At this time, the auxiliary wheel 4 will assist in limiting the integrated circuit workpiece, so that the integrated circuit workpiece can move down stably. When the integrated circuit workpiece enters the molding platform 5, the cylinder 7 can be started at this time, so that the cylinder 7 drives the extrusion molding plate 8 to extrude the integrated circuit workpiece, and press and bend the pins on the surface of the circuit board to complete the secondary stamping molding of the integrated circuit pins.

[0043] Embodiment 2: Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 The technical solution shown in the figure, the present invention provides the following technical solution: an integrated circuit pin secondary molding processing device, discloses a dust cleaning mechanism, through which the dust on the surface of the integrated circuit being transported out can be cleaned:

[0044] A fixed side plate 11 is fixedly connected to the side of the loading platform 2, and the upper surface of the fixed side plate 11 is rotatably connected to a rotating shaft 12, and the upper end of the rotating shaft 12 is fixedly connected to an air storage frame 14, and a dust cleaning mechanism is provided between the inner side of the air storage frame 14 and the loading platform 2 to clean the dust on the surface of the integrated circuit being transported out;

[0045] The dust cleaning mechanism includes an extrusion airbag 9, which is fixedly connected to the upper surface of the auxiliary plate 3, and an air supply pipe 19 is connected between the upper surface of the extrusion airbag 9 and the upper surface of the air storage frame 14, and an air blowing pipe 15 is connected through the inner center of the air storage frame 14, a butt joint pipe 16 is connected through the outer center of the extrusion airbag 9, and a sleeve 17 is nested and connected to the outer side of the butt joint pipe 16, and a return spring 21 is fixedly connected between the inner side of the sleeve 17 and the outer side of the extrusion airbag 9, and a push rod 18 is fixedly connected to the outer side of the sleeve 17, and a push plate 10 is fixedly connected to the side of the air storage frame 14, a torsion spring 13 is fixedly connected between the lower surface of the push plate 10 and the upper surface of the fixed side plate 11, and the outer end of the push rod 18 is hinged to the inner side of the push plate 10;

[0046] The sleeve 17 forms a sliding structure with the docking tube 16 by squeezing the gas inside the airbag 9, the sleeve 17 forms an elastic structure with the squeezing airbag 9 through the reset spring 21, the squeezing airbag 9 is connected with the air storage frame 14 through the air supply pipe 19, the connecting end of the air supply pipe 19 and the air storage frame 14 is made of flexible material, the inner end of the push rod 18 forms a rotating structure with the push plate 10 through the sleeve 17, the air storage frame 14 forms an elastic structure with the fixed side plate 11 through the torsion spring 13, and two groups of squeezing airbags 9 are symmetrically arranged about the center point of the air storage frame 14.

[0047] When the integrated circuit workpiece slides on the loading platform 2, the extrusion airbag 9 will be squeezed synchronously. At this time, the gas inside the extrusion airbag 9 will be transported to the inside of the gas storage frame 14 through the air supply pipe 19, and will be ejected outward through the air blowing pipe 15 arranged on the inner side of the gas storage frame 14, so as to further clean the sliding integrated circuit workpiece and reduce the influence of dust on subsequent impact operations. When the integrated circuit workpiece moves, it contacts a single extrusion airbag 9 in turn, so that the two groups of extrusion airbags 9 are indirectly squeezed by the integrated circuit workpiece. When the extrusion airbag 9 is squeezed, the gas inside it will be synchronously transported to the inside of the sleeve 17 through the docking pipe 16. At this time, the sleeve 17 is in the air Under the push of the body, it will move outward along the docking tube 16. At the same time, the sleeve 17 will drive the push rod 18 to move while moving, so that the push rod 18 pushes the push plate 10 to rotate. Due to the flexible contact between the air supply pipe 19 and the air storage frame 14, the push plate 10 will further drive the air storage frame 14 to rotate, and the air storage frame 14 will synchronously drive the blowing pipe 15 to rotate, thereby expanding the blowing range. When the extrusion airbag 9 is not squeezed, the sleeve 17 is not subjected to force at this time, and resets under the elastic force of the reset spring 21, thereby driving the synchronous swing reset of the air storage frame 14. At this time, the air storage frame 14 can swing back and forth with the movement of the integrated circuit workpiece, thereby further improving the cleaning effect.

[0048] Embodiment 3: Figure 1 , Figure 6 , Figure 7 , Figure 8 and Fig. 9 The technical solution shown in the figure, the present invention provides the following technical solution: an integrated circuit pin secondary molding processing device, discloses a protection mechanism, through which the integrated circuit board pin can be buffered during stamping:

[0049] Shock-absorbing pad 26, which is fixedly connected to the inner side of the molding platform 5, and a buffer plate 22 is provided on the inner side of the molding platform 5, and a protective mechanism is provided between the inner side of the buffer plate 22 and the shock-absorbing pad 26 to buffer the pins of the integrated circuit board during stamping;

[0050] The protective mechanism includes a sliding rod 25, which is nested and connected to the side of the shock-absorbing pad 26, and the outer end of the sliding rod 25 is hinged with a rotating rod 24, and the other end of the rotating rod 24 is hinged to the outer side of the buffer plate 22, and a buffer spring 23 is fixedly connected between the outer side of the buffer plate 22 and the inner side of the shock-absorbing pad 26. The buffer plate 22 is symmetrically arranged about the center point of the forming platform 5, and the buffer plate 22 forms an elastic structure with the forming platform 5 through the buffer spring 23. Three groups of buffer springs 23 are laterally arranged on the outer side of the buffer plate 22, and the rotating rod 24 forms a rotating structure with the sliding rod 25 through the buffer plate 22, and the sliding rod 25 forms a sliding structure with the shock-absorbing pad 26 through the rotating rod 24, and the sliding rod 25 is symmetrically arranged in two groups about the center point of the shock-absorbing pad 26.

[0051] When the extrusion molding plate 8 is performing a stamping operation on the integrated circuit workpiece, the integrated circuit workpiece will squeeze the buffer plate 22, and the buffer plate 22 will be forced to move toward the side of the forming platform 5. At this time, the buffer plate 22 will synchronously squeeze the rotating rod 24, so that the rotating rod 24 rotates and drives the sliding rod 25 to slide inside the shock-absorbing pad 26. Under the limiting action of the sliding rod 25, the buffer plate 22 can move stably and squeeze the buffer spring 23. The buffer spring 23 and the shock-absorbing pad 26 cooperate with each other to protect the outer side of the pin of the integrated circuit workpiece, avoid damage to the integrated circuit board caused by the stamping force, and protect the integrated circuit board.

[0052] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An integrated circuit pin secondary molding processing device, comprising a support seat (1), the upper surface of the support seat (1) is fixedly connected to a loading platform (2), the tail of the loading platform (2) is fixedly connected to a molding platform (5), and the upper surface side of the molding platform (5) is fixedly connected to an auxiliary frame (6), a cylinder (7) is arranged at the center of the auxiliary frame (6), and an extrusion molding plate (8) is fixedly connected to the output end of the cylinder (7); It is characterized in that Also includes: A fixed side plate (11) is fixedly connected to the side of the loading platform (2), and the upper surface of the fixed side plate (11) is rotatably connected to a rotating shaft (12), and the upper end of the rotating shaft (12) is fixedly connected to an air storage frame (14), and a dust cleaning mechanism capable of cleaning dust on the surface of the integrated circuit being delivered is provided between the inner side of the air storage frame (14) and the loading platform (2); an auxiliary plate (3) is fixedly connected to the side of the upper surface of the loading platform (2), and a movable groove ( The movable groove (20) is provided with an auxiliary wheel (4) nested inside the movable groove (20), the dust cleaning mechanism comprises an extrusion airbag (9), the extrusion airbag (9) is fixedly connected to the upper surface of the auxiliary plate (3), an air supply pipe (19) is connected through the upper surface of the extrusion airbag (9) and the upper surface of the air storage frame (14), and an air blowing pipe (15) is connected through the inner center of the air storage frame (14); a butt joint pipe (16) is connected through the outer center of the extrusion airbag (9), and the outer side of the butt joint pipe (16) is nested and connected. A sleeve (17) is connected, and a return spring (21) is fixedly connected between the inner side of the sleeve (17) and the outer side of the extrusion airbag (9), and a push rod (18) is fixedly connected to the outer side of the sleeve (17); a push plate (10) is fixedly connected to the side of the air storage frame (14), a torsion spring (13) is fixedly connected between the lower surface of the push plate (10) and the upper surface of the fixed side plate (11), the outer end of the push rod (18) is hinged to the inner side of the push plate (10), and the sleeve (17) is fixedly connected to the outer side of the extrusion airbag (9) by the extrusion airbag (9). The gas inside and the butt joint (16) form a sliding structure, the sleeve (17) and the extrusion airbag (9) form an elastic structure through a return spring (21), the extrusion airbag (9) is connected to the air storage frame (14) through an air supply pipe (19), the connection end of the air supply pipe (19) and the air storage frame (14) is supported by a flexible material, the air storage frame (14) forms an elastic structure with a fixed side plate (11) through a torsion spring (13), and two groups of the extrusion airbags (9) are symmetrically arranged about the center point of the air storage frame (14). A shock absorbing pad (26) is fixedly connected to the inner side of the molding platform (5), and a buffer plate (22) is provided on the inner side of the molding platform (5), and a protective mechanism capable of buffering the pins of the integrated circuit board during stamping is provided between the inner side of the buffer plate (22) and the shock absorbing pad (26).

2. The integrated circuit pin secondary molding processing device according to claim 1, characterized in that: The movable groove (20) is opened transversely along the auxiliary plate (3); the diameter of the auxiliary wheel (4) is greater than the maximum width of the auxiliary plate (3); and the loading platform (2) is arranged to be inclined at 45°.

3. The integrated circuit pin secondary molding processing device according to claim 1, characterized in that: The protective mechanism comprises a sliding rod (25), the sliding rod (25) being nested and connected to the side of the shock-absorbing pad (26), and a rotating rod (24) being hinged at the outer end of the sliding rod (25), and the other end of the rotating rod (24) being hinged at the outer side of the buffer plate (22), and a buffer spring (23) being fixedly connected between the outer side of the buffer plate (22) and the inner side of the shock-absorbing pad (26).

4. The integrated circuit pin secondary molding processing device according to claim 3, characterized in that: The buffer plate (22) is disposed symmetrically with respect to the center point of the forming platform (5); the buffer plate (22) and the forming platform (5) form an elastic structure via buffer springs (23); and three groups of buffer springs (23) are disposed transversely on the outside of the buffer plate (22).

5. The integrated circuit pin secondary molding processing device according to claim 3, characterized in that: The sliding rods (25) are arranged in two groups symmetrically about the center point of the shock-absorbing pad (26).

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