LED lamp bead and LED light-emitting device

Abstract

The present invention provides an LED lamp bead and an LED lighting device, comprising an LED bracket, an LED chip, and a filling portion. The LED bracket comprises an encapsulation body and a metal substrate at least partially embedded within the encapsulation body. The metal substrate comprises a plate body and a base foot disposed at the periphery of the plate body. The base foot has an exposed area exposed outside the encapsulation body and a fillet area, and is provided with a notch, with the notch being provided at least in the fillet area. The encapsulation body comprises a main body formed on the front surface of the metal substrate and covering the edge of the plate body, and a fillet portion formed in the fillet area and integrally connected to the main body. The main body has a recessed portion on the front surface for mounting the LED chip, with a portion of the metal substrate exposed at the bottom surface of the recessed portion. The LED chip is electrically connected to the metal substrate. The filling portion fills the recessed portion and covers the LED chip. The LED lamp bead and LED lighting device provided by the present invention enhance the airtightness of the bracket, reduce stress transmitted to the plastic during cutting, lower the risk of bracket cracking, and improve production yield.

Description

[0001] This application is a divisional application of the original Chinese invention patent application entitled “An LED bracket, a method for manufacturing an LED bracket, and an LED light-emitting device.” The original application number is 202210209623.4 and the filing date is March 4, 2022. Technical Field

[0002] The present invention belongs to the technical field of LED packaging, and in particular relates to an LED lamp bead and an LED light-emitting device. Background Art

[0003] Current LED lighting devices include an LED bracket, which includes an encapsulation body and a metal substrate bonded to the encapsulation body. The cut-type LED bracket employed in this configuration is constructed with plastic (one of the materials forming the encapsulation body) wrapped around all four sides of the bracket. The exposed metal material of the metal substrate on each of the four sides is also covered with plastic. This structure results in a high amount of plastic used in the lamp beads, increasing production costs. Furthermore, the heat dissipation point is limited to the bottom solder pad, restricting the heat dissipation path. Furthermore, when the bracket is cut, at least a portion of the metal substrate is cut simultaneously with the encapsulation body, causing the exposed portion of the metal substrate to become coplanar with the outer surface of the encapsulation body. Due to the different material properties of the metal substrate and the encapsulation body, the force feedback from the cutting tool is inconsistent. During cutting, the stress generated by the cutting tool on the metal substrate is transferred to the plastic, potentially causing the bracket to crack or affecting the airtightness of the bond between the metal substrate and the encapsulation body, resulting in poor performance. Summary of the Invention

[0004] The purpose of the present invention is to overcome the above-mentioned deficiencies of the prior art and provide an LED lamp bead and an LED lighting device, which have good use effects and low production costs.

[0005] The technical solution of the present invention is: an LED lamp bead, including an LED bracket, an LED chip and a filling part, the LED bracket including a metal substrate and a packaging body, the metal substrate is at least partially embedded in the packaging body, the metal substrate includes a plate body and a base foot provided on the periphery of the plate body, the back of the base foot has an exposed area and a fillet area and is provided with a notch, the notch is provided at least in the fillet area, the packaging body includes a main body and a fillet part, the main body is formed on the front side of the metal substrate and covers the edge of the plate body, the front side of the main body is provided with a recess for mounting the LED chip, part of the surface of the metal substrate is exposed at the bottom surface of the recess, the LED chip is electrically connected to the metal substrate; the filling part fills the recess and covers the LED chip; the fillet part is formed in the fillet area and is integrally connected to the main body; the base foot is exposed outside the packaging body corresponding to the exposed area, and the base foot is provided with the fillet part corresponding to the fillet area.

[0006] Specifically, both ends of the molding portion are integrally formed on the main body portion at both sides of the base; and the back surface of the plate body is at least partially exposed to the back surface of the LED lamp bead.

[0007] Specifically, the projection of the metal substrate toward the bottom surface includes a central area and a footing area, the footing area includes an exposed area corresponding to the exposed area and a fillet area corresponding to the fillet area, and the central area and the exposed area are separated by the fillet area.

[0008] Specifically, the notch is provided in both the exposed area and the fillet area, and the exposed area and the fillet area are flush or stepped; or, the notch is provided only in the fillet area, and the exposed area is flush with the bottom surface of the metal substrate.

[0009] Specifically, the outer plane shape of the package body is a rectangle with notches at the four corners, the exposed area of ​​the base foot is exposed at the notches, the metal substrate includes two sub-substrates arranged relatively separately, each of the sub-substrates is provided with two base feet, and each base foot is provided on a side of the two sub-substrates away from each other; the bottom surfaces of the opposite sides of the two sub-substrates are provided with strip-shaped notches, and the package body at least fills the strip-shaped notches.

[0010] Specifically, the front side of the footing is also provided with an exposed area corresponding to the exposed area on the back side of the footing.

[0011] Specifically, the molding area and the molding portion are arranged at the narrowest point where the base foot is connected to the plate body; and the molding portion is flush with the bottom surface of the LED lamp bead.

[0012] Specifically, the outer side surface of the base foot is flush with the outer side surface of the package body; and the outer side surface of each base foot is adjacent to the outer side surface of the package body in the length direction of the outer side surface of the LED bracket; the outer side surface of the base foot and the outer side surface of the package body have no overlapping parts.

[0013] The present invention also provides an LED lighting device, comprising the above-mentioned LED lamp bead.

[0014] Furthermore, the LED light-emitting device also includes a circuit board, which is provided with a prefabricated circuit and a first soldering pad electrically connected to the prefabricated circuit, and the back of the board is welded to the soldering pad; the circuit board is also provided with a heat sink and a second soldering pad electrically connected to the heat sink, and the second soldering pad is welded to the base foot.

[0015] The present invention provides an LED lamp bead and an LED light-emitting device, in which the molding part and the main body are arranged on both sides of the metal substrate and are formed in one piece, and the base foot is partially exposed outside the package body. The package body can form a closed enclosing edge on the back side of the metal substrate, so that the four sides of the metal substrate plate body are covered by the package body, thereby increasing the air tightness of the bracket. At the same time, the hollowed-out parts of the four corners of the plastic separately expose the base foot, reducing the material used for the package body and reducing production costs. At the same time, the base foot can be used as a lamp bead welding point to connect the heat dissipation component to increase the heat dissipation path, with good use effect. The exposed area of ​​the base foot is not covered by the package body, and the cutting tool will not cut the metal substrate and the package body at the same time during cutting, thereby reducing the stress transmitted to the plastic during the cutting process, reducing the risk of LED bracket breakage, improving production yield, and helping to reduce costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0017] Figure 1 This is a three-dimensional schematic diagram of an LED bracket provided by an embodiment of the present invention;

[0018] Figure 2 This is another three-dimensional schematic diagram of an LED bracket provided by an embodiment of the present invention;

[0019] Figure 3 This is a top view of an LED bracket provided by an embodiment of the present invention;

[0020] Figure 4 This is a bottom view of an LED bracket provided by an embodiment of the present invention;

[0021] Figure 5 This is a three-dimensional schematic diagram of a package in an LED bracket provided by an embodiment of the present invention;

[0022] Figure 6 This is another three-dimensional schematic diagram of a package in an LED bracket provided by an embodiment of the present invention;

[0023] Figure 7 This is a three-dimensional schematic diagram of a metal substrate in an LED bracket provided by an embodiment of the present invention;

[0024] Figure 8 This is another three-dimensional schematic diagram of a metal substrate in an LED bracket provided by an embodiment of the present invention;

[0025] Figure 9This is a schematic top plan view of a metal substrate in an LED bracket provided by an embodiment of the present invention;

[0026] Figure 10 This is a front plan view of a substrate frame formed by an array of multiple metal substrates arranged in one piece according to an embodiment of the present invention;

[0027] Figure 11 This is a schematic back plan view of a substrate frame formed by an array of multiple metal substrates arranged in one piece according to an embodiment of the present invention;

[0028] Figure 12a This is a cross-section of the mold in the mold opening state in a method for producing an LED bracket provided by an embodiment of the present invention (corresponding to Figure 10 A partial schematic diagram of the middle page (section at AA);

[0029] Figure 12b This is a cross-section of the mold in the mold closing state in a method for producing an LED bracket provided by an embodiment of the present invention (corresponding to Figure 10 A partial schematic diagram of the middle page (section at AA);

[0030] Figure 13 This is a cross-section of the mold in the mold closing state in a method for producing an LED bracket provided by an embodiment of the present invention (corresponding to Figure 11 A partial schematic diagram of the middle page (section at BB);

[0031] Figure 14 This is a schematic cutting diagram of an LED bracket sheet (front side) formed by integrating a plurality of LED brackets in an array according to an embodiment of the present invention;

[0032] Figure 15 This is a schematic diagram of a cut of an LED bracket sheet (back side) formed by an array of multiple LED brackets arranged in one piece according to an embodiment of the present invention;

[0033] Figure 16 This is a three-dimensional schematic diagram of another type of metal substrate in an LED bracket provided by an embodiment of the present invention;

[0034] Figure 17 This is a three-dimensional schematic diagram of an LED bracket assembled to form an LED light-emitting device provided by an embodiment of the present invention;

[0035] Figure 18 This is a three-dimensional schematic diagram of an LED lighting device connected to a circuit board provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0036] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0037] It should be noted that when an element is referred to as being “fixed to” or “disposed on” another element, it may be directly on the other element or there may be an intermediate element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or there may be an intermediate element.

[0038] In addition, if there are terms such as "longitudinal", "transverse", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicating orientation or positional relationships in the embodiments of the present invention, they are based on the orientation or positional relationships shown in the drawings or the conventional placement state or usage state, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the structure, feature, device or element referred to must have a specific orientation or positional relationship, nor must it be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0039] The various specific technical features and embodiments described in the specific implementation methods can be combined in any suitable manner unless there is any contradiction. For example, different implementation methods can be formed by combining different specific technical features / embodiments. In order to avoid unnecessary repetition, the various possible combinations of the specific technical features / embodiments in the present invention will not be described separately.

[0040] like Figures 1 to 5 As shown, an embodiment of the present invention provides an LED bracket, comprising a metal substrate 10 and a package body 20. The package body 20 can be made of polyester resin (plastic) or the like. The metal substrate 10 is at least partially embedded in the package body 20. The metal substrate 10 includes a plate body 11 and a base 12. The base 12 can be at least partially exposed from the package body 20 to facilitate welding. The back of the base 12 has a bare area 121 and a fillet area 122 (see FIG. 1 ). Figure 8 ) and is provided with a notch 120 (reference Figure 8 and Figure 9), the notch 120 is at least provided in the fillet area 122. In this embodiment, the notch 120 includes an exposed area 121 and a fillet area 122. The package body 20 includes a main body 211 and a fillet part 212. The main body 211 is formed on the front of the metal substrate 10 and covers the edge of the board 11. In this embodiment, the front refers to the installation surface of the LED chip in the LED bracket, and the back (bottom) refers to the welding surface of the LED bracket for electrical connection with the external circuit (the back of the board 11 can be used as a welding area with the external circuit). The LED chip can be provided on the front of the metal substrate 10. The fillet part 212 is formed in the fillet area 122 and is integrally connected to the main body 211; the base 12 corresponds to the exposed area 121 (reference Figure 2 and Figure 4 ) is exposed in the package body 20, and the base foot 12 corresponds to the fillet area 122 (reference Figure 9 ) is provided with a fillet portion 212, that is, the fillet portion 212 and the main body portion 211 are respectively provided on both sides of the metal substrate 10 and are integrally formed. The base 12 is partially exposed outside the package body 20. In this embodiment, the front side of the base 12 is also provided with an exposed area 121' corresponding to the exposed area on the back side of the base 12 (refer to Figure 3 and Figure 4 ), which is convenient for the molding mold to clamp when molding the packaging body 20. The packaging body 20 is provided on both sides of the intersection of the base 12 and the plate body 11 (i.e., the fillet area 122). The packaging body 20 can form a closed edge on the back of the metal substrate 10 (refer to Figure 4 The metal substrate 10 is surrounded by the encapsulation body 20 (which may be plastic) on all four sides, enhancing the airtightness of the bracket and the bonding strength between the metal substrate 10 and the encapsulation body 20. At the same time, the exposed area 121 of the base foot 12 is exposed from the encapsulation body 20. This allows for connection between multiple brackets before cutting during bracket production, as well as for welding points. It can also be welded to external metal components to increase the contact and thermal conductivity area, resulting in effective use. Furthermore, the exposed area 121 does not need to cover the encapsulation body 20, reducing production costs. Furthermore, the fillet area 122 and the fillet portion 212 are located at the narrowest point where the base foot 12 connects to the plate body 11, minimizing the bonding surface between the metal substrate and the encapsulation body exposed in the exposed area 121, thereby reducing the path for moisture to enter the bracket.

[0041] Specifically, both ends of the molding portion 212 are integrally formed on the main body portion 211 at both sides of the base foot 12 (refer to FIG. Figure 4 The area shown by the shaded area in the middle), that is, when viewed from the back of the LED bracket, the fillet portion 212 separates the exposed area 121 of the base 12 from the board 11 on the plane. This structure allows the package body 20 to be tightly combined with the metal substrate 10 while maintaining a large heat dissipation and welding area on the back of the substrate body. Figure 2, a schematic diagram of the back three-dimensional structure of the LED bracket is shown, in which the back of the plate 11 is at least partially exposed on the back of the LED bracket to facilitate connection with an external circuit.

[0042] In this embodiment, the projection of the metal substrate 10 toward the bottom surface includes a central area (the area of ​​the plate body 11) and a footing area. The footing area includes an exposed area corresponding to the exposed area 121 (the exposed area corresponding to the exposed area 122). Figure 4 The area indicated by 121 in FIG. 121 corresponds to the area indicated by 121 in FIG. 121 and the area indicated by 121 in FIG. 121 corresponding to the area indicated by 121 in FIG. Figure 4 The central area and the exposed area are separated by the fillet area, so that the back of the LED bracket is formed with a closed-shaped package body 20, the exposed area 121 is located outside the closed shape, and the board body 11 is located inside the closed shape. Figure 4 In FIG, the hatched area is the area of ​​the package 20 , and the unhatched area is the area of ​​the metal substrate 10 (when the LED bracket is viewed from the bottom).

[0043] Specifically, the bottom surface of the fillet portion 212 is flush with the bottom surface of the metal substrate 10 , so that the package body and the metal substrate have good bonding strength and airtightness, which can simplify the production mold structure, facilitate manufacturing, and does not affect heat dissipation.

[0044] Specifically, if Figures 1 to 9 As shown, the outer periphery of the package body 20 is in a rectangular shape with notches 201 at the four corners (refer to Figure 5 and Figure 6 ), the exposed area 121 of the base 12 is exposed at the notch 201, so as to reduce the material usage of the package 20 and reduce the production cost. The center of the package 20 is provided with a light-emitting body mounting hole 203 (refer to Figure 1 ), the light emitting body (LED chip) can be set in the light emitting body mounting hole 203 and connected to the plate 11 (refer to Figure 17 ); The metal substrate 10 includes two separate sub-substrates (reference Figure 7 、 Figure 8 、 Figure 9As shown), each sub-substrate is provided with two base feet 12 and each base foot 12 is provided on a side of the two sub-substrates away from each other. In this embodiment, the two sub-substrates are symmetrically arranged. The bottom surfaces of the opposite sides of the two sub-substrates are provided with a strip-shaped notch 111, and the package body 20 at least fills the strip-shaped notch 111, thereby insulating the two sub-substrates, and the package body is at least partially embedded in the strip-shaped notch 111, so that the package body 20 and the metal substrate 10 are more tightly combined. In this embodiment, the board body 11 is rectangular, and the two adjacent corners on its outer side are set as chamfers. The base foot 12 is formed by extending outward from the chamfer. The notch 120 can be formed on the back of the base foot 12 by an etching process. The notch 120 of the base foot 12 forms a step structure with the back of the board body 11, and the fillet portion 212 is formed at the step close to the board body 11. On the outer side of the LED bracket (reference Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 ), the outer side surface of the base foot 12 is flush with the outer side surface of the package body 20; and the outer side surface of each base foot 12 is adjacent to the outer side surface of the package body 20 in the length direction of the outer side surface of the LED bracket; the outer side surface of the base foot 12 and the outer side surface of the package body 20 do not overlap (that is, the upper and lower sides of the base foot 12 are not covered by the package body 20). This structural design ensures that during the LED manufacturing process, when cutting (related description will be given below), the cutting tool will only cut the package body 20 or the base foot 12 separately, and will not cut the base foot 12 and the package body 20 at the same time, avoiding inconsistent force feedback on the cutting tool due to the different material properties of the metal substrate 10 and the package body 20, which may cause the bracket to rupture or affect the airtightness of the combination of the metal substrate 10 and the package body 20.

[0045] The present invention also provides a method for manufacturing an LED bracket, which is used to manufacture the above-mentioned LED bracket, comprising the following steps:

[0046] refer to Figure 10 、 Figure 11 As shown, a substrate frame 130 having a metal substrate 10 is prepared on a whole metal plate by a stamping process or an etching process. The substrate frame 130 includes an outer frame 133 and a plurality of metal substrates 10 arranged in an array within the outer frame 133. Adjacent base feet between the metal substrates 10 are integrally formed and connected. The plurality of metal substrates 10 arranged in the array are connected to the outer frame 133 via base feet 12. The area outside the area of ​​the metal substrates 10 and the outer frame 133 is a hollow portion (i.e., the blank area in the figure).

[0047] The notch 120 on the back of the footing 12 is also formed by etching or stamping in the above steps. The notch 120 is at least provided in the fillet area 122. In this embodiment, the notch includes the exposed area and the fillet area.

[0048] (refer to Figures 12a to 15 As shown, and combined with reference Figure 1 、 Figure 2 、 Figure 4 ) The package body 20 is formed on the metal substrate 10 by injection molding or molding to form a bracket sheet 140 including a plurality of LED brackets arranged in an array. The main body 211 of the package body 20 is formed on the front surface of the plate body 11 and the front surface of the base foot 12 corresponding to the fillet area 122 (that is, opposite to the fillet area 122, the fillet area 122 is on the back of the base foot 12), and the package body 20 covers the edge of the plate body 11 but does not cover the base foot 12. The fillet portion 212 of the package body 20 is formed on the base foot 12 corresponding to the fillet area. The exposed area 121 is exposed outside the package body 20, which can be used as a connection point between the brackets before cutting, and can also be used as a welding point to connect with external metal parts to increase the contact heat conduction area, thereby achieving a good use effect.

[0049] If the metal notch (i.e., notch 120) is not specially treated during injection molding, the plastic may completely enter the metal notch. To ensure the metal notch is formed, the metal notch is clamped by the mold during injection molding of the package body 20 in this embodiment. This prevents the plastic from entering the metal notch, thus reducing the amount of plastic used. The fillet area 122 is not clamped by the mold and can be filled with plastic to form the fillet portion 212.

[0050] In specific applications, such as Figure 10 The figure shows a front plan view of the substrate frame 130. Each of the base feet 12 protrudes from the side of the metal substrate 10 in the peripheral direction. The grid line part is a metal entity, which includes multiple (4 rows and 4 columns) metal substrates 10 connected as one. The part without grid lines is a hollow structure. Figure 11 The figure shows a schematic diagram of the back plane of the substrate frame 130. The parts without grid lines and shadow lines are hollow structures. The planes corresponding to the outer frame shadow lines and the inner shadow lines are at the same height. The larger grid line area corresponding to the base 12 is the first etching area (corresponding to the notch 120 in this embodiment), and the smaller grid lines are the second etching area. The planes corresponding to the first etching area and the second etching area are both lower than the planes corresponding to the outer frame shadow lines and the inner shadow lines. The substrate frame 130 is set in the injection mold to form the package body 20, as shown in FIG. Figure 12a The mold and substrate frame 130 are shown corresponding to Figure 10 The cross-sectional view of the substrate frame 130 at AA (open mold state) shows that the mold includes an upper mold 31 and a lower mold 32 that are arranged in a matched manner. The upper mold 31 and the lower mold 32 can be matched to clamp the substrate frame 130 to inject glue to form the package body 20. Figure 12b The mold and substrate frame 130 are shown corresponding to Figure 10 A schematic cross-sectional view of the middle substrate frame 130 at AA (mold closing state) is shown as follows: Figure 13 The mold and substrate frame 130 are shown corresponding to Figure 11 The cross-sectional view of the middle substrate frame 130 at BB (in the mold opening state) shows that a portion of the notch 120 (corresponding to the fillet area 122 ) is not clamped by the upper mold 31 and the lower mold 32 , and a fillet portion 212 will be formed during the injection of glue.

[0051] like Figure 14 and Figure 15 As shown, multiple metal substrates 10 can be integrally formed with the LED package body 20 to form an LED bracket sheet 140, which can be cut into individual LED lamp beads (refer to Figure 17 As shown). The area between adjacent LED brackets on the bracket sheet 140 and between the outer frame 133 and the LED bracket is a cutting path area. The cutting path area includes crisscrossing cutting paths 131 and 132. In the cutting path area, the base foot 12 and the package body 20 do not overlap in thickness, so as to avoid the tool cutting the base foot 12 and the package body 20 at the same time during cutting. Figure 13 and Figure 14 As shown, in the step of forming the package body 20 by the substrate frame 130 through an injection molding or molding process to form a bracket sheet 140 including a plurality of LED brackets arranged in an array, the hollow portion near the outer frame 133 is not completely filled with the package body, and part of the hollow portion (the area covered by the grid lines in the figure) remains. The remaining hollow portion can reduce the amount of package body used to reduce production costs and is convenient for reducing the resistance of the tool during cutting.

[0052] After cutting, the side surfaces of the base foot 12 and the package body 20 are coplanar, and the cutting paths 131 and 132 are along the cutting direction. The cutting surface of the base foot 12 and the cutting surface of the package body 20 are continuous, but the cutting paths 131 and 132 either only cut the package body 20 or only cut the base foot 12, that is, the base foot 12 and the package body 20 do not overlap on the cutting paths 131 and 132, thereby avoiding cutting the base foot 12 and the package body 20 at the same time, reducing the stress transmitted to the plastic during the cutting process, reducing the risk of the package body 20 breaking, improving the production yield, and helping to reduce costs.

[0053] Furthermore, in this embodiment, the provision of the notches 120 effectively prevents the base legs 12 from bending downward during cutting and protruding beyond the bottom surface of the substrate, which could result in an uneven bottom surface of the final LED lamp bead and lead to poor soldering when the LED lamp bead is soldered to the PCB through the substrate body 11. When cutting the substrate frame 130, the base legs 12 are susceptible to slight downward warping due to the stress of cutting. However, the provision of the notches 120 ensures that even if the base legs 12 warp downward, they will not protrude beyond the bottom surface of the substrate body 11, thus preventing poor contact of the LED bracket during soldering and improving reliability.

[0054] In a specific application, the notch 120 is provided in both the exposed area 121 and the fillet area 122. The exposed area 121 and the fillet area 122 can be flush (same height) or stepped (not same height). However, when viewed from the back side of the metal substrate (the side with the notch 120 is the back side), both are lower than the plate body 11. As another optional embodiment, Figure 16 As shown, the notch 120 is only provided in the fillet area 122. When viewed from the back side of the metal substrate (the side with the notch 120 is the back side), the exposed area 121 is flush with the bottom surface of the metal substrate (plate body 11). When cutting this structure, the substrate frame should be turned over (with the bottom surface of the metal substrate facing up) for cutting to prevent the base from warping and protruding from the bottom surface of the substrate.

[0055] like Figure 17 As shown, an embodiment of the present invention further provides an LED lamp bead 100, which includes the aforementioned LED bracket and a recessed portion provided on the front of the bracket for mounting an LED chip. In this embodiment, the recessed portion is a mounting hole 203. An LED chip 30 is disposed within the mounting hole 203 and welded to the front of the plate body 11 of the metal substrate 10. The mounting hole is also filled with a filling portion 50 that covers the LED chip 30. The four sides of the metal substrate 10 of the LED lamp bead are surrounded by plastic (encapsulation body 20), which increases the airtightness of the bracket and exposes the exposed area 121 of the base foot 12. Referring to the description of the above embodiment, the base foot 12 can serve as a connection between the brackets in the substrate frame 130 before cutting. It can also reduce stress transmitted to the plastic during the cutting process, reducing the risk of cracking.

[0056] refer to Figure 18 As shown, this embodiment provides a light-emitting device, including the above-mentioned LED lamp beads, and also includes a circuit board 40. The circuit board 40 is provided with a prefabricated circuit (printed or embedded in the circuit board, not shown) and a first soldering pad 41 electrically connected to the prefabricated circuit. The back of the plate 11 of the LED lamp bead 100 is soldered to the soldering pad 41. In this embodiment, there are two first soldering pads 41, which are respectively connected to the two plates 11 on the back of the LED lamp bead 100 (refer to Figure 2 and Figure 8) welding; the circuit board 40 is also provided with a heat sink (printed or embedded in the circuit board, not shown) and a second soldering pad 42 electrically connected to the heat sink, the second soldering pad 42 is welded to the base foot 12. In this embodiment, there are four second soldering pads 42, which are respectively welded to the exposed area of ​​each base foot 12. It can be seen that the base foot 12 can also be used as a welding point to connect with the external heat dissipation component, increase the contact heat conduction area, and increase the stability of the welding between the LED lamp bead 100 and the circuit board, with good use effect. In this embodiment, the heat sink can be a copper layer provided on the surface of the circuit board, and the heat sink does not have a circuit function. In addition, in some applications, the base foot 12 can also be connected to the circuit on the circuit board to serve as a power supply to the LED lamp bead.

[0057] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions or improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. An LED lamp bead, characterized in that: The LED bracket comprises an LED bracket, an LED chip and a filling part. The LED bracket comprises a metal substrate and a packaging body. The metal substrate is at least partially embedded in the packaging body. The metal substrate comprises a plate body and a base foot arranged on the periphery of the plate body. The back of the base foot has an exposed area and a fillet area and is provided with a notch. The notch is provided at least in the fillet area. The packaging body comprises a main body and a fillet part. The main body is formed on the front side of the metal substrate and covers the edge of the plate body. The front side of the main body is provided with a recess for mounting the LED chip. Part of the surface of the metal substrate is exposed at the bottom surface of the recess. The LED chip is electrically connected to the metal substrate. The filling part fills the recess and covers the LED chip. The fillet part is formed in the fillet area and is integrally connected to the main body. The base foot is exposed outside the packaging body corresponding to the exposed area, and the base foot is provided with the fillet part corresponding to the fillet area.

2. The LED lamp bead according to claim 1, characterized in that: The two ends of the fillet portion are integrally formed on the main body portion at both sides of the base foot; the back side of the plate body is at least partially exposed to the back side of the LED lamp bead.

3. The LED lamp bead according to claim 1, characterized in that: The projection of the metal substrate toward the bottom surface includes a central area and a footing area. The footing area includes an exposed area corresponding to the exposed area and a fillet area corresponding to the fillet area. The central area and the exposed area are separated by the fillet area.

4. The LED lamp bead according to claim 1, characterized in that: The notch is provided in both the exposed area and the fillet area, and the exposed area and the fillet area are flush or stepped. Alternatively, the notch is provided only in the fillet area, and the exposed area is flush with the bottom surface of the metal substrate.

5. The LED lamp bead according to claim 1, characterized in that: The outer plane shape of the package body is a rectangle with notches at the four corners, and the exposed area of ​​the base foot is exposed at the notches. The metal substrate includes two sub-substrates arranged relatively separately, each of the sub-substrates is provided with two base feet, and each base foot is provided on a side of the two sub-substrates away from each other; the bottom surfaces of the opposite sides of the two sub-substrates are provided with strip-shaped notches, and the package body at least fills the strip-shaped notches.

6. The LED lamp bead according to claim 1, characterized in that: The front side of the footing is also provided with an exposed area corresponding to the exposed area on the back side of the footing.

7. The LED lamp bead according to claim 1, characterized in that: The fillet area and the fillet portion are arranged at the narrowest point where the base foot is connected to the plate body; the fillet portion is flush with the bottom surface of the LED lamp bead.

8. The LED lamp bead according to claim 1, characterized in that: The outer side surface of the base foot is flush with the outer side surface of the package body; and the outer side surface of each base foot is adjacent to the outer side surface of the package body in the length direction of the outer side surface of the LED bracket; the outer side surface of the base foot and the outer side surface of the package body have no overlapping parts.

9. An LED light-emitting device, characterized in that: The invention comprises the LED lamp bead according to any one of claims 1 to 8.

10. The LED lighting device according to claim 9, characterized in that: It also includes a circuit board, which is provided with a prefabricated circuit and a first soldering pad electrically connected to the prefabricated circuit, and the back of the board is welded to the soldering pad; the circuit board is also provided with a heat sink and a second soldering pad electrically connected to the heat sink, and the second soldering pad is welded to the base foot.

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