A distributed multi-bit superconducting quantum computing ultra-low temperature and signal transmission system

Abstract

A distributed multi-bit superconducting quantum computing ultra-low temperature and signal transmission system of the present invention relates to the field of cryogenic refrigeration and quantum computing, including: one or more centrally located ultra-low temperature main systems for serving quantum chips and multiple ultra-low temperature subsystems that undertake the signal input and output functions of quantum chips, which are fixed in the first space formed by the main cover plate and the system vacuum cover, and the first space is connected to a signal source and a room temperature signal processing module; the ultra-low temperature subsystem is connected to the ultra-low temperature main system by a cable, so that low temperature signal transmission can be realized. By distributing the low temperature signal transmission system of the multi-bit quantum chip in the ultra-low temperature subsystem, the heat load and space load in the ultra-low temperature main system are reduced, thereby improving the ability of the ultra-low temperature main system to carry quantum chips with higher bit numbers, and providing a solution for realizing superconducting quantum computing technology at the ten-thousand-bit level.

Description

Technical Field

[0001] The present invention relates to the fields of cryogenic refrigeration and quantum computing, and in particular to a distributed multi-bit superconducting quantum computing ultra-low temperature and signal transmission system. Background Art

[0002] In recent years, developed countries and high-tech companies have attached great importance to quantum computing, formulated long-term development plans and invested important resources to promote technological development. With a series of landmark advances in quantum computing technology, the attention of countries around the world to quantum computing has gradually expanded from academia to the whole society. Quantum computing has become a technical field with rich connotations, ranging from the most cutting-edge basic research in mathematics, physics, etc. to the cross-integration with many engineering disciplines, and then to the development of highly engineered application technologies, and its rapid development momentum remains unabated.

[0003] There are many technical routes to realize quantum computing, including superconducting quantum computing, distributed superconducting quantum computing, optical quantum computing, trapped ion quantum computing, silicon-based quantum computing and several other systems. Among them, superconducting quantum computing is the most eye-catching quantum computing route in recent years, with the most rapid technological breakthroughs, ranking first among all routes.

[0004] The advantages of the superconducting quantum computing route are: the preparation process of superconducting quantum chips is compatible with micro-nano processing technology and has good scalability; the parameters of superconducting quantum bits and related devices have good design freedom; the manipulation of superconducting quantum circuits uses mature microwave electronics technology, which is fast and has good controllability.

[0005] In 2019, the Sycamore superconducting quantum chip launched by the Google research team contained 54 Xmon-type superconducting quantum bits, which were coupled through 88 adjustable couplers to form a planar grid array, and the average fidelity of the two-bit gate reached 99.4%. The chip was used to demonstrate quantum superiority in the problem of quantum random circuit sampling for the first time. In 2021, the research team of the University of Science and Technology of China launched the "Zu Chongzhi" superconducting quantum processor (adjustable coupling) containing 66 bits, based on which a quantum superiority experiment with larger scale and deeper circuits was completed. International Business Machines Corporation (IBM) released a chip with 133 (adjustable coupling) quantum bits at the end of 2023.

[0006] In the next 5 to 10 years, the chip scale (number of bits) and performance (fidelity) of superconducting quantum computers will be further improved. The number of bits will develop from thousands to tens of thousands and millions of bits. Superconducting quantum computers at the thousand-bit level will hopefully achieve the first logical bit, which is a milestone.

[0007] The superconducting quantum computer is composed of superconducting chips, low-temperature measurement and control platforms, room-temperature measurement and control platforms, and software. The low-temperature measurement and control platform includes an ultra-low temperature system and a cryogenic electronics system.

[0008] Superconducting chips are made of superconducting materials and need to work in an extremely low temperature (20mK) environment, which requires the use of a dilution refrigerator, which is the lowest temperature commercial refrigerator currently. The dilution refrigerator provides the necessary extremely low temperature, low vibration, and low electromagnetic noise environment for the normal operation of superconducting quantum computers.

[0009] On the other hand, the operating frequency of superconducting chips is GHz, and microwave signal transmission is required between chips at room temperature and extremely low temperatures. The cryogenic electronics system has the functions of signal transmission, signal attenuation, low-temperature heat sink, filtering and signal merging.

[0010] With the development of superconducting quantum computing technology, the number of quantum bits continues to increase. The current superconducting quantum computing technology will face the following difficulties when it is expanded to the 10,000-bit level:

[0011] 1) As the number of bits increases, the corresponding measurement and control circuits will increase exponentially, which will bring huge heat load and space load, making the dilution refrigerator unable to work normally. It is necessary to develop a dilution refrigerator system with higher cooling power and increase its internal space utilization as much as possible.

[0012] 2) The original method of purchasing discrete components and connecting low-density signal lines to existing refrigerators will not be able to meet the demand for tens of thousands of bits, and it is necessary to develop more integrated signal modulation and transmission components.

[0013] 3) All circuits of traditional quantum computers are mixed in a dilution refrigerator. Circuits and chips with different functions restrain each other and cannot play their maximum role. It is necessary to break the traditional dilution refrigerator layout and design a functional dilution refrigerator cluster "according to local conditions". Summary of the invention

[0014] The present invention is proposed to alleviate or solve at least one aspect or at least one point of the above problems.

[0015] A distributed multi-bit superconducting quantum computing ultra-low temperature and signal transmission system of the present invention comprises: one or more ultra-low temperature main systems and multiple ultra-low temperature subsystems, which are fixedly arranged in a first space formed by a main cover plate and a system vacuum cover;

[0016] The extremely low temperature main system comprises a main system upper cover plate, which is fixed on the main cover plate; a main system shielding cover is arranged below the main system upper cover plate, and the main system upper cover plate and the main system shielding cover form a second space;

[0017] The extremely low temperature subsystem comprises a subsystem upper cover plate, which is fixed on the main cover plate; a subsystem shielding cover is arranged below the subsystem upper cover plate, and the subsystem upper cover plate and the subsystem shielding cover form a third space;

[0018] The second space and the third space are both provided with a precooling module, a dilution refrigeration module, a heat exchange component and a cold plate;

[0019] The first space is externally connected to a signal source and a room temperature signal processing module;

[0020] A multi-bit quantum chip is arranged in the second space, and a first low-temperature signal transmission system is arranged in the third space; the multi-bit quantum chip and the first low-temperature signal transmission system are connected by a cable, and a multi-level thermal radiation shielding layer is arranged on the periphery of the cable;

[0021] The multi-bit quantum chip and the first low-temperature signal transmission system are controlled and connected with a signal source outside the first space and a room-temperature signal processing module.

[0022] Preferably, the multi-bit quantum chip is controlled and connected to the signal source and the room temperature signal processing module through a first low-temperature signal transmission system.

[0023] Preferably, the multi-bit quantum chip and the first cryogenic signal transmission system are both connected to the signal connection module via cables.

[0024] Preferably, the first cryogenic signal transmission system comprises a coupling control circuit, an excitation circuit, a signal reading circuit and a signal amplification circuit, and the coupling control circuit, the excitation circuit, the signal reading circuit and the signal amplification circuit are distributed in different extremely cryogenic subsystems.

[0025] Preferably, the signal connection module is located in the cryogenic subsystem.

[0026] Preferably, the first low-temperature signal transmission system includes a coupling control circuit, an excitation circuit and a signal amplification circuit, and the coupling control circuit, the excitation circuit and the signal amplification circuit are distributed in different ultra-low temperature subsystems. A second low-temperature signal transmission system is also arranged in the second space, and the second low-temperature signal transmission system includes a signal reading circuit.

[0027] Preferably, communication ports for cables to pass through are formed on the side surfaces or bottom surfaces of the main system shielding cover and the subsystem shielding cover.

[0028] Preferably, the subsystem upper cover plates are provided with connection plates, and the connection plates are provided with a plurality of cable connectors.

[0029] Preferably, the cable connector is a SMPS connector.

[0030] Preferably, the signal line of the first low-temperature signal transmission system passes through the cold plate in the third space and is connected to the signal source and the room-temperature signal processing module through a cable connector.

[0031] Preferably, a plurality of extremely low temperature subsystems are arranged around one or more extremely low temperature main systems.

[0032] Preferably, the main cover plate, the main system upper cover plate and the subsystem upper cover plate are integrally formed.

[0033] The distributed multi-bit superconducting quantum computing ultra-low temperature and signal transmission system of the present invention has an ultra-low temperature main system for providing an ultra-low temperature, low noise, and low vibration working environment for multi-bit quantum chips, and an ultra-low temperature subsystem for providing an ultra-low temperature working environment for the input and output lines of quantum bit signals. Each independent ultra-low temperature subsystem has an independent refrigeration and shielding design, and is connected to the quantum chip of the ultra-low temperature main system through a low temperature signal transmission system for low temperature interconnection. This can optimize the capacity allocation of the low temperature system and the signal transmission system of the quantum computer. By distributing the signal transmission system of the multi-bit quantum chip in the ultra-low temperature subsystem, the heat load and space load in the ultra-low temperature main system are reduced, while maximizing the satisfaction of different functional areas for space, refrigeration power, and noise environment, reducing the mutual influence between the low temperature signal line and the chip, thereby improving the ability of the ultra-low temperature main system to carry quantum chips with higher bit numbers, and providing a solution for realizing superconducting quantum computing technology at the ten thousand bit level. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 This is a three-dimensional schematic diagram of a distributed multi-bit superconducting quantum computing ultra-low temperature and signal transmission system according to the first embodiment of the present invention.

[0035] Figure 2 This is a top view of the distributed multi-bit superconducting quantum computing ultra-low temperature and signal transmission system of Example 1 of the present invention.

[0036] Figure 3 This is a left view of the distributed multi-bit superconducting quantum computing ultra-low temperature and signal transmission system of Example 1 of the present invention.

[0037] Figure 4 for Figure 3 AA section view.

[0038] Figure 5 This is a schematic diagram of the internal structure of the ultra-low temperature main system of the distributed multi-bit superconducting quantum computing ultra-low temperature and signal transmission system of Example 1 of the present invention.

[0039] Figure 6 This is a schematic diagram of the line connections of the distributed multi-bit superconducting quantum computing ultra-low temperature and signal transmission system of the first embodiment of the present invention.

[0040] Figure 7 This is a schematic diagram of the line connections of the distributed multi-bit superconducting quantum computing ultra-low temperature and signal transmission system of the second embodiment of the present invention.

[0041] Figure 8 This is an internal schematic diagram of a distributed multi-bit superconducting quantum computing ultra-low temperature and signal transmission system according to the third embodiment of the present invention.

[0042] Fig. 9 This is a schematic diagram of the line connections of the distributed multi-bit superconducting quantum computing ultra-low temperature and signal transmission system of the third embodiment of the present invention.

[0043] Fig.10 This is a schematic diagram of the line connections of the distributed multi-bit superconducting quantum computing ultra-low temperature and signal transmission system of the fourth embodiment of the present invention.

[0044] Fig.11 This is a schematic diagram of the line connections of the distributed multi-bit superconducting quantum computing ultra-low temperature and signal transmission system of the fifth embodiment of the present invention.

[0045] Fig.12 This is a schematic diagram of the line connections of the distributed multi-bit superconducting quantum computing ultra-low temperature and signal transmission system of the sixth embodiment of the present invention.

[0046] Fig.13 It is a three-dimensional schematic diagram of the main system shielding cover according to the first embodiment of the present invention.

[0047] Fig.14 It is a three-dimensional schematic diagram of a subsystem shielding cover according to the first embodiment of the present invention.

[0048] Fig.15 It is a three-dimensional schematic diagram of the connecting plate according to the first embodiment of the present invention.

[0049] Fig.16 This is a schematic diagram of the communication port of the main cover plate of Example 1 of the present invention.

[0050] Fig.17 It is a front view of the cable connector according to the first embodiment of the present invention.

[0051] Fig.18 Schematic diagram of the internal structure of a cable connector according to Embodiment 1 of the present invention.

[0052] Fig.19 It is a three-dimensional schematic diagram of a cable connector according to the first embodiment of the present invention.

[0053] Fig. 20 This is a schematic diagram of the internal structure of the ultra-low temperature subsystem of the distributed multi-bit superconducting quantum computing ultra-low temperature and signal transmission system of Example 1 of the present invention.

[0054] Fig.21 This is a schematic diagram of the internal structure of the ultra-low temperature subsystem of the distributed multi-bit superconducting quantum computing ultra-low temperature and signal transmission system of Example 3 of the present invention.

[0055] Among them: 1-ultra-low temperature main system, 2-ultra-low temperature subsystem, 3-main cover, 4-system vacuum cover, 5-main system upper cover, 6-main system shielding cover, 7-subsystem upper cover, 8-subsystem shielding cover, 9-cable, 10-connecting plate, 11-cable connector, 12-cold plate, 13-workbench, 14-communication port, 15-multi-layer vacuum insulation structure, 16-signal connection module, 17-pre-cooling module, 18-dilution refrigeration module, 19-heat exchange component, 20-multi-bit quantum chip. DETAILED DESCRIPTION

[0056] The following description of the embodiments of the present invention with reference to the accompanying drawings is intended to explain the overall inventive concept of the present invention, and should not be construed as a limitation of the present invention. In the present invention, the same reference numerals represent the same or similar components.

[0057] The features described herein can be implemented in different forms and should not be construed as being limited to the examples described herein. Rather, the examples described herein have been provided to illustrate only some of the many possible ways to implement the methods, devices, and / or systems described herein, which will be clear after understanding the disclosure of the present invention.

[0058] Although terms such as "first", "second", and "third" may be used herein to describe various members, components, regions, layers, or portions, these members, components, regions, layers, or portions should not be limited by these terms. Instead, these terms are only used to distinguish one member, component, region, layer, or portion from another member, component, region, layer, or portion.

[0059] In the specification, when an element (such as a layer, a region, or a substrate) is described as being “on”, “connected to”, or “coupled to” another element, the element may be directly “on”, “connected to”, or “coupled to” another element, or one or more other elements may be present therebetween. Conversely, when an element is described as being “directly on”, “directly connected to”, or “directly coupled to” another element, there may be no other elements present therebetween.

[0060] The terms used herein are only used to describe various examples and are not intended to limit the disclosure. Unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. The terms "comprise", "include" and "have" indicate the presence of the described features, quantities, operations, components, elements and / or combinations thereof, but do not exclude the presence or addition of one or more other features, quantities, operations, components, elements and / or combinations thereof.

[0061] In order to enable those skilled in the art to use the contents of the present invention, the following exemplary embodiments may be provided in combination with specific application scenarios, specific systems, parameters of devices and components, and specific connection methods. However, for those skilled in the art, these embodiments are only examples, and the general principles defined herein may be applied to other embodiments and application scenarios without departing from the spirit and scope of the present invention.

[0062] Embodiment 1, as Figure 1 As shown, a distributed multi-bit superconducting quantum computing ultra-low temperature and signal transmission system consists of an ultra-low temperature main system 1 and three ultra-low temperature subsystems 2, which are fixed in a first space formed by a main cover plate 3 and a system vacuum cover 4. The ultra-low temperature subsystems 2 are arranged around the ultra-low temperature main system 1, and a signal source and a room temperature signal processing module are connected outside the first space; schematically, the system vacuum cover 4 is a square barrel structure.

[0063] like Figure 1-5 As shown, the ultra-low temperature main system 1 is used to provide a low temperature working environment for the multi-bit quantum chip 20, which is an important part in quantum computing, and includes a main system upper cover plate 5. The main system upper cover plate 5 and the main cover plate 3 can be integrally processed or fixedly connected together by a rubber ring. A main system shielding cover 6 is arranged below the main system upper cover plate 5. The main system upper cover plate 5 and the main system shielding cover 6 form a second space. A pre-cooling module 17, a dilution refrigeration module 18, a heat exchange component 19 and a cold plate 12 are arranged in the second space to provide an ultra-low temperature environment for the first space. Schematically, the main system shielding cover 6 is a cylindrical structure.

[0064] In the second space, there are multi-level cold plates 12 distributed from top to bottom, which are combined with the main system upper cover plate 5 and the main system shielding cover 6 to form a multi-layer vacuum insulation structure 15. The main system shielding cover 6 is used to shield noise and interference from outside the shielding cover; the bottom layer of the multi-level cold plate 12 in the second space is a workbench 13, which is used to place a multi-bit quantum chip 20.

[0065] like Figure 4-5 , 13 and Fig.15As shown, the side or bottom surface of the main system shielding cover 6 is formed with a plurality of communication ports 14 that cooperate with the cable connector 11. The plurality of cable connectors 11 sequentially pass through the connection plate 10 and the communication ports 14 of the main system shielding cover 6. The cable connector 11 and the connection plate 10 are fixed by an adhesive, which facilitates the connection between the cables 9 and the cable connector 11 inside and outside the second space, thereby realizing the line connection inside and outside the main system shielding cover 6. A rubber ring is used to seal the cable connector 11 with the main system shielding cover 6 and the connection plate 10. The main system shielding cover 6 and the connection plate 10 are fixed by bolts. When the cable connector 11 is connected to the cable 9, the position will not change.

[0066] like Figure 1-4 , 6, 14, 15 and Fig. 20 As shown, three extremely low temperature subsystems 2 are used to provide a working environment for circuits that undertake functions such as quantum bit signal input and output, signal reading and amplification, etc., including a subsystem upper cover plate 7, the subsystem upper cover plate 7 and the main cover plate 3 are integrally processed or sealed by a rubber ring, and a subsystem shielding cover 8 is arranged below the subsystem upper cover plate 7. The subsystem upper cover plate 7 and the subsystem shielding cover 8 form a third space, and a precooling module 17, a dilution refrigeration module 18, a heat exchange component 19, a cold plate 12 and a first low temperature signal transmission system are arranged in the third space. In the third space, multiple levels of cold plates 12 are distributed from top to bottom, and combined with the subsystem upper cover plate 7 and the subsystem shielding cover 8, a multi-layer vacuum insulation structure 15 is formed to provide an extremely low temperature environment for the third space. Schematically, the subsystem shielding cover 8 is a cylindrical structure;

[0067] The side or bottom surface of the subsystem shielding cover 8 is formed with a plurality of communication ports 14 that cooperate with the cable connector 11. The plurality of cable connectors 11 sequentially pass through the connection plate 10 and the communication ports 14 of the subsystem shielding cover 8. The cable connector 11 and the connection plate 10 are fixed by an adhesive, which facilitates the connection between the cables 9 and the cable connector 11 inside and outside the third space, thereby realizing the line connection inside and outside the subsystem shielding cover 8. A rubber ring is used to seal the cable connector 11 with the subsystem shielding cover 8 and the connection plate 10, and the subsystem shielding cover 8 and the connection plate 10 are fixed by bolts.

[0068] like Figure 1-4 , 16 and Fig. 20As shown, a plurality of communication ports 14 cooperating with the cable connectors 11 are formed on the subsystem upper cover 7, and the plurality of cable connectors 11 sequentially pass through the connection plate 10 and the communication ports 14 of the subsystem upper cover 7, and the cable connectors 11 are fixed to the connection plate 10 by an adhesive, so that it is convenient to connect the cables 9 and the cable connectors 11 inside and outside the third space, so that the first low-temperature signal transmission system in the extremely low-temperature subsystem 2 is connected to the communication line at room temperature, and the output signal of the multi-bit quantum chip 20 is transmitted to the room-temperature signal processing module; a rubber ring is used to seal the cable connector 11 and the subsystem upper cover 7 and the connection plate 10, and the subsystem upper cover 7 and the connection plate 10 are fixed by bolts.

[0069] The pre-cooling module 17 is cooled by a pulse tube refrigerator, the dilution refrigeration module 18 includes a mixing chamber and a distillation chamber, and the heat exchange component 19 includes a heat exchanger.

[0070] The distillation chamber provides sufficient heat exchange area to hold the dilute phase reflux He 3 Liquid, dilute phase 3 The liquid is in the distillation chamber and evaporated by evacuation, cooling and refrigeration to maintain a temperature range of 0.6-0.7K, achieving dilute phase He 3 Stable reflux; on the other hand, the concentrated phase He 3 Through the coil, the dense phase loop channel is realized and enters the heat exchanger. The dilution refrigeration mixing chamber is the reaction place of the dilution effect. 3 At the top, the workbench 13 is provided with a working temperature of mK.

[0071] like Figure 1-6 As shown, the extremely low temperature main system 1 has multiple cold plates 12, and the lowest cold plate 12 is a workbench 13 with an operating temperature of up to mk. A multi-bit quantum chip 20 is placed on the workbench 13. The signal in the calculation process is connected to one end of a cable connector 11 on a connecting plate 10 at the bottom of the main system shielding cover 6 through a cable 9. The other end of the cable connector 11 is connected to one end of a cable 9 outside the second space, and the other end of the cable 9 is connected to the cable connector 11 on a connecting plate 10 at the bottom of a subsystem shielding cover 8 of three extremely low temperature subsystems 2, so as to realize low temperature signal transmission between the extremely low temperature main system 1 and the three extremely low temperature subsystems 2. The outer layer of the cable 9 is set as a multi-level thermal radiation shielding layer to realize cooling interconnection; the first low temperature signal transmission system is distributed in the three extremely low temperature subsystems 2, so as to reduce the influence of the heat of the cables and electronic devices on the extremely low temperature main system 1, and reduce the heat load and space load of the extremely low temperature main system 1.

[0072] The first cryogenic signal transmission system includes a signal reading circuit, an excitation circuit, a coupling control circuit and a signal amplification circuit, which are distributed in three cryogenic subsystems 2. The coupling control circuit is set in the first cryogenic subsystem 2, the excitation circuit is set in the second cryogenic subsystem 2, and the signal amplification circuit and the signal reading circuit are set in the third cryogenic subsystem 2.

[0073] The external excitation signal is transmitted to the multi-bit quantum chip 20 through an excitation line. An attenuator and a filter are provided on the excitation line to attenuate and filter the input signal.

[0074] The external coupling control signal is transmitted to the multi-bit quantum chip 20 via the coupling control circuit. The coupling control circuit is provided with an attenuator and a filter to attenuate and filter the input signal.

[0075] The signal reading circuit adopts the dispersion measurement method to realize the reading of the state of the quantum bit of the multi-bit quantum chip 20. Each quantum bit is coupled to a resonator and filtered on the quantum chip. The signal amplification circuit will initially amplify the read signal near the multi-bit quantum chip 20 through an ultra-low temperature parametric amplifier; the initially amplified signal is amplified through the signal amplification circuit and finally transmitted to the room temperature signal processing module. The signal amplification circuit includes a low-temperature, low-noise, high-electron-mobility transistor amplifier located in the 4K layer to realize the secondary amplification of the signal.

[0076] like Figure 17-19 As shown, the cable connector 11 uses the latest SMPS connector technology on the market. The SMPS connector is a new generation of high-performance ultra-small RF / microwave coaxial connector that supports frequencies exceeding 100GHz. SMPS has the same powerful features as the SMP and SMPM connector series, but the package size is smaller, 45% and 30% smaller than SMP and SMPM, respectively. The SMPS RF / microwave coaxial connector adopts a "push-in" design and is directly compatible with G3PO and WSMP interfaces.

[0077] like Figure 4 , 20 As shown, in order to increase the line density, the SMPS connector design is specially adopted in this embodiment, and its microstructure poses new challenges to the crosstalk control between lines and the alignment accuracy of the connector. The outer periphery of the cable 9 is provided with a multi-level heat radiation shielding layer, which plays a role in adjusting the contact force of the cable connector 11, ensuring that the line density is increased without affecting the crosstalk of the adjacent lines, and at the same time, the heat generated by the cable 9 in the process of transmitting signals is dissipated by conduction to achieve cooling interconnection.

[0078] In addition, the diameter of the SMPS connector is only 1.8 mm. In order to meet the rapid connection of thousands of high-density signal lines, a special group connector for the SMPS connector is designed, which can complete the plugging and unplugging of multiple lines at one time. For example, for 32 lines, multiple special group connectors for the SMPS connector can be set on the connecting board 10.

[0079] like Figure 6 As shown, the signal source provides an excitation signal for the excitation circuit and provides a coupling control signal for the coupling control circuit; the room temperature signal processing module is used to receive data from the quantum computer and perform corresponding processing.

[0080] Embodiment 2, as Figure 1-3 , 5, 7 and Fig. 20 As shown, a distributed multi-bit superconducting quantum computing ultra-low temperature and signal transmission system includes: an ultra-low temperature main system 1 and three ultra-low temperature subsystems 2, which are fixed in a first space formed by a main cover plate 3 and a system vacuum cover 4.

[0081] The difference from the first embodiment is that in addition to placing a multi-bit quantum chip 20 in the cryogenic main system 1, a second cryogenic signal transmission system is also provided. In this embodiment, the second cryogenic signal transmission system includes a signal reading circuit; the first cryogenic signal transmission system includes an excitation circuit, a coupling control circuit, and a signal amplification circuit, which are distributed in three cryogenic subsystems 2. The first cryogenic subsystem 2 is provided with a coupling control circuit, the second cryogenic subsystem 2 is provided with an excitation circuit, and the third cryogenic subsystem 2 is provided with a signal amplification circuit.

[0082] Embodiment three, as Figure 1-3 , 5, 8-9 and Fig.21 As shown, a distributed multi-bit superconducting quantum computing ultra-low temperature and signal transmission system includes: an ultra-low temperature main system 1 and three ultra-low temperature subsystems 2, which are fixed in a first space formed by a main cover plate 3 and a system vacuum cover 4.

[0083] The difference from the first embodiment is that the communication between a very low temperature main system 1 and three very low temperature subsystems 2 is through the signal connection module 16. A multi-bit quantum chip 20 is placed on the workbench 13 of the very low temperature main system 1. The signal in the calculation process is connected to one end of the cable connector 11 on the connecting plate 10 at the bottom of the main system shielding cover 6 through the cable 9 in the second space. The other end of the cable connector 11 is connected to one end of the cable 9 outside the second space. The other end of the cable 9 is connected to the signal connection module 16. The signal connection module 16 is arranged inside the subsystem shielding cover 8. The signal connection module 16 is connected to the cable connector 11 on the connecting plate 10 at the bottom of the subsystem shielding cover 8 through the cable 9 to realize the low temperature signal transmission between the very low temperature main system 1 and the three very low temperature subsystems 2. The outer periphery of the cable 9 is provided with a multi-level thermal radiation shielding layer to realize cooling interconnection. The signal connection module 16 is connected to the cold plate 12 of the very low temperature subsystem 2 through a heat sink, or is directly fixed to the lower part of the cold plate 12, which is used to conduct the coldness of the cold plate 12 to the signal connection module 16 to ensure low temperature signal transmission.

[0084] Embodiment 4, as Figure 1-3 , 5, 10, and Fig.21 As shown, a distributed multi-bit superconducting quantum computing ultra-low temperature and signal transmission system includes: an ultra-low temperature main system 1 and three ultra-low temperature subsystems 2, which are fixed in a first space formed by a main cover plate 3 and a system vacuum cover 4.

[0085] The difference from the second embodiment is that three multi-bit quantum chips 20 are placed in the ultra-low temperature main system 1, and a second low temperature signal transmission system is also provided. In this embodiment, the second low temperature signal transmission system includes signal reading circuits of the three multi-bit quantum chips 20;

[0086] The first extremely low temperature subsystem 2 is provided with an excitation circuit, a coupling control circuit and a signal amplification circuit of the first multi-bit quantum chip 20; the second extremely low temperature subsystem 2 is provided with an excitation circuit, a coupling control circuit, a signal amplification circuit and a signal connection module 16 of the second multi-bit quantum chip 20; the third extremely low temperature subsystem 2 is provided with an excitation circuit, a coupling control circuit and a signal amplification circuit of the third multi-bit quantum chip 20. The signal connection module 16 is provided inside the subsystem shielding cover 8 of the extremely low temperature subsystem 2, and is connected to the bottom cold plate 12 of the extremely low temperature subsystem 2 through a heat sink, or is directly fixed to the bottom of the bottom cold plate 12, so as to conduct the coldness of the cold plate 12 to the signal connection module 16, so as to ensure low temperature signal transmission.

[0087] Embodiment 5, as Figure 1-3 , 5, 11 and Fig. 20As shown, a distributed multi-bit superconducting quantum computing ultra-low temperature and signal transmission system, compared with the first embodiment, the difference is that the system includes an ultra-low temperature main system 1 and six ultra-low temperature subsystems 2, which are fixed in a first space formed by a main cover plate 3 and a system vacuum cover 4, the ultra-low temperature main system 1 is in a central position, and the six ultra-low temperature subsystems 2 are arranged around the ultra-low temperature main system 1, and a signal source and a room temperature signal processing module are connected outside the first space; schematically, the system vacuum cover 4 is a cylindrical structure, an ultra-low temperature main system 1 and six ultra-low temperature subsystems 2 are connected by a cable 9, and the first low temperature signal transmission system required for the multi-bit quantum chip 20 of the ultra-low temperature main system 1 to work includes an excitation circuit, a coupling control circuit, a signal reading circuit and a signal amplification circuit, which are distributed in the six ultra-low temperature subsystems 2, and a multi-level thermal radiation shielding layer is arranged on the periphery of the cable 9 to realize cooling interconnection.

[0088] Embodiment six, as Figure 1-3 , 5, 12 and Fig. 20 As shown, a distributed multi-bit superconducting quantum computing ultra-low temperature and signal transmission system, compared with the first embodiment, the difference is that the system consists of two ultra-low temperature main systems 1 and four ultra-low temperature subsystems 2, which are fixed in the first space formed by the main cover plate 3 and the system vacuum cover 4, the four ultra-low temperature subsystems 2 are on both sides, the two ultra-low temperature main systems 1 are in the middle, and the first space is connected with a signal source and a room temperature signal processing module; schematically, the system vacuum cover 4 is a square barrel structure, the four ultra-low temperature subsystems 2 and the two ultra-low temperature main systems 1 are connected by cables 9, and the first low temperature signal transmission system required for the multi-bit quantum chips 20 of the two ultra-low temperature main systems 1 to work includes an excitation circuit, a coupling control circuit, a signal reading circuit and a signal amplification circuit, which are distributed in the four ultra-low temperature subsystems 2. A passage is established between the two ultra-low temperature main systems 1 through the cable 9, so that the multi-bit quantum chips 20 in the two ultra-low temperature main systems 1 can be transmitted by a probabilistic communication method, and a multi-level thermal radiation shielding layer is arranged on the periphery of the cable 9 to achieve cooling interconnection.

[0089] Of course, the main system shielding cover 6 and the subsystem shielding cover 8 can also be used as vacuum covers at the same time, so that the second space and the third space form a vacuum-sealed space; more lines can be set in the ultra-low temperature main system 1, and the second low-temperature signal transmission system can include one or more of a signal reading line, an excitation line, a coupling control line and a signal amplification line.

[0090] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes may be made to the embodiments and combinations of elements may be made without departing from the principles and spirit of the invention, the scope of the invention being defined by the appended claims and their equivalents.

Claims

1. A distributed multi-bit superconducting quantum computing ultra-low temperature and signal transmission system, characterized in that: include: One or more extremely low temperature main systems (1) and a plurality of extremely low temperature subsystems (2) are fixedly arranged in a first space formed by a main cover plate (3) and a system vacuum cover (4); The extremely low temperature main system (1) comprises a main system upper cover plate (5), the main system upper cover plate (5) being fixedly mounted on the main cover plate (3); a main system shielding cover (6) is disposed below the main system upper cover plate (5), the main system upper cover plate (5) and the main system shielding cover (6) forming a second space; The extremely low temperature subsystem (2) comprises a subsystem upper cover plate (7), and the subsystem upper cover plate (7) is fixedly mounted on the main cover plate (3); a subsystem shielding cover (8) is arranged below the subsystem upper cover plate (7), and the subsystem upper cover plate (7) and the subsystem shielding cover (8) form a third space; A precooling module (17), a dilution refrigeration module (18), a heat exchange component (19) and a cold plate (12) are provided in both the second space and the third space; The first space is externally connected to a signal source and a room temperature signal processing module; A multi-bit quantum chip (20) is arranged in the second space, and a first low-temperature signal transmission system is arranged in the third space; the multi-bit quantum chip (20) and the first low-temperature signal transmission system are connected via a cable (9), and a multi-level thermal radiation shielding layer is arranged on the periphery of the cable (9); The multi-bit quantum chip (20) and the first low-temperature signal transmission system are controlled and connected with a signal source outside the first space and a room-temperature signal processing module; The multi-bit quantum chip (20) and the first cryogenic signal transmission system are both connected to a signal connection module (16) via a cable (9); the signal connection module (16) is located in the cryogenic subsystem (2); the signal connection module (16) is connected to a cold plate (12) of the cryogenic subsystem (2) via a heat sink, or is directly fixed to the bottom of the cold plate (12).

2. The distributed multi-bit superconducting quantum computing ultra-low temperature and signal transmission system according to claim 1 is characterized in that: The multi-bit quantum chip (20) is controlled and connected to a signal source and a room temperature signal processing module via a first low temperature signal transmission system.

3. The distributed multi-bit superconducting quantum computing ultra-low temperature and signal transmission system according to claim 2 is characterized in that: The first cryogenic signal transmission system comprises a coupling control circuit, an excitation circuit, a signal reading circuit and a signal amplification circuit, wherein the coupling control circuit, the excitation circuit, the signal reading circuit and the signal amplification circuit are distributed in different extremely low temperature subsystems (2).

4. The distributed multi-bit superconducting quantum computing ultra-low temperature and signal transmission system according to claim 3 is characterized in that: The first low-temperature signal transmission system includes a coupling control circuit, an excitation circuit and a signal amplification circuit, wherein the coupling control circuit, the excitation circuit and the signal amplification circuit are distributed in different extremely low-temperature subsystems (2). A second low-temperature signal transmission system is also arranged in the second space, and the second low-temperature signal transmission system includes a signal reading circuit.

5. The distributed multi-bit superconducting quantum computing ultra-low temperature and signal transmission system according to claim 1 is characterized in that: The side surfaces or bottom surfaces of the main system shielding cover (6) and the subsystem shielding cover (8) are formed with communication ports (14) for the cables (9) to pass through.

6. The distributed multi-bit superconducting quantum computing ultra-low temperature and signal transmission system according to claim 1, characterized in that: The subsystem upper cover plate (7) is provided with a connection plate (10), and the connection plate (10) is provided with a plurality of cable connectors (11).

7. The distributed multi-bit superconducting quantum computing ultra-low temperature and signal transmission system according to claim 6 is characterized in that: The cable connector (11) is a SMPS connector.

8. The distributed multi-bit superconducting quantum computing ultra-low temperature and signal transmission system according to claim 7 is characterized in that: The signal line of the first low-temperature signal transmission system passes through the cold plate (12) in the third space and is connected to the signal source and the room-temperature signal processing module through the cable connector (11).

9. The distributed multi-bit superconducting quantum computing ultra-low temperature and signal transmission system according to claim 1, characterized in that: A plurality of extremely low temperature subsystems (2) are arranged around one or more extremely low temperature main systems (1).

10. The distributed multi-bit superconducting quantum computing ultra-low temperature and signal transmission system according to claim 1, characterized in that: The main cover plate (3), the main system upper cover plate (5) and the subsystem upper cover plate (7) are integrally formed.

Images