A dual-feature microchannel heat sink structure with manifold and fractal coupling

Abstract

The present invention provides a dual-feature microchannel heat sink structure with manifold and fractal coupling, relating to the field of electronic device cooling methods. The structure comprises a cover plate, a manifold microchannel plate, and a base plate. The cover plate is provided with a water inlet and a water outlet. The manifold microchannel plate comprises a lower fractal microchannel structure and an upper manifold channel structure disposed above the lower fractal microchannel structure. The manifold microchannel plate is an integrated structure. The base plate is provided with a concave cavity comprising an inlet water storage cavity, an inlet diverter cavity, a microchannel placement cavity, an outlet diverter cavity, and an outlet water storage cavity, which are sequentially connected. The water inlet is connected to the inlet water storage cavity, and the water outlet is connected to the outlet water storage cavity. The manifold microchannel plate is disposed within the microchannel placement cavity. This invention solves the problem of high flow resistance in traditional heat dissipation structures.

Description

Technical Field

[0001] The present invention relates to the field of electronic device cooling methods, and in particular to a dual-feature microchannel heat sink structure with a manifold and fractal coupling. Background Art

[0002] With the explosive growth of information technologies such as 5G, artificial intelligence, and edge computing, the heat flux density of electronic chips is getting higher and higher, and thermal management technology for high heat flux density chips has become a bottleneck problem in the development of microelectronic devices. Compared with traditional air cooling, liquid-cooled chip cooling has the advantages of large specific heat capacity, strong convection heat transfer capacity, and low noise. It is an ideal choice for solving the current high heat flux density electronic chip heat dissipation. In particular, with the introduction of the third-generation embedded microfluidic cooling technology and the promotion of advanced processing and manufacturing technology, the heat dissipation method of directly integrating microchannel heat sinks on electronic chips has become a hot topic in the field of electronic chip heat dissipation. Among them, the manifold microchannel heat sink divides the traditional microchannel heat sink into multiple microchannel units, which can achieve smaller pumping power requirements, higher heat transfer capacity and better temperature uniformity. Integrating manifold microchannel heat sinks onto electronic chips has become an ideal choice for solving the heat dissipation of high heat flux density electronic chips.

[0003] A Chinese patent (application number: CN202211530818.5) discloses a manifold-type dual-feature microchannel heat sink structure with a countercurrent zone, having manifold and fractal coupling, including a microchannel upper cover plate, a Z-shaped manifold structure, a microchannel diverter plate and a microchannel heat sink. The Z-shaped manifold structure is provided with an inlet section and an outlet section, and both the inlet section and the outlet section are trapezoidal areas. The inlet section is connected to four fluid inlets, and the outlet section is connected to four fluid outlets; the bottom of the microchannel heat sink is in direct contact with the heat source surface; the microchannel diverter plate of the present invention adopts a unique design to achieve pure countercurrent flow of the fluid in the microchannel, thereby improving the uniformity of the temperature of the heat source surface; in the Z-shaped manifold structure, the bottom channels of the first fluid inlet and the fourth fluid inlet located on both sides of the manifold are not applied with a heat source.

[0004] The above patent achieves opposite flow directions between adjacent microchannels by setting a manifold with a specific structure in conjunction with the manifold and microchannel structure, thereby reducing the local hot spots on the heating surface, improving the temperature uniformity of the heat source surface, and reducing the thermal resistance of the heat sink. However, the structural design is complex and the processing cost is high. In addition, an extra layer of manifold structure is added, the three-dimensional thickness of the microchannel plate is increased, and the installation is complicated, which is not conducive to the large-scale industrial application of microchannels. In addition, there is also the problem of large flow resistance of the traditional manifold microchannel structure. The manifold and the microchannel array present an upper and lower staggered structure, and the manifold structure is large and the microchannel structure is small, which will produce a jet effect at the interface. The jet effect will produce an impact-backflow effect on the bottom surface, causing a large pressure loss at the microchannel inlet, and as the flow rate increases, the jet effect is enhanced, and the backflow is also enhanced, causing pressure blockage at the microchannel inlet, a sharp increase in pressure loss, an increase in heat transfer irreversibility, and a decrease in heat dissipation capacity. Summary of the Invention

[0005] Based on this, in order to solve the problem, the present invention provides a dual-feature microchannel heat sink structure with manifold and fractal coupling, and its specific technical solution is as follows:

[0006] A dual-feature microchannel heat sink structure with manifold and fractal coupling, characterized in that it includes a cover plate, a manifold microchannel plate and a bottom plate, the cover plate is provided with a water inlet and a water outlet, the manifold microchannel plate includes a lower fractal microchannel structure and an upper manifold channel structure arranged on the lower fractal microchannel structure, the manifold microchannel plate is an integrated structure, a concave cavity is provided on the bottom plate, the concave cavity includes an inlet water storage cavity, an inlet diversion cavity, a microchannel placement cavity, an outlet diversion cavity and an outlet water storage cavity connected in sequence, the water inlet is connected to the inlet water storage cavity, the water outlet is connected to the outlet water storage cavity, and the manifold microchannel plate is arranged in the microchannel placement cavity.

[0007] The dual-feature microchannel heat sink structure with manifold and fractal coupling, by placing a lower fractal microchannel structure at the bottom of the upper manifold channel structure, directs the coolant jet generated by the upper manifold channel structure into the lower fractal microchannel structure through a diversion effect. This solves the problem of impact and backflow that easily occurs during the transition from the manifold channel structure to the microchannel structure in traditional heat dissipation structures, leading to pressure loss at the interface between the manifold channel and the microchannel, and reduces the flow resistance of the coolant. This dual-feature microchannel heat sink structure with manifold and fractal coupling solves the high flow resistance problem of traditional heat dissipation structures.

[0008] Furthermore, the outer contour of the upper manifold channel structure is serpentine-shaped, and the lower fractal microchannel structure is arranged in the shape of a fractal microchannel structure.

[0009] Furthermore, the upper manifold channel structure divides the manifold microchannel plate into two chambers separated from each other, one chamber is connected to the water diversion chamber as a water inlet channel, and the other chamber is connected to the water diversion chamber as a water outlet channel.

[0010] Furthermore, the lower fractal microchannel structure includes a plurality of multi-branch microchannel units connected in sequence, the multi-branch microchannel units are symmetrically arranged along the X-axis and the Y-axis, the multi-branch microchannel units include a diversion point and a plurality of microchannels, the plurality of microchannels are symmetrically arranged along the X-axis and the Y-axis and are all connected to the diversion point, a microchannel of one multi-branch microchannel unit is connected to a microchannel of another multi-branch microchannel unit to form a confluence point.

[0011] Furthermore, the water inlet channel is provided above the diversion point and is communicated with the diversion point, and the water outlet channel is provided above the confluence point and is communicated with the confluence point.

[0012] Furthermore, the depth of the inlet water storage chamber is greater than the depth of the inlet diversion chamber, the depth of the outlet water storage chamber is greater than the depth of the outlet diversion chamber, the depth of the inlet diversion chamber and the depth of the outlet diversion chamber are equal to the height of the upper manifold channel structure, and the depth of the microchannel placement chamber is equal to the thickness of the manifold microchannel plate.

[0013] Furthermore, a first quick pipe joint is provided on the water inlet, and a second quick pipe joint is provided on the water outlet.

[0014] Furthermore, the lower fractal microchannel structure is provided with a plurality of first microchannels arranged at intervals, the first microchannels are arranged perpendicular to the water outlet channel and the water inlet channel, and the first microchannels pass through the confluence point and the diversion point in sequence.

[0015] Beneficial effects of the present invention:

[0016] (1) The present invention adopts a fractal microchannel array to replace the traditional parallel straight microchannels. The cooling liquid enters the diversion point through the water inlet channel and is diverted to multiple microchannels through the diversion point, which reduces the impact and backflow generated at the interface between the traditional manifold channel and the microchannel, reduces the pressure loss at the interface between the traditional manifold channel and the microchannel, avoids the formation of liquid barriers, and expands the applicable flow range of the manifold microchannel heat sink; a microchannel of one of the multi-branch microchannel units is connected with a microchannel of another multi-branch microchannel unit to form a confluence point, which facilitates the liquid to be fully mixed with hot and cold fluids at the confluence point after being diverted through the diversion point and flow out from the water outlet channel, thereby increasing the fluid disturbance in the horizontal direction and improving the convective heat transfer capacity and temperature uniformity performance of the microchannel heat sink.

[0017] (2) The present invention adopts a simple rectangular water storage chamber plus a diversion chamber to replace the special diversion chamber structure design and three-dimensional fractal manifold design of the traditional microchannel heat sink, which has the advantages of simple structure and low processing cost. It also ensures the uniformity of the flow velocity distribution of the microchannel heat sink without increasing the three-dimensional size of the microchannel heat sink, which is conducive to the miniaturization and integration of microelectronic devices.

[0018] (3) The present invention adopts a manifold microchannel plate structure design, which has the advantages of strong heat dissipation capacity, good temperature uniformity, and mature processing technology. It can realize the integrated design of multi-layer microchannel plates and direct embedded processing of chip heat sources, meeting the current high heat flux density electronic chip heat dissipation needs. It can also be directly obtained by improving the microchannel structure on the basis of the original manifold microchannel heat sink, which is suitable for large-scale upgrades of microelectronic heat dissipation equipment in enterprises such as edge computing and data centers. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The present invention can be further understood from the following description in conjunction with the accompanying drawings. The components in the figures are not necessarily drawn to scale, but rather the emphasis is placed on illustrating the principles of the embodiments. In different views, the same reference numerals designate corresponding parts.

[0020] Figure 1 1 is an exploded view of a dual-feature microchannel heat sink structure with manifold and fractal coupling according to an embodiment of the present invention;

[0021] Figure 2 This is one of the structural schematic diagrams of a heat sink having a dual-feature microchannel heat sink structure with a manifold and fractal coupling according to an embodiment of the present invention;

[0022] Figure 3 This is a second structural schematic diagram of a heat sink having a dual-feature microchannel heat sink structure with a manifold and fractal coupling according to an embodiment of the present invention;

[0023] Figure 4 This is a third structural schematic diagram of a heat sink having a dual-feature microchannel heat sink structure with a manifold and fractal coupling according to an embodiment of the present invention;

[0024] Figure 5 yes Figure 3 Magnified view of part A.

[0025] Description of reference numerals:

[0026] 1-cover plate; 2-bottom plate; 3-manifold microchannel plate; 31-upper manifold channel structure; 32-lower fractal microchannel structure; 4-microchannel; 5-convergence point; 6-diversion point; 7-water inlet channel; 8-water outlet channel; 9-first quick pipe connector; 10-second quick pipe connector; 11-inlet water storage chamber; 12-inlet diversion chamber; 13-microchannel placement chamber; 14-outlet diversion chamber; 15-outlet water storage chamber; 16-first microchannel. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with its embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and do not limit the scope of protection of the present invention.

[0028] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly attached to the other element or there may be an intermediate element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this invention pertains. The terms used herein in the specification of the present invention are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0030] The "first" and "second" in the present invention do not represent specific quantities and orders, but are only used to distinguish names.

[0031] like Figure 1-3 As shown, in one embodiment of the present invention, a dual-feature microchannel heat sink structure with manifold and fractal coupling includes a cover plate 1, a manifold microchannel plate 3 and a bottom plate 2. The cover plate 1 is provided with a water inlet and a water outlet. The manifold microchannel plate 3 includes a lower fractal microchannel structure 32 and an upper manifold channel structure 31 provided on the lower fractal microchannel structure 32. The manifold microchannel plate 3 is an integrated structure. The bottom plate 2 is provided with a concave cavity, which includes an inlet water storage cavity 11, an inlet diversion cavity 12, a microchannel placement cavity 13, an outlet diversion cavity 14 and an outlet water storage cavity 15 that are connected in sequence. The water inlet is connected to the inlet water storage cavity 11, and the water outlet is connected to the outlet water storage cavity 15. The manifold microchannel plate 3 is arranged in the microchannel placement cavity 13.

[0032] The dual-feature microchannel heat sink structure with manifold and fractal coupling, by disposing a lower fractal microchannel structure 32 at the bottom of the upper manifold channel structure 31, directs the coolant jet generated by the upper manifold channel structure 31 into the lower fractal microchannel structure 32 through a diversion effect. This solves the problem of impact and backflow that easily occurs during the transition from the manifold channel structure to the microchannel structure in traditional heat dissipation structures, leading to pressure loss at the interface between the manifold channel and the microchannel, and reduces the flow resistance of the coolant. This dual-feature microchannel heat sink structure with manifold and fractal coupling solves the high flow resistance problem of traditional heat dissipation structures.

[0033] like Figure 1-2 As shown, in one embodiment, the outer contour of the upper manifold channel structure 31 is serpentine, and the lower fractal microchannel structure 32 is arranged in the shape of a fractal microchannel structure. The upper manifold channel structure 31 divides the manifold microchannel plate 3 into two separate chambers, one connected to the water diversion chamber as the water inlet channel 7, and the other connected to the water outlet channel as the water outlet channel 8. In this way, the water inlet channel is connected to the inlet diversion chamber 12, allowing coolant to enter the water inlet channel 7 in sequence along the inlet water storage chamber 11 and the inlet diversion chamber 12. The water inlet channel 7 is connected to the outlet diversion chamber 14, allowing coolant to flow upward from the lower fractal microchannel structure 32 to the water outlet channel 8 and out of the water outlet.

[0034] like Figure 1-5As shown, in one embodiment, the lower fractal microchannel structure 32 includes a plurality of multi-branch microchannel units connected in sequence, the multi-branch microchannel units are symmetrically arranged along the X-axis and the Y-axis, the multi-branch microchannel units include a diversion point 6 and a plurality of microchannels 4, the plurality of microchannels are symmetrically arranged along the X-axis and the Y-axis and are all connected to the diversion point 6, a microchannel 4 of one multi-branch microchannel unit is connected to a microchannel 4 of another multi-branch microchannel unit to form a confluence point 5; the water inlet channel 7 is provided above the diversion point 6 and is connected to the diversion point 6, the water outlet channel 8 is provided above the confluence point 5 and is connected to the confluence point 5; the lower fractal microchannel structure 32 is further provided with a plurality of first microchannels 16 arranged at intervals, the first microchannels 16 are arranged perpendicular to the water outlet channel 8 and the water inlet channel 7, and the first microchannels 16 pass through the confluence point 5 and the diversion point 6 in sequence. In this way, the coolant enters the diversion point 6 through the water inlet channel 7, and is diverted to multiple microchannels 4 through the diversion point 6, reducing the impact and backflow effects generated at the interface between the traditional manifold channel and the microchannel, reducing the pressure loss at the interface between the traditional manifold channel and the microchannel, avoiding the formation of liquid barriers, and expanding the applicable flow range of the manifold microchannel heat sink; a microchannel 4 of one of the multi-branch microchannel units is connected with a microchannel 4 of another multi-branch microchannel unit to form a confluence point 5, so that after the liquid is diverted through the diversion point 6, the cold and hot fluids are fully mixed at the confluence point 5 and flow out from the water outlet channel 8, increasing the fluid disturbance in the horizontal direction, and improving the convective heat transfer capacity and temperature uniformity performance of the microchannel heat sink.

[0035] like Figure 1 As shown, in one embodiment, a first quick pipe joint 9 is provided on the water inlet, and a second quick pipe joint 10 is provided on the water outlet, so as to improve the efficiency of the docking work.

[0036] like Figure 1 As shown, in one embodiment, the depth of the inlet water storage chamber 11 is greater than the depth of the inlet diversion chamber 12, the depth of the outlet water storage chamber 15 is greater than the depth of the outlet diversion chamber 14, the depth of the inlet diversion chamber 12 and the depth of the outlet diversion chamber 14 are equal to the height of the upper manifold channel structure 31, and the depth of the microchannel placement chamber 13 is equal to the thickness of the manifold microchannel plate 3.

[0037] like Figure 1 As shown, in one embodiment, a sealing ring is further provided on the bottom plate 2 and is arranged around the concave cavity. In this way, the sealing ring is provided to provide the sealing performance of the dual-feature microchannel heat sink structure with manifold and fractal coupling.

[0038] In one embodiment, the cover plate 1 and the base plate 2 are fixedly connected by bolts.

[0039] In one embodiment, the plate is fixedly connected to the base plate 22 by welding.

[0040] Specifically, the material of the dual-feature microchannel heat sink structure with manifold and fractal coupling can be a high thermal conductivity material such as copper, silicon, aluminum, etc.

[0041] In one embodiment, the upper manifold channel structure is integrally processed with the cover plate, and the lower fractal microchannel structure is integrally processed with the base plate.

[0042] In one embodiment, the cover plate, the manifold microchannel plate, and the base plate are manufactured separately.

[0043] In one embodiment, the fractal angle of the multi-division microchannel unit is 0-90°.

[0044] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0045] The above-described embodiments merely illustrate several implementations of the present invention, and while their descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be determined by the appended claims.

Claims

1. A dual-feature microchannel heat sink structure with manifold and fractal coupling, characterized in that: The manifold microchannel plate comprises a cover plate, a manifold microchannel plate and a bottom plate, wherein the cover plate is provided with a water inlet and a water outlet, the manifold microchannel plate comprises a lower fractal microchannel structure and an upper manifold channel structure provided on the lower fractal microchannel structure, the manifold microchannel plate is an integrated structure, the bottom plate is provided with a concave cavity, the concave cavity comprises an inlet water storage cavity, an inlet diversion cavity, a microchannel placement cavity, an outlet diversion cavity and an outlet water storage cavity which are connected in sequence, the water inlet is connected to the inlet water storage cavity, the water outlet is connected to the outlet water storage cavity, and the manifold microchannel plate is arranged in the microchannel placement cavity; The outer contour of the upper manifold channel structure is in the shape of a snake, and the lower fractal microchannel structure is arranged in the shape of a fractal microchannel structure; The upper manifold channel structure divides the manifold microchannel plate into two separate chambers, one of which is connected to the water diversion chamber as a water inlet channel, and the other of which is connected to the water diversion chamber as a water outlet channel; The lower fractal microchannel structure includes a plurality of sequentially connected multi-branch microchannel units, the multi-branch microchannel units are symmetrically arranged along the X-axis and the Y-axis, the multi-branch microchannel units include a diversion point and a plurality of microchannels, the plurality of microchannels are symmetrically arranged along the X-axis and the Y-axis and are all connected to the diversion point, and a microchannel of one multi-branch microchannel unit is connected to a microchannel of another multi-branch microchannel unit to form a confluence point.

2. The dual-feature microchannel heat sink structure with manifold and fractal coupling according to claim 1, characterized in that: The water inlet channel is arranged above the diversion point and communicated with the diversion point, and the water outlet channel is arranged above the confluence point and communicated with the confluence point.

3. The dual-feature microchannel heat sink structure with manifold and fractal coupling according to claim 2, characterized in that: The depth of the inlet water storage chamber is greater than the depth of the inlet diversion chamber, the depth of the outlet water storage chamber is greater than the depth of the outlet diversion chamber, the depth of the inlet diversion chamber and the depth of the outlet diversion chamber are equal to the height of the upper manifold channel structure, and the depth of the microchannel placement chamber is equal to the thickness of the manifold microchannel plate.

4. The dual-feature microchannel heat sink structure with manifold and fractal coupling according to claim 1, characterized in that: The water inlet is provided with a first quick pipe joint, and the water outlet is provided with a second quick pipe joint.

5. The dual-feature microchannel heat sink structure with manifold and fractal coupling according to claim 1, characterized in that: The lower fractal microchannel structure is further provided with a plurality of first microchannels arranged at intervals. The first microchannels are arranged perpendicular to the water outlet channel and the water inlet channel. The first microchannels pass through the confluence point and the diversion point in sequence.

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