A method for manufacturing a pillar type copper platform circuit board and a pillar type copper platform circuit board

Abstract

The present invention provides a method for manufacturing a pillar-type copper platform circuit board and a pillar-type copper platform circuit board, which belongs to the technical field of circuit board manufacturing, and solves the problem that the surface flatness of the product is not high and the surface is easily scratched and damaged during the manufacturing process of the pillar-type copper platform. The method includes: providing a substrate and a copper base; pre-treating the substrate to obtain a substrate with a circuit; milling the copper base to obtain a plurality of copper pillars; pressing and laminating the substrate with the circuit and the plurality of copper pillars to obtain a substrate with a plurality of copper pillars; and drawing and electroplating the substrate with the plurality of copper pillars to obtain a pillar-type copper platform circuit board. This scheme improves the surface flatness of the pillar-type copper platform circuit board and effectively avoids scratches and damage to the product surface.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board manufacturing, in particular to a manufacturing method of a pillar type copper platform circuit board and the pillar type copper platform circuit board. Background Art

[0002] In the electronics industry, pillar copper pallets are often used as key components of printed circuit boards (PCBs), especially in high-end electronic devices and chip packaging. As the integration of electronic products continues to increase, higher requirements are placed on the electrical connectivity and heat dissipation performance of circuit boards. Pillar copper pallets have become an important material for achieving these requirements due to their excellent electrical conductivity, thermal conductivity and mechanical strength. Their pillar structure can provide stable electrical connection points while enhancing heat dissipation to ensure stable operation of electronic components.

[0003] The production of pillar copper tabletops involves multiple processes, including material preparation, precision machining, electroplating, etc. With the continuous advancement of material processing technology, such as the application of high-precision CNC machining, micromachining, chemical copper plating and other technologies, it provides a more reliable and efficient means for the production of pillar copper tabletops. However, at present, there are problems in the production process of pillar copper tabletops, such as low surface flatness of the product and easy scratches and damage on the surface. These problems require improvements in the production method of pillar copper tabletops to ensure that the quality and performance of the final product meet the expected standards. Summary of the invention

[0004] The invention provides a method for manufacturing a pillar type copper platform circuit board and a pillar type copper platform circuit board, which solves the problem that the surface flatness of the product is not high and the surface is easily scratched and damaged during the manufacturing process of the pillar type copper platform board.

[0005] In order to solve the above technical problems, the technical solution of the present invention is as follows:

[0006] An embodiment of the present invention provides a method for manufacturing a pillar-type copper platform circuit board, comprising:

[0007] Provide substrate and copper base;

[0008] Pre-processing the substrate to obtain a substrate with circuits;

[0009] Milling the copper base to obtain a plurality of copper pillars;

[0010] Performing a lamination process on the substrate with circuits and the plurality of copper pillars to obtain a substrate with a plurality of copper pillars;

[0011] The substrate with a plurality of copper pillars is subjected to a wire drawing and electroplating process to obtain a pillar-type copper platform circuit board.

[0012] Optionally, pre-processing the substrate to obtain a substrate with circuits includes:

[0013] Cutting the substrate according to the first preset cutting parameters to obtain a cut substrate;

[0014] According to the preset copper reduction parameters, the substrate after cutting is subjected to copper reduction treatment to obtain a substrate after copper reduction;

[0015] Performing a drilling process on the copper-reduced substrate to obtain a drilled substrate;

[0016] Performing through-hole electroplating processing on the drilled substrate to obtain a substrate with through-hole electroplating;

[0017] The substrate with the through-holes electroplated is subjected to secondary processing to obtain a substrate with circuits.

[0018] Optionally, the substrate with the through-holes electroplated is subjected to secondary processing to obtain a substrate with circuits, including:

[0019] Performing whole-board electroplating on the substrate after the through-holes are electroplated to obtain a whole-board electroplated substrate;

[0020] Performing a plugging process on the substrate after the whole-plate electroplating to obtain a plugged substrate;

[0021] Performing drilling and electroplating on the substrate after the plugging to obtain a substrate after the drilling and electroplating;

[0022] According to preset copper removal parameters, copper removal is performed on the substrate after the drilling and electroplating through-hole processing to obtain a copper-removed substrate;

[0023] Performing pattern electroplating on the copper-cut substrate to obtain a pattern electroplated substrate;

[0024] The substrate after pattern electroplating is subjected to circuit etching processing to obtain a substrate with circuits.

[0025] Optionally, the copper base is milled to obtain a plurality of copper pillars, including:

[0026] According to the second preset cutting parameter, the copper base is cut to obtain a cut copper base;

[0027] According to preset milling parameters, the cut copper base is milled to obtain a plurality of milled copper columns;

[0028] The plurality of copper pillars after milling are subjected to browning treatment to obtain a plurality of copper pillars.

[0029] Optionally, the substrate with the circuit and the plurality of copper pillars are subjected to a lamination process to obtain a substrate with the plurality of copper pillars, comprising:

[0030] Performing drilling processing on the substrate with circuits to obtain a substrate with drilled holes;

[0031] Performing a browning treatment on the substrate with the drilled holes to obtain a browned substrate;

[0032] The browned substrate and the plurality of copper pillars are subjected to a lamination process to obtain a substrate with a plurality of copper pillars.

[0033] Optionally, the diameter of the drilled hole is 0.09 mm to 0.11 mm larger than the diameter of the copper column.

[0034] Optionally, the substrate with multiple copper pillars is subjected to a wire drawing electroplating process to obtain a pillar-type copper platform circuit board, comprising:

[0035] Performing wire drawing on the substrate with the multiple copper pillars to obtain a wire drawn substrate;

[0036] Performing through-hole electroplating processing on the wire-drawn substrate to obtain a wire-drawn substrate with through-hole electroplating;

[0037] Performing pattern electroplating on the brushed substrate after the through-hole electroplating to obtain a pattern-plated substrate;

[0038] Performing circuit etching on the substrate after pattern electroplating to obtain a substrate with circuits;

[0039] The substrate with the circuit is processed three times to obtain a pillar-type copper platform circuit board.

[0040] Optionally, the substrate with the circuit is processed three times to obtain a pillar-type copper platform circuit board, including:

[0041] Performing solder resist text processing on the substrate with the circuit to obtain a substrate after solder resist text processing;

[0042] Performing immersion gold treatment on the substrate after the solder mask text treatment to obtain a substrate after the immersion gold treatment;

[0043] The substrate after the immersion gold treatment is subjected to a drilling depth control treatment to obtain a pillar-type copper platform circuit board.

[0044] Optionally, the method for making a pillar type copper platform circuit board also includes:

[0045] The pillar type copper platform circuit board is tested and inspected according to preset test conditions to obtain a qualified pillar type copper platform circuit board; the preset test conditions include at least one of the following conditions:

[0046] Flatness test conditions, the maximum flatness error is 15um;

[0047] Thermal shock test conditions: the temperature of the thermal shock test is 288°C ± 5°C, the time of the thermal shock test is at least 10s, and the number of thermal shock tests is at least 3 times.

[0048] The embodiment of the present invention further provides a pillar type copper platform circuit board, and the pillar type copper platform circuit board is prepared according to the above method.

[0049] The technical solution of the present invention includes at least the following effects:

[0050] The above scheme of the present invention provides a substrate and a copper base, and pre-processes the substrate to obtain a substrate with a circuit; performs a milling process on the copper base to obtain a plurality of copper pillars; performs a lamination process on the substrate with a circuit and the plurality of copper pillars to obtain a substrate with a plurality of copper pillars; and performs a wire drawing and electroplating process on the substrate with a plurality of copper pillars to obtain a pillar-type copper platform circuit board. This scheme improves the product surface flatness of the pillar-type copper platform circuit board and effectively avoids scratches and damage to the product surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] Figure 1 It is a flow chart of a method for manufacturing a pillar type copper platform circuit board provided by an embodiment of the present invention;

[0052] Figure 2 It is a front schematic diagram of a pillar-type copper platform circuit board provided by an embodiment of the present invention;

[0053] Figure 3 It is a schematic diagram of the back side of the pillar type copper platform circuit board provided by an embodiment of the present invention;

[0054] Among them, 1. pillar-type copper base circuit board; 11. substrate; 12. copper pillar. DETAILED DESCRIPTION

[0055] The exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present invention and to enable the scope of the present invention to be fully communicated to those skilled in the art.

[0056] like Figure 1 As shown, an embodiment of the present invention provides a method for manufacturing a pillar type copper platform circuit board, comprising:

[0057] Step 11, providing a substrate and a copper base;

[0058] Step 12, pre-treating the substrate to obtain a substrate with circuits;

[0059] Step 13, performing milling processing on the copper base to obtain a plurality of copper pillars;

[0060] Step 14, performing a lamination process on the substrate with circuits and the plurality of copper pillars to obtain a substrate with a plurality of copper pillars;

[0061] Step 15, performing wire drawing and electroplating treatment on the substrate with multiple copper pillars to obtain a pillar-type copper platform circuit board.

[0062] In this example, two key materials are first prepared: substrate and copper base. The substrate is the basic material for manufacturing circuit boards, and has good insulation performance and mechanical strength. Common substrate materials include epoxy resin, glass fiber reinforced epoxy resin (FR-4), etc. The copper base is the raw material for the subsequent formation of multiple copper columns, and exists in the form of copper blocks.

[0063] Pre-processing the substrate to obtain a substrate with circuits; wherein the pre-processing process includes multiple sub-steps, aiming to make the substrate surface suitable for subsequent circuit production, including cutting the substrate to obtain a substrate of a preset size; and then performing copper reduction, drilling and other processing processes to obtain a substrate with circuits;

[0064] The copper base is milled to obtain a plurality of copper pillars; specifically, the copper base is precisely milled using precision processing equipment such as a CNC milling machine or a laser cutting machine, and the copper base is cut into a plurality of copper pillars with specific shapes and sizes according to design requirements. These copper pillars will serve as pillars for subsequent connection with the substrate to support and connect different parts of the circuit. The processing accuracy must be strictly controlled during the milling process to ensure that the size, shape and position of the copper pillars meet the design requirements;

[0065] The substrate with the circuit and the multiple copper pillars are subjected to a lamination process to obtain a substrate with multiple copper pillars; specifically, the substrate with the circuit is first placed on a lower mold of a laminating machine, and then multiple copper pillars are placed on the substrate according to a predetermined layout, and then a protective film or an insulating layer is covered over the copper pillars and the substrate to prevent the copper pillars and the circuit from being damaged during subsequent processing; the laminating machine is started to apply a certain pressure and temperature to the substrate, the copper pillars and the protective film to tightly combine them together; after the lamination is completed, the excess protective film is removed to obtain a substrate with multiple copper pillars;

[0066] The substrate with multiple copper pillars is subjected to wire drawing and electroplating treatment to obtain a pillar-type copper platform circuit board; specifically, the substrate with multiple copper pillars is subjected to wire drawing treatment to achieve the cleaning of the substrate, glue overflow and leveling; then the substrate with multiple copper pillars is placed in an electroplating tank, and a layer of metal is deposited on the surface of the copper pillars and the substrate by electrolysis; during the electroplating process, by controlling parameters such as current density, electroplating time and composition of the electroplating solution, a metal coating with a specific texture and thickness can be formed on the surface of the copper pillars and the substrate; after the electroplating is completed, the circuit is etched, solder mask text is processed, gold is immersion, and drilling depth is controlled to obtain a pillar-type copper platform circuit board.

[0067] The technical solution of the above-mentioned embodiment of the present invention improves the surface flatness of the pillar-type copper table plate, and effectively avoids scratches and damages on the surface of the product.

[0068] In an optional embodiment, the embodiment of the present invention provides that step 12 may include:

[0069] Step 121, cutting the substrate according to a first preset cutting parameter to obtain a cut substrate;

[0070] Step 122, performing copper reduction processing on the substrate after cutting according to preset copper reduction parameters to obtain a substrate after copper reduction;

[0071] Step 123, drilling the copper-reduced substrate to obtain a drilled substrate;

[0072] Step 124, performing through-hole electroplating processing on the drilled substrate to obtain a substrate with through-hole electroplating;

[0073] Step 125, performing secondary processing on the substrate with the through-holes plated thereon to obtain a substrate with circuits.

[0074] In this embodiment, firstly, it is necessary to determine the first preset cutting parameters, including the cutting path, cutting size, etc.; the selection of the first preset cutting parameters depends on the material, thickness, required dimensional accuracy and subsequent processing requirements of the substrate; a cutting device (such as a laser cutting machine, a mechanical cutting machine, etc.) is used to accurately cut the substrate according to the preset parameters, and the cutting quality needs to be strictly controlled during the cutting process to ensure that the cutting edge is flat and burr-free, and the dimensional accuracy meets the design requirements; after the cutting is completed, a substrate after cutting is obtained, that is, a substrate that has been cut according to a predetermined size and shape;

[0075] Copper reduction treatment is usually used to adjust the thickness of the copper layer on the substrate to meet the requirements of subsequent processing or product performance. First, the preset copper reduction parameters are determined, including the copper reduction rate, copper reduction time, the composition and concentration of the copper reduction solution, etc. Then, the cut substrate is placed in the copper reduction equipment, and the copper layer on the substrate is subjected to copper reduction treatment according to the preset parameters by chemical etching or electrolytic etching. During the copper reduction process, the uniformity and depth of the copper reduction need to be strictly controlled to avoid over-reduction or under-reduction. After the copper reduction is completed, a copper-reduced substrate is obtained, that is, a substrate whose copper layer thickness has been adjusted to a predetermined range.

[0076] The purpose of drilling is to form through holes on the substrate that connect different layers of circuits. In this step, special drilling equipment, such as laser drilling machines, mechanical drilling machines, etc., are used to drill holes in the copper-reduced substrate. During the drilling process, the position, diameter and depth of the holes need to be precisely controlled to ensure that the position accuracy and size accuracy of the through holes meet the design requirements. At the same time, care should be taken to avoid damage to the substrate caused by burrs and debris generated during the drilling process. After the drilling is completed, the drilled substrate is obtained, that is, the substrate with through holes drilled according to the predetermined position and size.

[0077] The purpose of electroplating through-hole processing is to deposit a layer of conductive metal (usually copper) on the inner wall of the through-hole formed after drilling, so as to achieve electrical connection between different layers of circuits. In this step, the substrate after drilling is first placed in the electroplating tank, and then the electroplating solution is introduced and current is applied to reduce and deposit the copper ions in the electroplating solution on the inner wall of the through-hole to form a copper layer. During the electroplating process, it is necessary to control the composition, concentration, temperature and current density of the electroplating solution to ensure that the uniformity and thickness of the electroplated layer meet the design requirements. After the electroplating is completed, the substrate after electroplating through-hole is obtained after cleaning and drying, that is, the substrate with the inner wall of the through-hole plated with a copper layer.

[0078] The substrate with the plated through holes is subjected to secondary processing to obtain a substrate with circuits; specifically, the substrate with the plated through holes is first subjected to whole-board electroplating processing to obtain a whole-board plated substrate, that is, the substrate with the plated through holes is placed in an electroplating tank for whole-board electroplating processing. The purpose of whole-board electroplating is to uniformly deposit a layer of copper or other conductive metal on the entire surface of the substrate (including the inside and surface of the through holes); this can not only increase the conductivity of the substrate, but also provide sufficient metal layer thickness for subsequent processing; during the electroplating process, it is necessary to control parameters such as the composition, temperature, current density and electroplating time of the electroplating solution to ensure that the uniformity and thickness of the electroplated layer meet the design requirements; after the electroplating is completed, the substrate surface and the inside of the through holes will be covered with a uniform metal layer to form a whole-board plated substrate;

[0079] The plugging treatment is performed on the substrate after the whole plate electroplating to obtain a plugged substrate; the plugging treatment is to fill and cure the through holes that do not need subsequent connection on the substrate after the whole plate electroplating with non-conductive materials, such as resin, ink, etc., to prevent the plating solution or etching solution from entering the through holes during the subsequent processing; this step usually uses special plugging equipment or processes to accurately fill the plugging material into the through holes and cure it by heating or ultraviolet irradiation; after the plugging is completed, the plugged substrate is obtained, and the through hole part of these substrates is effectively closed, which provides convenience for subsequent processing;

[0080] The plugged substrate is subjected to drilling and through-hole electroplating to obtain a substrate after drilling and through-hole electroplating. Although through-hole electroplating has been performed before, the plugged substrate needs to be subjected to additional drilling in this step to form through-holes for inserting electrical components. After drilling is completed, through-hole electroplating is performed again to ensure that the newly formed through-hole is also covered with a conductive metal layer. This step is similar to the previous through-hole electroplating, but the electroplating parameters also need to be adjusted according to the characteristics of the newly formed through-hole. After completion, a substrate after drilling and through-hole electroplating is obtained.

[0081] According to the preset copper-cutting parameters, the substrate after the drilling and electroplating through-hole processing is subjected to copper-cutting treatment to obtain the copper-cutting substrate; specifically, the copper-cutting treatment is a process of removing part of the copper layer on the surface of the substrate by chemical or mechanical methods; in this step, according to the preset copper-cutting parameters, the position of the preset copper column is subjected to copper-cutting treatment, and the copper-cutting is designed according to the copper column diameter compensation of 0.2mm to prevent short circuit;

[0082] The copper-cut substrate is subjected to pattern electroplating treatment to obtain a pattern-plated substrate; specifically, the pattern electroplating treatment is a process of depositing a conductive metal on a specific area on the surface of the substrate; in this step, a photoresist pattern is first formed on the surface of the substrate using photolithography technology, and the pattern defines the area to be electroplated; then the substrate is placed in an electroplating tank, and metal copper is deposited at the opening of the photoresist pattern by electroplating; after the electroplating is completed, the photoresist pattern is removed to obtain a pattern-plated substrate; the surface of these substrates is covered with a conductive metal layer only in a specific area, forming a clear circuit pattern;

[0083] The substrate after the pattern electroplating is etched to obtain a substrate with circuits. Specifically, the etching process is a process of removing the unnecessary copper layer on the surface of the substrate by chemical etching. In this step, the substrate after the pattern electroplating is etched with an etching liquid. The etching liquid selectively reacts with the unprotected copper layer to dissolve and remove it. The photoresist or other protective materials cover the copper layer that needs to be retained to prevent it from being corroded by the etching liquid. After the etching is completed, the protective material is removed to obtain a substrate with circuits. The surface of these substrates forms a precise circuit pattern, which provides a basis for subsequent assembly and testing.

[0084] In an optional embodiment, the embodiment of the present invention provides that step 13 may include:

[0085] Step 131, cutting the copper base according to the second preset cutting parameter to obtain a cut copper base;

[0086] Step 132, performing milling processing on the cut copper base according to preset milling parameters to obtain a plurality of milled copper columns;

[0087] Step 133 , performing browning treatment on the plurality of copper pillars after milling to obtain a plurality of copper pillars.

[0088] In this embodiment, the copper base is cut according to the second preset cutting parameters, including the cutting path, the cutting size, etc., to obtain the copper base after cutting; wherein the main purpose of this step is to cut the original copper base material (copper plate or copper block) according to the specific size and shape requirements for subsequent processing; the copper base material is accurately placed on the workbench of the cutting equipment, and is firmly fixed by a clamp or other fixing device to prevent movement or offset during the cutting process; the cutting equipment is started, and cutting is performed according to the preset cutting parameters; during the cutting process, the equipment automatically or manually moves according to the set path, and the cutting blade cuts the copper base at a certain speed and depth; after the cutting is completed, the copper base after cutting that meets the subsequent processing requirements is obtained;

[0089] According to preset milling parameters, the copper base after cutting is milled to obtain a plurality of copper pillars after milling; the purpose of this step is to further process the copper base after cutting into a plurality of copper pillars of specific shapes and sizes; the copper base after cutting is placed on the workbench of the milling machine and fixed with a clamp; the position and angle of the copper base are ensured to be accurate so as to perform milling according to the design requirements; milling operation: start the milling machine and perform milling according to preset milling parameters; during the milling process, the milling cutter will cut the copper base according to the set path and depth, and gradually process it into a plurality of copper pillars; after the milling is completed, the copper pillars are removed from the copper base by a separation operation;

[0090] The multiple copper pillars after milling are subjected to browning treatment to obtain multiple copper pillars; wherein, the browning treatment is a surface treatment technology aimed at improving the corrosion resistance and adhesion of the copper pillars; before the browning treatment, the copper pillars need to be thoroughly cleaned to remove impurities such as oil stains and oxides on the surface; the cleaning methods include solvent cleaning, ultrasonic cleaning, etc.; the cleaned copper pillars are immersed in the browning liquid and soaked for a predetermined time and temperature; the chemical components in the browning liquid will react with the surface of the copper pillar to form a dense oxide film; after the treatment is completed, the copper pillars are taken out of the browning liquid and rinsed with water; the copper pillars after the browning treatment are placed in a ventilated and dry place for natural drying or dried in an oven; after drying, check whether the surface of the copper pillar is evenly covered with a layer of brown oxide film, and whether there are defects such as cracks and shedding.

[0091] In an optional embodiment, the embodiment of the present invention provides that step 14 may include:

[0092] Step 141, drilling the substrate with the circuit to obtain a substrate with drilled holes;

[0093] Step 142, performing a browning treatment on the substrate with the drilled holes to obtain a browned substrate;

[0094] Step 143 , performing a lamination process on the browned substrate and the plurality of copper pillars to obtain a substrate with a plurality of copper pillars.

[0095] In this embodiment, firstly, a CNC drilling machine or a laser drilling machine is used to drill holes in the substrate according to the set parameters; during the drilling process, the stability and accuracy of the equipment need to be maintained to avoid deviation or breakage of the drill bit, which may lead to inaccurate hole position or damage to the substrate; after the drilling is completed, the drill cuttings and impurities on the substrate are cleaned; then, the quality of the drilled hole is checked, including whether the diameter, depth, and position of the hole meet the design requirements, and whether the hole wall is smooth and undamaged; the diameter of the drilled hole is 0.09 mm to 0.11 mm larger than the diameter of the copper column;

[0096] Prepare an appropriate amount of browning liquid according to the process requirements; the browning liquid is usually prepared from acidic or alkaline chemicals, which can react chemically with the metal on the surface of the substrate to form a dense oxide film; immerse the cleaned substrate in the browning liquid and soak it for a predetermined time and temperature; the chemical components in the browning liquid will react with the metal on the surface of the substrate to form a brown oxide film; during the treatment process, it is necessary to control the immersion time and temperature to avoid excessive browning resulting in degradation of substrate performance; after the browning treatment is completed, take the substrate out of the browning liquid and rinse it with deionized water or purified water; then place the substrate in a ventilated and dry place for natural drying or use an oven for drying;

[0097] Place the prepared copper pillars one by one into the drilled holes on the substrate; during the placement process, it is necessary to ensure that the position of the copper pillars is accurate and fits tightly with the drilled holes; use a press to press the substrate; during the pressing process, a certain pressure and temperature are applied to firmly fix the copper pillars on the substrate; at the same time, pressing can also eliminate the gaps and bubbles between the substrate and the copper pillars, and improve the stability and reliability of the overall structure; after pressing is completed, the substrate with multiple copper pillars is inspected; the inspection content includes whether the position of the copper pillars is accurate, whether the combination with the substrate is firm, and whether the surface is flat and defect-free.

[0098] In an optional embodiment, the embodiment of the present invention provides that step 15 may include:

[0099] Step 151, performing wire drawing on the substrate with the multiple copper pillars to obtain a wire drawing substrate;

[0100] Step 152, performing through-hole electroplating processing on the brushed substrate to obtain a brushed substrate with through-hole electroplating;

[0101] Step 153, performing pattern electroplating on the brushed substrate after the through-hole electroplating to obtain a substrate after pattern electroplating;

[0102] Step 154, performing circuit etching processing on the substrate after pattern electroplating to obtain a substrate with circuits;

[0103] Step 155, processing the substrate with circuits three times to obtain a pillar-type copper base circuit board.

[0104] In this embodiment, the substrate with multiple copper pillars is firstly subjected to a wire drawing process to obtain a wire drawing substrate; the wire drawing process can remove oxides, pollutants and uneven layers on the substrate surface (especially the copper pillar surface) to improve the adhesion and uniformity of the subsequent electroplating layer; then the wire drawing substrate is subjected to a plated through hole process to obtain a wire drawing substrate with a plated through hole; the plated through hole (Plated Through Hole, The purpose of the PTH treatment is to deposit a layer of conductive metal (usually copper) on the inner wall of the through hole of the substrate to achieve electrical connection between different layers; after the PTH treatment, the wire drawing substrate after the electroplated through hole is subjected to pattern electroplating treatment to obtain a substrate after pattern electroplating; pattern electroplating is to selectively electroplate on the substrate according to a predetermined circuit pattern to increase the thickness and conductivity of the circuit line, while protecting the non-circuit area from being electroplated; the substrate after the pattern electroplating is subjected to circuit etching treatment to obtain a substrate with circuits; wherein, circuit etching is to remove the copper layer in the non-circuit area and only retain the circuit pattern formed by electroplating; the substrate with circuits is subjected to three treatments to obtain a pillar type copper platform circuit board; wherein, the three treatments include: performing solder mask text treatment on the substrate with circuits to obtain a substrate after solder mask text treatment; performing immersion gold treatment on the substrate after solder mask text treatment to obtain a substrate after immersion gold treatment; performing drilling depth control treatment on the substrate after immersion gold treatment to obtain a pillar type copper platform circuit board.

[0105] A specific embodiment of the method for manufacturing a pillar type copper platform circuit board provided by an embodiment of the present invention is:

[0106] Step 1, providing a substrate and a copper base;

[0107] Specifically, the substrate material is glass fiber reinforced epoxy resin (FR-4).

[0108] Step 2, pre-treating the substrate to obtain a substrate with circuits;

[0109] Specifically, a laser cutting machine is used to accurately cut the substrate according to preset parameters to obtain a substrate cut according to a predetermined size and shape, wherein the copper coating on the first surface and the second surface of the substrate is 1.5OZ;

[0110] Then, the cut substrate is placed in a copper reduction device, and the copper layer of the substrate is subjected to copper reduction treatment according to preset parameters, wherein the copper on the first surface of the substrate is reduced to 1.0OZ, and after the copper reduction treatment is completed, the copper coatings on the first surface and the second surface of the substrate are 1.0OZ and 1.5OZ respectively;

[0111] The substrate is drilled for the first time to form through holes connecting different layers of circuits on the substrate. A 3.175mm drill bit is used to drill the positioning holes.

[0112] After the drilling is completed, the drilled substrate is obtained, and then the through-hole electroplating process is performed, so that a layer of conductive metal copper is deposited on the inner wall of the through-hole formed after the drilling, so as to realize the electrical connection between the circuits of different layers;

[0113] The substrate after the through-hole electroplating is placed in an electroplating tank for whole-board electroplating, so that a layer of metal copper is evenly deposited on the entire surface of the substrate (including the inside and surface of the through-hole), wherein the copper thickness is not less than 18 μm;

[0114] The through-holes that do not need to be connected later are filled with resin material and cured to prevent the plating solution or etching solution from entering the through-holes during the subsequent processing;

[0115] The substrate after the resin plugging hole is subjected to a second drilling process and an electroplated through-hole process, wherein the second drilling process is used to form a through-hole for inserting an electrical component; after the drilling is completed, the electroplated through-hole process is performed again to ensure that the newly formed through-hole is also covered with a conductive metal layer; after the second drilling process and the electroplated through-hole process are completed, a substrate after the drilling and electroplated through-hole processes is obtained;

[0116] According to the preset copper-cutting parameters, for the substrate after the drilling and electroplating through-hole processing, according to the preset copper-cutting parameters, the position of the preset copper pillar is subjected to copper-cutting processing according to the copper pillar diameter compensation design of 0.2mm, so as to form a slot for installing the copper pillar and prevent short circuit;

[0117] The copper-cut substrate is subjected to pattern electroplating treatment to obtain a pattern-plated substrate; the copper coatings on the first surface (front surface) and the second surface (back surface) of the substrate are 1.5OZ and 2.0OZ respectively;

[0118] The substrate after pattern electroplating is subjected to circuit etching processing to obtain a substrate with circuits.

[0119] Step 3, performing milling on the copper base to obtain a plurality of copper pillars;

[0120] Specifically, the copper base is cut according to the second preset cutting parameter to obtain a cut copper base, wherein the thickness of the copper base material is 4.0 mm;

[0121] According to preset milling parameters, the copper base after cutting is milled to obtain 9 copper pillars after milling, wherein the height of the copper pillars is controlled within the range of 1.72 mm to 1.75 mm;

[0122] browning the plurality of copper pillars after milling, and finally obtaining 9 prepared copper pillars;

[0123] Step 4, performing a lamination process on the substrate with the circuit and the plurality of copper pillars to obtain a substrate with the plurality of copper pillars;

[0124] Specifically, a laser drilling machine is used to drill a third hole on the substrate according to set parameters; the diameter of the drilled hole is 0.1 mm larger than the diameter of the copper column;

[0125] The substrate after the third drilling is placed in a browning liquid for browning treatment, so that a dense oxide film is formed on the surface of the substrate;

[0126] The prepared copper pillars are placed one by one into the drilled holes on the substrate, and the substrate is pressed by a pressing machine; after the pressing is completed, a substrate with multiple copper pillars is obtained;

[0127] Step 5, performing a wire drawing electroplating process on the substrate with a plurality of copper pillars to obtain a pillar-type copper platform circuit board;

[0128] Specifically, the substrate with the plurality of copper pillars is subjected to a wire drawing process to obtain a wire drawing substrate; through the wire drawing process, the glue overflowing from the copper pillars can be cleaned and the substrate can be smoothed;

[0129] The wire-drawn substrate is subjected to electroplating through-hole processing to obtain a wire-drawn substrate with electroplated through-holes, wherein the copper base surface is protected and metal copper cannot be deposited;

[0130] Performing pattern electroplating on the brushed substrate after the through-hole electroplating to obtain a pattern-plated substrate, wherein when the first side of the substrate is subjected to pattern electroplating, the copper thickness increases from 1.5OZ to 2.0OZ;

[0131] Performing circuit etching on the substrate after pattern electroplating to obtain a substrate with circuits;

[0132] Performing solder mask text processing on the substrate with the circuit to obtain a substrate after solder mask text processing, through the solder mask text processing, the solder mask layer has the functions of preventing short circuits and enhancing the strength of solder joints; and covering text, graphics and other information on the solder mask layer;

[0133] Performing immersion gold treatment on the substrate after the solder mask text treatment to obtain a substrate after the immersion gold treatment;

[0134] The substrate after the immersion gold treatment is subjected to drilling depth control treatment so that the height of the copper column is not higher than the basic surface, thereby obtaining a pillar-type copper platform circuit board.

[0135] The manufacturing method of the pillar type copper platform circuit board proposed by the present invention improves the product surface flatness of the pillar type copper platform board and effectively avoids scratches and damages on the product surface.

[0136] In an optional embodiment of the present invention, the method further comprises the following steps:

[0137] Step 161, testing and inspecting the pillar type copper platform circuit board according to preset test conditions to obtain a qualified pillar type copper platform circuit board; the preset test conditions include at least one of the following conditions:

[0138] Step 162, flatness test conditions, the maximum flatness error is 15um;

[0139] Step 163, thermal shock test conditions: the temperature of the thermal shock test is 288°C ± 5°C, the time of the thermal shock test is at least 10s, and the number of thermal shock tests is at least 3 times.

[0140] In this embodiment, in order to improve the qualified rate of circuit boards and user satisfaction, it is necessary to inspect the pillar-type copper platform circuit boards. Only circuit boards that pass the preset inspection conditions are qualified pillar-type copper platform circuit boards and can be used for subsequent production or shipment. In this embodiment, after the pillar-type copper platform circuit boards are inspected according to the above inspection method, the qualified pillar-type copper platform circuit boards have a high degree of flatness, which effectively avoids scratches and damage to the product surface.

[0141] like Figure 2 and Figure 3 As shown, an embodiment of the present invention proposes a pillar-type copper platform circuit board 1, and the pillar-type copper platform circuit board 1 is prepared by the manufacturing method of the pillar-type copper platform circuit board described in any one of the above embodiments. The pillar-type copper platform circuit board body 1 includes: a substrate 11, and a plurality of copper pillars 12 (i.e., pillar-type copper platforms) formed on the substrate 11. The total thickness of the pillar-type copper platform circuit board 1 product is 3.6 mm, wherein the height of the copper pillar 12 is 1.6 mm, the thickness of the copper substrate is 2.0 mm, the thickness of the FR-4 is 1.6 mm, and the minimum diameter of the two drill holes is 0.85 mm; the pillar-type copper platform circuit board is drilled multiple times and the depth of the drill holes is controlled, so that the pillar-type copper platform circuit board has a high flatness, which effectively avoids scratches and damage to the product surface. The pillar-type copper platform circuit board provides stable mechanical support, can resist vibration and impact, protect electronic components from damage, and is suitable for electronic devices with high conductivity, high stability and good heat dissipation performance, such as high-end servers, high-performance computers, military communication equipment, etc.

[0142] The above are preferred embodiments of the present invention. It should be pointed out that, for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as within the scope of protection of the present invention.

Claims

1. A method for manufacturing a pillar type copper base circuit board, characterized in that: include: Provide substrate and copper base; Pre-processing the substrate to obtain a substrate with circuits; Milling the copper base to obtain a plurality of copper pillars; Performing a lamination process on the substrate with circuits and the plurality of copper pillars to obtain a substrate with a plurality of copper pillars; The substrate with the plurality of copper pillars is subjected to a wire drawing and electroplating process to obtain a pillar-type copper platform circuit board; The method of pre-processing the substrate to obtain a substrate with circuits includes: According to the first preset cutting parameters, the substrate is cut to obtain a cut substrate, wherein the copper coating on the first surface and the second surface of the substrate is 1.5OZ; According to the preset copper reduction parameters, the substrate after cutting is subjected to copper reduction treatment to obtain a substrate after copper reduction, wherein the copper on the first surface of the substrate is reduced to 1.0OZ, and after the copper reduction treatment is completed, the copper coatings on the first surface and the second surface of the substrate are 1.0OZ and 1.5OZ respectively; Performing a drilling process on the copper-reduced substrate to obtain a drilled substrate; Performing through-hole electroplating processing on the drilled substrate to obtain a substrate with through-hole electroplating; Performing secondary processing on the substrate with the through-holes electroplated to obtain a substrate with circuits; The substrate with the through-holes electroplated is subjected to secondary processing to obtain a substrate with circuits, including: Performing whole-plate electroplating on the substrate after the through-hole electroplating to obtain a whole-plate electroplated substrate, wherein the copper thickness is not less than 18 μm; Performing a plugging process on the substrate after the whole-plate electroplating to obtain a plugged substrate; Performing drilling and electroplating on the substrate after the plugging to obtain a substrate after the drilling and electroplating; According to the preset copper-cutting parameters, the substrate after the drilling and electroplating through-hole processing is subjected to copper-cutting processing to obtain the copper-cutting substrate, wherein the position of the preset copper pillar is subjected to copper-cutting processing according to the copper pillar diameter compensation design of 0.2mm to form a copper pillar installation slot and prevent short circuit; Performing pattern electroplating on the copper-cut substrate to obtain a pattern electroplated substrate; Performing circuit etching processing on the substrate after pattern electroplating to obtain a substrate with circuits; The copper base is milled to obtain a plurality of copper pillars, including: According to the second preset cutting parameter, the copper base is cut to obtain a cut copper base; According to preset milling parameters, the cut copper base is milled to obtain a plurality of milled copper pillars, wherein the height of the copper pillars is controlled within a range of 1.72 mm to 1.75 mm; performing browning treatment on the plurality of copper pillars after milling to obtain a plurality of copper pillars; The substrate with the circuits and the plurality of copper pillars are subjected to a lamination process to obtain a substrate with the plurality of copper pillars, including: Performing drilling processing on the substrate with circuits to obtain a substrate with drilled holes; Performing a browning treatment on the substrate with the drilled holes to obtain a browned substrate; Performing a lamination process on the browned substrate and the plurality of copper pillars to obtain a substrate with a plurality of copper pillars; The substrate with multiple copper pillars is subjected to wire drawing and electroplating treatment to obtain a pillar-type copper platform circuit board, including: Performing a wire drawing process on the substrate with the multiple copper pillars to remove oxides and / or pollutants and / or uneven layers on the surface of the substrate to obtain a wire drawn substrate; Performing through-hole electroplating processing on the drawn substrate, depositing a conductive metal layer on the inner wall of the through-hole of the substrate, and obtaining a drawn substrate with through-hole electroplating; Performing pattern electroplating on the wire drawing substrate after the through-hole electroplating, electroplating on the substrate according to a predetermined circuit pattern to obtain a substrate after pattern electroplating; Performing circuit etching on the substrate after pattern electroplating to remove the copper layer in the non-circuit area and retain only the circuit pattern formed by electroplating to obtain a substrate with circuits; The substrate with the circuit is processed three times to obtain a pillar-type copper platform circuit board; The substrate with the circuit is processed three times to obtain a pillar-type copper platform circuit board, including: Performing solder resist text processing on the substrate with the circuit to obtain a substrate after solder resist text processing; Performing immersion gold treatment on the substrate after the solder mask text treatment to obtain a substrate after the immersion gold treatment; The substrate after the immersion gold treatment is subjected to drilling depth control treatment so that the height of the copper column is not higher than the basic surface, thereby obtaining a pillar-type copper platform circuit board.

2. The method for manufacturing a pillar type copper base circuit board according to claim 1, characterized in that: The diameter of the drilled hole is 0.09 mm to 0.11 mm larger than the diameter of the copper column.

3. The method for manufacturing a pillar type copper base circuit board according to claim 1, characterized in that: Also includes: The pillar type copper platform circuit board is tested and inspected according to preset test conditions to obtain a qualified pillar type copper platform circuit board; the preset test conditions include at least one of the following conditions: Flatness test conditions, the maximum flatness error is 15um; Thermal shock test conditions: the temperature of the thermal shock test is 288°C ± 5°C, the time of the thermal shock test is at least 10s, and the number of thermal shock tests is at least 3 times.

4. A pillar type copper base circuit board, characterized in that: The pillar-type copper platform circuit board is prepared according to the method described in any one of claims 1 to 3.

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