A quartz glass wafer precision processing device
By introducing components such as electric push rods, vacuum cleaners and paper scrapers into the precision machining device of quartz glass wafers, the problems of powder flying and adhesion are solved, processing accuracy and environmental stability are improved, and maintenance difficulty is reduced.
Patent Information
- Application Number
- CN202411408563.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-10
- Publication Date
- 2024-12-20
- Estimated Expiration
- 2044-10-10
AI Technical Summary
The existing quartz glass wafer precision processing device is prone to produce wafer powder during the grinding process. The powder is flying everywhere and attached to the surface of the equipment, affecting the processing accuracy and maintenance difficulty, and at the same time obstructing the staff's line of sight.
A device including an electric push rod, a grinding assembly, a pressing induction assembly, a return spring, a pressing plate, a pressing rod, a paper scraper and a vacuum cleaner assembly are designed. The electric push rod drives the grinding assembly to rotate and move up and down, and uses a vacuum cleaner to The components and paper scrapers effectively absorb and remove powder and prevent powder from adhesion and adhesion by equalizing and anti-adhesion devices.
It improves the accuracy and yield of wafer polishing, reduces the impact of powder on the line of sight and equipment surface, reduces maintenance difficulty, and ensures the temperature stability of the processing environment and the effective cleaning of powder.
Smart Images
Figure CN118905776B_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of quartz glass wafer processing, in particular to a quartz glass wafer precision processing device. Background Art
[0002] Quartz glass is widely used in the semiconductor integrated circuit industry due to its good performance. At the same time, the wafer is the core of the semiconductor integrated circuit. Quartz glass wafer refers to a semiconductor integrated circuit product made by photolithography technology, and the precision grinding and polishing of quartz glass wafer is extremely important in many processes.
[0003] The patent with the patent announcement number CN212145960U discloses a quartz glass wafer precision processing device, including a frame, a first motor is installed on the upper end of the frame, a support plate is fixedly connected to the upper end of the frame symmetrically with respect to the first motor, a mounting plate is fixedly connected to the upper ends of the two support plates, a second motor is installed on the upper end of the mounting plate, the output end of the second motor is connected to a threaded rod through a coupling, the threaded rod is rotatably connected to the mounting plate through a first bearing, the lower end of the threaded rod passes through the first bearing and extends outward, and a threaded sleeve is threadedly connected to the rod wall, and the bottom of the mounting plate is symmetrically fixedly connected to the threaded rod with a limited position frame. This patent facilitates the observation of the thickness of the quartz glass wafer polished by the grinding disc, and can stop the grinding and polishing of the quartz glass wafer in time to avoid affecting the processing and polishing accuracy of the quartz glass wafer.
[0004] However, the device still has some shortcomings: the device can observe the grinding thickness of quartz glass in real time, but wafer powder is easily generated during the grinding process. Under the influence of the centrifugal force of the high-speed rotation of the grinding equipment, the powder is easy to fly around and adhere to the surface of the equipment, increasing the difficulty of maintenance and affecting the next processing accuracy. In addition, the powder will cause certain obstructions to the staff's observation line of sight. Summary of the invention
[0005] In view of the deficiencies in the prior art, the present invention provides a quartz glass wafer precision processing device, which solves the problems raised in the above background technology.
[0006] To achieve the above purpose, the present invention is implemented through the following technical solutions: a quartz glass wafer precision processing device, including a cabinet body, a support column is arranged at the top edge of the cabinet body, a top plate is arranged on the top of the support column, a motor is arranged on the top of the top plate, a circular frame is arranged on the top of the cabinet body, the circular frame is transparent, and a round hole is opened on the right side of the circular frame, a circular slide rail is arranged at the center of the top of the cabinet body, the circular slide rail is located inside the circular frame, a plurality of sliding columns are slidably installed inside the circular slide rail, a grinding table is arranged on the top of the sliding column, a plurality of grooves are opened on the top of the grinding table, and a rotating mounting is arranged at the center of the bottom of the top plate. An electric push rod is installed, which consists of a fixed end and a telescopic end, and the top of the fixed end of the electric push rod passes through and is fixedly installed at the bottom of the motor output end. A reciprocating spiral groove is opened on the outer wall of the fixed end of the electric push rod. A grinding component is fixedly installed at the bottom of the telescopic end of the electric push rod. The grinding component is located on the top of the grinding table. A press sensing component is fixedly installed on the top of the grinding component. A return spring is fixedly installed between the top of the grinding component and the bottom of the fixed end of the electric push rod. A pressure plate is passed through and slidably installed on the outer wall of the fixed end of the electric push rod. Pressure rods are fixedly installed at the corners of the bottom of the pressure plate. A circular scraper is fixedly installed at the bottom of the pressure plate. The right side of the pressure plate is fixedly installed There is an L-shaped plate, and a dust suction component is fixedly installed on the left side of the L-shaped plate. When the electric push rod is started, the telescopic end of the electric push rod can move up and down, and the telescopic end of the electric push rod drives the grinding component to move synchronously, and the grinding component drives the pressing sensing component to move synchronously. When the grinding component moves downward, it contacts the tops of wafers of different sizes placed in the groove of the grinding table. When the bottom of the grinding component contacts and fits with the top of the wafer, an upward resistance force is generated and the resistance force is fed back to the pressing sensing component. The pressing sensing component controls the telescopic end of the electric push rod to stop descending. At the same time, a reset spring is used to perform a pressing buffer between the grinding component and the fixed end of the electric push rod to prevent the grinding component from fitting too fast with the wafer. Start the motor, and the motor output end drives the electric push rod to rotate. At this time, the telescopic end of the electric push rod rotates and contracts up and down, and the circular slide rail prompts the sliding column to drive the grinding table to rotate in the opposite direction of the motor rotation to increase the grinding friction; the electric push rod limits the internal block of the pressure plate through the reciprocating spiral groove on the outer wall of its own fixed end, so that the pressure plate can slide back and forth up and down along the outer wall of the fixed end of the electric push rod, and the pressure plate drives the pressure rod to move synchronously, and the pressure rod drives the circular scraper to slide synchronously along the inner wall of the circular frame. At the same time, the pressure plate drives the L-shaped plate to move synchronously, and the L-shaped plate drives the dust collection component to slide up and down along the right side of the outer wall of the circular frame, and absorbs the powder generated during grinding inside the circular frame through the circular hole.
[0007] According to the above technical solution, the inner wall of the pressure plate contacts the outer wall of the reciprocating spiral groove of the electric push rod, the outer wall of the circular scraper is slidably installed on the inner wall of the circular frame, the circular hole on the right side of the circular frame is located on the left side movement trajectory of the dust suction component, and an equalizing device is arranged on the upper left side of the circular frame to ensure constant temperature within the working range during wafer polishing.
[0008] The U-shaped frame is provided with a plurality of connecting plates, each of which is provided with a plurality of connecting plates, each of which is provided with a plurality of connecting plates, each of which is provided with a plurality of connecting plates.
[0009] According to the above technical solution, the balancing device also includes a rotating rod, a sliding plate, a plurality of arc-surface hollow plates and a protective mesh plate. Both ends of the rotating rod are fixedly installed at the center of the inner wall of the rotating wheel. Both ends of the rotating rod are provided with spiral grooves. The sliding plate passes through the inside and is slidably installed at the edge of the outer wall of the rotating rod. The inner wall of the sliding plate is in contact with the spiral groove of the outer wall of the rotating rod, and the left side of the sliding plate is slidably connected to the right side of the connecting plate. Several of the arc-surface hollow plates are equidistant and fixedly installed at the center of the outer wall of the rotating rod. The left side of the protective mesh plate is slidably installed on the right side of the connecting plate, and a sliding groove is provided on the left side of the protective mesh plate. The inside of the protective mesh plate is provided with an anti-attachment device for preventing the powder dispersed during the grinding process from being too large and difficult to be completely absorbed, resulting in the powder flying everywhere. When the rotating wheel rotates, it drives the rotating rod to rotate. When the rotating rod rotates, the sliding plate is restricted by the non-self-locking spiral groove, and the internal block of the sliding plate continuously contacts the inner wall of the spiral groove, causing the sliding plate to drive the resistance block to move toward the center of the rotating rod. The outer wall of the resistance block resists the arc surface of the semi-arc plate to cause a downward thrust. The semi-arc plate pushes the protective mesh plate to slide downward along the right side of the connecting plate, and the top of the protective mesh plate pulls the telescopic end of the elastic telescopic component to move synchronously. When the resistance block moves to the adjacent interval of multiple semi-arc plates, the elastic force of the telescopic end of the elastic telescopic component when it is reset drives the protective mesh plate to reset, and this process is repeated. At the same time, when the rotating rod rotates, it drives the arc hollow plate to rotate. The arc hollow plate relies on the guiding effect of its own internal arc surface to reduce the adhesion of wafer powder inside itself.
[0010] According to the above technical solution, the balancing device also includes a resistance block, a semi-arc plate and an elastic telescopic component. The top of the resistance block is fixedly installed on the top of the inner wall of the sliding plate, the bottom of the semi-arc plate is fixedly installed on the top of the protective mesh plate, the arc surface of the semi-arc plate is located on the movement trajectory of the resistance block, the left side of the elastic telescopic component is fixedly installed on the right side of the connecting plate, and the bottom of the telescopic end of the elastic telescopic component is fixedly installed on the top of the protective mesh plate.
[0011] According to the above technical scheme, the anti-adhesion device includes a plurality of groove plates, connecting rods and U-shaped plates. The left sides of the plurality of groove plates are fixedly installed on the left side of the inner wall of the protective mesh plate. The outer wall of the connecting rod passes through and is fixedly installed inside the plurality of groove plates. The U-shaped plate is fixedly installed between the left side of the connecting plate and the left side of the groove plate, and the outer wall of the U-shaped plate is located inside the sliding groove of the protective mesh plate. When the protective mesh plate moves downward and is reset, the groove plate and the connecting rod are limited by the U-shaped plate, and the U-shaped plate is limited by the connecting plate to remain stationary. Therefore, when the protective mesh plate moves downward, the powder intercepted by the inner wall of the protective mesh plate will contact and scratch the arc surface of the groove of the groove plate.
[0012] According to the above technical solution, the anti-adhesion device also includes a number of flat plates, vertical plates and hinged inclined plates. The tops of the several flat plates are fixedly installed at the bottom edge of the protective mesh plate, the bottom of the vertical plate is fixedly installed on the left side of the top of the flat plate, and the hinged inclined plate is hinged between the right side of the vertical plate and the left side of the connecting plate. The protective mesh plate drives the flat plate to move up and down, the flat plate drives the vertical plate to move synchronously, the vertical plate drives the hinged inclined plate to move synchronously, the hinged inclined plate is limited by the connecting plate, which causes the hinge axis of the hinged inclined plate to start rotating, causing the hinged inclined plate to swing in an arc during the up and down movement of the vertical plate.
[0013] According to the above technical scheme, the anti-adhesion device also includes a screw, a cam and a cross bar vibration plate. The top of the screw is rotatably installed at the bottom of the groove plate, and the outer wall of the screw moves through the interior of the plate. The top of the cross bar vibration plate is fixedly installed at the bottom of the protective mesh plate. The cross bar vibration plate is located on the movement trajectory of the outer wall of the cam. At the same time, when the plate slides downward along the outer wall of the screw, the spiral groove on the outer wall of the screw restricts the internal block of the plate to cause the screw to generate a rotational force. When the screw rotates along the bottom of the groove plate, it drives the cam to rotate. When the cam rotates, the outer wall contacts and resists the cross bar vibration plate to deform. When the cam passes over the cross bar vibration plate, the cross bar vibration plate will swing back and forth to generate a vibrating force when it is reset by its own toughness, and the protective mesh plate is caused to vibrate synchronously through the transmission of force.
[0014] The present invention provides a quartz glass wafer precision processing device, which has the following beneficial effects:
[0015] (1) The present invention ensures the polishing accuracy of the wafer while avoiding the impact and cracking of the wafer during the bonding process through the coordination of an electric push rod, a grinding component, a pressure sensing component, a reset spring, a pressure plate, a pressure rod, a circular scraper, an L-shaped plate and a dust suction component, thereby improving the yield rate of wafer grinding. At the same time, the polishing component automatically adjusts the bonding distance between itself and the wafer in real time according to the change of the wafer thickness by relying on the pressure sensing component and the reset spring, thereby reducing manual participation and improving practicality. At the same time, the dust suction component is prompted to expand the absorption range of the powder raised after grinding, ensuring that the circular frame blocks the powder while the circular scraper reciprocates to effectively ensure the cleanliness of the inner wall of the circular frame to prevent the adhesion of powder from obstructing the vision of the staff and preventing the powder from flying around and adhering to the surface of the equipment to increase the difficulty of maintenance.
[0016] (2) The present invention, through the arrangement of an equalizing device, cooperates with a pressure plate, a U-shaped frame, a cooling assembly, a connecting plate, a rotating wheel, a rotating rod, a sliding plate, a curved hollow plate, a protective mesh plate, a resistance block, a semi-arc plate and an elastic telescopic assembly to effectively expand the cooling range of the cooling assembly within the processing range of the grinding assembly, ensure a relatively low temperature processing environment, and prevent the wafer from heating up too quickly during grinding and changing its internal stress structure, thereby increasing the risk of cracking; and further promotes cold air to fill the grinding processing area in a softer and more uniform manner by relying on the curved hollow plate, to prevent the intersection of cold and hot gases during grinding of the wafer and increase humidity to affect grinding; at the same time, the protective mesh plate reciprocates up and down to intercept the powder not absorbed by the dust collection assembly, and the protective mesh plate reciprocates up and down to reduce the stickiness of the powder to its own inner wall.
[0017] (3) The present invention sets an anti-adhesion device, and cooperates with the protective mesh, groove plate, connecting rod, U-shaped plate, flat plate, vertical plate, hinged inclined plate, screw, cam and cross bar vibration plate to cause the powder attached to the inner wall of the protective mesh to continuously fall off and gather under the scraping of the groove plate, thereby preventing the wafer powder from long-term adhesion and solidification on the inner wall of the protective mesh and causing erosion. At the same time, the continuously accumulated powder reduces the adhesion area on the inner wall of the protective mesh, thereby reducing the cleaning time. At the same time, the vertical plate and the hinged inclined plate are used to intercept the powder overflowing from the protective mesh for a second time. At the same time, the reciprocating swing of the hinged inclined plate causes the powder to fall to the adjacent angle between the flat plate and the vertical plate for concentrated accumulation, thereby further avoiding the possibility of secondary dispersion of powder on the original basis. In addition, the reciprocating vibration of the protective mesh cooperates with the force of the up and down movement of the protective mesh to ensure that the powder and the inner wall of the protective mesh are always in a non-adhesive active state. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 A schematic diagram of the present invention as a whole;
[0019] Figure 2 It is a schematic diagram of the internal structure of the present invention as a whole;
[0020] Figure 3This is a schematic diagram of the peripheral structure of the electric push rod of the present invention;
[0021] Figure 4 It is a bottom perspective schematic diagram of the peripheral structure of the electric push rod of the present invention;
[0022] Figure 5 It is a schematic diagram of the peripheral structure of the electric push rod of the present invention from the left side perspective;
[0023] Figure 6 It is a schematic diagram of the equalizing device of the present invention;
[0024] Figure 7 It is a schematic diagram showing the overall display of the balancing device of the present invention;
[0025] Figure 8 It is a schematic diagram of the anti-adhesion device of the present invention;
[0026] Fig. 9 It is a schematic diagram of the anti-adhesion device of the present invention from the left side perspective.
[0027] In the figure: 1, cabinet body; 2, support column; 21, top plate; 3, circular frame; 31, circular slide rail; 32, sliding column; 33, grinding table; 4, balancing device; 41, U-shaped frame; 42, cooling assembly; 43, connecting plate; 44, rotating wheel; 45, rotating rod; 46, sliding plate; 47, arc hollow plate; 48, protective mesh plate; 49, resistance block; 410, semi-arc plate; 411, elastic extension Shrinkage assembly; 5. Anti-adhesion device; 51. Groove plate; 52. Connecting rod; 53. U-shaped plate; 54. Flat plate; 55. Vertical plate; 56. Articulated inclined plate; 57. Screw rod; 58. Cam; 59. Crossbar vibration plate; 6. Electric push rod; 7. Grinding assembly; 8. Pressing sensing assembly; 9. Return spring; 10. Pressing plate; 11. Pressing rod; 12. Circular scraper; 13. L-shaped plate; 14. Dust collection assembly. DETAILED DESCRIPTION
[0028] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.
[0029] See also Figure 1-Figure 9An embodiment of the present invention is: a quartz glass wafer precision processing device, including a cabinet body 1, a support column 2 is arranged at the top edge of the cabinet body 1, a top plate 21 is arranged on the top of the support column 2, a motor is arranged on the top of the top plate 21, a circular frame 3 is arranged on the top of the cabinet body 1, the circular frame 3 is transparent, and a circular hole is opened on the right side of the circular frame 3, a circular slide rail 31 is arranged at the center of the top of the cabinet body 1, the circular slide rail 31 is located inside the circular frame 3, and a plurality of sliding columns 32 are slidably installed inside the circular slide rail 31 A grinding table 33 is arranged on the top of the sliding column 32, and a plurality of grooves are provided on the top of the grinding table 33. An electric push rod 6 is rotatably installed at the center of the bottom of the top plate 21. The electric push rod 6 consists of a fixed end and a telescopic end, and the top of the fixed end of the electric push rod 6 passes through and is fixedly installed at the bottom of the motor output end. A reciprocating spiral groove is provided on the outer wall of the fixed end of the electric push rod 6. A grinding component 7 is fixedly installed at the bottom of the telescopic end of the electric push rod 6. The grinding component 7 is located at the top of the grinding table 33, and a press sensing component 8 is fixedly installed on the top of the grinding component 7. A return spring 9 is fixedly installed between the top of the component 7 and the bottom of the fixed end of the electric push rod 6. A pressure plate 10 is penetrated and slidably installed on the outer wall of the fixed end of the electric push rod 6. A pressure rod 11 is fixedly installed at the bottom corners of the pressure plate 10. A circular scraper 12 is fixedly installed at the bottom of the pressure plate 10. An L-shaped plate 13 is fixedly installed on the right side of the pressure plate 10. A dust suction component 14 is fixedly installed on the left side of the L-shaped plate 13. Through the above cooperation, the wafer grinding accuracy is guaranteed while avoiding the impact and cracking of the wafer during the bonding process, thereby improving the yield rate of wafer grinding. By relying on the pressure sensing component 8 and the return spring 9, the grinding component 7 can automatically adjust the fitting distance between itself and the wafer in real time according to the change of the wafer thickness, thereby reducing manual participation and improving practicality; through the above cooperation, the dust suction component 14 is prompted to expand the absorption range of the powder raised after grinding, ensuring that the circular frame 3 blocks the powder while the circular scraper 12 reciprocates to scrape effectively to ensure the cleanliness of the inner wall of the circular frame 3 to prevent powder adhesion from obstructing the staff's line of sight, and prevent powder from flying around and adhering to the surface of the equipment to increase the difficulty of maintenance.
[0030] The inner wall of the pressure plate 10 contacts the outer wall of the reciprocating spiral groove of the electric push rod 6, and the outer wall of the circular scraper 12 is slidably installed on the inner wall of the circular frame 3. The circular hole on the right side of the circular frame 3 is located on the left movement trajectory of the dust suction component 14, and an equalizing device 4 is arranged on the upper left side of the circular frame 3 to ensure constant temperature within the working range during wafer polishing.
[0031] When in use, start the electric push rod 6, the telescopic end of the electric push rod 6 can move up and down, the telescopic end of the electric push rod 6 drives the grinding assembly 7 to move synchronously, and the grinding assembly 7 drives the pressing sensing assembly 8 to move synchronously. When the grinding assembly 7 moves downward, it contacts the tops of wafers of different sizes placed in the groove of the grinding table 33. When the bottom of the grinding assembly 7 contacts and fits with the top of the wafer, an upward resistance force is generated and the resistance force is fed back to the pressing sensing assembly 8, and the pressing sensing assembly 8 controls the telescopic end of the electric push rod 6 to stop descending. At the same time, the grinding assembly 7 and the fixed end of the electric push rod 6 are pressed and buffered by the return spring 9 to prevent the grinding assembly 7 and the wafer from fitting too fast. At this time, start the motor, and the output end of the motor drives the electric push rod 6 to rotate. At this time, the telescopic end of the electric push rod 6 rotates and contracts up and down, and the circular slide rail 31 prompts the sliding column 32 to drive the grinding table 33 to rotate in the opposite direction of the motor rotation to increase the grinding friction. Through the above cooperation, the wafer grinding accuracy is ensured while avoiding the impact and cracking of the wafer during the fitting process, thereby improving the quality of wafer grinding. The grinding component 7 automatically adjusts the gap between itself and the wafer in real time according to the change of wafer thickness by means of the pressing sensing component 8 and the reset spring 9, thereby reducing manual intervention and improving practicality; the electric push rod 6 limits the internal block of the pressing plate 10 through the reciprocating spiral groove on the outer wall of its fixed end, so that the pressing plate 10 can slide back and forth up and down along the outer wall of the fixed end of the electric push rod 6, and the pressing plate 10 drives the pressing rod 11 to move synchronously, and the pressing rod 11 drives the circular scraper 12 to slide synchronously along the inner wall of the circular frame 3, and at the same time, the pressing plate 10 drives the L The L-shaped plate 13 moves synchronously, and the L-shaped plate 13 drives the dust collection component 14 to slide up and down along the right side of the outer wall of the circular frame 3, and absorbs the powder generated when the inside of the circular frame 3 is polished through the circular hole. Through the above cooperation, the dust collection component 14 is prompted to expand the absorption range of the powder raised after polishing, and while ensuring that the circular frame 3 blocks the powder, the circular scraper 12 reciprocates to scrape effectively to ensure the cleanliness of the inner wall of the circular frame 3, prevent powder adhesion from obstructing the staff's line of sight, and prevent powder from flying around and adhering to the surface of the equipment to increase the difficulty of maintenance.
[0032] See also Figure 1-Figure 9 , based on the above embodiment, another embodiment of the present invention further includes an equalizing device 4;
[0033] The balancing device 4 includes a U-shaped frame 41, a cooling component 42, a connecting plate 43 and a rotating wheel 44. The bottom of the U-shaped frame 41 is hinged at the left edge of the top of the circular frame 3, the bottom of the cooling component 42 is hinged at the top of the U-shaped frame 41, the top of the cooling component 42 contacts the bottom surface of the pressure plate 10, the outer walls of the connecting plate 43 on both sides are fixedly installed on the inner wall of the cooling component 42, the outer wall of the rotating wheel 44 is rotatably installed on the side of the cooling component 42 close to the center of the pressure plate 10, and the outer wall of the rotating wheel 44 contacts the bottom of the pressure plate 10. Through the above cooperation, the cooling range of the cooling component 42 within the processing range of the grinding component 7 is effectively expanded, ensuring a relatively low temperature processing environment, and preventing the wafer from heating up too quickly during grinding, changing its internal stress structure and increasing the risk of cracking.
[0034] The balancing device 4 also includes a rotating rod 45, a sliding plate 46, a plurality of arc-surface hollow plates 47 and a protective mesh plate 48. Both ends of the rotating rod 45 are fixedly mounted at the center of the inner wall of the rotating wheel 44. Spiral grooves are provided at both ends of the rotating rod 45. The sliding plate 46 penetrates the inside and is slidably mounted at the edge of the outer wall of the rotating rod 45. The inner wall of the sliding plate 46 contacts the spiral groove of the outer wall of the rotating rod 45, and the left side of the sliding plate 46 is slidably connected to the right side of the connecting plate 43. A plurality of arc-surface hollow plates 47 are equidistantly and fixedly mounted at the center of the outer wall of the rotating rod 45. The left side of the protective mesh plate 48 is slidably mounted on the right side of the connecting plate 43, and a sliding groove is provided on the left side of the protective mesh plate 48. The inside of the protective mesh plate 48 is provided with an anti-adhesion device 5 for preventing the powder that is dispersed during the grinding process from being too large and difficult to be completely absorbed, resulting in the powder flying around.
[0035] The balancing device 4 also includes a resistance block 49, a semi-arc plate 410 and an elastic telescopic component 411. The top of the resistance block 49 is fixedly mounted on the top of the inner wall of the sliding plate 46, the bottom of the semi-arc plate 410 is fixedly mounted on the top of the protective mesh plate 48, the arc surface of the semi-arc plate 410 is located on the movement trajectory of the resistance block 49, the left side of the elastic telescopic component 411 is fixedly mounted on the right side of the connecting plate 43, and the bottom of the telescopic end of the elastic telescopic component 411 is fixedly mounted on the top of the protective mesh plate 48. Through the above coordination, the arc hollow plate 47 is relied on to further promote the cold air to fill the grinding processing area in a softer and more uniform manner, so as to prevent the intersection of cold and hot gases during wafer grinding and increase the humidity to affect the grinding; at the same time, the protective mesh plate 48 reciprocates up and down to intercept the powder not absorbed by the dust collection component 14, and the protective mesh plate 48 reciprocates up and down to reduce the stickiness of the powder to its own inner wall.
[0036] When in use, the circular frame 3 limits the bottom of the U-shaped frame 41, and the pressing plate 10 moves downward to abut against the top of the cooling assembly 42. The cooling assembly 42 causes the hinge shaft at the top of the U-shaped frame 41 to start rotating. At this time, the top of the U-shaped frame 41 deviates in an arc shape and pushes the cooling assembly 42 to slide along the bottom of the pressing plate 10 toward the center of the pressing plate 10. After the pressing plate 10 is reset, the cooling assembly 42 is reset synchronously, and the cooling assembly 42 drives the connecting plate 43 to move synchronously. At the same time, the cooling assembly 42 drives the rotating wheel 44 to slide synchronously along the bottom of the pressing plate 10 and produce The friction force is generated and the wheel 44 starts to rotate. The rotating wheel 44 converts the sliding friction between the cooling component 42 and the pressing plate 10 into rolling friction. Through the above cooperation, the cooling range of the grinding component 7 within the processing range of the cooling component 42 is effectively expanded, ensuring a relatively low temperature processing environment, and preventing the wafer from heating up too quickly during grinding and changing its internal stress structure, thereby increasing the risk of cracking; when the rotating wheel 44 rotates, it drives the rotating rod 45 to rotate. When the rotating rod 45 rotates, the non-self-locking spiral groove restricts the sliding plate 46, and the internal block of the sliding plate 46 constantly contacts the spiral groove. The inner wall of the rotating groove causes the sliding plate 46 to drive the resistance block 49 to move toward the center of the rotating rod 45. The outer wall of the resistance block 49 resists the arc surface of the semi-arc plate 410 to cause a downward thrust. The semi-arc plate 410 pushes the protective mesh plate 48 to slide downward along the right side of the connecting plate 43. The top of the protective mesh plate 48 pulls the telescopic end of the elastic telescopic component 411 to move synchronously. When the resistance block 49 moves to the adjacent intervals of multiple semi-arc plates 410, the elastic force of the telescopic end of the elastic telescopic component 411 when it is reset drives the protective mesh plate 48 to reset, and this is repeated. At the same time, the rotating rod When 45 rotates, it drives the arc hollow plate 47 to rotate. The arc hollow plate 47 reduces the adhesion of wafer powder inside itself by relying on the guiding effect of its own internal arc surface. Through the above cooperation, the arc hollow plate 47 further promotes the cold air to fill the grinding processing area in a softer and more uniform manner, preventing the intersection of cold and hot gases during wafer grinding to increase humidity and affect grinding; at the same time, the protective mesh plate 48 reciprocates up and down to intercept the powder not absorbed by the dust collection component 14, and the reciprocating up and down movement of the protective mesh plate 48 reduces the stickiness of the powder to its own inner wall.
[0037] See also Figure 1-Figure 9 , based on the above embodiment, another embodiment of the present invention further includes an anti-adhesion device 5;
[0038] The anti-adhesion device 5 includes a plurality of groove plates 51, connecting rods 52 and U-shaped plates 53. The left sides of the plurality of groove plates 51 are fixedly installed on the left side of the inner wall of the protective mesh plate 48. The outer wall of the connecting rod 52 passes through and is fixedly installed inside the plurality of groove plates 51. The U-shaped plate 53 is fixedly installed between the left side of the connecting plate 43 and the left side of the groove plate 51, and the outer wall of the U-shaped plate 53 is located inside the slide groove of the protective mesh plate 48. Through the above cooperation, the powder attached to the inner wall of the protective mesh plate 48 is continuously fallen off and gathered under the scraping of the groove plate 51, so as to avoid the wafer powder from being attached and solidified on the inner wall of the protective mesh plate 48 for a long time and causing erosion. At the same time, the continuously gathered powder reduces the attachment area to the inner wall of the protective mesh plate 48, thereby reducing the cleaning time.
[0039] The anti-adhesion device 5 also includes a plurality of flat plates 54, vertical plates 55 and hinged inclined plates 56. The tops of the plurality of flat plates 54 are fixedly mounted at the bottom edge of the protective mesh plate 48, the bottoms of the vertical plates 55 are fixedly mounted on the left side of the top of the flat plates 54, and the hinged inclined plates 56 are hinged between the right side of the vertical plates 55 and the left side of the connecting plate 43.
[0040] The anti-adhesion device 5 also includes a screw 57, a cam 58 and a crossbar vibration plate 59. The top of the screw 57 is rotatably installed at the bottom of the groove plate 51, and the outer wall of the screw 57 moves through the inside of the flat plate 54. The top of the crossbar vibration plate 59 is fixedly installed at the bottom of the protective mesh plate 48, and the crossbar vibration plate 59 is located on the movement trajectory of the outer wall of the cam 58. Through the above cooperation, the vertical plate 55 and the hinged inclined plate 56 are used to intercept the powder overflowing from the protective mesh plate 48 for a second time. At the same time, the hinged inclined plate 56 swings back and forth to cause the powder to fall to the adjacent angle between the flat plate 54 and the vertical plate 55 for concentrated accumulation, thereby further avoiding the possibility of secondary dispersion of powder on the original basis. In addition, the reciprocating vibration of the protective mesh plate 48 cooperates with the force of the up and down movement of the protective mesh plate 48 to ensure that the powder and the inner wall of the protective mesh plate 48 are always in a non-adhesive active state.
[0041] When in use, when the protective mesh plate 48 moves downward and resets, the groove plate 51 and the connecting rod 52 are limited by the U-shaped plate 53, and the U-shaped plate 53 is limited and kept stationary by the connecting plate 43. Therefore, when the protective mesh plate 48 moves downward, the powder intercepted by the inner wall of the protective mesh plate 48 will contact and scrape with the arc surface of the groove of the groove plate 51. Through the above cooperation, the powder attached to the inner wall of the protective mesh plate 48 is continuously fallen off and gathered under the scraping of the groove plate 51, so as to avoid the long-term adhesion and solidification of the wafer powder on the inner wall of the protective mesh plate 48 and the erosion phenomenon. At the same time, the continuously gathered powder reduces the adhesion area to the inner wall of the protective mesh plate 48, thereby reducing the cleaning time; the protective mesh plate 48 drives the flat plate 54 to move up and down, the flat plate 54 drives the vertical plate 55 to move synchronously, the vertical plate 55 drives the articulated inclined plate 56 to move synchronously, the articulated inclined plate 56 is limited by the connecting plate 43, so that the hinge axis of the articulated inclined plate 56 starts to rotate, and the articulated inclined plate 56 swings in an arc shape during the up and down movement of the vertical plate 55. When the plate 54 slides downward along the outer wall of the screw rod 57, the spiral groove on the outer wall of the screw rod 57 restricts the internal block of the plate 54, causing the screw rod 57 to generate a rotational force. When the screw rod 57 rotates along the bottom of the groove plate 51, it drives the cam 58 to rotate. When the cam 58 rotates, the outer wall contacts and resists the cross bar vibration plate 59 and deforms. When the cam 58 passes over the cross bar vibration plate 59, the cross bar vibration plate 59 will swing back and forth to generate a vibrating force when it is reset by its own toughness. The transmission of force causes the protective mesh plate 48 to vibrate synchronously. Through the above cooperation, the vertical plate 55 and the hinged inclined plate 56 are used to intercept the powder overflowing from the protective mesh plate 48 for a second time. At the same time, the reciprocating swing of the hinged inclined plate 56 causes the powder to fall to the adjacent angle between the plate 54 and the vertical plate 55 for concentrated accumulation, thereby further avoiding the possibility of secondary dispersion of the powder on the original basis. In addition, the reciprocating vibration of the protective mesh plate 48 cooperates with the force of the up and down movement of the protective mesh plate 48 to ensure that the powder and the inner wall of the protective mesh plate 48 are always in a non-adhesive active state.
[0042] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.
Claims
1. A quartz glass wafer precision processing device, comprising a cabinet body (1), a support column (2) is arranged at the top edge of the cabinet body (1), a top plate (21) is arranged on the top of the support column (2), a motor is arranged on the top of the top plate (21), a circular frame (3) is arranged on the top of the cabinet body (1), the circular frame (3) is transparent, and a round hole is opened on the right side of the circular frame (3), a circular slide rail (31) is arranged at the center of the top of the cabinet body (1), the circular slide rail (31) is located inside the circular frame (3), a plurality of sliding columns (32) are slidably installed inside the circular slide rail (31), a grinding table (33) is arranged on the top of the sliding column (32), and a plurality of grooves are opened on the top of the grinding table (33), Features: An electric push rod (6) is rotatably mounted at the bottom center of the top plate (21), the electric push rod (6) being composed of a fixed end and a telescopic end, and the top of the fixed end of the electric push rod (6) penetrates through and is fixedly mounted at the bottom of the motor output end, a reciprocating spiral groove is provided on the outer wall of the fixed end of the electric push rod (6), a grinding component (7) is fixedly mounted at the bottom of the telescopic end of the electric push rod (6), the grinding component (7) is located at the top of the grinding table (33), and a pressure sensing component is fixedly mounted on the top of the grinding component (7) (8), a return spring (9) is fixedly installed between the top of the grinding component (7) and the bottom of the fixed end of the electric push rod (6), a pressure plate (10) is penetrated and slidably installed on the outer wall of the fixed end of the electric push rod (6), pressure rods (11) are fixedly installed at the bottom corners of the pressure plate (10), a circular scraper (12) is fixedly installed at the bottom of the pressure plate (10), an L-shaped plate (13) is fixedly installed on the right side of the pressure plate (10), and a dust collection component (14) is fixedly installed on the left side of the L-shaped plate (13); The inner wall of the pressing plate (10) contacts the outer wall of the reciprocating spiral groove of the electric push rod (6); the outer wall of the circular scraper (12) is slidably mounted on the inner wall of the circular frame (3); the circular hole on the right side of the circular frame (3) is located on the left side movement track of the dust suction component (14); and an equalizing device (4) is provided on the upper left side of the circular frame (3) for ensuring a constant temperature within the working range during wafer polishing; The balancing device (4) comprises a U-shaped frame (41), a cooling assembly (42), a connecting plate (43) and a rotating wheel (44); the bottom of the U-shaped frame (41) is hinged at the left edge of the top of the circular frame (3); the bottom of the cooling assembly (42) is hinged at the top of the U-shaped frame (41); the top of the cooling assembly (42) contacts the bottom surface of the pressing plate (10); the outer walls of the connecting plate (43) on both the front and back sides are fixedly mounted on the inner wall of the cooling assembly (42); the outer wall of the rotating wheel (44) is rotatably mounted on one side of the cooling assembly (42) close to the center of the pressing plate (10); and the outer wall of the rotating wheel (44) contacts the bottom of the pressing plate (10); The balancing device (4) further comprises a rotating rod (45), a sliding plate (46), a plurality of arc-surface hollow plates (47) and a protective mesh plate (48), the front and back ends of the rotating rod (45) are fixedly mounted at the center of the inner wall of the rotating wheel (44), the two ends of the rotating rod (45) are provided with spiral grooves, the sliding plate (46) penetrates the inside and is slidably mounted at the edge of the outer wall of the rotating rod (45), the inner wall of the sliding plate (46) contacts the spiral groove of the outer wall of the rotating rod (45), and the left side of the sliding plate (46) is slidably connected to the right side of the connecting plate (43), the plurality of arc-surface hollow plates (47) are equidistantly and fixedly mounted at the center of the outer wall of the rotating rod (45), the left side of the protective mesh plate (48) is slidably mounted on the right side of the connecting plate (43), and a sliding groove is provided on the left side of the protective mesh plate (48), and the protective mesh plate (48) is provided with an anti-adhesion device (5) inside the protective mesh plate (48) for preventing the powder from being too large and difficult to be completely absorbed during the grinding process, resulting in the powder flying everywhere; The anti-adhesion device (5) comprises a plurality of groove plates (51), a connecting rod (52) and a U-shaped plate (53), the left sides of the plurality of groove plates (51) are fixedly mounted on the left side of the inner wall of the protective mesh plate (48), the outer wall of the connecting rod (52) passes through and is fixedly mounted between the interior of the plurality of groove plates (51), the U-shaped plate (53) is fixedly mounted between the left side of the connecting plate (43) and the left side of the groove plate (51), and the outer wall of the U-shaped plate (53) is located inside the slide groove of the protective mesh plate (48); The anti-adhesion device (5) further comprises a plurality of flat plates (54), vertical plates (55) and hinged inclined plates (56), the tops of the plurality of flat plates (54) are fixedly mounted on the bottom edge of the protective mesh plate (48), the bottoms of the vertical plates (55) are fixedly mounted on the left side of the top of the flat plates (54), and the hinged inclined plates (56) are hinged between the right side of the vertical plates (55) and the left side of the connecting plate (43); The anti-adhesion device (5) further comprises a screw (57), a cam (58) and a crossbar vibration plate (59); the top of the screw (57) is rotatably mounted on the bottom of the groove plate (51), and the outer wall of the screw (57) movably penetrates the interior of the flat plate (54); the top of the crossbar vibration plate (59) is fixedly mounted on the bottom of the protective mesh plate (48), and the crossbar vibration plate (59) is located on the movement trajectory of the outer wall of the cam (58).
2. A quartz glass wafer precision processing device according to claim 1, Features: The balancing device (4) further comprises a resistance block (49), a semi-arc plate (410) and an elastic telescopic component (411), wherein the top of the resistance block (49) is fixedly mounted on the top of the inner wall of the sliding plate (46), the bottom of the semi-arc plate (410) is fixedly mounted on the top of the protective mesh plate (48), the arc surface of the semi-arc plate (410) is located on the movement track of the resistance block (49), the left side of the elastic telescopic component (411) is fixedly mounted on the right side of the connecting plate (43), and the bottom of the telescopic end of the elastic telescopic component (411) is fixedly mounted on the top of the protective mesh plate (48).