Wafer film pasting platform

Abstract

The present application relates to a wafer film pasting platform, when in use, the wafer is adsorbed by the vacuum chuck on the suction plate platform, when covering the film, the product is heated by the heating mechanism first, so that the film pasting is more stable, when laser cutting, dust is sucked by the filtering dust extraction mechanism, so that the dust-free environment during film pasting and laser cutting can be better ensured, when pasting, the suction plate platform, the heating mechanism and the filtering dust extraction mechanism are driven by the pasting platform lifting mechanism to lift, cooperate with the film pasting mechanism above, the film pasting can be better, after the film pasting is completed, the product can be taken out more conveniently by the product jacking mechanism. The heating mechanism is provided with a heat conduction plate, so that the suction plate platform is heated more evenly, the heat insulation plate can avoid heat downward transmission, and heat utilization rate is provided. The filtering dust extraction mechanism is provided with a filter screen ring group, so that long-time use of the filtering dust extraction mechanism can be ensured, the service life of the filtering dust extraction mechanism is prolonged, and when the dust collection reaches a certain degree, the filter screen ring group can be replaced.

Description

Technical Field

[0001] This invention relates to the field of wafer bonding technology, and more particularly to a wafer bonding platform. Background Technology

[0002] In semiconductor manufacturing, a carrier film needs to be applied to the wafer during wafer processing. The application of the film requires a dust-free operation, so it is not suitable for manual operation. Existing wafer film application is usually carried out in a dust-free space, but there are still a very small number of cases where dust contamination occurs, resulting in product defects. Furthermore, existing equipment does not apply the film tightly enough, and it is inconvenient to remove the product. In particular, it has poor versatility and cannot be adapted to products with large differences in specifications. Summary of the Invention

[0003] In view of the above situation, it is necessary to propose a wafer bonding platform that facilitates wafer bonding.

[0004] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is: a wafer bonding platform, comprising:

[0005] A suction plate platform, wherein the suction plate platform is equipped with a plurality of vacuum suction cups;

[0006] The heating mechanism includes, in sequence, a heat-conducting plate, a heating layer, and a heat-insulating plate, wherein the heat-conducting plate is attached to the bottom of the suction plate platform;

[0007] The dust extraction and filtration mechanism includes, in sequence, a sealing ring, a filter ring assembly, and a dust collection seat. The dust collection seat has a dust extraction port. The filter ring assembly has at least one layer of filter rings. The filter ring assembly and the sealing ring surround the suction plate platform and the heating mechanism. The sealing ring is connected to the dust collection seat and abuts against and fastens the edge portion of the filter ring assembly, leaving the remaining portion of the filter ring assembly exposed. The dust collection seat is connected to a dust extraction connector.

[0008] The product lifting mechanism is configured below the suction plate platform. The product lifting mechanism includes a product lifting rod. The suction plate platform and the heating mechanism are provided with lifting holes for the product lifting rod to extend out.

[0009] The applicator lifting mechanism is located below the suction plate platform, and the applicator lifting mechanism drives the suction plate platform and the heating mechanism to move up and down together.

[0010] Furthermore, it also includes a platform, on which the dust collection seat is disposed, and a platform lifting mechanism is provided below the platform, which is connected to the platform to drive the platform to move up and down.

[0011] Furthermore, the platform lifting mechanism includes a long-distance lifting mechanism and a short-distance lifting mechanism, the short-distance lifting mechanism being fixed on the long-distance lifting mechanism, and the short-distance lifting mechanism driving the platform to lift.

[0012] Furthermore, the platform includes an upper platform, a lower platform, and a dust collection ring pressure plate. The platform lifting mechanism includes a platform lifting linear bearing, a linear motor plate, a pressure sensor, a pressure control cylinder, an electro-proportional valve, a pressure lifting plate linear bearing, a pressure lifting plate, an electric cylinder fixing plate, a platform lifting electric cylinder, and a platform lifting servo motor. The dust collection ring pressure plate is connected to the upper platform and fastens the dust extraction mechanism inside. The platform lifting linear bearing connects the upper platform and the linear motor plate. The lower platform is connected to the top of the linear motor plate. The pressure lifting plate linear bearing connects the lower platform and the pressure lifting plate. The electric cylinder fixing plate is connected to the pressure lifting plate via a support column. The platform lifting servo motor is fixed on the electric cylinder fixing plate, and the pressure control cylinder is fixed on the pressure lifting plate.

[0013] The dust collection ring pressure plate, the upper plate of the platform, and the lower plate of the platform achieve micro-movement up and down under the drive of the pressure control cylinder through the platform lifting linear bearing. The electro-proportional valve, in conjunction with the pressure sensor, controls the force of the pressure control cylinder. The platform lifting servo motor drives the platform lifting electric cylinder to drive the pressure lifting plate to rise and fall through the pressure lifting plate linear bearing.

[0014] Furthermore, it also includes a temperature sensor that detects the temperature of the suction plate platform and provides control data for the heating layer.

[0015] Furthermore, the suction plate platform has multiple concentric zones, each concentric zone is provided with a number of suction cups, each concentric zone is independently controlled, and a vacuum negative pressure groove is provided on the outer ring of each concentric zone, the vacuum negative pressure groove is connected to the vacuum suction cup.

[0016] Furthermore, the dust extraction connector is connected to a filter via a dust extraction pipe.

[0017] Furthermore, the dust collection seat has a slot on its side wall, and the bottom layer of filter rings in the filter ring assembly has an extension plate that matches the slot.

[0018] Furthermore, the side wall of the dust collection seat is provided with several protrusions.

[0019] Furthermore, the heating layer includes a plurality of heating wires, which are arranged symmetrically or in a ring array.

[0020] The beneficial effects of this invention are as follows: During use, the wafer is adsorbed by a vacuum suction cup on the suction platform. During lamination, the product is first heated by a heating mechanism, resulting in a more stable lamination. During laser cutting, a dust extraction mechanism removes dust, ensuring a dust-free environment for both lamination and laser cutting. During lamination, the suction platform and heating mechanism are raised and lowered by a lifting mechanism, working in conjunction with the upper lamination mechanism for better lamination. After lamination, the product is easily removed by a lifting mechanism. The heating mechanism features a heat-conducting plate for more even heating of the suction platform, and a heat insulation plate to prevent heat transfer downwards, improving heat utilization. The dust extraction mechanism includes a filter ring assembly, ensuring long-term use and extending its lifespan. The filter ring assembly can be replaced when dust accumulates to a certain level. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of a wafer bonding platform according to an embodiment of the present invention;

[0022] Figure 2 This is a schematic diagram of the suction plate platform and the dust extraction and filtration mechanism of a wafer lamination platform according to an embodiment of the present invention;

[0023] Figure 3 This is a schematic diagram of the heating mechanism of a wafer bonding platform according to an embodiment of the present invention;

[0024] Figure 4 This is a schematic diagram of the product lifting mechanism and the coating platform lifting mechanism of a wafer bonding platform according to an embodiment of the present invention;

[0025] Figure 5 This is a schematic diagram of the stage and stage lifting mechanism of a wafer lamination platform according to an embodiment of the present invention;

[0026] Figure 6 This is a schematic diagram of the structure of a dust extraction and filtration mechanism of a wafer lamination platform according to an embodiment of the present invention.

[0027] Label Explanation:

[0028] 100. Suction plate platform; 110. Air vent; 120. Concentric zone; 130. Vacuum negative pressure tank;

[0029] 140. Sealing ring; 150. Vacuum suction cup; 151. Vacuum connector; 160. Lifting hole;

[0030] 200. Heating mechanism; 210. Heat-conducting plate; 220. Heating layer; 230. Heat insulation plate;

[0031] 240. Temperature sensor; 300. Filter and dust extraction mechanism; 310. Sealing ring; 320. Filter ring assembly;

[0032] 321. First filter ring; 322. Second filter ring; 3221. Extension plate;

[0033] 330. Dust collection base; 331. Card slot; 332. Protrusion; 340. Dust extraction connector; 350. Filter;

[0034] 400. Product lifting mechanism; 410. Connecting plate; 411. Product lifting rod; 420. Lifting rod cylinder;

[0035] 430. Top rod linear bearing; 500. Covering platform lifting mechanism; 510. Platform linear bearing;

[0036] 520. Position sensor; 530. Platform lifting screw; 540. Synchronous pulley; 550. Synchronous belt;

[0037] 560. Reducer; 570. Lifting servo motor; 600. Platform; 610. Platform top panel;

[0038] 620. Lower panel of the platform; 630. Dust collection ring pressure plate; 700. Platform lifting mechanism;

[0039] 710. Long-distance lifting mechanism; 711. Linear bearing for pressure lifting plate; 712. Pressure lifting plate;

[0040] 713. Electric cylinder fixing plate; 714. Platform lifting electric cylinder; 715. Platform lifting servo motor;

[0041] 720. Short-distance lifting mechanism; 721. Platform lifting linear bearing; 722. Linear motor plate;

[0042] 723. Pressure sensor; 724. Pressure control cylinder; 725. Electro-proportional valve. Detailed Implementation

[0043] To make the objectives, technical solutions, and advantages of this invention clearer, the wafer bonding platform of this invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0044] Please refer to Figures 1-6 A wafer bonding platform, comprising:

[0045] A suction plate platform 100 is provided, and a number of vacuum suction cups 150 are provided on the suction plate platform 100;

[0046] The heating mechanism 200 includes, in sequence, a heat-conducting plate 210, a heating layer 220, and a heat insulation plate 230. The heat-conducting plate 210 is attached to the bottom of the suction plate platform 100.

[0047] The dust extraction mechanism 300 includes, in sequence, a sealing ring 310, a filter ring assembly 320, and a dust collection seat 330. The dust collection seat 330 has a dust extraction port. The filter ring assembly 320 has at least one layer of filter rings. The filter ring assembly 320 and the sealing ring 310 surround the suction plate platform 100 and the heating mechanism 200. The sealing ring 310 is connected to the dust collection seat 330 and abuts against and fastens the edge portion of the filter ring assembly 320, while exposing the remaining portion of the filter ring assembly 320 (dust extraction is performed through the exposed portion). The dust collection seat 330 is connected to the dust extraction connector 340.

[0048] The product lifting mechanism 400 is configured below the suction plate platform 100. The product lifting mechanism 400 includes a product lifting rod 411. The suction plate platform 100 and the heating mechanism 200 are provided with lifting holes 160 for the product lifting rod 411 to extend out.

[0049] The application platform lifting mechanism 500 is located below the suction plate platform 100. The application platform lifting mechanism 500 pushes the suction plate platform 100 and the heating mechanism 200 to move up and down together.

[0050] During use, the vacuum suction cups 150 on the suction platform 100 adsorb the wafers, preventing product warping and adsorption failure. After lamination, the heating mechanism 200 heats the wafers, ensuring a more stable lamination. The dust extraction mechanism 300 removes dust, ensuring a dust-free environment during lamination and laser cutting. During lamination, the lifting mechanism 500 drives the suction platform 100 and heating mechanism 200 to move up and down, working in conjunction with the lamination mechanism above for better lamination. After lamination, the product lifting mechanism 400 allows for easy removal of the product. The heating mechanism 200 is equipped with a heat-conducting plate 210 to ensure more even heating of the suction platform 100, and a heat insulation plate 230 to prevent heat transfer downwards, improving heat utilization. The dust extraction mechanism 300 is equipped with a filter ring assembly 320, ensuring long-term use and extending its service life. The filter ring assembly 320 can be replaced when dust accumulates to a certain level.

[0051] Please refer to Figure 1 and Figure 5 It also includes a platform 600, a dust collection seat 330 disposed on the platform 600, and a platform lifting mechanism 700 located below the platform 600, which is connected to the platform 600 and drives the platform 600 to move up and down. The platform 600 and the platform lifting mechanism 700 extend the lifting stroke, enable multi-stage lifting, and improve the stability and accuracy of the lifting. Furthermore, the platform lifting mechanism 700 can move relative to the covering platform lifting mechanism 500.

[0052] Please refer to Figure 1 and Figure 5The platform lifting mechanism 700 includes a long-distance lifting mechanism 710 and a short-distance lifting mechanism 720. The short-distance lifting mechanism 720 is fixed to the long-distance lifting mechanism 710 and drives the platform 600 to lift. The platform lifting mechanism 700 is configured with two-stage lifting. The long-distance lifting mechanism 710 is responsible for the main lifting, while the short-distance lifting mechanism 720 is used to control the pressure on the platform, improving lifting accuracy while ensuring stroke, and facilitating precise control of the pressure the platform can withstand.

[0053] Please refer to Figure 5 The platform 600 includes an upper platform 610, a lower platform 620, and a dust collection ring pressure plate 630. The platform lifting mechanism 700 includes a platform lifting linear bearing 721, a linear motor plate 722, a pressure sensor 723, a pressure control cylinder 724, an electric proportional valve 725, a pressure lifting plate 712, a linear bearing 711, a pressure lifting plate 712, an electric cylinder fixing plate 713, a platform lifting electric cylinder 714, and a platform lifting servo motor 715. The dust collection ring pressure plate 630 is connected to the upper platform 610 and... The dust extraction mechanism 300 is fastened inside. The platform lifting linear bearing 721 connects the upper panel 610 and the linear motor plate 722 of the platform. The lower panel 620 of the platform is connected to the top of the linear motor plate 722. The pressure lifting plate 712 is connected to the lower panel 620 and the pressure lifting plate 712 by the linear bearing 711. The electric cylinder fixing plate 713 is connected to the pressure lifting plate 712 through the support column. The platform lifting servo motor 715 is fixed on the electric cylinder fixing plate 713. The pressure control cylinder 724 is fixed on the pressure lifting plate 712.

[0054] The dust collection ring pressure plate 630, the upper panel 610, and the lower panel 620 of the platform achieve micro-movement up and down via a platform lifting linear bearing 721 driven by a pressure control cylinder 724. An electro-proportional valve 725, in conjunction with a pressure sensor 723, controls the force of the pressure control cylinder 724. A platform lifting servo motor 715 drives a platform lifting electric cylinder 714, which in turn drives the pressure lifting plate 712 to rise and fall via a linear bearing 711. The pressure sensor 723 and the electro-proportional valve 725 control the force of the pressure control cylinder 724 to avoid affecting the film application effect.

[0055] Please refer to Figure 2 It also includes a temperature sensor 240, which detects the temperature of the suction plate platform 100 and provides control data for the heating layer 220. The temperature sensor 240 facilitates temperature control, preventing excessively high temperatures from causing wrinkles in the film and excessively low temperatures from causing poor adhesion.

[0056] Please refer to Figure 1 and Figure 2The suction platform 100 has multiple concentric zones 120, each with several suction cups. Each suction cup in each zone is independently controlled. A vacuum negative pressure groove 130 is located on the outer ring of each zone 120, and the vacuum negative pressure groove 130 communicates with the vacuum suction cup 150 / vacuum connector 151. The multiple concentric zones 120 are designed to accommodate products of different sizes. Specifically, the multiple concentric zones 120 include three areas: 6-inch, 8-inch, and 12-inch (outer diameter) to accommodate different product sizes. Preferably, each vacuum negative pressure groove 130 is equipped with a sealing ring 140 to prevent air leakage from the bottom of the suction platform 100. The vacuum negative pressure groove 130 and the vacuum suction cup 150 work together to adsorb products, ensuring the stability of the leather adsorption.

[0057] Please refer to Figure 3 The dust extraction connector 340 is connected to a filter 350 via a dust extraction pipe. The filter 350 provides further enhanced filtration, preventing blockage of the vacuum path and damage to the vacuum device. Simply put, the filter ring assembly 320, from top to bottom, includes a first filter ring 321 and a second filter ring 322. The first filter ring 321 has a filtration level of 1mm, the second filter ring 322 has a filtration level of 0.026mm, and the filter 350 has a filtration level of 0.01mm.

[0058] Please refer to Figure 3 The dust collection base 330 has a slot 331 on its side wall, and the bottom layer of filter rings in the filter ring assembly 320 has an extension plate 3221 that matches the slot 331. With the slot 331 and extension plate, the filter ring assembly 320 does not need to be fixed with screws, and the filter ring assembly 320 can be directly removed as a whole through the extension plate 3221, which facilitates quick replacement of the filter rings.

[0059] Please refer to Figure 3 The dust collection base 330 has several protrusions 332 on its side wall. The protrusions 332 facilitate the support of the dust collection base 330 on the platform panel 610 and make it easy to remove and maintain the dust collection base 330.

[0060] Please refer to Figure 2 The heating layer 220 includes several heating wires, which are arranged symmetrically or in a ring array. The arrangement of the heating wires is designed to ensure uniform heating as much as possible.

[0061] Specifically, due to the inclusion of the heating mechanism 200, the suction plate platform 100, sealing ring 140, and temperature sensor 240 are all made of high-temperature resistant materials. The heat insulation plate 230 is preferably made of ceramic material, which not only effectively insulates against high temperatures but also has high compressive strength.

[0062] Please refer to Figure 4The product lifting mechanism 400 includes a product lifting rod 411, a lifting rod cylinder 420, and a lifting rod linear bearing 430. Driven by the lifting rod linear bearing 430 and the lifting rod cylinder 420, the product lifting rod 411 lifts the product off the platform surface, facilitating product removal from the platform. Specifically, it also includes a connecting plate 410. The product lifting rod 411 is fixed to the connecting plate 410, and the lifting rod cylinder 420 lifts the connecting plate 410. Preferably, multiple product lifting rods 411 are arranged in a circular array.

[0063] Please refer to Figure 4 The platform lifting mechanism 500 includes a platform linear bearing 510, a position sensor 520, a platform lifting screw 530, a synchronous pulley 540, a synchronous belt 550, a reducer 560, and a lifting servo motor 570. The lifting servo motor 570, through the reducer 560, synchronous belt 550, and synchronous pulley 540, achieves platform lifting under the guidance of the platform linear bearing 510. It can be understood that it also includes a mounting plate and a moving plate, which are connected by the platform linear bearing 510. The push rod cylinder 420 is fixed on the moving plate. The position sensor 520 generally includes two parts: a light-emitting part and a light-shielding part. The light-emitting part is connected to the moving plate via a guide rail, and the light-shielding part is connected to the mounting plate via another parallel guide rail.

[0064] The vacuum suction cup 150 is connected to the vacuum device through the vacuum connector 151. The vacuum connector 151 can pass through the heating mechanism 200. That is, the heat-conducting plate 210 and the heat insulation plate 230 are provided with perforations for the vacuum connector 151 to pass through, and the heating wire is set to avoid the vacuum connector 151.

[0065] It is understood that the linear bearings involved in this application (including the platform linear bearing 510, the push rod linear bearing 430, the platform lifting linear bearing 721, the pressure lifting plate linear bearing 712, and the pressure lifting plate linear bearing 711) all include a bushing and a sliding shaft, which are slidably fitted together. In this application, the linear bearing connecting two objects refers to the bushing connecting to one object and the sliding shaft connecting to the other object, achieving a movable fit between the two. Typically, multiple sets of linear bearings are provided to ensure stable movement.

[0066] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0067] Furthermore, if the embodiments of the present invention involve descriptions such as "first" or "second," such descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature.

[0068] In summary, the wafer lamination platform provided by this invention uses vacuum suction cups on a suction platform to adsorb wafers. During lamination, a heating mechanism first heats the product, making the lamination more stable. During laser cutting, a dust extraction mechanism removes dust, ensuring a dust-free environment for both lamination and laser cutting. The lamination platform lifting mechanism drives the suction platform and heating mechanism to move up and down, working in conjunction with the upper lamination mechanism for better lamination. After lamination, the product lifting mechanism allows for easy removal of the product. The heating mechanism features a heat-conducting plate to ensure more even heating of the suction platform, and a heat insulation plate to prevent heat from flowing downwards, improving heat utilization. The dust extraction mechanism includes a filter ring assembly, ensuring long-term use and extending its service life. The filter ring assembly can be replaced when dust accumulates to a certain level.

[0069] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present invention. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the scope of the present invention.

Claims

1. A wafer bonding platform, characterized in that, include: A suction plate platform, wherein the suction plate platform is equipped with a plurality of vacuum suction cups; The heating mechanism includes, in sequence, a heat-conducting plate, a heating layer, and a heat-insulating plate, wherein the heat-conducting plate is attached to the bottom of the suction plate platform; The dust extraction and filtration mechanism includes, in sequence, a sealing ring, a filter ring assembly, and a dust collection seat. The dust collection seat has a dust extraction port. The filter ring assembly has at least one layer of filter rings. The filter ring assembly and the sealing ring surround the suction plate platform and the heating mechanism. The sealing ring is connected to the dust collection seat and abuts against and fastens the edge portion of the filter ring assembly, leaving the remaining portion of the filter ring assembly exposed. The dust collection seat is connected to a dust extraction connector. The product lifting mechanism is configured below the suction plate platform. The product lifting mechanism includes a product lifting rod. The suction plate platform and the heating mechanism are provided with lifting holes for the product lifting rod to extend out. The applicator lifting mechanism is located below the suction plate platform, and the applicator lifting mechanism drives the suction plate platform and the heating mechanism to move up and down together.

2. The wafer bonding platform according to claim 1, characterized in that, It also includes a platform, on which the dust collection seat is disposed. A platform lifting mechanism is provided below the platform, which is connected to the platform and drives the platform to move up and down.

3. The wafer bonding platform according to claim 2, characterized in that, The platform lifting mechanism includes a long-distance lifting mechanism and a short-distance lifting mechanism. The short-distance lifting mechanism is fixed on the long-distance lifting mechanism and drives the platform to lift.

4. The wafer bonding platform according to claim 3, characterized in that, The platform includes an upper platform, a lower platform, and a dust collection ring pressure plate. The platform lifting mechanism includes a platform lifting linear bearing, a linear motor plate, a pressure sensor, a pressure control cylinder, an electro-proportional valve, a pressure lifting plate linear bearing, a pressure lifting plate, an electric cylinder fixing plate, a platform lifting electric cylinder, and a platform lifting servo motor. The dust collection ring pressure plate is connected to the upper platform and fastens the dust extraction mechanism inside. The platform lifting linear bearing connects the upper platform and the linear motor plate. The lower platform is connected to the top of the linear motor plate. The pressure lifting plate linear bearing connects the lower platform and the pressure lifting plate. The electric cylinder fixing plate is connected to the pressure lifting plate via a support column. The platform lifting servo motor is fixed to the electric cylinder fixing plate, and the pressure control cylinder is fixed to the pressure lifting plate. The dust collection ring pressure plate, the upper plate of the platform, and the lower plate of the platform achieve micro-movement up and down under the drive of the pressure control cylinder through the platform lifting linear bearing. The electro-proportional valve, in conjunction with the pressure sensor, controls the force of the pressure control cylinder. The platform lifting servo motor drives the platform lifting electric cylinder to drive the pressure lifting plate to rise and fall through the pressure lifting plate linear bearing.

5. A wafer bonding platform according to claim 1, characterized in that, It also includes a temperature sensor that detects the temperature of the suction plate platform and provides control data for the heating layer.

6. A wafer bonding platform according to claim 1, characterized in that, The suction plate platform has multiple concentric zones, and each concentric zone is provided with a number of suction cups. The suction cups in each concentric zone are independently controlled. A vacuum negative pressure groove is provided on the outer ring of each concentric zone, and the vacuum negative pressure groove is connected to the vacuum suction cups.

7. A wafer bonding platform according to claim 1, characterized in that, The dust extraction connector is connected to a filter via a dust extraction pipe.

8. A wafer bonding platform according to claim 1, characterized in that, The dust collection seat has a slot on its side wall, and the bottom layer of filter rings in the filter ring assembly has an extension plate that matches the slot.

9. A wafer bonding platform according to claim 1, characterized in that, The dust collection seat has several protrusions on its side wall.

10. A wafer bonding platform according to claim 1, characterized in that, The heating layer includes a plurality of heating wires, which are arranged symmetrically or in a ring array.

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