A heat dissipation device for the nozzle of a 3D printer

Abstract

The present invention discloses a heat dissipation device for a 3D printer nozzle, which relates to the technical field of 3D printers. It includes an L-shaped plate. A nozzle mechanism is fixedly installed on the top of the L-shaped plate. A heat dissipation mechanism is arranged on the outer surface of the nozzle mechanism. A cleaning mechanism is arranged on one side of the outer wall of the L-shaped plate. It is characterized in that: the nozzle mechanism includes a heat dissipation aluminum block. An input pipe is fixedly communicated with the top of the heat dissipation aluminum block. A throat pipe is arranged inside the heat dissipation aluminum block. A heating aluminum block is fixedly sleeved at the bottom of the throat pipe. The heat dissipation mechanism is composed of a semiconductor refrigeration sheet and a cooling box. The cooling box completely covers the outer surface of the heat dissipation aluminum block, and the inside of the cooling box is filled with a coolant. When the cold end of the semiconductor refrigeration sheet cools the cooling box, it will also cool the coolant inside it, so as to achieve the heat dissipation effect on the heat dissipation aluminum block. The semiconductor refrigeration sheet is small in volume, and both the production cost and the use cost are very low, so it is very suitable for the nozzles of 3D printers with a small volume.

Description

Technical Field

[0001] The present invention relates to the technical field of 3D printers, and specifically to a heat dissipation device for a 3D printer nozzle. Background Technique

[0002] As one of the core components of a 3D printer, the nozzle of a 3D printer largely determines the quality of forming. The smoothness of the filament flowing out of the extrusion nozzle and the temperature of the filament extrusion directly affect the accuracy of the 3D printed model. However, if the nozzle temperature is too high, it will cause other components to dissolve and burn. After the printing is completed, it needs to be quickly cooled. Therefore, a heat dissipation device is required to control the nozzle temperature within a certain range. At present, usually a heat dissipation fan is installed at the nozzle, that is, air cooling is used to dissipate heat from the nozzle. However, during the printing process, the vibration generated by the operation of the heat dissipation fan will seriously affect the stability of the 3D printer.

[0003] In the prior art, such as a heat dissipation device for a 3D printer nozzle with a Chinese patent application number: CN113681889 A, which includes a fixed table; a support plate sleeved outside the nozzle; a composite shock-absorbing connection structure arranged between the support plate and the fixed table; a circumferential rotation device arranged on the support plate; and a temperature reduction component for circumferentially cooling the nozzle, arranged on the moving part of the circumferential rotation device, and driven by the circumferential rotation device, rotates around the nozzle circumferentially. Through the drive of the circumferential rotation device, the temperature reduction component rotates around the nozzle circumferentially, realizing circumferential cooling of the nozzle, making the nozzle heat dissipation balanced. At the same time, through the composite shock-absorbing connection structure, the seismic performance of the structure is enhanced, so as not to affect the printing work of the nozzle. The overall structure of the present invention is reliable and has strong practicability, worthy of promotion.

[0004] In the above patent, although the device can achieve cooling around the nozzle through the temperature reduction component, the device realizes the cooling effect through an air compressor. The air compressor not only has a large volume, but also has a high production cost and excessive energy consumption during use, and is not suitable for the nozzles of smaller 3D printers. Therefore, a new 3D printer heat dissipation device is needed. Summary of the Invention

[0005] The purpose of the present invention is to provide a heat dissipation device for a 3D printer to solve the problem that in the above background, the device can achieve cooling around the nozzle through the temperature reduction component, but the device realizes the cooling effect through an air compressor. The air compressor not only has a large volume, but also has a high production cost and excessive energy consumption during use, and is not suitable for the nozzles of smaller 3D printers.

[0006] To achieve the above object, the present invention provides the following technical solution: a heat dissipation device for a 3D printer nozzle, including an L-shaped plate, a nozzle mechanism is fixedly installed on the top of the L-shaped plate, a heat dissipation mechanism is arranged on the outer surface wall of the nozzle mechanism, and a cleaning mechanism is arranged on one side of the outer wall of the L-shaped plate, characterized in that: the nozzle mechanism includes a heat dissipation aluminum block, an input pipe is fixedly communicated with the top of the heat dissipation aluminum block, a throat pipe is arranged inside the heat dissipation aluminum block, a heating aluminum block is fixedly sleeved at the bottom of the throat pipe, a nozzle is threadedly inserted into the inner surface wall of the heating aluminum block, and the input end of the nozzle is communicated with the output end of the throat pipe;

[0007] The heat dissipation mechanism includes a cooling box, and the cooling box is fixedly sleeved on the outer surface wall of the heat dissipation aluminum block, and an annular space is formed between the cooling box and the heat dissipation aluminum block. A semiconductor refrigeration sheet is fixedly installed on one side of the outer wall of the cooling box, a heat dissipation fin is fixedly installed at the hot end of the semiconductor refrigeration sheet, and a second fan is fixedly installed on one side of the outer wall of the heat dissipation fin.

[0008] Preferably, the cleaning mechanism includes a support plate, a water tank is fixedly installed on the top of the support plate, a pump is fixedly communicated with one side of the outer wall of the water tank, and the output end of the pump is fixedly communicated with one side of the outer wall of the cooling box. One side of the outer surface of the pump is electrically connected to a PLC controller, and one side of the outer wall of the PLC controller is electrically connected to an air pump. The air pump is fixedly sleeved with a fixing block, and the fixing block is fixedly installed on the top of the L-shaped plate. An electric push rod is fixedly installed on the top of the fixing block, a top plate is fixedly installed on the top of the electric push rod, and an air pipe is fixedly communicated with the bottom of the top plate. The input end of the air pipe is fixedly communicated with the output end of the air pump, and the air pipe is located on the top of the input pipe.

[0009] Preferably, a rubber ring is fixedly sleeved on the outer surface wall of the air pipe, and the outer surface wall of the rubber ring is attached to the inner surface wall of the input pipe.

[0010] Preferably, a liquid injection end is fixedly communicated with the top of the water tank, and a top cover is arranged on the top of the liquid injection end.

[0011] Preferably, a connecting plate is fixedly installed on one side of the outer wall of the support plate through bolts, and the connecting plate is fixedly installed on one side of the outer wall of the L-shaped plate through bolts.

[0012] Preferably, a thermostat is fixedly inserted into the heating aluminum block, and the thermostat is electrically connected to the PLC controller.

[0013] Preferably, a thermocouple is fixedly inserted into the heating aluminum block, and the thermocouple is electrically connected to the PLC controller.

[0014] Preferably, two air ducts are fixedly installed at the bottom of the L-shaped plate, and the output ends of the two air ducts are located on both sides of the nozzle, and a first fan is fixedly installed at the input end of each of the two air ducts.

[0015] Preferably, a back plate is fixedly installed on one side of the outer wall of the L-shaped plate, and a set of pulleys is arranged on the rear surface of the back plate.

[0016] Preferably, two sealing rings are fixedly installed on the inner wall of the cooling box, and the inner walls of the two sealing rings are respectively attached to the outer wall of the heat dissipation aluminum block.

[0017] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0018] 1. In the present invention, the nozzle mechanism can be cooled by setting a heat dissipation mechanism, which is composed of a semiconductor refrigeration sheet and a cooling box. The cooling box completely covers the outer wall of the heat dissipation aluminum block, and the interior of the cooling box is filled with a coolant. When the cold end of the semiconductor refrigeration sheet cools the cooling box, the coolant inside will be cooled at the same time. The coolant will dissipate heat from the heat dissipation aluminum sheet, and the heat absorbed by the semiconductor refrigeration sheet will be discharged through the hot end. The heat dissipation effect of the semiconductor refrigeration sheet is enhanced by combining with heat dissipation fins and a fan, so as to achieve the heat dissipation effect of the heat dissipation aluminum block. By combining the semiconductor refrigeration sheet and the cooling box, not only can the heat dissipation effect of the heat dissipation aluminum sheet be improved, but also the semiconductor refrigeration sheet is small in size, and the production cost and use cost are very low. Therefore, it is very suitable for the nozzle of a 3D printer with a small volume, and has high practicability and portability.

[0019] 2. In the present invention, the nozzle mechanism can be cleaned by setting a cleaning mechanism, so as to prevent the remaining material from blocking the nozzle. When the nozzle mechanism needs to be cleaned, first, the coolant in the cooling box is pumped out by a pump, and then the heating aluminum block is started. At this time, due to the lack of the heat dissipation effect of the coolant, the inside of the heat dissipation aluminum block will be heated to a very high temperature. At this time, the residual material attached to the inside of the heating aluminum block will be melted into a liquid. Then, the air pipe is blocked at the top of the input pipe, and the air pump is started. Under the action of high-pressure gas, the melted residual material will be ejected from the nozzle, thus achieving the cleaning effect.

[0020] 3. In the present invention, since the cooling box and the water tank are connected by a pump, and the pump is a two-way pump. When the pump pumps the coolant in the cooling box, the coolant will enter the water tank. After the nozzle mechanism is cleaned, the coolant in the water tank is pumped back into the cooling box by the pump, so that the coolant can be recycled and the use cost of the coolant is reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic structural diagram of the front view of a 3D printer nozzle heat dissipation device of the present invention;

[0022] Figure 2 This is a schematic structural diagram of the front view of the assembly of the heat dissipation mechanism in a 3D printer nozzle heat dissipation device of the present invention;

[0023] Figure 3 This is a schematic structural diagram of the side view of the assembly of the heat dissipation mechanism in a 3D printer nozzle heat dissipation device of the present invention;

[0024] Figure 4 This is a schematic structural diagram of the disassembly of the heat dissipation mechanism in a 3D printer nozzle heat dissipation device of the present invention;

[0025] Figure 5 This is a schematic cross-sectional view of the nozzle mechanism and the heat dissipation mechanism in a 3D printer nozzle heat dissipation device of the present invention;

[0026] Figure 6 This is a schematic structural diagram of the cleaning mechanism in a 3D printer nozzle heat dissipation device of the present invention.

[0027] In the figure: 1. L-shaped plate; 2. Nozzle mechanism; 20. Heat dissipation aluminum block; 21. Input pipe; 22. Throat pipe; 23. Heating aluminum block; 24. Nozzle; 25. Thermostat; 26. Thermocouple; 27. Air duct; 28. First fan; 29. Back plate; 210. Pulley; 3. Heat dissipation mechanism; 30. Cooling box; 31. Semiconductor refrigeration sheet; 32. Heat dissipation fins; 33. Second fan; 34. Sealing ring; 4. Cleaning mechanism; 40. Support plate; 41. Water tank; 42. Pump; 43. PLC controller; 44. Air pump; 45. Fixed block; 46. Electric push rod; 47. Top plate; 48. Air pipe; 49. Rubber ring; 410. Liquid injection end; 411. Top cover; 412. Connecting plate. Detailed implementation manners

[0028] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention. Embodiment

[0029] Refer to Figures 1 - 6As shown: A wire pressing device for reducing the fuzziness of fancy yarns based on textile production, including an L-shaped plate 1. A spray head mechanism 2 is fixedly installed at the top of the L-shaped plate 1. A heat dissipation mechanism 3 is arranged on the outer surface wall of the spray head mechanism 2. A cleaning mechanism 4 is arranged on one side of the outer wall of the L-shaped plate 1. It is characterized in that: The spray head mechanism 2 includes a heat dissipation aluminum block 20. An input pipe 21 is fixedly communicated at the top of the heat dissipation aluminum block 20. A throat pipe 22 is arranged inside the heat dissipation aluminum block 20. A heating aluminum block 23 is fixedly sleeved at the bottom of the throat pipe 22. A nozzle 24 is threadedly inserted into the inner surface wall of the heating aluminum block 23, and the input end of the nozzle 24 is communicated with the output end of the throat pipe 22;

[0030] The heat dissipation mechanism 3 includes a cooling box 30, and the cooling box 30 is fixedly sleeved on the outer surface wall of the heat dissipation aluminum block 20, and an annular space is formed between the cooling box 30 and the heat dissipation aluminum block 20. A semiconductor refrigeration sheet 31 is fixedly installed on one side of the outer wall of the cooling box 30. A heat dissipation fin 32 is fixedly installed at the hot end of the semiconductor refrigeration sheet 31, and a second blower 33 is fixedly installed on one side of the outer wall of the heat dissipation fin 32. Start the semiconductor refrigeration sheet 31 to refrigerate, and the heat absorption end of the semiconductor refrigeration sheet 31 can absorb the heat of the cooling box 30, and then refrigerate the coolant in the cooling box 30, so as to achieve the heat dissipation effect on the heat dissipation aluminum block 20, and the absorbed heat will be discharged through the heat release end of the semiconductor refrigeration sheet 31. Under the action of the second blower 33 and the heat dissipation fin 32, the heat dissipation effect of the semiconductor refrigeration sheet 31 will be improved, and then the heat dissipation effect of the entire heat dissipation mechanism 3 will be improved.

[0031] Refer to Figure 1 and Figure 6 As shown: The cleaning mechanism 4 includes a support plate 40. A water tank 41 is fixedly installed at the top of the support plate 40. A pump 42 is fixedly communicated on one side of the outer wall of the water tank 41. The output end of the pump 42 is fixedly communicated with one side of the outer wall of the cooling box 30. A PLC controller 43 is electrically connected to one side of the outer surface of the pump 42, and an air pump 44 is electrically connected to one side of the outer wall of the PLC controller 43. A fixing block 45 is fixedly sleeved on the outer surface wall of the air pump 44, and the fixing block 45 is fixedly installed on the top of the L-shaped plate 1. An electric push rod 46 is fixedly installed on the top of the fixing block 45, and a top plate 47 is fixedly installed on the top of the electric push rod 46. An air pipe 48 is fixedly communicated at the bottom of the top plate 47, and the input end of the air pipe 48 is fixedly communicated with the output end of the air pump 44, and the air pipe 48 is located above the input pipe 21. Start the pump 42, and the coolant in the cooling box 41 can be pumped into the water tank 41. After the pumping is completed, start the electric push rod 46, press the air pipe 48 into the input pipe 21, and then start the air pump 44, and high-pressure gas can be injected into the heat dissipation aluminum block 20. At this time, the melted residue in the heat dissipation aluminum block 20 will be discharged from the nozzle 24 under the action of the high-pressure gas, so as to achieve the cleaning effect.

[0032] Refer to Figure 1and Figure 6 As shown in Figure 6 : A rubber ring 49 is fixedly sleeved on the outer wall of the trachea 48, and the outer wall of the rubber ring 49 is in contact with the inner wall of the input pipe 21. The rubber ring 49 can enhance the sealing performance between the trachea 48 and the input pipe 21, prevent high-pressure gas from leaking out, and thus enhance the cleaning effect of the high-pressure gas.

[0033] Refer to Figure 1 and Figure 6 As shown in Figure 6 : A liquid injection end 410 is fixedly connected to the top of the water tank 41, and a top cover 411 is arranged on the top of the liquid injection end 410. By opening the top cover 411, coolant can be added to the water tank 41 through the liquid injection end 410, and the coolant in the water tank 41 can also be extracted through the liquid injection end 410.

[0034] Refer to Figure 1 As shown in Figure 1 : A connecting plate 412 is fixedly installed on one side of the outer wall of the support plate 40 by bolts, and one side of the outer wall of the connecting plate 412 is fixedly installed on one side of the outer wall of the L-shaped plate 1 by bolts, which facilitates the fixed installation of the cleaning mechanism 4 on the L-shaped plate 1 under the action of the connecting plate 412.

[0035] Refer to Figure 3 and Figure 5 As shown in Figure 5 : A thermostat 25 is fixedly inserted into the heating aluminum block 23, and the thermostat 25 is electrically connected to the PLC controller 43. Under the action of the thermostat 25, the temperature of the heating aluminum block 23 is maintained between 200 - 300 degrees, which is convenient for heating and melting the printing material.

[0036] Refer to Figure 3 and Figure 5 As shown in Figure 5 : A thermocouple 26 is fixedly inserted into the heating aluminum block 23, and the thermocouple 26 is electrically connected to the PLC controller 43, which is convenient for measuring the temperature of the heating block 23 under the action of the thermocouple 26.

[0037] Refer to Figures 1 - 5 As shown in Figures 1 - 5 : Two air ducts 27 are fixedly installed at the bottom of the L-shaped plate 1, and the output ends of the two air ducts 27 are located on both sides of the nozzle 24, and a first blower 28 is fixedly installed at the input end of each of the two air ducts 27, which is convenient for dissipating heat from the bottom of the nozzle 24 under the action of the first blower 28, so as to accelerate the forming speed of the printing material.

[0038] Refer to Figures 1 - 5 As shown in Figures 1 - 5 : A back plate 29 is fixedly installed on one side of the outer wall of the L-shaped plate 1, and a set of pulleys 210 is arranged on the rear surface of the back plate 29, which is convenient for fixing the entire nozzle mechanism 2 on the slide rail under the action of the pulleys 210.

[0039] Refer to Figure 1 、 Figure 2 and Figure 4 、Figure 5 As shown in the figure, two sealing rings 34 are fixedly installed on the inner surface wall of the cooling box 30, and the inner surface walls of the two sealing rings 34 are both in contact with the outer surface wall of the heat dissipation aluminum block 20, which is convenient to improve the sealing performance of the cooling box 30 under the action of the sealing rings 34.

[0040] Usage method and working principle of this device: During use, the printing material enters the inside of the nozzle mechanism 2 through the input pipe 21 and is discharged from the nozzle 24. At this time, the heating aluminum block 23 will quickly heat up and heat-melt the printing material inside the nozzle 24. Under the action of the thermostat 25, the temperature of the heating aluminum block 23 is maintained between 200 - 300 degrees, facilitating the heating and melting of the printing material. The melted material will achieve the effect of 3D printing on the workbench. At this time, starting the first blower 28 can accelerate the solidification speed of the printing material, thereby improving the 3D printing rate. The thermocouple 26 can measure the temperature of the heating block 23. When the temperature of the nozzle 24 rises, it will heat the heat dissipation aluminum block 20, and the heat dissipation aluminum block 20 can dissipate the excess temperature to prevent the temperature of the heating aluminum block 23 from being too high. In order to prevent the printing material in the heat dissipation aluminum block 20 from melting prematurely due to excessive temperature, which may cause the subsequent printing material to not enter normally, at this time, start the semiconductor refrigeration chip 31 for refrigeration. The semiconductor refrigeration principle is based on the Peltier effect. A thermocouple pair is formed by a PN junction composed of special semiconductor materials to generate the Peltier effect. When current and voltage are applied to two different conductors, a path is formed between the conductors and heat transfer occurs at the conductor junctions, absorbing and releasing heat respectively. Specifically, when current passes through the semiconductor material, heat is generated, making one end of the semiconductor hot and the other end cold. This phenomenon is the thermoelectric effect. Using this effect, the purpose of refrigeration can be achieved. The heat absorption end of the semiconductor refrigeration chip 31 can absorb the heat of the cooling box 30, thereby refrigerating the coolant in the cooling box 30, thus achieving the heat dissipation effect on the heat dissipation aluminum block 20. The absorbed heat will be discharged through the heat dissipation end of the semiconductor refrigeration chip 31. Under the action of the second blower 33 and the heat dissipation fins 32, the heat dissipation effect of the semiconductor refrigeration chip 31 will be improved, and then the heat dissipation effect of the entire heat dissipation mechanism 3 will be improved. Since the printing material will inevitably remain in the heat dissipation aluminum block 20, it is necessary to clean the inside of the heat dissipation aluminum block 20. At this time, through the PLC controller 43, turn off the entire heat dissipation mechanism 3, and then start the pump 42, which can extract the coolant in the cooling box 41 into the water tank 41. After the extraction is completed, due to the lack of the refrigeration effect of the coolant, the heat dissipation aluminum block 20 will quickly heat up, and the printing material attached to the inside of the heat dissipation aluminum block 20 will gradually melt into a liquid. Then start the electric push rod 46 to press the air pipe 48 into the inside of the input pipe 21. Under the action of the rubber ring 49, the sealing performance between the air pipe 48 and the input pipe 21 will be greatly improved. The input pipe 21 is made of a ceramic heat insulation material, so it will not melt the rubber ring 49. Then start the air pump 44 to inject high-pressure gas into the heat dissipation aluminum block 20. At this time, the melted residue in the heat dissipation aluminum block 20 will be discharged from the nozzle 24 under the action of the high-pressure gas, thereby achieving the cleaning effect. After the cleaning is completed, then use the pump 42 to reverse-extract the coolant in the water tank 41 back into the cooling box 30.Thus, the effect of recycling is achieved, the usage cost of the coolant is reduced, and under the action of the sealing ring 34, the sealing performance of the cooling box 30 is improved to prevent the coolant from flowing out of the cooling box 30. In summary, the problems raised in the above background are solved.

[0041] Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, it is still possible to modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A 3D printer nozzle heat dissipation device, comprising an L-shaped plate (1), a nozzle mechanism (2) being fixedly mounted on the top of the L-shaped plate (1), a heat dissipation mechanism (3) being arranged on the outer wall of the nozzle mechanism (2), and a cleaning mechanism (4) being arranged on one side of the outer wall of the L-shaped plate (1), characterized in that: The nozzle mechanism (2) comprises a heat dissipation aluminum block (20), the top of the heat dissipation aluminum block (20) is fixedly connected to an input pipe (21), a throat (22) is arranged inside the heat dissipation aluminum block (20), a heating aluminum block (23) is fixedly sleeved on the bottom of the throat (22), a nozzle (24) is threadedly inserted on the inner surface wall of the heating aluminum block (23), and the input end of the nozzle (24) is connected to the output end of the throat (22); the heat dissipation mechanism (3) comprises a cooling box (30), the cooling box (30) is fixedly sleeved on the outer surface wall of the heat dissipation aluminum block (20), and an annular space is formed between the cooling box (30) and the heat dissipation aluminum block (20), a semiconductor cooling sheet (31) is fixedly mounted on one side of the outer wall of the cooling box (30), a heat dissipation fin (32) is fixedly mounted on the hot end of the semiconductor cooling sheet (31), and a second fan (33) is fixedly mounted on one side of the outer wall of the heat dissipation fin (32); The cleaning mechanism (4) comprises a support plate (40), a water tank (41) is fixedly mounted on the top of the support plate (40), and a pump (42) is fixedly connected to one side of the outer wall of the water tank (41), and an output end of the pump (42) is fixedly connected to one side of the outer wall of the cooling box (30), an outer side of the pump (42) is electrically connected to a PLC controller (43), and an outer side of the PLC controller (43) is electrically connected to an air pump (44), a fixed block (45) is fixedly sleeved on the outer wall of the air pump (44), and the fixed block (45) is fixedly mounted on the top of the L-shaped plate (1), an electric push rod (46) is fixedly mounted on the top of the fixed block (45), and a top plate (47) is fixedly mounted on the top of the electric push rod (46), and an air pipe (48) is fixedly connected to the bottom of the top plate (47), and an input end of the air pipe (48) is fixedly connected to an output end of the air pump (44), and the air pipe (48) is located on the top of the input pipe (21).

2. A 3D printer nozzle heat dissipation device according to claim 1, characterized in that: The outer wall of the air pipe (48) is fixedly sleeved with a rubber ring (49), and the outer wall of the rubber ring (49) is in contact with the inner wall of the input pipe (21).

3. A 3D printer nozzle heat dissipation device according to claim 2, characterized in that: The top of the water tank (41) is fixedly connected to a liquid injection end (410), and a top cover (411) is provided on the top of the liquid injection end (410).

4. A 3D printer nozzle heat dissipation device according to claim 3, characterized in that: A connecting plate (412) is fixedly mounted on one side of the outer wall of the support plate (40) by means of bolts, and a connecting plate (412) is fixedly mounted on one side of the outer wall of the L-shaped plate (1) by means of bolts.

5. A 3D printer nozzle heat dissipation device according to claim 4, characterized in that: A thermostat (25) is fixedly inserted inside the heating aluminum block (23), and the thermostat (25) is electrically connected to the PLC controller (43).

6. A 3D printer nozzle heat dissipation device according to claim 5, characterized in that: A thermocouple (26) is fixedly inserted inside the heating aluminum block (23), and the thermocouple (26) is electrically connected to the PLC controller (43).

7. A 3D printer nozzle heat dissipation device according to claim 6, characterized in that: Two air cylinders (27) are fixedly mounted on the bottom of the L-shaped plate (1), and the output ends of the two air cylinders (27) are located on both sides of the nozzle (24), and first fans (28) are fixedly mounted on the input ends of the two air cylinders (27).

8. A 3D printer nozzle heat dissipation device according to claim 7, characterized in that: A back plate (29) is fixedly mounted on one side of the outer wall of the L-shaped plate (1), and a group of pulleys (210) are arranged on the rear surface of the back plate (29).

9. A 3D printer nozzle heat dissipation device according to claim 8, characterized in that: Two sealing rings (34) are fixedly mounted on the inner surface wall of the cooling box (30), and the inner surfaces of the two sealing rings (34) are in contact with the outer surface wall of the heat dissipation aluminum block (20).

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