Chip detection device and detection method

Abstract

The present invention discloses a chip detection device and a detection method, wherein the chip detection device comprises a first feeding mechanism and a first receiving mechanism respectively arranged on both sides of a second detection mechanism, a second receiving mechanism arranged on the other side of the first receiving mechanism, and a mobile selection mechanism arranged on the upper end of the first feeding mechanism, the second detection mechanism, the first receiving mechanism, and the second receiving mechanism; the first feeding mechanism can receive a chip tray and detect the chip tray, the second detection mechanism can receive the chip on the first feeding mechanism through the mobile selection mechanism and detect the cache, and the mobile selection mechanism can grab the chip tray or chip on the second detection mechanism and place it on the first receiving mechanism or the second receiving mechanism for unloading. The beneficial effect of the present invention is that it can realize high-precision and high-efficiency chip detection, while improving the degree of automation and reducing manual intervention, thereby meeting the market demand for high-quality chips.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a chip detection device and a chip detection method. Background Art

[0002] With the continuous advancement of information technology, the demand for semiconductor chips, as the core components of electronic devices, continues to grow. This not only requires the chip manufacturing process to achieve large-scale and efficient production, but also puts higher requirements on the quality and performance of chips.

[0003] In the chip production process, packaging is an important link, and the packaging quality directly affects the performance and life of the chip. The evaluation of packaging quality depends on the precise measurement and detection of packaging parameters, which makes the chip packaging sorting tester a key equipment in the chip production process. However, traditional chip sorting and testing equipment has certain limitations in detection efficiency, accuracy and degree of automation. For example, traditional dimensional measurement methods are usually performed by visual inspection or mechanical measurement, which is inefficient and easily affected by ambient light. In addition, the poor coordination between the various mechanisms of traditional testing equipment also affects the overall detection efficiency.

[0004] Therefore, in order to cope with the rapid development of the semiconductor industry and the challenges in the chip manufacturing process, the inventors designed a chip detection device and detection method. Summary of the invention

[0005] The purpose of this section is to summarize some aspects of embodiments of the present invention and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and the specification abstract and the invention title of this application to avoid blurring the purpose of this section, the specification abstract and the invention title, and such simplifications or omissions cannot be used to limit the scope of the present invention.

[0006] In view of the above problems or problems existing in the prior art, the present invention is proposed.

[0007] Therefore, the purpose of the present invention is to provide a chip detection device and detection method, which can achieve high-precision and high-efficiency chip detection, while improving the degree of automation and reducing manual intervention, thereby meeting the market demand for high-quality chips.

[0008] In order to solve the above technical problems, the present invention provides the following technical solutions: including a first loading mechanism, a second detection mechanism, a mobile picking mechanism, a first receiving mechanism, and a second receiving mechanism; the first loading mechanism and the first receiving mechanism are respectively arranged on both sides of the second detection mechanism, the second receiving mechanism is arranged on the other side of the first receiving mechanism, and the first loading mechanism, the second detection mechanism, the first receiving mechanism, and the upper ends of the second receiving mechanism are arranged with a mobile picking mechanism; the first loading mechanism can receive a chip tray and detect the chip tray, the second detection mechanism can receive the chip on the first loading mechanism through the mobile picking mechanism and detect the cache, and the mobile picking mechanism can grab the chip tray or chip on the second detection mechanism and place it on the first receiving mechanism or the second receiving mechanism for unloading.

[0009] As a preferred solution of the chip detection device of the present invention, wherein: the first loading mechanism includes a first loading channel assembly and a first stacking assembly, the first loading channel assembly is provided with a first stacking assembly, a chip tray can be provided on the first loading channel assembly, and the chip tray can be moved on the first loading channel assembly, and the first stacking assembly can perform stacking detection on the chip tray; the mobile picking mechanism includes a mobile support shaft and a first grabbing module, the mobile support shaft is provided above the first loading mechanism, the first grabbing module can slide on one side of the mobile support shaft, and the first grabbing module can grab the chip on the first loading channel assembly to the second detection mechanism.

[0010] As a preferred solution of the chip detection device of the present invention, it also includes a first detection mechanism, which is arranged on the side of the first loading channel assembly, and the first detection mechanism includes a five-sided detection area. A mobile picking mechanism is arranged on the upper end of the first detection mechanism, and the mobile picking mechanism includes a five-sided grabbing shaft assembly and a mobile support shaft. A five-sided grabbing shaft assembly is arranged on the mobile support shaft, and the five-sided grabbing shaft assembly can grab the chip in the chip tray on the first loading channel assembly to the five-sided detection area for appearance inspection.

[0011] As a preferred solution of the chip detection device of the present invention, wherein: the first detection mechanism also includes a flipping and transferring shaft assembly and a back detection assembly, the back detection assembly is arranged at one end of the first detection mechanism, the flipping and transferring shaft assembly is arranged on the mobile picking mechanism, the flipping and transferring shaft assembly can be moved on the mobile picking mechanism, the flipping and transferring shaft assembly can flip the chip tray in the first detection mechanism, the first detection mechanism can drive the flipped chip into the back detection assembly, and the back detection assembly can perform back detection on the flipped chip.

[0012] As a preferred solution of the chip detection device of the present invention, the second detection mechanism includes a second channel component and a front detection component; a front detection component is provided at one end of the second channel component, and the second channel component can receive the chip on the first feeding mechanism or the first detection mechanism and perform front detection through the front detection component.

[0013] As a preferred solution of the chip detection device of the present invention, wherein: the first receiving mechanism includes a first receiving channel, the first receiving channel can receive the defective chips of the second detection mechanism through a mobile selection mechanism, and the first receiving channel can drive the defective chips on the chip tray to move to the operation area; the mobile selection mechanism includes a mobile support shaft, a first grabbing module and a second grabbing module; the first grabbing module and the second grabbing module are respectively arranged on both sides of the mobile support shaft, and the first grabbing module and the second grabbing module can both slide on the mobile support shaft, and a mobile support shaft is arranged above the second receiving mechanism, and the second grabbing module can grab the defective chips of the second detection mechanism into the first receiving channel.

[0014] As a preferred solution of the chip detection device of the present invention, the second receiving mechanism includes a second receiving channel, the second receiving channel can receive the good chips of the second detection mechanism through the mobile selection mechanism, and the second receiving channel can drive the good chips on the chip tray to move, and the second grabbing module can grab the good chips on the second detection mechanism into the second receiving channel.

[0015] As a preferred solution of the chip detection device of the present invention, the second receiving mechanism also includes a taping machine, which is arranged on one side of the second receiving channel. The taping machine can receive and group the good chips of the second detection mechanism through a mobile picking mechanism, and the second grabbing module slides on the movable support shaft, and the second grabbing module can grab the good chips of the second detection mechanism to the taping machine.

[0016] The present invention also provides a chip detection method, including a chip detection device, further including a first feeding channel component, a first stacking component, a first detection mechanism, a five-side detection component, a five-side detection area, a flip transfer shaft component, a back detection component, a second receiving channel and a braiding machine, the mobile selection mechanism includes a five-side grabbing shaft component, a mobile support shaft, a first grabbing module and a second grabbing module; including the following steps:

[0017] S1: Chips can be loaded through the first loading mechanism, and the chip tray can be stacked and inspected;

[0018] S2: The first inspection mechanism can receive the chip on the first feeding mechanism and perform appearance and back surface inspection on the chip;

[0019] S3: The second detection mechanism can receive the chip turned over by the first detection mechanism, so as to detect the front side of the chip, and the chip can be cached after the second detection mechanism completes the detection;

[0020] S4: In steps S2 and S3, if the first detection mechanism is not configured, after step S1 is completed, the operation is directly performed through this step; specifically, the first grabbing module can grab the chip in the first feeding mechanism and put it into the second detection mechanism for front detection, and the chip can be cached after the detection is completed;

[0021] S5: The chips cached on the second detection mechanism can be classified and selected through the second grabbing module, and the defective chips can be transferred to the first receiving mechanism and stacked to wait for manual sorting;

[0022] S6: The chips cached on the second detection mechanism can be classified and selected through the second grabbing module, and the good chips can be transferred to the second receiving channel for processing;

[0023] S7: In step S6, if the second receiving channel is not configured, after step S5 is completed, the operation is directly performed through this step; specifically: the chips cached on the second detection mechanism can be classified and selected through the second grabbing module, and the good chips can be transferred to the taping machine for grouping and sorting.

[0024] As a preferred solution of the chip detection method of the present invention, the steps of detecting the back side of the chip by the first detection mechanism in S2 are as follows:

[0025] S2-1: First, the chip on the first feeding mechanism is grabbed to the five-sided inspection area by the five-sided grabbing shaft assembly, the appearance of the chip is inspected by the five-sided inspection area, and the chips in the multiple chip trays on the first feeding channel assembly are inspected for dirt on the appearance, and are placed in place after the inspection is completed;

[0026] S2-2: The first loading channel assembly then drives the plurality of chip trays to continue to move, and uses the flipping and transferring shaft assembly to flip the chips in the chip trays and place them on the trays on the first detection mechanism;

[0027] S2-3: The chip in the fixture is driven to move by the detection channel on the first detection mechanism, so that the chip in the fixture is moved to the back detection component, and the back detection component can perform 2D and 3D detection on the back of the chip in the fixture;

[0028] S2-4: The chip after inspection is turned over by the turning and transferring shaft assembly and moved to the second inspection mechanism, and 2D and 3D inspections are performed on the front side of the chip.

[0029] The beneficial effects of the present invention are as follows: the present invention can load chips and inspect the stacking of materials on the tray through the first loading mechanism, perform 2D and 3D inspection on the back of the chip through the first inspection mechanism, grab the chip on the first loading mechanism to the second inspection mechanism through the mobile selection mechanism 3, perform 2D and 3D inspection on the appearance and the front of the chip through the second inspection mechanism, cache the chips after the inspection through the second inspection mechanism, classify and select the cached chips through the mobile selection mechanism, and send defective chips to the first receiving mechanism for sorting and the next step of operation; the good chips are sent to the second receiving mechanism or the taping machine. The present invention can achieve high-precision and high-efficiency chip inspection, while improving the degree of automation and reducing manual intervention, thereby meeting the market demand for high-quality chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative labor. Among them:

[0031] Figure 1 A top view of the chip detection device.

[0032] Figure 2 This is an axial view of the chip detection device.

[0033] Figure 3 This is an axonometric view of the chip detection device from another perspective.

[0034] Figure 4 Flow chart of the chip detection method. DETAILED DESCRIPTION

[0035] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings.

[0036] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0037] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The term "in one embodiment" that appears in different places in this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or selective embodiment that is mutually exclusive with other embodiments.

[0038] Example 1

[0039] Reference Figures 1 to 3 , is the first embodiment of the present invention, which provides a chip detection device, including a first loading mechanism 1, a second detection mechanism 2, a mobile picking mechanism 3, a first receiving mechanism 4, and a second receiving mechanism 5; the first loading mechanism 1 and the first receiving mechanism 4 are respectively arranged on both sides of the second detection mechanism 2, and the second receiving mechanism 5 is arranged on the other side of the first receiving mechanism 4, and the mobile picking mechanism 3 is arranged on the upper ends of the first loading mechanism 1, the second detection mechanism 2, the first receiving mechanism 4, and the second receiving mechanism 5; the first loading mechanism 1 can receive a chip tray and detect the chip tray, the second detection mechanism 2 can receive the chip on the first loading mechanism 1 through the mobile picking mechanism 3 and detect the cache, and the mobile picking mechanism 3 can grab the chip tray or chip on the second detection mechanism 2 and place it on the first receiving mechanism 4 or the second receiving mechanism 5 for unloading.

[0040] Preferably, the first loading mechanism 1 can receive the chip tray from the operation area, and stack them vertically in multiple layers, and drive the chip tray to move and perform stacking detection via the track.

[0041] Preferably, without setting up the first detection mechanism 6, the chip tray can be directly inspected for stacking through the first loading mechanism 1; the second detection mechanism 2 can receive the chip on the first loading mechanism 1 through the mobile picking mechanism 3, and the chip can be inspected from the front through the second detection mechanism 2, thereby completing the front 2D and 3D inspection of the chip.

[0042] Preferably, the second inspection mechanism 2 caches the chips after inspection, and uses the mobile sorting mechanism 3 to grab the good chips or defective chips after inspection and place them in the first receiving mechanism 4 and the second receiving mechanism 5 respectively, waiting for manual grouping or automatic grouping by machine.

[0043] Preferably, the mobile selection mechanism 3 is arranged above the first detection mechanism 1, the second detection mechanism 2, the first receiving mechanism 4, and the second receiving mechanism 5, and can perform grabbing operations on the chips in the first detection mechanism 1, the second detection mechanism 2, the first receiving mechanism 4, and the second receiving mechanism 5.

[0044] Furthermore, the first feeding mechanism 1 includes a first feeding channel assembly 11 and a first stacking assembly 12. The first feeding channel assembly 11 is provided with the first stacking assembly 12. A chip tray can be provided on the first feeding channel assembly 11, and the chip tray can be moved on the first feeding channel assembly 11. The first stacking assembly 12 can perform stacking detection on the chip tray; the mobile picking mechanism 3 includes a mobile support shaft 32 and a first grabbing module 33. The mobile support shaft 32 is provided above the first feeding mechanism 1. The first grabbing module 33 can slide on one side of the mobile support shaft 32. The first grabbing module 33 can grab the chip on the first feeding channel assembly 11 to the second detection mechanism 2.

[0045] Preferably, a track is provided inside the first loading channel assembly 11, and the chip tray can be driven to move by the movement of the track;

[0046] It should be noted that the first detection mechanism 6, the second detection mechanism 2, the first receiving mechanism 4, and the second receiving mechanism 5 are all provided with tracks inside, and can drive the tray or the chip to move;

[0047] Preferably, multiple groups of chips are placed in the chip tray, and the chip trays can be stacked vertically. The first stacking component 12 can scan and identify the stacked chip trays to determine how many layers the chip trays are stacked.

[0048] It should be noted that the first detection mechanism 1, the second detection mechanism 2, the first receiving mechanism 4, and the second receiving mechanism 5 can be provided with a first stacking assembly 12, which can scan and identify the chip tray and scan the chip in the chip tray.

[0049] Furthermore, it also includes a first detection mechanism 6, which is arranged on the side of the first loading channel assembly 11. The first detection mechanism 6 includes a five-sided detection area 61. A mobile selection mechanism 3 is arranged on the upper end of the first detection mechanism 6. The mobile selection mechanism 3 includes a five-sided grabbing shaft assembly 31 and a mobile support shaft 32. The five-sided grabbing shaft assembly 31 is arranged on the mobile support shaft 32. The five-sided grabbing shaft assembly 31 can grab the chip in the chip tray on the first loading channel assembly 11 to the five-sided detection area 61 for appearance inspection.

[0050] Preferably, when the first inspection mechanism 6 is provided, the first inspection mechanism 6 can inspect the appearance of the chip, and perform 2D inspection and 3D inspection on the back side of the chip; after the back side inspection is completed, the front side of the chip is inspected by the second inspection mechanism 2, thereby completing the appearance inspection of the chip, and the 2D and 3D inspections of the back side and the front side;

[0051] Preferably, a five-sided inspection area 61 is set on the side close to the first stacking component 12, and the chips in the chip tray on the first loading channel component 11 can be grabbed by the five-sided grabbing shaft assembly 31 to the five-sided inspection area 61 for appearance inspection; five groups of chips can be grabbed by the five-sided grabbing shaft assembly 31 for inspection each time, and the chips in all the stacking chip trays on the first loading channel assembly 11 can be inspected in turn multiple times by the five-sided grabbing shaft assembly 31.

[0052] Preferably, the five-sided grabbing shaft assembly 31 can move between the five-sided detection area 61 and the first feeding channel assembly 11 , and the five-sided grabbing shaft assembly 31 moves on the movable support shaft 32 .

[0053] Preferably, the chip is inspected through the five-sided inspection area 61 to check whether the appearance of the chip is dirty; after the inspection is completed, the chip tray is continuously pushed forward through the track in the first loading channel assembly 11.

[0054] It should be noted that the five-sided inspection area 61, the first stacking assembly 12 and the five-sided grabbing shaft assembly 31 can be configured according to needs. If not configured, it will directly enter the next process.

[0055] Furthermore, the first detection mechanism 6 also includes a flipping and transferring shaft assembly 62 and a back detection assembly 63. The back detection assembly 63 is arranged at one end of the first detection mechanism 6, and the flipping and transferring shaft assembly 62 is arranged on the mobile picking mechanism 3. The flipping and transferring shaft assembly 62 can move on the mobile picking mechanism 3. The flipping and transferring shaft assembly 62 can flip the chip tray in the first detection mechanism 6. The first detection mechanism 6 can drive the flipped chip into the back detection assembly 63. The back detection assembly 63 can perform back detection on the flipped chip.

[0056] Preferably, the back detection component 63 is arranged on a side away from the five-sided detection area 61, the flip transfer shaft component 62 can move between the first feeding mechanism 1 and the first detection mechanism 6, the flip transfer shaft component 62 is arranged on the mobile selection mechanism 3, and the flip transfer shaft component 62 can slide on the mobile selection mechanism 3; the flip transfer shaft component 62 is arranged on one side of the back of the five-sided grabbing shaft component 31;

[0057] The chip tray continues to be pushed forward through the track in the first loading channel assembly 11. After reaching the working range of the flipping and transferring shaft assembly 62, the chip in the chip tray on the first loading channel assembly 11 is flipped onto the chip tray on the track of the first detection mechanism 6 through the flipping and transferring shaft assembly 62, and the flipping and transferring shaft assembly 62 is used to push the flipped chip into the back detection assembly 63 through the track on the first detection mechanism 6, and the back of the chip is subjected to 2D and 3D detection by the back detection assembly 63; after the back detection is completed, the chip tray and the chip are driven to move to the position of the flipping and transferring shaft assembly 62 by the track on the first detection mechanism 6, and the flipping and transferring shaft assembly 62 is used to flip the chip on the back again onto the chip tray on the first loading channel assembly 11. At this time, the front side of the chip on the chip tray on the first loading channel assembly 11 is facing upwards; at this time, the chip tray and the chip in the first loading channel assembly 11 can be grabbed by the first grabbing module 33 and brought to the second detection mechanism 2 for detection.

[0058] It should be noted that the front transfer shaft assembly 62 and the back detection assembly 63 can be set as required. If not set, the next process is entered.

[0059] Furthermore, the second detection mechanism 2 includes a second channel component 21 and a front detection component 22; the front detection component 22 is provided at one end of the second channel component 21, and the second channel component 21 can receive the chip on the first feeding mechanism 1 or the first detection mechanism 6 and perform front detection through the front detection component 22.

[0060] Preferably, the chip tray and chip in the first loading channel assembly 11 are grabbed by the first grabbing module 33 and put onto the second channel assembly 21, and the chip tray and chip are driven by the track on the second channel assembly 21 to enter the front detection assembly 22 for chip front detection, and 2D and 3D detection can be performed. After the detection is completed, the chip tray and chip are moved by the track in the first loading channel assembly 11, and the first grabbing module 33 is used to store the good and defective products in separate trays, and temporarily stored on the track of the first loading channel assembly 11.

[0061] Furthermore, the first receiving mechanism 4 includes a first receiving channel 41, and the first receiving channel 41 can receive defective chips from the second detection mechanism 2 through the mobile selection mechanism 3, and the first receiving channel 41 can drive the defective chips on the chip tray to move to the operation area; the mobile selection mechanism 3 includes a mobile support shaft 32, a first grabbing module 33 and a second grabbing module 34; the first grabbing module 33 and the second grabbing module 34 are respectively arranged on both sides of the mobile support shaft 32, and the first grabbing module 33 and the second grabbing module 34 can both slide on the mobile support shaft 32, and a mobile support shaft 32 is arranged above the second receiving mechanism 5, and the second grabbing module 34 can grab the defective chips of the second detection mechanism 2 into the first receiving channel 41.

[0062] Preferably, the first receiving channel 41 can receive defective chips, and the second grabbing module 34 can grab the defective chips of the second detection mechanism 2 and put them into the first receiving channel 41 .

[0063] Preferably, the track inside the first receiving channel 41 can transport the defective chips to the operation area and stack them for processing.

[0064] Furthermore, the second receiving mechanism 5 includes a second receiving channel 51, which can receive the good chips from the second detection mechanism 2 through the mobile selection mechanism 3, and the second receiving channel 51 can drive the good chips on the chip tray to move, and the second grabbing module 34 can grab the good chips on the second detection mechanism 2 into the second receiving channel 51.

[0065] Preferably, good chips can be received through the second receiving channel 51; the second grabbing module 34 can be used to grab the good chips on the second detection mechanism 2 and put them on the empty tray in the second receiving channel 51, and the good chips and the tray can be driven to the operating area through the track in the second receiving channel 51 to wait for unloading and other operations.

[0066] Furthermore, the second receiving mechanism 5 also includes a taping machine 52, which is arranged on one side of the second receiving channel 51. The taping machine 52 can receive and group the good chips of the second detection mechanism 2 through the mobile picking mechanism 3. The second grabbing module 34 slides on the movable support shaft 32, and the second grabbing module 34 can grab the good chips of the second detection mechanism 2 to the taping machine 52.

[0067] It should be noted that when the second receiving channel 51 is not set, the second receiving channel 51 can be replaced by setting a taping machine 52, and the second grabbing module 34 slides on the movable support shaft 32. The second grabbing module 34 can grab the good chips of the second detection mechanism 2 and unload them onto the taping machine 52.

[0068] Preferably, the braiding machine 52 is optional, and the second receiving channel 51 and the braiding machine 52 can be configured by selecting one of them, and of course, they can also be set at the same time.

[0069] In summary, the present invention can perform appearance inspection on the chip through the first feeding mechanism, perform 2D and 3D inspection on the back of the chip through the first inspection mechanism 6, perform 2D and 3D inspection on the appearance and front of the chip through the second inspection mechanism, cache the chips after inspection through the second inspection mechanism, and classify and select the cached chips through the mobile picking mechanism. Defective chips are sent to the first receiving mechanism for sorting and the next step of operation; good chips are sent to the second receiving mechanism or the taping machine 52. The present invention can achieve high-precision and high-efficiency chip inspection, while improving the degree of automation and reducing manual intervention, thereby meeting the market demand for high-quality chips.

[0070] Example 2

[0071] Reference Figures 1 to 4 , which is the second embodiment of the present invention, based on the embodiment 1, further provides a chip detection method, further comprising a first feeding channel component 11, a first stacking component 12, a first detection mechanism 6, a five-side detection component 14, a five-side detection area 61, a flip transfer shaft component 62, a back detection component 63, a second receiving channel 51 and a braiding machine 52, the mobile selection mechanism 3 comprises a five-side grabbing shaft component 31, a mobile support shaft 32, a first grabbing module 33 and a second grabbing module 34; comprising the following steps:

[0072] S1: Chips can be loaded through the first loading mechanism 1, and the chip tray can be stacked and inspected;

[0073] S2: The first inspection mechanism 6 can receive the chip on the first feeding mechanism 1 and perform appearance and back surface inspection on the chip;

[0074] S2-1: First, the chip on the first feeding mechanism 1 is grabbed to the five-sided inspection area 61 by the five-sided grabbing shaft assembly 31, and the appearance of the chip is inspected by the five-sided inspection area 61. The chips in the multiple chip trays on the first feeding channel assembly 11 are inspected for dirt on the appearance, and are placed in place after the inspection is completed;

[0075] S2-2: Then the first loading channel assembly 11 drives the multiple groups of chip trays to continue to move, and the chips in the chip trays are turned over and placed on the trays on the first detection mechanism 6 by using the turning and transferring shaft assembly 62;

[0076] S2-3: The chip in the fixture is moved to the back detection component 63 through the detection channel on the first detection mechanism 6, and the back detection component 63 can perform 2D and 3D detection on the back of the chip in the fixture;

[0077] S2-4: The chip after inspection is turned over by the turning and transferring shaft assembly 62 and moved to the second inspection mechanism 2 for 2D and 3D inspection of the front side of the chip.

[0078] S3: The second detection mechanism 2 can receive the chip turned over by the first detection mechanism 6, so as to detect the front side of the chip, and the chip can be cached after the second detection mechanism 2 completes the detection;

[0079] S4: In steps S2 and S3, if the first detection mechanism 6 is not configured, after step S1 is completed, the operation is directly performed through this step; specifically, the first grab module 33 can grab the chip in the first feeding mechanism 1 to the second detection mechanism 2 for front detection, and the chip can be cached after the detection is completed;

[0080] S5: The chips cached on the second detection mechanism 2 can be classified and selected by the second grabbing module 34, and the defective chips can be transferred to the first receiving mechanism 4 and stacked to wait for manual sorting;

[0081] S6: The chips cached on the second detection mechanism 2 can be classified and selected through the second grabbing module 34, and the good chips can be transferred to the second receiving channel 51 and processed;

[0082] S7: In step S6, if the second receiving channel 51 is not configured, after step S5 is completed, the operation is directly performed through this step; specifically: the chips cached on the second detection mechanism 2 can be classified and selected through the second grabbing module 34, and the good chips can be transferred to the tape machine 52 for grouping and sorting.

[0083] Reference Figure 4, the process is: in the case where the first detection mechanism 6 is not configured, step S1: the chips can be loaded through the first feeding mechanism 1, and the chip tray can be stacked and detected; after the completion of step S1, directly pass to S4: the chips in the first feeding mechanism 1 can be grabbed by the first grab module 33 to the second detection mechanism 2 for front detection, and can be cached after the detection is completed; then pass to step S5: the chips cached on the second detection mechanism 2 can be classified and selected by the second grab module 34, and the defective chips can be transferred to the first receiving mechanism 4 and stacked, waiting for manual sorting; if the second receiving channel 51 is configured, pass to step S6: the chips cached on the second detection mechanism 2 can be classified and selected by the second grab module 34, and the good chips can be transferred to the second receiving channel 51 and stacked; if the second receiving channel 51 is not configured, when the braiding machine 52 is used, pass to step S7: specifically: the chips cached on the second detection mechanism 2 can be classified and selected by the second grab module 34, and the good chips can be transferred to the braiding machine 52 for grouping and sorting.

[0084] In the case where the first inspection mechanism 6 is configured, step S1 is performed: the first loading mechanism 1 can be used to load the chip, and the chip tray can be stacked and inspected; then, step S2 is performed: the first inspection mechanism 6 can receive the chip on the first loading mechanism 1 and inspect the appearance and back of the chip; step S2 is divided into four small steps, firstly step S2-1: S2-1: firstly, the chip on the first loading mechanism (1) is grabbed to the five-sided inspection area (61) by the five-sided grabbing shaft assembly (31), the appearance of the chip is inspected by using the five-sided inspection area (61), and the chips in the multiple chip trays on the first loading channel assembly (11) are inspected. The chips are inspected for dirt on the outside and placed in place after the inspection is completed; S2-2: the first loading channel component (11) then drives the plurality of chip trays to continue to move, and the chips in the chip trays are turned over and placed on the trays on the first inspection mechanism (6) by using the flip transfer shaft component (62); S2-3: the chips in the fixture are driven to move through the inspection channel on the first inspection mechanism (6), so that the chips in the fixture are moved to the back inspection component (63), and the back inspection component (63) can be used to perform 2D and 3D inspection on the back of the chips in the fixture; S2-4: the chips in the first inspection mechanism (6) are turned over by the flip transfer shaft component (62). The tray is turned over to turn over the chip after the inspection and move it to the second inspection mechanism (2), and perform 2D and 3D inspection on the front side of the chip. After step S2 is completed, through S3: the second inspection mechanism 2 can receive the chip transferred by the first inspection mechanism 6, so as to inspect the front side of the chip, and it can be cached after the inspection by the second inspection mechanism 2 is completed; then step S4 is performed, specifically: the first grabbing module 33 can grab the chip in the first feeding mechanism 1 and put it into the second inspection mechanism 2 for front inspection, and it can be cached after the inspection is completed; then step S5: the second grabbing module 34 can grab the chip in the second inspection mechanism 2 The chips cached on the second detection mechanism 2 are classified and selected, and the defective chips are transferred to the first receiving mechanism 4 and stacked to wait for manual sorting; if the second receiving channel 51 is configured, through step S6: the chips cached on the second detection mechanism 2 can be classified and selected through the second grasping module 34, and the good chips are transferred to the second receiving channel 51 and stacked; if the second receiving channel 51 is not configured, when the tape machine 52 is used, through step S7: specifically: the chips cached on the second detection mechanism 2 can be classified and selected through the second grasping module 34, and the good chips are transferred to the tape machine 52 for grouping and sorting.

[0085] In summary, the present invention can load chips and inspect stacking materials on trays through the first loading mechanism, perform 2D and 3D inspections on the back of the chip through the first inspection mechanism 6, perform 2D and 3D inspections on the appearance and front of the chip through the second inspection mechanism, cache the chips after inspection through the second inspection mechanism, classify and select the cached chips through the mobile picking mechanism, and send defective chips to the first receiving mechanism for sorting and the next step of operation; good chips are sent to the second receiving mechanism or the taping machine 52. The present invention can achieve high-precision and high-efficiency chip inspection, while improving the degree of automation and reducing manual intervention, thereby meeting the market demand for high-quality chips.

[0086] Importantly, it should be noted that the construction and arrangement of the present application shown in a number of different exemplary embodiments are only exemplary. Although only a few embodiments are described in detail in this disclosure, it should be readily understood by those who refer to this disclosure that many modifications are possible (e.g., the size, scale, structure, shape and proportion of various elements, and parameter values ​​(e.g., temperature, pressure, etc.), mounting arrangements, use of materials, color, changes in orientation, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in the application. For example, an element shown as integrally formed may be composed of multiple parts or elements, the position of the element may be inverted or otherwise changed, and the nature or number or position of the discrete element may be altered or changed. Therefore, all such modifications are intended to be included within the scope of the present invention. The order or sequence of any process or method steps may be changed or reordered according to an alternative embodiment. In the claims, any "device plus function" clause is intended to cover the structure described herein that performs the function, and is not only structurally equivalent but also equivalent structure. Other substitutions, modifications, changes and omissions may be made in the design, operating conditions and arrangement of the exemplary embodiments without departing from the scope of the present invention. Therefore, the invention is not limited to a specific embodiment, but extends to numerous modifications still falling within the scope of the appended claims.

[0087] Additionally, in order to provide a concise description of exemplary embodiments, all features of an actual embodiment may not be described (ie, those features that are not relevant to the best mode presently contemplated for carrying out the invention or those features that are not relevant to implementing the invention).

[0088] It will be appreciated that in the development of any actual implementation, as in any engineering or design project, numerous implementation-specific decisions may be made. Such a development effort may be complex and time-consuming, but will be a routine task of design, fabrication, and production for those of ordinary skill having the benefit of this disclosure without undue experimentation.

[0089] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. A chip detection device, characterized in that: The invention comprises a first feeding mechanism (1), a second detection mechanism (2), a mobile selection mechanism (3), a first receiving mechanism (4), and a second receiving mechanism (5); the first feeding mechanism (1) and the first receiving mechanism (4) are respectively arranged on both sides of the second detection mechanism (2); the second receiving mechanism (5) is arranged on the other side of the first receiving mechanism (4); the mobile selection mechanism (3) is arranged on the upper ends of the first feeding mechanism (1), the second detection mechanism (2), the first receiving mechanism (4), and the second receiving mechanism (5); the first feeding mechanism (1) can receive a chip tray and detect the chip tray; the second detection mechanism (2) can receive the chip on the first feeding mechanism (1) through the mobile selection mechanism (3) and detect the cache; the mobile selection mechanism (3) can grab the chip tray or chip on the second detection mechanism (2) and place it on the first receiving mechanism (4) or the second receiving mechanism (5) for unloading; The first feeding mechanism (1) comprises a first feeding channel assembly (11) and a first stacking assembly (12); the first feeding channel assembly (11) is provided with the first stacking assembly (12); a chip tray can be provided on the first feeding channel assembly (11), and the chip tray can move on the first feeding channel assembly (11); the first stacking assembly (12) can perform stacking detection on the chip tray; the mobile selection mechanism (3) comprises a mobile support shaft (32) and a first grabbing module (33); the mobile support shaft (32) is provided above the first feeding mechanism (1); the first grabbing module (33) can slide on one side of the mobile support shaft (32); the first grabbing module (33) can grab the chip on the first feeding channel assembly (11) and put it on the second detection mechanism (2); The chip detection device further comprises a first detection mechanism (6), the first detection mechanism (6) being arranged on the side of the first feeding channel assembly (11), the first detection mechanism (6) comprising a five-sided detection area (61), a mobile selection mechanism (3) being arranged at the upper end of the first detection mechanism (6), the mobile selection mechanism (3) comprising a five-sided grabbing shaft assembly (31) and a mobile support shaft (32), the five-sided grabbing shaft assembly (31) being arranged on the mobile support shaft (32), the five-sided grabbing shaft assembly (31) being capable of grabbing a chip in a chip tray on the first feeding channel assembly (11) to the five-sided detection area (61) for appearance detection; The first detection mechanism (6) further comprises a flipping and transferring shaft assembly (62) and a back detection assembly (63); the back detection assembly (63) is arranged at one end of the first detection mechanism (6); the flipping and transferring shaft assembly (62) is arranged on the movable selection mechanism (3); the flipping and transferring shaft assembly (62) can move on the movable selection mechanism (3); the flipping and transferring shaft assembly (62) can flip the chip tray in the first detection mechanism (6); the first detection mechanism (6) can drive the flipped chip into the back detection assembly (63); and the back detection assembly (63) can perform back detection on the flipped chip; The first receiving mechanism (4) comprises a first receiving channel (41), and the first receiving channel (41) can receive defective chips from the second detection mechanism (2) through the mobile selection mechanism (3), and the first receiving channel (41) can drive the defective chips on the chip tray to move to the operation area; the mobile selection mechanism (3) comprises a mobile support shaft (32), a first grabbing module (33) and a second grabbing module (34); the first grabbing module (33) and the second grabbing module (34) are respectively arranged on both sides of the mobile support shaft (32), and the first grabbing module (33) and the second grabbing module (34) can both slide on the mobile support shaft (32); the second receiving mechanism (5) is provided with a mobile support shaft (32) above, and the second grabbing module (34) can grab the defective chips from the second detection mechanism (2) and put them into the first receiving channel (41).

2. The chip detection device according to claim 1, characterized in that: The second detection mechanism (2) comprises a second channel component (21) and a front detection component (22); the front detection component (22) is arranged at one end of the second channel component (21), and the second channel component (21) can use the mobile selection mechanism (3) to receive the chip on the first feeding mechanism (1) or the first detection mechanism (6) and perform front detection through the front detection component (22).

3. The chip detection device according to claim 1, characterized in that: The second receiving mechanism (5) comprises a second receiving channel (51), and the second receiving channel (51) can receive the good chips from the second inspection mechanism (2) through the mobile selection mechanism (3), and the second receiving channel (51) can drive the good chips on the chip tray to move, and the second grabbing module (34) can grab the good chips on the second inspection mechanism (2) and put them into the second receiving channel (51).

4. The chip detection device according to claim 1, characterized in that: The second receiving mechanism (5) further comprises a tape braiding machine (52), wherein the tape braiding machine (52) is arranged on one side of the second receiving channel (51), and the tape braiding machine (52) can receive and group the good chips of the second detection mechanism (2) through the mobile selection mechanism (3), and the second grabbing module (34) slides on the mobile support shaft (32), and the second grabbing module (34) can grab the good chips of the second detection mechanism (2) and put them on the tape braiding machine (52).

5. A chip detection method, characterized in that: A chip detection device comprising any one of claims 1 to 4, wherein the chip detection device further comprises a first feeding channel component (11), a first stacking component (12), a first detection mechanism (6), a five-side detection component (14), a five-side detection area (61), a flip transfer shaft component (62), a back detection component (63), a second receiving channel (51) and a braiding machine (52), the mobile selection mechanism (3) comprises a five-side grabbing shaft component (31), a mobile support shaft (32), a first grabbing module (33) and a second grabbing module (34); the chip detection method comprises the following steps: S1: Chips can be loaded through the first loading mechanism (1), and stacking detection can be performed on the chip tray; S2: The first inspection mechanism (6) can receive the chip on the first loading mechanism (1) and perform appearance and back surface inspection on the chip; S3: The second detection mechanism (2) can receive the chip turned over by the first detection mechanism (6), so as to detect the front side of the chip, and the chip can be cached after the second detection mechanism (2) completes the detection; S4: In steps S2 and S3, when the first detection mechanism (6) is not configured, after step S1 is completed, the operation is directly performed through this step; specifically, the chip in the first feeding mechanism (1) can be grabbed by the first grabbing module (33) and put into the second detection mechanism (2) for front detection, and can be cached after the detection is completed; S5: the chips cached on the second detection mechanism (2) can be classified and selected by the second grabbing module (34), and the defective chips can be transferred to the first receiving mechanism (4) and stacked to wait for manual sorting; S6: The chips cached on the second detection mechanism (2) can be classified and selected by the second grabbing module (34), and the good chips can be transferred to the second receiving channel (51) for further processing; S7: In step S6, when the second receiving channel (51) is not configured, after step S5 is completed, the operation is directly performed through this step; specifically: the chips cached on the second detection mechanism (2) can be classified and selected through the second grabbing module (34), and the good chips can be transferred to the tape machine (52) for grouping and sorting.

6. The chip detection method according to claim 5, characterized in that: According to S2, the steps of inspecting the back side of the chip by the first inspection mechanism (6) are as follows: S2-1: firstly, the chips on the first loading mechanism (1) are grabbed to the five-sided inspection area (61) by the five-sided grabbing shaft assembly (31), the appearance of the chips is inspected by the five-sided inspection area (61), and the chips in the multiple chip trays on the first loading channel assembly (11) are inspected for dirt on the appearance, and are placed in place after the inspection is completed; S2-2: the first loading channel assembly (11) then drives the plurality of chip trays to continue to move, and utilizes the flipping and transferring shaft assembly (62) to flip the chips in the chip trays and place them on the trays on the first detection mechanism (6); S2-3: driving the chip in the jig to move via the detection channel on the first detection mechanism (6), so that the chip in the jig moves to the back detection component (63), and the back detection component (63) can perform 2D and 3D detection on the back of the chip in the jig; S2-4: The chip tray in the first inspection mechanism (6) is turned over by means of a turning and transferring shaft assembly (62), so that the chip after inspection is turned over and moved to the second inspection mechanism (2), and 2D and 3D inspection of the front side of the chip is performed.

Images